JP2016128156A - Treatment liquid filtration apparatus, chemical liquid supply device, treatment liquid filtration method, and storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten work time in filtering treatment liquid used for a chemical liquid supply device for supplying chemical liquid to an object to be treated from a chemical liquid supply source through a chemical liquid flow channel and a nozzle.SOLUTION: A chemical liquid supply device includes a first airtight vessel 31 and a second airtight vessel 32 in which treatment liquid is accumulated respectively, and a filter part 4 provided to a flow channel to send the treatment liquid from one of the first and second airtight vessels 31 and 32 to the other. When the treatment liquid is sent from one of the first and second airtight vessels 31 and 32 to the other, the treatment liquid passes through the filter part 4 so that foreign matter in the treatment liquid is removed. Sending of the treatment liquid between the first and second airtight vessels 31 and 32 is performed by depressurizing the destination airtight vessel so that a moving amount of the treatment liquid per unit time is larger than in a case where the treatment liquid is sent using a pump, thereby shortening work time required for treatment liquid filtration processing.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a technique for filtering a processing liquid used in a chemical liquid supply apparatus that supplies a chemical liquid to a target object from a chemical liquid supply source via a chemical liquid flow path and a nozzle.

  A single wafer type liquid processing apparatus used in a semiconductor manufacturing process is configured, for example, to discharge a chemical solution from a nozzle onto the surface of an object to be processed held by a spin chuck. Examples of the chemical solution include a resist solution for forming a resist pattern, a developer solution for developing a substrate after exposure, or a coating solution containing a silicon oxide film precursor. Such a chemical solution is supplied from the chemical solution supply source to the object to be processed through a nozzle through a chemical solution channel provided with devices such as a valve, a filter, and a pump.

  In recent years, with the miniaturization of circuits, further reduction in the number of defects has been demanded, and high cleanliness is required for chemical liquids such as resist liquids and chemical flow paths including piping and equipment. As a technique for improving the cleanliness by removing foreign substances such as particles and bubbles from the chemical liquid, for example, in Patent Document 1, a filter device and a pump are provided in a supply pipe line connecting a processing liquid storage container and a nozzle, A configuration is described in which a circulation line that connects the discharge side and the suction side of the filter device is provided. In this configuration, when the pump is driven, the processing liquid is circulated and supplied to the filter device via the circulation line to remove foreign substances from the processing liquid. However, the amount of movement of the liquid by the pump is about several ml / several tens of seconds. And it takes time.

Therefore, in order to increase the cleanliness of the chemical liquid, it is necessary to circulate the treatment liquid for a long time when the number of times of filtration by the filter device is increased, and there is a concern that the working time may be significantly increased. Although it is conceivable to increase the liquid feeding amount in order to shorten the working time, it is not preferable because the pump becomes larger. Further, since the circulation line is provided in the vicinity of the pump, the processing liquid discharge system becomes complicated, and the flow control of the processing liquid becomes complicated. For this reason, there is a need for a cleaning technique that consumes less processing liquid, can perform work in a short time, and can simplify the processing liquid discharge system.

JP 2013-211525 A

The present invention has been made in such circumstances, and an object of the present invention is to filter a treatment liquid used in a chemical liquid supply apparatus that supplies a chemical liquid to a target object from a chemical liquid supply source via a chemical liquid flow path and a nozzle. In providing the technology, it is possible to shorten the working time.

For this reason, the treatment liquid filtration device of the present invention is
In the apparatus for filtering the chemical liquid used for the chemical liquid supply apparatus for supplying the chemical liquid to the object to be processed through the chemical liquid flow source and the nozzle from the chemical liquid supply source or the treatment liquid that is a cleaning liquid for cleaning the chemical liquid flow path,
A first sealed container and a second sealed container in which the treatment liquid is stored,
A first decompression unit for decompressing a gas phase part of the first sealed container;
A second decompression unit for decompressing the gas phase part of the second sealed container;
A first treatment liquid channel for sending a treatment liquid from the first closed container to the second closed container;
A second processing liquid channel for sending a processing liquid from the second sealed container to the first sealed container;
And a filter unit that is provided in at least one of the first processing liquid flow path and the second processing liquid flow path and removes foreign matters in the processing liquid.

The chemical solution supply apparatus of the present invention is
In the chemical liquid supply apparatus for supplying the chemical liquid from the chemical liquid supply source to the object to be processed through the chemical liquid flow path and the nozzle by the liquid feeding mechanism,
And a treatment liquid supply path for supplying the treatment liquid filtered by the treatment liquid filtration apparatus to the chemical liquid flow path.

The process liquid filtration method of the present invention comprises:
In a method of filtering a treatment liquid that is a cleaning liquid for cleaning the chemical liquid or the chemical liquid flow path used in a chemical liquid supply apparatus that supplies a chemical liquid to a target object via a chemical liquid flow path and a nozzle from a chemical liquid supply source.
Using a first sealed container and a second sealed container,
A step of depressurizing the gas phase part of the second sealed container to send the processing liquid from the first sealed container to the second sealed container via the first processing liquid channel;
A step of depressurizing the gas phase part of the first sealed container to send the processing liquid from the second sealed container to the first sealed container via the second processing liquid channel;
And a step of removing foreign substances in the processing liquid by the filter unit when the processing liquid flows through at least one of the first processing liquid channel and the second processing liquid channel.

The storage medium of the present invention is
A computer program used in an apparatus for filtering a chemical liquid used in a chemical liquid supply apparatus for supplying a chemical liquid to a target object via a chemical liquid flow source and a nozzle from a chemical liquid supply source or a cleaning liquid for cleaning the chemical liquid flow path A storage medium for storing
The computer program includes a group of steps so as to execute the processing liquid filtering method.

  According to the present invention, when the processing liquid is sent from one of the first sealed container and the second sealed container in which the processing liquid is stored to the other, the processing liquid passes through the filter unit. Therefore, the foreign matter in the processing liquid is removed. Since the processing liquid is sent between the first sealed container and the second sealed container by depressurizing the destination sealed container, compared to the case where the processing liquid is sent using a pump. Therefore, the amount of movement of the treatment liquid per unit time is large, and the work time required for the filtration treatment of foreign matters in the treatment liquid is shortened.

