JP2016111094A - Method of manufacturing circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of enhancing the detachability of a dry film resist after reflow.SOLUTION: A manufacturing method includes a step for forming a layer of liquid organic components, where the weight change is 4.0% or less at 250°C in still standing for 30 min, and the kinetic viscosity is 80-120000 mm/s, between a solder resist layer and a dry film resist layer formed on the substrate surface.SELECTED DRAWING: None

Description

  The present disclosure relates to a method for manufacturing a circuit board.

  In recent years, regarding the mounting of electronic components on a printed wiring board or a ceramic substrate, the demand for higher density has been increasing year by year, and a bare chip mounting method has attracted attention as a method that satisfies such a requirement. In the bare chip mounting method, instead of the conventional face-up mounting that achieves electrical connection between the chip and the substrate wiring via wire bonding, face-down mounting that achieves the electrical connection via metal bumps is widely adopted. It tends to be. According to the so-called metal bump method in which face-down mounting is performed through metal bumps, it can be expected to form a low-resistance connection between electronic components.

  As a method for narrowing the pitch of metal bumps, Patent Document 1 discloses that a dry film resist is further laminated on a solder resist layer on a substrate surface, an opening is provided in an electrode pad, a solder paste is supplied, and after reflow A method for stripping a dry film resist is disclosed.

  Patent Document 2 discloses the use of a negative radiation-sensitive two-layer laminated film as a dry film resist in order to facilitate the peeling of the dry film resist.

JP 2000-208911 A Japanese Patent Laid-Open No. 2005-266795

  In the metal bump method, the dry film resist used for bump formation needs to be peeled off. However, if the peeling residue remains even after cleaning, or the cleaning resist does not remain, but the surface of the solder resist layer is not removed. It may be rough. In either case, it is difficult to perform good electronic component mounting.

  Therefore, in one aspect, the present disclosure provides a method for manufacturing a circuit board that can improve the releasability of a dry film resist after reflow.

In one or a plurality of embodiments of the present disclosure, a liquid having a weight change of 4.0% or less after standing at 250 ° C. for 30 minutes between a solder resist layer and a dry film resist layer formed on a substrate surface. a Jo of organic components, kinematic viscosity comprises forming a layer of liquid organic component is less than 80 mm ² / s or more 120000mm ² / s, a method of manufacturing a circuit board.

In one or a plurality of embodiments, the present disclosure relates to a method for manufacturing a circuit board including steps (1) to (7).
Step (1): A step of forming a solder resist layer on the surface of the substrate on which the soldering portion is provided, and forming a soldering opening so that the soldering portion is exposed.
Step (2): A liquid organic component having a weight change of 4.0% or less on standing at 250 ° C. for 30 minutes on the solder resist layer, and having a kinematic viscosity of 80 mm ² / s to 120,000 mm ² / s. The process of forming the layer of the liquid organic substance component which is the following.
Step (3): A step of forming a dry film resist layer on the organic component layer.
Step (4): A step of forming a soldering opening communicating with the opening in the step (1) so that the soldering portion is exposed in the dry film resist layer and the organic component layer.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

In one or a plurality of embodiments, the present disclosure relates to a circuit board manufacturing method including the following steps (1 ′), (2 ′), and (5) to (7).
Step (1 ′): A solder resist layer is formed on the surface of the substrate on which the soldering portion is provided, and a liquid state having a weight change of 4.0% or less after standing at 250 ° C. for 30 minutes on the solder resist layer. be organic component, the step of kinematic viscosity 80 mm ² / s or more 120000mm ² / s to form a layer of liquid organic component or less, to form a dry film resist layer on the layer of the organic components.
Step (2 ′): a step of forming a soldering opening in the solder resist layer, the organic component layer, and the dry film resist layer so that the soldering portion is exposed.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

  According to the method for manufacturing a circuit board according to the present disclosure, when a solder bump is fixed to a soldered portion (for example, an electrode) of the circuit board using a resin mask layer (resin film) such as a dry film resist, The effect that the peelability of the dry film resist after the heat treatment (reflow) of the solder bumps can be improved can be achieved.

It is an outline process explanatory view showing one or a plurality of embodiments of a circuit board manufacturing method concerning this indication. It is an outline process explanatory view showing one or a plurality of embodiments of a circuit board manufacturing method concerning this indication. It is a schematic process explanatory drawing which shows an example of the manufacturing method of the circuit board containing the solder bump formation which uses a dry film resist.

