JP2016074795A - Resin composition and resin molded body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a resin molded body having suppressed dimensional change under high temperature and high moisture environment.SOLUTION: There is provided a resin composition containing (A) a cellulose ester resin, (B) an epoxy group-containing plasticizer of 5 pts.mass to 10 pts.mass based on 100 pts.mass of the (A) cellulose ester resin and (C) a non-reactive plasticizer having no functional group reactive with the (A) cellulose ester resin of 10 pts.mass to 30 pts.mass based on 100 pts.mass of the (A) cellulose ester resin.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition and a resin molded body.

Conventionally, various resin compositions have been provided and used for various applications. In particular, it is used for various parts and casings of home appliances and automobiles, and thermoplastic resin is also used for parts such as casings for office equipment and electronic and electrical equipment.
In recent years, plant-derived resins have been used, and cellulose derivatives are one of the conventionally known plant-derived resins.

  For example, Patent Document 1 discloses a fatty acid cellulose ester-based resin composition containing a phosphite compound having a melting point exceeding room temperature.

JP-A-10-306175

  The problem of the present invention is that when the amount of the epoxy group-containing plasticizer is out of the range described later in the system including the cellulose ester resin, the epoxy group-containing plasticizer, and the non-reactive plasticizer, or the amount of the non-reactive plasticizer is described later. Outside the range, when a non-reactive plasticizer is not included in a system including a cellulose ester resin and an epoxy group-containing plasticizer, or when a non-reactive plasticizer is included in a system including a cellulose ester resin and a non-reactive plasticizer. It is providing the resin composition from which the resin molding which suppressed the dimensional change in a high-temperature, high-humidity environment compared with the case where it does not contain is obtained.

The above object is achieved by the present invention described below.
The invention according to claim 1
(A) a cellulose ester resin;
(B) an epoxy group-containing plasticizer having an amount of 5 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the cellulose ester resin (A);
(A) a non-reactive plasticizer having a functional group capable of reacting with the cellulose ester resin (C) having an amount of 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the (A) cellulose ester resin; Is a resin composition.

The invention according to claim 2
The resin composition according to claim 1, wherein the (A) cellulose ester resin is a cellulose ester resin represented by the following general formula (1).

(In General Formula (1), R ¹ , R ² , and R ³ each independently represent a hydrogen atom or an acyl group having 1 to 3 carbon atoms. N represents an integer of 1 or more.)

The invention according to claim 3
3. The resin composition according to claim 1, wherein an epoxy equivalent of the (B) epoxy group-containing plasticizer is 170 or more and 300 or less.

The invention according to claim 4
Any one of Claims 1-3 which contains at least 1 type selected from the group which consists of epoxidized soybean oil, epoxidized linseed oil, and epoxyhexahydrophthalic acid diepoxy stearyl as said (B) epoxy group containing plasticizer. The resin composition according to item 1.

The invention according to claim 5
The resin composition according to any one of claims 1 to 4, wherein the non-reactive plasticizer (C) includes at least one selected from the group consisting of an adipic acid ester-containing compound and a polyether ester compound. It is a thing.

The invention according to claim 6
It is a resin molding containing the resin composition of any one of Claims 1-5.

  According to the first aspect of the present invention, when the amount of the epoxy group-containing plasticizer is out of the above range in the system including the cellulose ester resin, the epoxy group-containing plasticizer, and the non-reactive plasticizer, When the amount is out of the above range, when a non-reactive plasticizer is not included in a system including a cellulose ester resin and an epoxy group-containing plasticizer, or an epoxy group is included in a system including a cellulose ester resin and a non-reactive plasticizer. Provided is a resin composition capable of obtaining a resin molded body in which dimensional change in a high-temperature and high-humidity environment is suppressed as compared with the case where no plasticizer is contained.

  According to the invention which concerns on Claim 2, when the quantity of an epoxy-group containing plasticizer remove | deviates from the said range in the system containing a cellulose ester resin, an epoxy-group-containing plasticizer, and a non-reactive plasticizer, When the amount is out of the above range, when a non-reactive plasticizer is not included in a system including a cellulose ester resin and an epoxy group-containing plasticizer, or an epoxy group is included in a system including a cellulose ester resin and a non-reactive plasticizer. A resin composition that includes a cellulose ester resin represented by the general formula (1) as a cellulose ester resin as compared with a case in which a plasticizer is not included, and a resin molded body in which a dimensional change in a high-temperature and high-humidity environment is suppressed is obtained. Provided.

