JP2016074174A - Liquid spray head and liquid spray device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid spray head which can simplify a wiring pattern and achieve increase of nozzles while being downsized, and a liquid spray device.SOLUTION: The liquid spray head comprises: an actuator plate 45 in which discharge channels 51 extending along a Z direction are arranged parallely at intervals in a X direction; a cover plate 46, laminated with the actuator plate 45, in which are formed common ink chambers 71 integrally communicated into the discharge channels 51; a common electrode 56 formed on an inner surfaces of the discharge channels 51; common pads 77, formed on a rear end surface in the cover plate 46, to which is connected a FPC33; a recessed portion 74 that opens to a lower surface 46a side of the cover plate 46 and opens at the rear end surface thereof; and a connection wiring 79, formed on an inner surface of the recessed portion 74, which connects the common pads 77 to the common electrode 56.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

  2. Description of the Related Art Conventionally, an ink jet printer (liquid ejecting apparatus) provided with an ink jet head (liquid ejecting head) is an apparatus that ejects droplet-shaped ink onto recording paper (recording medium) and records images and characters on the recording paper. is there.

  The head chip of the ink jet head described above has an actuator plate in which discharge channels and dummy channels are alternately arranged on one main surface side, and a common ink chamber that is stacked on the actuator plate and communicates together in the discharge channel. A cover plate. In each channel, a common electrode having a reference potential GND is formed on the inner surface of the ejection channel, and an individual electrode having a drive potential Vdd is formed on the inner surface of the dummy channel.

  For example, in Patent Document 1 below, the individual wiring passes through one end surface of the actuator plate in the channel extending direction and is connected to an individual pad formed on the other main surface of the actuator plate. On the other hand, the common wiring passes through the other end surface of the actuator plate in the channel extending direction and is connected to a common pad formed on the other main surface of the actuator plate. Each pad is divided by a dividing groove on the other main surface, and is connected to an external wiring such as a flexible printed circuit board that is pressure-bonded to the other main surface.

JP 2000-168094 A

  However, in the configuration of Patent Document 1, the individual wiring and the common wiring are routed to the pads on the other main surface through the both end surfaces in the channel extending direction of the actuator plate, so that the wiring pattern is complicated. There was a problem.

  Recently, a configuration in which a plurality of head chips are stacked along the thickness direction of the actuator plate is known as a configuration to increase the number of nozzles such as high density recording of characters and images recorded on recording paper. Yes. However, the configuration of Patent Document 1 described above is connected to an external wiring on the other main surface of the actuator plate, and it is difficult to reduce the size and increase the number of nozzles.

  The present invention has been made in view of such circumstances, and an object thereof is to simplify a wiring pattern and realize a liquid ejecting head and a liquid ejecting apparatus capable of realizing a large number of nozzles while achieving downsizing. Is to provide.

The present invention provides the following means in order to solve the above problems.
The liquid ejecting head according to the present invention includes an actuator plate in which ejection channels extending in the first direction are arranged in parallel in the second direction intersecting the first direction, and the actuator plate is stacked on the actuator plate. A cover plate; a common electrode formed on an inner surface of the ejection channel; a common pad formed on one end surface of the cover plate in a first direction to which external wiring is connected; and the actuator formed on the cover plate. A recess that opens to the first main surface located on the plate side and that opens on the one end surface; and a connection wiring that is formed on the inner surface of the recess and connects the common pad and the common electrode. It is characterized by that.

According to this configuration, by connecting to the external wiring via the common pad formed on the one end surface in the first direction of the cover plate, the common formed on the other main surface of the actuator plate as in the prior art. The wiring pattern can be simplified as compared with the configuration in which the common electrode is routed to the pad. In addition, the recess on the cover plate side can be formed at the same time as the formation of a slit for communicating the common ink chamber and the ejection channel, for example. For this reason, it is possible to simplify the wiring pattern while suppressing an increase in the number of manufacturing steps.
In addition, by connecting the common electrode and the common pad using the connection wiring in the recess, for example, the connection wiring is short-circuited or divided compared to the configuration in which the connection wiring is routed on one end surface in the first direction or on the actuator plate side. Can be suppressed. As a result, electrical reliability can be ensured.
According to the configuration of the present invention, as described above, the head chip formed by stacking the actuator plate and the cover plate is thickened by connecting to the external wiring on the one end surface of the cover plate in the first direction. It can be easily stacked in the vertical direction. In this case, the number of nozzles can be increased while reducing the size as compared with the case of increasing the number of nozzles by using a plurality of inkjet heads.

Moreover, the said recessed part may be formed in the part located in the one end side of a 1st direction with respect to the said injection channel by the planar view seen from the lamination direction among the said cover plates.
According to this configuration, by forming a recess in a portion of the cover plate that is located on one end side in the first direction with respect to the injection channel, for example, the distance from the common electrode of the injection channel can be shortened, and the injection channel The distance between the adjacent dummy channels can be secured. Therefore, on the cover plate, a margin when the recess is displaced can be secured, the electrical reliability of the connection wiring can be secured, and the recess can be easily formed.

Further, the second main surface side of the cover plate opposite to the first main surface is extended along the second direction and is connected to the plurality of recesses collectively. A groove may be formed.
According to this configuration, the concave portion can be easily opened on the second main surface side of the cover plate by forming the connecting groove portion communicating with each concave portion collectively on the second main surface side of the cover plate. That is, since the cover plate is processed from both main surface sides, the manufacturing efficiency can be improved as compared with the case where the recess is opened on the second main surface side only by processing on the first main surface side. Then, by opening the concave portion on the second main surface side, the electrode material can be reliably formed on the inner surface of the concave portion, for example, when the connection wiring is formed by oblique vapor deposition or the like. As a result, it is possible to improve the manufacturing efficiency and secure the electrical reliability of the connection wiring.

Moreover, the common electrode which electrically connects the said connection wiring may be formed in the inner surface of the said connection groove part.
According to this structure, since the common electrode of each discharge channel can be made common by the common electrode formed on the inner surface of the connection groove portion by oblique vapor deposition or the like, the electrical reliability of the connection wiring can be further ensured.

Further, the connection wiring may be formed by oblique vapor deposition on an inner surface located on one side in the second direction among the inner surfaces of the recesses.
According to this configuration, since the connection wiring is formed by oblique vapor deposition on the inner surface located on the one end side in the second direction among the inner surface of the recess, the common pad and the connection wiring can be formed collectively. it can. Thereby, the increase in a manufacturing man-hour can be suppressed.

