JP2016096209A - Wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can achieve thinning of a wiring part.SOLUTION: A manufacturing method of a wiring board 1 comprises: a first process of filling a recess 61 of an engraved plate 6 with a first resin material 62 and causing cure shrinkage of the first resin material 62 to form a first cured resin 621 having a depressed part 63 which is depressed toward a bottom of the recess 61; a second process of filling the depressed part 63 with a conductive material 64; and a third process of demolding the first cured resin 621 and the conductive material 64 from the engraved plate 6.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing a wiring board.

  There is known a circuit pattern formed by filling an intaglio groove with an organometallic ink and then transferring the organometallic ink to a printing medium via a curable resin (see, for example, Patent Document 1).

JP-A-4-240792

  In the above technique, a part of the organometallic ink filled in the groove portion of the intaglio may remain in the groove portion during transfer. For this reason, there is a problem that it is difficult to make the circuit pattern thinner.

  The problem to be solved by the present invention is to provide a method of manufacturing a wiring board capable of thinning a wiring part.

  [1] In the method for manufacturing a wiring board according to the present invention, the concave portion of the intaglio is filled with the first resin material, the first resin material is cured and contracted, and the concave portion recessed toward the bottom of the concave portion is formed. A first step of forming a first cured resin having a second step of filling the recess with a conductive material, and a first step of releasing the first cured resin and the conductive material from the intaglio. And 3 processes.

  [2] In the above invention, the second step may include curing the conductive material filled in the recess.

  [3] In the above invention, after the second step, the method further includes a step of forming a second cured resin by applying and curing a second resin material on the intaglio, the third step The second cured resin and the conductive material are separated from the intaglio in a state where the second cured resin is fixed to the first cured resin and the conductive material. May be released from the intaglio.

  [4] In the above invention, the first resin material and the second resin material may have the same composition.

  [5] In the above invention, after the second step, the method further includes a step of disposing a base material on the intaglio via an adhesive, and the third step includes the base material passing through the adhesive. Then, the first cured resin and the conductive material may be released from the intaglio by releasing the substrate from the intaglio in a state of being fixed to the first cured resin and the conductive material.

  [6] In the above invention, the intaglio has a plurality of the recesses, and the first step is to apply the first resin material to the surface of the intaglio between the adjacent recesses. It may include curing.

  [7] In the above invention, the first resin material may be a colored material, and the first step may include filling only the concave portion with the first resin material.

  According to the present invention, the conductive material is filled into the recess formed when the first resin material filled in the concave portion of the intaglio is cured and shrunk. Thereby, it is possible to reduce the thickness of the wiring portion while preventing the conductive material from remaining in the concave portion of the intaglio when releasing the mold.

FIG. 1 is a cross-sectional view showing a wiring board according to the first embodiment of the present invention. FIG. 2 is a view showing a modification of the wiring board in the first embodiment of the present invention. FIG. 3A to FIG. 3F are cross-sectional views showing a method for manufacturing a wiring board in the first embodiment of the present invention. FIG. 4 is a cross-sectional view showing a wiring board according to the second embodiment of the present invention. FIG. 5A to FIG. 5E are cross-sectional views showing a method for manufacturing a wiring board in the second embodiment of the present invention. FIG. 6 is a cross-sectional view showing a wiring board according to the third embodiment of the present invention. FIG. 7A to FIG. 7E are cross-sectional views illustrating a method for manufacturing a wiring board according to a third embodiment of the present invention. FIG. 8 is a cross-sectional view showing a wiring board according to the fourth embodiment of the present invention. FIG. 9A to FIG. 9E are cross-sectional views illustrating a method for manufacturing a wiring board in the fourth embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< first embodiment >>
FIG. 1 is a cross-sectional view showing a wiring board in this embodiment, and FIG. 2 is a view showing a modification of the wiring board in this embodiment.

  The wiring board 1 in the present embodiment is used as an electrode substrate of a touch panel, and includes a base material 2, an adhesive part 3, a wiring part 4, and a covering part 5, as shown in FIG. In the present embodiment, although not particularly illustrated, the thin wire constituting the mesh electrode provided on the base material 2 is formed by the wiring portion 4. In addition, the use of the wiring board 1 is not specifically limited. For example, the wiring substrate 1 may be used as the electrode substrate of the touch sensor.

