JP2016082129A - Resin mold and manufacturing method for the same - Google Patents

Resin mold and manufacturing method for the same Download PDF

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JP2016082129A
JP2016082129A JP2014213682A JP2014213682A JP2016082129A JP 2016082129 A JP2016082129 A JP 2016082129A JP 2014213682 A JP2014213682 A JP 2014213682A JP 2014213682 A JP2014213682 A JP 2014213682A JP 2016082129 A JP2016082129 A JP 2016082129A
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resin member
thermosetting resin
thermoplastic resin
resin
burr
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JP6327107B2 (en
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智之 原田
Tomoyuki Harada
智之 原田
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Denso Corp
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Denso Corp
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Priority to JP2014213682A priority Critical patent/JP6327107B2/en
Priority to US15/107,679 priority patent/US10395947B2/en
Priority to PCT/JP2015/000857 priority patent/WO2015129237A1/en
Priority to CN201580009342.2A priority patent/CN106030770B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a resin mold and a manufacturing method for the same that can prevent lack of resin burr of a thermoplastic resin member formed at the boundary between a sealing face and an exposure face in a thermosetting resin member in order to eliminate an additional step of removing the resin burr.SOLUTION: A resin mold has a thermosetting resin member 10 which is formed of a thermosetting resin material, a part of the surface thereof serving as a sealing face 11 while the residual portion of the surface serves as an exposure face 12, and a thermoplastic resin member 20 which is formed of thermoplastic resin material and seals the sealing face 11 so that the exposure face 12 of the thermosetting resin member 10 is exposed. At the boundary between the sealing face 11 and the exposure face 12, a part of the thermoplastic resin member 20 protrudes along the exposure face 12, and forms resin burr 21. A base portion of the resin burr on at least the exposure face 12 of the surface of the thermosetting resin member 10 is formed as a surface treated portion 13 which is subjected to a roughening treatment as a surface treatment of enhancing the adhesion to the thermoplastic resin member 20.SELECTED DRAWING: Figure 1

Description

本発明は、熱硬化性樹脂部材の表面の一部を熱可塑性樹脂部材で封止し、熱硬化性樹脂部材の表面の残部を熱可塑性樹脂部材より露出させてなる樹脂成形体、および、そのような樹脂成形体の製造方法に関し、特に、熱硬化性樹脂部材における封止面と露出面との境界に形成される熱可塑性樹脂部材の樹脂バリに関する。   The present invention provides a resin molded body in which a part of the surface of a thermosetting resin member is sealed with a thermoplastic resin member, and the remainder of the surface of the thermosetting resin member is exposed from the thermoplastic resin member, and the In particular, the present invention relates to a resin burr of a thermoplastic resin member formed at a boundary between a sealing surface and an exposed surface of a thermosetting resin member.

従来より、この種の樹脂成形体として、被封止部品と、被封止部品を封止する熱硬化性樹脂材料よりなる熱硬化性樹脂部材と、熱硬化性樹脂部材の表面を封止する熱可塑性樹脂材料よりなる熱可塑性樹脂部材と、を備える樹脂成形体が提案されている（たとえば特許文献１参照）。ここで、熱可塑性樹脂部材は、熱硬化性樹脂部材の表面の一部である封止面を封止し、当該表面の残部である露出面を露出させたものである。また、被封止部品は、部品が実装された基板等よりなる。   Conventionally, as a resin molded body of this type, a sealed part, a thermosetting resin member made of a thermosetting resin material for sealing the sealed part, and the surface of the thermosetting resin member are sealed. There has been proposed a resin molded body including a thermoplastic resin member made of a thermoplastic resin material (see, for example, Patent Document 1). Here, the thermoplastic resin member seals the sealing surface which is a part of the surface of the thermosetting resin member, and exposes the exposed surface which is the remaining part of the surface. Further, the sealed component is a substrate on which the component is mounted.

このような樹脂成形体は、熱硬化性樹脂材料については、被封止部品に対する高密度性や低応力性の点で好ましく、熱可塑性樹脂材料については、成形物の寸法精度や靭性がよい、という各利点を生かしたものである。たとえば、熱硬化性樹脂材料としてはエポキシ樹脂等が挙げられ、熱可塑性樹脂材料としては、ＰＰＳ（ポリフェニレンサルファイド）やＰＢＴ（ポリブチレンテレフタレート）等が挙げられる。   Such a resin molded body is preferable for the thermosetting resin material in terms of high density and low stress to the sealed parts, and for the thermoplastic resin material, the dimensional accuracy and toughness of the molded product are good. Each advantage is taken advantage of. Examples of the thermosetting resin material include an epoxy resin and the like, and examples of the thermoplastic resin material include PPS (polyphenylene sulfide) and PBT (polybutylene terephthalate).

このような樹脂成形体の一般的な製造方法は、次の通りである。まず、被封止部品を、熱硬化性樹脂材料で被覆し、これを加熱して硬化完了させて熱硬化性樹脂部材を形成する工程、つまり一次成形を行う。これにより熱硬化性樹脂部材が用意される。   The general manufacturing method of such a resin molding is as follows. First, a process for forming a thermosetting resin member by covering the part to be sealed with a thermosetting resin material and heating it to complete the curing, that is, primary molding is performed. Thereby, a thermosetting resin member is prepared.

次に、熱可塑性樹脂材料にて熱硬化性樹脂部材の表面のうちの封止面を被覆し、露出面を露出させるように射出成形を行うことにより、熱可塑性樹脂部材を形成する工程、つまり二次成形を行う。   Next, a step of forming the thermoplastic resin member by covering the sealing surface of the surface of the thermosetting resin member with the thermoplastic resin material and performing injection molding so that the exposed surface is exposed, that is, Secondary molding is performed.

この熱可塑性樹脂部材を成形する金型として、通常、熱可塑性樹脂部材の外形に対応した空間形状のキャビティを有する成形部と、成形部に隣接して設けられ熱硬化性樹脂部材の露出面の部分が嵌合される嵌合部とを備えたものを用いる。つまり、嵌合部は、金型における熱硬化性樹脂部材の露出面との合わせ面を有する部分である。   As a mold for molding the thermoplastic resin member, usually, a molded part having a space-shaped cavity corresponding to the outer shape of the thermoplastic resin member, and an exposed surface of the thermosetting resin member provided adjacent to the molded part. The thing provided with the fitting part by which a part is fitted is used. That is, a fitting part is a part which has a mating surface with the exposed surface of the thermosetting resin member in a metal mold | die.

そして、熱硬化性樹脂部材における封止面の部分をキャビティ内に位置させ、熱硬化性樹脂部材の露出面の部分を嵌合部に嵌合させた状態で、キャビティ内に熱可塑性樹脂材料を射出して充填することにより、熱可塑性樹脂部材を成形する。こうして、熱可塑性樹脂部材による上記封止が行われ、樹脂成形体ができあがる。   Then, the portion of the sealing surface in the thermosetting resin member is positioned in the cavity, and the portion of the exposed surface of the thermosetting resin member is fitted in the fitting portion, and the thermoplastic resin material is placed in the cavity. The thermoplastic resin member is formed by injection and filling. Thus, the sealing with the thermoplastic resin member is performed, and a resin molded body is completed.

特許第３６２０１８４号公報Japanese Patent No. 3620184

ところで、上記した熱可塑性樹脂の成形工程においては、熱硬化性樹脂部材の露出面と金型の嵌合部との間には、設計時の寸法公差あるいは成形時の樹脂圧（つまり射出圧）による金型の開きや変形に起因して隙間が存在する。   By the way, in the above-described thermoplastic resin molding process, the dimensional tolerance at the time of design or the resin pressure at the time of molding (that is, injection pressure) is between the exposed surface of the thermosetting resin member and the fitting portion of the mold. There are gaps due to mold opening and deformation.

そのために、熱可塑性樹脂部材の成形時に、上記露出面と嵌合部との隙間により、熱可塑性樹脂材料よりなる樹脂バリが発生する。つまり、熱硬化性樹脂部材における封止面と露出面との境界では、熱可塑性樹脂部材の一部が、当該境界から露出面に沿ってはみ出して樹脂バリを形成した形となる。   Therefore, at the time of molding the thermoplastic resin member, a resin burr made of a thermoplastic resin material is generated due to the gap between the exposed surface and the fitting portion. That is, at the boundary between the sealing surface and the exposed surface in the thermosetting resin member, a part of the thermoplastic resin member protrudes from the boundary along the exposed surface to form a resin burr.

樹脂バリは、熱可塑性樹脂部材の正規の形状の外へはみ出した薄いヒレ状部分であり、欠落しやすいため、従来では、熱可塑性樹脂成形工程の後に、この樹脂バリを除去する追加工程が必要となっていた。   A resin burr is a thin fin-like portion that protrudes outside the regular shape of a thermoplastic resin member, and is easily lost. Therefore, an additional process to remove this resin burr is conventionally required after the thermoplastic resin molding process. It was.

本発明は、上記問題に鑑みてなされたものであり、熱硬化性樹脂部材における封止面と露出面との境界に形成される熱可塑性樹脂部材の樹脂バリについて、樹脂バリを除去する追加工程を不要とするべく、樹脂バリの欠落防止を実現することを目的とする。   The present invention has been made in view of the above problem, and an additional step of removing a resin burr with respect to a resin burr of a thermoplastic resin member formed at a boundary between a sealing surface and an exposed surface in a thermosetting resin member. It is an object of the present invention to prevent the loss of resin burrs.

上記目的を達成するため、請求項１に記載の発明では、熱硬化性樹脂材料よりなり、表面の一部が封止面（１１）とされ、残部が露出面（１２）とされた熱硬化性樹脂部材（１０）と、熱可塑性樹脂材料よりなり、熱硬化性樹脂部材の表面のうち露出面を露出させるように封止面（１１）を封止する熱可塑性樹脂部材（２０）と、を備える樹脂成形体であって、さらに、熱硬化性樹脂部材における封止面と露出面との境界では、熱可塑性樹脂部材の一部が露出面に沿ってはみ出して樹脂バリ（２１）を形成しており、熱硬化性樹脂部材の表面のうちの少なくとも露出面における樹脂バリの下地となる部分は、当該表面における当該下地となる部分以外の部分に比べて熱可塑性樹脂部材との接着性が大きくなるように表面処理がなされた表面処理部（１３）とされていることを特徴とする。   In order to achieve the above object, in the invention according to claim 1, the thermosetting is made of a thermosetting resin material, a part of the surface is a sealing surface (11), and the rest is an exposed surface (12). A thermoplastic resin member (10) and a thermoplastic resin member (20) which is made of a thermoplastic resin material and seals the sealing surface (11) so as to expose the exposed surface of the surface of the thermosetting resin member; Further, at the boundary between the sealing surface and the exposed surface of the thermosetting resin member, a part of the thermoplastic resin member protrudes along the exposed surface to form a resin burr (21). The portion of the surface of the thermosetting resin member that becomes the base of the resin burr on at least the exposed surface is more adhesive to the thermoplastic resin member than the portion other than the portion that becomes the base on the surface. Surface treatment that has been surface-treated to be larger Characterized in that it is a part (13).

