JP2016120616A - Manufacturing apparatus of liquid jet head, manufacturing method of liquid jet head, and liquid jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a liquid jet head which achieves an improvement of the yield and reduces the cost of failure (F cost), and to provide a manufacturing method of the liquid jet head and the liquid jet head.SOLUTION: An ink jet head manufacturing apparatus connects head chips 31A, 31B, each of which has an actuator plate 41, with driving substrates 23a, 23b, which respectively drive the head chips 31A, 31B and includes: a holder part 101 in which the head chips 31A, 31B are set; a crimp mechanism which crimps the driving substrates 23a, 23b to the head chips 31A, 31B; and a ground part 102 which is connected to the driving substrates 23a, 23b and discharges electrical charges built up in the driving substrates 23a, 23b.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a liquid ejecting head manufacturing apparatus, a liquid ejecting head manufacturing method, and a liquid ejecting head.

  2. Description of the Related Art Conventionally, there is an ink jet printer provided with an ink jet head as an apparatus for ejecting droplet-form ink onto a recording medium such as paper and recording images and characters on the recording medium.

The ink jet head described above includes a nozzle plate having a plurality of nozzle holes and an actuator plate made of a piezoelectric material and having a plurality of channels communicating with the nozzle holes. A drive electrode is formed on the inner surface of the channel. The drive electrode is pulled out to the outer surface of the actuator plate (hereinafter referred to as a mounting surface), and is electrically connected to the drive substrate by crimping the drive substrate on the mounting surface (see, for example, Patent Document 1 below). .
According to this configuration, when a voltage is applied to the drive electrode, the drive wall that defines the channel is deformed to increase the pressure in the channel, and the ink contained in the channel is ejected through the nozzle holes.

Japanese Patent Application No. 2004-209796

  However, in the step of pressure-bonding the driving substrate to the mounting surface described above, the actuator plate is dielectrically polarized due to the piezoelectric effect, whereby a voltage is generated in the actuator plate and the driving substrate is charged. If the driving board is charged and contacts the peripheral member or the driving boards, an overvoltage is applied between the electronic component mounted on the driving board and the peripheral member, and the electronic component may be damaged.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a liquid ejecting head manufacturing apparatus and a liquid ejecting head that can improve yield and reduce failure cost (F cost). A method and a liquid jet head are provided.

The present invention provides the following means in order to solve the above problems.
An apparatus for manufacturing a liquid jet head according to the present invention is a liquid jet head manufacturing apparatus for connecting a head chip having an actuator plate made of a piezoelectric material and a drive substrate for driving the head chip, the head chip And a grounding unit that is connected to the drive substrate and discharges electric charges charged to the drive substrate. It is characterized by being.
The method of manufacturing a liquid jet head according to the present invention is a method of manufacturing a liquid jet head that connects a head chip having an actuator plate made of a piezoelectric material and a drive substrate that drives the head chip. There is a crimping step of crimping the drive substrate and the head chip, and the crimping step is performed while the drive substrate is connected to a ground portion and discharging electric charges charged on the drive substrate.

  According to this configuration, the electric charge charged to the drive substrate at the time of pressure bonding can be discharged by pressure bonding the head chip and the drive substrate with the drive substrate connected to the ground portion. For this reason, it is possible to prevent the electronic component mounted on the drive board from being damaged by applying an overvoltage between the drive board and the peripheral member due to the drive board coming into contact with the peripheral member or the like in a subsequent process. Therefore, the yield can be improved and the failure cost can be reduced.

Further, in the liquid jet head manufacturing apparatus according to the present invention, the pressure-bonding mechanism pressure-bonds the first drive substrate and the second drive substrate separately to the laminate of the first head chip and the second head chip, The ground portion may connect the first drive substrate and the second drive substrate.
According to this configuration, since the electric charge charged to each drive substrate at the time of crimping can be discharged to the ground portion, in the subsequent process, an overvoltage is applied between the drive substrates by, for example, direct contact between the drive substrates, It can suppress that the electronic component mounted in the drive board | substrate is damaged. As a result, even in a multi-row type liquid jet head in which a plurality of head chips are stacked, the yield can be improved and the failure cost can be reduced.