  In this embodiment, the base material 2 is comprised from the film made from a polyethylene terephthalate (PET). In addition, the material which comprises the base material 2 is not specifically limited to this. For example, you may comprise the base material 2 using materials, such as a polyethylene naphthalate (PEN), a polyimide resin (PI), and a polyetherimide resin (PEI).

  The adhesion part 3 is a member that adheres and fixes the substrate 2, the wiring part 4 and the covering part 5 to each other. For example, a thermosetting resin, a thermoplastic resin, a UV curable resin, a ceramic green sheet Etc., and is provided on the main surface 21 of the substrate 2 with a substantially constant thickness.

  In the present embodiment, the upper surface of the bonding portion 3 (the surface on which the wiring portion 4 and the covering portion 5 are provided) is a flat surface, but is not particularly limited thereto. For example, as shown in FIG. 2, a convex portion 32 may be formed at a position corresponding to the wiring portion 4. The convex portion 32 is formed between the main surface 21 of the substrate 2 and the wiring portion 4 so as to protrude along the protruding direction of the wiring portion 4. For this reason, the thickness (height) H1 of the adhesive portion 3 at the top of the convex portion 32 is larger than the thickness (height) H2 of the adhesive portion 3 at a portion where the convex portion 32 is not provided ( H1> H2).

  The wiring part 4 is made of a conductive material containing conductive particles made of, for example, silver or copper, and is provided on the main surface 31 of the bonding part 3. In the present embodiment, the wiring portions 4 are provided at three positions on the main surface 31 of the bonding portion 3 at substantially equal intervals. However, the number of wiring portions 4 provided on the main surface 31 of the bonding portion 3 and The arrangement is not particularly limited to this.

  The width of the wiring part 4 is preferably 50 nm to 300 μm, more preferably 500 nm to 150 μm, and still more preferably 1 μm to 100 μm from the viewpoint of improving the formation accuracy of the wiring part 4. The height of the wiring part 4 is preferably 50 nm to 300 μm, more preferably 500 nm to 150 μm, and still more preferably 1 μm to 100 μm.

  The wiring part 4 in the present embodiment is formed so as to protrude from the main surface 31 of the bonding part 3 toward the upper side in FIG. Although the cross-sectional shape of the wiring part 4 in this embodiment is substantially semi-elliptical, it is not particularly limited to this. For example, the cross-sectional shape of the wiring part 4 may be a polygonal shape, a shape formed by collecting small pieces of conductive material, or the like. In the present embodiment, the plurality of wiring portions 4 provided on the main surface 31 of the bonding portion 3 have substantially the same cross-sectional shape, but the plurality of wiring portions 4 have different cross sections. Each may have a shape.

  The covering portion 5 is made of a resin material such as a thermosetting resin, a thermoplastic resin, or a UV curable resin, glass obtained by a sol-gel method, and the like. The wiring covering portion 51, the main surface covering portion 52, have. In addition, from the viewpoint of suppressing the occurrence of warping of the wiring substrate 1 caused by the difference in thermal expansion coefficient between the covering portion 5 and the bonding portion 3, the material constituting the covering portion 5 has the same composition as the material constituting the bonding portion 3. It is preferable to do.

  The wiring covering portion 51 covers the entire outer surface of the wiring portion 4 excluding the bonding surface with the bonding portion 3, and has a trapezoidal shape that becomes narrower in the protruding direction of the wiring portion 4 as shown in FIG. It has a cross-sectional outer shape. That is, the cross-sectional outer shape of the wiring covering portion 51 is bonded from the top side 511 formed so as to be substantially parallel to the main surface 21 of the substrate 2 and the main surface 31 of the bonding portion 3, and from both ends of the top side 511. And side sides 512 formed so as to be wider toward the main surface 31 of the portion 3. For this reason, the corner | angular part 513 formed in the both ends of the top side 511 is 90 degree | times or more. The cross-sectional outer shape of the wiring covering portion 51 is not particularly limited to the above.

  As shown in FIG. 1, the main surface covering portion 52 covers the entire main surface 31 of the bonding portion 3 with a substantially constant thickness except for the wiring portion 4 and the wiring covering portion 51 that covers the wiring portion 4. ing. That is, between the adjacent wiring portions 4, the main surface covering portion 52 covers the main surface 21 of the base material 2 via the bonding portion 3. The main surface covering portion 52 is continuous with the wiring covering portion 51. In the present embodiment, the main surface covering portion 52 and the wiring covering portion 51 are integrally formed. The height (thickness) D1 of the main surface covering portion 52 is smaller than the height (thickness) D2 of the wiring covering portion 51, and the wiring covering portion 51 protrudes from the end of the main surface covering portion 52. Yes.