それによれば、熱硬化性樹脂部材の露出面における樹脂バリの下地部分、すなわち樹脂バリの直下部分は、熱可塑性樹脂部材との接着性が向上された表面処理部とされるから、樹脂バリと露出面との強固な接着が実現される。よって、本発明によれば、樹脂バリを除去する追加工程を不要とするべく、樹脂バリの欠落防止を実現することができる。   According to this, since the base part of the resin burr on the exposed surface of the thermosetting resin member, that is, the part directly under the resin burr is a surface treatment part with improved adhesion to the thermoplastic resin member, Strong adhesion to the exposed surface is achieved. Therefore, according to the present invention, it is possible to prevent the resin burr from being lost so that an additional step of removing the resin burr is unnecessary.

請求項６に記載の発明は、熱硬化性樹脂材料よりなり、表面の一部が封止面（１１）とされ、残部が露出面（１２）とされた熱硬化性樹脂部材（１０）と、熱可塑性樹脂材料よりなり、熱硬化性樹脂部材の表面のうち露出面を露出させるように封止面（１１）を封止する熱可塑性樹脂部材（２０）と、を備え、さらに、熱硬化性樹脂部材における封止面と露出面との境界では、熱可塑性樹脂部材の一部が露出面に沿ってはみ出して樹脂バリ（２１）を形成している樹脂成形体を製造する樹脂成形体の製造方法であって、以下の特徴を有するものである。   The invention according to claim 6 is a thermosetting resin member (10) made of a thermosetting resin material, wherein a part of the surface is a sealing surface (11) and the remaining part is an exposed surface (12). And a thermoplastic resin member (20) that is made of a thermoplastic resin material and seals the sealing surface (11) so as to expose the exposed surface of the surface of the thermosetting resin member, and further thermosetting A resin molded body for producing a resin molded body in which a part of the thermoplastic resin member protrudes along the exposed surface to form a resin burr (21) at the boundary between the sealing surface and the exposed surface of the conductive resin member. A manufacturing method having the following characteristics.

すなわち、請求項６の製造方法では、熱硬化性樹脂部材を用意する用意工程と、熱可塑性樹脂部材を成形する金型（１００）として、熱可塑性樹脂部材の外形に対応した空間形状のキャビティ（１１１）を有する成形部（１１０）と、成形部に隣接して設けられ熱硬化性樹脂部材における露出面の部分が嵌合される嵌合部（１２０）とを備えたものを用い、熱硬化性樹脂部材における封止面の部分をキャビティ内に位置させ、熱硬化性樹脂部材における露出面の部分を嵌合部に嵌合させた状態で、キャビティ内に熱可塑性樹脂材料を射出して充填することにより熱可塑性樹脂部材を成形する樹脂成形工程と、を備える。   That is, in the manufacturing method of claim 6, as a preparation step for preparing a thermosetting resin member and a mold (100) for molding the thermoplastic resin member, a cavity having a spatial shape corresponding to the outer shape of the thermoplastic resin member ( 111) and a fitting portion (120) provided adjacent to the molding portion and fitted with an exposed surface portion of the thermosetting resin member. The thermoplastic resin material is injected and filled into the cavity with the sealing surface portion of the thermoplastic resin member positioned in the cavity and the exposed surface portion of the thermosetting resin member fitted to the fitting portion. And a resin molding step of molding the thermoplastic resin member.

そして、用意工程では、熱硬化性樹脂部材として、熱硬化性樹脂部材の表面のうちの少なくとも露出面における嵌合部と対向する対向部（１２ａ）が、当該表面における対向部以外の部分に比べて熱可塑性樹脂部材との接着性が大きくなるように表面処理がなされた表面処理部（１３）とされたものを用意し、樹脂成形工程によって、熱硬化性樹脂部材の露出面における対向部と嵌合部との隙間に発生する樹脂バリを、表面処理部に接着させた状態とする。請求項６の製造方法は、これらの点を特徴としている。   And in a preparation process, as a thermosetting resin member, the opposing part (12a) which opposes the fitting part in the exposed surface at least among the surfaces of a thermosetting resin member is compared with parts other than the opposing part in the said surface. And preparing a surface-treated portion (13) that has been surface-treated so as to increase the adhesiveness to the thermoplastic resin member, and by the resin molding step, the facing portion on the exposed surface of the thermosetting resin member The resin burr generated in the gap with the fitting portion is bonded to the surface treatment portion. The manufacturing method of claim 6 is characterized by these points.

本発明の製造方法によれば、熱硬化性樹脂部材の露出面における樹脂バリの下地部分は、熱可塑性樹脂部材との接着性が向上された表面処理部とされるから、樹脂バリと露出面との強固な接着が実現される。よって、本発明によれば、樹脂バリを除去する追加工程を不要とするべく、樹脂バリの欠落防止を実現することができる。   According to the manufacturing method of the present invention, since the base portion of the resin burr on the exposed surface of the thermosetting resin member is a surface-treated portion with improved adhesion to the thermoplastic resin member, the resin burr and the exposed surface A strong bond with is realized. Therefore, according to the present invention, it is possible to prevent the resin burr from being lost so that an additional step of removing the resin burr is unnecessary.

なお、特許請求の範囲およびこの欄で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。   In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

本発明の第１実施形態にかかる樹脂成形体としての半導体装置を示す概略断面図である。It is a schematic sectional drawing which shows the semiconductor device as a resin molding concerning 1st Embodiment of this invention. 図１中の半導体装置における樹脂バリ近傍部の拡大図である。It is an enlarged view of the resin burr | flash vicinity part in the semiconductor device in FIG. 図１中の半導体装置における熱硬化性樹脂部材を模式的に示した外観斜視図である。It is the external appearance perspective view which showed typically the thermosetting resin member in the semiconductor device in FIG. 図２中の一点鎖線ＩＶ−ＩＶに沿った断面を示す概略断面図である。It is a schematic sectional drawing which shows the cross section along the dashed-dotted line IV-IV in FIG. 図４に示される断面構成の他の例を示す概略断面図である。It is a schematic sectional drawing which shows the other example of the cross-sectional structure shown by FIG. 図４に示される断面構成の他の例を示す概略断面図である。It is a schematic sectional drawing which shows the other example of the cross-sectional structure shown by FIG. 第１実施形態にかかる樹脂成形体の製造方法における樹脂成形工程を示す概略断面図である。It is a schematic sectional drawing which shows the resin molding process in the manufacturing method of the resin molding concerning 1st Embodiment. 本発明の第２実施形態にかかる樹脂成形体の製造方法における樹脂成形工程を示す概略断面図である。It is a schematic sectional drawing which shows the resin molding process in the manufacturing method of the resin molding concerning 2nd Embodiment of this invention. 図８中の熱硬化性樹脂部材を模式的に示した外観斜視図である。It is the external appearance perspective view which showed typically the thermosetting resin member in FIG. 本発明の第３実施形態にかかる樹脂成形体の製造方法における樹脂成形工程の第１の例を示す概略断面図である。It is a schematic sectional drawing which shows the 1st example of the resin molding process in the manufacturing method of the resin molding concerning 3rd Embodiment of this invention. 第３実施形態にかかる樹脂成形体の製造方法における樹脂成形工程の第２の例を示す概略断面図である。It is a schematic sectional drawing which shows the 2nd example of the resin molding process in the manufacturing method of the resin molding concerning 3rd Embodiment. 第３実施形態にかかる樹脂成形体の製造方法における樹脂成形工程の第３の例を示す概略断面図である。It is a schematic sectional drawing which shows the 3rd example of the resin molding process in the manufacturing method of the resin molding concerning 3rd Embodiment.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、説明の簡略化を図るべく、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

（第１実施形態）
本発明の第１実施形態にかかる樹脂成形体について、図１〜図３を参照して述べる。なお、図１、図２および後述の各断面図においては、後述する熱硬化性樹脂部材１０の表面に形成された粗化面としての表面処理部１３の凹凸形状、樹脂バリ２１の厚さ、および、段差１４の高さについては、わかりやすくするために、大きくデフォルメして示してある。また、図３および後述の外観斜視図では、識別のため、熱硬化性樹脂部材１０の表面に形成された表面処理部１３について、その表面に便宜上、斜線ハッチングを施して示している。 (First embodiment)
The resin molded body according to the first embodiment of the present invention will be described with reference to FIGS. In FIG. 1, FIG. 2, and each cross-sectional view described later, the uneven shape of the surface treatment portion 13 as the roughened surface formed on the surface of the thermosetting resin member 10 described later, the thickness of the resin burr 21, The height of the step 14 is greatly deformed for easy understanding. Further, in FIG. 3 and an external perspective view described later, for the sake of convenience, the surface treatment portion 13 formed on the surface of the thermosetting resin member 10 is hatched on the surface for the sake of convenience.

この樹脂成形体は、たとえば自動車などの車両に搭載され、車両用の各種電子装置を駆動するための半導体装置として適用されるものである。本実施形態の樹脂成形体としての半導体装置は、熱硬化性樹脂部材１０と熱硬化性樹脂部材１０の表面の一部を封止する熱可塑性樹脂部材２０とを備えて構成されている。   This resin molded body is mounted on a vehicle such as an automobile, and is applied as a semiconductor device for driving various electronic devices for the vehicle. The semiconductor device as the resin molded body of the present embodiment includes a thermosetting resin member 10 and a thermoplastic resin member 20 that seals a part of the surface of the thermosetting resin member 10.

熱硬化性樹脂部材１０は、エポキシ樹脂等の熱硬化性樹脂材料よりなる。この熱硬化性樹脂部材１０には、必要に応じて、当該樹脂中にシリカやアルミナ等の絶縁性材料よりなるフィラーが含有されていてもよい。このような熱硬化性樹脂部材１０は、トランスファー成形、コンプレッション成形、あるいは、ポッティング法等による成形および熱硬化処理を行うことで、形成されたものである。   The thermosetting resin member 10 is made of a thermosetting resin material such as an epoxy resin. In the thermosetting resin member 10, a filler made of an insulating material such as silica or alumina may be contained in the resin as necessary. Such a thermosetting resin member 10 is formed by performing transfer molding, compression molding, molding by a potting method, and thermosetting treatment.

また、熱可塑性樹脂部材２０は、ＰＰＳ（ポリフェニレンサルファイド）やＰＢＴ（ポリフェニレンテレフタレート）等の熱可塑性樹脂材料よりなる。この熱可塑性樹脂部材２０は、熱硬化性樹脂部材１０の一部を封止するように射出成形を行うことにより、形成されたものである。   The thermoplastic resin member 20 is made of a thermoplastic resin material such as PPS (polyphenylene sulfide) or PBT (polyphenylene terephthalate). The thermoplastic resin member 20 is formed by performing injection molding so as to seal a part of the thermosetting resin member 10.

