JP2016085181A5 - - Google Patents

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JP2016085181A5
JP2016085181A5 JP2014219774A JP2014219774A JP2016085181A5 JP 2016085181 A5 JP2016085181 A5 JP 2016085181A5 JP 2014219774 A JP2014219774 A JP 2014219774A JP 2014219774 A JP2014219774 A JP 2014219774A JP 2016085181 A5 JP2016085181 A5 JP 2016085181A5
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Japan
Prior art keywords
detection
wiring
disposed
wiring layer
shield
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JP2014219774A
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Japanese (ja)
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JP2016085181A (en
JP6488639B2 (en
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Priority to JP2014219774A priority Critical patent/JP6488639B2/en
Priority claimed from JP2014219774A external-priority patent/JP6488639B2/en
Priority to US14/886,591 priority patent/US9568313B2/en
Publication of JP2016085181A publication Critical patent/JP2016085181A/en
Priority to US15/388,001 priority patent/US10302430B2/en
Publication of JP2016085181A5 publication Critical patent/JP2016085181A5/ja
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Publication of JP6488639B2 publication Critical patent/JP6488639B2/en
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Description

検出接地端子672bは、支持部651、652にそれぞれ配置されている。支持部651に配置されている検出接地端子672bは、支持部651の中央部に配置されており、梁部661に配置された検出接地配線を介して、検出振動腕621に配置された検出接地電極672aと電気的に接続されている。一方、支持部652に配置されている検出接地端子672bは、支持部652の中央部に配置されており、梁部663に配置された検出接地配線を介して、検出振動腕622に配置された検出接地電極672aと電気的に接続されている。 The detection ground terminal 672b is disposed on the support portions 651 and 652, respectively. The detection ground terminal 672 b disposed in the support portion 651 is disposed in the center of the support portion 651, and the detection ground disposed in the detection vibration arm 621 via the detection ground wiring disposed in the beam portion 661. The electrode 672a is electrically connected. On the other hand, the detection ground terminal 672b disposed in the support portion 652 is disposed in the center portion of the support portion 652, and is disposed in the detection vibration arm 622 through the detection ground wiring disposed in the beam portion 663 . The detection ground electrode 672a is electrically connected.

また、第1配線層72は、配線部721の他に、シールド配線722を有している。シールド配線722は、配線部721の配置を阻害しない限りに第1絶縁層71上に広がって配置されている。また、シールド配線722は、定電位に電気的に接続されている。ここで、定電位とは、グランド電位、または一定の電位に固定された電位のことを意味する。このようなシールド配線722は、第2配線層74とIC3の配線層32との間に位置し、第2配線層74と配線層32との容量結合(第2配線層74と配線層32との間の静電容量)を低減するシールド層として機能する。そのため、シールド配線722を配置することで、S/N比が向上し、角速度をより高精度に検出することのできる電子デバイス1となる。また、ノイズに温度特性がある場合でも、このノイズ自体を低減することができるので、温度特性に優れた電子デバイス1となる。 Further, the first wiring layer 72 includes a shield wiring 722 in addition to the wiring portion 721. The shield wiring 722 is arranged so as to spread on the first insulating layer 71 as long as the arrangement of the wiring part 721 is not hindered. The shield wiring 722 is electrically connected to a constant potential. Here, the constant potential means a ground potential or a potential fixed to a constant potential. Such a shield wiring 722 is located between the second wiring layer 74 and the wiring layer 32 of the IC 3, and capacitive coupling between the second wiring layer 74 and the wiring layer 32 (the second wiring layer 74 and the wiring layer 32 are connected to each other). Functions as a shield layer. Therefore, by arranging the shield wiring 722, the S / N ratio is improved, and the electronic device 1 can detect the angular velocity with higher accuracy. Further, even when the noise has temperature characteristics, the noise itself can be reduced, so that the electronic device 1 having excellent temperature characteristics is obtained.

