JP2016072652A - Crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal oscillator capable of reducing short-circuit between an external terminal and a thermo-sensitive element.SOLUTION: A crystal oscillator includes: a rectangular substrate 110a; a mounting frame body 160 provided on a lower surface of the substrate 110a; a joint terminal 112 provided along an outer peripheral edge of the lower surface of the substrate 110a; a joint pad 161 provided along an outer peripheral edge of an upper surface of the mounting frame body 160; a pair of electrode pads 111 provided on the substrate 110a; a pair of connection pads 115 provided on the lower surface of the substrate 110a in the mounting frame body 160; a crystal element 120 mounted on the electrode pad 111; a thermo-sensitive element 150 mounted on the connection pad 115; a gap portion H provided between the substrate 110a and the mounting frame body 160; a lid 130 for hermetically sealing the crystal element 120; a first insulating resin 180 which covers the thermo-sensitive element 150 and is provided on the gap portion H; and a second insulating resin 190 provided from an upper surface of the mounting frame body 160 to a side surface of the substrate 110a.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal resonator used in an electronic device or the like.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a package having a substrate, a first frame provided on the upper surface of the substrate for providing the first recess, and a second frame provided on the lower surface of the substrate for providing the second recess. And a crystal resonator that is mounted on an electrode pad provided on the upper surface of the substrate and a temperature sensitive device that is mounted on a connection pad provided on the lower surface of the substrate has been proposed (for example, , See Patent Document 1 below).

JP 2011-2111340 A

  The above-described quartz resonator has been miniaturized, and the area of the connection pad provided on the substrate is also reduced. The crystal resonator thus miniaturized is reduced in the amount of conductive bonding material provided on the connection pad, the bonding strength between the connection pad and the temperature sensitive element is reduced, and by performing a drop test, There is a possibility that the temperature sensitive element may be peeled off from the connection pad.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the crystal oscillator which can reduce that a temperature sensitive element peels from a connection pad.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a mounting frame provided on a lower surface of the substrate, a junction terminal provided along an outer peripheral edge of the lower surface of the substrate, and a mounting frame. A bonding pad provided along the outer peripheral edge of the upper surface, a pair of electrode pads provided on the upper surface of the substrate, a pair of connection pads provided on the lower surface of the substrate in the mounting frame, and mounted on the electrode pads Covers the crystal element, the temperature sensor mounted on the connection pad, the gap provided between the substrate and the mounting frame, a lid for hermetically sealing the crystal element, and the temperature sensor. The first insulating resin provided in the gap portion and the second insulating resin provided from the upper surface of the mounting frame to the side surface of the substrate are provided.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a mounting frame provided on a lower surface of the substrate, a junction terminal provided along an outer peripheral edge of the lower surface of the substrate, and a mounting frame. A bonding pad provided along the outer peripheral edge of the upper surface, a pair of electrode pads provided on the upper surface of the substrate, a pair of connection pads provided on the lower surface of the substrate in the mounting frame, and mounted on the electrode pads Covers the crystal element, the temperature sensor mounted on the connection pad, the gap provided between the substrate and the mounting frame, a lid for hermetically sealing the crystal element, and the temperature sensor. And a first insulating resin provided in the gap portion and a second insulating resin provided from the upper surface of the mounting frame to the side surface of the substrate. By doing in this way, since the second insulating resin is provided from the upper surface of the mounting frame to the side surface of the substrate, the stress applied by the drop test can be absorbed, and the second insulating resin temporarily Even if stress that could not be absorbed is applied to the temperature sensing element, the first insulating resin is provided so as to cover the temperature sensing element. It is possible to improve the bonding strength between the temperature element and the connection pad.

It is a disassembled perspective view which shows the crystal resonator which concerns on this embodiment. (A) It is AA sectional drawing of FIG. 1, (b) It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. (A) is the see-through plan view of the package constituting the crystal resonator according to the present embodiment as viewed from above, and (b) is the substrate of the package constituting the crystal resonator according to the present embodiment as viewed from above. It is a perspective plan view. (A) is a perspective plan view of the substrate of the package constituting the crystal resonator according to the present embodiment as seen from the lower surface, and (b) is a view of the package constituting the crystal resonator according to the present embodiment from the lower surface. It is a perspective plan view. FIG. 4A is a perspective plan view of a mounting frame body that constitutes the crystal resonator according to the present embodiment as viewed from above, and FIG. 5B is a bottom view of the mounting frame body that constitutes the crystal resonator according to the present embodiment. It is the perspective top view seen from. (A) is a perspective plan view of a package constituting the crystal resonator according to the first modification of the present embodiment as viewed from above, and (b) is a crystal resonator according to the first modification of the present embodiment. FIG. (A) is a perspective plan view of the substrate of the package constituting the crystal resonator according to the first modification of the present embodiment as viewed from below, and (b) is the crystal according to the first modification of the present embodiment. FIG. 6 is a perspective plan view of a package constituting the vibrator as viewed from the bottom. (A) is a perspective plan view of a package constituting a crystal resonator according to a second modification of the present embodiment as viewed from above, and (b) is a crystal resonator according to the second modification of the present embodiment. FIG. (A) is a perspective plan view of a substrate of a package constituting a crystal resonator according to a second modification of the present embodiment as viewed from below, and (b) is a crystal according to the second modification of the present embodiment. FIG. 6 is a perspective plan view of a package constituting the vibrator as viewed from the bottom.

  As shown in FIGS. 1 to 5, the crystal resonator according to the present embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and a temperature sensitive element bonded to the lower surface of the package 110. 150. The package 110 has a recess K1 surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. A second recess K2 surrounded by the lower surface of the substrate 110a and the inner surface of the mounting frame 160 is formed. Such a crystal resonator is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface and the temperature sensitive element 150 mounted on the lower surface. The substrate 110a is provided with an electrode pad 111 for mounting the crystal element 120 on the upper surface, and a connection pad 115 for mounting the temperature sensitive element 150 on the lower surface. A first electrode pad 111a and a second electrode pad 111b for bonding the crystal element 120 are provided along one side of the substrate 110a. In addition, bonding terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Further, two of the four junction terminals 112 are electrically connected to the crystal element 120, and the remaining two of the four junction terminals 112 are electrically connected to the temperature sensing element 150. . Further, as shown in FIG. 5, the first joint terminal 112a and the third joint terminal 112c electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the substrate 110a. ing. Further, the second joint terminal 112b and the fourth joint terminal 112d electrically connected to the temperature sensitive element 150 are provided with the first joint terminal 112a and the third joint terminal 112c connected to the crystal element 120. It is provided so as to be located at a diagonal of the substrate 110a different from the diagonal.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113 and a via conductor 114 for electrically connecting the electrode pad 111 provided on the upper surface and the bonding terminal 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. Yes. Further, a connection pattern 116 for electrically connecting the connection pads 115 provided on the lower surface and the bonding terminals 112 provided on the lower surface of the substrate 110a is provided on the surface of the substrate 110a.