この熱可塑性樹脂部材２０が熱硬化性樹脂部材１０の表面の一部を封止することにより、熱硬化性樹脂部材１０の表面の一部は、熱可塑性樹脂部材２０により封止された封止面１１とされている。そして、熱硬化性樹脂部材１０の表面のうち封止面１１に連続し封止面１１以外の部分である残部は、熱可塑性樹脂部材２０より露出する露出面１２とされている。   The thermoplastic resin member 20 seals a part of the surface of the thermosetting resin member 10, so that a part of the surface of the thermosetting resin member 10 is sealed by the thermoplastic resin member 20. The surface 11 is used. The remaining part of the surface of the thermosetting resin member 10 that is continuous with the sealing surface 11 and is a portion other than the sealing surface 11 is an exposed surface 12 that is exposed from the thermoplastic resin member 20.

ここでは、図１〜図３に示されるように、熱硬化性樹脂部材１０は、直方体状のブロック形状をなすものとして構成されている。そして、この熱硬化性樹脂部材１０の長手方向の一端１０ａ側における熱硬化性樹脂部材１０の表面の一部が、封止面１１とされ、当該長手方向の他端１０ｂ側における熱硬化性樹脂部材の表面の残部が、露出面１２とされている。   Here, as shown in FIGS. 1 to 3, the thermosetting resin member 10 is configured to have a rectangular parallelepiped block shape. A part of the surface of the thermosetting resin member 10 on the one end 10a side in the longitudinal direction of the thermosetting resin member 10 is used as a sealing surface 11, and the thermosetting resin on the other end 10b side in the longitudinal direction. The remainder of the surface of the member is an exposed surface 12.

さらに具体的に言うならば、図１〜図３に示される熱硬化性樹脂部材１０は、長手方向の一端面とこれに対向する他端面、および、長手方向に延びる４個の側面を有する直方体をなしている。   More specifically, the thermosetting resin member 10 shown in FIGS. 1 to 3 has a rectangular parallelepiped shape having one end surface in the longitudinal direction, the other end surface facing the one end surface, and four side surfaces extending in the longitudinal direction. I am doing.

そして、熱硬化性樹脂部材１０の封止面１１は、当該長手方向の一端面と、４個の側面のうちの当該長手方向の一端１０ａ側の部位とに相当する。一方、熱硬化性樹脂部材１０の露出面１２は、当該長手方向の他端面と、４個の側面のうちの当該長手方向の他端１０ｂ側の部位とに相当する。   The sealing surface 11 of the thermosetting resin member 10 corresponds to one end surface in the longitudinal direction and a portion on the one end 10a side in the longitudinal direction among the four side surfaces. On the other hand, the exposed surface 12 of the thermosetting resin member 10 corresponds to the other end surface in the longitudinal direction and a portion of the four side surfaces on the other end 10b side in the longitudinal direction.

このような樹脂成形体としての半導体装置は、熱可塑性樹脂部材２０により熱硬化性樹脂部材１０の表面のうちの封止面１１を封止し、露出面１２を露出させるように、熱硬化性樹脂部材１０が熱可塑性樹脂部材２０でインサート成形されることで形成される。そして、図１に示されるように、これら両樹脂部材１０、２０の界面の端部は外部に露出している。   The semiconductor device as such a resin molded body is thermosetting so that the sealing surface 11 of the surface of the thermosetting resin member 10 is sealed by the thermoplastic resin member 20 and the exposed surface 12 is exposed. The resin member 10 is formed by insert molding with the thermoplastic resin member 20. And as FIG. 1 shows, the edge part of the interface of these both resin members 10 and 20 is exposed outside.

熱硬化性樹脂部材１０は、その内部に、熱硬化性樹脂部材１０により封止された被封止部品としての半導体素子３０および電気接続部材４０を有している。半導体素子３０は、磁気センサや光センサ、あるいは、圧力センサ等に用いられるシリコン半導体等よりなるセンサチップである。このような半導体素子３０は、通常の半導体プロセスにより形成されるものである。   The thermosetting resin member 10 has a semiconductor element 30 and an electrical connection member 40 as sealed components sealed by the thermosetting resin member 10 therein. The semiconductor element 30 is a sensor chip made of a silicon semiconductor or the like used for a magnetic sensor, an optical sensor, a pressure sensor, or the like. Such a semiconductor element 30 is formed by a normal semiconductor process.

たとえば、磁気センサ用の半導体素子３０の場合、半導体素子３０の全体が熱硬化性樹脂部材１０により封止されており、半導体素子３０は、熱硬化性樹脂部材１０を介して外部の磁気を検出するようにしている。   For example, in the case of the semiconductor element 30 for a magnetic sensor, the entire semiconductor element 30 is sealed with the thermosetting resin member 10, and the semiconductor element 30 detects external magnetism via the thermosetting resin member 10. Like to do.

また、光センサや圧力センサ用の半導体素子３０の場合、半導体素子３０の一部を開口させる図示しない開口部が、熱硬化性樹脂部材１０に形成され、半導体素子３０は、当該開口部を介して光や圧力を検出するようになっている。   In the case of the semiconductor element 30 for an optical sensor or a pressure sensor, an opening (not shown) for opening a part of the semiconductor element 30 is formed in the thermosetting resin member 10, and the semiconductor element 30 is interposed through the opening. It detects light and pressure.

一方、電気接続部材４０は、半導体素子３０と半導体装置の外部の図示しない配線部材とを電気的に接続するためのものである。この電気接続部材４０としては、リードフレームや配線基板などが挙げられるが、ここでは、典型的なＣｕ（銅）や４２アロイ等のリードフレームよりなるものとされている。   On the other hand, the electrical connection member 40 is for electrically connecting the semiconductor element 30 and a wiring member (not shown) outside the semiconductor device. Examples of the electrical connection member 40 include a lead frame and a wiring board. Here, the electrical connection member 40 is made of a typical lead frame such as Cu (copper) or 42 alloy.

このリードフレームとしての電気接続部材４０は、はんだ等の図示しないダイボンド材を介して半導体素子３０を搭載する搭載部４１と、半導体装置の外部との電気的接続を行うための端子部４２とが一体に形成されたものである。   The electrical connection member 40 as the lead frame includes a mounting portion 41 for mounting the semiconductor element 30 via a die bond material (not shown) such as solder and a terminal portion 42 for electrical connection to the outside of the semiconductor device. It is formed integrally.

ここでは、電気接続部材４０の搭載部４１は熱硬化性樹脂部材１０に被覆されて、端子部４２は、熱硬化性樹脂部材１０における封止面１１より突出する。また、電気接続部材４０の端子部４２は、熱硬化性樹脂部材１０の外部にて熱可塑性樹脂部材２０により封止され、かつ、その先端部が熱可塑性樹脂部材２０から露出している。   Here, the mounting portion 41 of the electrical connection member 40 is covered with the thermosetting resin member 10, and the terminal portion 42 protrudes from the sealing surface 11 of the thermosetting resin member 10. Further, the terminal portion 42 of the electrical connection member 40 is sealed by the thermoplastic resin member 20 outside the thermosetting resin member 10, and the tip portion is exposed from the thermoplastic resin member 20.

ここで、電気接続部材４０の搭載部４１は、熱硬化性樹脂部材１０内にて、半導体素子３０と電気接続されている。この半導体素子３０との接続手法は特に限定するものではないが、ここでは、Ａｌ（アルミニウム）やＡｕ（金）等のボンディングワイヤ５０により接続されている。   Here, the mounting portion 41 of the electrical connection member 40 is electrically connected to the semiconductor element 30 in the thermosetting resin member 10. Although the connection method with this semiconductor element 30 is not specifically limited, Here, it connects with bonding wires 50, such as Al (aluminum) and Au (gold).

一方、熱可塑性樹脂部材２０は、電気接続部材４０の端子部４２を封止しているが、熱可塑性樹脂部材２０には開口部２２が形成されている。そして、この開口部２２において、電気接続部材４０の端子部４２のうちのさらに一部が、熱可塑性樹脂部材２０の外部に露出している。   On the other hand, the thermoplastic resin member 20 seals the terminal portion 42 of the electrical connection member 40, but the opening 22 is formed in the thermoplastic resin member 20. In the opening 22, a part of the terminal portion 42 of the electrical connection member 40 is exposed to the outside of the thermoplastic resin member 20.

この熱可塑性樹脂部材２０の開口部２２は、図示しない外部の配線部材、たとえばコネクタ部材等が挿入されて接続される部位である。この開口部２２により、当該外部の配線部材と電気接続部材４０の端子部４２とが、電気的に接続されるようになっている。   The opening 22 of the thermoplastic resin member 20 is a portion to which an external wiring member (not shown) such as a connector member is inserted and connected. Through this opening 22, the external wiring member and the terminal portion 42 of the electrical connection member 40 are electrically connected.

つまり、電気接続部材４０は、半導体素子３０の検出や出力等の用をなすものとして機能し、半導体素子３０は、電気接続部材４０を介して、装置の外部との電気的なやり取りを可能としている。   That is, the electrical connection member 40 functions as a device for detecting and outputting the semiconductor element 30, and the semiconductor element 30 can be electrically exchanged with the outside of the apparatus via the electrical connection member 40. Yes.

ここにおいて、本実施形態では、図１、図２に示されるように、熱硬化性樹脂部材１０における封止面１１と露出面１２との境界では、熱可塑性樹脂部材２０の一部が露出面１２上にて露出面１２に沿ってはみ出して樹脂バリ２１を形成している。   Here, in this embodiment, as shown in FIGS. 1 and 2, a part of the thermoplastic resin member 20 is exposed at the boundary between the sealing surface 11 and the exposed surface 12 in the thermosetting resin member 10. A resin burr 21 is formed on the surface 12 along the exposed surface 12.

つまり、熱硬化性樹脂部材１０と熱可塑性樹脂部材２０との界面のうち、封止面１１と露出面１２との境界に位置する当該界面の端部に、樹脂バリ２１が形成されている。樹脂バリ２１とは、熱可塑性樹脂部材２０の射出成形時に形成されるもので、熱可塑性樹脂部材２０の正規の形状の外へはみ出した薄いヒレ状の部分である。   That is, the resin burr 21 is formed at the end portion of the interface located at the boundary between the sealing surface 11 and the exposed surface 12 in the interface between the thermosetting resin member 10 and the thermoplastic resin member 20. The resin burr 21 is formed at the time of injection molding of the thermoplastic resin member 20 and is a thin fin-like portion that protrudes outside the regular shape of the thermoplastic resin member 20.

なお、厳密に言えば、熱硬化性樹脂部材１０において、露出面１２の全体が露出しているのではなく、露出面１２のうちの封止面１１に隣接して連続する所定幅の領域、つまり封止面１１寄りの領域は、樹脂バリ２１で被覆されている。   Strictly speaking, in the thermosetting resin member 10, the entire exposed surface 12 is not exposed, but an area having a predetermined width that is adjacent to the sealing surface 11 in the exposed surface 12. That is, the region near the sealing surface 11 is covered with the resin burr 21.

つまり、樹脂バリ２１は、封止面１１と露出面１２との境界にて当該境界から露出面１２の一部に渡って形成されている。すなわち、樹脂バリ２１は、当該境界から露出面１２側への所定幅の領域に渡って形成されており、露出面１２は、樹脂バリ２１以外の部分では露出している。   That is, the resin burr 21 is formed from the boundary to a part of the exposed surface 12 at the boundary between the sealing surface 11 and the exposed surface 12. That is, the resin burr 21 is formed over a region having a predetermined width from the boundary to the exposed surface 12, and the exposed surface 12 is exposed at portions other than the resin burr 21.