The actuator plate has a dummy channel that extends along the first direction and is not filled with a liquid, alternately formed with the ejection channel, and an individual electrode is formed on the inner surface of the dummy channel. One end face of the actuator plate in the first direction may be formed with an individual pad connected to the individual electrode through a portion located between the adjacent dummy channels and connected to the external wiring.
According to this configuration, since the individual pads are formed on the one end surface in the first direction of the actuator plate, the pads can be collectively connected by the external wiring on the one end surface of the head chip in the first direction. . As a result, the wiring pattern can be further simplified, and the connection work between the external wiring and each pad can be performed efficiently.

Further, the common pad and the individual pad may be disposed flush with each other.
According to this configuration, since the pads are arranged flush with each other, the external wiring and each pad can be more easily connected, and electrical reliability between the external wiring and each pad can be ensured.

An insulating portion that insulates between the common pad and the individual pads may be disposed between the actuator plate and the cover plate.
According to this structure, since the insulating part which insulates between a common pad and an individual pad is arrange | positioned between an actuator plate and a cover plate, the short circuit between both pads can be suppressed reliably.

In addition, a plurality of head chips in which the actuator plate and the cover plate are stacked may be stacked.
According to this configuration, the head chip can be easily stacked in the thickness direction by connecting to the external wiring on the one end surface in the first direction of the cover plate as described above. In this case, the number of nozzles can be increased while reducing the size as compared with the case of increasing the number of nozzles by using a plurality of inkjet heads.

The liquid ejecting apparatus according to the present invention includes the liquid ejecting head according to the present invention, and a moving mechanism that relatively moves the liquid ejecting head and the recording medium.
According to this configuration, since the liquid jet head according to the present invention is provided, simplification is achieved, and the number of nozzles can be increased while the size is reduced.

  According to the present invention, it is possible to simplify the wiring pattern and to realize a large number of nozzles while achieving miniaturization.

It is a schematic block diagram of an inkjet printer. It is a perspective view of an inkjet head. It is the perspective view which looked at the discharge part from the one end side of Z direction. It is the disassembled perspective view which looked at the discharge part from the other end side of the Z direction. FIG. 5 is a cross-sectional view corresponding to the line VV in FIG. 3. FIG. 4 is a cross-sectional view corresponding to the line VI-VI in FIG. 3. It is the rear view which looked at the discharge part in the state to which FPC was connected from the one end side of the Z direction. It is process drawing for demonstrating an actuator wafer preparation process, Comprising: It is a top view of an actuator wafer. It is sectional drawing which follows the IX-IX line of FIG. It is sectional drawing which follows the XX line of FIG. It is process drawing for demonstrating an actuator wafer preparation process, Comprising: It is a top view of an actuator wafer. It is process drawing for demonstrating a cover wafer preparation process, Comprising: It is a top view of a cover wafer. It is sectional drawing equivalent to the XIII-XIII line | wire of FIG. It is process drawing of a bonding process, Comprising: It is a top view of a wafer bonded body. It is sectional drawing equivalent to the XV-XV line | wire of FIG. It is process drawing of a cutting process, Comprising: It is a top view of a wafer bonded body. FIG. 17 is a cross-sectional view corresponding to the line XVII-XVII in FIG. 16. It is process drawing of a cutting process, Comprising: It is the rear view which looked at the precursor from the one end side of the Z direction. It is process drawing of a 2nd electrode formation process, Comprising: It is the rear view which looked at the precursor from the one end side of the Z direction. It is process drawing of each insulation part formation process, Comprising: It is the rear view which looked at the precursor from the one end side of the Z direction. It is the perspective view which looked at the discharge part which shows the other structure in embodiment from the one end side of the Z direction. It is the perspective view which looked at the discharge part which shows the other structure in embodiment from the one end side of the Z direction.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, as an example of a liquid ejecting apparatus including the liquid ejecting head of the present invention, an ink jet printer (hereinafter simply referred to as a printer) that performs recording on recording paper using ink (liquid) is taken as an example. explain. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

[Printer]
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, the printer 1 includes a pair of transport mechanisms (moving mechanisms) 2 and 3 that transport a recording paper S such as paper, and an ink jet head (liquid ejecting head) 4 that ejects ink droplets onto the recording paper S. And an ink supply unit 5 that supplies ink to the inkjet head 4 and a scanning unit 6 that scans the inkjet head 4 in a direction (sub-scanning direction) orthogonal to the conveyance direction (main scanning direction) of the recording paper S. ing. In the following description, the main scanning direction will be described as the X direction, the sub scanning direction as the Y direction, and the X direction and the direction orthogonal to the Y direction as the Z direction.

  The pair of transport mechanisms 2 and 3 rotate the grid rollers 2a and 3a extending in the Y direction, the pinch rollers 2b and 3b extending parallel to the grid rollers 2a and 3a, and the grid rollers 2a and 3a around their axes, respectively. And a drive mechanism (not shown) such as a motor to be operated.

  The ink supply unit 5 includes an ink tank 10 that contains ink, and an ink pipe 11 that connects the ink tank 10 and the inkjet head 4. A plurality of ink tanks 10 are provided. For example, ink tanks 10Y, 10M, 10C, and 10B containing four types of inks of yellow, magenta, cyan, and black are arranged along the X direction. The ink pipe 11 is a flexible hose having flexibility, for example, and can follow the operation (movement) of the carriage 16 that supports the inkjet head 4. The ink tank 10 is not limited to the ink tanks 10Y, 10M, 10C, and 10B that contain four types of inks of yellow, magenta, cyan, and black, and an ink tank that contains multicolored inks. You may have.

The scanning means 6 includes a pair of guide rails 14 and 15 that extend in the Y direction and are arranged in parallel to each other with an interval in the X direction, and a carriage that is movably disposed along the pair of guide rails 14 and 15. 16 and a drive mechanism 17 that moves the carriage 16 in the Y direction.
The drive mechanism 17 is disposed between the pair of guide rails 14 and 15, and is paired with a pair of pulleys 18 that are spaced apart from each other in the Y direction, and endlessly wound around the pair of pulleys 18 and traveling in the Y direction. A belt 19 and a drive motor 20 that rotationally drives one pulley 18 are provided.

  The carriage 16 is connected to an endless belt 19 and is movable in the Y direction as the endless belt 19 is moved by the rotational drive of one pulley 18. In addition, a plurality of inkjet heads 4 are mounted on the carriage 16 in a state of being arranged in the Y direction. In the illustrated example, there are four inkjet heads 4 (that is, inkjet heads 4Y, 4M, 4C, and 4B) that respectively eject yellow (Y), magenta (M), cyan (C), and black (B) inks. It is mounted on the carriage 16. The transport mechanisms 2 and 3 and the scanning means 6 described above constitute a moving mechanism that relatively moves the inkjet head 4 and the recording paper S.