  The frame 110b is disposed along the outer peripheral edge of the upper surface of the substrate 110a, and is for forming the first recess K1 on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. As shown in FIGS. 4 and 5, the electrode pad 111 is electrically connected to the bonding terminal 112 provided on the lower surface of the substrate 110a through the wiring pattern 113 and the via conductor 114 provided on the upper surface of the substrate 110a. It is connected to the.

  As shown in FIG. 4, the electrode pad 111 is composed of a first electrode pad 111a and a second electrode pad 111b. Further, as shown in FIG. 5, the junction terminal 112 includes a first junction terminal 112a, a second junction terminal 112b, a third junction terminal 112c, and a fourth junction terminal 112d. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, and a third via conductor 114c. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b. The first electrode pad 111a is electrically connected to one end of the first wiring pattern 113a provided on the substrate 110a. The other end of the first wiring pattern 113a is electrically connected to the first joint terminal 112a through the first via conductor 114a. Therefore, the first electrode pad 111a is electrically connected to the first joint terminal 112a. The second electrode pad 111b is electrically connected to one end of the second wiring pattern 113b provided on the substrate 110a. The other end of the second wiring pattern 113b is electrically connected to the third junction terminal 112c through the third via conductor 114c.

  The joint terminal 112 is used for electrical joining with the joint pad 161 of the mounting frame 160. The junction terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the bonding terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. In addition, the junction terminal 112 that is electrically connected to the electrode pad 111 is provided so as to be located diagonally on the lower surface of the substrate 110a. The second joint terminal 112b is electrically connected to the sealing conductor pattern 118 via the second via conductor 114b. In addition, the conductive bonding material 170 is provided between the bonding terminals 112 and the bonding pads 161 of the mounting frame 160.

  The wiring pattern 113 is provided on the upper surface of the substrate 110a, and is drawn from the electrode pad 111 toward the neighboring via conductor 114. Moreover, the wiring pattern 113 is comprised by the 1st wiring pattern 113a and the 2nd wiring pattern 113b, as shown in FIG.

  The via conductor 114 is provided inside the substrate 110a, and both ends thereof are electrically connected to the wiring pattern 113, the connection pattern 116, or the sealing conductor pattern 118. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110a. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, and a third via conductor 114c, as shown in FIGS.

  The connection pad 115 has a rectangular shape and is used for mounting a temperature sensing element 150 described later. Further, as shown in FIG. 5, the connection pad 115 includes a first connection pad 115a and a second connection pad 115b. In addition, the conductive bonding material 170 is also provided between the lower surface of the connection pad 115 and the connection terminal 151 of the temperature sensitive element 150.

  Here, taking the case where the long side dimension of the substrate 110a as viewed in plan is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the connection pad 115 is taken as an example. Explain the size of. The length of the side of the connection pad 115 parallel to the short side of the substrate 110a is 0.2 to 0.5 mm, and the length of the side parallel to the long side of the substrate 110a is 0.25 to 0.55 mm. It has become. Further, the length between the first connection pad 115a and the second connection pad 115b is 0.1 to 0.3 mm.

  The first connection pad 115a and the second bonding terminal 112b are connected by a first connection pattern 116a provided on the lower surface of the substrate 110a. The second connection pad 115b and the fourth joint terminal 112d are connected by a second connection pattern 116b provided on the lower surface of the substrate 110a.

  The connection pattern 116 is provided on the lower surface of the substrate 110a, and is drawn out from the connection pad 115 toward the bonding terminal 112 in the vicinity. Further, as shown in FIG. 5, the connection pattern 116 includes a first connection pattern 116a and a second connection pattern 116b. The length of the first connection pattern 116a and the length of the second connection pattern 116b are substantially equal. Here, the substantially equal length means that the difference between the length of the first connection pattern 116a provided on the lower surface of the substrate 110a and the length of the second connection pattern 116b provided on the lower surface of the substrate 110a is different by 0 to 200 μm. Shall be included. The length of the connection pattern 116 is obtained by measuring the length of a straight line passing through the center of each connection pattern 116. That is, when the wiring length of the first connection pattern 116a and the wiring length of the second connection pattern 116b are substantially equal, the generated resistance values are equal, and the load resistance applied to the temperature sensing element 150 is also uniform. Therefore, it becomes possible to output a voltage stably.

  Further, as shown in FIGS. 4 and 5, the second connection pattern 116 b is provided so as to be positioned between the pair of electrode pads 111 in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second connection pad 115b through the substrate 110a directly below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Further, as shown in FIGS. 4 and 5, a part of the second connection pattern 116b is provided so as to overlap the first electrode pad 111a in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second connection pad 115b via the substrate 110a located immediately below the first electrode pad 111. Therefore, in such a crystal resonator, the temperature of the crystal element 120 and the temperature of the thermosensitive element 150 are approximated by further shortening the heat conduction path and further increasing the number of heat conduction paths. It is possible to further reduce the difference between the temperature obtained by converting the voltage output from the temperature element 150 and the temperature around the actual crystal element 120.

  The sealing conductor pattern 118 plays a role of improving the wettability of the sealing member 131 when it is joined to the lid 130 via the sealing member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern 118 is electrically connected to the second joint terminal 112b through the second via conductor 114b. The sealing conductor pattern 118 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of, for example, tungsten or molybdenum so as to surround the upper surface of the frame 110b in an annular shape. Has been.