In the method of manufacturing a liquid jet head according to the present invention, the press-bonding step includes a first press-bonding of a first driving substrate to the first head chip in a stacked body of the first head chip and the second head chip. And a second pressure-bonding step for pressure-bonding a second drive substrate to the second head chip in the stacked body, and in the second pressure-bonding step, between the first drive substrate and the second drive substrate. Crimping may be performed in a state in which the grounding part is connected to.
According to this configuration, since the electric charge charged to each drive substrate at the time of crimping can be discharged to the ground portion, in the subsequent process, an overvoltage is applied between the drive substrates by, for example, direct contact between the drive substrates, It can suppress that the electronic component mounted in the drive board | substrate is damaged. As a result, even in a multi-row type liquid jet head in which the first head chip and the second head chip are stacked, the yield can be improved and the failure cost can be reduced.

In the method for manufacturing a liquid jet head according to the present invention, in the second pressure-bonding step, the grounding provided in advance on at least one of the first drive board and the second drive board. The first drive substrate and the second drive substrate may be connected to each other through a section.
According to this configuration, the drive substrates are connected to each other via the ground portion provided in advance on the drive substrate, so that both drive substrates can be reliably connected to the ground portion in the second crimping step. Moreover, since each drive board | substrate is connected to the earth | ground part and is conveyed to a post process, the electric charge electrically charged to each drive board | substrate can be discharged reliably.

The liquid jet head according to the present invention is manufactured by the method of manufacturing a liquid jet head according to the present invention.
According to this configuration, since the liquid jet head manufacturing method according to the present invention is used, it is possible to provide a highly reliable liquid jet head while improving yield and reducing failure costs.

  According to the present invention, the yield can be improved and the failure cost can be reduced.

1 is a schematic configuration diagram of an inkjet printer according to an embodiment. It is a disassembled perspective view of the inkjet head in embodiment. FIG. 3 is a cross-sectional view corresponding to line III-III in FIG. 2. It is a perspective view of a discharge part. It is a disassembled perspective view of a discharge part. It is a schematic plan view of a crimping jig. It is sectional drawing equivalent to the VII-VII line of FIG. It is sectional drawing of an earth | ground part. FIG. 8 is a cross-sectional view corresponding to FIG. 7 and is an explanatory diagram for explaining a first crimping process. It is explanatory drawing for demonstrating the 2nd crimping | compression-bonding process which concerns on the other structure of embodiment. It is explanatory drawing for demonstrating the 2nd crimping | compression-bonding process which concerns on the other structure of embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, as an example of a liquid ejecting apparatus including the liquid ejecting head of the present invention, an ink jet printer (hereinafter simply referred to as a printer) that performs recording on a recording medium using ink (liquid) is taken as an example. I will explain. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

[Printer]
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, a printer 1 includes a pair of transport mechanisms (moving mechanisms) 2 and 3 that transport a recording medium S such as paper, and an ink jet head (liquid ejecting head) that ejects ink droplets onto the recording medium S. 4), ink supply means 5 for supplying ink to the inkjet head 4, and scanning means 6 for scanning the inkjet head 4 in a direction (sub-scanning direction) orthogonal to the transport direction (main scanning direction) of the recording medium S It is equipped with. In the following description, the main scanning direction will be described as the X direction, the sub scanning direction as the Y direction, and the X direction and the direction orthogonal to the Y direction as the Z direction.

  The pair of transport mechanisms 2 and 3 rotate the grid rollers 2a and 3a extending in the Y direction, the pinch rollers 2b and 3b extending parallel to the grid rollers 2a and 3a, and the grid rollers 2a and 3a around their axes, respectively. And a drive mechanism (not shown) such as a motor to be operated.

The ink supply unit 5 includes an ink tank 10 that contains ink, and an ink pipe 11 that connects the ink tank 10 and the inkjet head 4.
The ink tank 10 includes, for example, ink tanks 10Y, 10M, 10C, and 10B each containing four types of inks of yellow (Y), magenta (M), cyan (C), and black (B). The ink is not limited to four types, and may be multicolored or may be a single color.
The ink pipe 11 is a flexible hose having flexibility, for example, and can follow the operation (movement) of the carriage 16 that supports the inkjet head 4.

The scanning means 6 includes a pair of guide rails 14 and 15 that extend in the Y direction and are arranged in parallel to each other with an interval in the X direction, and a carriage that is movably disposed along the pair of guide rails 14 and 15. 16 and a drive mechanism 17 that moves the carriage 16 in the Y direction.
The drive mechanism 17 is disposed between the pair of guide rails 14 and 15, and is paired with a pair of pulleys 18 that are spaced apart from each other in the Y direction, and endlessly wound around the pair of pulleys 18 and traveling in the Y direction. A belt 19 and a drive motor 20 that rotationally drives one pulley 18 are provided.