  According to the invention of claim 3, in a system including a cellulose ester resin, an epoxy group-containing plasticizer, and a non-reactive plasticizer in an amount within the above range, the epoxy equivalent of the epoxy group-containing plasticizer is outside the above range. Compared with the case, the resin composition from which the resin molding which suppressed the dimensional change in a high-temperature, high-humidity environment is obtained is provided.

  According to the invention of claim 4, in a system comprising a cellulose ester resin, an epoxy group-containing plasticizer, and a non-reactive plasticizer in an amount within the above range, the epoxy group-containing plasticizer is “phenol novolac type epoxy” or Compared to the case of “bisphenol-type epoxy”, a resin composition is provided that can provide a resin molded product in which dimensional change in a high-temperature and high-humidity environment is suppressed.

  According to the invention of claim 5, in a system comprising a cellulose ester resin, an epoxy group-containing plasticizer, and a non-reactive plasticizer in an amount within the above range, the non-reactive plasticizer is “acetic ester” The resin composition from which the resin molding which suppressed the dimensional change in a high-temperature, high-humidity environment compared with is obtained is provided.

  According to the invention which concerns on Claim 6, when the quantity of an epoxy group containing plasticizer remove | deviates from the said range in the system containing a cellulose ester resin, an epoxy group containing plasticizer, and a non-reactive plasticizer, When the amount is out of the above range, when a non-reactive plasticizer is not included in a system including a cellulose ester resin and an epoxy group-containing plasticizer, or an epoxy group is included in a system including a cellulose ester resin and a non-reactive plasticizer. Compared with the case where a plasticizer is not included, a resin molded body in which a dimensional change in a high temperature and high humidity environment is suppressed is provided.

  Hereinafter, an embodiment as an example of the resin composition and the resin molded body of the present invention will be described.

[Resin composition]
The resin composition according to this embodiment has (A) a cellulose ester resin, (B) an epoxy group-containing plasticizer, and no functional group capable of reacting with the (A) cellulose ester resin. And a plasticizer.
(B) The epoxy group-containing plasticizer is 5 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the (A) cellulose ester resin, and (C) the non-reactive plasticizer is the (A) cellulose ester resin 100. The quantity with respect to a mass part is 10 to 30 mass parts.

Conventionally, a cellulose ester resin has been used as a resin composition. However, in a resin molded product obtained by molding a resin composition using a cellulose ester resin, a dimensional change may occur when left in a high temperature and high humidity environment (65 ° C. × 85% RH), and improvement is required. It was done.
On the other hand, the resin composition according to the present embodiment includes (A) a cellulose ester resin, (B) an epoxy group-containing plasticizer, and (C) a non-reactive plasticizer, and (B) an epoxy group containing By making the amount of the plasticizer and (C) the non-reactive plasticizer within the above range, dimensional change under a high temperature and high humidity environment (65 ° C. × 85% RH) is suppressed.

The mechanism by which the above effect is achieved is not necessarily clear, but is estimated as follows.
That is, by including the (B) epoxy group-containing plasticizer, the epoxy group contained in the (B) epoxy group-containing plasticizer reacts with the hydroxyl group and carboxyl group at the terminal of the cellulose ester resin to form a crosslinked structure. . It is considered that this cross-linked structure suppresses deformation of the resin molded body and suppresses dimensional change even in a high temperature and high humidity environment.
However, it is considered that only the (B) epoxy group-containing plasticizer contained as a plasticizer cannot achieve compatibility with the (A) cellulose ester resin, and a good dispersion state cannot be obtained. Therefore, by using (C) a non-reactive plasticizer in combination, hydrogen bonds in the cellulose ester resin molecules are inhibited by the presence of the (C) non-reactive plasticizer, packing is suppressed, and the resin molecules It is considered that (B) the epoxy group-containing plasticizer is easily dispersed. As a result, it is surmised that the above-mentioned crosslinked structure is formed satisfactorily and the dimensional change is suppressed.

In addition, the content change of (B) epoxy group containing plasticizer is less than 5 mass parts with respect to 100 mass parts of (A) cellulose-ester resin, and cannot suppress the dimensional change in a high-temperature, high-humidity environment.
On the other hand, when the amount exceeds 10 parts by mass, it is considered that a large amount of (B) epoxy group-containing plasticizer generates a large amount of unreacted epoxy groups and absorbs moisture due to its polarity. The dimensional change below cannot be suppressed. Further, (B) bleeding occurs, which is a phenomenon in which the epoxy group-containing plasticizer is deposited on the surface.