  Here, a method for manufacturing the substrate 110a will be described. When the substrate 110a is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the bonding terminal 112, the wiring pattern 113, the via conductor 114, the connection pad 115, the connection pattern 116, and the sealing conductor pattern 118. Moreover, it produces by giving gold plating, silver palladium, etc. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  The mounting frame 160 is joined along the outer peripheral edge of the lower surface of the substrate 110a, and is used to form the second recess K2 on the lower surface of the substrate 110a. The mounting frame 160 is made of, for example, an insulating substrate such as a glass epoxy resin, and is bonded to the lower surface of the substrate 110 a via a conductive bonding material 170. Inside the mounting frame 160, as shown in FIG. 6, a conductor portion for electrically connecting a bonding pad 161 provided on the upper surface and an external terminal 162 provided on the lower surface of the mounting frame 160. 163 is provided. Bonding pads 161 are provided at the four corners of the upper surface of the mounting frame 160, and external terminals 162 are provided at the four corners of the lower surface. A protective film 164 is provided between the bonding pads 161 on the upper and lower surfaces of the mounting frame 160 and between the external terminals 162. Two of the four external terminals 162 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120. Also, two of the four external terminals 162 are electrically connected to the temperature sensing element 150. Further, the first external terminal 162 a and the third external terminal 162 c that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the mounting frame 160. The second external terminal 162b and the fourth external terminal 162d that are electrically connected to the temperature sensing element 150 are provided with the first external terminal 162a and the third external terminal 162c that are connected to the crystal element 120. It is provided so that it may be located in the diagonal of the mounting frame 160 different from the diagonal which is.

  The bonding pad 161 is for electrically bonding to the bonding terminal 112 of the substrate 110a via the conductive bonding material 170. As shown in FIG. 6A, the bonding pad 161 includes a first bonding pad 161a, a second bonding pad 161b, a third bonding pad 161c, and a fourth bonding pad 161d. Among these, the second bonding pad 161b is bonded to the second bonding terminal 112b, the first connection pattern 116a, and the first connection pad 115a by the conductive bonding material 170. The fourth bonding pad 161d is bonded to the fourth bonding terminal 112d, the second connection pattern 116b, and the second connection pad 115b by the conductive bonding material 170.

  The external terminal 162 is for mounting on a mounting board such as an electronic device. The external terminals 162 are provided at the four corners of the lower surface of the mounting frame 160. Two of the external terminals 162 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. The remaining two terminals of the external terminals 162 are electrically connected to a pair of connection pads 115 provided on the lower surface of the substrate 110a. The second external terminal 162b is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting board of an electronic device or the like. As a result, the lid 130 bonded to the sealing conductor pattern 118 is connected to the second external terminal 162b having the ground potential. Therefore, the shielding property in the 1st recessed part K1 by the cover body 130 improves.

  Further, as shown in FIG. 6B, the external terminal 162 includes a first external terminal 162a, a second external terminal 162b, a third external terminal 162c, and a fourth external terminal 162d. The conductor part 163 includes a first conductor part 163a, a second conductor part 163b, a third conductor part 163c, and a fourth conductor part 163d. The first bonding pad 161a is electrically connected to the first external terminal 162a via the first conductor portion 163a, and the second bonding pad 161b is connected to the second external terminal 162b via the second conductor portion 163b. Electrically connected. The third bonding pad 161c is electrically connected to the third external terminal 162c via the third conductor portion 163c, and the fourth bonding pad 161d is connected to the fourth external terminal 162d via the fourth conductor portion 163d. Electrically connected.

  The conductor portion 163 is for electrically connecting the bonding pad 161 on the upper surface of the substrate 110a and the external terminal 162 on the lower surface. The conductor portion 163 is formed by providing through holes at the four corners of the mounting frame 160, forming a conductive member on the inner wall surface of the through hole, closing the upper surface with the bonding pad 161, and closing the lower surface with the external terminals 162. ing.

  As shown in FIG. 6, the protective film 164 is provided on the upper or lower surface of the mounting frame 160. The protective film 164 is made of a thermosetting resin (for example, epoxy resin) containing a pigment or the like. For example, the protective film 164 is provided so as to cover the upper surface or the lower surface of the mounting frame 160 while exposing the plurality of bonding pads 161 or the external terminals 162. For example, the protective film 164 is formed thicker than the bonding pad 161 and the external terminal 162. For example, the thickness of the bonding pad 161 and the external terminal 162 is 15 μm or more and 40 μm or less, while the thickness of the protective film 164 is 10 μm or more and 25 μm or more and 100 μm or less. As shown in FIGS. 5B and 6, the protective film 164 is provided with a non-arrangement region of the protective film 164 in addition to the region where the bonding pads 161 or the external terminals 162 are disposed. The non-arrangement region has a first non-arrangement region R1, a second non-arrangement region R2, a third non-arrangement region R3, and a fourth non-arrangement region R4. The first non-arrangement region R1 is, for example, the entire inner peripheral surface of the second recess K2.

  As shown in FIG. 6, the second non-arrangement region R <b> 2 is provided at a position connecting the opening of the second recess K <b> 2, the bonding pad 161, and the external terminal 162. The second non-arrangement region R2 is provided at a location where a third non-arrangement region R3 and a fourth non-arrangement region R4, which will be described later, intersect. The second non-arrangement region R2 is provided so as to include a third non-arrangement region R3 and a fourth non-arrangement region R4.

  As shown in FIG. 6, the third non-arrangement region R <b> 3 is provided adjacent to the bonding pad 161 and the external terminal 162 so as to surround the bonding pad 161 together with the outer peripheral edge of the substrate 110. For example, the third non-arrangement region R3 is formed to have a substantially constant width along the edge of the bonding pad 161 and to have a groove shape. Note that “enclose” here means that, for example, the third non-arrangement region R <b> 3 may extend over half or more of the edge of the bonding pad 161.

  The fourth non-arrangement region R4 is provided adjacent to the opening of the second recess K2 and surrounding the opening. For example, the fourth non-arrangement region R4 has a substantially constant width and extends along the edge of the opening of the second recess K2, and is formed in a groove shape. Note that “enclose” here means, for example, that one or more fourth non-arranged regions R4 extend over half of the edge of the opening of the second recess K2, or the edge of the opening of the second recess K2. It is only necessary that the fourth non-arrangement region R4 is located in at least a part of each section obtained by dividing the section into three or more equal parts at a central angle of 120 ° or less.

  The widths of the second non-arrangement region R2, the third non-arrangement region R3, and the fourth non-arrangement region R4 may be set as appropriate. For example, these widths are 30 μm or more and 200 μm or less. These widths may be smaller or larger than the thickness of the protective film 164.

