JP2016134760A - Vibration element, vibrator, oscillator, electronic apparatus, and mobile body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration element capable of reducing spurious caused by bending vibrations which are unnecessary vibration modes, a vibrator, an oscillator, an electronic apparatus, and a mobile body.SOLUTION: A vibration element 1 includes: a crystal substrate 2 having a vibration part 21 which vibrates by a thickness slip vibration and a thin wall part 22 which is thinner than the vibration part 21 and is positioned around the vibration part 21; and excitation electrodes 311, 321 disposed on the vibration part 21. Between a step located at a boundary part between the excitation electrodes 311, 321 and the vibration part 21 and a step located at a boundary part between the vibration part 21 and the thin wall part 22, two antinodes of the bending vibration are adjacently located.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a vibration element, a vibrator, an oscillator, an electronic device, and a moving body.

  The AT-cut vibration element has thickness vibration mode as the main vibration mode to be excited, and is suitable for miniaturization and high frequency, and exhibits a cubic curve with excellent frequency temperature characteristics. Used in the direction.

  Patent Document 1 discloses a so-called “mesa type” AT-cut vibration element having a convex surface at the center. Such a mesa-type AT-cut vibration element has an advantage of excellent energy confinement efficiency. Patent Document 2 discloses a mesa-type AT-cut quartz crystal resonator in which a boundary portion between a central convex portion and a surrounding thin portion is an inclined surface or a curved surface. By adopting such a configuration, there is an advantage that the CI (crystal impedance) value can be lowered and the secondary vibration can be suppressed. However, in the AT-cut vibration element described in Patent Documents 1 and 2, spurious due to bending vibration that is an unnecessary vibration mode may not be sufficiently reduced.

JP 58-047316 A Japanese Utility Model Publication No. 06-052230

  An object of the present invention is to provide a vibration element, a vibrator, an oscillator, an electronic device, and a moving body that can reduce spurious due to bending vibration that is an unnecessary vibration mode.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1]
The vibration element of this application example has a thick part,
Located in the periphery of the thick portion, the middle thickness portion is thinner than the thick portion,
It is located around the middle meat part, and has a thin part thinner than the middle meat part,
At least the thick part vibrates due to thickness sliding vibration,
Between the first step at the boundary between the thick part and the middle part on the one side in the vibration direction of the thickness shear vibration and the second step at the boundary between the middle part and the thin part, The first antinode and the second antinode adjacent to the bending vibration are located.
Thereby, the vibration element which can reduce the spurious resulting from the bending vibration which is an unnecessary vibration mode can be provided.

[Application Example 2]
In the vibration element of this application example, a distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and a distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
It is preferable that the relations 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8 are satisfied respectively.
Thereby, the spurious resulting from the bending vibration which is an unnecessary vibration mode can be reduced more effectively.

[Application Example 3]
The vibration element of this application example includes a vibration unit that vibrates by thickness shear vibration,
A thin-walled portion located around the vibrating portion and thinner than the vibrating portion;
An electrode disposed on the main surface of the vibrating part,
When the length of the vibration part in the vibration direction of the thickness-shear vibration is L1, and the length of the electrode is L2,
Satisfying the relationship of L1> L2,
Between the first step at the boundary between the electrode and the vibration part on one side in the vibration direction of the thickness-shear vibration and the second step at the boundary between the vibration part and the thin part, adjacent to the bending vibration. The matching first and second belly are located,
The distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and the distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
L1 / 2 = (n / 2 + 1/4) λ−d1−d2 (where n is an integer)
It is characterized by satisfying the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively.
Thereby, the vibration element which can reduce the spurious resulting from the bending vibration which is an unnecessary vibration mode can be provided.

[Application Example 4]
In the resonator element according to this application example, it is preferable that the relationship of (L1−L2) / 2 = λ / 2−d1−d2 is satisfied.
Thereby, the spurious resulting from the bending vibration which is an unnecessary vibration mode can be reduced more effectively.

[Application Example 5]
The vibration element of this application example includes a vibration unit that vibrates by thickness shear vibration,
A thin-walled portion located around the vibrating portion and thinner than the vibrating portion;
An electrode disposed across the main surface of the vibrating portion and the main surface of the thin portion,
When the length of the vibration part in the vibration direction of the thickness-shear vibration is L1, and the length of the electrode is L2,
Satisfying the relationship of L1 <L2,
Between the first step at the boundary between the electrode and the vibration part on one side in the vibration direction of the thickness-shear vibration and the second step at the boundary between the vibration part and the thin part, adjacent to the bending vibration. The matching first and second belly are located,
The distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and the distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
L1 / 2 = (n / 2 + 1/4) λ−d1−d2 (where n is an integer)
It is characterized by satisfying the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively.
Thereby, the vibration element which can reduce the spurious resulting from the bending vibration which is an unnecessary vibration mode can be provided.

[Application Example 6]
In the resonator element of this application example, it is preferable that the relationship (L2−L1) / 2 = λ / 2−d1−d2 is satisfied.
Thereby, the spurious resulting from the bending vibration which is an unnecessary vibration mode can be reduced more effectively.

[Application Example 7]
In the vibration element according to this application example, the vibration unit is located on both sides of the vibration direction of the thickness-shear vibration of the first region, and the second region is thinner than the first region. It is preferable to have.
Thereby, the spurious resulting from the bending vibration which is an unnecessary vibration mode can be reduced more effectively.

[Application Example 8]
In the vibration element according to this application example, it is preferable that a protrusion along the outer edge intersecting the vibration direction of the thickness-shear vibration of the vibration part is disposed around the vibration part.
Thereby, the spurious resulting from the bending vibration which is an unnecessary vibration mode can be reduced more effectively.

[Application Example 9]
The vibrator of this application example includes the vibration element of the above application example,
And a package in which the vibration element is accommodated.
Thereby, a highly reliable vibrator is obtained.

[Application Example 10]
The oscillator of this application example includes the vibration element of the above application example,
And a circuit.
Thereby, a highly reliable oscillator can be obtained.

[Application Example 11]
An electronic apparatus according to this application example includes the vibration element according to the application example described above.
As a result, a highly reliable electronic device can be obtained.

[Application Example 12]
The moving body of this application example includes the vibration element of the above application example.
Thereby, a mobile body with high reliability is obtained.

