JP2016072280A5 - - Google Patents

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Publication number
JP2016072280A5
JP2016072280A5 JP2014196728A JP2014196728A JP2016072280A5 JP 2016072280 A5 JP2016072280 A5 JP 2016072280A5 JP 2014196728 A JP2014196728 A JP 2014196728A JP 2014196728 A JP2014196728 A JP 2014196728A JP 2016072280 A5 JP2016072280 A5 JP 2016072280A5
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JP
Japan
Prior art keywords
rail
pressing
die
film
changing
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JP2014196728A
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English (en)
Japanese (ja)
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JP6324860B2 (ja
JP2016072280A (ja
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Priority claimed from JP2014196728A external-priority patent/JP6324860B2/ja
Publication of JP2016072280A publication Critical patent/JP2016072280A/ja
Publication of JP2016072280A5 publication Critical patent/JP2016072280A5/ja
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JP2014196728A 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 Active JP6324860B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Publications (3)

Publication Number Publication Date
JP2016072280A JP2016072280A (ja) 2016-05-09
JP2016072280A5 true JP2016072280A5 (OSRAM) 2017-06-01
JP6324860B2 JP6324860B2 (ja) 2018-05-16

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ID=55864907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014196728A Active JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Country Status (1)

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JP (1) JP6324860B2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018129324A (ja) * 2017-02-06 2018-08-16 株式会社東芝 ピックアップ装置
WO2025182629A1 (ja) * 2024-02-29 2025-09-04 東京エレクトロン株式会社 接合装置、及び接合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031672A (ja) * 2002-06-26 2004-01-29 Sharp Corp チップのピックアップ装置
JP2005033065A (ja) * 2003-07-08 2005-02-03 Shinkawa Ltd 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム
JP2007165351A (ja) * 2005-12-09 2007-06-28 Shibuya Kogyo Co Ltd ダイボンディング方法

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