  The shape of the opening of the second recess K2 is a rectangular shape in plan view. Here, taking the case where the long side dimension of the substrate 110a in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the second concave portion is taken as an example. The size of the opening of K2 will be described. The length of the long side of the second recess K2 is 0.6 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm.

  A method for joining the mounting frame 160 to the substrate 110a will be described. First, the conductive bonding material 170 is applied onto the first bonding pad 161a, the second bonding pad 161b, the third bonding pad 161c, and the fourth bonding pad 161d by, for example, a dispenser and screen printing. The substrate 110 a is transported so that the bonding terminals 112 of the substrate 110 a are positioned on the conductive bonding material 170 applied on the bonding pads 161 of the mounting frame 160, and placed on the conductive bonding material 170. . Thus, the bonding terminal 112 of the substrate 110 a is bonded to the bonding pad 161 by heating and melting the conductive bonding material 170. That is, the first bonding terminal 112a of the substrate 110a is bonded to the first bonding pad 161a, and the second bonding terminal 112b of the substrate 110a is bonded to the second bonding pad 161b. Further, the third bonding terminal 112c of the substrate 110a is bonded to the third bonding pad 161c, and the fourth bonding terminal 112d of the substrate 110a is bonded to the fourth bonding pad 161d.

  Further, the bonding terminal 112 of the substrate 110a and the bonding pad 161 of the mounting frame 160 are bonded via the conductive bonding material 170, so that the substrate 110a and the mounting frame 160 are shown in FIG. 2B. Is provided with a gap H corresponding to the sum of the thickness of the conductive bonding material 170 and the thickness of the bonding terminal 112 and the bonding pad 161, and the gap H is covered with the first insulation 150. Resin 180 is provided. A second insulating resin 190 is provided on the upper surface of the mounting frame 160 and the side surface of the substrate 110. The second insulating resin 190 is joined to the first insulating resin 180 as shown in FIG. As a result, if the crystal resonator of this embodiment is mounted on a mounting board such as an electronic device, other electronic components such as power amplifiers mounted on the mounting board generate heat, and the heat Even if the heat is transferred into the second recess K2 through the mounting substrate, the heat is transferred from the first insulating resin 180 in the second recess K2 to the first insulating resin 180 provided in the gap H. . Next, the heat is transmitted to the second insulating resin 190 joined to the first insulating resin 180 provided in the gap H. Finally, since the second insulating resin 190 is exposed to the outside, heat is released into the atmosphere. By doing in this way, the influence of a heat | fever can be relieve | moderated with respect to the thermosensitive element 150 mounted in the 2nd recessed part K2. Therefore, such a crystal resonator can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  Further, since the first insulating resin 180 is provided in such a gap H, the temperature sensitive element 150 is surely fixed by the first insulating resin 180. Peeling from the substrate 110a can be reduced.

  The second insulating resin 190 may be provided so as to adhere to the side surface of the lid 130. By doing so, the heat transmitted to the second insulating resin 190 is also transmitted to the lid body 130 and is released from both the lid body 130 and the second insulating resin 190. The influence of heat on the temperature sensitive element 150 mounted in K2 can be further reduced.

  Here, a method for manufacturing the mounting frame 160 will be described. When the mounting frame 160 is made of glass epoxy resin, it is manufactured by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature. In addition, a predetermined portion of the conductor pattern, specifically, the bonding pad 161 and the external terminal 162, for example, transfer a copper foil processed into a predetermined shape onto a resin sheet made of glass epoxy resin, and the copper foil is transferred. The formed resin sheets are laminated and bonded with an adhesive. The conductor portion 163 is formed by depositing a metal on the inner surface of a through hole formed in the resin sheet by a conductive paste printing or plating method, or by filling the through hole with a metal. Such a conductor part 163 is formed by, for example, integrating a metal foil or a metal column by resin molding, or depositing it using a sputtering method, a vapor deposition method, or the like. Further, the protective film 164 covers a top surface or a bottom surface of the mounting frame 160 with a thermosetting resin (for example, epoxy resin) containing a pigment or the like, for example, while exposing the plurality of bonding pads 161 or the external terminals 162. Is provided.

  As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is between the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110a by a cantilevered support structure with a free end.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the first external terminal 112 a and the third external terminal 112 c are electrically connected to the crystal element 120.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 150, a thermistor, a platinum resistance thermometer, a diode, or the like is used. In the case of the thermistor element, the temperature sensing element 150 has a rectangular parallelepiped shape, and is provided with connection terminals 151 at both ends. The temperature sensing element 150 shows a remarkable change in electrical resistance due to a change in temperature. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and voltage and the relationship between voltage and temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 150 outputs a voltage between connection terminals 151, which will be described later, to the outside of the crystal resonator through the second external terminal 112b and the fourth external terminal 112d, for example, a main IC such as an electronic device. Temperature information can be obtained by converting the voltage output at (not shown) into temperature. Such a temperature sensitive element 150 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the main IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation. Can do.

  In the case where a platinum resistance thermometer is used, the temperature sensing element 150 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 151 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

  When a diode is used, the temperature sensing element 150 has a structure in which a semiconductor element is mounted on an upper surface of a semiconductor element substrate and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals 151 serving as an anode terminal and a cathode terminal are provided from the bottom surface to the side surface of the semiconductor element substrate. The temperature sensing element 150 has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly flows current from the cathode terminal to the anode terminal. The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, temperature information of the crystal element can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. The voltage between the cathode terminal and the anode terminal of the connection terminal 151 is output to the outside of the crystal resonator via the second external terminal 112b and the fourth external terminal 112d.

  As shown in FIG. 2, the temperature sensing element 150 is mounted on a connection pad 115 provided on the lower surface of the substrate 110a via a conductive bonding material 170 such as solder. The first connection terminal 151a of the temperature sensitive element 150 is connected to the first connection pad 115a, and the second connection terminal 151b is connected to the second connection pad 115b. The first connection pad 115a is connected to the second external terminal 112b via a first connection pattern 116a provided on the lower surface of the substrate 110a. The second external terminal 112b serves as a ground terminal by being connected to a mounting pad that is connected to a ground that is a reference potential on a mounting substrate of an electronic device or the like. Therefore, the first connection terminal 151a of the temperature sensitive element 150 is connected to the ground that is the reference potential.

