JP2016078138A - Method for polishing workpiece - Google Patents

Method for polishing workpiece Download PDF

Info

Publication number
JP2016078138A
JP2016078138A JP2014209454A JP2014209454A JP2016078138A JP 2016078138 A JP2016078138 A JP 2016078138A JP 2014209454 A JP2014209454 A JP 2014209454A JP 2014209454 A JP2014209454 A JP 2014209454A JP 2016078138 A JP2016078138 A JP 2016078138A
Authority
JP
Japan
Prior art keywords
workpiece
polishing
cutting
polishing tool
chuck table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014209454A
Other languages
Japanese (ja)
Other versions
JP6388518B2 (en
Inventor
酒井　敏行
Toshiyuki Sakai
敏行 酒井
クリス ミハイ
Chris Mihai
クリス ミハイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2014209454A priority Critical patent/JP6388518B2/en
Publication of JP2016078138A publication Critical patent/JP2016078138A/en
Application granted granted Critical
Publication of JP6388518B2 publication Critical patent/JP6388518B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for polishing workpiece that can perform processing steps of cutting and polishing with one kind of device.SOLUTION: In the method for polishing workpiece, a polishing tool 8 is mounted to a blade cover of a cutting device via a fixing plate 9, processing feed where a chuck table 2 is fed for processing in an X direction to polish the workpiece Wwith a polishing action surface 81 of the polishing tool 8 and indexing feed where the polishing tool 8 is fed for indexing on a side of the workpiece Ware repeated. The processing feed and the indexing feed are repeated till a desired polished surface is formed in the workpiece W.SELECTED DRAWING: Figure 2

Description

本発明は、被加工物の研磨方法に関する。   The present invention relates to a method for polishing a workpiece.

スピンドルの先端に切削ブレードを装着し、加工送り手段と割り出し送り手段を作動させて半導体ウェーハやガラス板等の被加工物を切削する切削装置が知られている（特許文献１）。携帯電話のカバーガラス等に用いられるガラス板は、大判なガラス板から切削装置で所定のサイズに切り出した後、研磨装置を用いて切断面を研磨することでエッジのカケやクラックを除去している。   There is known a cutting device in which a cutting blade is attached to the tip of a spindle and a workpiece feeding means and an indexing feeding means are operated to cut a workpiece such as a semiconductor wafer or a glass plate (Patent Document 1). A glass plate used for a cover glass of a cellular phone is cut out from a large glass plate to a predetermined size with a cutting device, and then the edge is cut and cracked by polishing the cut surface with a polishing device. Yes.

特開２００８−３０７６４６号公報JP 2008-307646 A

ところで、被加工物を切断して研磨する加工工程において、切削装置と研磨装置の異なる２種類の装置を必要としていた。   By the way, in the processing step of cutting and polishing the workpiece, two types of apparatuses, that is, a cutting apparatus and a polishing apparatus, are required.

そこで、本発明は、上記に鑑みてなされたものであって、切断と研磨の加工工程を１種類の装置で実施することができる被加工物の研磨方法を提供することを目的とする。   Therefore, the present invention has been made in view of the above, and an object of the present invention is to provide a workpiece polishing method capable of performing cutting and polishing processing steps with one type of apparatus.

上述した課題を解決し、目的を達成するために、本発明は、被加工物を保持するチャックテーブルと、先端に切削ブレードを装着するスピンドルと該スピンドルを回転可能に保持するスピンドルハウジングとを備え、該チャックテーブルに保持された被加工物を切削する切削手段と、該チャックテーブルと該切削手段とを加工送り方向に相対移動させる加工送り手段と、該チャックテーブルと該切削手段とを該加工送り方向に直交する割り出し送り方向に相対移動させる割り出し送り手段と、を備える切削装置を用い、該スピンドルハウジングに研磨工具を装着して該チャックテーブルに保持した被加工物を研磨する研磨方法であって、該チャックテーブルに被加工物を保持する被加工物保持ステップと、該スピンドルハウジングに装着ジグを介して該研磨工具を装着する研磨工具装着ステップと、該被加工物保持ステップと該研磨工具装着ステップを実施した後、該加工送り手段で該チャックテーブルを加工送りし被加工物を該研磨工具で研磨する加工送りと、該割り出し送り手段で被加工物を該研磨工具側に割り出し送りする割り出し送りと、を繰り返し被加工物に所望の研磨面が形成されるまで繰り返す研磨ステップと、を備えることを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a chuck table for holding a workpiece, a spindle for mounting a cutting blade at a tip, and a spindle housing for rotatably holding the spindle. A cutting means for cutting the workpiece held on the chuck table, a machining feed means for moving the chuck table and the cutting means in a machining feed direction, and the chuck table and the cutting means. This is a polishing method for polishing a workpiece held on the chuck table by attaching a polishing tool to the spindle housing using a cutting device having an indexing feed means that moves relative to the indexing feed direction orthogonal to the feed direction. A workpiece holding step for holding the workpiece on the chuck table, and a jig mounted on the spindle housing. After performing the polishing tool mounting step for mounting the polishing tool, the workpiece holding step, and the polishing tool mounting step, the chuck table is processed and fed by the processing feeding means, and the workpiece is transferred to the polishing tool. And a polishing step that repeats until a desired polishing surface is formed on the workpiece, and an index feed for indexing and feeding the workpiece to the polishing tool side by the index feeding means. It is characterized by that.