1 is an overall configuration diagram showing a chemical liquid supply apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. 1 is a configuration diagram showing a processing liquid filtration apparatus according to a first embodiment of the present invention. It is a lineblock diagram showing the processing liquid filtration device concerning a 1st embodiment of the present invention. It is a lineblock diagram showing the processing liquid filtration device concerning a 1st embodiment of the present invention. It is a lineblock diagram showing the processing liquid filtration device concerning a 1st embodiment of the present invention. It is a lineblock diagram showing the processing liquid filtration device concerning a 1st embodiment of the present invention. It is a whole block diagram which shows the chemical | medical solution supply apparatus which concerns on the 2nd Embodiment of this invention. It is a whole block diagram which shows the chemical | medical solution supply apparatus which concerns on the 3rd Embodiment of this invention. It is a whole block diagram which shows the chemical | medical solution supply apparatus which concerns on the 4th Embodiment of this invention.

(First embodiment)
FIG. 1 shows a first embodiment of a chemical liquid supply apparatus provided with a processing liquid filtering apparatus according to the present invention, and FIG. 2 shows a detailed configuration of the processing liquid filtering apparatus. The processing liquid to be filtered by the processing liquid filtering apparatus is a chemical liquid or a cleaning liquid. In this example, the chemical liquid supplied to the object to be processed is a filtering target.
In FIG. 1 and FIG. 2, reference numeral 1 denotes a chemical liquid tank 1 that forms a processing liquid storage container that is a chemical liquid supply source. In the chemical liquid tank 1, a processing liquid that is a chemical liquid, for example, a resist liquid is stored. The chemical liquid tank 1 is provided with the upstream end of the chemical liquid flow path 2 (21 to 27) protruding therein, and the downstream end of the chemical liquid flow path 2 is provided with a nozzle 20 via a processing liquid filtering device 3 and the like which will be described later. It has been. In FIG. 1, a portion indicated by reference numeral 30 indicates a treatment liquid circulation unit that forms part of the treatment liquid filtration device 3.

The chemical liquid tank 1 is connected to a gas supply source 53 of a gas for pressurization via a gas supply path 51 forming a pressurizing pipe. The gas supply path 51 has a valve V5 and a pressure adjustment from the chemical liquid tank 1 toward the upstream side. A tank 52 and a valve V6 are provided. An inert gas such as nitrogen (N ₂ ) gas is used as the pressurizing gas. The pressure adjusting tank 52 is for adjusting the pressure of the gas for pressurization sent from the gas supply source 53 and sending it out, and is connected to an exhaust path 521 provided with a valve V7.

A treatment liquid filtration device 3 is provided on the downstream side of the chemical solution tank 1, and the treatment liquid filtration device 3 will be described with reference to FIG. In FIG. 2, reference numeral 31 denotes a first sealed container in which the processing liquid is stored. The liquid level sensor 311 that detects the upper limit level of the liquid level in the sealed container 31 and the lower limit level of the liquid level in the sealed container 31 are indicated. And a liquid level sensor 312 for detection. The liquid phase portion of the chemical liquid tank 1 and the first sealed container 31 are connected by a chemical liquid flow path 21 provided with a valve V1, and this chemical liquid flow path 21 corresponds to a third processing liquid flow path. .
The first hermetic container 31 is connected to a gas supply source 53 through a gas supply path 51, a pressure adjusting tank 52, and a valve V6 by a gas supply path 54 that forms a pressurizing pipe provided with a valve V8. In this example, the first pressurizing unit that pressurizes the gas phase part of the first sealed container 31 includes gas supply paths 54 and 51, a pressure adjusting tank 52, and a gas supply source 53. Part of 3

The first sealed container 31 is connected to a decompression mechanism 73 via an exhaust path 71 and an exhaust path 7 that form a decompression pipe provided with a valve V12. In this example, the first sealed container 31 has an air passage. The first decompression unit that decompresses the phase part includes exhaust passages 71 and 7 and a decompression mechanism 73. Further, the first sealed container 31 is connected to a gas supply source 63 for pressurization by gas supply paths 61 and 6 that form a pressurization pipe provided with a valve V10. An inert gas such as nitrogen gas is used as the pressurizing gas. The gas supply source 63 is provided to pressurize the gas phase part of the first sealed container 31 with a pressure larger than that of the first pressurizing part. For example, the chemical solution is discharged from the first sealed container 31. This is used when the chemical solution is pumped downstream in some cases.

A second sealed container 32 is provided on the downstream side of the first sealed container 31 via a first processing liquid flow path 22 including a valve V2 and a filter unit 4, for example, the first sealed container 31 31 and the 2nd airtight container 32 are arranged up and down. The first treatment liquid channel 22 is for sending a chemical solution from the liquid phase part of the first sealed container 31 to the gas phase part of the second sealed container 32, and constitutes a part of the chemical solution channel 2. doing.
The filter unit 4 includes a filtering material that removes foreign matters such as particles of 5 nm size or larger and bubbles contained in the processing liquid, and a drain pipe 41 for exhausting the atmosphere in the filter unit 4 connects the valve V4. Connected through.

The second sealed container 32 temporarily stores the chemical liquid from which foreign matters have been removed by the filter unit 4, and detects the upper limit level of the liquid level in the sealed container 32, as with the first sealed container 31. A liquid level sensor 321 that detects the lower limit level of the liquid level in the sealed container 32.
The ceiling portion of the first sealed container 31 and the bottom surface of the second sealed container 32 are connected by a second processing liquid channel 33 having a valve V3. The second processing liquid channel 33 is for sending the chemical solution from the liquid phase part of the second sealed container 32 to the gas phase part of the first sealed container 31.

The second hermetic container 32 is connected to a gas supply source 53 via gas supply paths 54 and 51, a pressure adjusting tank 52, and a valve V6 by a gas supply path 55 forming a pressurizing pipe provided with a valve V9. ing. In this example, the second pressurizing unit that pressurizes the gas phase part of the second sealed container 32 includes gas supply paths 55, 54, 51, a pressure adjusting tank 52 and a gas supply source 53, and the gas supply path The upstream side of 55 is shared with the first pressure unit.