  Further, the temperature sensing element 150 is positioned in the plane of the excitation electrode 122 provided on the crystal element 120 in plan view, so that the temperature sensing element 150 is shielded by the metal film of the excitation electrode 122. Protects against noise from other semiconductor components and electronic components such as power amplifiers constituting electronic devices. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  A method for bonding the temperature sensitive element 150 to the substrate 110a will be described. First, the conductive bonding material 170 is applied to the connection pad 115 by a dispenser, for example. The temperature sensitive element 150 is placed on the conductive bonding material 170. The conductive bonding material 170 is melt bonded by heating. Therefore, the temperature sensitive element 150 is bonded to the pair of connection pads 115.

  When the temperature sensitive element 150 is a thermistor element, as shown in FIGS. 1 and 2, one connection terminal 151 is provided at each end of the rectangular parallelepiped shape. The first connection terminal 151 a is provided on the right side surface and the top and bottom surfaces of the temperature sensing element 150. The second connection terminals 151b are provided on the left side surface and the top and bottom surfaces of the temperature sensitive element 150. The length of the long side of the temperature sensitive element 150 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 170 is made of, for example, silver paste or lead-free solder. The conductive bonding material contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  The first insulating resin 180 prevents the solder or the like used when mounting on a mounting substrate such as an electronic device from adhering to the temperature sensing element 150, and the connection terminal 151 of the temperature sensing element 150 and the mounting frame. This is to reduce a short circuit with the external terminal 112 of 110c. The first insulating resin 180 covers the temperature sensing element 150 and is provided in the gap H between the temperature sensing element 150 and the substrate 110a and between the mounting frame 160 and the substrate 110a.

  Next, the first insulating resin 180 is applied by applying the uncured first insulating resin 180 between the temperature-sensitive element 150 and the substrate 110a and the mounting frame through the opening of the second recess K2. Filled between 160 and the substrate. Filling is performed by, for example, a dispenser. At this time, the uncured first insulating resin 180 has higher wettability to the mounting frame 160 than wettability to the protective film 164. Alternatively, in the non-arrangement region of the protective film 164, corners formed by the upper and lower surfaces of the mounting frame 180 and the side surfaces of the protective film 164, or the upper and lower surfaces of the mounting frame 160 and the side surfaces of the protective film 164 are formed. Capillary phenomenon that pulls in the protective film 164 occurs in the groove to be formed. As a result, the first insulating resin 180 preferentially spreads on the second non-arranged region R2, the third non-arranged region R3, and the fourth non-arranged region R4 rather than on the protective film 164. Thereafter, the first insulating resin 180 is cured by an atmosphere at room temperature or by heating with a reflow furnace or the like.

  Further, the first insulating resin 180 is provided so as to reach the bonding pad 162 from the second recess K2 via the second non-arrangement region R2. Thus, the mounting frame body 160 and the board | substrate 110a can be joined by the 1st insulating resin 180 for protecting the short circuit of the temperature sensing element 150, and both joint strength can be improved. Since the bonding strength is improved in the second non-arrangement region R2 extending to the bonding pad 161, the reliability of the electrical connection between the bonding pad 161 and the bonding terminal 112 can be improved.

  The first insulating resin 180 is provided so as to spread from the second non-arrangement region R2 to the third non-arrangement region R3. Therefore, the bonding strength between the mounting frame 160 and the substrate 110 a by the first insulating resin 180 is improved around the bonding pad 162. As a result, the reliability of the electrical connection between the bonding pad 62 and the bonding terminal 112 can be further improved. Further, since the first insulating resin 180 is provided around the bonding pad 162, the first insulating resin 180 is also provided around the conductive bonding material 170 provided between the bonding pad 161 and the bonding terminal 112. Since it is provided, a short circuit with other electronic components mounted on the electronic device or the like due to adhesion of solder or the like can be reduced.

  The first insulating resin 180 is provided so as to spread from the second recess K2 onto the fourth non-arrangement region R4. Therefore, for example, the insulating resin 180 provided so as to cover the temperature sensing element 150 engages the mounting frame 160 from the upper surface side to the lower surface side. As a result, for example, a force that pulls the connection terminal 151 of the temperature sensing element 150 away from the connection pad 115 can be suppressed from being applied to the temperature sensing element 150.

  The second insulating resin 190 is for protecting the upper surface of the mounting frame 160 and the side surface of the substrate 110a. The second insulating resin 190 is provided so as to be bonded to the first insulating resin 180 provided in the gap H and to cover the upper surface of the mounting frame 160 and the side surface of the substrate 110a. For the first insulating resin 180 and the second insulating resin 190, for example, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used. The elastic modulus of the first insulating resin 180 and the second insulating resin 190 is, for example, 1 to 3 GPa in the case of an epoxy resin.

  The second insulating resin 190 may be provided so as to adhere to the side surface of the lid 130. By doing this, if the crystal unit is mounted on a mounting board such as an electronic device, electronic components such as other power amplifiers mounted on this mounting board generate heat, and the heat is mounted. Even if the heat is transferred into the second recess K2 through the substrate, the heat is transferred from the first insulating resin 180 in the second recess K2 to the first insulating resin 180 provided in the gap H. Next, the heat is transmitted to the second insulating resin 190 joined to the first insulating resin 180 provided in the gap H. Finally, heat is released from the second insulating resin 190 into the atmosphere, part of the heat is transferred from the second insulating resin 190 to the lid 130, and heat is also released from the lid 130 into the atmosphere. The By doing in this way, the influence of a heat | fever can be further relieve | moderated with respect to the temperature sensing element 150 mounted in the 2nd recessed part K2. Therefore, such a crystal resonator can further reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  Further, the second insulating resin 190 may be provided so as to cover the lid 130. By doing so, even if an impact is applied to the crystal unit, the insulating resin 190 is formed so as to cover the crystal unit, so that the impact is absorbed and the crystal element 120 is applied with an impact. Therefore, the crystal element 120 can be prevented from peeling off from the electrode pad 111.