In addition, when the content of the (C) non-reactive plasticizer is less than 10 parts by mass with respect to 100 parts by mass of the (A) cellulose ester resin, the dimensional change under a high temperature and high humidity environment cannot be suppressed.
On the other hand, when it exceeds 30 parts by mass, it is considered that (C) the excess of the non-reactive plasticizer inhibits the formation of a crosslinked structure by the hydroxyl group and carboxyl group of the cellulose ester resin and the epoxy group of the epoxy group-containing plasticizer. As a result, the dimensional change in a high temperature and high humidity environment cannot be suppressed. Further, (C) bleeding occurs, which is a phenomenon in which a non-reactive plasticizer is deposited on the surface.

  Hereinafter, the components of the resin composition according to this embodiment will be described in detail.

[(A) Cellulose ester resin]
The resin composition according to the present embodiment contains a cellulose ester resin. Specific examples of the cellulose ester resin include a cellulose ester resin represented by the general formula (1).

In General Formula (1), R ¹ , R ² , and R ³ each independently represent a hydrogen atom or an acyl group having 1 to 3 carbon atoms. n represents an integer of 1 or more.

In general formula (1), examples of the acyl group represented by R ¹ , R ² , and R ³ include an acetyl group, a propionyl group, and a butyryl group. As the acyl group, an acetyl group is desirable from the viewpoint of improving the transparency and tensile rupture energy characteristics of the resin molded product. Further, from the viewpoint of improving moldability of the resin composition, an acetyl group is desirable as the acyl group.

In the general formula (1), the range of n is not particularly limited, but is preferably from 250 to 750, more preferably from 350 to 600.
When n is 250 or more, the strength of the resin molded body tends to increase. When n is 750 or less, a decrease in flexibility of the resin molded body is easily suppressed. For this reason, when n is in the above range, the tensile fracture energy characteristic of the resin molded product is further improved.

Here, in the general formula (1), R ¹ , R ² , and R ³ each independently represent an acyl group, which means that at least a part of the hydroxyl groups of the cellulose ester resin represented by the general formula (1) is acyl. It is shown that.
That is, n R ¹ in the cellulose ester resin molecule may be all the same, partly the same or different from each other. Similarly, n R ^{2 s} and n A ^{3 s} may all be the same, partially the same, or different from each other.

The degree of substitution of the cellulose ester resin is preferably from 2.1 to 2.6, and more preferably from 2.2 to 2.5.
When the substitution degree is 2.1 or more, the affinity with the polyether ester compound is likely to increase. When the substitution degree is 2.6 or less, crystallization of the cellulose ester resin is suppressed, and thermoplasticity is easily developed. For this reason, when the degree of substitution is within the above range, the transparency and tensile rupture energy characteristics of the resin molded body are improved. Moreover, the moldability of the resin composition is improved.
The degree of substitution is an index indicating the degree of acylation of the cellulose ester resin. Specifically, the degree of substitution means an intramolecular average of the number of substitutions in which three hydroxyl groups in the D-glucopyranose unit of the cellulose ester resin are substituted with acyl groups.

Here, from the viewpoint of improving the transparency and tensile rupture energy characteristics of the resin molded body, in particular, the cellulose ester resin has an acetyl group as an acyl group that R ¹ , R ² , and R ³ each independently represent. In addition, a resin having a substitution degree of 2.1 or more and 2.6 or less is desirable.

The weight average molecular weight (Mw) of the cellulose ester resin is preferably 100,000 or more and 300,000 or less, and more preferably 150,000 or more and 200,000 or less, from the viewpoint of improving the transparency and tensile breaking energy characteristics of the resin molded product.
A weight average molecular weight is the value measured by the method similar to the measuring method of the weight average molecular weight of the below-mentioned polyetherester compound.

  Hereinafter, although the specific example of cellulose-ester resin is shown, it is not necessarily restricted to this.

[(B) Epoxy group-containing plasticizer]
The epoxy group-containing plasticizer is not particularly limited, but preferably has an epoxy equivalent of 170 or more and 300 or less, and more preferably 250 or more and 300 or less.
When the epoxy equivalent is 250 or more, a dimensional change in a high temperature and high humidity environment can be further suppressed. On the other hand, when the epoxy equivalent is 300 or less, an effect that bleeding out of the plasticizer from the molded body can be further suppressed is obtained.