  The carriage 16 is connected to an endless belt 19 and is movable in the Y direction as the endless belt 19 is moved by the rotational drive of one pulley 18. In addition, a plurality of inkjet heads 4 are mounted on the carriage 16 in a state of being arranged in the Y direction. In the illustrated example, four inkjet heads 4 (that is, inkjet heads 4Y, 4M, 4C, and 4B) that respectively eject four types of ink are mounted on the carriage 16. The transport mechanisms 2 and 3 and the scanning unit 6 described above constitute a moving mechanism that relatively moves the inkjet head 4 and the recording medium S.

(Inkjet head)
Next, the above-described inkjet head 4 will be described in detail. 2 is an exploded perspective view of the inkjet head 4, and FIG. 3 is a cross-sectional view corresponding to the line III-III of FIG. Each of the inkjet heads 4 described above has the same configuration except for the color of the supplied ink. Therefore, in the following description, only one inkjet head 4 will be described.
As shown in FIGS. 2 and 3, the inkjet head 4 includes an ejection unit 21 that ejects ink droplets, a flow path member 22 that supplies ink to the ejection unit 21, and each head chip 31 </ b> A described later of the ejection unit 21. A first drive board 23a and a second drive board 23b that are electrically connected to 31B (see FIG. 4), respectively, and a head base 24 that supports these components are provided.

  The inkjet head 4 ejects ink of each color with a predetermined ejection amount by applying a driving voltage. At this time, the inkjet head 4 is moved in the Y direction by the scanning unit 6, so that recording can be performed in a predetermined range on the recording medium S. Further, by repeatedly performing the above-described scanning while the recording medium S is transported in the X direction by the transport mechanisms 2 and 3, it is possible to perform recording on the entire recording medium S.

FIG. 4 is a perspective view of the discharge unit 21, and FIG. 5 is an exploded perspective view of the discharge unit 21.
As shown in FIGS. 4 and 5, the discharge unit 21 includes two rows in which nozzle rows 48 and 49 each including a plurality of nozzle holes (first nozzle holes 48 a and second nozzle holes 49 a) are formed in two rows. This is a discharge unit 21 of the type. Specifically, the ejection unit 21 includes a first head chip 31A and a second head chip 31B stacked in the Y direction, a nozzle cap 32 that collectively supports the head chips 31A and 31B, and the head chips 31A and 31B. The nozzle plate 33 is fixed to the nozzle plate 33. Each of the head chips 31A and 31B is a so-called edge chute type that ejects ink from an ejection channel 43a described later. Therefore, the discharge part 21 of this embodiment is installed in a state where the Z direction coincides with the vertical direction. Hereinafter, the nozzle plate 33 side along the Z direction may be referred to as the lower side, and the side opposite to the nozzle plate 33 side may be referred to as the upper side. Further, in the following description, the first head chip 31A will be mainly described, and portions corresponding to the first head chip 31A in the second head chip 31B are denoted by the same reference numerals and description thereof is omitted.

The first head chip 31A mainly includes an actuator plate 41 and a cover plate 42 stacked in the Y direction.
The actuator plate 41 is made of a piezoelectric material such as PZT (lead zirconate titanate), and its polarization direction is set in one direction along the thickness direction (Y direction).

  A plurality of channels 43 are arranged in parallel at intervals in the X direction on one main surface 41a side in the Y direction of the actuator plate 41 (the surface side located on the cover plate 42 side). The plurality of channels 43 are linearly extended along the Z direction in a state opened to the one main surface 41 a side, and are opened at the lower end surface of the actuator plate 41. A portion of the actuator plate 41 located between the channels 43 constitutes a drive wall 44 that defines each channel 43.

  Each channel 43 has an ejection channel 43a filled with ink and a dummy channel 43b not filled with ink. The discharge channels 43a and the dummy channels 43b are alternately arranged in the X direction. A drive electrode (not shown) is formed on the inner surface of each channel 43 (drive wall 44). The drive electrode is pulled out on one main surface 41a in a portion (hereinafter simply referred to as a tail portion) located above the cover plate 42 in the upper end portion of the actuator plate 41, and the drive electrode is formed on the first main surface 41a. One drive substrate 23a is connected. Then, when a driving voltage is applied to the driving electrode via the first driving substrate 23a, the driving wall 44 is deformed by the piezoelectric sliding effect, and the volume in the discharge channel 43a is changed.