この樹脂バリ２１は、熱硬化性樹脂部材１０における封止面１１と露出面１２との境界の全体に形成されたものであってもよいし、当該境界の一部のみに形成されたものであってもよい。典型的には、図４に示されるように、樹脂バリ２１は、当該境界の全体に形成される。   The resin burr 21 may be formed on the entire boundary between the sealing surface 11 and the exposed surface 12 in the thermosetting resin member 10, or may be formed only on a part of the boundary. There may be. Typically, as shown in FIG. 4, the resin burr 21 is formed over the entire boundary.

具体的に言うと、図１〜図３の例では、直方体ブロック形状をなす熱硬化性樹脂部材１０において、封止面１１と露出面１２との境界は、長手方向の軸まわりの全周にて４個の側面を通るように存在する。この場合において、図４に示されるように、樹脂バリ２１も、熱硬化性樹脂部材１０の長手方向の軸まわりの全周に存在する。   Specifically, in the example of FIGS. 1 to 3, in the thermosetting resin member 10 having a rectangular parallelepiped block shape, the boundary between the sealing surface 11 and the exposed surface 12 is on the entire circumference around the longitudinal axis. Exists to pass through the four sides. In this case, as shown in FIG. 4, the resin burrs 21 are also present on the entire circumference around the longitudinal axis of the thermosetting resin member 10.

なお、樹脂バリ２１が、熱硬化性樹脂部材１０における封止面１１と露出面１２との境界の一部に形成されたものである場合の一例は、図５、図６に示される。図５に示される例では、樹脂バリ２１は、当該境界上にて断続的に存在しており、図６に示される例では、樹脂バリ２１は、当該境界上の一箇所に存在している。つまり、樹脂バリ２１は、上記境界の少なくとも一部に形成されていればよい。   An example of the case where the resin burr 21 is formed at a part of the boundary between the sealing surface 11 and the exposed surface 12 in the thermosetting resin member 10 is shown in FIGS. In the example shown in FIG. 5, the resin burr 21 exists intermittently on the boundary, and in the example shown in FIG. 6, the resin burr 21 exists at one place on the boundary. . That is, the resin burr 21 may be formed at least at a part of the boundary.

そして、本実施形態の半導体装置においては、熱硬化性樹脂部材１０の表面の一部が、熱可塑性樹脂部材２０との接着性向上のための表面処理がなされた表面処理部１３とされている。この表面処理部１３は、熱硬化性樹脂部材１０の表面のうち表面処理部１３以外の部分に比べて熱可塑性樹脂部材２０との接着性が大きくなるように表面処理された部分である。   In the semiconductor device of the present embodiment, a part of the surface of the thermosetting resin member 10 is the surface treatment unit 13 that has been subjected to a surface treatment for improving the adhesion to the thermoplastic resin member 20. . The surface-treated portion 13 is a portion that has been surface-treated so that the adhesiveness to the thermoplastic resin member 20 is greater than the portion other than the surface-treated portion 13 on the surface of the thermosetting resin member 10.

ここでは、熱硬化性樹脂部材１０の表面のうちの露出面１２における樹脂バリ２１の下地となる部分と、この樹脂バリ２１の下地部分に連続する封止面１１との両部分が、表面処理部１３とされている。つまり、当該両部分は、熱硬化性樹脂部材１０の表面における当該両部分以外の部分に比べて熱可塑性樹脂部材２０との接着性が大きくなるように表面処理されている。   Here, both the portion of the exposed surface 12 of the surface of the thermosetting resin member 10 that is the base of the resin burr 21 and the sealing surface 11 that is continuous with the base portion of the resin burr 21 are subjected to surface treatment. Part 13. That is, both the parts are surface-treated so that the adhesiveness with the thermoplastic resin member 20 is greater than the parts other than the two parts on the surface of the thermosetting resin member 10.

ここで、露出面１２における樹脂バリ２１の下地部分とは、樹脂バリ２１の直下に位置する部分、すなわち露出面１２における樹脂バリ２１を投影した領域である。さらに言えば、本実施形態の表面処理部１３は、封止面１１の領域と露出面１２における封止面１１寄りの領域とに連続して設けられたものと言える。   Here, the base portion of the resin burr 21 on the exposed surface 12 is a portion located immediately below the resin burr 21, that is, a region where the resin burr 21 on the exposed surface 12 is projected. Furthermore, it can be said that the surface treatment unit 13 of this embodiment is provided continuously in the region of the sealing surface 11 and the region of the exposed surface 12 near the sealing surface 11.

なお、本実施形態では、図３に示されるように、表面処理部１３は、露出面１２における封止面１１寄りの領域においても、封止面１１側と同様に、熱硬化性樹脂部材１０の長手方向の軸まわりの全周に設けられている。つまり、露出面１２のうちの封止面１１寄りの領域の全体が、表面処理部１３とされている。   In the present embodiment, as shown in FIG. 3, the surface treatment portion 13 is similar to the sealing surface 11 side in the region near the sealing surface 11 on the exposed surface 12. Are provided around the entire circumference in the longitudinal direction. That is, the entire region of the exposed surface 12 near the sealing surface 11 is the surface treatment unit 13.

上述のように、樹脂バリ２１は、必ずしも露出面１２と封止面１１との境界全体に形成されるものではない。しかし、露出面１２における封止面１１寄りの領域は、当該境界に連続する領域であり、露出面１２のうちで樹脂バリ２１発生の可能性のある部分である。そのため、露出面１２における封止面１１寄りの領域全体を、表面処理部１３としておく必要がある。   As described above, the resin burr 21 is not necessarily formed on the entire boundary between the exposed surface 12 and the sealing surface 11. However, the region near the sealing surface 11 on the exposed surface 12 is a region continuous with the boundary, and is a portion of the exposed surface 12 where the resin burr 21 may be generated. Therefore, the entire region near the sealing surface 11 in the exposed surface 12 needs to be the surface treatment unit 13.

図３、図４によれば、樹脂バリ２１が封止面１１と露出面１２との境界の全体に形成されている場合、露出面１２における封止面１１寄りの領域全体が、実質的に樹脂バリの下地部分であり、且つ表面処理部１３である。   3 and 4, when the resin burr 21 is formed on the entire boundary between the sealing surface 11 and the exposed surface 12, the entire region of the exposed surface 12 near the sealing surface 11 is substantially This is a base portion of the resin burr and the surface treatment unit 13.

一方、図５、図６に示されるように、樹脂バリ２１が当該境界の一部のみに形成されている場合でも、露出面１２における封止面１１寄りの領域全体が表面処理部１３である。そして、この場合、表面処理部１３のうちの一部が樹脂バリ２１の下地部分となり、表面処理部１３の残部は樹脂バリ２１が存在しない部分となる。   On the other hand, as shown in FIGS. 5 and 6, even when the resin burr 21 is formed only on a part of the boundary, the entire region of the exposed surface 12 near the sealing surface 11 is the surface treatment unit 13. . In this case, a part of the surface treatment portion 13 becomes a base portion of the resin burr 21 and the remaining portion of the surface treatment portion 13 becomes a portion where the resin burr 21 does not exist.

ただし、樹脂バリ２１が封止面１１と露出面１２との境界の特定部位のみに発生することが予め明らかであるならば、露出面１２における封止面１１寄りの領域のうちの一部のみを表面処理部１３としてもよい。いずれにせよ、樹脂バリ２１が存在する樹脂バリ２１の下地部分は、必ず表面処理部１３とされている。   However, if it is clear in advance that the resin burr 21 is generated only at a specific portion of the boundary between the sealing surface 11 and the exposed surface 12, only a part of the region near the sealing surface 11 on the exposed surface 12 is used. The surface treatment unit 13 may be used. In any case, the base portion of the resin burr 21 where the resin burr 21 exists is always the surface treatment unit 13.

本実施形態の表面処理部１３は、粗化処理された面、すなわち熱硬化性樹脂部材１０の表面における表面処理部１３以外の部分よりも粗化された粗化面である。これにより、表面処理部１３は、アンカー効果が付与されて熱可塑性樹脂部材２０との接着性が向上されたものとなっている。   The surface treatment portion 13 of the present embodiment is a roughened surface that is roughened from the roughened surface, that is, the portion other than the surface treatment portion 13 on the surface of the thermosetting resin member 10. Thereby, the surface treatment part 13 is provided with an anchor effect and improved adhesiveness with the thermoplastic resin member 20.

この粗化面としての表面処理部１３は、後述する製造方法のうちの表面層の除去により形成されるものである。この粗化面の粗化度合（表面粗さＲａ）は、熱硬化性樹脂部材１０の表面のうちの当該粗化面以外の部分よりも大きくされている。   The surface treatment portion 13 as the roughened surface is formed by removing the surface layer in the manufacturing method described later. The roughening degree of the roughened surface (surface roughness Ra) is made larger than the portion other than the roughened surface of the surface of the thermosetting resin member 10.

具体的には、この粗化面としての表面処理部１３の表面粗さＲａは、数μｍ以上（たとえば３μｍ以上）とされている。なお、表面粗さＲａは、ＪＩＳ（日本工業規格の略称）の規格番号Ｂ０６０１に定義されている算術平均粗さＲａである。   Specifically, the surface roughness Ra of the surface treatment unit 13 as the roughened surface is several μm or more (for example, 3 μm or more). The surface roughness Ra is an arithmetic average roughness Ra defined in the standard number B0601 of JIS (abbreviation for Japanese Industrial Standards).

また、本実施形態では、図１、図２に示されるように、表面処理部１３は、熱硬化性樹脂部材１０の露出面１２において樹脂バリ２１の下地部分よりも拡がって形成されている。つまり、表面処理部１３は、露出面１２において樹脂バリ２１の端部よりも外側にはみ出している。   Moreover, in this embodiment, as FIG. 1 and FIG. 2 show, the surface treatment part 13 is formed in the exposed surface 12 of the thermosetting resin member 10 so that it may spread rather than the base part of the resin burr | flash 21. FIG. That is, the surface treatment unit 13 protrudes outside the end portion of the resin burr 21 on the exposed surface 12.

ここで、表面処理部１３は、上述のように、熱硬化性樹脂部材１０の表面層を全面除去することで形成された面であり、熱硬化性樹脂部材１０の表面のうち表面処理部１３以外の部分に対して表面処理部１３が凹むように、これらの間には段差１４が形成されている。この段差１４の高さは、数μｍ以上（たとえば５μｍ以上）であり、目視で段差１４の確認が可能なレベルの高さとされている。   Here, the surface treatment unit 13 is a surface formed by removing the entire surface layer of the thermosetting resin member 10 as described above, and the surface treatment unit 13 out of the surface of the thermosetting resin member 10. A step 14 is formed between them so that the surface treatment portion 13 is recessed with respect to other portions. The height of the step 14 is several μm or more (for example, 5 μm or more), and is set to a level at which the step 14 can be visually confirmed.