  The second insulating resin 190 is supplied so as to adhere to the upper surface of the mounting frame 160, the side surface of the substrate 110a, and the side surface of the lid 130 by, for example, a transfer molding method or a printing method. Further, when the second insulating resin 190 is supplied, productivity can be improved by using a sheet substrate (not shown) provided with a plurality of mounting frame bodies 160 adjacent to each other. In addition, when this sheet substrate is used, the mounting frame body 160 is cut with a dicer in the direction of the second insulating resin 190, so that there is a variability near the external terminal 162 on the lower surface side of the mounting frame body 160. Since the crystal resonator can be separated into individual pieces while reducing the occurrence of the above, productivity can be improved.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. Such a lid 130 is for hermetically sealing the first recess K1 in a vacuum state or the first recess K1 filled with nitrogen gas or the like. Specifically, the lid body 130 is placed on the frame body 110b of the package 110 in a predetermined atmosphere, and the sealing conductor pattern 118 of the frame body 110b and the sealing member 131 of the lid body 130 are welded. As described above, by applying a predetermined current and performing seam welding, the frame body 110b is joined. The lid 130 is electrically connected to the second external terminal 162b on the lower surface of the mounting frame 160 via the sealing conductor pattern 118, the second via conductor 114b, and the second conductor portion 163b. The second external terminal 162b is electrically connected to the second connection pad 115b through the conductive bonding material 170. Therefore, the lid 130 is electrically connected to the second external terminal 112b of the package 110.

  The sealing member 131 is provided at a position of the lid body 130 facing the sealing conductor pattern 118 provided on the upper surface of the frame 110 b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  The crystal resonator according to this embodiment includes a rectangular substrate 110a, a mounting frame 160 provided on the lower surface of the substrate 110a, a bonding terminal 112 provided along the outer peripheral edge of the lower surface of the substrate 110a, and a mounting frame. A bonding pad 161 provided along the outer peripheral edge of the upper surface of the body 160, a pair of electrode pads 111 provided on the upper surface of the substrate 110a, and a pair of connections provided on the lower surface of the substrate 110a in the mounting frame 160 A pad 115, a crystal element 120 mounted on the electrode pad 111, a temperature sensing element 150 mounted on the connection pad 115, a gap H provided between the substrate 110a and the mounting frame 160, and a crystal element A lid 130 for hermetically sealing, a temperature-sensitive element 150, a first insulating resin 180 provided in the gap H, and an upper surface of the mounting frame 160 on the side surface of the substrate 110a. Only in and a second insulating resin 190 provided. By doing so, since the second insulating resin 190 is provided from the upper surface of the mounting frame 160 to the side surface of the substrate 110a, the stress applied by the drop test can be absorbed and the second insulation is temporarily provided. Even if stress that could not be absorbed by the heat-sensitive resin 190 is applied to the temperature-sensitive element 150, the temperature-sensitive element 150 is connected to the connection pad 115 because the first insulating resin 180 is provided to cover the temperature-sensitive element 150. It is possible to improve the bonding strength between the temperature sensitive element 150 and the connection pad while suppressing the disconnection.

  In the crystal resonator according to the present embodiment, the mounting frame 160 is formed of a glass epoxy substrate. By doing in this way, the base material of the mounting frame 160 and the base material of the mounting substrate (not shown) constituting the electronic device or the like are made of the same resin material, so that the difference in thermal expansion coefficient is further increased. Can be small. For this reason, even when the mounting substrate is deformed by heating, the stress due to the deformation is relieved by the presence of the mounting frame 160, and as a result, the stress applied to the solder is also relieved. Such a crystal resonator can reduce the occurrence of peeling from a mounting substrate such as an electronic device.

  In the crystal resonator of this embodiment, the first insulating resin 180 and the second insulating resin 190 are joined. When such a crystal unit is mounted on a mounting board such as an electronic device, other electronic components such as power amplifiers mounted on the mounting board generate heat, and the heat is transmitted through the mounting board. Even if the heat is transferred into the second recess K2, the heat is transferred from the first insulating resin 180 in the second recess K2 to the first insulating resin 180 provided in the gap H. Next, the heat is transmitted to the second insulating resin 190 joined to the first insulating resin 180 provided in the gap H. Finally, since the second insulating resin 190 is exposed to the outside, heat is released into the atmosphere. By doing in this way, the influence of a heat | fever can be relieve | moderated with respect to the thermosensitive element 150 mounted in the 2nd recessed part K2. Therefore, such a crystal resonator can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  Further, in the crystal resonator of this embodiment, the second insulating resin 190 and the lid body 130 are joined. When such a crystal unit is mounted on a mounting board such as an electronic device, other electronic components such as power amplifiers mounted on the mounting board generate heat, and the heat is transmitted through the mounting board. Even if the heat is transferred into the second recess K2, the heat is transferred from the first insulating resin 180 in the second recess K2 to the first insulating resin 180 provided in the gap H. Next, the heat is transmitted to the second insulating resin 190 joined to the first insulating resin 180 provided in the gap H. Finally, heat is released from the second insulating resin 190 into the atmosphere, part of the heat is transferred from the second insulating resin 190 to the lid 130, and heat is also released from the lid 130 into the atmosphere. The By doing in this way, the influence of a heat | fever can be further relieve | moderated with respect to the temperature sensing element 150 mounted in the 2nd recessed part K2. Therefore, such a crystal resonator can further reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  In addition, the crystal resonator according to the present embodiment is sensitive to the plane of the excitation electrode 122 provided on the crystal element 120 in plan view with the crystal element 120 and the temperature sensitive element 150 mounted on the substrate 110a. By positioning the temperature element 150, the temperature-sensitive element 150 is protected from noise from other semiconductor components such as a power amplifier constituting the electronic apparatus and electronic components by the shielding effect by the metal film of the excitation electrode 122. . Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  Further, the crystal resonator in the present embodiment is provided such that the electrode pad 111 is adjacent along one side of the inner peripheral edge of the first frame 110b, and the second connection pattern 116b is viewed in plan view. It is provided so as to be positioned between the pair of electrode pads 111. By doing so, the heat transferred from the crystal element 120 is transferred to the second connection pad 115b via the second connection pattern 116b via the substrate 110a directly below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Further, the crystal resonator in the present embodiment is provided so that a part of the second connection pattern 116b overlaps the first electrode pad 111a in plan view. By doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second connection pad 115b through the substrate 110a directly below the first electrode pad 111a. In such a crystal resonator, by further shortening the heat conduction path and further increasing the number of heat conduction paths, the temperature of the crystal element 120 and the temperature of the temperature-sensitive element 150 are further approximated, and the temperature sensitivity is increased. It is possible to further reduce the difference between the temperature obtained by converting the voltage output from the element 150 and the temperature around the actual crystal element 120.