  The cover plate 42 has a plate shape in which one main surface 42 a is joined onto one main surface 41 a of the actuator plate 41, and closes each channel 43. In the illustrated example, the cover plate 42 is shorter in the Z direction than the actuator plate 41, and is joined to the actuator plate 41 with the lower end surface being flush with the actuator plate 41. And the tail part of the actuator plate 41 mentioned above is exposed above the cover plate 42. The cover plate 42 has a concave common ink chamber 46 formed on the other main surface 42b, and a plurality of slits 47 that allow the common ink chamber 46 and the ejection channel 43a to communicate with each other.

The common ink chamber 46 is a groove that is located at the upper end of the cover plate 42 and is recessed toward the actuator plate 41 side, and extends along the X direction.
The slit 47 is formed at a position corresponding to the ejection channel 43a in the X direction in the common ink chamber 46, and communicates the inside of the common ink chamber 46 and the inside of the ejection channel 43a.

  Similar to the first head chip 31A described above, the second head chip 31B is configured by laminating an actuator plate 41 and a cover plate 42 in the Y direction. The head chips 31A and 31B are integrally configured by joining the other main surfaces 41b of the actuator plate 41 to each other.

The ejection channels 43a and the dummy channels 43b of the second head chip 31B are arranged with a half pitch shift with respect to the arrangement pitch of the ejection channels 43a and the dummy channels 43b of the first head chip 31A, and the ejection channels of the head chips 31A and 31B. 43a and dummy channels 43b are arranged alternately (staggered).
In the second head chip 31B, a second drive substrate 23b (see FIGS. 1 and 2) is connected to the tail portion of the actuator plate 41.

  The nozzle cap 32 has a rectangular shape in plan view when viewed from the Z direction. The nozzle cap 32 is formed with a fitting hole 32a penetrating in the Z direction, and the head chips 31A and 31B described above are fitted together. In the illustrated example, the head chips 31 </ b> A and 31 </ b> B are combined such that the lower end surface thereof is flush with the lower end surface of the nozzle cap 32.

  The nozzle plate 33 is made of a film material such as polyimide, and is fixed to the nozzle cap 32 and the lower end surfaces of the head chips 31A and 31B by adhesion or the like. In the nozzle plate 33, a nozzle row (first nozzle row 48 and second nozzle row 49) composed of a plurality of nozzle holes (first nozzle hole 48a and second nozzle hole 49a) arranged in parallel in the X direction. ) Are arranged in two rows.

The first nozzle row 48 includes a plurality of first nozzle holes 48a penetrating the nozzle plate 33 in the Z direction and arranged in a straight line at intervals in the X direction. The first nozzle holes 48a communicate with the discharge channels 43a of the first head chip 31A described above.
The second nozzle row 49 penetrates the nozzle plate 33 in the Z direction and has a plurality of second nozzle holes 49a arranged at intervals in the X direction, and is arranged in parallel with the first nozzle row 48 described above. Has been. Each second nozzle hole 49a communicates with the discharge channel 43a of the second head chip 31B described above. Therefore, each dummy channel 43 b does not communicate with the nozzle holes 48 a and 49 a and is covered from below by the nozzle plate 33.

  2 and 3, the flow path member 22 includes a first flow path block 51 that supplies ink to the first head chip 31A and a second flow path block 52 that supplies ink to the second head chip 31B. And a connection block 53 that connects the flow path blocks 51 and 52.

The first flow path block 51 has a plate shape extending along the X direction. The first flow path block 51 is fixed on the other main surface 42b of the cover plate 42 of the first head chip 31A and closes the common ink chamber 46 on the first head chip 31A side. In the first flow path block 51, a first ink supply path 54 communicating with the common ink chamber 46 is formed.
The second flow path block 52 has a plate shape extending along the X direction, and faces the first flow path block 51 in the Y direction with the discharge unit 21 interposed therebetween. Specifically, the second flow path block 52 is fixed on the other main surface 42b of the cover plate 42 of the second head chip 31B and closes the common ink chamber 46 on the second head chip 31B side. . In the second flow path block 52, a second ink supply path 55 communicating with the common ink chamber 46 is formed.