本発明に係る被加工物の研磨方法によれば、切削装置のスピンドルハウジングに研磨工具を装着することで、研磨専用装置と同様の加工が実施できるため、切断と研磨を１種類の装置で実施することができるという効果を奏する。また、切削ブレードを装着するスピンドルではなくスピンドルハウジングに研磨工具を装着するため、一方の工具を付けたままでも他の加工が可能であり、切削と研磨の工程変更が容易であるという効果を奏する。   According to the method for polishing a workpiece according to the present invention, by attaching a polishing tool to the spindle housing of a cutting device, processing similar to that for a polishing-dedicated device can be performed, so that cutting and polishing are performed with one type of device. There is an effect that can be done. In addition, since the polishing tool is attached to the spindle housing instead of the spindle to which the cutting blade is attached, other processing is possible even with one of the tools attached, and there is an effect that the cutting and polishing process can be easily changed. .

図１は、研磨工具を装着する切削装置の構成例を示す斜視図である。FIG. 1 is a perspective view showing a configuration example of a cutting apparatus on which a polishing tool is mounted. 図２は、被加工物の研磨例（加工送り）を示す正面図である。FIG. 2 is a front view showing an example of polishing (processing feed) of a workpiece. 図３は、被加工物の研磨例（加工送り）を示す上面図である。FIG. 3 is a top view showing an example of polishing (processing feed) of a workpiece. 図４は、被加工物の研磨例（割り出し送り）を示す上面図である。FIG. 4 is a top view showing an example of polishing (index feed) of a workpiece. 図５は、被加工物の研磨方法を示すフローチャートである。FIG. 5 is a flowchart showing a method for polishing a workpiece.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。   DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

〔実施形態〕
実施形態に係る被加工物の研磨方法について説明する。図１は、研磨工具を装着する切削装置の構成例を示す斜視図である。図１に示すように、切削装置１は、チャックテーブル２と、切削機構３と、Ｘ軸移動機構４と、Ｙ軸移動機構５と、Ｚ軸移動機構６と、研磨工具８とを有している。 Embodiment
A method for polishing a workpiece according to an embodiment will be described. FIG. 1 is a perspective view showing a configuration example of a cutting apparatus on which a polishing tool is mounted. As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 2, a cutting mechanism 3, an X-axis moving mechanism 4, a Y-axis moving mechanism 5, a Z-axis moving mechanism 6, and a polishing tool 8. ing.

チャックテーブル２は、被加工物Ｗａ，Ｗｂを保持するものである。被加工物Ｗａは、例えば、携帯電話のカバーガラス等に用いられる大判のガラス板であり、切削加工される前のものである。被加工物Ｗｂは、被加工物Ｗａが矩形状に切削加工されて個片化されたものである。チャックテーブル２は、例えば、保持面２１上に固定ジグ７を介して被加工物Ｗｂが載置され、保持面２１上に載置された固定ジグ７を吸引保持する。チャックテーブル２は、保持面２１を構成する部分がＳＵＳ、ポーラスセラミック等から形成された円盤形状であり、図示しない真空吸引経路を介して図示しない真空吸引源と接続され、保持面２１に載置された被加工物Ｗｂを、固定ジグ７を介して吸引することで保持する。チャックテーブル２は、図示しない回転駆動源によりＺ軸回りに回転され、さらにＸ軸移動機構４によりＸ軸方向に移動される。 The chuck table 2 holds the workpieces W a and W b . The workpiece W a is a large glass plate used for, for example, a cover glass of a mobile phone, and is before being cut. Workpiece W b are those workpiece W a is being cut into rectangular pieces of. For example, the workpiece W b is placed on the holding surface 21 via the fixed jig 7, and the chuck table 2 sucks and holds the fixed jig 7 placed on the holding surface 21. The chuck table 2 has a disk shape in which a portion constituting the holding surface 21 is formed of SUS, porous ceramic, or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) and placed on the holding surface 21. the workpiece W b which is, held by sucking through a fixing jig 7. The chuck table 2 is rotated around the Z axis by a rotation drive source (not shown), and further moved in the X axis direction by the X axis moving mechanism 4.

固定ジグ７は、被加工物Ｗｂを固定するものであり、矩形状の支持柱７１と、円板プレート７２とを含んで構成されている。支持柱７１は、円板プレート７２に立設して固定されている。被加工物Ｗｂの端部Ｅが支持柱７１の端面７１２からはみ出すように、支持柱７１の上面７１１に被加工物Ｗｂが接着されて固定されている。 Fixing jig 7 is for fixing the workpiece W b, a rectangular support column 71 is configured to include a disc plate 72. The support pillar 71 is erected and fixed to the disc plate 72. So that the end portion E of the workpiece W b protrudes from the end face 712 of the support column 71, the workpiece W b is fixedly bonded to the upper surface 711 of the support column 71.