  In the present embodiment, the cross-sectional outer shapes of the wiring covering portions 51 that respectively cover the three wiring portions 4 provided on the main surface 31 of the bonding portion 3 are substantially the same shape, but are not particularly limited thereto. For example, the cross-sectional outlines of the plurality of wiring covering portions 51 may be different from each other.

  Next, the manufacturing method of the wiring board 1 in this embodiment is demonstrated. FIG. 3A to FIG. 3F are cross-sectional views for explaining a method for manufacturing a wiring board in the present embodiment.

First, as shown in FIG. 3 (A), an intaglio 6 having a recess 61 corresponding to the pattern of the wiring portion 4 to be formed is prepared. Examples of the material constituting the intaglio 6 include metal materials such as silicon (Si), silica (SiO ₂ ), glassy carbon, nickel, and ceramics.

  The recess 61 in the present embodiment has a tapered shape, and the width of the bottom of the recess 61 is smaller than the width of the opening of the recess 61. The surface of the intaglio 6 is preferably preliminarily subjected to a release film treatment for improving the release property.

  Subsequently, the first resin material 62 for forming the covering portion 5 is filled in the concave portion 61 of the intaglio 6 and applied to the main surface 60 of the intaglio 6 with a predetermined thickness. Examples of the first resin material 62 include an uncured or semi-cured state and a transparent or semi-transparent thermosetting resin, thermoplastic resin, and UV curable resin. Specific examples include resin materials such as acrylic resin, polyimide resin, epoxy resin, and ceramic-containing resin. When the concave portion 61 of the intaglio 6 has a tapered shape as in this embodiment, the first resin material 62 can be easily filled into the concave portion 61. In addition, when the 1st resin material 62 for forming the coating | coated part 5 has adhesiveness or adhesiveness after hardening shrinkage | contraction, formation of the adhesion part 3 (process shown in FIG.3 (D)) is abbreviate | omitted. can do.

  Examples of the method for filling the first resin material 62 into the recess 61 include screen printing, spray coating, bar coating, dipping, injection, sputtering, CVD, and vapor deposition. .

  Subsequently, the first resin material 62 is filled in the concave portion 61 of the intaglio 6 and the first resin material 62 applied to the main surface 60 of the intaglio 6 is cured and contracted to form the first cured resin 621 ( First step). The first hardened resin 621 covers the main surface 60 and the inner wall surface of the recess 61 (see FIG. 3B). The first cured resin 621 covering between the recesses 61 of the intaglio 6 has a substantially uniform thickness. Further, the first cured resin 621 covering the inner wall surface of the recess 61 forms a recess 63 having a substantially U-shaped cross section that is recessed toward the bottom of the recess 61. The covering portion 5 of the wiring board 1 is configured by the first cured resin 621.

  Specific conditions for curing and shrinking the first resin material 62 include, for example, a nickel intaglio 6 in which a recess 61 having a width of 5 μm and a depth of 5 μm is formed, and using a screen printing method. When acrylic resin is filled and applied to the recess 61 as the first resin material 62, the first resin material 62 can be heated at 120 degrees for 5 minutes. Note that when the first resin material 62 is filled and applied to the intaglio 6 by sputtering, CVD, or vapor deposition, the above-described curing shrinkage step of the first resin material 62 can be omitted.

  Next, as shown in FIG. 3C, the recess 63 formed in the recess 61 is filled with a conductive material 64 for forming the wiring portion 4 (second step). As such a conductive material 64, a conductive paste configured by mixing conductive particles such as silver and copper with a binder resin and a solvent can be exemplified. Examples of the binder resin contained in the conductive material 64 include a phenol resin, a polyester resin, and an epoxy resin. Examples of the solvent contained in the conductive material 64 include butyl carbitol acetate, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, and tetradecane. Examples of the method for filling the recess 63 with the conductive material 64 include a screen printing method, a spray coating method, and an ink jet method. In the case where the conductive material 64 includes a binder resin, the binder resin is not included in any of the first resin material and the second resin material of the present invention.

  Then, the wiring part 4 is formed by hardening the conductive material 64 using heat, UV light, electromagnetic waves, or the like. As specific conditions for curing the conductive material 64, for example, when a paste containing silver particles and an epoxy resin (binder resin) is used, the conductive material 64 is heated at 150 degrees for 10 minutes. This can be done.