  One embodiment of a circuit board manufacturing method including solder bump formation using a dry film resist disclosed in Patent Document 1 is schematically illustrated in FIG. 3, for example. As shown in FIG. 3A, first, a solder resist layer 1 (insulating layer) is formed on the surface of the circuit board 10 and firmly fixed. An opening is formed in the solder resist layer 1 so that the electrode portion 11 is exposed. A dry film resist 2 is laminated on the solder resist layer 1, a portion covering the electrode portion 11 is removed by exposure, and an opening 7 is formed so as to communicate with the opening. Alternatively, the opening 7 may be formed so that the electrode portion 11 is exposed after the solder resist layer 1 and the dry film resist layer 2 are laminated. Next, as shown in FIG. 3B, a solder bump forming material 5 is applied to the opening 7 of the circuit board 10. Alternatively, solder balls may be disposed in the openings 7 instead of the solder bump forming material. Next, heating (reflow) is performed to deposit solder on the surface of the electrode part 11 as shown in FIG. Then, as shown in FIG. 3 (d), the dry film resist layer 2 is peeled off with the cleaning composition to obtain the circuit board 10 on which the solder bumps 6 are formed. In one or a plurality of embodiments, the solder bumps 6 are fluttered as necessary as shown in FIG. In the solder bump forming method schematically shown in FIG. 3, although not shown, solder flux may be used to improve solder wettability.

  The present disclosure is based on the knowledge that the peelability of the dry film resist is improved by disposing a layer of a predetermined organic component as the third layer between the solder resist layer and the dry film resist layer. That is, by arranging the third layer, the peeling residue of the dry film resist layer after cleaning and / or the roughness of the surface of the solder resist layer after cleaning are compared with the case where the third layer is not provided. Based on the finding that it is suppressed.

The details of the mechanism by which the peelability of the dry film resist layer is improved in the method of the present disclosure are not clear, but are presumed as follows.
That is, when the solder resist layer and the dry film resist layer are directly laminated and further heated (reflowed) in a state where the flux component is added, the flux component and the dry film resist layer change at high temperatures, and the solder resist It is considered that the strong bond to the layer is the cause of the deterioration of peelability. Placing a layer of a predetermined organic component as the third layer between the solder resist layer and the dry film resist layer, and suppressing the strong bond due to high temperature alteration, it is considered that the peelability of the dry film resist is improved. It is done. However, the present disclosure is not limited to this mechanism.

[Third layer]
In one aspect, a method for manufacturing a circuit board according to the present disclosure includes disposing a layer of a predetermined organic component as a third layer between a solder resist layer and a dry film resist layer. The organic component layer is liquid from the viewpoint of improving the peelability of the dry film resist, and is preferably liquid at room temperature (25 ° C.).

[Organic components]
From the viewpoint of improving the releasability of the dry film resist, the organic component constituting the third layer has a weight change of not more than 4.0%, preferably not more than 3.5%, after standing at 250 ° C. for 30 minutes. More preferably, it is 3.0% or less, more preferably 2.0% or less, still more preferably 1.5% or less, and still more preferably 1.3% or less. The change in weight after standing at 250 ° C. for 30 minutes can be measured and calculated by the method described in Examples.

The organic components, in one or more embodiments, the kinematic viscosity at 25 ° C., or less 80 mm ² / s or more 120000mm ² / s, from the viewpoint of improving the peeling resistance of the dry film resist, preferably 90 mm ² / s As mentioned above, More preferably, it is 100 mm < ² > / s or more. From the same viewpoint, the kinematic viscosity at 25 ° C., preferably 100,000 mm ² / s or less, more preferably 12000 mm ² / s or less, more preferably 11000mm ² / s or less, still more preferably not more than 10000 mm ² / s. From the same viewpoint, the kinematic viscosity at 25 ° C., preferably from 80 mm ² / s or more 100,000 mm ² / s or less, more preferably 80 mm ² / s or more 12000 mm ² / s or less, more preferably 90 mm ² / s or more 11000mm ² / It is s or less, More preferably, it is 100 mm < ² > / s or more and 10000 mm < ² > / s or less.

  In one or more embodiments, the organic component preferably includes silicone oil (polysiloxane) and PEG (polyethylene glycol) from the viewpoint of improving the peelability of the dry film resist. The silicone oil is preferably a non-reactive silicone oil from the viewpoint of improving the peelability of the dry film resist. From the same viewpoint, the silicone oil is preferably a silicone oil in which a phenyl group, a methyl group, or a hydrogen atom is introduced at the terminal, or a modified silicone oil thereof. The modified silicone oil is more preferably a silicone oil in which an organic group such as a phenyl group or a polyether group is introduced into the side chain. Examples of the silicone oil in which a phenyl group, a methyl group, or a hydrogen atom is introduced at the terminal include methylphenyl silicone oil, diphenyl silicone oil, dimethyl silicone oil, and methylhydrogen silicone oil. Examples of the silicone oil in which the phenyl group and the organic group of the polyether are introduced into the side chain include phenyl-modified silicone and polyether-modified silicone.