切削機構３は切削手段として機能し、チャックテーブル２に保持された被加工物Ｗａに対して切削加工を行うものであり、切削ブレード３１と、スピンドル３２と、スピンドルハウジング３３と、ブレードカバー３４と、図示しない回転駆動部とを有している。切削ブレード３１は、スピンドル３２の先端部３２１に装着されている。スピンドル３２は、スピンドル３２の本体がスピンドルハウジング３３内に回転可能に保持され、回転駆動部により回転される。ブレードカバー３４は、スピンドルハウジング３３の前面に装着され、スピンドル３２の先端部３２１に固定された切削ブレード３１の周囲を囲っている。切削機構３は、装置本体１１に設けられている門型の支持部材１０に対して、Ｙ軸移動機構５およびＺ軸移動機構６により、Ｙ軸方向およびＺ軸方向に移動自在に支持されている。 The cutting mechanism 3 functions as a cutting means and performs a cutting process on the workpiece Wa held on the chuck table 2, and includes a cutting blade 31, a spindle 32, a spindle housing 33, and a blade cover 34. And a rotation drive unit (not shown). The cutting blade 31 is attached to the tip 321 of the spindle 32. The main body of the spindle 32 is rotatably held in the spindle housing 33, and the spindle 32 is rotated by a rotation driving unit. The blade cover 34 is attached to the front surface of the spindle housing 33 and surrounds the cutting blade 31 fixed to the tip portion 321 of the spindle 32. The cutting mechanism 3 is supported by a Y-axis moving mechanism 5 and a Z-axis moving mechanism 6 so as to be movable in the Y-axis direction and the Z-axis direction with respect to a portal-type support member 10 provided in the apparatus main body 11. Yes.

Ｘ軸移動機構４は加工送り手段として機能し、切削機構３に対してチャックテーブル２を加工送り方向（Ｘ軸方向）に相対移動させる。例えば、Ｘ軸移動機構４は、Ｘ軸方向に延在された図示しないボールねじと、ボールねじを回転させる駆動部と、ボールねじに螺合されたナットと、チャックテーブル２に固定された移動プレート４１と、移動プレート４１を案内する図示しないガイドレールとを有し、ボールねじを回転させてナットに固定されたチャックテーブル２を、移動プレート４１をガイドレールに摺動させながらＸ軸方向に移動させる。   The X-axis moving mechanism 4 functions as a machining feed means, and moves the chuck table 2 relative to the cutting mechanism 3 in the machining feed direction (X-axis direction). For example, the X-axis moving mechanism 4 includes a ball screw (not shown) that extends in the X-axis direction, a drive unit that rotates the ball screw, a nut that is screwed to the ball screw, and a movement that is fixed to the chuck table 2. The chuck table 2 having a plate 41 and a guide rail (not shown) for guiding the moving plate 41 and rotating the ball screw is fixed in the X-axis direction while sliding the moving plate 41 on the guide rail. Move.

Ｙ軸移動機構５は割り出し送り手段として機能し、加工送り方向（Ｘ軸方向）に直交する割り出し送り方向（Ｙ軸方向）に切削機構３をチャックテーブル２に対して相対移動させる。例えば、Ｙ軸移動機構５は、Ｙ軸方向に延在されたボールねじ５１と、ボールねじ５１を回転させる図示しない駆動部と、ボールねじ５１に螺合されたナットと、ナットに固定されて切削機構３を支持する支持プレート５２と、支持プレート５２を案内するガイドレール５３とを有し、ボールねじ５１を回転させてナットに固定された支持プレート５２をガイドレール５３に摺動させてＹ軸方向に移動させる。   The Y-axis moving mechanism 5 functions as an indexing feeding unit, and moves the cutting mechanism 3 relative to the chuck table 2 in an indexing feeding direction (Y-axis direction) orthogonal to the machining feeding direction (X-axis direction). For example, the Y-axis moving mechanism 5 includes a ball screw 51 extending in the Y-axis direction, a drive unit (not shown) that rotates the ball screw 51, a nut screwed to the ball screw 51, and a nut. It has a support plate 52 that supports the cutting mechanism 3 and a guide rail 53 that guides the support plate 52, and rotates the ball screw 51 to slide the support plate 52 fixed to the nut onto the guide rail 53. Move in the axial direction.

Ｚ軸移動機構６は、チャックテーブル２に対して切削機構３をＺ軸方向に相対移動させる。例えば、Ｚ軸移動機構６は、Ｚ軸方向に延在されたボールねじ６１と、ボールねじ６１を回転させる駆動部６２と、ボールねじ６１に螺合されたナットと、ナットに固定されて切削機構３を支持する支持プレート６３と、支持プレート６３を案内するガイドレール６４とを有し、ボールねじ６１を回転させてナットに固定された支持プレート６３をガイドレール６４に摺動させてＺ軸方向に移動させる。   The Z-axis moving mechanism 6 moves the cutting mechanism 3 relative to the chuck table 2 in the Z-axis direction. For example, the Z-axis moving mechanism 6 includes a ball screw 61 that extends in the Z-axis direction, a drive unit 62 that rotates the ball screw 61, a nut that is screwed to the ball screw 61, and a cutting that is fixed to the nut. A support plate 63 that supports the mechanism 3 and a guide rail 64 that guides the support plate 63, the ball screw 61 is rotated, and the support plate 63 fixed to the nut is slid on the guide rail 64 to make a Z-axis. Move in the direction.