FIG. 3 is a top view and a bottom view of the resonator element according to the first embodiment of the invention. It is the sectional view on the AA line in FIG. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is sectional drawing which shows the quartz substrate formed by wet etching. It is the upper side figure and bottom view of the vibration element concerning 2nd Embodiment of this invention. FIG. 6 is a sectional view taken along line B-B in FIG. 5. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is sectional drawing which shows the quartz substrate formed by wet etching. It is the upper side figure and bottom view of the vibration element concerning 3rd Embodiment of this invention. It is CC sectional view taken on the line in FIG. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is sectional drawing which shows the quartz substrate formed by wet etching. It is the upper side figure and bottom view of the vibration element concerning 4th Embodiment of this invention. It is the DD sectional view taken on the line in FIG. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is sectional drawing which shows the quartz substrate formed by wet etching. FIG. 10 is a top view and a bottom view of a resonator element according to a fifth embodiment of the invention. It is the EE sectional view taken on the line in FIG. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is the top view and bottom view of a vibration element concerning a 6th embodiment of the present invention. It is the FF sectional view taken on the line in FIG. It is a figure which shows the positional relationship of a level | step difference and the waveform of a bending vibration. It is sectional drawing which shows an example of the vibrator | oscillator of this invention. It is the top view and sectional drawing which show the modification of the vibrator | oscillator of this invention. It is sectional drawing which shows suitable embodiment of the oscillator of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. 1 is a perspective view schematically showing an automobile as an example of a moving object of the present invention.

  Hereinafter, a resonator element, a vibrator, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the drawings.

1. First, the vibration element of the present invention will be described.

<First Embodiment>
FIG. 1 is a top view and a bottom view of a resonator element according to the first embodiment of the invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a diagram illustrating a positional relationship between the step and the waveform of the bending vibration. FIG. 4 is a cross-sectional view showing a quartz substrate formed by wet etching.

  As shown in FIGS. 1 and 2, the vibration element 1 includes a quartz substrate (piezoelectric substrate) 2 and an electrode 3 formed on the quartz substrate 2.

(Quartz substrate)
The quartz substrate 2 is a plate-like quartz substrate. Here, the crystal that is the material of the crystal substrate 2 belongs to the trigonal system and has crystal axes X, Y, and Z orthogonal to each other. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. The quartz substrate 2 of the present embodiment is a “rotated Y-cut quartz substrate” cut along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ, for example, rotated by θ = 35 ° 15 ′. The substrate cut out along the flat surface is referred to as an “AT-cut quartz substrate”. By using such a quartz substrate, the vibration element 1 having excellent temperature characteristics is obtained. However, the quartz substrate 2 is not limited to the AT-cut quartz substrate as long as the thickness-shear vibration can be excited. For example, a BT-cut quartz substrate may be used.

  Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the quartz substrate 2 has a thickness in the Y′-axis direction and has a spread in the XZ ′ plane direction.

  The crystal substrate 2 has a long shape with the long side in the X-axis direction and the short side in the Z′-axis direction in plan view. However, the plan view shape of the quartz crystal substrate 2 is not limited to this, and for example, the quartz substrate 2 may have a square shape in which the lengths in the X-axis direction and the Z′-axis direction are substantially equal. And may have a longitudinal shape having a long side in the Z′-axis direction.

  As shown in FIG. 1 and FIG. 2, the quartz substrate 2 includes a vibrating portion 21 that vibrates in thickness and a thin wall that is located around the vibrating portion 21 and is integrated with the vibrating portion 21 and is thinner than the vibrating portion 21. Part 22. The vibration part 21 protrudes on both the + Y ′ side and the −Y ′ side of the thin part 22. However, the vibration part 21 only has to protrude to at least one of the + Y′-axis side and the −Y′-axis side.

  In addition, the quartz substrate 2 may be subjected to, for example, bevel processing for grinding the periphery of the quartz substrate 2 or convex processing in which the upper surface and the lower surface are convex curved surfaces. Further, the four corners of the vibration part 21 may be rounded.

  The electrode 3 includes a pair of excitation electrodes 311 and 321, a pair of pad electrodes 312 and 322, and a pair of extraction electrodes 313 and 323. The excitation electrode 311 is disposed on the surface of the vibration unit 21, and the excitation electrode 321 is disposed on the back surface of the vibration unit 21 so as to face the excitation electrode 311. In addition, the length Ex (L2) of the excitation electrodes 311 and 321 in the X-axis direction is shorter than the length Mx (L1) of the vibration unit 21 in the X-axis direction. That is, the relationship Ex <Mx is satisfied. The excitation electrodes 311 and 321 are arranged at the center so as not to overlap with both ends of the vibration part 21 in the X-axis direction.

  The pad electrodes 312 and 322 are arranged side by side in the Z′-axis direction on the lower surface of the thin portion 22 at the end on the + X-axis side of the quartz crystal substrate 2. The extraction electrode 313 is disposed so as to connect the excitation electrode 311 and the pad electrode 312, and the extraction electrode 323 is disposed so as to connect the excitation electrode 321 and the pad electrode 322.

  The configuration of such an electrode 3 is not particularly limited. For example, a metal such as Au (gold) or Al (aluminum), Au, or Al is mainly used for an underlayer such as Cr (chromium) or Ni (nickel). It can be comprised with the metal film which laminated | stacked the alloy used as a component.

  The configuration of the vibration element 1 has been described above. In such a vibrating element 1, as shown in FIG. 2, the portion provided with the excitation electrodes 311 and 321 of the vibrating portion 21 forms the thickest portion 11 having the thickest thickness, and the vibrating portion around it. 21 forms the thin part 12 thinner than the thick part, and the thin part 22 around the vibration part 21 forms the thin part 13 thinner than the thick part. Therefore, in the vibration element 1, a step (first step) V <b> 1 is formed at the boundary between the vibration part 21 and the excitation electrodes 311 and 321 in the X-axis direction, and the boundary between the vibration part 21 and the thin part 22. A step (second step) V2 is formed. Hereinafter, the step V1 located on the −X axis side is referred to as V1 ′, and the step V1 located on the + X axis side is referred to as V1 ″. Similarly, the step V2 located on the −X axis side is referred to as V2 ′. The step V2 located on the + X-axis side is defined as V2 ″.