  In addition, the epoxy equivalent of an epoxy group containing plasticizer is measured by the method prescribed | regulated to JIS-K7236.

Examples of the epoxy group-containing plasticizer include an aliphatic epoxy compound having an epoxy group and an aromatic epoxy compound having an epoxy group.
Examples of the aliphatic epoxy compound include epoxidized vegetable oil, triepoxy glycol, alkylene-1,6-diepoxy, epoxy adipic acid ester, and epoxy alkyl stearate.
Epoxidized vegetable oil is obtained by oxidizing a naturally occurring vegetable oil with an epoxidizing agent. Specifically, for example, epoxidized soybean oil, epoxidized linseed oil, epoxidized castor oil, epoxidized olive oil, etc. Can be mentioned.
Examples of the aromatic epoxy compound include epoxyhexahydrophthalate diepoxystearyl, epoxyhexahydrophthalate diethylhexyl, epoxyhexahydrophthalate diisodecyl, phenol novolac type epoxy, cresol novolac type epoxy, and bisphenol A type. An epoxy, a bisphenol F type epoxy, etc. are mentioned.

  Among these, epoxidized soybean oil, epoxidized linseed oil, and epoxyhexahydrophthalic acid diepoxy stearyl are more desirable from the viewpoint of further suppressing dimensional changes in a high-temperature and high-humidity environment.

[(C) Non-reactive plasticizer]
“Non-reactive” in the non-reactive plasticizer in the present embodiment means that it does not have a functional group capable of reacting with the (A) cellulose ester resin.
It is not particularly limited as long as it is a plasticizer that does not have a functional group capable of reacting with a cellulose ester resin. For example, a polyether ester compound, an adipic acid ester-containing compound, a sebacic acid ester compound, a glycol ester compound, an acetic acid ester, A dibasic acid ester compound, a phosphoric acid ester compound, a phthalic acid ester compound, camphor, etc. are mentioned.
Among these, a polyetherester compound and an adipic acid ester-containing compound are more desirable from the viewpoint of further suppressing dimensional changes in a high-temperature and high-humidity environment.

-Polyetherester compound-
Specifically as a polyetherester compound, the polyetherester compound represented by General formula (2) is mentioned, for example.

In General Formula (2), R ⁴ and R ⁵ each independently represents an alkylene group having 2 to 10 carbon atoms. A ¹ and A ² each independently represents an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 18 carbon atoms. m represents an integer of 1 or more.

In general formula (2), the alkylene group represented by R ⁴ is preferably an alkylene group having 3 to 10 carbon atoms, and more preferably an alkylene group having 3 to 6 carbon atoms. The alkylene group represented by R ⁴ may be linear, branched or cyclic, but is preferably linear.
When the number of carbon atoms of the alkylene group represented by R ⁴ is 3 or more, a decrease in fluidity of the resin composition is suppressed, and thermoplasticity is easily exhibited. When the number of carbon atoms of the alkylene group represented by R ⁴ is 10 or less or the alkylene group represented by R ⁴ is linear, the affinity with the cellulose ester resin is likely to increase. For this reason, when the alkylene group represented by R ⁴ is linear and the carbon number is in the above range, the transparency and tensile rupture energy characteristics (particularly transparency) of the resin molded product are improved. Moreover, the moldability of the resin composition is improved.
From these viewpoints, the alkylene group represented by R ⁴ is particularly preferably an n-hexylene group (— (CH ₂ ) ₆ —). That is, the polyetherester compound is desirably a compound that represents an n-hexylene group (— (CH ₂ ) ₆ —) as R ⁴ .

In general formula (2), the alkylene group represented by R ⁵ is preferably an alkylene group having 3 to 10 carbon atoms, and more preferably an alkylene group having 3 to 6 carbon atoms. The alkylene group represented by R ⁵ may be linear, branched, or cyclic, but is preferably linear.
When the number of carbon atoms of the alkylene group represented by R ⁵ is 3 or more, a decrease in fluidity of the resin composition is suppressed, and thermoplasticity is easily exhibited. When the number of carbon atoms of the alkylene group represented by R ⁵ is 10 or less or the alkylene group represented by R ⁵ is linear, the affinity with the cellulose ester resin is likely to increase. Therefore, when the alkylene group represented by R ⁵ is linear and the carbon number is in the above range, the transparency and tensile rupture energy characteristics (particularly transparency) of the resin molded product are improved. Moreover, the moldability of the resin composition is improved.
From these viewpoints, the alkylene group represented by R ⁵ is particularly preferably an n-butylene group (— (CH ₂ ) ₄ —). That is, the polyether ester compound is desirably a compound that represents an n-butylene group (— (CH ₂ ) ₄ —) as R ⁵ .