本実施形態では、切削装置１は、切削機構３により被加工物Ｗａを切削して個片化して複数の被加工物Ｗｂを形成する機能と、個片化された被加工物Ｗｂの端部Ｅを研磨する機能とを有している。研磨工具８は、被加工物Ｗｂの端部Ｅを研磨するものであり、固定プレート９を介してブレードカバー３４に固定されている。固定プレート９およびブレードカバー３４は、装着ジグの一例である。 In the present embodiment, the cutting device 1 has a function of cutting a workpiece W a by the cutting mechanism 3 into individual pieces to form a plurality of workpieces W b , and a piece-by-piece workpiece W b. It has a function of polishing the end E of the. Polishing tool 8 is to polish the ends E of the workpiece W b, and is fixed to the blade cover 34 through the fixing plate 9. The fixing plate 9 and the blade cover 34 are an example of a mounting jig.

研磨工具８は、砥粒を平板に電着させたプレート状の工具であり、電鋳ブレードと同等の機能を有するものである。研磨工具８は、固定プレート９の前面９１に接着されて固定されている。固定プレート９には、ボルト９３を通すための穴部９２が２箇所設けられている。ブレードカバー３４の前面には、ボルト９３を螺合するための雌ねじ３４１が、固定プレート９の穴部９２に対応する位置に設けられている。   The polishing tool 8 is a plate-like tool in which abrasive grains are electrodeposited on a flat plate, and has a function equivalent to that of an electroformed blade. The polishing tool 8 is bonded and fixed to the front surface 91 of the fixed plate 9. The fixing plate 9 is provided with two holes 92 through which the bolts 93 are passed. On the front surface of the blade cover 34, a female screw 341 for screwing the bolt 93 is provided at a position corresponding to the hole 92 of the fixing plate 9.

次に、被加工物Ｗｂの研磨方法について説明する。図２は、被加工物の研磨例（加工送り）を示す正面図である。図３は、被加工物の研磨例（加工送り）を示す上面図である。図４は、被加工物の研磨例（割り出し送り）を示す上面図である。図５は、被加工物の研磨方法を示すフローチャートである。 Next, a description will be given of a polishing method of the workpiece W b. FIG. 2 is a front view showing an example of polishing (processing feed) of a workpiece. FIG. 3 is a top view showing an example of polishing (processing feed) of a workpiece. FIG. 4 is a top view showing an example of polishing (index feed) of a workpiece. FIG. 5 is a flowchart showing a method for polishing a workpiece.

図５に示すステップＳＴ１で、ブレードカバー３４に固定プレート９を介して研磨工具８を装着する（研磨工具装着ステップ）。例えば、研磨工具８が固定された固定プレート９をブレードカバー３４の前面に配置し、２本のボルト９３を固定プレート９の各穴部９２にそれぞれ通してブレードカバー３４の雌ねじ３４１に螺合し、固定プレート９をブレードカバー３４に固定する。次に、ステップＳＴ２に移行する。   In step ST1 shown in FIG. 5, the polishing tool 8 is mounted on the blade cover 34 via the fixed plate 9 (polishing tool mounting step). For example, the fixing plate 9 to which the polishing tool 8 is fixed is disposed on the front surface of the blade cover 34, and two bolts 93 are respectively passed through the holes 92 of the fixing plate 9 and screwed into the female screw 341 of the blade cover 34. The fixing plate 9 is fixed to the blade cover 34. Next, the process proceeds to step ST2.

ステップＳＴ２で、大判のガラス板である被加工物Ｗａが切削されて個片化された被加工物Ｗｂをチャックテーブル２に保持する（被加工物保持ステップ）。例えば、固定ジグ７の支持柱７１の上面７１１に被加工物Ｗｂを接着して固定し、被加工物Ｗｂが固定された固定ジグ７の円板プレート７２をチャックテーブル２に載置し、チャックテーブル２により円板プレート７２を吸引保持する。次に、ステップＳＴ３に移行する。 In step ST2, the holding of the workpiece W b of the workpiece W a is a glass plate large format is being cut singulated on the chuck table 2 (the workpiece holding step). For example, the workpiece W b is bonded and fixed to the upper surface 711 of the support column 71 of the fixed jig 7, and the disc plate 72 of the fixed jig 7 to which the workpiece W b is fixed is placed on the chuck table 2. The disk plate 72 is sucked and held by the chuck table 2. Next, the process proceeds to step ST3.