  As shown in FIG. 3, two adjacent antinodes (maximum amplitude positions) of bending vibration, which is spurious (unnecessary vibration) generated in the quartz substrate 2, are located between the steps V1 ′ and V2 ′, and are similarly bent. Two adjacent antinodes of vibration are located between the steps V1 "and V2". More specifically, let C11 be an imaginary straight line that passes through the apex (maximum amplitude point) P1 of the bending vibration waveform B and is parallel to the Y ′ axis, and is adjacent to the apex P1 of the waveform B on the −X axis side. A virtual straight line passing through P2 and parallel to the Y ′ axis is C12, a virtual straight line passing through the step V1 ′ and parallel to the Y ′ axis is C13, and a virtual straight line passing through the step V2 ′ and parallel to the Y ′ axis is C14 The virtual straight lines C11 and C12 are located between the virtual straight lines C13 and C14. Similarly, a virtual straight line passing through the vertex P3 of the waveform B and parallel to the Y ′ axis is C15, a virtual straight line passing through the vertex P4 adjacent to the waveform B vertex P3 on the + X axis side and parallel to the Y ′ axis is C16, When a virtual straight line passing through the step V1 ″ and parallel to the Y ′ axis is C17 and a virtual straight line passing through the step V2 ″ and parallel to the Y ′ axis is C18, the virtual straight lines C15 and C16 are between the virtual straight lines C17 and C18. positioned.

  That is, the wavelength of the bending vibration is λ, the distance between the virtual straight line C11 and the virtual straight line C13 (the distance between the virtual straight line C15 and the virtual straight line C17) is d1, and the distance between the virtual straight line C12 and the virtual straight line C14 ( When the distance between the imaginary straight line C16 and the imaginary straight line C18 is d2, the relationship (Mx−Ex) / 2 = λ / 2−d1−d2 is satisfied. As a result, the spurious can be effectively confined between the steps V1 'and V2' (V1 ", V2"). Therefore, spurious can be reduced, thereby reducing the CI value of the vibration element 1 and improving the vibration characteristics.

  In particular, in this embodiment, the virtual straight lines C11 and C12 are symmetrically positioned between the virtual straight lines C13 and C14, and the virtual straight lines C15 and C16 are symmetrically positioned between the virtual straight lines C17 and C18. . That is, the relationship d1 = d2 is satisfied. Thereby, spurious can be confined more effectively, and therefore spurious can be reduced. Moreover, it is preferable that d1 and d2 satisfy the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively, and further Mx / 2 = (n / 2 + 1/4) λ−d1−. It is preferable to satisfy the relationship of d2 (where n is an integer). Thereby, spurious can be reduced more effectively. The wavelength λ of the bending vibration can be obtained from the resonance frequency f of the vibration element 1 by an equation such as λ / 2 = (1.332 / f) −0.0024.

  The first embodiment has been described above. For example, when the quartz crystal substrate 2 is formed by patterning the quartz crystal substrate by wet etching, the crystal plane of the quartz crystal substrate appears and the side wall of the vibration part 21 becomes an inclined surface as shown in FIG. The step V <b> 2 in this case is a portion located at the center between the boundary between the main surface and the inclined surface of the vibrating portion 21 and the boundary between the inclined surface and the main surface of the thin portion 22. Further, the length Mx in the X-axis direction of the vibration part 21 is a separation distance between the parts.

Second Embodiment
Next, a second embodiment of the resonator element according to the invention will be described.

  FIG. 5 is a top view and a bottom view of the resonator element according to the second embodiment of the invention. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a diagram illustrating a positional relationship between a step and a waveform of bending vibration. FIG. 8 is a cross-sectional view showing a quartz substrate formed by wet etching.

  Hereinafter, the resonator element according to the second embodiment will be described focusing on differences from the first embodiment described above, and description of similar matters will be omitted.

  The vibration element according to the second embodiment of the present invention is the same as that of the first embodiment described above except that the arrangement of the electrodes is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIGS. 5 and 6, in the vibration element 1 of the present embodiment, the length Ex of the excitation electrodes 311 and 321 in the X-axis direction is longer than the length Mx of the vibration unit 21 in the X-axis direction. That is, the relationship Ex> Mx is satisfied. The excitation electrodes 311 and 321 are arranged so that both end portions in the X-axis direction protrude from the vibrating portion 21 onto the thin portion 22.

  In such a vibrating element 1, the vibrating portion 21 forms the thickest thick portion 11, and the portion where the excitation electrodes 311 and 321 of the thin portion 22 are disposed is thinner than the thick portion. A middle thickness portion 12 is formed, and a thin thickness portion 22 around the middle thickness portion 12 forms a thin thickness portion 13 having a thickness smaller than that of the middle thickness portion. Therefore, a step (first step) V3 is formed at the boundary between the vibrating portion 21 and the thin portion 22 in the X-axis direction, and a step (second step) is formed at the boundary between the excitation electrodes 311 and 321 and the thin portion 22. Step) V4 is formed. Hereinafter, the step V3 located on the −X axis side is referred to as V3 ′, and the step V3 located on the + X axis side is referred to as V3 ″. Similarly, the step V4 located on the −X axis side is referred to as V4 ′. The step V4 located on the + X-axis side is defined as V4 ″.

  As shown in FIG. 7, two adjacent antinodes of bending vibration which are spurious generated in the quartz substrate 2 are located between the steps V3 ′ and V4 ′, and similarly, two adjacent antinodes of bending vibration are the step V3. ", V4". More specifically, an imaginary straight line passing through the apex P1 of the assumed bending vibration waveform B and parallel to the Y ′ axis is C21, and passing through the apex P2 adjacent to the apex P1 of the waveform B on the −X axis side, Y ′. When a virtual straight line parallel to the axis is C22, a virtual straight line passing through the step V3 ′ and parallel to the Y ′ axis is C23, and a virtual straight line passing through the step V4 ′ and parallel to the Y ′ axis is C24, the virtual straight line C23, Virtual straight lines C21 and C22 are located between C24, and similarly, a virtual straight line passing through the vertex P3 of the waveform B and parallel to the Y′-axis is defined as C25, and the vertex P4 adjacent to the vertex P3 of the waveform B on the + X-axis side is defined as C25. When a virtual straight line parallel to the Y ′ axis is C26, a virtual straight line passing through the step V3 ″ and parallel to the Y ′ axis is C27, and a virtual straight line passing through the step V4 ″ and parallel to the Y ′ axis is C28, Virtual straight lines C25, C26 between the straight lines C27, C28 It is located.