  The connection block 53 is fixed so as to straddle between the flow path blocks 51 and 52 on one end face in the X direction of the discharge section 21. The connection block 53 is formed with a connection flow path (not shown) that communicates with the ink supply paths 54 and 55 of the flow path blocks 51 and 52 described above. Further, the connection block 53 is provided with a supply port 57 to which the above-described ink pipe 11 is connected. The supply port 57 communicates with the connection flow path, and causes the ink supplied from the ink tank 10 (see FIG. 1) to flow into the ink supply paths 54 and 55 through the connection flow path.

Each drive substrate 23a, 23b includes a first FPC 61a and a second FPC 61b connected to the respective head chips 31A, 31B, a first support plate 62a and a second support plate 62b for individually supporting the FPCs 61a, 61b, It has.
The first FPC 61a is mounted with various electronic components such as a driver IC 63 that generates a drive signal for driving the first head chip 31A and a capacitor (not shown). These electronic components are connected via a wiring pattern (not shown). The driver IC 63 is electrically connected to the drive electrode of the first head chip 31A through a wiring pattern (not shown). Specifically, the lower end portion of the first FPC 61a is pressure-bonded to one main surface 41a of the tail portion of the first head chip 31A (actuator plate 41) via an anisotropic conductive film (not shown). Accordingly, the first head chip 31A and the first FPC 61a are mechanically connected to each other, and the conductive particles in which the drive electrodes of the first head chip 31A and the wiring patterns of the first FPC 61a are dispersed in the anisotropic conductive film are obtained. Is electrically connected.

  The first support plate 62a has a plate shape made of, for example, a metal material, and is fixed on a surface of the first FPC 61a that is located on the side opposite to the mounting surface on which each electronic component is mounted. In the illustrated example, the first support plate 62a overlaps the first FPC 61a in the Y direction with the upper and lower ends of the first FPC 61a protruding.

  The first support plate 62a is formed with a pair of attachment pieces 65 protruding toward both sides in the X direction. These attachment pieces 65 are for attaching the first drive board 23a to the head base 24 and have attachment holes 66 penetrating the first support plate 62a in the Y direction. In the illustrated example, each attachment piece 65 is formed at a different position in the Z direction.

The second FPC 61b has the same configuration as the first FPC 61a described above, and is mounted with a driver IC 64 that generates a drive signal for driving the second head chip 31B and various electronic components such as a capacitor. The second head chip 31B and the second FPC 61b are mechanically connected to each other through an anisotropic conductive film, and the drive electrode of the second head chip 31B and the wiring pattern of the second FPC 61b are connected to the anisotropic conductive film. They are electrically connected through conductive particles dispersed therein.
In the present embodiment, the mounting surfaces of the electronic components face each other in the FPCs 61 a and 61 b in a state where the positions of the electronic components are shifted in the in-plane direction (YZ plane).

The second support plate 62b has the same configuration as the first support plate 62a described above, and is fixed on a surface located on the opposite side of the mounting surface of the second FPC 61b.
A pair of attachment pieces 68 are formed on the second support plate 62b so as to protrude toward both sides in the X direction. These attachment pieces 68 are for attaching the second drive board 23b to the head base 24 and have attachment holes 69 penetrating the second support plate 62b in the Y direction. In the illustrated example, the attachment pieces 68 of the second support plate 62b are formed at different positions in the Z direction, and are formed at positions that do not overlap with the attachment pieces 65 of the first support plate 62a in the Y direction. .

The head base 24 is disposed so as to sandwich the ejection unit 21, the flow path member 22, and the drive substrates 23a and 23b in the Y direction. Specifically, the head base 24 includes a main body base 71 disposed on the first head chip 31A side in the Y direction, and a lid 72 disposed on the second head chip 31B side.
The main body base 71 has a C-shape that opens toward the first head chip 31A in the X direction when viewed from the top when viewed from the Z direction. Covering from the head chip 31A side. As shown in FIG. 2, the main body base 71 is formed with a pedestal portion 73 to which the mounting pieces 65 and 68 of the support plates 62a and 62b described above are mounted. Corresponding mounting pieces 65 and 68 abut each pedestal portion 73 in the Y direction. Of the attachment pieces 65 and 68, the attachment piece 65 of the first support plate 62 a is fixed to the pedestal portion 73 with a screw 75.

  The lid 72 has a plate shape that closes the main body base 71 from the second head chip 31B side in the Y direction, and the upper end portion of the second flow path block 52 and the second drive substrate 23b from the second head chip 31B side. Covering. The lid 72 is fastened together with the mounting piece 68 of the second support plate 62b to the pedestal 73 of the main body base 71 with screws 76.