In general formula (2), the alkyl group represented by A ¹ and A ² is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably an alkyl group having 2 to 4 carbon atoms. The alkyl group represented by A ¹ and A ² may be linear, branched or cyclic, but is preferably branched.
Examples of the aryl group represented by A ¹ and A ² include unsubstituted aryl groups such as a phenyl group and a naphthyl group; and substituted phenyl groups such as a t-butylphenyl group and a hydroxyphenyl group.
The aralkyl group represented by A ¹ and A ² is a group represented by -R ^A -Ph. R ^A represents a linear or branched alkylene group having 1 to 6 carbon atoms (preferably 2 to 4 carbon atoms). Ph represents an unsubstituted phenyl group: a substituted phenyl group substituted with a linear or branched alkyl group having 1 to 6 carbon atoms (preferably 2 to 6 carbon atoms). Specific examples of the aralkyl group include unsubstituted aralkyl groups such as benzyl group, phenylmethyl group (phenethyl group), phenylpropyl group, and phenylbutyl group; substituted aralkyl groups such as methylbenzyl group, dimethylbenzyl group, and methylphenethyl group. Groups.

It is desirable that at least one of A ¹ and A ² represents an aryl group or an aralkyl group. In other words, a polyether ester compound, A ^1, and it is desirable as at least one of A ² aryl groups (preferably phenyl group) which is a compound representing the or aralkyl group, an aryl group both as A ^1, and A ² ( Desirably, it is a compound representing a phenyl group) or an aralkyl group [particularly an aryl group (preferably a phenyl group)]. A polyether ester compound that represents an aryl group (preferably a phenyl group) or an aralkyl group as at least one of A ¹ and A ² tends to generate an appropriate space between molecules of the cellulose ester resin, and between the molecules of the resin ( B) The epoxy group-containing plasticizer is more easily dispersed.

  Next, the characteristics of the polyetherester compound will be described.

The weight average molecular weight (Mw) of the polyether ester compound is preferably from 450 to 650, more preferably from 500 to 600.
When the weight average molecular weight (Mw) is 450 or more, bleeding (a phenomenon of precipitation) becomes difficult. When the weight average molecular weight (Mw) is 650 or less, the affinity with the cellulose ester resin is likely to increase. For this reason, when a weight average molecular weight (Mw) is made into the said range, the transparency and tensile fracture energy characteristic of a resin molding will improve. Moreover, the moldability of the resin composition is improved.
The weight average molecular weight (Mw) is a value measured by gel permeation chromatography (GPC). Specifically, the molecular weight measurement by GPC is carried out with a chloroform solvent using Tosoh Corporation HPLC1100 as a measuring apparatus, using a Tosoh column TSKgel GMHHR-M + TSKgel GMHHR-M (7.8 mm ID 30 cm). . The weight average molecular weight is calculated from the measurement result using a molecular weight calibration curve prepared with a monodisperse polystyrene standard sample.

The viscosity of the polyether ester compound at 25 ° C. is preferably 35 mPa · s to 50 mPa · s, and more preferably 40 mPa · s to 45 mPa · s.
When the viscosity is 35 mPa · s or more, the dispersibility in the cellulose ester resin is easily improved. When the viscosity is 50 mPa · s or less, the anisotropy of the dispersion of the polyetherester compound hardly appears. For this reason, when a viscosity is made into the said range, the transparency and tensile fracture energy characteristic of a resin molding will improve. Moreover, the moldability of the resin composition is improved.
The viscosity is a value measured with an E-type viscometer.

The solubility parameter (SP value) of the polyether ester compound is preferably from 9.5 to 9.9, and more preferably from 9.6 to 9.8.
When the solubility parameter (SP value) is 9.5 or more and 9.9 or less, the dispersibility in the cellulose ester resin is easily improved.
The solubility parameter (SP value) is a value calculated by the method of Fedor. Specifically, the solubility parameter (SP value) is, for example, Polym. Eng. Sci. , Vol. 14, p. 147 (1974), the SP value is calculated by the following formula.
Formula: SP value = √ (Ev / v) = √ (ΣΔei / ΣΔvi)
(Where Ev: evaporation energy (cal / mol), v: molar volume (cm ³ / mol), Δei: evaporation energy of each atom or atomic group, Δvi: molar volume of each atom or atomic group)
The solubility parameter (SP value) employs (cal / cm ³ ) ^1/2 as a unit, but the unit is omitted in accordance with common practice and expressed in a dimensionless manner.