  In one or more embodiments, the organic component is preferably at least one selected from the group consisting of methylphenyl silicone oil, dimethyl silicone oil, and polyether-modified silicone from the viewpoint of improving the adhesion of the dry film resist. From the viewpoint of improving the adhesion of the dry film resist, the HLB of the polyether-modified silicone is preferably 8 or more, more preferably 10 or more, still more preferably 11 or more, and even more preferably 12 or more. From the same viewpoint, the HLB is preferably 18 or less, more preferably 17 or less, and still more preferably 16 or less. From the same viewpoint, HLB is preferably 8 or more and 18 or less, more preferably 10 or more and 18 or less, still more preferably 11 or more and 17 or less, and further preferably 12 or more and 16 or less.

[Circuit board manufacturing method]
In one aspect, a method for manufacturing a circuit board according to the present disclosure includes forming a third layer of the organic component between a solder resist layer and a dry film resist layer formed on a substrate surface.

  One or more embodiments of a circuit board manufacturing method according to the present disclosure will be described with reference to FIGS. 1 and 2. Drawing 1 is an outline process explanatory view showing one or a plurality of embodiments of a manufacturing method of a circuit board concerning this indication. 1 and 2 are the same except for (b). As shown in FIG. 1A, first, a solder resist layer 1 (insulating layer) is formed on the surface of the circuit board 10 and firmly fixed. An opening is formed in the solder resist layer 1 so that the electrode portion 11 is exposed. The organic component layer 3 is formed on the solder resist layer 1, and the dry film resist layer 2 is further laminated thereon, and the portion covering the electrode portion 11 is removed by exposure so as to communicate with the opening. An opening 7 is formed. Or you may form the opening part 7 so that the electrode part 11 may be exposed, after laminating | stacking the solder resist layer 1, the said organic component layer 3, and the dry film resist layer 2 in this order. Next, as shown in FIG. 1B, a solder bump forming material 5 is applied to the opening 7 of the circuit board 10. Alternatively, as shown in FIG. 2B, solder balls 4 may be disposed in the openings 7 instead of the solder bump forming material 5. Next, heating (reflow) is performed to deposit solder on the surface of the electrode portion 11 as shown in FIG. Then, as shown in FIG. 1 (d), the dry film resist layer 2 is peeled off with the cleaning composition to obtain the circuit board 10 on which the solder bumps 6 are formed. In one or a plurality of embodiments, as shown in FIG. 3 (e), the organic component layer 3 is washed and the solder bumps 6 are fluttered as necessary. In the solder bump forming method outlined in FIGS. 1 and 2, although not shown, solder flux may be used to improve solder wettability and the like.

Therefore, the circuit board manufacturing method according to the present disclosure relates to a circuit board manufacturing method including the following steps (1) to (7) in one or a plurality of embodiments.
Step (1): A step of forming a solder resist layer on the surface of the substrate on which the soldering portion is provided, and forming a soldering opening so that the soldering portion is exposed.
Step (2): A step of forming a liquid organic component layer having a weight change of 4.0% or less on standing at 250 ° C. for 30 minutes on the solder resist layer.
Step (3): A step of forming a dry film resist layer on the organic component layer.
Step (4): A step of forming a soldering opening communicating with the opening of the step (1) so that the soldering portion is exposed to the dry film resist layer and the organic component layer.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

In one or a plurality of other embodiments, a method for manufacturing a circuit board according to the present disclosure relates to a method for manufacturing a circuit board including the following steps (1 ′), (2 ′), and (5) to (7). .
Step (1 ′): A solder resist layer is formed on the surface of the substrate on which the soldering portion is provided, and a liquid state having a weight change of 4.0% or less after standing at 250 ° C. for 30 minutes on the solder resist layer. Forming an organic component layer and forming a dry film resist layer on the organic component layer;
Step (2 ′): a step of forming a soldering opening in the solder resist layer, the organic component layer, and the dry film resist layer so that the soldering portion is exposed.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

[Step (1)]
Step (1) is a step of providing an opening by disposing a solder resist layer on the surface of the substrate on which the soldering portion is provided. In one or a plurality of embodiments, the substrate provided with the soldering part may be a circuit board provided with a soldering part on which a solder bump is to be formed, and the soldering part may be provided in one or a plurality of embodiments. , The electrode. In one or more embodiments of the circuit board, as shown in FIG. 1A, the surface of the circuit board 10 is covered with the solder resist layer 1 and the electrode portion 11 is exposed on the surface. The solder resist layer 1 is firmly fixed to the surface of the circuit board 10. As the solder resist layer 1, in one or more embodiments that are not limited, an epoxy resin, an acrylic resin, a polyimide resin, or the like is used.