[Inkjet head manufacturing method]
Next, the manufacturing method of the inkjet head 4 mentioned above is demonstrated.
First, the discharge part 21 is formed (discharge part formation process). Specifically, first, the actuator plate 41 and the cover plate 42 to be the head chips 31A and 31B are bonded together, and then the actuator plates 41 of the head chips 31A and 31B are bonded together. Subsequently, after the head chips 31A and 31B are fitted into the fitting holes 32a of the nozzle cap 32, the nozzle plate 33 is fixed to the nozzle cap 32 and the lower end surfaces of the head chips 31A and 31B.

Next, each drive board | substrate 23a, 23b is connected to the discharge part 21 mentioned above (connection process). In this embodiment, a connection process is performed using the crimping jig 100 described below. 6 is a schematic plan view of the crimping jig 100, and FIG. 7 is a cross-sectional view corresponding to the line VII-VII in FIG.
As shown in FIGS. 6 and 7, the crimping jig 100 includes a holder unit 101 that holds the discharge unit 21, a crimping mechanism (not shown) that crimps the drive substrates 23 a and 23 b against the holder unit 101, and the drive substrate 23 a. , 23b, and a grounding part 102 for discharging the electric charge charged to the battery 23b.

  The holder part 101 is comprised, for example with metal materials, such as stainless steel and aluminum, and the insulation process is performed to the surface. The holder portion 101 is formed with a head recess 103 that accommodates the discharge portion 21. The head recess 103 is recessed downward and accommodates the head chip 31A, 31B side of the discharge portion 21 where pressure bonding is not performed. The holder portion 101 may be formed of, for example, a resin material as long as dimensional stability can be ensured.

  The holder portion 101 has a substrate recess 104 formed at a distance from the head recess 103. The recess 104 for a substrate has a shape in plan view that follows the drive substrate (first drive substrate 23a in the present embodiment) to be crimped in the first crimping step described later, among the drive substrates 23a and 23b. A drive substrate to be crimped in the first crimping process is accommodated.

  In the holder portion 101, a portion located between the head recess 103 and the substrate recess 104 constitutes a crimping pedestal 105. The crimping pedestal 105 has the tails of the head chips 31A and 31B placed thereon, and sandwiches the tails and the drive substrates 23a and 23b with the crimping mechanism.

FIG. 8 is a cross-sectional view of the ground portion 102.
As shown in FIGS. 6 and 8, the grounding portion 102 includes, in the holder portion 101, each mounting piece 68 of a drive board (second drive board 23 b in the present embodiment) to be crimped in a second crimping process described later. It is embedded and fixed in the overlapping parts in plan view. Specifically, the ground part 102 includes a block-shaped base part 110 made of a resin material or the like. The base 110 has an L shape in side view, and extends from the opening edge of the substrate recess 104 (the upper surface of the holder unit 101) across the bottom surface of the substrate recess 104.

  A contact pin 111 that can contact the first support plate 62a of the first drive substrate 23a in the second crimping process is disposed in a portion of the base 110 that is located on the bottom surface of the substrate recess 104. Further, a contact portion 112 that can contact the attachment piece 68 of the second support plate 62b of the second drive substrate 23b in the second press-bonding step is provided in a portion of the base portion 110 located on the opening edge of the substrate recess 104. It is arranged.

  Further, a connection wiring 113 for connecting the contact pin 111 and the contact portion 112 is embedded in the base portion 110. A resistor 114 is connected on the connection wiring 113. The resistor 114 is a relatively high resistance resistor having an electrical resistance value of about several hundred kΩ to several MΩ.

FIG. 9 is a cross-sectional view corresponding to FIG. 7 and is an explanatory diagram for explaining the first crimping step.
In order to perform the connecting process using the above-described crimping jig 100, first, the first head chip 31A and the first drive substrate 23a are connected as shown in FIG. Specifically, first, the first head chip 31A is directed upward, and the discharge unit 21 is set on the holder unit 101 so that the tail of the second head chip 31B is disposed on the crimping pedestal 105 (setting step). Subsequently, after attaching an anisotropic conductive film on one main surface 41a of the actuator plate 41 at the tail of the first head chip 31A, the tail and the connection end of the first FPC 61a on the first drive substrate 23a , Are superimposed. In this state, the overlapping portion of the tail portion of the first head chip 31A and the connection end portion of the first FPC 61a is pressurized while applying heat by the crimping mechanism (first crimping step). Thereby, the first head chip 31A and the first drive substrate 23a are pressure-bonded. In the first crimping step, the first drive board 23a is moved into the substrate recess 104 by the attachment piece 65 of the first support plate 62a coming into contact with the upper surface of the holder portion 101 (for example, the upper surface of the ground portion 102). Entry is restricted.