ステップＳＴ３で、被加工物Ｗｂと研磨工具８の位置合わせを行い、被加工物Ｗｂを研磨工具８により研磨する。例えば、被加工物Ｗｂが載置されたチャックテーブル２をＸ軸移動機構４によりＸ軸方向に移動させて、被加工物Ｗｂを研磨工具８の正面に移動させる。また、チャックテーブル２をＺ軸回りに回転して、矩形状の被加工物Ｗｂの端部Ｅが研磨工具８の研磨作用面８１に対して平行になるように設定する。Ｚ軸移動機構６により研磨工具８をＺ軸方向に移動させて、研磨工具８の研磨作用面８１の高さを被加工物Ｗｂの端部Ｅの高さと同程度の高さにする。Ｙ軸移動機構５により研磨工具８をＹ軸方向に移動させて、研磨工具８の研磨作用面８１を被加工物Ｗｂの端部Ｅに当接させる。これで、被加工物Ｗｂと研磨工具８の位置合わせが終了する。 In step ST3, the aligns the polishing tool 8 and the workpiece W b, is polished by the polishing tool 8 workpiece W b. For example, by moving the chuck table 2 the workpiece W b is placed on the X-axis direction by the X axis moving mechanism 4 to move the workpiece W b in front of the polishing tool 8. Further, the chuck table 2 rotates around the Z axis, rectangular shaped end E of the workpiece W b is set to be parallel to the polishing working surface 81 of the polishing tool 8. The polishing tool 8 by the Z-axis moving mechanism 6 is moved in the Z axis direction, the height of the polishing working surface 81 of the polishing tool 8 to the height of the height and the same degree of end E of the workpiece W b. The polishing tool 8 is moved in the Y-axis direction by the Y axis moving mechanism 5 is brought into contact with the polishing working surface 81 of the polishing tool 8 to the end portion E of the workpiece W b. This completes the alignment of the workpiece Wb and the polishing tool 8.

ここで、研磨工具８および固定プレート９の最下部８２と固定ジグ７の円板プレート７２の上面７２１との間は十分な間隔Ｈを有しており、研磨工具８および固定プレート９が円板プレート７２の上面７２１に接触することはない。また、切削ブレード３１は、研磨工具８および固定プレート９の最下部８２よりも上方に位置しているので、切削ブレード３１も円板プレート７２の上面７２１に接触せず、切削ブレード３１が研磨加工を邪魔することはない。   Here, there is a sufficient distance H between the lowermost portion 82 of the polishing tool 8 and the fixed plate 9 and the upper surface 721 of the disk plate 72 of the fixed jig 7, and the polishing tool 8 and the fixed plate 9 are discs. There is no contact with the upper surface 721 of the plate 72. Further, since the cutting blade 31 is positioned above the lowermost part 82 of the polishing tool 8 and the fixed plate 9, the cutting blade 31 does not contact the upper surface 721 of the disc plate 72, and the cutting blade 31 is polished. Will not disturb you.

Ｘ軸移動機構４によりチャックテーブル２をＸ軸方向に加工送りして被加工物Ｗｂを研磨工具８の研磨作用面８１で研磨する加工送り（図２および図３参照）と、Ｙ軸移動機構５により研磨工具８を被加工物Ｗｂ側（Ｙ軸方向）に割り出し送りする割り出し送り（図４参照）とを繰り返す。加工送りと割り出し送りは、被加工物Ｗｂに所望の研磨面が形成されるまで繰り返す（研磨ステップ）。例えば、被加工物ＷｂをＸ軸方向に移動する加工送りを１往復実施し、研磨工具８を被加工物Ｗｂ側に移動する割り出し送りを１回実施する工程を所定回数繰り返す。 The X axis moving mechanism 4 by feed machining the chuck table 2 in the X-axis direction and the machining feed for polishing the workpiece W b in the polishing working surface 81 of the polishing tool 8 (see FIGS. 2 and 3), moving Y-axis The mechanism 5 repeats index feed (see FIG. 4) for indexing and feeding the polishing tool 8 to the workpiece Wb side (Y-axis direction). Processing-feed and indexing-feed is repeated until the desired polishing surface to the workpiece W b is formed (polishing step). For example, a machining feed for moving the workpiece W b in the X-axis direction 1 reciprocally carried, repeated a predetermined number of times the step of performing once indexing to move the polishing tool 8 to the workpiece W b side.

なお、被加工物Ｗｂの端部Ｅの加工は、端部Ｅの面部Ｅｓを研磨する加工や、端部Ｅの角部Ｅｅを削る面取り加工がある。端部Ｅの面部Ｅｓを研磨する加工の場合、研磨工具８の研磨作用面８１と被加工物Ｗｂの端部Ｅの面部Ｅｓとを当接させて、被加工物ＷｂをＸ軸方向に加工送りさせる。 The processing of the end portion E of the workpiece W b is processing and polishing the surface portion E s end E, there is a chamfering cutting the corners E e of the end E. For machining of polishing the surface portion E s of the end portion E, the polishing working surface 81 of the polishing tool 8 and a surface portion E s of the end portion E of the workpiece W b is abutted against the workpiece W b X Process feed in the axial direction.