(Inkjet head)
Next, the above-described inkjet head 4 will be described in detail. FIG. 2 is a perspective view of the inkjet head 4. Each of the inkjet heads 4 described above has the same configuration except for the color of the supplied ink. Therefore, in the following description, only one inkjet head 4 will be described.
As shown in FIG. 2, the inkjet head 4 includes a fixed plate 21 fixed to the carriage 16, a discharge unit 22 fixed on the fixed plate 21, and ink supplied from the ink supply unit 5. 22, an ink supply unit 23 that further supplies a common ink chamber 71 described later, and a head drive unit 24 that applies a drive voltage to the discharge unit 22.

  The inkjet head 4 ejects ink of each color with a predetermined ejection amount by applying a driving voltage. At this time, the inkjet head 4 is moved in the Y direction by the scanning unit 6, so that recording can be performed in a predetermined range on the recording paper S. In addition, by repeatedly performing the above-described scanning while the recording paper S is transported in the X direction by the transport mechanisms 2 and 3, it is possible to perform recording on the entire recording paper S.

  A support plate 25 made of metal such as aluminum is fixed to the fixed plate 21 in a standing state along the Z direction, and a flow path member 26 that supplies ink to the ejection unit 22 is fixed. The support plate 25 supports a pressure buffer 27 having therein a storage chamber for storing ink. The pressure buffer 27 is connected to the ink tank 10 through the ink pipe 11 described above, and is connected to the flow path member 26 through the ink connecting pipe 28. In this case, when the ink is supplied through the ink pipe 11, the pressure buffer 27 once stores the ink in the internal storage chamber, and then discharges a predetermined amount of the ink through the ink connecting pipe 28 and the flow path member 26. To supply. The flow path member 26, the pressure buffer 27, and the ink connection pipe 28 constitute the ink supply unit 23 described above.

  An IC substrate 32 on which a control circuit 31 such as an integrated circuit for driving the ejection unit 22 is mounted is attached to the support plate 25. The IC substrate 32 is electrically connected to the ejection unit 22 via a flexible printed circuit board (external wiring) 33 (hereinafter referred to as FPC 33). The above-described head drive unit 24 is configured by the IC substrate 32 and the FPC 33 on which the control circuit 31 is mounted.

(Discharge part)
Next, the discharge unit 22 will be described in detail. 3 is a perspective view of the discharge unit 22 as viewed from one end side in the Z direction, and FIG. 4 is an exploded perspective view of the discharge unit 22 as viewed from the other end side in the Z direction. 5 is a cross-sectional view taken along the line VV in FIG. 3, and FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG.
As shown in FIG. 3 to FIG. 6, the discharge section 22 of the present embodiment has nozzle rows 42 a and 42 b formed of a plurality of nozzle holes (first nozzle holes 41 a and second nozzle holes 41 b) formed in two rows. This is the two-row type discharge unit 22. Specifically, the ejection unit 22 includes a first head chip 40A and a second head chip 40B stacked in a plurality of stages in the Y direction, and a nozzle plate 44 fixed to the first head chip 40A and the second head chip 40B together. And. Each of the head chips 40A and 40B is a so-called edge shoot type that ejects ink from an ejection channel 51 described later. Further, in the following description, the first head chip 40A will be mainly described, and portions corresponding to the first head chip 40A in the second head chip 40B will be denoted by the same reference numerals and description thereof will be omitted. In the following description, in the Y direction, one end side (first head chip 40A side) is the upper side, the other end side (second head chip 40B side) is the lower side, and one end side (nozzle) in the Z direction. In the following description, the opposite side of the plate 44 is the rear side, and the other end side (nozzle plate 44 side) is the front side.

The first head chip 40A mainly includes an actuator plate 45 and a cover plate 46 stacked in the Y direction.
The actuator plate 45 is formed of a piezoelectric material such as PZT (lead zirconate titanate) and the polarization direction thereof is set in one direction along the thickness direction (Y direction). On the upper surface (first main surface) 45a side of the actuator plate 45, a plurality of channels 51 and 52 that open upward are formed.

  Each channel 51, 52 is formed linearly in the Z direction (first direction) and at equal intervals in the X direction (second direction), and is defined by a drive wall 53 made of a piezoelectric body (actuator plate 45). It is made. Specifically, the plurality of channels 51 and 52 include an ejection channel (ejection channel) 51 that is filled with ink and a dummy channel 52 that is not filled with ink. The discharge channels 51 and the dummy channels 52 are arranged alternately in the X direction.

  As shown in FIGS. 4 and 5, the discharge channel 51 has a rear end that terminates in the actuator plate 45, and a front end that opens at the front end face of the actuator plate 45. Specifically, the discharge channel 51 is located at the front end portion, and is provided continuously with the extending portion 51a having a uniform groove depth, and the rear end portion of the extending portion 51a. And a raised portion 51b in which the groove depth becomes shallow.

  The dummy channel 52 penetrates the actuator plate 45 in the Z direction, and both end portions in the Z direction are opened at both end surfaces of the actuator plate 45 in the Z direction. Specifically, the dummy channel 52 is located at the front end portion, and is provided continuously with the extending portion 52a having a uniform groove depth and the rear end portion of the extending portion 52a. A deep groove portion 52b in which the groove depth increases. The deep groove portion 52 b is located on the rear side of the discharge channel 51 and opens on the rear end face of the actuator plate 45.

  A common electrode 56 is formed on the surface of the drive wall 53 of the actuator plate 45 that defines each discharge channel 51 (the inner surface of the discharge channel 51). The common electrode 56 has a width in the Y direction that is about half that of the discharge channel 51. Out of the inner surface of each discharge channel 51, the inner surface that faces in the X direction and the bottom surface of the raised portion 51b, from the upper edge. It is formed in a range that reaches the middle part. A common wiring 57 that connects the common electrode 56 and a common pad 77 described later is formed on the upper surface 45a of the actuator plate 45. The common wiring 57 has a strip shape extending along the Z direction, and the rear side end portion extends to the rear side edge of the actuator plate 45. On the other hand, the front end portion of the common wiring 57 surrounds the raised portion 51 b of the discharge channel 51 from both sides in the X direction, and is connected to the common electrode 56 in the discharge channel 51.

  As shown in FIGS. 4 and 6, individual electrodes 61 are individually formed on the surfaces of the drive walls 53 of the actuator plate 45 that define the dummy channels 52 (inner surfaces of the dummy channels 52). These individual electrodes 61 have a width in the Y direction that is about half that of the dummy channel 52, and are formed in a range from the upper edge to the middle portion of the inner surface of each dummy channel 52 facing in the X direction. ing. In this case, among the individual electrodes 61, the individual electrodes 61 facing each other in the same dummy channel 52 are electrically separated from each other. A vapor deposition film 62 is formed on the inner side surface and the bottom surface located on one end side in the X direction at the rear end portion of each dummy channel 52 (deep groove portion 52b).