The second hermetic container 32 is connected to a decompression mechanism 73 via exhaust passages 72 and 7 that form decompression pipes provided with a valve V13. In this example, the second decompression unit that decompresses the gas phase part of the second sealed container 32 includes the exhaust passages 72 and 7 and the decompression mechanism 73, and the first downstream side of the exhaust passage 72 is the first first decompression unit. And is common.
Further, the second sealed container 32 is connected to a gas supply source 63 by gas supply paths 62 and 6 having a valve V11. The gas supply source 63 is provided to pressurize the gas phase part of the second sealed container 32 with a pressure larger than that of the second pressurizing part. For example, in order to supply the chemical solution to the nozzle 20, This is used when the chemical solution is pumped downstream from the second sealed container 32.

Returning to FIG. 1, the description of the overall configuration of the chemical liquid supply apparatus will be continued. On the downstream side of the processing liquid filtration apparatus 3, an intermediate tank 10 in which processing liquid is stored via a chemical liquid flow path 23 having a valve V <b> 14. Is provided. In this example, the chemical liquid flow path 23 corresponds to a processing liquid supply path that supplies the processing liquid (resist liquid that is a chemical liquid) filtered by the processing liquid filtering device 3 to the chemical liquid flow path.
The intermediate tank 10 is connected to a discharge path 11 having a valve V10 and an exhaust path 60 having a valve V61 and connected to a factory exhaust system. Further, for example, a liquid level sensor (not shown) for detecting the upper limit level of the liquid level in the tank 10 and a liquid level sensor (not shown) for detecting the lower limit level of the liquid level in the tank 10 are provided. .

  The downstream side of the intermediate tank 10 is connected to the pump flow path system 12 via a chemical liquid flow path 24 having a valve V15. As shown in FIG. 1, the pump flow path system 12 includes, in order from the upstream side, a filter part 13, a chemical liquid flow path 25, a chemical liquid trap part 14, a chemical liquid flow path 26, and a pump part 15. ing. The pump unit 15 supplies a chemical solution (processing solution) to the nozzle 20 and discharges the chemical solution from the nozzle 20, and includes, for example, a diaphragm pump. The pump section 15 is provided with a liquid supply valve V16, a liquid discharge valve V17, and a vent valve V18. The vent valve V18 and the trap section 14 are connected by a flow path 16. Has been. Further, between the upstream side of the valve V15 and the trap part 14 in the chemical liquid flow path 25, a bypass path 17 having a valve V19 and bypassing the filter part 13 is provided.

  A nozzle 20 is provided on the downstream side of the pump flow path system 12 via, for example, a dispense valve V20. The nozzle 20 supplies a processing solution which is a chemical solution, for example, a resist solution, to a wafer which is transferred to a liquid processing module (not shown). The liquid processing module, for example, supplies a resist solution from the nozzle 20 to the wafer held rotatably around the vertical axis by the substrate holding unit, and advances the resist solution to the wafer surface by the rotational centrifugal force. It is comprised so that a coating film may be formed. In this example, the valves other than the dispense valve V20 are constituted by, for example, an air operated valve.

  A liquid processing apparatus including a chemical liquid supply device and a liquid processing module is provided with a control unit 100 including a computer, and the control unit 100 includes a program storage unit 110. The program storage unit 110 stores a program made of software, for example, in which instructions are set to perform processing liquid filtration processing, chemical flow path cleaning processing, and liquid processing in the liquid processing module, which will be described later. Is done. By reading this program to the control unit 100, the control unit 100 outputs a control signal to each unit of the chemical solution supply apparatus and the liquid processing module. As a result, operations such as opening / closing of the valve, driving of the pump, movement of the nozzle, driving of the substrate holding unit, and the like are controlled, and processing liquid filtration processing, cleaning processing, and liquid processing described later are performed. This program is stored in the program storage unit 110 while being stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card.

Next, the operation of this embodiment will be described with reference to FIGS. 3 to 11 by taking as an example the case of removing foreign substances from a resist solution that is a chemical solution. The removal of foreign matters in the resist solution is performed, for example, at a timing immediately before the liquid processing is started in the liquid processing module.
First, as shown in FIG. 3, the valve V6 and the valve V7 are opened, the other valves are closed, nitrogen gas is supplied from the gas supply source 53 to the pressure adjustment tank 52, and the pressure adjustment tank 52 has a set pressure, for example, standard atmospheric pressure. Supply until pressure reaches +5 kPa. In this example, when the valves V6 and V7 are opened to supply nitrogen gas, the valve V7 is closed at a pressure lower than the set pressure, and the supply of nitrogen gas is continued, so that the pressure adjustment tank 52 becomes the set pressure. The opening and closing of the valves V6 and V7 is controlled so as to close the valve V6. The valves V6 and V7 are controlled to open and close while detecting the pressure in the pressure adjusting tank 52, for example. Further, when the nitrogen gas is supplied from the gas supply source 53 at a predetermined flow rate in advance, the opening / closing timings of the valves V6 and V7 are acquired so that the pressure in the pressure adjusting tank 52 becomes the set pressure. The opening / closing control of the valves V6 and V7 may be performed at the same timing. 3 to 11, “C” is attached to a closed valve, and a flow path through which a gas or liquid flows is indicated by a thick line.

Next, as shown in FIG. 4, a resist solution is supplied to the first sealed container 31. This step is performed by opening the valves V1, V5, V8, V12 and closing the other valves. Thereby, the nitrogen gas in the pressure adjusting tank 52 is supplied all at once into the chemical liquid tank 1 to pressurize the liquid level of the resist solution, and the gas phase portion in the first sealed container 31 is For example, it is evacuated (reduced pressure) until a pressure of standard pressure −20 kPa is reached. Thus, the resist solution in the chemical solution tank 1 is sucked and fed to the first sealed container 31 side via the chemical solution channel 21 (third processing solution channel). By supplying nitrogen gas in the pressure adjusting tank 52 to the chemical tank 1, the inside of the chemical tank 1 is pressurized at a pressure of, for example, standard pressure +5 kPa. Call it. The liquid level of the resist solution in the first sealed container 31 is monitored by the liquid level sensor 311. When the liquid level of the resist solution reaches the upper limit level, the valves V1 and V5 are closed as shown in FIG. The supply of the resist solution to the closed container 31 is stopped, the valves V8 and V12 are opened, and the inside of the first closed container 31 is maintained at a reduced pressure, for example, at a standard pressure of about −50 kPa. The resist solution inside is degassed. Further, the valves V6 and V7 are opened, and nitrogen gas is supplied so that the inside of the pressure adjusting tank 52 becomes a set pressure as in the process shown in FIG.