  In the case where the protrusions 32 (see FIG. 2) are formed on the bonding part 3, a conductive material containing a binder resin (for example, an acrylic resin) having a relatively large volume shrinkage after curing as the conductive material 64. Is used.

  Next, as shown in FIG. 3D, an adhesive 65 for forming the adhesive portion 3 is applied from above the covering portion 5 and the wiring portion 4. Examples of the adhesive 65 include a thermosetting resin, a thermoplastic resin, a UV curable resin, and a ceramic green sheet. Examples of the method for applying the adhesive 65 include screen printing, spray coating, and bar coating.

  In addition, when forming the convex part 32 (refer FIG. 2) in the adhesion part 3, it carries out as follows. That is, when the conductive material 64 filled in the concave portion 63 is cured, a concave shape having a substantially U-shaped cross section that is recessed toward the bottom surface of the concave portion 61 is formed in the concave portion 63 due to the shrinkage of the conductive material 64. Is done. And when apply | coating the adhesive material 65, the adhesive material 65 is filled in this concave shape.

  Subsequently, as shown in FIG. 3E, the base material 2 is disposed at a predetermined position on the adhesive material 65. Then, in a state where the base material 2 is in contact with the adhesive material 65, the adhesive material 65 is cured by heating, pressurization, UV irradiation, microwave irradiation, or the like to form the bonding portion 3. Thereby, the base material 2 is fixed to the wiring part 4 and the covering part 5 through the adhesive 65. Specifically, for example, when polyethylene terephthalate (PET) is used as the base material 2 and a UV curable acrylic resin is used as the adhesive material 65, the base material 2 is bonded onto the adhesive material 65. The substrate 2 can be fixed by irradiating UV from the second side.

  Next, as shown in FIG. 3 (F), in a state where the base material 2 is fixed to the covering portion 5 and the wiring portion 4 via an adhesive 65, the wiring portion 4 and the covering portion are separated from the intaglio 6 by separating them. The part 5 (first cured resin 621) is released from the intaglio 6 (third step). The wiring board 1 can be obtained through the above steps.

  Next, the effect | action of the manufacturing method of the wiring board 1 in this embodiment is demonstrated.

  When a wiring board is manufactured by directly filling a concave part of an intaglio with a conductive material constituting the wiring part and transferring the conductive material to a base material, a part of the conductive material is transferred into the concave part during the transfer. In the case where the width of the groove of the concave portion is narrow, the obtained wiring may be disconnected, and it may be difficult to make the wiring portion thin.

  On the other hand, in the present embodiment, when the wiring substrate 1 is manufactured, the first resin material 62 is first filled in the recess 61 of the intaglio 6, and the first resin material 62 is cured and shrunk so that the recess The covering portion 5 having 63 is formed (see FIG. 3B). Then, the recess 63 is filled with a conductive material 64 constituting the wiring portion 4 (see FIG. 3C). At this time, since the covering portion 5 is firmly fixed to the base material 2 through the adhesive portion 3, the covering portion 5 is released without remaining in the concave portion 61 of the intaglio 6. Accordingly, the conductive material 64 filled in the recess 63 is also released from the intaglio 6 without remaining in the recess 61. Thereby, thinning of the wiring part 4 can be achieved while preventing disconnection of the wiring part 4.

  Further, when the wiring board 1 is manufactured, contamination of the intaglio 6 due to the conductive material 64 and the like remaining in the recess 61 of the intaglio 6 can be suppressed.

  Furthermore, since the wiring part 4 is sandwiched between the base material 2 and the covering part 5 via the adhesive part 3, the wiring part 4 is peeled off from the base material 2 due to bending of the wiring board 1 or the like. Can be suppressed, and the wiring portion 4 can be protected from an external impact or the like. In addition, after filling the recessed part 63 with the electroconductive material 64, the convex part 32 is formed in the adhesion part 3 by hardening the said electroconductive material 64 (refer FIG. 2), the adhesion part 3 and the wiring part 4, the boundary between the wiring portion 4 and the bonding portion 3 (convex portion 32) becomes a non-linear shape (for example, an uneven shape such as a curved shape, a wave shape, or a zigzag shape), and the wiring portion 4 Since the contact area between the adhesive portion 3 and the adhesive portion 3 increases, the above effect can be further improved. By increasing the contact area between the bonding portion 3 and the wiring portion 4, it is possible to prevent the wiring portion 4 from being peeled off from the base material 2 due to bending of the wiring substrate 1, etc. Can be protected.