[Step (2)]
Step (2) is a step of disposing an organic component layer on the solder resist layer of step (1). Examples of the organic component include those described above. The thickness of the organic component layer is theoretically (calculated) from the viewpoint of improving the peelability of the dry film resist, preferably from 0.1 μm to 50 μm, more preferably from 0.3 μm to 20 μm, still more preferably. It is 0.5 μm or more and 10 μm or less, more preferably 0.8 μm or more and 5 μm or less, and still more preferably about 1 μm. In one or a plurality of embodiments, the organic component layer can be arranged by applying the organic component to the surface of the solder resist layer. However, the arrangement method of the organic component layer is not limited.

[Step (3)]
Step (3) is a step of forming a dry film resist layer on the organic component layer of step (2). In one or a plurality of embodiments, the step is a step of laminating a film-like dry film resist (dry film) on the organic component layer. As a resin material for forming the dry film resist layer, in one or a plurality of embodiments, a film-like photosensitive resin is preferably used from the viewpoint of uniform thick film formation, and a dry film resist is more preferable. Further, the dry film resist is more preferably a negative photosensitive film in which the exposed portion is cured from the viewpoint of ease of handling and the like, and more preferably a negative dry film resist. The negative dry film resist is more preferably polyacrylic acid as a main component. The dry film resist in the present disclosure refers to a film-like photosensitive resin that requires peeling in the step after pattern formation. A general-purpose dry film resist can be used. In one or a plurality of embodiments, the thickness of the dry film resist layer is preferably 10 μm or more, and more preferably 30 μm or more, from the viewpoint of the amount of solder deposited required for forming bumps by deposited solder. In one or a plurality of embodiments, the thickness of the dry film resist layer is preferably 300 μm or less, more preferably 150 μm or less, from the viewpoint of curing the dry film resist layer to the bottom.

[Step (4)]
Step (4) is a step of forming an opening so that the soldered portion is exposed in the organic component layer and the dry film resist layer formed in steps (2) and (3). In one or a plurality of embodiments, the opening of the dry film resist layer can be formed by exposure / development processing. In one or a plurality of embodiments, the opening of the organic component layer can be washed after forming the opening of the dry film resist layer. Through steps (1) to (4), the solder resist layer 1, the organic component layer 3, and the dry film resist layer 2 are formed on the surface of the circuit board 10 as in one or a plurality of embodiments shown in FIG. A substrate that is formed and from which the electrode portion 11 is exposed through the opening 7 is obtained.

[Steps (1 ′) and (2 ′)]
In steps (1) to (4), the organic component layer and the dry film resist layer are laminated after the formation of the opening of the solder resist layer, but instead of these steps, steps (1 ′) and (2 ′) May be performed. Step (1 ′) is a step of laminating a solder resist layer, an organic component layer, and a dry film resist layer on the surface of the substrate on which the soldering portion is provided. The arrangement of each layer can be performed in the same manner as in steps (1) to (3). Step (2 ′) is a step of forming a soldering opening in the laminate of step (1 ′) so that the soldering portion is exposed. About formation of an opening part, it can carry out similarly to process (1) and (4).

[Step (5)]
Step (5) is a step of filling the opening formed in step (4) or (2 ′) with a solder bump forming material. In one or a plurality of embodiments, the solder bump forming material is a solder paste, and can be filled by, for example, a paste printing method (FIG. 1B). In addition, the solder bump forming material is a solder ball in one or a plurality of embodiments, and can be filled by, for example, a ball mounting method (FIG. 2B).

  In one or a plurality of embodiments, the solder paste includes (a) a solder paste containing a tin salt and a metal salt such as lead, copper, silver, or (b) a tin powder and silver ions and copper ions. Examples thereof include a solder paste containing at least one selected from a complex of at least one selected from arylphosphines, alkylphosphines and azoles. The metal salt of (a) and the complex of (b) can be mixed and used. The term “tin powder” includes, for example, tin-silver tin alloy powder containing silver, tin-copper tin alloy powder containing copper, and the like in addition to metal tin powder. Examples of the metal salt include organic carboxylates and organic sulfonates.

The solder alloy contained in the solder bump forming material is typically a tin-based solder alloy, but non-tin solder alloys such as indium alloys can also be used in the present disclosure. Conventional common tin-lead eutectic solder alloy particles can also be used, but lead-free solder alloy particles are preferably used. Preferred lead-free solder alloys include tin-silver, tin-copper, and tin-silver-copper. Typical composition examples are as follows (% is% by mass):
Sn: balance, Ag: 0.3%, Cu: 0.5%
Sn: balance, Ag: 3.5%, Cu: 0.7%
Sn: remainder, Ag: 3.5%
Sn: remainder, Cu: 0.7%.