Next, as shown in FIG. 6, the resist solution is sent to the filter unit 4 to remove foreign matters in the resist solution by filtration. This step is performed by opening the valves V2, V8, V13 and closing the other valves. As a result, the nitrogen gas in the pressure adjusting tank 52 is supplied to the first sealed container 31 at a stretch to slightly pressurize the gas phase part, and the gas phase part in the second sealed container 32 is reduced by the decompression mechanism 73. Depressurized. In this way, the resist solution in the first sealed container 31 is sent out to the second sealed container 32 side via the first processing liquid channel 22.

Since the filter unit 4 is interposed between the first sealed container 31 and the second sealed container 32, the resist solution passes through the filter unit 4 when moving to the second sealed container 32 side. . Thereby, the foreign material in the resist solution is captured and removed by the filtering material of the filter unit 4, and the resist solution from which the foreign material has been removed is stored in the second sealed container 32.
The liquid level of the resist liquid in the second sealed container 32 is monitored by the liquid level sensor 321. When the liquid level of the resist liquid reaches the upper limit level, the valves V2 and V8 are closed as shown in FIG. And the valves V6 and V7 are opened, and nitrogen gas is supplied so that the pressure adjusting tank 52 becomes the set pressure as in the step shown in FIG.

Next, as shown in FIG. 8, the resist solution in the second sealed container 32 is sent to the first sealed container 31 via the second processing liquid channel 33. This step is performed by opening the valves V3, V8, V9, V12 and closing the other valves. As a result, the nitrogen gas in the pressure adjusting tank 52 is supplied to the second sealed container 32 to slightly pressurize the gas phase part, and the gas phase part in the first sealed container 31 is decompressed by the decompression mechanism 73. Then, the resist solution in the second sealed container 32 is sent out to the first sealed container 31 side via the second processing liquid channel 33. When the level of the resist solution in the first sealed container 31 reaches the upper limit level, the supply of the resist solution to the first sealed container 31 is stopped by closing the valves V3 and V9 as shown in FIG. At the same time, the valves V8 and V12 are opened to hold the inside of the first sealed container 31 under reduced pressure, and the resist solution in the first sealed container 31 is degassed. Further, the valves V6 and V7 are opened, and nitrogen gas is supplied so that the inside of the pressure adjusting tank 52 becomes a set pressure as in the process shown in FIG.

Next, the processing liquid is again sent to the filter unit 4. This step is performed by opening the valves V2, V8, V13 and closing the other valves (see FIG. 6). As a result, the nitrogen gas in the pressure adjusting tank 52 is supplied to the first sealed container 31 to slightly pressurize the gas phase part, and the gas phase part in the second sealed container 32 is decompressed by the decompression mechanism 73. Then, the resist solution in the first sealed container 31 is sent out to the second sealed container 32 side via the first processing liquid channel 22. Then, when the resist solution passes through the filter unit 4, foreign matters in the resist solution are removed. Thus, when the liquid level of the resist solution in the second sealed container 32 reaches the upper limit level, the valve V2 is closed to stop supplying the resist solution to the second sealed container 32, and the valves V6 and V7 are opened. Similarly to the process shown in FIG. 3, nitrogen gas is supplied so that the pressure adjusting tank 52 becomes a set pressure (see FIG. 10).

Further, as shown in FIG. 10, a step of feeding the resist solution to the downstream side of the processing solution circulation unit 30 is performed. This step is performed by opening the valves V8, V11, V14, V61 and closing the other valves. In FIG. 10, the steps of supplying the nitrogen gas to the pressure adjustment tank 52 and the step of sending the resist solution to the downstream side of the processing solution circulation unit 30 are shown, so that the valves V6 and V7 are open.
By supplying nitrogen gas from the gas supply source 63 to the second sealed container 32 in this way, the gas phase portion is pressurized, and the resist solution in the second sealed container 32 passes through the chemical solution flow path 23. To the intermediate tank 10. When the liquid level of the processing liquid in the intermediate tank 10 reaches the upper limit level, the valves V14, V11, V61 are closed to stop the supply of the resist liquid to the intermediate tank 10.

When liquid processing is performed in the liquid processing module, for example, as shown in FIG. 11, the valves V15, V16, V17, and V20 are opened and the other valves are closed to drive the pump unit 15. By the suction operation of the pump unit 15, the resist solution in the intermediate tank 10 is sucked into the pump unit 15 through the chemical liquid channel 24 → the filter unit 13 → the chemical channel 25 → the trap unit 14 → the chemical channel 26. Next, by the discharge operation of the pump unit 15, the resist solution in the pump unit 15 is sent to the downstream side via the chemical liquid flow path 27, discharged from the nozzle 20, and is discharged to the wafer by a liquid processing module (not shown) with a predetermined amount Liquid treatment is performed.
As described above, in this embodiment, the chemical solution feeding mechanism for supplying the chemical solution (resist solution) from the chemical solution tank 1 as the chemical solution supply source to the wafer via the chemical solution flow path 2 and the nozzle 20 is the first solution. A decompression unit, a second decompression unit, a first pressurization unit, a second pressurization unit, a nitrogen gas supply source 63, a gas supply path 62, and a pump unit 15 are provided.

According to this embodiment, when removing the foreign substances in the resist solution by the processing liquid filtering device 3, the resist solution in the first sealed container 31 is decompressed by depressurizing the gas phase portion of the second sealed container 32. Is fed to the second sealed container 32 via the filter unit 4 by the first treatment liquid flow path 22. Further, by depressurizing the gas phase portion of the first sealed container 31, the resist solution in the second sealed container 32 is sent to the first sealed container 31 via the second processing liquid channel 33. Yes. Since the resist solution is fed by sucking the gas phase portion of the closed container to which the solution is moved, the resist solution per unit time is compared with the solution fed by repeating the suction and discharge of the pump. As a result, the working time required for filtering the resist solution, which is a step of removing foreign matter, can be shortened. In addition, when pumping the liquid, suction and discharge are repeated, so the resist liquid cannot be fed at a constant speed. However, as in this embodiment, the resist liquid is moved at a constant speed when the liquid is fed under reduced pressure. Therefore, the liquid can be fed efficiently.