  Hereinafter, although the specific example of a polyetherester compound is shown, it is not necessarily restricted to this.

-Adipate-containing compound-
Adipic acid ester-containing compound (compound containing adipic acid ester) is a compound of adipic acid ester alone or a mixture of adipic acid ester and a component other than adipic acid ester (a compound different from adipic acid ester) Indicates. However, the adipic acid ester-containing compound may contain 50% by mass or more of the adipic acid ester with respect to all components.

  Examples of the adipic acid ester include adipic acid diester and adipic acid polyester. Specific examples include an adipic acid diester represented by the general formula (2-1), an adipic acid polyester represented by the following general formula (2-2), and the like.

In the general formulas (2-1) and (2-2), R ⁴ and R ⁵ are each independently an alkyl group, a polyoxyalkyl group [— (C _x H _2X —O) _y —R ^A1 ] (provided that , R ^A1 represents an alkyl group, x represents an integer of 1 to 10, and y represents an integer of 1 to 10.
R ⁶ represents an alkylene group.
m1 represents an integer of 1 or more and 20 or less.
m2 represents an integer of 1 or more and 10 or less.

In general formulas (2-1) and (2-2), the alkyl group represented by R ⁴ and R ⁵ is preferably an alkyl group having 1 to 6 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms. . The alkyl group may be linear, branched or cyclic, but is preferably linear or branched.
In the general formulas (2-1) and (2-2), in the polyoxyalkyl group [— (C _x H _2X —O) _y —R ^A1 ] represented by R ⁴ and R ⁵ , the alkyl group represented by R ^A1 is An alkyl group having 1 to 6 carbon atoms is desirable, and an alkyl group having 1 to 4 carbon atoms is more desirable. The alkyl group may be linear, branched or cyclic, but is preferably linear or branched.
x preferably represents an integer of 1 to 10. y is preferably an integer from 1 to 10.

In general formulas (2-1) and (2-2), the alkylene group represented by R ⁶ is preferably an alkylene group having 1 to 6 carbon atoms, and more preferably an alkylene group having 1 to 4 carbon atoms. The alkylene group may be linear, branched or cyclic, but is preferably linear or branched.

  In general formulas (2-1) and (2-2), the group represented by each symbol may be substituted with a substituent. Examples of the substituent include an alkyl group, an aryl group, and a hydroxyl group.

  The molecular weight (or weight average molecular weight) of the adipic acid ester is desirably 200 or more and 5000 or less, and more desirably 300 or more and 2000 or less. In addition, a weight average molecular weight is the value measured by the measuring method similar to the weight average molecular weight of the above-mentioned cellulose ester compound.

  Hereinafter, although the specific example of an adipic acid ester containing compound is shown, it is not necessarily restricted to this.

[Contents of (A) Cellulose Ester Resin, (B) Epoxy Group-Containing Plasticizer, (C) Nonreactive Plasticizer]
(A) With respect to 100 parts by mass of the cellulose ester resin, the (B) epoxy group-containing plasticizer is contained in an amount of 5 to 10 parts by mass, and more preferably 7 to 10 parts by mass. . (B) The dimensional change in a high-temperature, high-humidity environment cannot be suppressed as content of an epoxy group containing plasticizer is less than 5 mass parts. On the other hand, when it exceeds 10 parts by mass, the dimensional change in a high-temperature and high-humidity environment cannot be suppressed due to an excess of (B) an epoxy group-containing plasticizer. Further, (B) bleeding occurs, which is a phenomenon in which the epoxy group-containing plasticizer is deposited on the surface.

(A) The non-reactive plasticizer (C) is contained in an amount of 10 to 30 parts by mass and preferably 15 to 25 parts by mass with respect to 100 parts by mass of the cellulose ester resin.
(C) The dimensional change in a high-temperature, high-humidity environment cannot be suppressed as content of a non-reactive plasticizer is less than 10 mass parts. On the other hand, if the content exceeds 30 parts by mass, the dimensional change in a high-temperature and high-humidity environment cannot be suppressed due to an excess of (C) nonreactive plasticizer. Further, (C) bleeding occurs, which is a phenomenon in which a non-reactive plasticizer is deposited on the surface.