  The solder paste can be further mixed with a flux component and a solvent. As a flux component, what is normally used for solder materials, such as a tin-lead system, a tin-silver system, and a tin-copper system, can dissolve other ingredients in a composition as a solvent, There is no particular limitation as long as the viscosity and concentration can be adjusted. By the step (5), as in one or a plurality of embodiments shown in FIG. 1B, the solder resist layer 1, the organic component layer 3 and the dry film resist 2 are formed on the surface of the circuit board 10, and A circuit board 10 in which the opening 7 on the electrode part 2 on the surface of the circuit board 1 is filled or arranged with the solder forming material 5 can be obtained. Alternatively, the solder resist layer 1, the organic component layer 3 and the dry film resist 2 are formed on the surface of the circuit board 10 by the step (5) as in one or a plurality of embodiments shown in FIG. Further, the circuit board 10 in which the solder balls 4 are filled or arranged in the opening 7 on the electrode part 2 on the surface of the circuit board 1 can be obtained.

[Step (6)]
Step (6) is a step of heating and melting the solder bump forming material filled in step (5) to fix the solder bumps to the soldering portion. In one or a plurality of embodiments, the heating temperature may be 200 ° C. or higher and 200 ° C. to 260 ° C. in consideration of the heat resistance of the circuit board. The liquidus temperature of the solder bump forming material is usually 200 ° C. or higher, and the heating temperature is higher than the liquidus temperature of the solder bump forming material and the heat resistance of the circuit board in one or more other embodiments. Considering the liquidus temperature to 260 ° C. or less in consideration. The heating time is determined according to the composition of the solder bump forming material and the like, and in one or more embodiments, is preferably about 30 seconds to 10 minutes, more preferably about 1 minute to 5 minutes. From the viewpoint of circuit board productivity, it is preferable to fix the bumps by a single heat treatment. By the step (6), the solder resist layer 1, the organic component layer 3, the dry film resist 2, and the opening 7 are formed on the surface of the circuit board 10 as in one or a plurality of embodiments shown in FIG. Thus, a substrate having the solder bumps 6 formed on the electrode portions 11 can be obtained.

[Step (7)]
Step (7) is a step of removing the dry film resist of the circuit board obtained in step (6). Examples of the peeling method include cleaning using a cleaning agent in one or a plurality of embodiments. Examples of the cleaning means include an ultrasonic cleaning method, a spray method, an immersion rocking method, an immersion method, and a hand wiping method. The washing | cleaning means of these is mentioned. These means may be used alone or in combination as appropriate according to the type of circuit board. From the viewpoint of suppressing the influence on the circuit board and the viewpoint of cleanability, the spray method, the immersion rocking method or the immersion method is preferable.

  The cleaning agent in the step (7) is preferably an alkaline solution from the viewpoint of improving the peelability of the dry film resist, and is not particularly limited, and a cleaning agent capable of peeling the dry film resist layer can be used. The pH of the cleaning agent is preferably 10.0 or higher, more preferably 11.0 or higher, still more preferably 12.0 or higher, preferably 14.0 or lower, from the viewpoint of improving the peelability of the dry film resist. Preferably it is 13.5 or less, More preferably, it is 13.0 or less. The temperature during washing in the step (7) is preferably 25 ° C. or higher, more preferably 40 ° C. or higher, from the viewpoint of improving the peelability of the dry film resist. Further, from the viewpoint of suppressing evaporation of moisture, 90 ° C. or lower is preferable, and 80 ° C. or lower is more preferable. From the viewpoint of improving the peelability of the dry film resist, the cleaning time in the step (7) is preferably 1 minute or longer, more preferably 3 minutes or longer, further preferably 5 minutes or longer, and a viewpoint of shortening the circuit board manufacturing time. Therefore, 30 minutes or less is preferable, and 20 minutes or less is more preferable.

  By the step (7), a substrate in which the solder bumps 6 are formed on the electrode portions 11 on the surface of the circuit substrate 10 can be obtained as in one or a plurality of embodiments shown in FIG. 1 and FIG. After the step (7), if the organic component layer remains, it can be removed by washing as appropriate. Further, if necessary, the solder bumps 6 may be fluttered as in one or a plurality of embodiments shown in FIGS.

[Join electronic components]
In one or a plurality of embodiments, the method for manufacturing a circuit board according to the present disclosure further includes placing an electronic component on the board obtained in the step (7), and a liquidus temperature of the solder bump of 260 ° C. or lower. Heating the temperature to join the soldered part of the electronic component and the soldered part of the substrate to obtain a substrate to which the electronic component is joined. According to this embodiment, a circuit board to which electronic components are bonded can be manufactured.

  Regarding the above-described embodiment, the present disclosure further discloses a composition, a production method, or an application according to one or more of the following embodiments.

<1> A liquid organic component having a weight change of not more than 4.0% at 250 ° C. for 30 minutes between a solder resist layer and a dry film resist layer formed on the substrate surface. viscosity includes forming a layer of liquid organic component is less than 80 mm ² / s or more 120000mm ² / s, the manufacturing method of the circuit board.