  That is, the wavelength of the bending vibration is λ, the distance between the virtual straight line C21 and the virtual straight line C23 (the distance between the virtual straight line C25 and the virtual straight line C27) is d1, and the distance between the virtual straight line C22 and the virtual straight line C24 ( When the distance between the virtual straight line C26 and the virtual straight line C28 is d2, the relationship of (Ex−Mx) / 2 = λ / 2−d1−d2 is satisfied. As a result, unnecessary vibrations can be effectively confined between the steps V3 and V4. Therefore, spurious can be reduced, the CI value of the vibration element 1 is lowered, and the vibration characteristics are improved.

  In particular, in this embodiment, the virtual straight lines C21 and C22 are symmetrically positioned between the virtual straight lines C23 and C24, and the virtual straight lines C25 and C26 are symmetrically positioned between the virtual straight lines C27 and C28. . That is, the relationship d1 = d2 is satisfied. Thereby, the above-mentioned spurious can be reduced more effectively. Moreover, it is preferable that d1 and d2 satisfy the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively, and further Mx / 2 = (n / 2 + 1/4) λ−d1−. It is preferable to satisfy the relationship of d2 (where n is an integer). Thereby, spurious can be reduced more effectively.

  The second embodiment has been described above. For example, when the quartz crystal substrate 2 is formed by patterning the quartz crystal substrate by wet etching, the crystal plane of the quartz crystal substrate appears and the side wall of the vibration part 21 becomes an inclined surface as shown in FIG. In this case, the step V3 (V3 ′, V3 ″) is a portion located at the center between the boundary between the main surface and the inclined surface of the vibrating portion 21 and the boundary between the inclined surface and the main surface of the thin portion 22. In addition, the length Mx in the X-axis direction of the vibration part 21 is a separation distance between the parts.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

  In the present embodiment, the excitation electrodes 311 and 321 are arranged so as to protrude from the vibrating part 21 also in the Z′-axis direction, but are arranged so as to protrude from the vibrating part 21 in the Z′-axis direction. It does not have to be.

<Third Embodiment>
Next, a third embodiment of the resonator element according to the invention will be described.

  FIG. 9 is a top view and a bottom view of the resonator element according to the third embodiment of the invention. FIG. 10 is a cross-sectional view taken along the line CC in FIG. 11 and 12 are diagrams showing the positional relationship between the step and the waveform of the bending vibration, respectively. FIG. 13 is a cross-sectional view showing a quartz substrate formed by wet etching.

  Hereinafter, the resonator element according to the third embodiment will be described focusing on differences from the above-described embodiment, and description of similar matters will be omitted.

  The vibration element according to the third embodiment of the present invention is the same as that of the first embodiment described above except that the vibration section has two stages (a so-called “multistage mesa type”). In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 9 and FIG. 10, the vibration part 21 of the vibration element 1 of the present embodiment includes a thick first region 211 located in the center and around the first region 211 (on both sides in the X-axis direction). And a second region 212 that is positioned and thinner than the first region 211. In this way, by making the vibration part 21 a so-called “multi-stage mesa type”, the vibration part 21 can efficiently confine energy. Therefore, more excellent vibration characteristics can be exhibited.

  The excitation electrode 311 is disposed on the surface of the first region 211, and the excitation electrode 321 is disposed on the back surface of the first region 211 so as to face the excitation electrode 311. In addition, the length Ex (L2) in the X-axis direction of the excitation electrodes 311 and 321 is shorter than the length Mx (L1) in the X-axis direction of the first region 211. That is, the relationship Ex <Mx is satisfied. The excitation electrodes 311 and 321 are arranged in the center so as not to overlap with both ends of the first region 211 in the X-axis direction.

  In such a vibration element 1, the portion of the first region 211 where the excitation electrodes 311 and 321 are arranged forms the thickest thick portion 11, and the surrounding first region 211 is formed from the thicker portion. The first middle thickness part 121 having a smaller thickness is formed, the second region 212 forms the second middle thickness part 122 thinner than the first middle thickness part 121, and the thin part 22 is the second middle thickness part. A thin portion 13 having a thickness smaller than that of the portion 122 is formed. Therefore, in the X-axis direction, a step (first step) V5 is formed at the boundary between the excitation electrodes 311 and 321 and the first region 211, and a step (at the boundary between the first region 211 and the second region 212 ( A second step) V6 is formed, and a step (third step) V7 is formed at the boundary between the second region 212 and the thin portion 22.

  Hereinafter, the step V5 located on the −X axis side is referred to as V5 ′, and the step V5 located on the + X axis side is referred to as V5 ″. Similarly, the step V6 located on the −X axis side is referred to as V6 ′. The step V6 located on the + X axis side is V6 ″, the step V7 located on the −X axis side is V7 ′, and the step V7 located on the + X axis side is V7 ″.

  As shown in FIG. 11, two adjacent antinodes of the bending vibration, which are spurious generated in the quartz substrate 2, are located between the steps V5 ′ and V6 ′, and similarly, two adjacent antinodes of the bending vibration are the step V5. “, V6”. More specifically, an imaginary straight line passing through the apex P1 of the assumed bending vibration waveform B and parallel to the Y ′ axis is C31, and passing through the apex P2 adjacent to the apex P1 of the waveform B on the −X axis side, Y ′. An imaginary straight line C33, when a virtual straight line parallel to the axis is C32, a virtual straight line passing through the step V5 ′ and parallel to the Y ′ axis is C33, and a virtual straight line passing through the step V6 ′ and parallel to the Y ′ axis is C34, An imaginary straight line C31, C32 is located between C34. Similarly, an imaginary straight line passing through the vertex P3 of the waveform B and parallel to the Y ′ axis is C35, and the vertex P4 adjacent to the vertex P3 of the waveform B on the + X axis side is defined as C35. When a virtual straight line parallel to the Y ′ axis is C36, a virtual straight line passing through the step V5 ″ and parallel to the Y ′ axis is C37, and a virtual straight line passing through the step V6 ″ and parallel to the Y ′ axis is C38, Virtual straight lines C35, C36 between the straight lines C37, C38 It is located.