Further, in order to move the resist solution by reducing the pressure, the resist solution may be circulated between the first sealed container 31 and the second sealed container 32, and there is no need to provide a circulation path in the vicinity of the pump. The complexity of the configuration of the discharge system can be suppressed.
Furthermore, since the inside of the flow path of the chemical solution is degassed by liquid supply by decompression, the dissolved gas in the resist solution is reduced. Further, after the resist solution is stored in the first and second sealed containers 31 and 32, as shown in FIGS. 5 and 9, the first and second sealed containers 31 and 32 are maintained under reduced pressure so as to be deaerated. If so, the dissolved gas in the resist solution is reduced, and the number of defects caused by this dissolved gas can be reduced.

  Furthermore, when the resist solution is moved between the first sealed container 31 and the second sealed container 32, in addition to depressurizing the gas phase part of the sealed container to which the liquid is moved, the liquid transfer source If the gas phase part of the hermetic container is pressurized, the movement time of the resist solution is further shortened, which can contribute to the reduction of the work time required for the filtration process of the resist solution.

Furthermore, since the gas phase portion of the chemical liquid tank 1 and the hermetic container is pressurized using nitrogen gas whose pressure has been increased in the pressure adjusting tank 52, the pressure adjustment of the nitrogen gas for pressurization becomes easy. In addition, when reducing the pressure of the closed container to which the liquid is moved, the pressurized inert gas is supplied from the pressure adjustment tank 52 to the closed container from which the liquid is moved, so that the pressure is reduced. Even in this case, mixing of air into the sealed container is prevented. For this reason, drying of the resist solution and the like due to air mixture are suppressed, and deterioration of the resist solution (chemical solution) can be suppressed.

In the above-described chemical liquid supply apparatus, for example, when the liquid processing apparatus stops for some reason, the chemical liquid supplied to the nozzle 20 is returned to the processing liquid circulation unit 30 through, for example, the intermediate tank 10, and the resist liquid is filtered again. You may make it do. In this case, as shown in FIG. 12, for example, the processing liquid on the downstream side of the intermediate tank 10 opens the valves V13, V14, V17, V18, V19, and V20 and closes the other valves to form the second sealed container. By reducing the pressure inside 32, the pressure is returned to the intermediate tank 10 via the flow path 16 and the bypass path 17. Alternatively, the valves V17, V18, V19, V20, and V61 may be opened, and the other valves may be closed and the pump unit 15 may be driven to return to the intermediate tank 10. In this way, when the resist solution is moved from the nozzle 20 side toward the intermediate tank 10 via the bypass passage 17 that bypasses the filter unit 13, even if foreign matter exists in the resist solution, the filter unit 13. Contamination is prevented.

And the process which returns the process liquid in the intermediate | middle tank 10 to the 2nd airtight container 32 opens the valve | bulb V13, V14, V8, closes other valves, for example, as shown in FIG. This is performed by reducing the pressure of the gas phase and sucking the resist solution in the intermediate tank 10 through the chemical solution flow path 23. The chemical liquid channel 23 in this example corresponds to a processing liquid supply path for supplying the resist liquid filtered by the processing liquid filtering device 3 to the chemical liquid channel 2 as described above. The path also serves as a flow path for returning the resist solution sent to the chemical flow path 2 to the processing liquid filtering device 3. Further, the valves V6 and V7 are opened, and nitrogen gas is supplied so that the inside of the pressure adjusting tank 52 becomes a set pressure as in the process shown in FIG.

Next, as shown in FIG. 14, the valves V3, V8, V9, V12 are opened, the other valves are closed, and the gas phase portion of the second sealed container 32 is slightly pressurized with nitrogen gas in the pressure adjusting tank 52. At the same time, the gas phase portion in the first sealed container 31 is decompressed by the decompression mechanism 73. In this way, the processing liquid in the second sealed container 32 is supplied to the first sealed container 31 via the second processing liquid channel 33. When the level of the resist solution in the first sealed container 31 reaches the upper limit level, the valves V3 and V9 are closed to stop the supply of the processing liquid, and the valves V8 and V12 are opened to open the first sealed container. The inside of 31 is kept under reduced pressure, and the resist solution in the first sealed container 31 is degassed. Further, the valves V6 and V7 are opened, and nitrogen gas is supplied until the pressure adjusting tank 52 reaches the set pressure, as in the process shown in FIG. Thereafter, as described above, the steps shown in FIGS. 5 to 10 are performed to remove foreign substances in the resist solution, and the resist solution from which the foreign matters have been removed is fed to the intermediate tank 10.

Conventionally, when the liquid processing apparatus is stopped, the processing liquid reaching the tip of the nozzle 20 has been subjected to dummy dispensing because foreign matter increases with the passage of time, but in this example, the resist liquid inside the nozzle 20 is It is returned to the processing liquid circulation unit 30 again through the path of the intermediate tank 10 → the second sealed container 32 → the second processing liquid channel 33 → the first sealed container 31. For this reason, since the foreign substance is removed from the resist solution by performing the filtration process again in the processing solution circulation unit 30, the resist solution can be used without being wasted, and the consumption of the chemical solution can be reduced.

In the first embodiment, when removing foreign substances in the resist solution in the processing liquid circulation unit 30, the first sealed container 31 → the filter unit 4 → the second sealed container 32 → the second processing liquid channel. The cycle of 33 → first sealed container 31 may be repeated a plurality of times. Further, the above-described method for filtering the resist solution, which is a chemical solution, is an example, and is not necessarily limited to the above-described method. For example, the resist solution is once sent from the chemical solution tank 1 to the nozzle 20 via the chemical solution flow path 2 (21 to 27) to perform the liquid treatment in the liquid treatment module, and then the resist solution in the nozzle 20 is passed through the intermediate tank 10. Then, the process liquid may be returned to the treatment liquid circulation unit 30 and the treatment liquid may be filtered.

Further, the step of feeding the resist solution from which foreign substances have been removed by the treatment liquid filtering device 3 to the downstream side may be performed by driving the pump unit 15. Furthermore, after the resist solution from which foreign substances have been removed by the processing solution filtering device 3 is sent to the intermediate tank 10, the resist solution is newly supplied from the chemical solution tank 1 to the first sealed container 31, and is supplied to the processing solution circulation unit 30. Then, foreign matter in the resist solution may be removed. In this case, the step of supplying the resist solution from the intermediate tank 10 to the nozzle 20 and performing the liquid treatment and the step of removing the foreign matter from the resist solution in the treatment liquid filtering device 3 may be performed in parallel. Good.