  Here, as shown in FIGS. 3 and 5, the individual electrodes 61 facing each other in the X direction across the discharge channel 51 are connected to the rear end face of the actuator plate 45, and the above-described FPC 33 is connected. Individual pads 64 are formed. The individual pad 64 is formed over the entire portion of the rear end face of the actuator plate 45 located between the adjacent dummy channels 52, and is located on the rear side with respect to the discharge channel 51. In the illustrated example, the individual pad 64 has a width in the Y direction substantially equal to the depth of the deep groove portion 52 b of the dummy channel 52.

  One end portion in the X direction of the individual pad 64 is connected to an individual electrode 61 formed on the other end side in the X direction in the dummy channel 52 positioned on one end side in the X direction with respect to the ejection channel 51. . On the other hand, the other end portion in the X direction of the individual pad 64 is the individual electrode 61 formed on one end side in the X direction and the vapor deposition in the dummy channel 52 positioned on the other end side in the X direction with respect to the ejection channel 51. Connected to the membrane 62.

  A first insulating portion 66 that divides the adjacent individual pads 64 is formed at the lower corner portion of the rear end face of the actuator plate 45. The first insulating portion 66 is a groove that is recessed toward the front side and that extends along the X direction, and is formed over the entire length of the actuator plate 45 in the X direction. In the first head chip 40A (actuator plate 45), the first insulating portion 66 is located in a region (non-ejection region) located outside the outermost channel (dummy channel 52) in the X direction. It may not be formed.

  In the illustrated example, the first insulating portion 66 has an upper end positioned above the bottom surface of the deep groove portion 52 b and a lower end opened on the lower surface 45 b of the actuator plate 45. Further, the depth in the Z direction of the first insulating portion 66 is such a depth that the electrode material 121 (see FIG. 19) formed at the lower corner portion of the rear end face of the actuator plate 45 can be removed. (Preferably 20 μm or more) may be used. The first insulating portion 66 is not limited to the corner portion as long as the first insulating portion 66 can be divided between the individual pads 64.

  As shown in FIGS. 3 to 6, the cover plate 46 has a plate shape in which a lower surface (first main surface) 46 a is bonded onto the upper surface 45 a of the actuator plate 45, and closes the channels 51 and 52. . The cover plate 46 has a planar outer shape viewed from the Y direction that matches the actuator plate 45, and an outer peripheral surface facing the X direction and the Z direction is flush with the outer peripheral surface of the actuator plate 45.

The cover plate 46 includes a common ink chamber 71 formed on the upper surface (second main surface) 46b side, and a plurality of slits 72 formed on the lower surface 46a side, each communicating between the common ink chamber 71 and each ejection channel 51. And have.
The common ink chamber 71 is a groove that is located at the rear end of the cover plate 46 and that is recessed downward, and extends in the X direction. The common ink chamber 71 communicates with the flow path member 26 described above, and is configured such that ink in the flow path member 26 flows.

  The slit 72 is formed in the common ink chamber 71 at a position overlapping with the raised portion 51b of the ejection channel 51 in the Y direction, and penetrates the cover plate 46 in the Y direction. That is, the above-described common ink chamber 71 communicates together in each discharge channel 51 through the slit 72. The slit 72 has a width in the X direction that is equal to that of the discharge channel 51, and the position of the rear edge substantially coincides with the rear edge of the discharge channel 51 (rounded-up portion 51b). .

  On the lower surface 46 a side of the cover plate 46, a plurality of recesses 74 that are recessed toward the upper side are formed in portions located on the rear side with respect to the respective slits 72 (discharge channels 51). The recess 74 is open on the lower surface 46 a and the rear end surface of the cover plate 46, and the above-described common wiring 57 is exposed through the recess 74. Each recess 74 is formed at the same position as each discharge channel 51 in the X direction and the width in the X direction is equal to each discharge channel 51. Further, the width of each concave portion 74 is gradually reduced as it goes upward.

  On the upper surface 46 b side of the cover plate 46, a connection groove portion 75 is formed in a portion located on the rear side of the above-described common ink chamber 71. The connection groove portion 75 is recessed downward and communicates with the above-described concave portions 74. ing. The connection groove 75 is formed so as to cut away the corner located on the rear side of the cover plate 46 and on the upper side, and extends in parallel with the common ink chamber 71 along the X direction. The above-described recesses 74 are opened on the bottom surface of the connection groove 75. Note that the length in the X direction and the depth in the Y direction of the connection groove 75 may be equal to those of the common ink chamber 71.

  Here, a common pad 77 is formed over the entire area of the rear end face of the cover plate 46. The common pad 77 is flush with the individual pad 64 described above, and the FPC 33 is connected to the common pad 77. In the illustrated example, a vapor deposition film (common electrode) 78 that adheres when the common pad 77 is formed is formed on the inner surface of the connection groove 75 over the entire area. Note that both end portions in the X direction of the vapor deposition film 78 may be connected to the portion of the common pad 77 described above formed in the non-ejection region.

  Further, as shown in FIG. 5, a connection wiring 79 for connecting the above-described common pad 77 and the common wiring 57 is formed on the inner surface mainly located at one end side in the X direction among the inner surfaces of the respective recesses 74. ing. The lower end edge of the connection wiring 79 is connected to a portion of the common wiring 57 exposed in the recess 74 on the upper surface 45 a of the actuator plate 45. On the other hand, the connection wiring 79 is connected to the common pad 77 on the rear end face of the cover plate 46 at the rear end edge.

  As shown in FIGS. 3 and 5, the individual pad 64, the common pad 77, the common wiring 57, and the above-described individual pad 64 are provided at the boundary between the actuator plate 45 and the cover plate 46 on the rear end surface of the first head chip 40 </ b> A. A second insulating portion 81 that divides the connection wiring 79 is formed. The second insulating portion 81 is a groove that is recessed toward the front side and that extends along the X direction, and is formed over the entire length of the first head chip 40A in the X direction. The second insulating portion 81 is formed across the plates 45 and 46 in the Y direction. In this case, the second insulating portion 81 has an upper edge located above the lower edge of the recess 74 and a lower edge located below the upper edge of the individual pad 64. In addition, the second insulating portion 81 may have a depth in the Z direction that is shallower than a depth at which the connection wiring 79 can be deposited. However, in order to reduce the wiring resistance (impedance) in each of the wirings 57 and 79 and the pads 64 and 77, the width and depth of the second insulating portion 81 are divided between the wirings 57 and 79 and the pads 64 and 77. Above, it is preferable to make it as small as possible.