  That is, the wavelength of the bending vibration is λ, the separation distance between the virtual straight line C31 and the virtual straight line C33 (the separation distance between the virtual straight line C35 and the virtual straight line C37) is d1, and the separation distance between the virtual straight line C32 and the virtual straight line C34 ( When the distance between the virtual straight line C36 and the virtual straight line C38 is d2, the relationship (Mx−Ex) / 2 = λ / 2−d1−d2 is satisfied. As a result, unnecessary vibrations can be effectively confined between the steps V5 and V6. Therefore, spurious can be reduced, the CI value of the vibration element 1 is lowered, and the vibration characteristics are improved.

  In particular, in this embodiment, virtual straight lines C31 and C32 are symmetrically positioned between virtual straight lines C33 and C34, and virtual straight lines C35 and C36 are symmetrically positioned between virtual straight lines C37 and C38. . That is, the relationship d1 = d2 is satisfied. Thereby, the above-mentioned spurious can be reduced more effectively. Moreover, it is preferable that d1 and d2 satisfy the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively, and further Mx / 2 = (n / 2 + 1/4) λ−d1−. It is preferable to satisfy the relationship of d2 (where n is an integer). Thereby, spurious can be reduced more effectively.

  As a modification of the present embodiment, as shown in FIG. 12, two adjacent antinodes of bending vibration, which is spurious generated in the quartz substrate 2, are located between the steps V6 ′ and V7 ′, and similarly bent Two adjacent antinodes of vibration may be positioned between the steps V6 ″ and V7 ″. That is, if two antinodes are located between the steps V5 and V6, or if two antinodes are located between the steps V6 and V7, the spurious can be effectively reduced as described above. Can do.

  The third embodiment has been described above. For example, when the crystal substrate 2 is formed by patterning the crystal substrate by wet etching, the crystal plane of the crystal substrate appears as shown in FIG. 13, and each of the first and second regions 211 and 212 is displayed. The side wall becomes an inclined surface. In this case, the step V6 is a portion located at the center between the boundary between the main surface and the inclined surface of the first region 211 and the boundary between the inclined surface and the main surface of the second region 212. Further, the step V7 is a portion located at the center between the boundary between the main surface and the inclined surface of the second region 212 and the boundary between the inclined surface and the main surface of the thin portion 22.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, a fourth embodiment of the resonator element according to the invention will be described.

  FIG. 14 is a top view and a bottom view of a resonator element according to the fourth embodiment of the invention. 15 is a cross-sectional view taken along the line DD in FIG. 16 and 17 are diagrams showing the positional relationship between the step and the waveform of the bending vibration. FIG. 18 is a cross-sectional view showing a quartz substrate formed by wet etching.

  Hereinafter, the vibration element according to the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The vibration element according to the fourth embodiment of the present invention is the same as that of the second embodiment described above except that the vibration section has two stages (a so-called “multistage mesa type”). In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 14 and FIG. 15, the vibration part 21 of the vibration element 1 of the present embodiment is located around the first region 211, the thick first region 211 located in the center, and the first region 2nd area | region 212 thinner than 211.

  In addition, the length Ex of the excitation electrodes 311 and 321 in the X-axis direction is longer than the length Mx of the vibration unit 21 in the X-axis direction. That is, the relationship Ex> Mx is satisfied. The excitation electrodes 311 and 321 are arranged so that both end portions in the X-axis direction protrude from the vibrating portion 21 onto the thin portion 22.

  In such a vibration element 1, the first region 211 forms the thickest thick portion 11, the second region 212 forms the first middle thickness portion 121 thinner than the thick portion, The portion of the thin portion 22 where the excitation electrodes 311 and 321 are arranged forms the second middle portion 122 having a thickness smaller than that of the first middle portion 121, and the thin portion 22 positioned around the second middle portion 122 is the second middle portion. A thin portion 13 having a thickness smaller than that of the meat portion 122 is formed. Therefore, a step (first step) V8 is formed at the boundary between the first region 211 and the second region 212 in the X-axis direction, and a step (first step) is formed at the boundary between the second region 212 and the thin portion 22. 2 steps) V9 is formed, and a step (third step) V10 is formed at the boundary between the excitation electrodes 311 and 321 and the thin portion 22.

  Hereinafter, the step V8 located on the −X axis side is referred to as V8 ′, and the step V8 located on the + X axis side is referred to as V8 ″. Similarly, the step V9 located on the −X axis side is referred to as V9 ′. The step V9 located on the + X-axis side is V9 ″, the step V10 located on the −X-axis side is V10 ′, and the step V10 located on the + X-axis side is V10 ″.

  As shown in FIG. 16, two adjacent antinodes of bending vibration which are spurious generated in the quartz substrate 2 are located between steps V9 ′ and V10 ′, and similarly, two adjacent antinodes of bending vibration are step V9. “, V10”. More specifically, let C41 be an imaginary straight line passing through the apex P1 of the waveform B of the assumed bending vibration and parallel to the Y ′ axis, passing through the apex P2 adjacent to the apex P1 of the waveform B on the −X axis side, and Y ′. When a virtual straight line parallel to the axis is C42, a virtual straight line passing through the step V9 ′ and parallel to the Y ′ axis is C43, and a virtual straight line passing through the step V10 ′ and parallel to the Y ′ axis is C44, the virtual straight line C43, Virtual straight lines C41 and C42 are located between C44. Similarly, an imaginary straight line passing through the apex P3 of the waveform B and parallel to the Y ′ axis is C45, and an imaginary straight line passing through the apex P4 adjacent to the apex P3 of the waveform B on the + X axis side and parallel to the Y ′ axis is C46. When a virtual straight line passing through the step V9 ″ and parallel to the Y ′ axis is C47, and a virtual straight line passing through the step V10 ″ and parallel to the Y ′ axis is C48, virtual straight lines C45 and C46 are provided between the virtual straight lines C47 and C48. positioned.

  That is, the wavelength of the bending vibration is λ, the distance between the virtual straight line C41 and the virtual straight line C43 (the distance between the virtual straight line C45 and the virtual straight line C47) is d1, and the distance between the virtual straight line C42 and the virtual straight line C44 ( When the distance between the virtual straight line C46 and the virtual straight line C48 is d2, the relationship (Mx−Ex) / 2 = λ / 2−d1−d2 is satisfied. As a result, unnecessary vibrations can be effectively confined between the steps V9 and V10. Therefore, spurious can be reduced, the CI value of the vibration element 1 is lowered, and the vibration characteristics are improved.

