JP2016133623A5 - - Google Patents
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- JP2016133623A5 JP2016133623A5 JP2015008107A JP2015008107A JP2016133623A5 JP 2016133623 A5 JP2016133623 A5 JP 2016133623A5 JP 2015008107 A JP2015008107 A JP 2015008107A JP 2015008107 A JP2015008107 A JP 2015008107A JP 2016133623 A5 JP2016133623 A5 JP 2016133623A5
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- 239000000758 substrate Substances 0.000 claims description 85
- 238000001514 detection method Methods 0.000 claims description 56
- 238000005259 measurement Methods 0.000 claims description 20
- 230000002093 peripheral Effects 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000000875 corresponding Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
Description
本発明の第１の実施態様に従えば、所定の軸線から一定半径の円筒状の外周面の一部で、長尺の可撓性の被処理基板の一部を支持し、前記軸線の周りに回転することにより前記被処理基板を長尺方向に搬送する円筒部材を備え、前記円筒部材の外周面の周方向の特定方位に配置された処理部によって前記外周面で支持された前記被処理基板に所定の処理を施す基板処理装置であって、前記円筒部材の前記回転の方向又は前記軸線の方向への変位を検出するために、前記円筒部材の外周面に沿った特定位置に設けられた基準パターンを、前記処理部が配置される前記特定方位から周方向に所定の角度だけ離れた方位に設定される検出領域内で検出するパターン検出部と、前記円筒部材とともに前記軸線の周りを回転し、かつ前記円筒部材の回転方向の角度位置に応じた目盛が環状に刻設されたスケール部と、該スケール部上の所定の計測領域で前記目盛を読み取るように前記スケール部の周囲に配置され、前記円筒部材の回転方向の位置に関する計測情報を出力するスケール計測部と、前記円筒部材の回転にともなって、前記基準パターンが前記パターン検出部の検出領域内の互いに異なる少なくとも２ヶ所の各々にきたときに、前記パターン検出部によって検出される前記基準パターンの少なくとも２つの位置情報と前記スケール計測部の計測情報とに基づいて、前記パターン検出部と前記円筒部材との相対的な位置関係、又は該位置関係の所定状態からの誤差を求める演算部と、を備える基板処理装置が提供される。 According to the first embodiment of the present invention, a part of a long flexible substrate to be processed is supported by a part of a cylindrical outer peripheral surface having a constant radius from a predetermined axis, A cylindrical member that conveys the substrate to be processed in a longitudinal direction by rotating the substrate, and the processing target supported on the outer peripheral surface by a processing unit disposed in a specific direction in the circumferential direction of the outer peripheral surface of the cylindrical member A substrate processing apparatus that performs a predetermined process on a substrate, and is provided at a specific position along an outer peripheral surface of the cylindrical member in order to detect displacement of the cylindrical member in the rotation direction or the axis direction. A pattern detection unit for detecting a reference pattern in a detection area set at a predetermined angle in the circumferential direction from the specific azimuth in which the processing unit is disposed, and the axis together with the cylindrical member Rotating and rotating the cylindrical member A scale portion in which a scale corresponding to the angular position of the direction is engraved in an annular shape, and arranged around the scale portion so as to read the scale in a predetermined measurement area on the scale portion, and the rotation direction of the cylindrical member When the reference pattern comes to each of at least two different positions in the detection area of the pattern detection unit as the cylindrical member rotates, and the scale measurement unit outputs measurement information related to the position of the pattern detection. A relative positional relationship between the pattern detection unit and the cylindrical member, or a predetermined state of the positional relationship, based on at least two positional information of the reference pattern detected by the unit and measurement information of the scale measurement unit There is provided a substrate processing apparatus including a calculation unit that calculates an error from the calculation unit.
本発明の第２の実施態様に従えば、長尺方向に搬送されるフレキシブルな被処理基板に電子デバイス用のパターンを形成するデバイス製造方法であって、前記被処理基板を、本発明の第１の実施態様に従う基板処理装置の前記円筒部材の外周面に支持させて、所定速度で長尺方向に搬送することと、前記被処理基板に形成された基板マークの位置を、本発明の第１の実施態様に従う基板処理装置の前記パターン検出部と前記スケール計測部とにより検出することと、前記基板マークの検出された位置に基づいて設定される前記被処理基板上の所定の領域に、本発明の第１の実施態様に従う基板処理装置の前記処理部によって前記電子デバイス用のパターンを形成することと、を含むデバイス製造方法が提供される。
According to a second embodiment of the present invention , there is provided a device manufacturing method for forming a pattern for an electronic device on a flexible substrate to be processed that is transported in the longitudinal direction . The substrate processing apparatus according to one embodiment is supported on the outer peripheral surface of the cylindrical member and conveyed in the longitudinal direction at a predetermined speed, and the position of the substrate mark formed on the substrate to be processed Detecting the pattern detection unit and the scale measurement unit of the substrate processing apparatus according to one embodiment, and a predetermined region on the target substrate set based on the detected position of the substrate mark , a device manufacturing method comprising forming a pattern for the electronic device by the processing unit of a substrate processing apparatus according to the first embodiment, the present invention is provided.