  Similar to the first head chip 40A described above, the second head chip 40B is configured by laminating an actuator plate 45 and a cover plate 46 in the Y direction. In this case, the second head chip 40B is joined to the first head chip 40A with the cover plate 46 facing the actuator plate 45 of the first head chip 40A. That is, the discharge unit 22 of the present embodiment has a configuration in which a plurality of actuator plates 45 and cover plates 46 are alternately stacked.

  The ejection channels 51 and the dummy channels 52 of the second head chip 40B are arranged with a half-pitch shift with respect to the arrangement pitch of the ejection channels 51 and the dummy channels 52 of the first head chip 40A, and the ejection channels of the head chips 40A and 40B. 51 and dummy channels 52 are arranged in a staggered manner. That is, the ejection channel 51 of the first head chip 40A and the dummy channel 52 of the second head chip 40B face each other in the Y direction, and the dummy channel 52 of the first head chip 40A and the ejection channel 51 of the second head chip 40B. They are facing each other in the Y direction.

  A common ink chamber of each head chip 40A, 40B is located in a portion (non-ejection area) located outside the outermost channel (dummy channel 52) in the X direction among the head chips 40A, 40B. A communication hole (not shown) for connecting the 71 is formed. The communication hole penetrates the actuator plate 45 (actuator plate 45 on the first head chip 40A side) located between the cover plates 46 among the actuator plates 45 in the Y direction, and both ends are common to the cover plates 46. Each ink chamber 71 has an opening. Accordingly, the ink that has flowed into the first head chip 40A (common ink chamber 71) through the flow path member 26 flows into the second head chip 40B (common ink chamber 71) through the communication hole.

FIG. 7 is a rear view of the ejection unit 22 with the FPC 33 connected as viewed from the rear side.
As shown in FIG. 7, the FPC 33 is a so-called double-sided FPC in which a wiring pattern is formed on both surfaces of an insulating base film 83, and one end portion in the extending direction covers the rear side end surface in the discharge portion 22. So that it is crimped. Specifically, the FPC 33 has a plurality of individual electrode wirings 84 connected to the individual pads 64 and a common electrode wiring 85 connected to the common pad 77.

The individual electrode wiring 84 includes an individual land portion 86 formed on the first surface side (surface located on the discharge portion 22 side) of the base film 83, and a second surface side (discharge portion 22 side) of the base film 83. And a drawer portion 87 formed on the opposite surface.
The individual land portions 86 are individually connected to the above-described individual pads 64 of the head chips 40A and 40B. The lead-out portion 87 has a strip shape extending along the extending direction of the FPC 33, one end of which is individually connected to the above-described individual land portion 86 through the through hole 88, and the other end is connected to the IC substrate 32. Yes.

  The common electrode wiring 85 is formed between the common land portion 91 and the collective portion 92 formed on the first surface side of the base film 83 and the common land portion 91 and the collective portion 92 formed on the second surface side. And a drawer portion 93.

The common land portion 91 has a strip shape extending along the width direction (X direction) of the FPC 33, and is connected to the common pad 77 of each of the head chips 40A and 40B.
The lead-out portion 93 has a belt-like shape extending along the extending direction of the FPC 33, one end of which is individually connected to the common land portion 91 through the through hole 94, and the other end is connected to the collecting portion 92 through the through hole 95. Connected separately.
The collective portion 92 is wider than the common land portion 91 and the lead-out portion 93, and is parallel to the common land portion 91 on the other end side in the extending direction of the FPC 33 (the other end side relative to the individual land portion 86). It is extended to. The common electrode wiring 85 is connected to the IC substrate 32 via the assembly portion 92.

  As shown in FIGS. 4 to 6, the nozzle plate 44 is made of a film material such as polyimide, and is bonded to the head chips 40 </ b> A and 40 </ b> B so as to cover the entire front end face. The nozzle plate 44 includes a nozzle row (first nozzle row 42a and second nozzle row 42b) composed of a plurality of nozzle holes (first nozzle holes 41a and second nozzle holes 41b) arranged in parallel in the X direction. ) Are arranged in two rows.

  The first nozzle row 42a has a plurality of first nozzle holes 41a penetrating the nozzle plate 44 in the Z direction, and the first nozzle holes 41a are arranged in a straight line at intervals in the X direction. . These first nozzle holes 41a communicate with the discharge channel 51 of the first head chip 40A described above. Specifically, the first nozzle holes 41a are formed so as to be located at the center in the Y direction in the ejection channel 51 of the first head chip 40A, and are formed at the same pitch as the ejection channel 51.

  The second nozzle row 42b has a plurality of second nozzle holes 41b penetrating the nozzle plate 44 in the Z direction, and is arranged in parallel with the first nozzle row 42a described above. Each second nozzle hole 41b communicates with the discharge channel 51 of the second head chip 40B described above. Specifically, the second nozzle holes 41b are formed so as to be located at the center in the Y direction in the discharge channel 51 of the second head chip 40B, and are formed at the same pitch as the discharge channel 51. Accordingly, each dummy channel 52 does not communicate with the nozzle holes 41 a and 41 b and is covered from the front side by the nozzle plate 44.

[How the printer works]
Next, a case where characters, figures, and the like are recorded on the recording paper S using the printer 1 configured as described above will be described below.
As an initial state, it is assumed that inks of different colors are sufficiently sealed in the four ink tanks 10 shown in FIG.
Under such an initial state, when the printer 1 is operated, the grid rollers 2a and 3a of the transport mechanisms 2 and 3 rotate, so that the recording paper S is interposed between the grid rollers 2a and 3a and the pinch rollers 2b and 3b. Is conveyed in the X direction. At the same time, the drive motor 20 rotates the pulley 18 to run the endless belt 19. As a result, the carriage 16 reciprocates in the Y direction while being guided by the guide rails 14 and 15.
During this time, characters, images, and the like can be recorded by appropriately ejecting four colors of ink from the inkjet heads 4 onto the recording paper S.

Here, the movement of each inkjet head 4 will be described in detail below.
In the inkjet head 4, a voltage is applied between the electrodes 56 and 61 through the FPC 33 so that the common electrode 56 is at the reference potential GND and the individual electrode 61 is at the drive potential Vdd. Then, thickness-slip deformation occurs in the two drive walls 53 that define the discharge channel 51, and the two drive walls 53 are deformed so as to protrude into the discharge channel 51 toward the dummy channel 52. That is, the actuator plate 45 of this embodiment has a single polarization direction, and the electrodes 56 and 61 are formed only up to the middle portion of the drive wall 53 in the Y direction. Therefore, by applying a voltage between the electrodes 56 and 61, the drive wall 53 is bent and deformed in a V shape with the middle portion in the Y direction as the center. Thereby, the discharge channel 51 is deformed so as to swell.