  Moreover, in the wiring board 1 of this embodiment, since the wiring part 4 is coat | covered with the coating | coated part 5, generation | occurrence | production of migration can be suppressed.

<< Second Embodiment >>
FIG. 4 is a cross-sectional view showing a wiring board 1B in the second embodiment, and FIGS. 5A to 5E are cross-sectional views showing a method for manufacturing the wiring board 1B in the second embodiment. Since the wiring board 1B in the second embodiment is the same as the first embodiment described above except that the bonding part 3 is omitted, only the parts different from the first embodiment will be described. The same reference numerals as those of the embodiment are attached and description thereof is omitted.

  As shown in FIG. 4, the wiring board 1 </ b> B in the present embodiment includes a second cured resin 2 </ b> B, a wiring part 4, and a covering part 5. The 2nd cured resin 2B is comprised from the material similar to the base material 2 demonstrated in 1st Embodiment. The wiring part 4 of the wiring board 1B in the present embodiment is directly provided on the main surface 21 of the second cured resin 2B.

  The covering portion 5 includes a wiring covering portion 51 and a main surface covering portion 52 as in the first embodiment. In the present embodiment, the main surface covering portion 52 directly covers the main surface 21 of the second cured resin 2B.

  In addition, it is preferable that the material which comprises the 2nd cured resin 2B, and the material which comprises the coating | coated part 5 are the same compositions. In this case, it is possible to suppress the occurrence of warpage in the wiring board 1B due to the difference in thermal expansion coefficient between the second cured resin 2B and the covering portion 5.

  When manufacturing the wiring board 1B, first, the same process (see FIGS. 3A to 3C) as the manufacturing method of the wiring board 1 described in the first embodiment is performed. That is, after the first resin material 62 is applied to the intaglio 6 and the recess 61 is filled with the first resin material 62 (FIG. 5A), the first resin material 62 is cured and contracted to form the recess. 63 is formed (FIG. 5B). Next, after filling the recess 63 with the conductive material 64, the conductive material 64 is cured to form the wiring portion 4 (FIG. 5C).

  Next, as shown in FIG. 5D, the second resin material 7 is applied on the intaglio 6 through the covering portion 5 and the wiring portion 4. That is, the second resin material 7 is applied on at least the covering portion 5 (first cured resin 621) and the wiring portion 4 (cured conductive material 64). The second resin material 7 is composed of a thermosetting resin, a thermoplastic resin, a UV curable resin, or the like. Examples of the method for applying the second resin material 7 include a screen printing method, a spray coating method, and a bar coating method.

  Subsequently, the applied second resin material 7 is cured to form the second cured resin 2B. As specific curing conditions, for example, when polyimide varnish is used as the second resin material 7, the second resin material 7 can be cured by heating and baking at 300 degrees for 1 hour. Next, the wiring part 4 and the covering part 5 are released from the intaglio 6 by separating the second hardening resin 2B from the intaglio 6 while the second hardening resin 2B is fixed to the covering 5 and the wiring part 4. Thereby, the wiring board 1B can be obtained.

  The manufacturing method of the wiring board 1B in the present embodiment can achieve the same effects as the manufacturing method of the wiring board 1 described in the first embodiment.

  Moreover, in this embodiment, since the adhesion part 3 demonstrated in 1st Embodiment can be abbreviate | omitted, thickness reduction of the wiring board 1B can be achieved.

<< Third Embodiment >>
FIG. 6 is a cross-sectional view showing a wiring board 1C in the third embodiment, and FIGS. 7A to 7E are cross-sectional views showing a method for manufacturing the wiring board 1C in the third embodiment. The wiring board 1C in the third embodiment is the same as the first embodiment described above except that the bonding portion 3 is omitted and a film material having bonding performance is used as a base material. Only the parts different from the embodiment will be described, and the same reference numerals as those in the first embodiment will be attached and the description thereof will be omitted.

  As shown in FIG. 6, the wiring board 1 </ b> C in this embodiment includes a base material 2 </ b> C, a wiring part 4, and a covering part 5.

  The base material 2C is composed of a film having adhesive performance. Examples of the material constituting such a film include a thermosetting resin, a thermoplastic resin, and a UV curable resin. Moreover, you may use an adhesive film as the base material 2C.