Claims (20)
前記円筒部材の前記回転の方向又は前記軸線の方向への変位を検出するために、前記円筒部材の外周面に沿った特定位置に設けられた基準パターンを、前記処理部が配置される前記特定方位から周方向に所定の角度だけ離れた方位に設定される検出領域内で検出するパターン検出部と、
前記円筒部材とともに前記軸線の周りを回転し、かつ前記円筒部材の回転方向の角度位置に応じた目盛が環状に刻設されたスケール部と、
該スケール部上の所定の計測領域で前記目盛を読み取るように前記スケール部の周囲に配置され、前記円筒部材の回転方向の位置に関する計測情報を出力するスケール計測部と、
前記円筒部材の回転にともなって、前記基準パターンが前記パターン検出部の検出領域内の互いに異なる少なくとも２ヶ所の各々にきたときに、前記パターン検出部によって検出される前記基準パターンの少なくとも２つの位置情報と前記スケール計測部の計測情報とに基づいて、前記パターン検出部と前記円筒部材との相対的な位置関係、又は該位置関係の所定状態からの誤差を求める演算部と、
を備える基板処理装置。 A part of a cylindrical outer peripheral surface having a constant radius from a predetermined axis supports a part of a long flexible substrate to be processed, and the substrate to be processed is elongated by rotating around the axis. The substrate processing apparatus includes a cylindrical member that conveys in a direction, and performs a predetermined process on the substrate to be processed supported on the outer peripheral surface by a processing unit disposed in a specific direction in the circumferential direction of the outer peripheral surface of the cylindrical member. And
In order to detect the displacement of the cylindrical member in the direction of rotation or the direction of the axis, the specific pattern in which the processing unit is arranged is used as a reference pattern provided at a specific position along the outer peripheral surface of the cylindrical member. A pattern detection unit for detecting within a detection region set in an azimuth away from the azimuth by a predetermined angle in the circumferential direction ;
A scale portion that rotates around the axis together with the cylindrical member, and in which a scale corresponding to the angular position in the rotational direction of the cylindrical member is engraved in an annular shape;
A scale measuring unit that is arranged around the scale unit so as to read the scale in a predetermined measurement area on the scale unit, and outputs measurement information regarding the position of the cylindrical member in the rotational direction;
At least two positions of the reference pattern detected by the pattern detection unit when the reference pattern comes to each of at least two different positions in the detection area of the pattern detection unit as the cylindrical member rotates. Based on the information and the measurement information of the scale measurement unit, a relative positional relationship between the pattern detection unit and the cylindrical member, or a calculation unit for obtaining an error from a predetermined state of the positional relationship;
A substrate processing apparatus comprising:
前記パターン検出部は、
前記検出領域内を所定倍率で拡大する対物光学系と、
前記検出領域の拡大像を光電検出する画像センサと、
前記検出領域内に前記基準パターンが現れたときに前記画像センサから出力される画像情報に基づいて前記基準パターンの位置情報を求める画像処理回路と、を備える、
基板処理装置。 The substrate processing apparatus according to claim 1,
The pattern detection unit
An objective optical system for enlarging the detection area at a predetermined magnification;
An image sensor that photoelectrically detects an enlarged image of the detection region;
An image processing circuit for obtaining position information of the reference pattern based on image information output from the image sensor when the reference pattern appears in the detection area;
Substrate processing equipment.
前記演算部は、さらに、
前記パターン検出部によって検出される前記基準パターンの前記少なくとも２つの位置情報と、前記基準パターンが前記パターン検出部の前記検出領域内の互いに異なる前記少なくとも２ヶ所の各々にきたときに、前記スケール計測部から出力される少なくとも２つの計測情報とに基づいて、前記画像センサで検出される拡大像の倍率誤差又は倍率係数を求める、
基板処理装置。 The substrate processing apparatus according to claim 2,
The calculation unit further includes:
Wherein at least two position information of the reference pattern detected by the pattern detection unit, when the reference pattern has come to each of different at least two locations in the detection region of the pattern detection unit, the scale measuring A magnification error or a magnification coefficient of a magnified image detected by the image sensor based on at least two pieces of measurement information output from the unit;
Substrate processing equipment.