  Thus, the volume of the discharge channel 51 increases due to the deformation of the two drive walls 53 due to the piezoelectric thickness slip effect. Then, the ink stored in the common ink chamber 71 is guided into the discharge channel 51 due to the increase in the volume of the discharge channel 51. The ink guided to the inside of the discharge channel 51 propagates as a pressure wave to the inside of the discharge channel 51, and is applied between the electrodes 56 and 61 when the pressure wave reaches the nozzle holes 41a and 41b. Set the voltage to zero. As a result, the drive wall 53 is restored, and the volume of the discharge channel 51 once increased returns to the original volume. By this operation, the pressure inside the ejection channel 51 is increased and the ink is pressurized. As a result, the liquid droplets are ejected to the outside through the nozzle holes 41a and 41b, so that characters, images, and the like can be recorded on the recording paper S as described above.

[Manufacturing method of discharge section]
Next, the manufacturing method of the discharge part 22 mentioned above is demonstrated. In the following description, an actuator wafer 101 in which a plurality of actuator plates 45 are continuous in the Z direction and a cover wafer 102 in which a plurality of cover plates 46 are continuous in the Z direction are bonded to form a wafer bonded body 103. A method for manufacturing a plurality of discharge units 22 by cutting the body 103 will be described.
The manufacturing method of the discharge unit 22 of the present embodiment mainly includes an actuator wafer manufacturing process, a cover wafer manufacturing process, and an assembling process. Among them, the actuator wafer manufacturing process and the cover wafer manufacturing process can be performed in parallel.

<Actuator wafer fabrication process>
FIG. 8 is a process diagram for explaining the actuator wafer manufacturing process, and is a plan view of the actuator wafer 101. 9 is a cross-sectional view taken along line IX-IX in FIG. 8, and FIG. 10 is a cross-sectional view taken along line XX in FIG.
As shown in FIG. 8 and FIG. 9, in the actuator wafer manufacturing process, first, a first dicing line 110 that will later become the discharge channel 51 is formed by cutting or the like using a dicer (not shown) (first dicing line formation). Process). Specifically, a dicer is made to enter the actuator wafer 101 from the first main surface 101a side, and the dicer is made to travel in the Z direction. Thereafter, the dicer is made to travel a predetermined amount, and then the dicer is retracted from the actuator wafer 101. Thereby, the first dicing line 110 is formed.

  At this time, in a side view as viewed from the X direction, both end portions in the Z direction of the first dicing line 110 are portions corresponding to the above-described rounded-up portions 51b, and have an arc shape that follows the radius of curvature of the dicer. The Note that the length in the Z direction of the first dicing line 110 (the amount of travel of the dicer) is set to the length of two of the discharge channels 51 (extending portions 51a). Then, in the first dicing line forming step, the above-described operation is repeatedly performed with respect to the actuator wafer 101 at intervals in the Z direction and the X direction to form a plurality of first dicing lines 110. In other words, the actuator wafer 101 is continuous with the rear end portions and the front end portions of the actuator plate 45 facing each other.

  Next, as shown in FIGS. 8 and 10, a second dicing line 111 that will later become a dummy channel 52 is formed (second dicing line forming step). Specifically, the dicer is made to enter the portions of the actuator wafer 101 that are located on both sides in the X direction with respect to the first dicing line 110, and the dicer travels over the entire Z direction of the actuator wafer 101. At this time, in the dummy channel 52, the portion corresponding to the extending portion 52a runs the dicer with the machining depth being constant, and the portion corresponding to the deep groove portion 52b (between the first dicing lines 110 in the Z direction). The portion located at (5) is made deeper than the portion corresponding to the extending portion 52a.

FIG. 11 is a process diagram for explaining the actuator wafer manufacturing process, and is a plan view of the actuator wafer 101.
Next, as shown in FIG. 11, the individual electrode 61, the common electrode 56, and the common wiring 57 are formed on the actuator wafer 101 (first electrode forming step). Specifically, the electrode material 113 is vapor-deposited from the direction inclined in the X direction with respect to the Y direction toward the first main surface 101a side of the actuator wafer 101 by oblique vapor deposition or the like. Then, an electrode material 113 is formed on the first main surface 101a of the actuator wafer 101 and on the inner surfaces of the first dicing line 110 and the second dicing line 111 through an opening of a mask (not shown). As a result, the common wiring 57 is formed on the first main surface 101a of the actuator wafer 101, and the individual electrode 61 and the common electrode 56 are formed in the portion from the upper edge of each dicing line 110, 111 to the middle portion. Is done.

<Cover wafer production process>
12 is a process diagram for explaining a cover wafer manufacturing process, which is a plan view of the cover wafer 102, and FIG. 13 is a cross-sectional view corresponding to the line XIII-XIII of FIG.
As shown in FIGS. 12 and 13, in the cover wafer manufacturing process, first, sandblasting or the like is performed on the cover wafer 102 from the second main surface 102b side through a mask (not shown) to form the common ink chamber 71 and the connection groove 75 later. Groove part 114 is formed (common ink chamber and groove part forming step). At this time, the common ink chamber 71 is formed along the X direction on the cover wafer 102 at portions corresponding to both ends in the Z direction of the first dicing line 110 described above. Further, the groove 114 is formed in the cover wafer 102 along the X direction at a portion corresponding to the first dicing line 110 described above.

  Subsequently, sandblasting or the like is performed on the cover wafer 102 from the first main surface 102a side through a mask (not shown) to form a slit 72 communicating with each other in the common ink chamber 71 and a counterbore portion 115 to be a recess 74 later. (Slit and counterbore forming step). At this time, the slits 72 are separately formed on the cover wafer 102 at portions corresponding to both end portions of each first dicing line 110 in the Z direction. Moreover, the counterbore part 115 is separately formed in the part corresponding to between each 1st dicing line 110 mentioned above in the cover wafer 102. FIG. Each process of the cover wafer forming process is not limited to sand blasting, and may be performed by dicing or the like.

<Assembly process>
FIG. 14 is a process diagram of the bonding process, which is a plan view of the wafer bonded body 103, and FIG. 15 is a cross-sectional view corresponding to the XV-XV line of FIG.
As shown in FIGS. 14 and 15, in the assembly process, first, a plurality of actuator wafers 101 and cover wafers 102 are alternately stacked to form a wafer bonded body 103 (bonding process). Specifically, the cover wafer 102 and the actuator wafer 101 to be the head chips 40A and 40B are bonded together, and then the cover wafer 102 to be the second head chip 40B is bonded to the actuator wafer 101 to be the first head chip 40A. Match.