次に、本実施形態の半導体装置の製造方法について、図７も参照して述べる。本製造方法は、上記図１〜図４に示される熱硬化性樹脂部材１０を用意する用意工程と、図７に示されるような金型１００を用いた射出成形により熱可塑性樹脂部材２０を形成し、熱硬化性樹脂部材１０の一部を封止する樹脂成形工程と、を備える。   Next, a method for manufacturing the semiconductor device of this embodiment will be described with reference to FIG. In this manufacturing method, the thermoplastic resin member 20 is formed by a preparation process for preparing the thermosetting resin member 10 shown in FIGS. 1 to 4 and injection molding using a mold 100 as shown in FIG. And a resin molding step for sealing a part of the thermosetting resin member 10.

用意工程では、熱硬化性樹脂部材１０の原料である熱硬化性樹脂材料を用い、この熱硬化性樹脂材料を加熱して硬化完了させることにより、熱硬化性樹脂部材１０を成形する。この成形では、具体的には、半導体素子３０と電気接続部材４０とをボンディングワイヤ５０で接続したものを、トランスファー成形、コンプレッション成形あるいはポッティング等により封止し、さらに、このものを加熱、硬化する。   In the preparation step, the thermosetting resin member 10 is molded by using the thermosetting resin material that is the raw material of the thermosetting resin member 10 and heating the thermosetting resin material to complete the curing. Specifically, in this molding, the semiconductor element 30 and the electrical connection member 40 connected by the bonding wire 50 are sealed by transfer molding, compression molding, potting or the like, and this is heated and cured. .

さらに、用意工程では、熱硬化された熱硬化性樹脂部材１０の表面に対して、上記図１〜図４に示されるような表面処理部１３を形成する。具体的な表面処理部１３の形成については、後述する。こうして、用意工程が完了する。   Furthermore, in a preparation process, the surface treatment part 13 as shown in the said FIGS. 1-4 is formed with respect to the surface of the thermosetting resin member 10 thermosetted. Specific formation of the surface treatment portion 13 will be described later. Thus, the preparation process is completed.

続いて、樹脂成形工程を行う。この工程では、図７に示されるように、熱可塑性樹脂部材２０を成形する金型１００として、熱可塑性樹脂部材２０の外形に対応した空間形状のキャビティ１１１を有する成形部１１０と、成形部１１０に隣接して設けられた嵌合部１２０とを備えたものを用いる。   Subsequently, a resin molding step is performed. In this step, as shown in FIG. 7, as a mold 100 for molding the thermoplastic resin member 20, a molding portion 110 having a cavity 111 having a spatial shape corresponding to the outer shape of the thermoplastic resin member 20, and a molding portion 110. The one provided with the fitting part 120 provided adjacent to is used.

嵌合部１２０は、成形部１１０と一体に連続して設けられた部分であり、熱硬化性樹脂部材１０における露出面１２の部分が嵌合される部分である。言い換えれば、嵌合部１２０は、金型１００における熱硬化性樹脂部材１０の露出面１２との合わせ面を有する部分である。   The fitting portion 120 is a portion that is continuously provided integrally with the molding portion 110, and is a portion to which the exposed surface 12 portion of the thermosetting resin member 10 is fitted. In other words, the fitting portion 120 is a portion having a mating surface with the exposed surface 12 of the thermosetting resin member 10 in the mold 100.

そして、樹脂成形工程では、図７に示されるように、熱硬化性樹脂部材１０における封止面１１の部分をキャビティ１１１内に位置させ、熱硬化性樹脂部材１０における露出面１２の部分を嵌合部１２０に嵌合させた状態とする。そして、この状態で、キャビティ１１１内に熱可塑性樹脂材料を射出して充填する。これにより、熱可塑性樹脂部材２０が成形されて、熱硬化性樹脂部材１０の一部の封止がなされる。   Then, in the resin molding step, as shown in FIG. 7, the portion of the sealing surface 11 in the thermosetting resin member 10 is positioned in the cavity 111 and the portion of the exposed surface 12 in the thermosetting resin member 10 is fitted. It is set as the state fitted to the joint part 120. FIG. In this state, the cavity 111 is filled with a thermoplastic resin material. Thereby, the thermoplastic resin member 20 is shape | molded and a part of thermosetting resin member 10 is sealed.

ここで、用意工程にて行われる表面処理部１３の形成について、述べる。上述のように、本実施形態においては、表面処理部１３は、熱硬化性樹脂部材１０の表面のうちの露出面１２における樹脂バリ２１の下地部分と、封止面１１との両部分に形成された粗化面である。   Here, formation of the surface treatment part 13 performed in a preparation process is described. As described above, in the present embodiment, the surface treatment portion 13 is formed on both the base portion of the resin burr 21 and the sealing surface 11 on the exposed surface 12 of the surface of the thermosetting resin member 10. Roughened surface.

ここで、露出面１２における樹脂バリ２１の下地部分は、図７においては、露出面１２における嵌合部１２０と対向する部分である対向部１２ａに相当する。さらに言えば、この対向部１２ａは、露出面１２のうち封止面１１に連続して隣接しつつ嵌合部１２０に対向する部分であり、露出面１２のうちで樹脂バリ２１発生の可能性のある部分に相当するものである。   Here, the base portion of the resin burr 21 on the exposed surface 12 corresponds to a facing portion 12a that is a portion facing the fitting portion 120 on the exposed surface 12 in FIG. More specifically, the facing portion 12a is a portion of the exposed surface 12 that is continuously adjacent to the sealing surface 11 and faces the fitting portion 120, and the exposed surface 12 may cause a resin burr 21. It corresponds to a certain part.

図３では、封止面１１と露出面１２との境界から熱硬化性樹脂部材１０の長手方向の他端１０ｂまでの露出面１２の全体に嵌合部１２０が対向しており、この対向する部分が対向部１２ａとされている。   In FIG. 3, the fitting portion 120 faces the entire exposed surface 12 from the boundary between the sealing surface 11 and the exposed surface 12 to the other end 10 b in the longitudinal direction of the thermosetting resin member 10. The portion is a facing portion 12a.

そこで、用意工程では、熱硬化性樹脂部材１０の表面のうちの露出面１２における対向部１２ａと、封止面１１との両部分に対して、当該表面における当該両部分以外の部分に比べて熱可塑性樹脂部材２０との接着性が大きくなるように表面処理を行う。   Therefore, in the preparation process, compared to the portions other than the two portions on the surface, both the facing portion 12a on the exposed surface 12 and the sealing surface 11 of the surface of the thermosetting resin member 10 are compared. The surface treatment is performed so that the adhesiveness with the thermoplastic resin member 20 is increased.

用意工程において上記熱硬化された熱硬化性樹脂部材１０の最表面には、汚染物よりなる図示しない表面層が存在する。ここで、汚染物とは、たとえば離型剤や工程中に熱硬化性樹脂部材１０の表面に付着した異物等である。離型剤とは、上記成形において型離れ性を確保するために、金型１００の表面に設けられたり、熱硬化性樹脂材料自身に混合されたりするもので、たとえばシロキサンや脂肪酸等よりなる。   A surface layer (not shown) made of contaminants exists on the outermost surface of the thermosetting resin member 10 that has been thermoset in the preparation step. Here, the contaminant is, for example, a release agent or a foreign matter attached to the surface of the thermosetting resin member 10 during the process. The mold release agent is provided on the surface of the mold 100 or mixed with the thermosetting resin material itself in order to ensure mold release properties in the molding, and is made of, for example, siloxane or fatty acid.

そこで、本実施形態の表面処理では、この表面層を除去することにより粗化面としての表面処理部１３を形成する。つまり、熱硬化性樹脂部材１０の表面のうちの露出面１２における対向部１２ａと、封止面１１との両部分において、最表面に位置する表面層を除去することで当該両部分を新生面とする処理を行う。   Therefore, in the surface treatment of this embodiment, the surface treatment portion 13 as a roughened surface is formed by removing this surface layer. That is, by removing the surface layer located at the outermost surface in both portions of the facing portion 12a on the exposed surface 12 and the sealing surface 11 in the surface of the thermosetting resin member 10, the two portions are regarded as new surfaces. Perform the process.

具体的には、表面処理部１３の形成予定位置に対して、レーザ照射、ショットブラスト、研磨等の手法を用い、表面層を除去する。これら手法は、表面を削って凹凸を形成する粗化処理であり、レーザ照射が最も望ましい手法である。   Specifically, the surface layer is removed using a method such as laser irradiation, shot blasting, and polishing with respect to the formation position of the surface treatment unit 13. These methods are roughening treatments in which the surface is cut to form irregularities, and laser irradiation is the most desirable method.

こうして、表面処理部１３は、レーザ照射等により、熱硬化性樹脂部材１０の表面における表面処理部１３以外の部分よりも粗化された粗化面として形成される。この処理における除去深さは、上記表面層を除去できる程度でよく、数μｍ以上（たとえば５μｍ以上）とされていればよい。   Thus, the surface treatment unit 13 is formed as a roughened surface that is roughened by laser irradiation or the like than the portion other than the surface treatment unit 13 on the surface of the thermosetting resin member 10. The removal depth in this treatment may be such that the surface layer can be removed, and may be several μm or more (for example, 5 μm or more).

これら手法により、汚染物としての表面層が除去されるとともに、表面層の下地としての新生面が粗化される。それによって、当該新生面は、アンカー効果が付与されて熱可塑性樹脂部材２０との密着性に優れた粗化面とされ、表面処理部１３を形成する。   By these methods, the surface layer as a contaminant is removed, and a new surface as a base of the surface layer is roughened. As a result, the new surface is a roughened surface which is provided with an anchor effect and has excellent adhesion to the thermoplastic resin member 20, and forms the surface treatment portion 13.

なお、この表面処理においては、特にレーザ照射を用いると、新生面が焼けて酸化された部分に存在する官能基がさらに化学反応を促進して、熱可塑性樹脂部材２０との高密着性の実現が可能となるため、好ましい。   In this surface treatment, in particular, when laser irradiation is used, the functional group present in the portion where the new surface is burnt and oxidized further promotes the chemical reaction, thereby realizing high adhesion with the thermoplastic resin member 20. Since it becomes possible, it is preferable.

こうして、用意工程にて表面処理部１３を形成した後、樹脂成形工程を行えば、熱硬化性樹脂部材１０の露出面１２における対向部１２ａと嵌合部１２０との隙間に発生する樹脂バリ２１を、接着性の高い表面処理部１３に接着させた状態とすることができる。   Thus, after forming the surface treatment part 13 in the preparation process, if the resin molding process is performed, the resin burr 21 generated in the gap between the facing part 12a and the fitting part 120 on the exposed surface 12 of the thermosetting resin member 10 is obtained. Can be made to adhere to the surface treatment portion 13 having high adhesiveness.

樹脂成形工程では、熱硬化性樹脂部材１０の露出面１２における対向部１２ａと嵌合部１２０との間には、設計時の寸法公差あるいは樹脂圧による金型１００の開きや変形等に起因して、隙間が発生する。そのため、熱可塑性樹脂材料は、キャビティ１１１に充填された後、さらに、図７に示されるように、樹脂圧によってキャビティ１１１からはみ出して当該隙間に進入し、これが樹脂バリ２１となる。   In the resin molding process, the gap between the facing portion 12a and the fitting portion 120 on the exposed surface 12 of the thermosetting resin member 10 is caused by dimensional tolerance at the time of design or opening or deformation of the mold 100 due to resin pressure. A gap is generated. Therefore, after the thermoplastic resin material is filled in the cavity 111, as shown in FIG. 7, the thermoplastic resin material protrudes from the cavity 111 by the resin pressure and enters the gap, and this becomes the resin burr 21.