前記演算部は、さらに、
前記パターン検出部によって検出される前記基準パターンの前記少なくとも２つの位置情報に基づいて、前記画像センサで検出される拡大像の回転誤差を求める、
基板処理装置。 The substrate processing apparatus according to claim 2,
The calculation unit further includes:
Obtaining a rotation error of the magnified image detected by the image sensor based on the at least two position information of the reference pattern detected by the pattern detection unit;
Substrate processing equipment.
前記軸線が延びる方向から見た場合、前記スケール部上の前記計測領域と前記パターン検出部の前記検出領域とが前記円筒部材の周方向に関して同じ位置となるように、前記スケール計測部を前記スケール部の周囲に配置する、
基板処理装置。 A substrate processing apparatus according to any one of claims 1 to 4, wherein
When viewed from the direction in which the axis line extends, said as the measurement region on the scale portion and said detection area of said pattern detecting unit is the same position in the circumferential direction of the cylindrical member, the scale and the scale measuring unit Placed around the part,
Substrate processing equipment.
前記円筒部材の回転にともなって、前記基準パターンが前記パターン検出部の前記検出領域内の任意の箇所にきた状態において、
前記演算部は、前記パターン検出部によって検出される前記基準パターンの位置情報を第１の位置情報として求めるとともに、前記スケール計測部が出力する計測情報を第１の計測情報として求め、その状態から前記円筒部材が３６０°±Δθ°回転した後に、前記演算部は、前記パターン検出部によって検出される前記基準パターンの位置情報を第２の位置情報として求めるとともに、前記スケール計測部が出力する計測情報を第２の計測情報として求める、
基板処理装置。 The substrate processing apparatus according to claim 5,
With the rotation of the cylindrical member, in a state in which the reference pattern came anywhere in the detection area of the pattern detection unit,
The calculation unit obtains position information of the reference pattern detected by the pattern detection unit as first position information, obtains measurement information output by the scale measurement unit as first measurement information, and determines from the state After the cylindrical member rotates 360 ° ± Δθ °, the calculation unit obtains the position information of the reference pattern detected by the pattern detection unit as second position information, and the measurement output from the scale measurement unit Asking for information as second measurement information,
Substrate processing equipment.
前記円筒部材の回転する角度Δθ°は、前記基準パターンが前記パターン検出部の検出領域内の互いに異なる少なくとも２ヶ所の各々に現れるように設定される、
基板処理装置。 The substrate processing apparatus according to claim 6,
The rotation angle Δθ ° of the cylindrical member is set so that the reference pattern appears in each of at least two different positions in the detection area of the pattern detection unit.
Substrate processing equipment.
前記基板処理装置は、さらに前記円筒部材の前記軸線方向の横ずれを検出する横ずれ検出部を有し、
前記演算部は、
前記横ずれ検出部が検出した横ずれ量も用いて、前記パターン検出部と前記円筒部材との相対的な位置関係の誤差を求める、
基板処理装置。 A substrate processing apparatus according to any one of claims 1 to 7,
The substrate processing apparatus further includes a lateral deviation detection unit that detects lateral deviation in the axial direction of the cylindrical member,
The computing unit is
Using the lateral deviation amount detected by the lateral deviation detection unit, an error in the relative positional relationship between the pattern detection unit and the cylindrical member is obtained.
Substrate processing equipment.
前記円筒部材又は前記スケール部は、前記軸線と９０°±α°で交差する基準平坦面を有し、
前記横ずれ検出部は、前記軸線から前記円筒部材の径方向に一定量変位した前記基準平坦面上の計測位置において、前記円筒部材の前記軸線方向の横ずれを非接触で検出する変位センサを含む、
基板処理装置。 The substrate processing apparatus according to claim 8, comprising:
The cylindrical member or the scale portion has a reference flat surface that intersects the axis at 90 ° ± α °,
The lateral deviation detection unit includes a displacement sensor that detects the lateral deviation of the cylindrical member in the axial direction in a non-contact manner at a measurement position on the reference flat surface that is displaced by a certain amount in the radial direction of the cylindrical member from the axis.
Substrate processing equipment.
前記変位センサは、前記軸線を挟んで対称的に配置される２個の変位センサ又は前記軸線の回りに略１２０°の間隔で配置される３個の変位センサを有する、
基板処理装置。 The substrate processing apparatus according to claim 9, comprising:
The displacement sensor includes two displacement sensors arranged symmetrically with respect to the axis, or three displacement sensors arranged at intervals of approximately 120 ° around the axis.