また、端部Ｅの角部Ｅｅを削る面取り加工の場合、被加工物Ｗｂの端部Ｅの角部Ｅｅを研磨工具８の研磨作用面８１に当接させて、被加工物ＷｂをＸ軸方向に加工送りさせる。例えば、被加工物Ｗｂの端部Ｅの角部Ｅｅが研磨工具８の研磨作用面８１に当接するように、図示しない固定ジグにより被加工物Ｗｂを斜めに固定する。 Further, in the case of chamfering that cuts the corner E e of the end E, the corner E e of the end E of the workpiece W b is brought into contact with the polishing surface 81 of the polishing tool 8 so that the workpiece W b is processed and fed in the X-axis direction. For example, as the corners E e of the end portion E of the workpiece W b comes into contact with the polishing working surface 81 of the polishing tool 8, the fixing jig (not shown) for fixing the workpiece W b obliquely.

以上のように、実施形態に係る被加工物Ｗｂの研磨方法によれば、切削装置１のブレードカバー３４に研磨工具８を装着することで、研磨専用装置と同様の加工が実施できるため、切断と研磨を１種類の装置で実施することができる。また、切削ブレード３１を装着するスピンドル３２ではなくブレードカバー３４に研磨工具８を装着するため、一方の工具を付けたままでも他の加工が可能であり、切削と研磨の工程変更が容易である。例えば、切削ブレード３１をスピンドル３２に装着した状態でも研磨加工が可能となる。また、切削装置１のブレードカバー３４に雌ねじ３４１を設けることにより研磨工具８を装着できるので、切削装置１に研磨機能を容易に導入することができ、導入コストが極めて低い。 As described above, according to the polishing method of the workpiece W b according to the embodiment, by mounting the polishing tool 8 to the blade cover 34 of the cutting device 1, since the same processing and polishing dedicated apparatus can be implemented, Cutting and polishing can be performed with one type of apparatus. Further, since the polishing tool 8 is attached to the blade cover 34 instead of the spindle 32 to which the cutting blade 31 is attached, other processing is possible even with one tool attached, and the cutting and polishing process can be easily changed. . For example, polishing can be performed even when the cutting blade 31 is mounted on the spindle 32. Further, since the polishing tool 8 can be mounted by providing the female cover 341 on the blade cover 34 of the cutting apparatus 1, the polishing function can be easily introduced into the cutting apparatus 1, and the introduction cost is extremely low.

なお、切削装置１は、切削機能と研磨機能を有するが、必ずしもこれらの両方の機能を使用する必要はなく、切削機能のみを使用してもよいし、研磨機能のみを使用してもよい。また、他の切削装置により切断された被加工物を切削装置１の研磨工具８により研磨してもよい。   Although the cutting device 1 has a cutting function and a polishing function, it is not always necessary to use both of these functions, and only the cutting function may be used, or only the polishing function may be used. Further, the workpiece cut by another cutting device may be polished by the polishing tool 8 of the cutting device 1.

また、研磨工具８をブレードカバー３４に装着した状態で、切削ブレード３１により被加工物Ｗａを切削することも考えられる。この場合、切削ブレード３１の刃先が研磨工具８および固定プレート９の最下部８２よりも下方に位置するように設定すると共に、切削時に研磨工具８および固定プレート９の最下部８２が円板プレート７２の上面７２１に接触しないように、当該最下部８２と円板プレート７２の上面７２１との間に十分な間隔設けておく。また、研磨時に切削ブレード３１の刃先が円板プレート７２の上面７２１に接触しないように、切削ブレード３１の刃先と円板プレート７２の上面７２１との間に十分な間隔を設けておく。 Further, in a state of mounting the grinding tool 8 to the blade cover 34, it is conceivable to cut the workpiece W a by the cutting blade 31. In this case, the cutting blade 31 is set so that the cutting edge is positioned below the lowermost portion 82 of the polishing tool 8 and the fixed plate 9, and the lowermost portion 82 of the polishing tool 8 and the fixed plate 9 is the disc plate 72 at the time of cutting. A sufficient space is provided between the lowermost part 82 and the upper surface 721 of the disc plate 72 so as not to contact the upper surface 721. In addition, a sufficient space is provided between the cutting edge of the cutting blade 31 and the upper surface 721 of the disc plate 72 so that the cutting edge of the cutting blade 31 does not contact the upper surface 721 of the disc plate 72 during polishing.

また、固定プレート９を用いて研磨工具８をブレードカバー３４に装着する例を説明したが、ブレードカバー３４に装着するのではなくスピンドルハウジング３３に研磨工具８を装着するようにしてもよい。この場合、切削ブレード３１を囲う固定部材の前面に研磨工具８を固定し、当該固定部材をスピンドルハウジング３３にねじ等により装着する。   Further, the example in which the polishing tool 8 is mounted on the blade cover 34 using the fixed plate 9 has been described, but the polishing tool 8 may be mounted on the spindle housing 33 instead of being mounted on the blade cover 34. In this case, the polishing tool 8 is fixed to the front surface of a fixing member that surrounds the cutting blade 31, and the fixing member is attached to the spindle housing 33 with screws or the like.