ここにおいて、本実施形態では、当該隙間において予め熱硬化性樹脂部材１０の対向部１２ａを表面処理部１３としているので、樹脂バリ２１を表面処理部１３に接着させた状態が形成されるのである。   Here, in this embodiment, since the facing portion 12a of the thermosetting resin member 10 is used as the surface treatment portion 13 in advance in the gap, a state where the resin burr 21 is adhered to the surface treatment portion 13 is formed. .

こうして、樹脂成形工程の完了に伴い、熱可塑性樹脂部材２０によって熱硬化性樹脂部材１０の一部が封止され、熱可塑性樹脂部材２０の樹脂バリ２１が形成された本実施形態の樹脂成形体ができあがる。   Thus, with the completion of the resin molding process, a part of the thermosetting resin member 10 is sealed by the thermoplastic resin member 20, and the resin burr 21 of the thermoplastic resin member 20 is formed. Is completed.

なお、上記の表面層形成工程以降の各工程は、熱硬化性樹脂部材１０の表面の一部に対して選択的に処理を行うものであるため、処理を行わない表面には適宜マスキング等を施したうえで、当該各工程を行うようにする。   In addition, since each process after said surface layer formation process processes selectively with respect to a part of surface of the thermosetting resin member 10, masking etc. are suitably performed on the surface which does not process. After applying, each step is performed.

ところで、本実施形態によれば、熱硬化性樹脂部材１０の露出面１２における樹脂バリ２１の下地部分、すなわち樹脂バリ２１の直下部分は、粗化面によるアンカー効果によって熱可塑性樹脂部材２０との接着性が向上された表面処理部１３とされている。   By the way, according to the present embodiment, the base portion of the resin burr 21 on the exposed surface 12 of the thermosetting resin member 10, that is, the portion directly below the resin burr 21 is in contact with the thermoplastic resin member 20 due to the anchor effect by the roughened surface. The surface treatment unit 13 has improved adhesion.

そのため、熱可塑性樹脂よりなる樹脂バリ２１と表面処理部１３とされた露出面１２との間で、強固な接着が実現される。よって、本実施形態によれば、従来のような樹脂バリ２１を除去する追加工程を不要としつつ、樹脂バリ２１の欠落防止を実現するのに適した構成および製造方法を提供することができる。   Therefore, strong adhesion is realized between the resin burr 21 made of a thermoplastic resin and the exposed surface 12 as the surface treatment portion 13. Therefore, according to the present embodiment, it is possible to provide a configuration and a manufacturing method suitable for realizing prevention of the loss of the resin burr 21 while eliminating the additional step of removing the resin burr 21 as in the related art.

また、本実施形態によれば、熱硬化性樹脂部材１０の表面のうち樹脂バリ２１の下地部分に加えて封止面１１も、表面処理部１３とされている。それによれば、熱可塑性樹脂部材２０と封止面１１との接着についても、より強固な接着を実現でき、安定した封止形態を実現することができる。   Further, according to the present embodiment, the sealing surface 11 is also the surface treatment portion 13 in addition to the base portion of the resin burr 21 in the surface of the thermosetting resin member 10. According to this, it is possible to realize stronger adhesion with respect to the adhesion between the thermoplastic resin member 20 and the sealing surface 11 and to realize a stable sealing form.

（第２実施形態）
本発明の第２実施形態について、図８、図９を参照して、上記第１実施形態との相違点を中心に述べることとする。なお、図９においては、熱硬化性樹脂部材１０の表面に形成された表面処理部１３および突起１５の各表面に、識別のために便宜上ハッチングを施してある。 (Second Embodiment)
The second embodiment of the present invention will be described with reference to FIGS. 8 and 9, focusing on the differences from the first embodiment. In FIG. 9, the surfaces of the surface treatment unit 13 and the protrusions 15 formed on the surface of the thermosetting resin member 10 are hatched for convenience of identification.

図８、図９に示されるように、本実施形態にかかる樹脂成形体としての半導体装置では、熱硬化性樹脂部材１０において、さらに、露出面１２における樹脂バリ２１の下地部分のうちの封止面１１に隣接する部分に、突起１５が形成されている。この突起１５は、封止面１１側から露出面１２側への樹脂バリ２１の伸展距離を抑制するために設けられたものである。   As shown in FIG. 8 and FIG. 9, in the semiconductor device as the resin molded body according to the present embodiment, in the thermosetting resin member 10, sealing of the base portion of the resin burr 21 on the exposed surface 12 is further performed. A protrusion 15 is formed in a portion adjacent to the surface 11. The protrusion 15 is provided to suppress the extension distance of the resin burr 21 from the sealing surface 11 side to the exposed surface 12 side.

つまり、突起１５は、樹脂バリ２１の下地部分において、樹脂バリ２１のはみ出し方向の先端側とは反対の根元側に配置されている。そして、図９に示されるように、突起１５は、熱硬化性樹脂部材１０の長手方向の軸まわりの全周に存在している。   That is, the protrusion 15 is disposed on the base side opposite to the tip side in the protruding direction of the resin burr 21 in the base portion of the resin burr 21. And as FIG. 9 shows, the protrusion 15 exists in the perimeter around the axis | shaft of the longitudinal direction of the thermosetting resin member 10. As shown in FIG.

この突起１５は、樹脂バリ２１の下地部分のうちの突起１５以外の部分よりも突出高さが大きい。そして、突起１５も樹脂バリ２１に被覆されているが、樹脂バリ２１においては、突起１５の部分が突起１５以外の部分よりも突起１５の突出高さの分、実質的に薄いものとされている。   The protrusion 15 has a protrusion height larger than that of the base portion of the resin burr 21 other than the protrusion 15. The protrusion 15 is also covered with the resin burr 21, but in the resin burr 21, the protrusion 15 is substantially thinner than the protrusion 15 by the protrusion height of the protrusion 15. Yes.

ここでは、突起１５は、上記用意工程にて行われるレーザ照射等による表面層の除去工程において、熱硬化性樹脂部材１０の表面のうち突起１５となる部分では、表面層の除去を行わないようにすることで形成される。この場合、突起１５は、表面処理部１３ではなく未処理の部分となり、実質的に段差１４の高さと同程度の突出高さとされる。   Here, the protrusion 15 does not remove the surface layer in the portion of the surface of the thermosetting resin member 10 that becomes the protrusion 15 in the surface layer removal step by laser irradiation or the like performed in the preparation step. It is formed by. In this case, the protrusion 15 becomes an unprocessed portion instead of the surface treatment portion 13, and has a protrusion height substantially equal to the height of the step 14.

なお、突起１５の形成方法としては、たとえば、熱硬化後の熱硬化性樹脂部材１０の表面に、型成形や切削、エッチング等により、予め突起１５を形成しておき、その後は、突起１５も含めて表面層の除去を行うようにしてもよい。この場合は、突起１５も表面処理部１３とされる。   As a method for forming the protrusion 15, for example, the protrusion 15 is formed in advance on the surface of the thermosetting resin member 10 after thermosetting by molding, cutting, etching, or the like. In addition, the surface layer may be removed. In this case, the protrusion 15 is also used as the surface treatment unit 13.

本実施形態における突起１５の作用は、図８に示される樹脂成形工程にて発揮される。まず、上記したような突起１５の形成方法を用いることにより、用意工程では、熱硬化性樹脂部材１０として、さらに、露出面１２における対向部１２ａのうち封止面１１に隣接する部分に突起１５が形成されたものを用意する。   The effect | action of the protrusion 15 in this embodiment is exhibited in the resin molding process shown by FIG. First, by using the method for forming the protrusion 15 as described above, in the preparation step, as the thermosetting resin member 10, the protrusion 15 is formed on a portion of the exposed surface 12 adjacent to the sealing surface 11 in the facing portion 12 a. Prepare what is formed.

そして、樹脂成形工程では、図８に示されるように、突起１５と嵌合部１２０との隙間を、突起１５以外の対向部１２ａと嵌合部１２０との隙間よりも小さいものとした状態で、熱可塑性樹脂材料の充填を行う。   In the resin molding step, as shown in FIG. 8, the gap between the protrusion 15 and the fitting portion 120 is smaller than the gap between the facing portion 12a other than the protrusion 15 and the fitting portion 120. Then, the thermoplastic resin material is filled.

このとき、金型１００の嵌合部１２０と対向する対向部１２ａのうち突起１５の部分は、突起１５以外の部分に比べて嵌合部１２０との隙間が小さくなるため、突起１５を越えて対向部１２ａと嵌合部１２０との隙間に進入する樹脂の量が抑制される。   At this time, the portion of the protrusion 15 of the facing portion 12a facing the fitting portion 120 of the mold 100 has a smaller gap with the fitting portion 120 than the portion other than the protrusion 15, so The amount of resin entering the gap between the facing portion 12a and the fitting portion 120 is suppressed.

そのため、本実施形態の突起１５によれば、露出面１２上における樹脂バリ２１の伸展を抑制することができる。なお、樹脂バリ２１の固化時間を考慮して上記隙間へ進入する樹脂量を抑制するように、突起１５の高さを設計すればよい。   Therefore, according to the projection 15 of the present embodiment, the extension of the resin burr 21 on the exposed surface 12 can be suppressed. The height of the protrusion 15 may be designed so as to suppress the amount of resin entering the gap in consideration of the solidification time of the resin burr 21.

（第３実施形態）
本発明の第３実施形態について、図１０〜図１２を参照して述べることとする。本実施形態は、金型１００の開き方向Ｙ１、および、熱硬化性樹脂部材１０の対向部１２ａにおける表面処理部１３の配置構成についてのバリエーションを示すもので、上記各実施形態と組み合わせて適用できるものである。 (Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS. This embodiment shows the variation about arrangement | positioning structure of the surface treatment part 13 in the opening direction Y1 of the metal mold | die 100, and the opposing part 12a of the thermosetting resin member 10, and can be applied in combination with said each embodiment. Is.

図１０〜図１２において、金型１００の開き方向Ｙ１は、白矢印にて示してある。この開き方向Ｙは、射出成形後に金型１００を樹脂成形体より取り外すために金型１００を移動させる方向である。図１０および図１１では、開き方向Ｙ１は熱硬化性樹脂部材１０の対向部１２ａに平行な方向とされ、図１２では、開き方向Ｙ１は熱硬化性樹脂部材１０の対向部１２ａに鉛直な方向とされている。   10 to 12, the opening direction Y1 of the mold 100 is indicated by a white arrow. The opening direction Y is a direction in which the mold 100 is moved in order to remove the mold 100 from the resin molded body after injection molding. 10 and 11, the opening direction Y1 is a direction parallel to the facing portion 12a of the thermosetting resin member 10, and in FIG. 12, the opening direction Y1 is a direction perpendicular to the facing portion 12a of the thermosetting resin member 10. It is said that.