(Second Embodiment)
Next, a second embodiment of the chemical solution supply apparatus of the present invention will be described. This embodiment is an example in which the chemical liquid flow path 2 is cleaned using a cleaning liquid for cleaning the chemical liquid flow path 2 as a processing liquid, and the chemical liquid flow path 2 is cleaned when the liquid processing apparatus is started up, for example. It is carried out after assembling the pipes constituting the.
This embodiment is different from the first embodiment in that a cleaning liquid tank 71 is connected to the upstream end of the chemical liquid flow path 2 as a processing liquid storage container instead of the chemical liquid tank 1. In this example, as shown in FIG. 15, a gas supply source 63 is connected to the intermediate tank 10 via a gas supply path 64 that forms a pressurizing pipe having a valve V62 interposed therebetween. By supplying and pressurizing the cleaning liquid, the cleaning liquid is sent downstream. Further, for example, the filter unit 13 is in a state in which a filter medium for removing foreign substances in the chemical solution (resist solution) is not attached. About another structure, it comprises similarly to 1st Embodiment, the same code | symbol is attached | subjected about the same structural member, and description is abbreviate | omitted.

When cleaning is performed by flowing the cleaning liquid through the chemical liquid flow path 2, first, for example, the cleaning liquid in the cleaning liquid tank 71 is first transferred from the cleaning liquid tank 71 to the first sealed container 31 → second sealed container 32 → intermediate tank 10 → filter. Liquid is fed to the inside of the nozzle 20 through the chemical liquid flow path 2 (21 to 27) through the path of the section 13 → the trap section 14 → the pump section 15. For example, the cleaning liquid is fed from the cleaning liquid tank 71 to the intermediate tank 10 in the same manner as in the first embodiment.
For example, as shown in FIG. 15, the supply of the cleaning liquid from the intermediate tank 10 to the nozzle 20 is performed by opening the valves V62, V15, V16, V17, and the valve V20 and closing the other valves. 10 is performed by supplying nitrogen gas into the inside. As a result, the inside of the intermediate tank 10 is pressurized by nitrogen gas, and the cleaning liquid is supplied to the nozzle 20 through the filter section 13, the trap section 14, and the pump section 15 through the chemical liquid flow paths 24 to 27. However, the valves V15, V16, V17, and V20 may be opened and the pump unit 15 may be driven to supply the cleaning liquid in the intermediate tank 10 to the nozzle 20.

In this way, the cleaning liquid is caused to flow through the chemical liquid flow path 2 extending from the cleaning liquid tank 71 to the inside of the nozzle 20 to peel off and remove the foreign matter adhering to the chemical liquid flow path 2. As a result, foreign matter is mixed in the cleaning liquid, but this foreign matter is removed when passing through the filter unit 4 of the treatment liquid filtering device 3.
Next, for example, the valves V17, V18, V19, V20, and V61 are opened, the other valves are closed, and the pump unit 15 is driven or the gas phase part of the second hermetic container 32 is decompressed to reach the inside of the nozzle 20. The filled cleaning liquid is returned to the intermediate tank 10 through the flow path 16 and the bypass path 17. When the gas phase portion of the second sealed container 32 is depressurized and sent, the valves V14 and V13 are opened.

Subsequently, the pressure of the gas phase portion of the second sealed container 32 is reduced, and the cleaning liquid is sent from the intermediate tank 10 to the second sealed container 32. Further, by depressurizing the gas phase part of the first sealed container 31 and slightly pressurizing the gas phase part of the second sealed container 32, the second sealed container 32 passes through the second processing liquid channel 33. The cleaning liquid is sent to the first sealed container 31.
Thereafter, the gas phase part of the second sealed container 32 is depressurized and the gas phase part of the first sealed container 31 is slightly pressurized, so that the cleaning liquid in the first sealed container 31 flows into the first treatment liquid flow. The liquid is fed to the second hermetic container 32 through the filter unit 4 through the path 22. At this time, foreign matters in the cleaning liquid are removed by the filter unit 4.

Then, for example, the cleaning liquid in the second sealed container 32 is again fed into the nozzle 20. In this way, for example, the cleaning liquid is supplied to the inside of the nozzle 20 and the cleaning liquid in the nozzle 20 is returned to the processing liquid filtering device 3 through the intermediate tank 10 to remove the foreign substances of the cleaning liquid by the filter 4 a plurality of times. Then, the chemical liquid flow path 2 is cleaned and the foreign matters in the cleaning liquid are removed.
After that, the cleaning liquid is discharged from the nozzle 20 to detect foreign matter in the cleaning liquid. If the foreign matter is less than the set value, the cleaning process is terminated, and if it exceeds the set value, the nozzle 20 returns to the processing liquid filtering device 3 again. Return the cleaning solution to remove foreign matter.

When the cleaning process is completed, for example, the cleaning liquid tank 71 is removed, the first sealed container 31 is decompressed, and the cleaning liquid in the chemical liquid channel 21 is sucked and removed to the first sealed container 31 and then the chemical liquid channel 2 is removed. A chemical tank 1 is attached to the upstream end. Further, for example, the cleaning liquid in the first sealed container 31 and the second sealed container 32 is sent to the nozzle 20, and is discharged from the nozzle 20 and collected. The cleaning liquid may be supplied by supplying nitrogen gas from the gas supply source 63 to the first and second sealed containers 31 and 32 and pressurizing them, or by driving the pump unit 15. Good.
After removing the cleaning liquid in the first and second sealed containers 31 and 32 and the chemical liquid flow path 2 in this way, a filter medium 13 is attached with a filter medium for removing a foreign substance from the resist liquid, and the resist liquid is supplied to the chemical liquid flow path 2. To supply. Then, for example, as in the first embodiment, after removing foreign substances in the resist solution by the processing liquid filtering device 3, the chemical liquid is supplied from the nozzle 20 to the object to be processed, and a predetermined liquid processing is performed.