  When manufacturing the wiring substrate 1 </ b> C, first, the same process (see FIGS. 3A to 3C) as the manufacturing method of the wiring substrate 1 described in the first embodiment is performed. That is, after the first resin material 62 is applied to the intaglio 6 and the recess 61 is filled with the first resin material 62 (FIG. 7A), the first resin material 62 is cured and contracted to form the recess. 63 is formed (FIG. 7B). Next, after filling the recess 63 with the conductive material 64, the conductive material 64 is cured to form the wiring portion 4 (FIG. 7C).

  Next, as shown in FIG. 7D, the base material 2C is arranged from above the covering part 5 and the wiring part 4, and the base part 2C is heated, irradiated with UV, etc. The base material 2C is fixed to each other. When the base material 2 </ b> C is configured using an adhesive film, the covering portion 5 and the base material 2 </ b> C are fixed to each other using the adhesiveness of the film.

  Subsequently, the wiring part 4 and the covering part 5 are released from the intaglio 6 by separating the base 2C from the intaglio 6 in a state where the base 2C is fixed to the covering 5 and the wiring part 4. Thereby, the wiring board 1C can be obtained.

  The manufacturing method of the wiring board 1C in the present embodiment can achieve the same effects as the manufacturing method of the wiring board 1 described in the first embodiment.

  Also in this embodiment, since the bonding portion 3 described in the first embodiment can be omitted, the wiring board 1C can be thinned.

<< Fourth embodiment >>
FIG. 8 is a cross-sectional view showing a wiring board 1D in the fourth embodiment, and FIGS. 9A to 9F are cross-sectional views showing a method for manufacturing the wiring board 1D in the fourth embodiment. The wiring board 1D according to the fourth embodiment is the same as the first embodiment described above except that the main surface covering portion 52 of the covering portion 5 is omitted, and therefore only the portions different from the first embodiment are described. Explanation will be given, and the same reference numerals as those in the first embodiment will be given, and description thereof will be omitted.

  As shown in FIG. 8, the wiring board 1 </ b> D in the present embodiment includes a base material 2, an adhesive part 3, a wiring part 4, and a covering part 5 </ b> B.

  The covering portion 5 </ b> B in the present embodiment is composed only of the wiring covering portion 51. For this reason, the main surface 31 of the bonding part 3 is in a state exposed to the outside of the wiring board 1 </ b> D except for the wiring part 4 and the wiring covering part 51.

  When manufacturing the wiring substrate 1D, first, the concave portion 61 of the intaglio 6 is filled with the first resin material 62 for forming the covering portion 5B (FIG. 9A). At this time, the first resin material 62 is filled only in the concave portion 61 by filling the first resin material 62 so as to be scraped off at the edge of the concave portion 61. After that, the same process as the process for manufacturing the wiring board 1 described in the first embodiment (see FIGS. 3B to 3F) is performed.

  That is, the first resin material 62 is cured and contracted to form the first cured resin 621 (covering portion 5B) having the recess 63 (FIG. 9B). Next, after filling the recess 63 with the conductive material 64, the conductive material 64 is cured to form the wiring portion 4 (FIG. 9C). Thereafter, an adhesive 65 is applied on the wiring part 4 and the covering part 5B (FIG. 9D), and the base material 2 is disposed (FIG. 9E). Next, the adhesive 65 is cured to form the adhesive part 3, and the base material 2 is separated from the intaglio 6 in a state where the base material 2 is fixed to the covering part 5 </ b> B and the wiring part 4 via the adhesive part 3. 4 and the covering portion 5B are released from the intaglio 6 (FIG. 9F). Thereby, wiring board 1D can be obtained.

  The manufacturing method of the wiring board 1D in the present embodiment can also achieve the same effects as the manufacturing method of the wiring board 1 described in the first embodiment.

  Further, in the wiring board 1D of the present embodiment, the covering portion 5B is composed only of the wiring covering portion 51, and the covering portion 5B does not cover the base member 2 and the bonding portion 3, so that the entire wiring substrate 1D transmits light. Can be improved. Therefore, it is possible to improve the visibility when the wiring board 1D is used for a touch panel or the like.