  In addition, the crystal resonator according to the present embodiment includes a protective film 164 that covers the mounting frame 160 while exposing the bonding pad 161, and includes a second recess K <b> 2 provided between the substrate 110 a and the mounting frame 160. The inner peripheral surface has a first non-arrangement region R1 in which the protective film 164 is not disposed. By doing in this way, since the protective film 164 is not disposed on the inner peripheral surface of the opening of the second recess K2, the first insulating resin 180 enters the second recess K2 by capillary action. While suppressing this, the opening area of the opening of the second recess K2 can be increased by a thickness twice that of the protective film 164. As a result, the large temperature sensitive element 150 can be mounted. Further, when the temperature sensitive element 150 is mounted on the connection pad 115, the temperature sensitive element 150 can be prevented from coming into contact with the inner wall of the second recess K2.

  Further, in the crystal resonator according to the present embodiment, the second non-arrangement region R2 in which the protective film 164 is not disposed on the upper surface of the mounting frame 160 and connects the opening of the second recess K2 and the bonding pad 161 is provided. The first insulating resin 180 is provided so as to reach the bonding pad 162 from the opening of the second recess K2 via the second non-arrangement region R2. Thus, the mounting frame body 160 and the board | substrate 110a can be joined by the 1st insulating resin 180 for protecting the short circuit of the temperature sensing element 150, and both joint strength can be improved. Since the bonding strength is improved in the second non-arrangement region R2 extending to the bonding pad 161, the reliability of the electrical connection between the bonding pad 161 and the bonding terminal 112 can be improved.

  Further, the crystal resonator according to the present embodiment has a third non-arrangement region R3 that is not disposed with the protective film 164 on the upper surface of the mounting frame 160, is adjacent to the bonding pad 161, and surrounds the bonding pad 161. The first insulating resin 180 is provided so as to spread from the second non-arrangement region R2 to the third non-arrangement region R3. Therefore, the bonding strength between the mounting frame 160 and the substrate 110 a by the first insulating resin 180 is improved around the bonding pad 162. As a result, the reliability of electrical connection between the bonding pad 162 and the bonding terminal 112 can be further improved. Further, since the first insulating resin 180 is provided around the bonding pad 162, the first insulating resin 180 is also provided around the conductive bonding material 170 provided between the bonding pad 161 and the bonding terminal 112. Since it is provided, a short circuit with other electronic components mounted on the electronic device or the like due to adhesion of solder or the like can be reduced.

  Further, in the crystal resonator according to the present embodiment, the protective film 164 is not disposed on the upper surface of the mounting frame 160, is adjacent to the opening of the second recess K2, and surrounds the opening of the second recess K2. The non-arrangement region R4 is provided, and the protective film 164 is provided so as to spread from the second recess K2 to the fourth non-arrangement region R4. Therefore, the first insulating resin 180 provided so as to cover the temperature sensing element 150 is engaged with the mounting frame 160 from the upper surface side to the lower surface side. As a result, for example, a force that pulls the connection terminal 151 of the temperature sensing element 150 away from the connection pad 115 can be suppressed from being applied to the temperature sensing element 150.

(First modification)
Hereinafter, the crystal resonator according to the first modification of the present embodiment will be described. Note that, in the crystal resonator according to the first modification of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 7 and 8, the crystal resonator in the first modification of the present embodiment includes a wiring pattern 213 for electrically connecting the electrode pad 211 and the connection terminal 212. One of the wiring patterns 213 is provided on the same plane as the connection pads 215 and is provided at a position overlapping the mounting frame 160.

  As shown in FIG. 7, the electrode pad 211 includes a first electrode pad 211a and a second electrode pad 211b. Further, as shown in FIG. 7, the joining terminal 212 includes a first joining terminal 212a, a second joining terminal 212b, a third joining terminal 212c, and a fourth joining terminal 212d. The via conductor 214 includes a first via conductor 214a and a second via conductor 214b. The wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, and a third wiring pattern 213c. The first electrode pad 211a is electrically connected to one end of the first wiring pattern 213a provided on the substrate 210a. The other end of the first wiring pattern 213a is electrically connected to one end of the third wiring pattern 213c via the first via conductor 214a. The other end of the third wiring pattern 213c is electrically connected to the first joint terminal 212a. Therefore, the first electrode pad 211a is electrically connected to the first bonding terminal 212a. The second electrode pad 211b is electrically connected to one end of the second wiring pattern 213b provided on the substrate 210a. The other end of the second wiring pattern 213b is electrically connected to the third junction terminal 212c through the second via conductor 214b.

  Further, the wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, and a third wiring pattern 213c, as shown in FIGS. The first wiring pattern 213a and the second wiring pattern 213b are provided on the upper surface of the substrate 210a, and are drawn from the electrode pad 211 toward the via conductor 214 of the nearby substrate 210a. The third wiring pattern 213c is provided on the lower surface of the substrate 210a and is provided so as to be close to the connection pad 215 of the substrate 210a. That is, the distance between the third wiring pattern 213c and the connection pad 215b is 50 to 100 μm. By doing so, heat transferred from the crystal element 120 is transferred from the electrode pad 211 to the third wiring pattern 213c via the first wiring pattern 213a and the first via conductor 214a. Next, the heat transmitted from the crystal element 120 is transmitted from the third wiring pattern 213c to the connection pad 215 via the lower surface of the substrate 210a. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the actual temperature around the quartz crystal element 120 can be reduced.

  Further, the third wiring pattern 213 c is provided at a position overlapping the mounting frame body 160. In this way, when the crystal resonator according to the first modification of the present embodiment is mounted on a mounting board such as an electronic device, the wiring conductor provided on the mounting board and the third wiring pattern 213c. The stray capacitance generated between the two can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

  The crystal resonator in the first modification of the present embodiment includes a wiring pattern 213 for electrically connecting the electrode pad 211 and the connection terminal 212, and the third wiring pattern 213 c is flush with the connection pad 215. It is provided on a position that overlaps with the mounting frame 160. By doing so, heat transferred from the crystal element 120 is transferred from the electrode pad 211 to the third wiring pattern 213c via the first wiring pattern 213a and the first via conductor 214a. Next, the heat transmitted from the crystal element 120 is transmitted from the third wiring pattern 213c to the connection pad 215 via the lower surface of the substrate 210a. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the actual temperature around the quartz crystal element 120 can be reduced.