16 is a process view of the cutting process, and is a plan view of the wafer bonded body 103. FIG. 17 is a cross-sectional view corresponding to the line XVII-XVII in FIG. FIG. 18 is a process diagram of the cutting process, and is a rear view of the precursor 120 as seen from the rear side.
Subsequently, as shown in FIGS. 16 and 17, the wafer bonded body 103 is cut for each discharge unit 22 (cutting process). Specifically, the dicer runs in the X direction with respect to the intermediate position of the first dicing line 110 in the Z direction and the intermediate position of the portion positioned between the first dicing lines 110 in the wafer bonded body 103. The wafer bonded body 103 is cut. At this time, the first dicing line 110 is divided at an intermediate position in the Z direction, and the groove portion 114 and the counterbore portion 115 are divided at an intermediate position in the Z direction. As a result, as shown in FIG. 18, a plurality of precursors 120 of the discharge unit 22 in which the first head chip 40 </ b> A and the second head chip 40 </ b> B are stacked are cut out from a single wafer bonded body 103.

FIG. 19 is a process diagram of the second electrode forming process, and is a rear view of the precursor 120 as viewed from the rear side.
Next, as shown in FIG. 19, an electrode material 121 that becomes the individual pad 64, the common pad 77, and the connection wiring 79 is formed on the precursor 120 (second electrode formation step). Specifically, oblique deposition or the like is performed on the rear side end face of the precursor 120, and the electrode material 121 is deposited from the direction inclined with respect to the X direction, the Y direction, and the Z direction toward one end side in the X direction. . Then, the electrode material 121 is formed on the rear end face of the precursor 120, the inner face of the recess 74, the inner face of the connection groove 75, and the inner face of the dummy channel 52, which is the face located on one end side in the X direction. Is done.

FIG. 20 is a process diagram of each insulating part forming process, and is a rear view of the precursor 120 as seen from the rear end side.
Then, as shown in FIG. 20, the 1st insulating part 66 is formed with respect to the corner | angular part located below among the rear side end surfaces in the actuator plate 45 (1st insulating part formation process). Specifically, the dicer is run along the X direction, and the electrode material 121 connecting the adjacent individual pads 64 is removed.
Moreover, the 2nd insulation part 81 is formed with respect to the part located between the actuator plate 45 and the cover plate 46 among the precursors 120 (2nd insulation part formation process). Specifically, the dicer runs along the X direction, and the electrode material 121 that connects the common pad 77, the individual pad 64, the common wiring 57, and the connection wiring 79 is removed.

  Then, the nozzle part 44 is joined on the front side end surface in the precursor 120 (head chip 40A, 40B), and the discharge part 22 mentioned above is completed.

As described above, in this embodiment, the common pad 77 to which the FPC 33 is connected is formed on the rear end face of the cover plate 46, and the common wiring is connected through the connection wiring 79 formed on the inner surface of the recess 74 of the cover plate 46. 57 and the common pad 77 are connected.
According to this configuration, the wiring pattern can be simplified compared to the conventional configuration in which the common electrode is routed to the common pad formed on the other main surface of the actuator plate. In addition, the recess 74 on the cover plate 46 side can be formed simultaneously with the formation of the slit 72 that allows the common ink chamber 71 and the ejection channel 51 to communicate, for example. For this reason, it is possible to simplify the wiring pattern while suppressing an increase in the number of manufacturing steps.
Further, by connecting the common electrode 56 and the common pad 77 using the connection wiring 79 in the recess 74, for example, the connection wiring 79 is routed on the rear end face of the head chips 40A and 40B or on the actuator plate 45 side. Compared with this, it is possible to suppress short-circuiting or disconnection of the connection wiring 79. As a result, electrical reliability can be ensured.

  Here, the head chips 40A and 40B can be easily stacked in the Y direction by connecting to the FPC 33 on the rear end face of the ejection section 22. In this case, the number of nozzles can be increased while reducing the size as compared with the case where the number of nozzles 22 (ink jet head 4) itself is used to increase the number of nozzles.

  Further, by forming the recess 74 in a portion of the cover plate 46 located on the rear end side with respect to the discharge channel 51, it is possible to secure a distance from the adjacent dummy channel 52 and to provide a common electrode for the discharge channel 51. The distance to 56 can be shortened. Therefore, a margin when the recess 74 is displaced with respect to the channels 51 and 52 can be secured, the electrical reliability of the connection wiring 79 can be secured, and the recess 74 can be easily formed.

  Further, in the present embodiment, by forming the connection groove portion 75 that communicates with each recess 74 collectively on the upper surface 46 b side of the cover plate 46, the recess 74 can be easily opened on the upper surface 46 b side of the cover plate 46. . That is, since the cover plate 46 is processed from both the main surfaces 46a and 46b, the manufacturing efficiency can be improved as compared with the case where the recess 74 is opened on the upper surface 46b only by processing on the lower surface 46a. . Then, by opening the recess 74 on the upper surface 46b side, the electrode material can be reliably formed on the inner surface of the recess 74 when the connection wiring 79 is formed by, for example, oblique vapor deposition. As a result, the manufacturing efficiency can be improved and the electrical reliability of the connection wiring 79 can be ensured.

  Further, since the connection wiring 79 can be made common by the vapor deposition film 78 formed on the inner surface of the connection groove 75, electrical reliability with the FPC 33 in the common electrode 56 can be further ensured.

  Furthermore, since the connection wiring 79 is formed by oblique vapor deposition on the inner surface located on one end side in the X direction in the inner surface of the recess 74, the common pad 77 and the connection wiring 79 can be formed in a lump. . Thereby, the increase in a manufacturing man-hour can be suppressed.

In addition, since the individual pads 64 are formed on the rear end surface of the actuator plate 45, the pads 64 and 77 can be connected together by the FPC 33 on the rear end surface of the discharge unit 22. As a result, the wiring pattern can be further simplified, and the connection work between the FPC 33 and the pads 64 and 77 can be performed efficiently.
In particular, since the pads 64 and 77 are arranged flush with each other, the FPC 33 and the pads 64 and 77 can be more easily connected, and electrical reliability between the FPC 33 and the pads 64 and 77 can be secured. .

  In addition, since the second insulating portion 81 that insulates between the common pad 77 and the individual pads 64 is formed between the actuator plate 45 and the cover plate 46, a short circuit between the pads 64 and 77 can be reliably suppressed. .