  The mass ratio of the (A) cellulose ester resin to the entire resin composition is preferably 30% by mass to 85% by mass, and more preferably 60% by mass to 85% by mass.

[Other ingredients]
The resin composition according to the present embodiment may further include other components than those described above as necessary. Examples of other components include flame retardants, compatibilizers, plasticizers, antioxidants, release agents, light proofing agents, weathering agents, colorants, pigments, modifiers, anti-drip agents, antistatic agents, Hydrolysis inhibitor, filler, reinforcing agent (glass fiber, carbon fiber, talc, clay, mica, glass flake, milled glass, glass bead, crystalline silica, alumina, silicon nitride, alumina nitride, boron nitride, etc.) Is mentioned. The content of these components is preferably 0% by mass or more and 5% by mass or less with respect to the entire resin composition. Here, “0 mass%” means that other components are not included.

The resin composition according to the present embodiment may contain a resin other than the above resin. However, other resins may be contained in a total mass of 40% by mass or less.
Examples of the other resins include conventionally known thermoplastic resins, and specifically, polycarbonate resins; polypropylene resins; polyester resins; polyolefin resins; polyester carbonate resins; polyphenylene ether resins; Polyethersulfone resin; Polyarylene resin; Polyetherimide resin; Polyacetal resin; Polyvinyl acetal resin; Polyketone resin; Polyetherketone resin; Polyetheretherketone resin; Polyarylketone resin; Benzimidazole resin; polyparabanic acid resin; selected from the group consisting of aromatic alkenyl compounds, methacrylic acid esters, acrylic acid esters, and vinyl cyanide compounds A vinyl-based polymer or copolymer resin obtained by polymerizing or copolymerizing one or more vinyl monomers; a diene-aromatic alkenyl compound copolymer resin; a vinyl cyanide-diene-aromatic alkenyl compound Copolymer resin; aromatic alkenyl compound-diene-vinyl cyanide-N-phenylmaleimide copolymer resin; vinyl cyanide- (ethylene-diene-propylene (EPDM))-aromatic alkenyl compound copolymer resin; Vinyl resin; chlorinated vinyl chloride resin; and the like. These resins may be used alone or in combination of two or more.

[Method for Producing Resin Composition]
The resin composition according to this embodiment is produced, for example, by melt-kneading a mixture of the above components. In addition, the resin composition according to the present embodiment is produced, for example, by dissolving the above components in a solvent. Examples of the melt-kneading means include known means, and specific examples include a twin screw extruder, a Henschel mixer, a Banbury mixer, a single screw extruder, a multi-screw extruder, and a kneader.

<Resin molding>
The resin molded body according to the present embodiment includes the resin composition according to the present embodiment. That is, the resin molded body according to the present embodiment is configured with the same composition as the resin composition according to the present embodiment.
Specifically, the resin molded body according to the present embodiment is obtained by molding the resin composition according to the present embodiment. As the molding method, for example, injection molding, extrusion molding, blow molding, hot press molding, calendar molding, coating molding, cast molding, dipping molding, vacuum molding, transfer molding, or the like may be applied.

  The molding method of the resin molded body according to the present embodiment is preferably injection molding because it has a high degree of freedom in shape. The cylinder temperature of injection molding is, for example, 200 ° C. or more and 250 ° C. or less, and desirably 210 ° C. or more and 230 ° C. or less. The mold temperature for injection molding is, for example, 40 ° C. or more and 60 ° C. or less, and more preferably 45 ° C. or more and 55 ° C. or less. The injection molding may be performed using a commercially available apparatus such as NEX500 manufactured by Nissei Plastic Industry, NEX150 manufactured by Nissei Plastic Industry, NEX70000 manufactured by Nissei Plastic Industry, SE50D manufactured by Toshiba Machine.

  The resin molded body according to the present embodiment is suitably used for applications such as electronic / electrical equipment, office equipment, home appliances, automobile interior materials, and containers. More specifically, casings for electronic / electrical equipment and home appliances; various parts of electronic / electrical equipment and home appliances; interior parts for automobiles; storage cases such as CD-ROM and DVD; tableware; beverage bottles; Wrap material; film; sheet;

  EXAMPLES The present invention will be described in further detail with reference to examples below, but the present invention is not limited to these examples.