<2> A circuit board manufacturing method including the following steps (1) to (7).
Step (1): A step of forming a solder resist layer on the surface of the substrate on which the soldering portion is provided, and forming a soldering opening so that the soldering portion is exposed.
Step (2): A liquid organic component having a weight change of 4.0% or less on standing at 250 ° C. for 30 minutes on the solder resist layer, and having a kinematic viscosity of 80 mm ² / s to 120,000 mm ² / s. The process of forming the layer of the liquid organic substance component which is the following.
Step (3): A step of forming a dry film resist layer on the organic component layer.
Step (4): A step of forming a soldering opening communicating with the opening in the step (1) so that the soldering portion is exposed in the dry film resist layer and the organic component layer.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

<3> A circuit board manufacturing method including the following steps (1 ′), (2 ′), and (5) to (7).
Step (1 ′): A solder resist layer is formed on the surface of the substrate on which the soldering portion is provided, and a liquid state having a weight change of 4.0% or less after standing at 250 ° C. for 30 minutes on the solder resist layer. be organic component, the step of kinematic viscosity 80 mm ² / s or more 120000mm ² / s to form a layer of liquid organic component or less, to form a dry film resist layer on the layer of the organic components.
Step (2 ′): a step of forming a soldering opening in the solder resist layer, the organic component layer, and the dry film resist layer so that the soldering portion is exposed.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.

<4> The weight change of the liquid organic component after standing at 250 ° C. for 30 minutes is preferably 3.5% or less, more preferably 3.0% or less, still more preferably 2.0% or less, and further The production method according to any one of <1> to <3>, which is preferably 1.5% or less, and more preferably 1.3% or less.
<5> The production according to any one of <1> to <4>, wherein the liquid organic component has a kinematic viscosity at 25 ° C. of preferably 90 mm ² / s or more, more preferably 100 mm ² / s or more. Method.
<6> a kinematic viscosity at 25 ° C. of the liquid organic components, preferably 100,000 mm ² / s or less, more preferably 12000 mm ² / s or less, more preferably 11000mm ² / s or less, even more preferably 10000 mm ² / The production method according to any one of <1> to <5>, which is s or less.
<7> a kinematic viscosity at 25 ° C. of the liquid organic components, 80 mm ² / s or more 120000mm ² / s or less, preferably 80 mm ² / s or more 100,000 mm ² / s or less, more preferably 80 mm ² / s or more 12000mm ² / s or less, more preferably 90 mm ² / s or more 11000Mm ² / s or less, and more preferably not more than 100 mm ² / s or more 10000 mm ² / s, a process according to any one of <6><1> .
<8> The method according to any one of <1> to <7>, wherein the liquid organic component is silicone oil.
<9> The method according to <8>, wherein the liquid organic component is at least one selected from the group consisting of methylphenyl silicone oil, dimethyl silicone oil, and polyether-modified silicone having an HLB of 11 to 17. .
<10> The method according to <9>, wherein the polyether-modified silicone has an HLB of preferably 8 or more, more preferably 10 or more, still more preferably 11 or more, and even more preferably 12 or more.
<11> The method according to <9> or <10>, wherein the polyether-modified silicone has an HLB of preferably 18 or less, more preferably 17 or less, and still more preferably 16 or less.
<12> The HLB of the polyether-modified silicone is preferably 8 or more and 18 or less, more preferably 10 or more and 18 or less, further preferably 11 or more and 17 or less, and further preferably 12 or more and 16 or less, from <9> to <11> The manufacturing method in any one of.
<13> The liquid organic component layer preferably has a thickness of 0.1 μm to 50 μm, more preferably 0.3 μm to 20 μm, still more preferably 0.5 μm to 10 μm, and still more preferably 0.8 μm. The production method according to any one of <1> to <12>, which is 8 μm or more and 5 μm or less, and more preferably about 1 μm.
<14> The production method according to any one of <2> to <13>, wherein an alkaline solution is used in the step of peeling the dry film resist layer.
<15> The method according to any one of <1> to <14>, wherein the method of forming the organic component layer is a method of applying the liquid organic component to a solder resist layer surface.

  The following examples are intended to illustrate the present disclosure and are not intended to limit the present disclosure in any way. In Examples,% is% by mass unless otherwise specified.

Example 1
<Evaluation board creation method>
A solder resist substrate (solder resist: AUS SR-1, manufactured by Taiyo Ink Co., Ltd., base material: FR-4) in which an opening of a solder resist layer was formed in a soldered portion was prepared. A 1% solution of methyl phenyl silicone oil (25 ° C. kinematic viscosity 100 mm ² / s) (KF-50-100cs, manufactured by Shin-Etsu Chemical Co., Ltd.) in a theoretical amount of 1 μm in thickness was applied to this substrate. A dry film resist (manufactured by DuPont) from which the cover film had been peeled was pressure bonded with a mini roller heated to 100 ° C. An opening pattern was placed on the substrate, exposed (irradiated with 1000 mJ), and developed (1 wt% sodium carbonate aqueous solution, 30 seconds rinse twice).
Thereafter, in an actual circuit board manufacturing method, a solder bump forming material is put into the opening and melted by heating to fix the solder bump in the opening. Here, as a model experiment, a solder bump forming material was not used, and a solder melting temperature was assumed, and this was left in an electric furnace at 240 ° C. for 5 minutes.