また、加工送りを１往復実施して割り出し送りを１回実施する工程を所定回数繰り返す例を説明したが、加工送りと割り出し送りの回数は適宜設定可能である。例えば、加工送りを２往復実施して割り出し送りを１回実施する工程を所定回数繰り返してもよい。   Moreover, although the example which repeats the process of performing one reciprocating process feed and performing the index feed once is demonstrated a predetermined number of times, the frequency | count of process feed and index feed can be set suitably. For example, the process of performing the processing feed twice and performing the indexing feed once may be repeated a predetermined number of times.

また、従来、切削ブレード３１を固定するマウント材の端面を研磨する端面修正用のソフトウェアが切削装置１には用意されており、本実施形態において、端面修正ソフトを用いて被加工物Ｗｂの端部Ｅを研磨工具８により研磨することも可能である。これにより、従来のソフトウェアを使用できるので、導入コストを削減できる。 Further, conventionally, end face correction software for polishing the end face of the mount material that fixes the cutting blade 31 is prepared in the cutting apparatus 1. In this embodiment, the end face correction software is used to adjust the workpiece W b . It is also possible to polish the end E with the polishing tool 8. Thereby, since conventional software can be used, introduction cost can be reduced.

また、研磨工具８は、砥粒を平板に電着させたプレート状の工具として説明したが、これに限定されない。例えば、被加工物の端部Ｅを湾曲させたい場合、円弧状の凹部を有した部材に砥粒を電着させた研磨工具としてもよい。   Moreover, although the polishing tool 8 was demonstrated as a plate-shaped tool which electrodeposited the abrasive grain on the flat plate, it is not limited to this. For example, when it is desired to bend the end E of the workpiece, a polishing tool in which abrasive grains are electrodeposited on a member having an arcuate recess may be used.

また、プレート状の研磨工具８は、被加工物Ｗｂの端部Ｅが当接する使用領域が摩耗するので、加工送りの回数が一定数を超えると研磨工具８をＺ軸移動手段６によりＺ軸方向に移動させて、研磨工具８の未使用領域に被加工物Ｗｂの端部Ｅを当接させて研磨を行うようにしてもよい。 Further, the plate-like polishing tool 8, the end portion E of the workpiece W b is used area wear abutting, the polishing tool 8 and the number of processing-feed exceeds a certain number by the Z-axis moving means 6 Z is moved in the axial direction, may be performed polishing abutted against not the end E of the workpiece W b in the unused area of the polishing tool 8.

また、被加工物Ｗｂの端部Ｅの角部Ｅｅが研磨工具８の研磨作用面８１に当接するように、図示しない固定ジグにより被加工物Ｗｂを斜めに固定する例を説明したが、これに限定されない。研磨工具８の研磨作用面８１が被加工物Ｗｂの角部Ｅｅに当接するように、図示しない固定プレートにより研磨工具８を斜めにブレードカバー３４に固定してもよい。また、研磨工具８の研磨作用面８１が被加工物Ｗｂの角部Ｅｅに当接するように、固定プレートおよび固定ジグの双方を斜めに固定してもよい。 Further, as the corners E e of the end portion E of the workpiece W b comes into contact with the polishing working surface 81 of the polishing tool 8, an example was described of fixing the workpiece W b obliquely by a fixing jig (not shown) However, it is not limited to this. As the polishing working surface 81 of the polishing tool 8 comes into contact with the corner portion E e of the workpiece W b, it may be fixed to the blade cover 34 the polishing tool 8 obliquely by a fixing plate (not shown). The polishing working surface 81 of the polishing tool 8 so as to abut against the corner portion E e of the workpiece W b, it may be fixed to both of the fixing plate and the fixing jig diagonally.

１ 切削装置
２ チャックテーブル
３ 切削機構
３１ 切削ブレード
３２ スピンドル
３３ スピンドルハウジング
３４ ブレードカバー
４ Ｘ軸移動機構
５ Ｙ軸移動機構
６ Ｚ軸移動機構
７ 固定ジグ
７１ 支持柱
７２ 円板プレート
８ 研磨工具
９ 固定プレート
９３ ボルト
８１ 研磨作用面
Ｗｂ 被加工物
Ｅ 端部 DESCRIPTION OF SYMBOLS 1 Cutting device 2 Chuck table 3 Cutting mechanism 31 Cutting blade 32 Spindle 33 Spindle housing 34 Blade cover 4 X-axis moving mechanism 5 Y-axis moving mechanism 6 Z-axis moving mechanism 7 Fixed jig 71 Support pillar 72 Disc plate 8 Polishing tool 9 Fixed Plate 93 Bolt 81 Polishing surface W b Workpiece E End

Claims (1)