  In particular, in the present embodiment, the virtual straight lines C41 and C42 are symmetrically positioned between the virtual straight lines C43 and C44, and the virtual straight lines C45 and C46 are symmetrically positioned between the virtual straight lines C47 and C48. . That is, the relationship d1 = d2 is satisfied. Thereby, the above-mentioned spurious can be reduced more effectively. Moreover, it is preferable that d1 and d2 satisfy the relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively, and further Mx / 2 = (n / 2 + 1/4) λ−d1−. It is preferable to satisfy the relationship of d2 (where n is an integer). Thereby, spurious can be reduced more effectively.

  As a modification of the present embodiment, as shown in FIG. 17, two adjacent antinodes of bending vibration that are spurious generated in the quartz substrate 2 are located between the steps V8 ′ and V9 ′, and similarly bent Two adjacent antinodes of vibration may be positioned between the steps V8 "and V9". That is, if the two antinodes of bending vibration are located between the steps V9 and V10, or if the two antinodes of bending vibration are located between the steps V8 and V9, as described above, it is effective. In addition, spurious can be reduced.

  The fourth embodiment has been described above. For example, when the crystal substrate 2 is formed by patterning the crystal substrate by wet etching, the crystal plane of the crystal substrate appears, as shown in FIG. 18, and each of the first and second regions 211 and 212 is displayed. The side wall becomes an inclined surface. The step V8 (V8 ′, V8 ″) in this case is a portion located at the center between the boundary between the main surface and the inclined surface of the first region 211 and the boundary between the inclined surface and the main surface of the second region 212. The step V9 (V9 ′, V9 ″) is located at the center between the boundary between the main surface and the inclined surface of the second region 212 and the boundary between the inclined surface and the main surface of the thin portion 22. Part.

  According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
Next, a fifth embodiment of the resonator element according to the invention will be described.

  FIG. 19 is a top view and a bottom view of the resonator element according to the fifth embodiment of the invention. 20 is a cross-sectional view taken along line EE in FIG. FIG. 21 is a diagram illustrating the positional relationship between the step and the waveform of the bending vibration.

  Hereinafter, the resonator element according to the fifth embodiment will be described focusing on differences from the above-described embodiment, and description of similar matters will be omitted.

  The vibration element according to the fifth embodiment of the present invention is the same as that of the first embodiment described above, except that the convex portion is arranged in the thin portion. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

As shown in FIGS. 19 and 20, the thin portion 22 of the vibration element 1 of the present embodiment is provided with a convex portion 221. The convex part 221 is spaced apart from the vibration part 21 toward the −X axis side in a plan view, and extends in the Z′-axis direction (the direction along the outer edge intersecting the vibration direction (X axis direction) of the thickness shear vibration of the vibration part 21). It has the 1st convex part 221a extended, and the 2nd convex part 221b which is spaced apart to the + X-axis side from the vibration part 21, and is extended in the Z'-axis direction. In the present embodiment, the first and second convex portions 221a and 221b are integrally formed with the thin portion 22, respectively. For example, another material such as SiO ₂ is deposited on the surface of the thin portion 22. Thus, the first and second convex portions 221a and 221b may be arranged. Further, the first and second convex portions 221a and 221b may be integrally formed by, for example, a frame-like portion disposed so as to surround the periphery of the vibration portion 21.

  In such a vibration element 1, steps V <b> 11 and V <b> 12 are formed at the boundary between the first protrusion 221 a and the thin portion 22 in the X-axis direction. Hereinafter, the step V11 located on the −X axis side is referred to as V11 ′, and the step V11 located on the + X axis side is referred to as V11 ″. Similarly, the step V12 located on the −X axis side is referred to as V12 ′. The step V12 located on the + X-axis side is defined as V12 ″.

  As shown in FIG. 21, two adjacent antinodes of bending vibration which are spurious generated in the quartz substrate 2 are located between steps V11 ′ and V12 ′, and similarly, two adjacent antinodes of bending vibration are step V11. “, V12”. Specifically, an imaginary straight line passing through the apex P5 of the assumed bending vibration waveform B and parallel to the Y ′ axis is C51, and passing through the apex P6 adjacent to the apex P5 of the waveform B on the −X axis side, Y ′. When a virtual straight line parallel to the axis is C52, a virtual straight line passing through the step V11 ′ and parallel to the Y ′ axis is C53, and a virtual straight line passing through the step V12 ′ and parallel to the Y ′ axis is C54, the virtual straight line C53, Virtual straight lines C51 and C52 are located between C54, and similarly, a virtual straight line passing through the vertex P7 of the waveform B and parallel to the Y′-axis is defined as C55, and the vertex P8 adjacent to the vertex P7 of the waveform B on the + X-axis side is defined as C55. When a virtual straight line parallel to the Y ′ axis is C56, a virtual straight line passing through the step V11 ″ and parallel to the Y ′ axis is C57, and a virtual straight line passing through the step V12 ″ and parallel to the Y ′ axis is C58, Virtual straight line C55 between straight lines C57 and C58 C56 is located. As a result, the vibration element 1 can more effectively suppress the bending vibration component, and can more effectively reduce spurious.

  According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
Next, a sixth embodiment of the resonator element according to the invention will be described.

  FIG. 22 is a top view and a bottom view of the resonator element according to the sixth embodiment of the invention. 23 is a cross-sectional view taken along line FF in FIG. FIG. 24 is a diagram illustrating a positional relationship between a step and a waveform of bending vibration.

  Hereinafter, the resonator element according to the sixth embodiment will be described focusing on differences from the above-described embodiment, and description of similar matters will be omitted.

  The vibration element according to the sixth embodiment of the present invention is the same as that of the first embodiment described above, except that the convex portion is arranged in the thin portion. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

As shown in FIGS. 22 and 23, the thin portion 22 of the vibration element 1 of the present embodiment is provided with a convex portion 222. The convex portion 222 has a frame shape that is in contact with the outer periphery of the vibration portion 21 and surrounds the vibration portion 21 in a plan view. However, the convex part 222 is not formed in the part which overlaps with the extraction electrodes 313 and 323. Such a protrusion 222 is made of, for example, the same material as the electrode 3 and is formed at the same time as the electrode 3. However, the constituent material of the convex portion 222 is not limited to this, and for example, SiO ₂ or the like may be used.