Substrate processing equipment.
前記パターン検出部は、前記円筒部材の回転方向に所定角度βだけ離して配置される第１パターン検出部と第２パターン検出部とを含み、
前記演算部は、
前記円筒部材の回転にともなって、順次、前記第１パターン検出部の検出領域内と前記第２パターン検出部の検出領域内との各々で検出される前記基準パターンの各位置情報に基づいて、前記第１パターン検出部と前記第２パターン検出部との相対的な位置関係を求める、
基板処理装置。 It is a substrate processing apparatus of any one of Claims 1-10,
The pattern detection unit includes a first pattern detection unit and a second pattern detection unit that are arranged apart from each other by a predetermined angle β in the rotation direction of the cylindrical member,
The computing unit is
With the rotation of the cylindrical member, based on each position information of the reference pattern detected in each of the detection area of the first pattern detection unit and the detection area of the second pattern detection unit sequentially, Obtaining a relative positional relationship between the first pattern detection unit and the second pattern detection unit;
Substrate processing equipment.
前記被処理基板は、前記円筒部材で搬送される際に、前記第１パターン検出部と前記第２パターン検出部との各検出領域内に現れるように前記長尺方向に配置された複数の基板マークを有する、
基板処理装置。 The substrate processing apparatus according to claim 11,
The substrate to be processed is a plurality of substrates arranged in the longitudinal direction so as to appear in the detection areas of the first pattern detection unit and the second pattern detection unit when being transported by the cylindrical member. Having a mark ,
Substrate processing equipment.
前記演算部は、
前記円筒部材の回転によって、順次、前記第１パターン検出部と前記第２パターン検出部との各々で検出して得られる前記基板マークの各位置情報に基づいて、前記被処理基板上に規定される被処理領域の位置を定める、
基板処理装置。 The substrate processing apparatus according to claim 12,
The computing unit is
By rotation of the cylindrical member, successively, on the basis of the respective position information of the substrate marks obtained by detecting by each of said second pattern detection unit and the first pattern detecting section, is defined in the target substrate Determine the position of the treated area,
Substrate processing equipment.
前記第１パターン検出部と前記第２パターン検出部とは、前記円筒部材の外周面又は前記被処理基板に向けて、前記基準パターン又は基板マークを検出するための照明光を照射する照明系を有し、
前記被処理基板は、前記照明光に対して透過性を有する、
基板処理装置。 The substrate processing apparatus according to claim 12,
The first pattern detection unit and the second pattern detection unit are illumination systems that irradiate illumination light for detecting the reference pattern or the substrate mark toward the outer peripheral surface of the cylindrical member or the substrate to be processed. Have
The substrate to be processed has transparency to the illumination light;
Substrate processing equipment.
前記演算部は、
前記円筒部材の回転にともなって、順次、前記第１パターン検出部の検出領域内及び前記第２パターン検出部の検出領域内の各々で検出される前記基準パターンの各位置情報と、
前記円筒部材が前記所定角度βだけ回転したときに、前記複数の基板マークのうちの特定基板マークを、前記第１パターン検出部と前記第２パターン検出部との各々で検出して得られる前記特定基板マークの各位置情報と、に基づいて、前記円筒部材の外周面と前記被処理基板との相対位置の変化を求める、
基板処理装置。 The substrate processing apparatus according to claim 14, comprising:
The computing unit is
With the rotation of the cylindrical member, each position information of the reference pattern detected in each of the detection area of the first pattern detection unit and the detection area of the second pattern detection unit,
When the cylindrical member rotates by the predetermined angle beta, a specific substrate marks of the plurality of substrate marks, obtained by detecting by each of the said first pattern detection unit and the second pattern detecting section the Based on each position information of the specific substrate mark, to determine the change in the relative position between the outer peripheral surface of the cylindrical member and the substrate to be processed ,
Substrate processing equipment.
前記基準パターンは、
前記円筒部材の外周面の回転方向に所定の角度間隔ε°で複数設けられ、前記複数の基板マークが前記長尺方向に間隔Ｍで設けられる場合、前記円筒部材の半径をｒとしたとき、前記角度間隔ε°と間隔Ｍとが、π・ｒ・ε／１８０≠Ｍ、の関係となるように設定される、
基板処理装置。 The substrate processing apparatus according to claim 15, wherein
The reference pattern is
When the plurality of substrate marks are provided at intervals M in the longitudinal direction when the plurality of substrate marks are provided at intervals M in the rotation direction of the outer peripheral surface of the cylindrical member, when the radius of the cylindrical member is r, The angular interval ε ° and the interval M are set to have a relationship of π · r · ε / 180 ≠ M.