<Measurement of kinematic viscosity>
It measured with the Ubbelohde viscometer by the method of JISZ8803.

<Evaluation of adhesion>
About the evaluation board | substrate which left still at room temperature for half a day, the peeling state of the dry film resist was observed visually, and adhesiveness was evaluated (the following is the same).
○: Good ・ ・ No dry film resist peeling part × ： Bad ・ ・ Dry film resist peeling part

<Evaluation of peelability>
After sonication (38 kHz) for 8 minutes in a 50 ° C. stripping solution (mixed aqueous solution of TMAH and monoethanolamine), the dry film resist surface was showered with ion-exchanged water at 40 ° C. for 5 minutes, and then at room temperature. Ion-exchanged water was showered for 1 minute, and drained and dried using a nitrogen blow. The substrate after drying was photographed, and the area of the remaining dry film resist was judged to evaluate the peelability (the same applies hereinafter).
○: Good ・ ・ Residual area 1% or less △: Between good and bad: Residual area>1%> 10% or less ×: Defective ・ ・ Residual area> 10%

<Evaluation of heat resistance of third layer>
Methyl phenyl silicone oil (100 mm ² / s, 25 ° C. kinematic viscosity, the same applies hereinafter) (KF-50-100cs, manufactured by Shin-Etsu Chemical Co., Ltd.) is placed in a constant temperature dryer (DRS420DA, manufactured by Advantech Toyo Co., Ltd.) at 250 ° C. under atmospheric pressure for 30 minutes. The sample was allowed to stand and the change in weight before and after heating was measured with an electronic balance to evaluate the heat resistance (the same applies hereinafter).
○: Good ・ ・ Change in weight is 4% or less × ： Defective ・ ・ Change in weight exceeds 4%

(Example 2)
In Example 1, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co.) octane 1% solution was added to dimethyl silicone oil (1000 mm ² / s) (KF-96-1000 cs manufactured by Shin-Etsu Chemical Co., Ltd.). The adhesiveness and peelability of the dry film resist were evaluated by changing to a 1% octane solution. Further, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs made by Shin-Etsu Chemical Co., Ltd.) was changed to dimethyl silicone oil (1000 mm ² / s) (KF-96-1000 cs made by Shin-Etsu Chemical Co., Ltd.), and heat resistance was improved. Was evaluated.

(Example 3)
In Example 1, a 1% solution of methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co.) octane was added to dimethyl silicone oil (10,000 mm ² / s) (KF-96- manufactured by Shin-Etsu Chemical Co., Ltd.). The change was made to a 10,000 cs) 1% octane solution, and the adhesion and peelability of the dry film resist were evaluated. Further, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) is changed to dimethyl silicone oil (10,000 mm ² / s) (KF-96-10,000 cs manufactured by Shin-Etsu Chemical Co., Ltd.). The heat resistance was evaluated.

Example 4
In Example 1, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co.) octane 1% solution was added to dimethyl silicone oil (100,000 mm ² / s) (KF-96- manufactured by Shin-Etsu Chemical Co., Ltd.). In addition to a 100,000 cs) 1% octane solution, the adhesion and peelability of the dry film resist were evaluated. Further, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) is changed to dimethyl silicone oil (100,000 mm ² / s) (KF-96-100,000 cs manufactured by Shin-Etsu Chemical Co., Ltd.). The heat resistance was evaluated.

(Reference Example 1)
In Example 1, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) octane 1% solution was changed to polyvinyl alcohol (commercial stationery water) 1% aqueous solution, and dry film resist adhesion And peelability were evaluated. Further, the methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) was changed to polyvinyl alcohol (special grade of Wako Pure Chemical Industries), and the heat resistance was evaluated. Since the evaluation of heat resistance here was poor, the kinematic viscosity of a 1% aqueous solution of polyvinyl alcohol (commercial stationery water paste) was not measured.

(Comparative Example 1)
In Example 1, the adhesion and peelability of the dry film resist were evaluated without using a methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs, manufactured by Shin-Etsu Chemical Co., Ltd.) octane 1% solution.

  Table 1 shows the results of the viscosity and heat resistance of the third layer in Examples 1 to 4, Reference Example 1 and Comparative Example 1, and the adhesion and peelability of the dry film resist.

  As shown in Table 1, Examples 1 to 4 were superior in releasability of the dry film resist as compared to Reference Example 1 and Comparative Example 1. Moreover, it turned out that Examples 1-3 are further excellent in peelability compared with Example 4. FIG.