  Further, in the crystal resonator according to the first modified example of the present embodiment, the third wiring pattern 213 c is provided at a position where it overlaps with the mounting frame body 160. In this way, when the crystal resonator according to the first modification of the present embodiment is mounted on a mounting board such as an electronic device, the wiring conductor provided on the mounting board and the third wiring pattern 213c. The stray capacitance generated between the two can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. As shown in FIGS. 9 to 10, the quartz crystal device according to the second modification of the present embodiment is connected to the substrate 310a so that the long side of the temperature sensitive element 150 is parallel to the short side of the substrate 310a. It differs from the present embodiment in that it is mounted on the pad 315.

  The connection pad 315 has a rectangular shape and is provided near the center of the lower surface of the substrate 310a. As shown in FIG. 10, the connection pads 315 are provided adjacent to each other so that the long sides of the connection pads 315 and the short sides of the substrate 310a are parallel to each other. The connection pad 315 includes a first connection pad 315a and a second connection pad 315b.

  As shown in FIG. 10B, the connection pattern 316 is provided on the lower surface of the substrate 310a, and is drawn from the connection pad 315 toward the neighboring via conductor 314. The second connection pattern 316b is provided so as to overlap the first wiring pattern 313a. By doing so, heat transmitted from the crystal element 120 is transmitted from the first electrode pad 311a to the first wiring pattern 313a, and from the second connection pattern 316b via the substrate 310a immediately below the first wiring pattern 313a. It is transmitted to the second connection pad 315b. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Here, when the board 310a is viewed in plan, the long side dimension is 1.2 to 2.5 mm, and the short side dimension is 1.0 to 2.0 mm as an example. Explain the size of. The length of the side of the connection pad 315 parallel to the long side of the substrate 310a is 0.2 to 0.5 mm, and the length of the side parallel to the short side of the substrate 310a is 0.25 to 0.55 mm. It has become. Further, the length between the first connection pad 315a and the second connection pad 315b is 0.1 to 0.3 mm.

  The temperature sensing element 150 is mounted on the lower surface of the substrate 310a so that the long side of the temperature sensing element 150 and the short side of the substrate 310a are parallel to each other. By doing in this way, the 1st junction terminal 312a electrically connected with the crystal element 120 can lengthen the space | interval with the 1st connection pad 315a, and is electrically connected with the crystal element 120. Since the third joint terminal 312c can have a longer distance from the second connection pad 315b, even if the conductive joint material 170 joining the temperature sensitive element 150 overflows, the conductive joint material 170 Can be suppressed. Therefore, a short circuit between the temperature sensitive element 150 and the junction terminal 312 electrically connected to the crystal element 120 can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the frame 110b is integrally formed of a ceramic material in the same manner as the substrate 110a has been described. However, the frame 110b may be made of metal. In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

  In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described, but the frame 110b may not be provided. In this case, the lid may be configured by a rectangular sealing base and a sealing frame provided along the outer peripheral edge of the lower surface of the sealing base. In such a lid, an accommodation space is formed by the lower surface of the sealing base and the inner side surface of the sealing frame. The sealing frame part is provided along the outer edge of the lower surface of the sealing base. The sealing base portion and the sealing frame portion are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid is for hermetically sealing a housing space in a vacuum state or a housing space filled with nitrogen gas or the like. Specifically, the lid is placed on the upper surface of the flat substrate in a predetermined atmosphere, and heat is applied to the bonding member provided between the upper surface of the substrate and the lower surface of the sealing frame portion. In this way, fusion bonding is performed.

  Moreover, although the case where the conductor part 163 was provided in the board | substrate was demonstrated in the said embodiment, you may provide in the inside of the notch provided in the corner | angular part of the mounting frame 160. FIG. At this time, the conductive portion is provided so as to print the conductor paste in the cut.

110, 210, 310 ... Package 110a, 210a, 310a ... Substrate 110b, 210b, 310b ... Frame body 111, 211, 311 ... Electrode pad 112, 212, 312 ... Joint terminal 113, 213, 313 ... wiring pattern 114, 214, 314 ... via conductor 115, 215, 315 ... connection pad 116, 216, 316 ... mounting pad 117, 217, 317 ... connection pattern 118, 218, 318 ... Conductive pattern for sealing 120 ... Crystal element 121 ... Crystal base plate 122 ... Electrode for excitation 123 ... Extraction electrode 130 ... Lid 131 ... Sealing member 140: conductive adhesive 150 ... temperature sensitive element 151 ... connection terminal 160 ... mounting frame 161 ... bonding pad 161 ... external terminal 163 ... conductor part 164 ... protective film 180 ... first insulating resin 190 ... second insulating resin K1 ... first recess K2 ... second recess H: Gap R1 ... First non-arrangement region R2 ... Second non-arrangement region R3 ... Third non-arrangement region R4 ... Fourth non-arrangement region

Claims (7)

A rectangular substrate;
A mounting frame provided on the lower surface of the substrate;
Bonding terminals provided along the outer peripheral edge of the lower surface of the substrate;
A bonding pad provided along the outer peripheral edge of the upper surface of the mounting frame;
A pair of electrode pads provided on the upper surface of the substrate;
A pair of connection pads provided on the lower surface of the substrate in the mounting frame;
A crystal element mounted on the electrode pad;
A temperature sensitive element mounted on the connection pad;
A gap provided between the substrate and the mounting frame;
A lid for hermetically sealing the crystal element;
A first insulating resin that covers the temperature sensitive element and is provided in the gap;
And a second insulating resin provided from the upper surface of the mounting frame to the side surface of the substrate. The crystal resonator according to claim 1,
A crystal resonator, wherein the mounting frame is formed of a glass epoxy substrate. The crystal resonator according to claim 1 or 2,
The crystal unit, wherein the first insulating resin and the second insulating resin are bonded. The crystal resonator according to claim 1, wherein
The quartz resonator, wherein the second insulating resin is provided so as to be joined to the lid. The crystal resonator according to any one of claims 1 to 4,
The temperature sensing element is positioned in a plane of an excitation electrode provided on the crystal element in plan view in a state where the crystal element and the temperature sensing element are mounted on the substrate. Crystal resonator. The crystal resonator according to any one of claims 1 to 5,
The electrode pad is provided so as to be adjacent along one side of the inner peripheral edge of the frame,
One of the connection patterns is provided so as to be positioned between the pair of electrode pads in plan view. The crystal resonator according to any one of claims 1 to 6,
A wiring pattern for electrically connecting the electrode pad and the junction terminal;
One of the wiring patterns is provided on the same plane as the connection pad, and is provided at a position overlapping the mounting frame.

Images