According to this embodiment, when removing foreign substances in the cleaning liquid by the processing liquid filtering device 3, the cleaning liquid feeding between the first sealed container 31 and the second sealed container 32 is sealed at the destination. Since the operation is performed by depressurizing the container, the moving amount of the cleaning liquid per unit time is increased as compared with the liquid feeding by the pump, and the filtering time of the cleaning liquid can be shortened. For this reason, the work time required for starting up the apparatus can be shortened. Further, when the cleaning liquid is moved between the first sealed container 31 and the second sealed container 32, in addition to depressurizing the gas phase portion of the sealed container to which the liquid is moved, the liquid source is sealed. If the gas phase portion of the container is slightly pressurized, the time required for the filtration treatment of the cleaning liquid can be further reduced. In addition, the cleaning liquid reaching the tip of the nozzle 20 is returned to the processing liquid filtering device 3 without being discarded, and the filtering process is performed again, whereby the cleaning liquid can be reused and the consumption of the cleaning liquid can be reduced.

In the second embodiment, when removing foreign substances in the cleaning liquid by the processing liquid filtering device 3, the first sealed container 31 → the filter unit 4 → the second sealed container 32 → the second processing liquid channel 33. → You may make it implement the cycle of the 1st airtight container 31 by repeating several times.
Further, the cleaning method of the chemical liquid flow path 2 is not necessarily limited to the above-described method, and the first sealed container 31 → the filter unit 4 → the second sealed container 32 → the second process is performed in the one-side treatment liquid filtering device 3. The cleaning liquid may be supplied up to the tip of the nozzle 20 after the cycle of the liquid flow path 33 → the first sealed container 31 and returned to the processing liquid filtering device 3 again.

(Third embodiment)
Next, a third embodiment of the chemical solution supply apparatus of the present invention will be described with reference to FIG. This embodiment is different from the first embodiment in that the processing liquid storage container 8 and the intermediate tank 10 are connected by a chemical flow path 81 provided with a valve V81, and the chemical flow path 81 is upstream of the valve V81. That is, the processing liquid circulation unit 30 is connected to the side through a chemical liquid channel 23 having one end connected to the liquid phase of the second sealed container 32. Except for the fact that the processing liquid is not directly supplied from the processing liquid storage container 8 to the first storage container 31, the other components such as the processing liquid filtration device 300 are the same as those of the first embodiment, and the same constituent members are the same. Reference numerals are assigned and description is omitted.

  An example of the chemical liquid supply performed by the chemical liquid supply apparatus of this embodiment will be described. For example, when the chemical liquid (resist liquid) is stored in the processing liquid storage container 8, for example, the gas phase in the processing liquid storage container 8 is stored. The chemical solution is sent to the intermediate tank 10 by pressurizing the unit by supplying nitrogen gas from the gas supply source 53. Next, as in the first embodiment, a chemical solution is sent from the intermediate tank 10 to the nozzle 20 via the pump unit 12 to perform liquid processing on the wafer.

  Next, as in the first embodiment, the chemical liquid inside the nozzle 20 is returned to the first sealed container 31 through the path of the intermediate tank 10 → the second sealed container 32 → the second processing liquid channel 33, and the processing liquid The circulation part 30 performs a process of removing foreign substances in the chemical solution. The chemical liquid from which the foreign matter has been removed in this way is supplied again to the nozzle 20 and liquid processing is performed. Further, while the processing liquid circulation unit 30 performs the foreign substance removal processing in the chemical liquid, the valve V14 is closed and the chemical liquid is supplied from the processing liquid storage container 8 to the nozzle 20 via the intermediate tank 10 to perform the liquid processing. You may go.

When storing the cleaning liquid in the processing liquid storage container 8, for example, the cleaning liquid is sent to the inside of the nozzle 20 through the intermediate tank 10 to clean the chemical liquid flow path 2. Next, as in the second embodiment, the cleaning liquid inside the nozzle 20 is returned to the first sealed container 31 via the intermediate tank 10, the second sealed container 32, and the second processing liquid channel 33, and the processing liquid is circulated. In the unit 30, the foreign matter in the cleaning liquid is removed. In this way, the cleaning liquid from which the foreign matter has been removed may be supplied again to the inside of the nozzle 20 to clean the chemical flow path 2, or while the foreign matter in the cleaning liquid is being removed by the processing liquid circulating unit 30, The cleaning process of the chemical liquid flow path 2 may be performed by closing the valve V14 and sending the cleaning liquid from the processing liquid storage container 8 to the nozzle 20 via the intermediate tank 10.

  After the cleaning of the chemical liquid flow path 2 is completed in this way, for example, the cleaning liquid in the nozzle 20 is collected in at least one of the first and second sealed containers 31 and 32 of the processing liquid circulation unit 30 as described above. Then, for example, the processing liquid storage container 8 in which the resist liquid as the processing liquid is stored is attached to the upstream end of the chemical liquid flow path 81, and the chemical liquid as the processing liquid is supplied from the processing liquid storage container 8 to the nozzle 20. Liquid treatment is performed. Further, after the cleaning of the chemical liquid flow path 2 is completed, for example, the cleaning liquid is discharged and collected through the nozzle 20, and the processing liquid storage container 8 in which the processing liquid is stored is attached to the upstream end of the chemical liquid flow path 81. A resist solution, which is a processing liquid, may be supplied from the liquid storage container 8 to the nozzle 20 to perform liquid processing on the wafer.

  According to this embodiment, when the foreign substance in the processing liquid is removed by the processing liquid filtering device 300, the cleaning liquid supplied between the first sealed container 31 and the second sealed container 32 is transferred to the destination. Since the operation is performed by depressurizing the sealed container, the same effects as those of the first and second embodiments can be obtained.

(Fourth embodiment)
Next, a fourth embodiment will be described with reference to FIG. In this embodiment, the processing liquid storage container 82 for storing the chemical liquid is connected to the first sealed container 31 of the processing liquid circulation section 30 via the processing liquid flow path 84 provided with the valve V84 and the cleaning liquid is stored. The processing liquid storage container 83 is connected to the chemical liquid flow path 23 on the downstream side of the processing liquid circulation section 30 via a processing liquid flow path 85 having a valve V85. Further, the treatment liquid storage containers 82 and 83 are connected to a nitrogen gas supply source 53 via a pressure adjusting tank 52 by gas supply paths 86 and 87 forming pressure tubes provided with valves V86 and V87, respectively. Other configurations are the same as those of the first embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted.