(Example 5)
In Example 1, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co.) octane 1% solution was converted to polyether-modified silicone (180 mm ² / s, HLB 4) (KF- manufactured by Shin-Etsu Chemical Co., Ltd.) 6020) The adhesion and peelability of the dry film resist were evaluated in place of IPA 1%. Further, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) was changed to polyether-modified silicone (180 mm ² / s, HLB 4) (KF-6020 manufactured by Shin-Etsu Chemical Co., Ltd.) The heat resistance was evaluated.

(Example 6)
In Example 1, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) 1% octane solution was changed to polyether-modified silicone (150 mm ² / s, HLB 12) (KF- manufactured by Shin-Etsu Chemical Co., Ltd.) 355A) The dry film resist was evaluated for adhesion and peelability by changing to IPA 1%. Further, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) was changed to polyether-modified silicone (150 mm ² / s, HLB 12) (KF-355A manufactured by Shin-Etsu Chemical Co., Ltd.) The heat resistance was evaluated.

(Example 7)
In Example 1, methyl phenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) 1% solution of octane was changed to polyether-modified silicone (200 mm ² / s, HLB 16) (KF- manufactured by Shin-Etsu Chemical Co., Ltd.). 354L) The adhesiveness and peelability of the dry film resist were evaluated by changing to a 1% octane solution. Further, methylphenyl silicone oil (100 mm ² / s) (KF-50-100cs manufactured by Shin-Etsu Chemical Co., Ltd.) was changed to polyether-modified silicone (200 mm ² / s, HLB 16) (KF-354L manufactured by Shin-Etsu Chemical Co., Ltd.) The heat resistance was evaluated.

  Table 2 shows the results of HLB, viscosity, heat resistance, and adhesion and peelability of the dry film resist of the third layer in Examples 5 to 7.

  As shown in Table 2, Examples 5 to 7 were excellent in the peelability of the dry film resist as compared with Reference Example 1 and Comparative Example 1. Moreover, it turned out that Example 6 and 7 are excellent in adhesiveness compared with Example 5. FIG.

DESCRIPTION OF SYMBOLS 1 Solder resist layer 2 Dry film resist layer 3 Organic component layer 4 Solder ball 5 Solder forming material 6 Solder bump 7 Opening part 10 Circuit board 11 Electrode part

Claims (7)

A method for producing a circuit board, which is a liquid organic substance having a weight change of not more than 4.0% after standing at 250 ° C. for 30 minutes between a solder resist layer and a dry film resist layer formed on the substrate surface. a component, kinematic viscosity comprises forming a layer of liquid organic component is less than 80 mm ² / s or more 120000mm ² / s, the production method. A circuit board manufacturing method including the following steps (1) to (7).
Step (1): A step of forming a solder resist layer on the surface of the substrate on which the soldering portion is provided, and forming a soldering opening so that the soldering portion is exposed.
Step (2): A liquid organic component having a weight change of 4.0% or less on standing at 250 ° C. for 30 minutes on the solder resist layer, and having a kinematic viscosity of 80 mm ² / s to 120,000 mm ² / s. The process of forming the layer of the liquid organic substance component which is the following.
Step (3): A step of forming a dry film resist layer on the organic component layer.
Step (4): A step of forming a soldering opening communicating with the opening in the step (1) so that the soldering portion is exposed in the dry film resist layer and the organic component layer.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer. A circuit board manufacturing method including the following steps (1 ′), (2 ′), and (5) to (7).
Step (1 ′): A solder resist layer is formed on the surface of the substrate on which the soldering portion is provided, and a liquid state having a weight change of 4.0% or less after standing at 250 ° C. for 30 minutes on the solder resist layer. be organic component, the step of kinematic viscosity 80 mm ² / s or more 120000mm ² / s to form a layer of liquid organic component or less, to form a dry film resist layer on the layer of the organic components.
Step (2 ′): a step of forming a soldering opening in the solder resist layer, the organic component layer, and the dry film resist layer so that the soldering portion is exposed.
Step (5): A step of putting a solder bump forming material into the soldering opening.
Step (6): A step of heating and melting the solder bump forming material to fix the solder bumps to the soldered portion.
Step (7): A step of peeling off the dry film resist layer.   The manufacturing method in any one of Claim 1 to 3 whose said liquid organic substance component is silicone oil.   The manufacturing method according to claim 4, wherein the liquid organic component is at least one selected from the group consisting of methylphenyl silicone oil, dimethyl silicone oil, and polyether-modified silicone having an HLB of 11 to 17.   The manufacturing method according to any one of claims 2 to 5, wherein an alkaline solution is used in the step of peeling the dry film resist layer.   The manufacturing method according to any one of claims 1 to 6, wherein the method of forming the organic component layer is a method of applying the liquid organic component on a solder resist layer surface.

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