被加工物を保持するチャックテーブルと、先端に切削ブレードを装着するスピンドルと該スピンドルを回転可能に保持するスピンドルハウジングとを備え、該チャックテーブルに保持された被加工物を切削する切削手段と、該チャックテーブルと該切削手段とを加工送り方向に相対移動させる加工送り手段と、該チャックテーブルと該切削手段とを該加工送り方向に直交する割り出し送り方向に相対移動させる割り出し送り手段と、を備える切削装置を用い、該スピンドルハウジングに研磨工具を装着して該チャックテーブルに保持した被加工物を研磨する研磨方法であって、
該チャックテーブルに被加工物を保持する被加工物保持ステップと、
該スピンドルハウジングに装着ジグを介して該研磨工具を装着する研磨工具装着ステップと、
該被加工物保持ステップと該研磨工具装着ステップを実施した後、該加工送り手段で該チャックテーブルを加工送りし被加工物を該研磨工具で研磨する加工送りと、該割り出し送り手段で被加工物を該研磨工具側に割り出し送りする割り出し送りと、を繰り返し被加工物に所望の研磨面が形成されるまで繰り返す研磨ステップと、を備えることを特徴とする被加工物の研磨方法。 A chuck table for holding a workpiece; a spindle for mounting a cutting blade at a tip; and a spindle housing for rotatably holding the spindle; a cutting means for cutting the workpiece held on the chuck table; A machining feed means for relatively moving the chuck table and the cutting means in a machining feed direction; and an index feed means for relatively moving the chuck table and the cutting means in an index feed direction perpendicular to the machining feed direction. A polishing method for polishing a workpiece held on the chuck table by attaching a polishing tool to the spindle housing using a cutting device comprising:
A workpiece holding step for holding the workpiece on the chuck table;
A polishing tool mounting step of mounting the polishing tool on the spindle housing via a mounting jig;
After performing the workpiece holding step and the polishing tool mounting step, the machining table feeds the chuck table by the machining feed means and polishes the workpiece by the polishing tool, and the index feed means works the workpiece. A method for polishing a workpiece, comprising: indexing and feeding the workpiece to the polishing tool side; and repeating a polishing step repeatedly until a desired polishing surface is formed on the workpiece.
JP2014209454A 2014-10-10 2014-10-10 Workpiece polishing method Active JP6388518B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014209454A JP6388518B2 (en) 2014-10-10 2014-10-10 Workpiece polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014209454A JP6388518B2 (en) 2014-10-10 2014-10-10 Workpiece polishing method

Publications (2)

Publication Number Publication Date
JP2016078138A true JP2016078138A (en) 2016-05-16
JP6388518B2 JP6388518B2 (en) 2018-09-12

Family

ID=55957191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014209454A Active JP6388518B2 (en) 2014-10-10 2014-10-10 Workpiece polishing method

Country Status (1)

Country Link
JP (1) JP6388518B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017078314A (en) * 2015-10-22 2017-04-27 東日本旅客鉄道株式会社 Crosstie binder

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277110A (en) * 2000-04-03 2001-10-09 Sony Corp Work method and device for forming rectangular member into bar-shaped member
JP2004148487A (en) * 2002-10-11 2004-05-27 Murata Mfg Co Ltd Polishing method, and polishing apparatus used in the same method
JP2011036939A (en) * 2009-08-07 2011-02-24 Disco Abrasive Syst Ltd Cutting polishing device
JP2012223848A (en) * 2011-04-19 2012-11-15 Disco Corp End face correction method for flange

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277110A (en) * 2000-04-03 2001-10-09 Sony Corp Work method and device for forming rectangular member into bar-shaped member
JP2004148487A (en) * 2002-10-11 2004-05-27 Murata Mfg Co Ltd Polishing method, and polishing apparatus used in the same method
JP2011036939A (en) * 2009-08-07 2011-02-24 Disco Abrasive Syst Ltd Cutting polishing device
JP2012223848A (en) * 2011-04-19 2012-11-15 Disco Corp End face correction method for flange

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017078314A (en) * 2015-10-22 2017-04-27 東日本旅客鉄道株式会社 Crosstie binder

Also Published As

Publication number Publication date
JP6388518B2 (en) 2018-09-12

Similar Documents

Publication Publication Date Title
US10668595B2 (en) Method of using laminated dressing board
CN107186891B (en) Method for cutting workpiece
JP2009176848A (en) Method of grinding wafer
JP5717571B2 (en) Cutting equipment
TWI693994B (en) Method for shaping front end shape of cutting blade
JP5975723B2 (en) Cutting equipment
JP2009202323A (en) Method for machining holding surface of planar object
JP6120717B2 (en) Resin blade shaping method
CN107919274B (en) Processing method
TWI668751B (en) Grinding method of workpiece
JP2021094693A (en) Manufacturing method of chamfered baseboard and chamfering device used in the same
JP6486785B2 (en) End face correction jig and end face correction method
JP6103895B2 (en) Cutting equipment
JP6388518B2 (en) Workpiece polishing method
JP5244548B2 (en) Holding table and processing device
KR102047717B1 (en) Dressing mechanism of blade, cutting device provided with the mechanism, and dressing method of blade using the mechanism
JP6151529B2 (en) Grinding method of sapphire wafer
JP5912696B2 (en) Grinding method
JP6850569B2 (en) Polishing method
JP6976713B2 (en) Chamfer grinding method and chamfer grinding equipment
JP2015103567A (en) Wafer processing method
JP6736217B2 (en) Cutting equipment
JP6075775B2 (en) Cutting equipment
CN117620851A (en) Grinding device
CN111452238A (en) Cutting device and dressing method of cutting tool

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170815

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180417

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180612

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180724

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180814

R150 Certificate of patent or registration of utility model

Ref document number: 6388518

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250