  Next, as shown in FIGS. 6 and 7, the second head chip 31B and the second drive substrate 23b are connected. Specifically, first, the ejection unit 21 is turned upside down so that the second head chip 31B faces upward, and the ejection unit 21 is placed in the holder unit 101 so that the tail of the first head chip 31A is disposed on the crimping base 105. (Set process). At this time, the first drive substrate 23a connected to the first head chip 31A is bent downward by its own weight, and is accommodated in the substrate recess 104, and the first support plate 62a is the substrate recess 104. In contact with the contact pin 111.

  Subsequently, after attaching an anisotropic conductive film on one main surface 41a of the actuator plate 41 at the tail of the second head chip 31B, the tail and the connection end of the second FPC 61b on the second drive substrate 23b , Are superimposed. At this time, the second drive substrate 23b (second support plate 62b) is prevented from entering the substrate recess 104 by the attachment piece 68 contacting the contact portion 112 of the ground portion 102 on the upper surface of the holder portion 101. Be regulated. Therefore, the second drive substrate 23b is held by the holder unit 101 in a state of being separated from the first drive substrate 23a.

  Here, when the attachment piece 68 of the second support plate 62b contacts the contact portion 112 of the ground portion 102, the first drive substrate 23a and the second drive substrate 23b are electrically connected to each other via the ground portion 102. The In this state, the overlapping portion of the tail portion of the second head chip 31B and the connection end portion of the second FPC 61b is pressurized while applying heat by the crimping mechanism (second crimping step). As a result, the second head chip 31B and the second drive substrate 23b are pressure-bonded. That is, in the second crimping process, the crimping is performed in a state where the first drive board 23 a and the second drive board 23 b are connected to the ground portion 102.

  By the way, in each crimping step described above, the actuator plate 41 is dielectrically polarized due to the piezoelectric effect, whereby a voltage is generated in the actuator plate 41 and the drive substrates 23a and 23b (support plates 62a and 62b) are charged. Specifically, different charges are charged in the support plates 62a and 62b, and a potential difference is generated between the support plates 62a and 62b.

  At this time, since the support plates 62a and 62b are electrically connected by the ground portion 102 as described above, a current flows between the support plates 62a and 62b via the resistor 114 of the ground portion 102. That is, the electric charges charged in the support plates 62a and 62b are discharged to the ground portion 102, and the electric energy held by the electric charges is converted into thermal energy by the resistor 114. The electric charge is discharged according to a time constant calculated by the product of the electrostatic capacitances of the support plates 62a and 62b and the electric resistance value of the resistor 114. Therefore, the discharge time can be adjusted by appropriately adjusting the electric resistance value. In this case, for example, by increasing the electric resistance value of the resistor 114, the discharge time can be extended.

  Thereafter, the ejection unit 21 and the drive substrate 23a are removed from the crimping jig 100, and the flow path member 22, the head base 24, and the like are assembled, whereby the above-described inkjet head 4 is completed.

  According to this configuration, in the crimping process, the second head chip 31B and the second drive board 23b are crimped in a state where the drive boards 23a and 23b are connected to the ground portion 102, so that each drive board 23a is crimped. , 23b can be discharged. Therefore, it is possible to prevent the electronic components mounted on the FPCs 61a and 61b from being damaged due to an overvoltage being applied between the drive substrates 23a and 23b by, for example, direct contact between the drive substrates 23a and 23b. Therefore, the yield can be improved and the failure cost can be reduced.

  In this embodiment, it is possible to provide the inkjet head 4 with high reliability after improving the yield and reducing the failure cost.

  In the above-described embodiment, the configuration in which the drive substrates 23a and 23b are connected via the contact pins 111 and the contact portions 112 has been described. However, the present invention is not limited to this. For example, as shown in FIG. 10, a conductive sheet may be used as the ground part 200. The conductive sheet is sponge-like and has a thickness of about 5 mm, for example. In FIG. 10, the illustration of the holder unit that supports the ejection unit 21 and the drive substrates 23 a and 23 b is omitted.