  Furthermore, by using a colored material such as black or white as the material constituting the covering portion 5B, the irregular reflection of light at the wiring portion 4 is suppressed, and the visibility when the wiring board 1D is used for a touch panel or the like is further improved. can do.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, for the wiring boards 1 to 1 </ b> C described in the first to third embodiments, the covering portion 5 may be configured by only the wiring covering portion 51, similarly to the wiring substrate 1 </ b> D described in the fourth embodiment. At this time, the material constituting the covering portion 5 may be a colored material. In these cases, the visibility when the wiring boards 1 to 1C are used for a touch panel or the like can be improved.

  For example, the form of the convex part 32 of the adhesion part 3 described as a modification of the first embodiment may be applied to the wiring boards 1B to 1D described in the second to fourth embodiments. Specifically, as the conductive material 64, a conductive material 64 containing, as a binder resin, a resin having a relatively large volume shrinkage after curing (for example, an acrylic resin) is used. Then, when the conductive material 64 filled in the recess 63 is cured and contracted, the above-described adhesive 65 or the second resin material 7 is filled in the concave shape formed in the recess 63. Accordingly, the wiring boards 1B to 1D may be manufactured.

  In these cases, similarly to the wiring board 1 described in the modification of the first embodiment, the wiring portion 4 is peeled off from the base material 2, 2 </ b> B, 2 </ b> C due to the bending of the wiring boards 1 </ b> B to 1 </ b> D. It can suppress and can improve the effect which protects the wiring part 4 from the impact from the outside, etc. more.

  Further, although not particularly illustrated, the bonding portion 3 may be provided only in the vicinity of the wiring portion 4 of the wiring substrate 1D described in the fourth embodiment. Here, the “vicinity” of the wiring portion 4 refers to a range within about 300% of the width of the wiring portion 4 around the wiring portion 4. For example, such an adhesive portion 3 is formed by forming the adhesive portion 3 on the entire main surface 21 of the base material 2 to produce a wiring board, and then removing the adhesive portion 3 except for the vicinity of the wiring portion 4 by etching or the like. Can be formed. In this case, the light transmittance of the wiring board can be improved, and the visibility when the wiring board is used for a touch panel or the like can be improved.

DESCRIPTION OF SYMBOLS 1, 1B-1D ... Wiring board 2, 2C ... Base material 2B ... 2nd cured resin 21 ... Main surface 3 ... Adhesion part 31 ... Main surface 32 ... Convex Portion 4 ··· Wiring portion 5 ··· Covering portion 51 ··· Wiring covering portion 511 ··· Top side 512 · · · Side edge 513 · · · Corner portion 52 · · · Main surface covering portion 6 ··· Intaglio 61 ... Recess 62 ... First resin material 621 ... First cured resin 63 ... Depression 64 ... Conductive material 65 ... Adhesive 7 ... Second Resin material

Claims (7)

A first step of filling a concave portion of the intaglio with a first resin material, curing and shrinking the first resin material, and forming a first cured resin having a recess that is recessed toward the bottom of the concave portion; ,
A second step of filling the recess with a conductive material;
And a third step of releasing the first cured resin and the conductive material from the intaglio. It is a manufacturing method of the wiring board according to claim 1,
The method of manufacturing a wiring board, wherein the second step includes curing the conductive material filled in the recess. It is a manufacturing method of the wiring board according to claim 1 or 2,
After the second step, further comprising a step of forming a second cured resin by applying and curing a second resin material on the intaglio,
In the third step, the first cured resin is separated from the intaglio in a state where the second cured resin is fixed to the first cured resin and the conductive material. And the manufacturing method of the wiring board characterized by releasing the said electroconductive material from the said intaglio. It is a manufacturing method of the wiring board according to claim 3,
The method for manufacturing a wiring board, wherein the first resin material and the second resin material have the same composition. It is a manufacturing method of the wiring board according to claim 1 or 2,
After the second step, further comprising a step of placing a base material on the intaglio via an adhesive,
In the third step, the first cured resin is formed by separating the substrate from the intaglio in a state where the substrate is fixed to the first cured resin and the conductive material via the adhesive. And the manufacturing method of the wiring board characterized by releasing the said electroconductive material from the said intaglio. A method of manufacturing a wiring board according to any one of claims 1 to 5,
The intaglio has a plurality of the recesses,
The method of manufacturing a wiring board, wherein the first step includes applying and curing the first resin material on a surface of the intaglio between adjacent recesses. A method of manufacturing a wiring board according to any one of claims 1 to 5,
The first resin material is a colored material,
The method of manufacturing a wiring board, wherein the first step includes filling only the concave portion with the first resin material.

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