また、熱硬化性樹脂部材１０の対向部１２ａにおける表面処理部１３の配置構成については、図１０では、対向部１２ａの全体が表面処理部１３とされている。一方、図１１および図１２では、対向部１２ａの全体ではなく対向部１２ａにおける封止面１１寄りの領域が、表面処理部１３とされている。   Further, regarding the arrangement configuration of the surface treatment portion 13 in the facing portion 12 a of the thermosetting resin member 10, the entire facing portion 12 a is the surface treatment portion 13 in FIG. 10. On the other hand, in FIG. 11 and FIG. 12, the region near the sealing surface 11 in the facing portion 12 a instead of the entire facing portion 12 a is the surface treatment portion 13.

ここで、図１０、図１１においても、同図中に示される金型１００について開き方向Ｙ１を、図１２と同じく、対向部１２ａに鉛直方向としてもよい。また、図１１に示される例では、対向部１２ａの一部を表面処理部１３とし、残部を未処理部としているから、嵌合部１２０と対向部１２ａとの隙間は、表面処理部１３では未処理部よりも広くなっている。   Here, also in FIGS. 10 and 11, the opening direction Y1 of the mold 100 shown in FIG. In addition, in the example shown in FIG. 11, a part of the facing part 12 a is the surface treatment part 13 and the remaining part is an untreated part. Therefore, the gap between the fitting part 120 and the facing part 12 a It is wider than the unprocessed part.

ここで、図１２に示されるように、開き方向Ｙ１が対向部１２ａの鉛直方向である場合には、嵌合部１２０の合わせ面のうち表面処理部１３に対向する部分を、未処理部に対向する部分よりも突出させた突出面１２１とすることが可能である。この突出面１２１により、表面処理部１３における嵌合部１２０との隙間が狭くされるので、樹脂バリ２１の進入量の低減が期待される。   Here, as shown in FIG. 12, when the opening direction Y1 is the vertical direction of the facing portion 12a, the portion of the mating surface of the fitting portion 120 that faces the surface treatment portion 13 is the untreated portion. It is possible to make the protruding surface 121 protrude from the opposing part. Since the protrusion surface 121 narrows the gap between the surface treatment portion 13 and the fitting portion 120, a reduction in the amount of the resin burr 21 entering is expected.

（他の実施形態）
なお、上記各実施形態において、熱可塑性樹脂部材２０を構成する熱可塑性樹脂材料には、熱硬化性樹脂部材１０における表面処理部１３に存在する官能基と化学結合する官能基を含有する図示しない添加剤が添加されていてもよい。この添加剤は、水酸基、エポキシ基、アミノ基、カルボニル基などのいずれか１つもしくは複数を有するポリマーよりなるものである。 (Other embodiments)
In each of the above embodiments, the thermoplastic resin material constituting the thermoplastic resin member 20 contains a functional group chemically bonded to a functional group present in the surface treatment portion 13 of the thermosetting resin member 10 (not shown). An additive may be added. This additive is made of a polymer having any one or more of a hydroxyl group, an epoxy group, an amino group, a carbonyl group and the like.

この添加剤が、熱硬化性樹脂部材１０の表面処理部１３に存在する水酸基やエポキシ基等の官能基と化学反応して、高密着性な熱硬化性樹脂−熱可塑性樹脂接合を可能とする、という効果が期待できる。このように熱可塑性樹脂部材２０側にも、添加剤を添加すれば、樹脂バリ２１も含めた熱可塑性樹脂部材２０と、熱硬化性樹脂部材１０との接着性をより強固なものにできる。   This additive chemically reacts with a functional group such as a hydroxyl group or an epoxy group present in the surface treatment portion 13 of the thermosetting resin member 10 to enable highly adhesive thermosetting resin-thermoplastic resin bonding. Can be expected. Thus, if an additive is added also to the thermoplastic resin member 20 side, the adhesiveness between the thermoplastic resin member 20 including the resin burr 21 and the thermosetting resin member 10 can be made stronger.

この場合の樹脂成形工程としては、熱硬化性樹脂部材１０に対して、添加剤を添加した熱可塑性樹脂材料を射出成形する。例えば、添加剤となる官能基を有するポリマーを、母材となる熱可塑性樹脂材料に混練することにより、添加剤を添加した熱可塑性樹脂材料を得ることができる。   As a resin molding step in this case, a thermoplastic resin material to which an additive is added is injection-molded with respect to the thermosetting resin member 10. For example, a thermoplastic resin material to which an additive has been added can be obtained by kneading a polymer having a functional group that serves as an additive into a thermoplastic resin material that serves as a base material.

これにより、表面処理部１３に存在する官能基と熱可塑性樹脂材料に含まれる添加剤に存在する官能基とが化学結合しつつ、熱可塑性樹脂部材２０による熱硬化性樹脂部材１０の封止が行われる。   Accordingly, the thermosetting resin member 10 is sealed by the thermoplastic resin member 20 while the functional groups present in the surface treatment unit 13 and the functional groups present in the additive contained in the thermoplastic resin material are chemically bonded. Done.

この化学結合としては、たとえば熱硬化性樹脂部材１０がエポキシ樹脂である場合、エポキシ樹脂中の水酸基やエポキシ基が添加剤に存在する水酸基、エポキシ基、アミノ基、カルボニル基と化学結合することになる。そして、水酸基同士の結合やエポキシ基同士の結合などとされる場合、共有結合となるため、より強度の高い化学結合となる。つまり、添加剤の構成材料として、熱硬化性樹脂部材１０の構成材料に含まれる官能基と同じ官能基を少なくとも１つ含む材料を用いることで共有結合を実現できる。   As this chemical bond, for example, when the thermosetting resin member 10 is an epoxy resin, the hydroxyl group or epoxy group in the epoxy resin is chemically bonded to the hydroxyl group, epoxy group, amino group, or carbonyl group present in the additive. Become. And when it is set as the coupling | bonding of hydroxyl groups, the coupling | bonding of epoxy groups, etc., since it becomes a covalent bond, it becomes a chemical bond with higher intensity | strength. That is, covalent bonding can be realized by using a material containing at least one functional group that is the same as the functional group contained in the constituent material of the thermosetting resin member 10 as the constituent material of the additive.

また、上記各実施形態において、表面処理部１３は、熱硬化性樹脂部材１０の表面のうちの露出面１２における樹脂バリ２１の下地部分のみに形成され、封止面１１には形成されていないものでもよい。また、表面処理部１３は、熱硬化性樹脂部材１０の表面のうちの露出面１２における樹脂バリ２１が発生する可能性がある部分、すなわち対向部１２ａのみに形成され、封止面１１には形成されていないものでもよい。   In each of the above embodiments, the surface treatment unit 13 is formed only on the base portion of the resin burr 21 on the exposed surface 12 of the surface of the thermosetting resin member 10 and is not formed on the sealing surface 11. It may be a thing. Further, the surface treatment portion 13 is formed only on a portion of the surface of the thermosetting resin member 10 where the resin burr 21 may be generated on the exposed surface 12, that is, on the facing portion 12a. It may not be formed.

さらには、上記各実施形態において、表面処理部１３が封止面１１の全体および露出面１２の全体に形成された構成、すなわち、表面処理部１３が熱硬化性樹脂部材１０の表面全体に形成された構成であってもよい。   Furthermore, in each said embodiment, the surface treatment part 13 is formed in the whole sealing surface 11 and the whole exposed surface 12, ie, the surface treatment part 13 is formed in the whole surface of the thermosetting resin member 10. It may be a configured.

また、上述したように、樹脂バリ２１の発生部位が予め特定されている場合、表面処理部１３を露出面１２における封止面１１寄りの領域のうちの一部のみに形成してもよいが、これと同じく、封止面１１についても一部のみを表面処理部１３としてもよい。ただし、封止面１１全体を表面処理部１３とする方が、露出する熱硬化性樹脂部材１０と熱可塑性樹脂部材２０との界面から水分やオイル等の汚染物が侵入することを防止しやすく、望ましい。   Further, as described above, when the generation site of the resin burr 21 is specified in advance, the surface treatment unit 13 may be formed only in a part of the exposed surface 12 near the sealing surface 11. Similarly, only a part of the sealing surface 11 may be used as the surface treatment unit 13. However, it is easier to prevent contaminants such as moisture and oil from entering from the exposed interface between the thermosetting resin member 10 and the thermoplastic resin member 20 when the entire sealing surface 11 is the surface treatment portion 13. ,desirable.

また、表面処理部１３は、熱硬化性樹脂部材１０の表面のうちの表面処理部１３以外の部分に比べて熱可塑性樹脂部材２０との接着性が大きくなるように表面処理がなされたものであればよく、上記した粗化処理された粗化面に限定されるものではない。可能ならば、上記各実施形態における表面処理部１３は、薬液等により表面処理を行うことで、熱可塑性樹脂部材２０との接着性が向上されたものとしてもよい。   Moreover, the surface treatment part 13 is surface-treated so that adhesiveness with the thermoplastic resin member 20 may become large compared with parts other than the surface treatment part 13 among the surfaces of the thermosetting resin member 10. There is no limitation to the roughened surface subjected to the above-described roughening treatment. If possible, the surface treatment unit 13 in each of the above embodiments may be improved in adhesiveness with the thermoplastic resin member 20 by performing a surface treatment with a chemical solution or the like.

また、熱硬化性樹脂部材１０により封止される被封止部品としては、熱硬化性樹脂部材１０で封止されることが可能なものであればよく、上記した半導体素子３０や電気接続部材４０あるいは回路基板に限定されるものではない。   Moreover, as a to-be-sealed component sealed with the thermosetting resin member 10, what is necessary is just what can be sealed with the thermosetting resin member 10, and the above-mentioned semiconductor element 30 or electrical connection member It is not limited to 40 or a circuit board.

また、上記各実施形態において、熱硬化性樹脂部材１０の形状は、上記した直方体状のものに限定されるものではなく、球状、その他、不定形状などであってもよい。また、熱可塑性樹脂部材２０の封止形態は、熱硬化性樹脂部材１０の表面の一部が封止され残部が露出するものであればよく、上記図示例のような熱硬化性樹脂部材１０の一端１０ａ側が封止面１１、他端１０ｂ側が露出面とされたものに限定するものではない。   Further, in each of the embodiments described above, the shape of the thermosetting resin member 10 is not limited to the above-described rectangular parallelepiped shape, and may be a spherical shape or other irregular shapes. The thermoplastic resin member 20 may be sealed as long as a part of the surface of the thermosetting resin member 10 is sealed and the remaining part is exposed. The one end 10a side is not limited to the sealing surface 11 and the other end 10b side is an exposed surface.

また、上記各実施形態では、樹脂成形体は半導体装置であり、熱硬化性樹脂部材１０の内部には、熱硬化性樹脂部材１０で封止された被封止部品となる半導体素子３０などが設けられたものであった。しかし、樹脂成形体としては、このような半導体装置に限定されるものではなく、たとえば熱硬化性樹脂部材１０として被封止部品を持たない構成のものであってもよい。   Moreover, in each said embodiment, the resin molding is a semiconductor device, The semiconductor element 30 etc. which become the to-be-sealed components sealed with the thermosetting resin member 10 inside the thermosetting resin member 10 etc. It was provided. However, the resin molded body is not limited to such a semiconductor device. For example, the thermosetting resin member 10 may have a configuration without a sealed component.