  In such a vibration element 1, the portion where the excitation electrodes 311 and 321 of the vibration portion 21 are disposed forms the thickest thick portion 11, and the surrounding vibration portion 21 is thicker than the thick portion. The thin first portion 121 is formed, the convex portion 222 is formed to be thinner than the first middle portion 121, and the thin portion 22 is formed from the second middle portion 122. The thin-walled portion 13 having a small thickness is also formed. Therefore, in the X-axis direction, a step (first step) V13 is formed at the boundary between the excitation electrodes 311 and 321 and the vibration part 21, and a step (second step) is formed at the boundary between the vibration part 21 and the convex part 222. ) V14 is formed, and a step (third step) V15 is formed at the boundary between the convex portion 222 and the thin portion 22.

  Hereinafter, the step V13 located on the −X axis side is referred to as V13 ′, and the step V13 located on the + X axis side is referred to as V13 ″. Similarly, the step V14 located on the −X axis side is referred to as V14 ′. The step V14 located on the + X axis side is defined as V14 ″, the step V15 located on the −X axis side is defined as V15 ′, and the step V15 located on the + X axis side is defined as V15 ″.

  As shown in FIG. 24, two adjacent antinodes of bending vibration which are spurious generated in the quartz substrate 2 are located between the steps V14 ′ and V15 ′, and similarly, two adjacent antinodes of bending vibration are the step V14. “, V15”. More specifically, a virtual straight line passing through the apex P1 of the assumed bending vibration waveform B and parallel to the Y ′ axis is C61, and passing through the apex P2 adjacent to the apex P1 of the waveform B on the −X axis side, Y ′. When a virtual straight line parallel to the axis is C62, a virtual straight line passing through the step V14 ′ and parallel to the Y ′ axis is C63, and a virtual straight line passing through the step V15 ′ and parallel to the Y ′ axis is C64, the virtual straight line C63, Virtual straight lines C61 and C62 are located between C64, and similarly, a virtual straight line passing through the vertex P3 of the waveform B and parallel to the Y′-axis is defined as C65, and the vertex P4 adjacent to the vertex P3 of the waveform B on the + X-axis side is defined as C65. A virtual straight line parallel to the Y ′ axis is C66, a virtual straight line passing through the step V14 ″ and parallel to the Y ′ axis is C67, and a virtual straight line passing through the step V15 ″ and parallel to the Y ′ axis is C68. Virtual straight line C65 between straight lines C67 and C68 C66 is located.

  As a result, unnecessary vibrations can be effectively confined between the steps V14 and V15. Therefore, spurious can be reduced, the CI value of the vibration element 1 is lowered, and the vibration characteristics are improved.

  Also according to the sixth embodiment, the same effects as those of the first embodiment described above can be exhibited.

2. Next, a vibrator to which the above-described vibration element 1 is applied will be described.
FIG. 25 is a cross-sectional view showing an example of the vibrator of the present invention.

  A vibrator 10 illustrated in FIG. 25 includes the above-described vibration element 1 and a package 4 that houses the vibration element 1.

  The package 4 includes a box-shaped base 41 having a concave portion 411 that opens to the upper surface, and a plate-shaped lid 42 that closes the opening of the concave portion 411 and is joined to the base 41. The vibration element 1 is housed in the housing space S formed by closing the recess 411 with the lid 42. The accommodation space S may be in a reduced pressure (vacuum) state, for example. Moreover, inert gas, such as nitrogen, helium, and argon, may be enclosed.

  The constituent material of the base 41 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 42 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 41. For example, when the constituent material of the base 41 is ceramic as described above, an alloy such as Kovar is preferable. In addition, joining of the base 41 and the lid 42 is not specifically limited, For example, you may join via an adhesive material and may join by seam welding etc.

  Connection electrodes 451 and 461 are formed on the bottom surface of the recess 411 of the base 41. External mounting terminals 452 and 462 are formed on the lower surface of the base 41. The connection electrode 451 is electrically connected to the external mounting terminal 452 through a through electrode formed in the base 41, and the connection electrode 461 is connected to the external mounting terminal 462 through a through electrode formed in the base 41. Electrically connected.

  The vibration element 1 housed in the housing space S is fixed to the base 41 by two conductive adhesives 51 and 52 at the end on the + X axis side with the lower surface facing the base 41 side. The conductive adhesive 51 is provided in contact with the connection electrode 451 and the pad electrode 312. Thereby, the connection electrode 451 and the pad electrode 312 are electrically connected via the conductive adhesive 51. On the other hand, the conductive adhesive 52 is provided in contact with the connection electrode 461 and the pad electrode 322. Thereby, the connection electrode 461 and the pad electrode 322 are electrically connected via the conductive adhesive material 52. The conductive adhesives 51 and 52 are not particularly limited as long as they have conductivity and adhesiveness. For example, conductive adhesives such as silicone-based, epoxy-based, acrylic-based, polyimide-based, and bismaleimide-based conductive materials can be used. What disperse | distributed the filler can be used.

(Modification)
Next, a modification of the vibrator will be described.
FIG. 26 is a top view and a cross-sectional view showing a modification of the vibrator of the present invention.

  This modification is a so-called “MAT” type vibrator. As shown in FIG. 26, the vibrator 10 of this modification example couples the vibration element 1 (quartz substrate 2), the frame portion 61 positioned around the vibration element 1, and the frame portion 61 and the crystal substrate 2. The vibration element containing layer 60 integrally formed with the connecting portion 62 is sandwiched between the box-shaped base 41 and the box-shaped lid 42. More specifically, the base 41 has a recess 411 that opens to the upper surface, and the upper surface is joined to the lower surface of the frame portion 61. On the other hand, the lid 42 has a recess 421 that opens to the lower surface, and the lower surface is joined to the upper surface of the frame portion 61. As a result, an accommodation space S surrounded by the base 41, the lid 42, and the frame portion 61 is formed, and the vibration element 1 is accommodated in the accommodation space S.

  In this modification, the pad electrodes 312 and 322 are provided on the frame portion 61, and the pad electrodes 312 and 322 are electrically connected to the external mounting terminals 452 and 462 through the through electrodes formed on the base 41. Has been.

3. Next, an oscillator to which the vibrator of the present invention is applied (the oscillator of the present invention) will be described.
FIG. 27 is a cross-sectional view showing a preferred embodiment of the oscillator of the present invention.

  An oscillator 100 illustrated in FIG. 27 includes a vibrator 10 and an IC chip 110 for driving the vibration element 1. Hereinafter, the oscillator 100 will be described with a focus on differences from the above-described vibrator, and description of similar matters will be omitted.