Substrate processing equipment.
前記基板マークは、前記被処理基板の前記円筒部材で支持される面側に設けられ、
前記第１パターン検出部又は前記第２パターン検出部は、前記照明光に対して透過性を有する前記被処理基板を介して前記基板マークを検出する、
基板処理装置。 A substrate processing apparatus according to any one of claims 14 to 16, comprising:
The substrate mark is provided on a surface side supported by the cylindrical member of the substrate to be processed ,
The first pattern detection unit or the second pattern detection unit detects the substrate mark through the substrate to be processed having transparency to the illumination light.
Substrate processing equipment.
前記第１パターン検出部及び前記第２パターン検出部の各々の検出領域と、前記処理部の前記被処理基板に対する処理位置とは、前記円筒部材の外周面で前記被処理基板が支持される所定の周長範囲内に配置される、
基板処理装置。 The substrate processing apparatus according to claim 13,
Wherein a first pattern detecting section and each of the detection areas of the second pattern detecting section, a processing position with respect to the substrate to be treated in the processing unit, predetermined for the target substrate is supported by the outer peripheral surface of the cylindrical member Arranged within the circumference range of
Substrate processing equipment.
前記処理部は、前記被処理基板の表面に、液状又はペースト状のインクによってパターニングを施す塗布装置、又は光エネルギーによってパターニングを施す露光装置である、
基板処理装置。 The substrate processing apparatus according to claim 1,
The processing unit is a coating apparatus that performs patterning with liquid or paste-like ink on the surface of the substrate to be processed , or an exposure apparatus that performs patterning with light energy.
Substrate processing equipment.
前記被処理基板を、請求項１９に記載の基板処理装置の前記円筒部材の外周面に支持させて、所定速度で長尺方向に搬送することと、
前記被処理基板に形成された基板マークの位置を、請求項１９に記載の基板処理装置の前記パターン検出部と前記スケール計測部とにより検出することと、
前記基板マークの検出された位置に基づいて設定される前記被処理基板上の所定の領域に、請求項１９に記載の基板処理装置の前記処理部によって前記電子デバイス用のパターンを形成することと、
を含むデバイス製造方法。 A device manufacturing method for forming a pattern for an electronic device on a flexible substrate to be transported in a longitudinal direction,
The substrate to be processed is supported on the outer peripheral surface of the cylindrical member of the substrate processing apparatus according to claim 19 and conveyed in a longitudinal direction at a predetermined speed;
The position of the substrate mark formed on the substrate to be processed is detected by the pattern detection unit and the scale measurement unit of the substrate processing apparatus according to claim 19 ,
In a predetermined region on the target substrate is set based on the detected position of the substrate mark, and forming a pattern for the electronic device by the processing unit of a substrate processing apparatus according to claim 19 ,
A device manufacturing method including :
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| JP2015008107A JP6413784B2 (en) | 2015-01-19 | 2015-01-19 | Substrate processing apparatus and device manufacturing method |
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| JP2016133623A JP2016133623A (en) | 2016-07-25 |
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| TWI736621B (en) * | 2016-10-04 | 2021-08-21 | 日商尼康股份有限公司 | Pattern drawing device and pattern drawing method |
| KR102630749B1 (en) * | 2021-08-03 | 2024-01-30 | 주식회사 디에이테크놀로지 | System And Method for Calibration of Electrode During Manufacturing Secondary Battery Cell |
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| JP2005197483A (en) * | 2004-01-08 | 2005-07-21 | Nikon Corp | Rotational error measuring method of image pick-up means, adjustment method or measuring method using the same, position measuring apparatus which uses rotational error measured thereby, and exposure device equipped therewith |
| JP2006268032A (en) * | 2005-02-24 | 2006-10-05 | Fuji Photo Film Co Ltd | Drawing device and calibrating method for drawing device |
| JP5210199B2 (en) * | 2009-02-23 | 2013-06-12 | 大日本スクリーン製造株式会社 | Image recording method |
| JP6123252B2 (en) * | 2012-11-21 | 2017-05-10 | 株式会社ニコン | Processing apparatus and device manufacturing method |
| CN107656427B (en) * | 2012-08-28 | 2020-07-03 | 株式会社尼康 | Pattern forming apparatus |
| JP2014081452A (en) * | 2012-10-16 | 2014-05-08 | Nikon Corp | Exposure apparatus and device manufacturing method |
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