  Since the printer 1 according to this embodiment includes the inkjet head 4 described above, it is possible to simplify the wiring pattern and provide the printer 1 with high reliability.

  The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the ink jet printer 1 is described as an example of the liquid ejecting apparatus, but the present invention is not limited to the printer. For example, a fax machine or an on-demand printer may be used.

In the above-described embodiment, the case where the nozzle rows 42a and 42b extend linearly along the X direction has been described. However, the present invention is not limited thereto, and for example, the nozzle rows 42a and 42b extend obliquely. You may do it.
Further, the shape of the nozzle holes 41a and 41b is not limited to a circle. For example, a polygonal shape such as a triangle, an elliptical shape, or a star shape may be used.
In the above-described embodiment, the configuration in which the ejection channels 51 and the dummy channels 52 are arranged in a staggered manner with a half pitch shift between the head chips 40A and 40B has been described. However, the present invention is not limited to this.

  Furthermore, in the above-described embodiment, the multilayer type inkjet head in which the two head chips 40A and 40B are stacked has been described. However, the present invention is not limited to this, and a single-layer inkjet head as illustrated in FIG. It is good also as a laminated type of three or more steps. The number of nozzle rows is changed according to the number of head chips stacked.

  In the above-described embodiment, the edge shoot type ink jet head has been described as an example. However, the present invention is not limited to this case. It does not matter as the type.

Furthermore, in the above-described embodiment, the case where the connection wiring 79 is formed by performing oblique vapor deposition from one side with respect to the concave portion 74 has been described. However, the present invention is not limited thereto, and oblique vapor deposition is performed from both sides with respect to the concave portion 74. It doesn't matter.
According to this configuration, since the area of the connection wiring 79 can be increased, the impedance of the connection wiring 79 can be reduced, and heat generation during operation can be suppressed.

  In the above-described embodiment, the configuration in which the common electrode 56 and the connection wiring 79 are connected via the common wiring 57 on the actuator plate 45 has been described. However, the connection wiring 79 and the common electrode 56 are directly connected to each other. It doesn't matter.

Furthermore, in the above-described embodiment, the configuration in which the insulating portions 66 and 81 are recessed toward the front side in the head chips 40A and 40B has been described, but the present invention is not limited thereto. For example, the head chips 40A and 40B may be formed flush with the rear end surfaces. In this case, for example, portions corresponding to the insulating portions 66 and 81 may be protruded in advance from the rear end surfaces of the head chips 40A and 40B, and the protruding portions may be excised after the second electrode forming step described above. Absent. Further, the wirings 57 and 79 and the pads 64 and 77 may be insulated using an insulating film or the like.
That is, if the insulating portions 66 and 81 are configured to insulate the wirings 57 and 79 and the pads 64 and 77, the formation positions and forming methods can be appropriately changed in design.

Furthermore, in the above-described embodiment, the configuration in which the concave portion 74 is opened through the connection groove portion 75 has been described, but the configuration is not limited thereto. For example, as shown in FIG. 22, only the recess 74 may be formed in the cover plate 46.
According to this configuration, since the area of the common pad 77 (the area of the rear end face of the cover plate 46) can be ensured, the impedance of the common pad 77 can be reduced, and heat generation during operation can be suppressed. Note that the recess 74 itself may penetrate the cover plate 46 in the Y direction.
In the above-described embodiment, the configuration in which ink is supplied into the ejection channel 51 through the common ink chamber 71 and the slit 72 formed in the cover plate 46 has been described, but the present invention is not limited to this. A configuration may be adopted in which ink is supplied from a different path from the cover plate 46.

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in the embodiment mentioned above by a known component, and you may combine each modification mentioned above suitably.

1 ... Inkjet printer (liquid ejecting device)
2, 3 ... Conveying mechanism (moving mechanism)
4, 4Y, 4M, 4C, 4B ... Inkjet head (liquid ejecting head)
33 ... Flexible printed circuit board (external wiring)
40A ... 1st head chip (head chip)
40B ... Second head chip (head chip)
45 ... Actuator plate 45a ... Upper surface (first main surface)
46: Cover plate 46a: Lower surface (first main surface)
46b ... Upper surface (second main surface)
51. Discharge channel (injection channel)
52 ... Dummy channel 56 ... Common electrode 61 ... Individual electrode 64 ... Individual pad portion 74 ... Recessed portion 75 ... Connection groove portion 77 ... Common pad portion 78 ... Vapor deposition film (common electrode)
79 ... Connection wiring 81 ... Second insulating part (insulating part)

Claims (10)

An actuator plate in which injection channels extending along a first direction are arranged side by side in a second direction intersecting the first direction;
A cover plate laminated on the actuator plate;
A common electrode formed on the inner surface of the ejection channel;
A common pad formed on one end surface of the cover plate in the first direction and connected to an external wiring;
A recess formed on the cover plate and opening on the first main surface located on the actuator plate side, and opening on the one end surface;
A liquid ejecting head, comprising: a connection wiring formed on an inner surface of the recess and connecting the common pad and the common electrode.   2. The liquid according to claim 1, wherein the concave portion is formed in a portion of the cover plate located on one end side in the first direction with respect to the ejection channel in a plan view as viewed from the stacking direction. Jet head.   In the cover plate, on the second main surface side opposite to the first main surface, there is a connection groove portion that extends along the second direction and communicates collectively with the plurality of recesses. The liquid ejecting head according to claim 1, wherein the liquid ejecting head is formed.   The liquid ejecting head according to claim 3, wherein a common electrode that electrically connects the connection wirings is formed on an inner surface of the connection groove portion.   The said connection wiring is formed in the inner surface located in the one side of a 2nd direction among the said recessed part inner surfaces by diagonal vapor deposition, The any one of Claims 1-4 characterized by the above-mentioned. Liquid jet head. In the actuator plate, dummy channels that extend along the first direction and are not filled with liquid are alternately formed with the ejection channels,
An individual electrode is formed on the inner surface of the dummy channel,
One end face of the actuator plate in the first direction is formed with an individual pad connected to the individual electrode through a portion located between the adjacent dummy channels and to which the external wiring is connected. The liquid ejecting head according to any one of claims 1 to 5.   The liquid ejecting head according to claim 6, wherein the common pad and the individual pad are arranged flush with each other.   The liquid ejecting head according to claim 6, wherein an insulating portion that insulates the common pad and the individual pads is disposed between the actuator plate and the cover plate.   The liquid ejecting head according to claim 1, wherein a plurality of head chips each including the actuator plate and the cover plate are stacked. A liquid ejecting head according to any one of claims 1 to 9,
A liquid ejecting apparatus comprising: a moving mechanism that relatively moves the liquid ejecting head and the recording medium.

Images