  As shown in FIG. 27, in the oscillator 100, the IC chip 110 is fixed to the recess 411 of the base 41. The IC chip 110 is electrically connected to a plurality of internal terminals 120 formed on the bottom surface of the recess 411. The plurality of internal terminals 120 include those connected to the connection electrodes 451 and 461 and those connected to the external mounting terminals 452 and 462. The IC chip 110 has an oscillation circuit for controlling the driving of the vibration element 1. When the vibration element 1 is driven by the IC chip 110, a signal having a predetermined frequency can be taken out.

4). Next, an electronic device (an electronic device of the present invention) to which the vibrator of the present invention is applied will be described.

  FIG. 28 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 29 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, or the like.

  FIG. 30 is a perspective view showing a configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, or the like.

  In addition to the personal computer shown in FIG. 28 (mobile personal computer), the mobile phone shown in FIG. 29, and the digital still camera shown in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Class (eg, vehicle, aircraft) Gauges of a ship), can be applied to a flight simulator or the like.

5. Next, a moving body (moving body of the present invention) to which the vibrator of the present invention is applied will be described.

  FIG. 31 is a perspective view schematically showing an automobile as an example of the moving object of the present invention. The automobile 1500 is equipped with the vibrator 10 (the vibration element 1). The vibrator 10 is a keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine control, hybrid car, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.

  As described above, the resonator element, the vibrator, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is the same. It can be replaced with any configuration having the above function. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

  In the above-described embodiment, the quartz substrate is used as the piezoelectric substrate, but various piezoelectric substrates such as lithium niobate and lithium tantalate may be used instead.

DESCRIPTION OF SYMBOLS 1 ... Vibrating element 10 ... Vibrator 11 ... Thick part 12 ... Middle part 121 ... 1st middle part 122 ... 2nd middle part 13 ... Thin part 100 ... Oscillator 110 ... IC chip 120 …… Internal terminal 2 …… Quartz substrate 21 …… Vibrating portion 211 …… First region 212 …… Second region 22 …… Thin portion 221 …… Convex portion 221a …… First convex portion 221b …… First 2 convex portion 222 ...... convex portion 3 ...... electrode 311, 321 ...... excitation electrode 312, 322 ...... pad electrode 313, 323 ...... extraction electrode 4 ...... package 41 ...... base 411 ...... concave portion 42 ...... lid 421 ... Recesses 451, 461 ... Connecting electrodes 452,462 ... External mounting terminals 51,52 ... Conductive adhesive 60 ... Vibrating element-containing layer 61 ... Frame part 62 ... Connecting part 1100 ... Personal computer 11 2 …… Keyboard 1104 …… Main body 1106 …… Display unit 1108 …… Display unit 1200 …… Mobile phone 1202 …… Operation buttons 1204 …… Earpiece 1206 …… Speaker 1208 …… Display 1300 …… Digital still Camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display unit 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer 1500 …… Car B ...... Waveforms C11-C18, C21-C28, C31-C38, C41-C48, C51-C58, C61-C68 ... Virtual straight line P1-P8 ... Vertex S ... Accommodating space V1 (V1 ', V1 " ) To V15 (V15 ′, V15 ″) …… Difference

Claims (12)

The thick part,
Located in the periphery of the thick portion, the middle thickness portion is thinner than the thick portion,
It is located around the middle meat part, and has a thin part thinner than the middle meat part,
At least the thick part vibrates due to thickness sliding vibration,
Between the first step at the boundary between the thick part and the middle part on the one side in the vibration direction of the thickness shear vibration and the second step at the boundary between the middle part and the thin part, A vibrating element characterized in that a first antinode and a second antinode adjacent to bending vibration are located. The distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and the distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
The resonator element according to claim 1, wherein the relation of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8 is satisfied. A vibration part that vibrates due to thickness-slip vibration;
A thin-walled portion located around the vibrating portion and thinner than the vibrating portion;
An electrode disposed on the main surface of the vibrating part,
When the length of the vibration part in the vibration direction of the thickness-shear vibration is L1, and the length of the electrode is L2,
Satisfying the relationship of L1> L2,
Between the first step at the boundary between the electrode and the vibration part on one side in the vibration direction of the thickness-shear vibration and the second step at the boundary between the vibration part and the thin part, adjacent to the bending vibration. The matching first and second belly are located,
The distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and the distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
L1 / 2 = (n / 2 + 1/4) λ−d1−d2 (where n is an integer)
A vibration element characterized by satisfying a relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively.   The resonator element according to claim 3, wherein a relationship of (L1−L2) / 2 = λ / 2−d1−d2 is satisfied. A vibration part that vibrates due to thickness-slip vibration;
A thin-walled portion located around the vibrating portion and thinner than the vibrating portion;
An electrode disposed across the main surface of the vibrating portion and the main surface of the thin portion,
When the length of the vibration part in the vibration direction of the thickness-shear vibration is L1, and the length of the electrode is L2,
Satisfying the relationship of L1 <L2,
Between the first step at the boundary between the electrode and the vibration part on one side in the vibration direction of the thickness-shear vibration and the second step at the boundary between the vibration part and the thin part, adjacent to the bending vibration. The matching first and second belly are located,
The distance between the first antinode and the first step in the vibration direction of the thickness-shear vibration is d1, and the distance between the second antinode and the second step is d2.
When the wavelength of bending vibration is λ,
L1 / 2 = (n / 2 + 1/4) λ−d1−d2 (where n is an integer)
A vibration element characterized by satisfying a relationship of 0 <d1 ≦ λ / 8 and 0 <d2 ≦ λ / 8, respectively.   The resonator element according to claim 5, wherein a relationship of (L2−L1) / 2 = λ / 2−d1−d2 is satisfied.   The said vibration part has a 1st area | region and the 2nd area | region located in the both sides of the vibration direction of the said thickness shear vibration of the said 1st area | region, and thinner than the said 1st area | region. 7. The vibration element according to any one of items 6 to 6.   The vibration element according to any one of claims 3 to 7, wherein a protrusion along an outer edge that intersects a vibration direction of the thickness-shear vibration of the vibration part is disposed around the vibration part. The vibration element according to any one of claims 1 to 8,
And a package in which the vibration element is housed. The vibration element according to any one of claims 1 to 8,
And an oscillator.   An electronic apparatus comprising the vibration element according to claim 1.   A moving body comprising the vibration element according to claim 1.

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