<Examples 1-14, Comparative Examples 1-9>
[Kneading]
A material having the composition shown in Tables 1 and 2 is put into a biaxial kneading apparatus (TEX41SS manufactured by TOSHIBA MACHINE), and the cylinder temperature is kneaded in a range of 220 ° C. or more and 250 ° C. or less, and a resin composition pellet (hereinafter “resin pellet” "). The unit of composition shown in Tables 1 and 2 is “parts by mass”.

[injection molding]
The obtained pellets are put into an injection molding machine (NEX500, manufactured by Nissei Plastic Industry Co., Ltd.), the barrel temperature is set to 260 ° C., and a compact is used, using a small square plate type D2 defined by ISO249-3 as a mold. A D2 test piece was obtained.

[Evaluation]
The following evaluation was performed about each obtained test piece. The results are shown in Tables 1 and 2.
-Workability-
The state during the kneading was evaluated according to the following criteria. In addition, about the thing of B evaluation, the below-mentioned evaluation of dimensional stability was not performed.
A: The kneading was stable. B: The plasticizer accumulated in the vent port during the kneading and could not be stably kneaded.

-Dimensional stability-
The obtained D2 test piece was subjected to a wet heat test using a wet heat tester “THN042PA (manufactured by Advantech)” under the conditions of 65 ° C. × 85% RH × 72 hours.
Evaluation of dimensional stability examined the dimensional change (after a wet heat test / before a wet heat test) of the D2 test piece in the TD direction (width direction), and calculated the ratio.

-Bleed-
About the test piece after the said wet heat test, the presence or absence of generation | occurrence | production (bleed | breed) of the plasticizer on the surface was observed visually.

  From the above results, it can be seen that in this example, both of the evaluation results of the dimensional stability are better than those in the comparative example even when left under high temperature and high humidity conditions (65 ° C. × 85% RH). Recognize.

The material types in Tables 1 and 2 are as follows.
[(A) Cellulose ester resin]
Diacetyl cellulose (1): L-50, manufactured by Daicel Corporation (acetyl group substitution degree 2.5)
-Diacetyl cellulose (2): L-50 (manufactured by Daicel) was modified to an acetyl group substitution degree of 2.0.-Cellulose acetate propionate: CAP482-20: manufactured by Eastman Chemical Co.

[(B) Epoxy group-containing plasticizer]
Epoxidized soybean oil: O-130P, manufactured by Adeka Corporation (epoxy equivalent 238)
Epoxidized linseed oil: O-180A, manufactured by Adeka Corporation (epoxy equivalent 175)
・ Epoxyhexahydrophthalic acid diepoxystearyl: E-PO, manufactured by Shin Nippon Rika Co., Ltd. (epoxy equivalent 290)
-Phenol novolac type epoxy: N-775, manufactured by DIC (epoxy equivalent 190)
-Bisphenol type (A type) epoxy: 1050, manufactured by DIC (epoxy equivalent 470)

[(C) Non-reactive plasticizer]
Adipic acid ester: Difaty 101, manufactured by Daihachi Chemical Industry Co., Ltd. Polyether ester compound: RS-1000, manufactured by Adeka Corporation Acetic acid ester: Triacetylene, manufactured by Daihachi Chemical Industry Co., Ltd.

Claims (6)

(A) a cellulose ester resin;
(B) an epoxy group-containing plasticizer having an amount of 5 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the cellulose ester resin (A);
(A) a non-reactive plasticizer having a functional group capable of reacting with the cellulose ester resin (C) having an amount of 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the (A) cellulose ester resin; A resin composition comprising: The resin composition according to claim 1, wherein the (A) cellulose ester resin is a cellulose ester resin represented by the following general formula (1).


(In General Formula (1), R ¹ , R ² , and R ³ each independently represent a hydrogen atom or an acyl group having 1 to 3 carbon atoms. N represents an integer of 1 or more.)   The resin composition according to claim 1 or 2, wherein the epoxy equivalent of the (B) epoxy group-containing plasticizer is 170 or more and 300 or less.   Any one of Claims 1-3 which contains at least 1 type selected from the group which consists of epoxidized soybean oil, epoxidized linseed oil, and epoxyhexahydrophthalic acid diepoxy stearyl as said (B) epoxy group containing plasticizer. 2. The resin composition according to item 1.   The resin composition according to any one of claims 1 to 4, wherein the non-reactive plasticizer (C) includes at least one selected from the group consisting of an adipic acid ester-containing compound and a polyether ester compound. object.   The resin molding containing the resin composition of any one of Claims 1-5.