また、本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。また、上記各実施形態は、互いに無関係なものではなく、組み合わせが明らかに不可な場合を除き、適宜組み合わせが可能であり、また、上記各実施形態は、上記の図示例に限定されるものではない。   Further, the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims. The above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible, and the above embodiments are not limited to the illustrated examples. Absent.

１０ 熱硬化性樹脂部材
１１ 熱硬化性樹脂部材の封止面
１２ 熱硬化性樹脂部材の露出面
１２ａ 対向部
１３ 表面処理部
２０ 熱可塑性樹脂部材
２１ 樹脂バリ
１００ 金型
１１０ 金型の成形部
１１１ キャビティ
１２０ 金型の嵌合部 DESCRIPTION OF SYMBOLS 10 Thermosetting resin member 11 Sealing surface of thermosetting resin member 12 Exposed surface of thermosetting resin member 12a Opposing part 13 Surface treatment part 20 Thermoplastic resin member 21 Resin burr 100 Mold 110 Molding part 111 Cavity 120 Mold fitting part

Claims (10)

熱硬化性樹脂材料よりなり、表面の一部が封止面（１１）とされ、残部が露出面（１２）とされた熱硬化性樹脂部材（１０）と、
熱可塑性樹脂材料よりなり、前記熱硬化性樹脂部材の表面のうち前記露出面を露出させるように前記封止面（１１）を封止する熱可塑性樹脂部材（２０）と、を備える樹脂成形体であって、
さらに、前記熱硬化性樹脂部材における前記封止面と前記露出面との境界では、前記熱可塑性樹脂部材の一部が前記露出面に沿ってはみ出して樹脂バリ（２１）を形成しており、
前記熱硬化性樹脂部材の表面のうちの少なくとも前記露出面における前記樹脂バリの下地となる部分は、当該表面における当該下地となる部分以外の部分に比べて熱可塑性樹脂部材との接着性が大きくなるように表面処理がなされた表面処理部（１３）とされていることを特徴とする樹脂成形体。 A thermosetting resin member (10) made of a thermosetting resin material, with a part of the surface being a sealing surface (11) and the remaining part being an exposed surface (12);
A resin molded body comprising a thermoplastic resin member (20) made of a thermoplastic resin material and sealing the sealing surface (11) so as to expose the exposed surface of the surface of the thermosetting resin member. Because
Furthermore, at the boundary between the sealing surface and the exposed surface in the thermosetting resin member, a part of the thermoplastic resin member protrudes along the exposed surface to form a resin burr (21),
Of the surface of the thermosetting resin member, at least the portion that becomes the base of the resin burr on the exposed surface has greater adhesion to the thermoplastic resin member than the portion other than the portion that becomes the base on the surface. It is set as the surface treatment part (13) by which surface treatment was made so that the resin molding characterized by the above-mentioned. 前記熱硬化性樹脂部材の表面のうち前記封止面も、前記表面処理部とされていることを特徴とする請求項１に記載の樹脂成形体。   The resin molded body according to claim 1, wherein the sealing surface of the surface of the thermosetting resin member is also the surface treatment portion. 前記熱硬化性樹脂部材において、さらに、前記露出面における前記樹脂バリの下地となる部分のうちの前記封止面に隣接する部分には、前記封止面側から前記露出面側への前記樹脂バリの伸展距離を抑制するための突起（１５）が形成されていることを特徴とする請求項１または２に記載の樹脂成形体。   In the thermosetting resin member, a portion adjacent to the sealing surface in a portion of the exposed surface that is the base of the resin burr is further provided with the resin from the sealing surface side to the exposed surface side. The resin molding according to claim 1 or 2, wherein a protrusion (15) for suppressing a burr extension distance is formed. 前記表面処理部は、前記熱硬化性樹脂部材の表面における前記表面処理部以外の部分よりも粗化された粗化面であることを特徴とする請求項１ないし３のいずれか１つに記載の樹脂成形体。   The said surface treatment part is a roughening surface roughened rather than parts other than the said surface treatment part in the surface of the said thermosetting resin member, It is any one of Claim 1 thru | or 3 characterized by the above-mentioned. Resin molded body. 前記熱可塑性樹脂部材には、前記熱硬化性樹脂部材における前記表面処理部に存在する官能基と化学結合する官能基を含有する添加剤が添加されていることを特徴とする請求項１ないし４のいずれか１つに記載の樹脂成形体。   The additive which contains the functional group chemically bonded with the functional group which exists in the said surface treatment part in the said thermosetting resin member is added to the said thermoplastic resin member. The resin molding as described in any one of these. 熱硬化性樹脂材料よりなり、表面の一部が封止面（１１）とされ、残部が露出面（１２）とされた熱硬化性樹脂部材（１０）と、
熱可塑性樹脂材料よりなり、前記熱硬化性樹脂部材の表面のうち前記露出面を露出させるように前記封止面（１１）を封止する熱可塑性樹脂部材（２０）と、を備え、
さらに、前記熱硬化性樹脂部材における前記封止面と前記露出面との境界では、前記熱可塑性樹脂部材の一部が前記露出面に沿ってはみ出して樹脂バリ（２１）を形成している樹脂成形体を製造する樹脂成形体の製造方法であって、
前記熱硬化性樹脂部材を用意する用意工程と、
前記熱可塑性樹脂部材を成形する金型（１００）として、前記熱可塑性樹脂部材の外形に対応した空間形状のキャビティ（１１１）を有する成形部（１１０）と、前記成形部に隣接して設けられ前記熱硬化性樹脂部材における前記露出面の部分が嵌合される嵌合部（１２０）とを備えたものを用い、
前記熱硬化性樹脂部材における前記封止面の部分を前記キャビティ内に位置させ、前記熱硬化性樹脂部材における前記露出面の部分を前記嵌合部に嵌合させた状態で、前記キャビティ内に前記熱可塑性樹脂材料を射出して充填することにより前記熱可塑性樹脂部材を成形する樹脂成形工程と、を備え、
前記用意工程では、前記熱硬化性樹脂部材として、前記熱硬化性樹脂部材の表面のうちの少なくとも前記露出面における前記嵌合部と対向する対向部（１２ａ）が、当該表面における前記対向部以外の部分に比べて前記熱可塑性樹脂部材との接着性が大きくなるように表面処理がなされた表面処理部（１３）とされたものを用意し、
前記樹脂成形工程によって、前記熱硬化性樹脂部材の前記露出面における前記対向部と前記嵌合部との隙間に発生する前記樹脂バリを、前記表面処理部に接着させた状態とすることを特徴とする樹脂成形体の製造方法。 A thermosetting resin member (10) made of a thermosetting resin material, with a part of the surface being a sealing surface (11) and the remaining part being an exposed surface (12);
A thermoplastic resin member (20) that is made of a thermoplastic resin material and seals the sealing surface (11) so as to expose the exposed surface of the surface of the thermosetting resin member;
Furthermore, at the boundary between the sealing surface and the exposed surface of the thermosetting resin member, a resin in which a part of the thermoplastic resin member protrudes along the exposed surface to form a resin burr (21). A method for producing a resin molded body for producing a molded body,
A preparation step of preparing the thermosetting resin member;
As a mold (100) for molding the thermoplastic resin member, a molding part (110) having a cavity (111) having a space shape corresponding to the outer shape of the thermoplastic resin member, and provided adjacent to the molding part. Using a fitting portion (120) with which the exposed surface portion of the thermosetting resin member is fitted,
A portion of the sealing surface of the thermosetting resin member is positioned in the cavity, and a portion of the exposed surface of the thermosetting resin member is fitted in the fitting portion. A resin molding step of molding the thermoplastic resin member by injecting and filling the thermoplastic resin material,
In the preparation step, as the thermosetting resin member, at least the facing portion (12a) facing the fitting portion on the exposed surface of the surface of the thermosetting resin member is other than the facing portion on the surface. Prepare a surface-treated portion (13) that has been surface-treated so that the adhesion to the thermoplastic resin member is greater than the portion of
In the resin molding step, the resin burr generated in a gap between the facing portion and the fitting portion on the exposed surface of the thermosetting resin member is in a state of being bonded to the surface treatment portion. A method for producing a resin molded product. 前記用意工程では、前記熱硬化性樹脂部材として、前記熱硬化性樹脂部材の表面のうち前記封止面も前記表面処理部とされたものを用意することを特徴とする請求項６に記載の樹脂成形体の製造方法。   The said preparation process prepares what the said sealing surface was also made into the said surface treatment part among the surfaces of the said thermosetting resin member as said thermosetting resin member. Manufacturing method of resin molding. 前記用意工程では、前記熱硬化性樹脂部材として、さらに、前記露出面における前記対向部のうち前記封止面に隣接する部分に、前記封止面側から前記露出面側への前記樹脂バリの伸展距離を抑制するための突起（１５）が形成されたものを用意し、
前記樹脂成形工程では、前記突起と前記嵌合部との隙間を、前記突起以外の前記対向部と前記嵌合部との隙間よりも小さいものとした状態で、前記熱可塑性樹脂材料の充填を行うことを特徴とする請求項６または７に記載の樹脂成形体の製造方法。 In the preparation step, as the thermosetting resin member, the resin burr from the sealing surface side to the exposed surface side is further formed in a portion adjacent to the sealing surface in the facing portion of the exposed surface. Prepare a protrusion (15) to suppress the extension distance,
In the resin molding step, the thermoplastic resin material is filled in a state where a gap between the protrusion and the fitting portion is smaller than a gap between the facing portion other than the protrusion and the fitting portion. The method for producing a resin molded body according to claim 6, wherein the method is performed. 前記表面処理部は、レーザ照射されることにより、前記熱硬化性樹脂部材の表面における前記表面処理部以外の部分よりも粗化された粗化面であることを特徴とする請求項６ないし８のいずれか１つに記載の樹脂成形体の製造方法。   The surface treatment portion is a roughened surface that is roughened from a portion other than the surface treatment portion on the surface of the thermosetting resin member by laser irradiation. The manufacturing method of the resin molding as described in any one of these. 前記樹脂成形工程では、前記熱可塑性樹脂材料として、前記熱硬化性樹脂部材における前記表面処理部に存在する官能基と化学結合する官能基を含有する添加剤が添加された材料を、射出成形することにより、前記表面処理部に存在する官能基と前記添加剤に存在する官能基とを化学結合させつつ、前記熱可塑性樹脂部材の成形を行うことを特徴とする請求項６ないし９のいずれか１つに記載の樹脂成形体の製造方法。   In the resin molding step, as the thermoplastic resin material, a material to which an additive containing a functional group chemically bonded to a functional group present in the surface treatment portion of the thermosetting resin member is added is injection molded. Thus, the thermoplastic resin member is molded while chemically bonding the functional group present in the surface treatment portion and the functional group present in the additive. The manufacturing method of the resin molding as described in one.
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