  An example of the chemical liquid supply performed by the chemical liquid supply apparatus of this embodiment will be described. For example, the cleaning liquid in the processing liquid storage container 83 is supplied downstream through the chemical liquid flow path 23 and supplied to the inside of the nozzle 20. Then, the cleaning liquid in the nozzle 20 is returned to the processing liquid circulation unit 30 and the above-described processing is performed to clean the flow path and remove foreign substances in the cleaning liquid. Then, for example, the cleaning liquid is discharged from the nozzle 20 to be collected, or after being collected in the processing liquid storage container 83, the chemical liquid (resist liquid) is sent from the processing liquid storage container 82 to the processing liquid filtration device 3 and the chemical liquid is filtered. Then, the chemical solution from which the foreign matter has been removed is supplied to the nozzle 20 to perform the liquid treatment. Alternatively, the chemical liquid in the nozzle 20 may be returned to the processing liquid filtering device 3 to perform a foreign substance removal process in the chemical liquid. The feeding of the chemical liquid and the cleaning liquid is performed in the same manner as in the first embodiment.

  According to this embodiment, when the foreign substance in the processing liquid is removed by the processing liquid filtering device 3, the liquid supply of the cleaning liquid between the first sealed container 31 and the second sealed container 32 is transferred to the destination. Since the operation is performed by depressurizing the sealed container, the same effects as those of the first and second embodiments can be obtained.

  In the above, the 1st pressurization part which pressurizes the gas phase part of the 1st airtight container, and the 2nd pressurization part which pressurizes the gas phase part of the 2nd airtight container are not necessarily required, and filtration of processing liquid is carried out The processing is not necessarily limited to the method described above. Further, it is only necessary that a filter unit is provided in at least one of the first processing liquid channel and the second processing liquid channel, and the filter unit is interposed in both the first and second processing liquid channels. It may be. Further, the pressure adjusting tank and the intermediate tank for adjusting the pressure of the pressurizing gas sent from the pressurizing gas supply source are not always necessary. Furthermore, in an apparatus dedicated to the filtration of the cleaning liquid, when one of the sealed containers is decompressed, the other sealed container may communicate with the air atmosphere and be pressurized with air. Furthermore, when the treatment liquid is filtered, the process of holding the inside of the sealed container under reduced pressure and degassing the treatment liquid is not always necessary.

W Wafer 1 Chemical liquid tank 2 Chemical liquid flow path 21 Third processing liquid flow path 22 First processing liquid flow path 3 Processing liquid filtration device 30 Processing liquid circulation section 31 First sealed container 32 Second sealed container 33 Second Treatment liquid flow path 4 Filter section

Claims (9)

In the apparatus for filtering the chemical liquid used for the chemical liquid supply apparatus for supplying the chemical liquid to the object to be processed through the chemical liquid flow source and the nozzle from the chemical liquid supply source or the treatment liquid that is a cleaning liquid for cleaning the chemical liquid flow path,
A first sealed container and a second sealed container in which the treatment liquid is stored,
A first decompression unit for decompressing a gas phase part of the first sealed container;
A second decompression unit for decompressing the gas phase part of the second sealed container;
A first treatment liquid channel for sending a treatment liquid from the first closed container to the second closed container;
A second processing liquid channel for sending a processing liquid from the second sealed container to the first sealed container;
A processing liquid filtration apparatus, comprising: a filter unit provided in at least one of the first processing liquid flow path and the second processing liquid flow path for removing foreign substances in the processing liquid.   A first pressurizing unit that pressurizes the gas phase part of the first sealed container when the gas phase part of the second sealed container is depressurized; and the gas phase part of the first sealed container is depressurized. The processing liquid filtering device according to claim 1, further comprising a second pressurizing unit that pressurizes the gas phase part of the second sealed container.   The first pressurizing unit and the second pressurizing unit each include a pressure adjusting tank for adjusting the pressure of the pressurizing gas sent from the pressurizing gas supply source. The processing liquid filtration apparatus according to claim 2.   A processing liquid storage container for storing the processing liquid, and a third processing liquid channel for supplying the processing liquid from the liquid phase portion in the processing liquid storage container to the first sealed container. The processing liquid filtration device according to any one of claims 1 to 3, wherein In the chemical liquid supply apparatus for supplying the chemical liquid from the chemical liquid supply source to the object to be processed through the chemical liquid flow path and the nozzle by the liquid feeding mechanism,
Claims 1 comprises a treatment liquid filtration apparatus according to any one of 4, and a processing liquid supply passage for supplying the filtered process liquid to the chemical liquid flow path by the treatment liquid filtering device A chemical solution supply apparatus characterized by the above.   6. The chemical liquid supply apparatus according to claim 5, wherein the treatment liquid supply path also serves as a flow path for returning the treatment liquid sent to the chemical liquid flow path to the treatment liquid filtration device. In a method of filtering a treatment liquid that is a cleaning liquid for cleaning the chemical liquid or the chemical liquid flow path used in a chemical liquid supply apparatus that supplies a chemical liquid to a target object via a chemical liquid flow path and a nozzle from a chemical liquid supply source.
Using a first sealed container and a second sealed container,
A step of depressurizing the gas phase part of the second sealed container to send the processing liquid from the first sealed container to the second sealed container via the first processing liquid channel;
A step of depressurizing the gas phase part of the first sealed container to send the processing liquid from the second sealed container to the first sealed container via the second processing liquid channel ;
And a step of removing foreign substances in the processing liquid by the filter unit when the processing liquid flows through at least one of the first processing liquid channel and the second processing liquid channel. Liquid filtration method.   Pressurizing the gas phase part of the first sealed container when the gas phase part of the second sealed container is depressurized; and when the gas phase part of the first sealed container is depressurized, The process liquid filtration method of Claim 7 including the process of pressurizing the gaseous-phase part of 2 airtight containers. A computer program used in an apparatus for filtering a chemical liquid used in a chemical liquid supply apparatus for supplying a chemical liquid to a target object via a chemical liquid flow source and a nozzle from a chemical liquid supply source or a cleaning liquid for cleaning the chemical liquid flow path A storage medium for storing
The computer program, storage medium, wherein the step group is organized to execute the treating solution filtration method according to claim 7 or 8.

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