駆動振動腕521、522には図示しない駆動信号電極が設けられており、IC3から駆動信号電極に発振駆動信号(交番電圧)を印加することで、矢印Dで示す駆動モードが励振される。そして、駆動振動腕521、522が駆動モードで振動しているときに、X軸まわりの角速度ωxが加わると、矢印Eで示す検出モードが励振され、これにより、検出振動腕531、532が振動する。検出振動腕531、532には図示しない検出信号電極が設けられており、この検出信号電極から検出振動腕531、532の振動により生じる検出信号(電荷)が取り出される。そして、取り出された検出信号に基づいてIC3が角速度ωxを検出する。 The drive vibration arms 521 and 522 are provided with drive signal electrodes (not shown), and the drive mode indicated by the arrow D is excited by applying an oscillation drive signal (alternating voltage) from the IC 3 to the drive signal electrodes. When the drive vibration arms 521 and 522 are vibrating in the drive mode, if the angular velocity ωx around the X axis is applied, the detection mode indicated by the arrow E is excited, and the detection vibration arms 531 and 532 vibrate. To do. The detection vibration arms 531 and 532 are provided with detection signal electrodes (not shown), and detection signals (charges) generated by vibrations of the detection vibration arms 531 and 532 are extracted from the detection signal electrodes. Based on the extracted detection signal, the IC 3 detects the angular velocity ωx.

また、振動素子6は、支持部651、652の並び方向がY軸方向と一致するように配置されている。振動素子6は、支持部651、652の並び方向の長さの方が、これに直交する方向(連結腕631、632の延在方向)の長さよりも長いため、このように配置することで、IC3の上面のスペースを有効に活用することができる。そのため、例えば、外縁3a、3bの離間距離を短くすることができ、IC3の小型化を図ることができる。 In addition, the vibration element 6 is disposed so that the arrangement direction of the support portions 651 and 652 coincides with the Y-axis direction. The vibration element 6 is arranged in this manner because the length in the direction in which the support portions 651 and 652 are arranged is longer than the length in the direction perpendicular to the direction (the extending direction of the connecting arms 631 and 632). The space on the upper surface of the IC 3 can be used effectively. Therefore, for example, the distance between the outer edges 3a and 3b can be shortened, and the IC 3 can be downsized.

JP2014219774A 2014-10-28 2014-10-28 Electronic devices, electronic devices, and moving objects Active JP6488639B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014219774A JP6488639B2 (en) 2014-10-28 2014-10-28 Electronic devices, electronic devices, and moving objects
US14/886,591 US9568313B2 (en) 2014-10-28 2015-10-19 Electronic device, electronic apparatus, and moving object
US15/388,001 US10302430B2 (en) 2014-10-28 2016-12-22 Electronic device, electronic apparatus, and moving object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014219774A JP6488639B2 (en) 2014-10-28 2014-10-28 Electronic devices, electronic devices, and moving objects

Publications (3)

Publication Number Publication Date
JP2016085181A JP2016085181A (en) 2016-05-19
JP2016085181A5 true JP2016085181A5 (en) 2017-12-07
JP6488639B2 JP6488639B2 (en) 2019-03-27

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Family Applications (1)

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JP2014219774A Active JP6488639B2 (en) 2014-10-28 2014-10-28 Electronic devices, electronic devices, and moving objects

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JP (1) JP6488639B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6922325B2 (en) * 2017-03-28 2021-08-18 セイコーエプソン株式会社 Physical quantity sensors, physical quantity sensor devices, electronic devices and mobiles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7555949B2 (en) * 2004-04-07 2009-07-07 Murata Manufacturing Co., Ltd. Angular velocity measuring device
FI119729B (en) * 2005-11-23 2009-02-27 Vti Technologies Oy A method of making a microelectromechanical component and a microelectromechanical component
JP5810500B2 (en) * 2010-09-30 2015-11-11 セイコーエプソン株式会社 Sensor devices, motion sensors, electronic devices
JP2012198099A (en) * 2011-03-22 2012-10-18 Seiko Epson Corp Inertial sensor

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