  In such a configuration, in the second crimping step, the second drive substrate 23b is crimped to the second head chip 31B in a state where the above-described ground portion 200 is sandwiched between the drive substrates 23a and 23b (FPCs 61a and 61b). Then, a current flows between the drive substrates 23a and 23b via the ground portion 200. As a result, the electric charges charged in the drive substrates 23a and 23b are released, and the yield can be improved and the failure cost can be reduced.

  The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the configuration in which the ground portion 102 is disposed on the crimping jig 100 side has been described, but the configuration is not limited thereto. For example, the ground portion 300 is disposed in advance on each of the drive substrates 23a and 23b, and the second head chip 31B and the second drive substrate 23b are pressure-bonded in a state where the ground portions 300 are connected to each other in the second pressure bonding step. It doesn't matter.
According to this configuration, the drive substrates 23a and 23b are connected to each other via the ground portion 300 provided in advance on the drive substrates 23a and 23b, so that both the drive substrates 23a and 23b are reliably grounded in the crimping process. The unit 300 can be connected. In addition, since the drive substrates 23a and 23b are connected to the ground portion 300 and are transported to a subsequent process, the charges charged in the drive substrates 23a and 23b can be reliably discharged. In this case, a resistor (not shown) connected to the ground unit 300 may be separately provided on the FPCs 61a and 61b.

In addition, the connection between the respective earth portions 300 can be appropriately changed in design. For example, the opposing surfaces may be abutted with each other, or the opposing surfaces may be engaged with each other in an uneven manner.
Furthermore, if the ground part 300 is configured to connect the drive boards 23a and 23b to each other, it is not necessary to provide the ground part 300 on both the drive boards 23a and 23b, but on at least one of the drive boards 23a and 23b. It doesn't matter if it is done.

In the above-described embodiment, the configuration in which the plurality of head chips 31A and 31B are stacked has been described. However, the present invention is not limited to this, and the present invention is applied to a case where a single-layer head chip and a driving substrate are pressure-bonded. can do.
Furthermore, in the above-described embodiment, the configuration in which the mounting surfaces of the drive substrates 23a and 23b are opposed to each other is not limited thereto.
In the above-described embodiment, the configuration in which the head chips 31A and 31B and the drive substrates 23a and 23b are connected via the anisotropic conductive film has been described. However, the present invention is not limited to this, and the crimping method can be appropriately changed in design. It is.

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in the embodiment mentioned above by a known component, and you may combine each modification mentioned above suitably.

4, 4Y, 4M, 4C, 4B ... Inkjet head (liquid ejecting head)
23a ... 1st drive substrate 23b ... 2nd drive substrate 31A ... 1st head chip (head chip)
31B ... Second head chip (head chip)
101 ... Holder part 102,200,300 ... Earth part

Claims (6)

A liquid ejecting head manufacturing apparatus for connecting a head chip having an actuator plate made of a piezoelectric material and a driving substrate for driving the head chip,
A holder part in which the head chip is set;
A crimping mechanism for crimping the drive substrate to the head chip;
An apparatus for manufacturing a liquid ejecting head, comprising: an earth part that is connected to the driving substrate and discharges electric charges charged in the driving substrate. The crimping mechanism is configured to crimp the first drive substrate and the second drive substrate separately to the stacked body of the first head chip and the second head chip,
The apparatus for manufacturing a liquid jet head according to claim 1, wherein the ground portion connects the first drive substrate and the second drive substrate. A liquid ejecting head manufacturing method for connecting a head chip having an actuator plate made of a piezoelectric material and a driving substrate for driving the head chip,
A crimping step of crimping the drive substrate and the head chip;
The method of manufacturing a liquid jet head, wherein the crimping step is performed while the driving substrate is connected to a ground portion and the electric charge charged to the driving substrate is discharged. The crimping process includes
A first pressure-bonding step of pressure-bonding a first drive substrate to the first head chip of the laminate of the first head chip and the second head chip;
A second crimping step of crimping a second drive substrate to the second head chip in the laminate,
4. The method of manufacturing a liquid jet head according to claim 3, wherein in the second pressure bonding step, pressure bonding is performed in a state where the ground portion is connected between the first drive substrate and the second drive substrate.   In the second pressure-bonding step, the first drive board and the second drive are arranged via the ground portion arranged in advance on at least one of the first drive board and the second drive board. The method of manufacturing a liquid jet head according to claim 4, wherein the substrates are connected to each other.   A liquid jet head manufactured by the method of manufacturing a liquid jet head according to claim 5.

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