JP2016068463A - Manufacturing method of functional element and functional element member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a functional element capable of suppressing a damage to a ground layer when using a film deposition method that accumulates particles having energy, by a simple method.SOLUTION: A manufacturing method of a functional element includes: a ground layer preparation step of preparing a ground layer including a main material and a fluorine-based material having acryl as a main skeleton; and a functional layer formation step of forming a functional layer on the ground layer by a film deposition method that accumulates particles having energy.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a functional element using a film forming method for depositing particles having energy, and a functional element member used therefor.

  A film forming method for depositing particles having energy, such as a sputtering method, is a film forming method widely used in various fields such as a semiconductor device, an electronic device, and an optical device.

  In the film forming method, usually, a particulate material having energy is deposited by colliding with the surface of the underlayer to form a thin film. At this time, there is a problem that the surface of the underlayer is damaged by collision of energetic particles, electrons, ions, gas particles used during film formation, and the like.

Patent Document 1 discloses a method of forming a polymer protective layer on an organic LED layer in advance when a transparent electrode is formed on the organic LED layer using a sputtering method in a method for manufacturing an organic semiconductor element. . Further, Patent Document 2 discloses that in the method of manufacturing an organic electroluminescence element, when a transparent electrode is formed on an organic material layer using a sputtering method, a sputter protective layer is previously formed on the organic material layer. . As described above, in a film forming method for depositing particles having energy, a technique for forming a protective layer on a base layer has been conventionally used.
Further, in order to reduce damage to the underlayer, a counter target type sputtering apparatus has been developed that can dispose the underlayer in the side direction of two opposing target materials.

However, when the protective layer is formed on the above-described base layer, there is a problem that the manufacturing cost increases due to an increase in the number of steps. In addition, when the facing target type sputtering apparatus is used, there are problems that the utilization efficiency of the target material is lowered and that film formation takes time.
Therefore, in a film forming method for depositing energetic particles, a method for suppressing damage to the underlayer by a simpler method is required.

JP 2003-249353 A JP 2003-77651 A

  The present invention has been made in view of the above circumstances, and is a functional element capable of suppressing damage to an underlying layer by a simple method when a film forming method for depositing energetic particles is used. The main object is to provide a manufacturing method and a functional element member used therefor.

  In order to achieve the above object, as a result of intensive research conducted by the present inventors, when a film forming method for depositing energetic particles by adding a specific fluorine-based material to the main material of the underlayer is used. It has been found that it is possible to effectively suppress damage to the underlayer of the present invention, and the present invention has been completed.

  That is, the present invention provides an underlayer preparation step for preparing an underlayer containing a main material and a fluorine-based material having acrylic as a main skeleton, and a film forming method for depositing energetic particles on the underlayer. And a functional layer forming step of forming a functional layer.

  According to the present invention, it is possible to prepare an underlayer in which the fluorine-based material is unevenly distributed on at least one surface of the underlayer by including the underlayer preparation step. Therefore, in the functional layer forming step, the unevenly distributed portion of the fluorine-based material functions as a protective layer, and damage to the main material existing on the inner side of the unevenly distributed portion of the fluorine-based material can be suppressed. Furthermore, according to the present invention, it is not necessary to separately form a protective layer on the base layer, and a conventional film forming method can be applied. Therefore, the method for producing a functional element of the present invention can suppress damage to the underlying layer by a simple method when using a film forming method for depositing particles having energy.

  In the said invention, it is preferable that the said main material contains a metal particle. This is because damage to the underlayer can be suitably suppressed.

  In the said invention, it is preferable that the said fluorine-type material has a functional group which has silicon skeleton further. This is because the strength of the surface of the underlayer can be improved, and resistance to a film forming method for depositing energetic particles can be increased.

  The present invention relates to a functional element member used in a method for manufacturing a functional element, which includes a step of forming a functional layer on an underlayer using a film forming method for depositing particles having energy. And a functional element member comprising: the base layer containing a fluorine-based material having an acrylic main skeleton, wherein the fluorine-based material is unevenly distributed on at least one surface side of the base layer. provide.

  According to the present invention, when the fluorine-based material is unevenly distributed on at least one surface of the underlayer, the functional layer is formed on the underlayer by the film-forming method for depositing particles having energy. The unevenly distributed portion of the system material functions as a protective layer, and damage to the main material existing on the inner side of the unevenly distributed portion of the fluorine-based material can be suppressed. Furthermore, according to the present invention, it is not necessary to separately form a protective layer on the base layer, and a conventional film forming method can be applied. Therefore, the member for a functional element of the present invention can suppress damage to the base layer by a simple method when using a film forming method for depositing energetic particles.

  In the said invention, it is preferable that the said member for functional elements has a base material and the said base layer formed on the said base material, and the said main material contains a metal particle. This is because damage to the underlayer can be suitably suppressed.

  The method for producing a functional element of the present invention has an effect that it is possible to suppress damage to the underlying layer by a simple method when a film forming method for depositing energetic particles is used.

It is process drawing which shows an example of the manufacturing method of the functional element of this invention. It is process drawing which shows the other example of the manufacturing method of the functional element of this invention. It is a schematic sectional drawing which shows an example of the member for functional elements of this invention.

  Hereafter, the manufacturing method of the functional element of this invention and the detail of the member for functional elements used for this are demonstrated.

A. Manufacturing method of functional element The manufacturing method of the functional element of the present invention includes a base layer preparation step of preparing a base layer containing a main material and a fluorine-based material having acrylic as a main skeleton, and depositing particles having energy And a functional layer forming step of forming a functional layer on the base layer by the film forming method.

A method for producing a functional element of the present invention will be described with reference to the drawings.
1A and 1B are process diagrams showing an example of a method for producing a functional element of the present invention. As shown to Fig.1 (a), the manufacturing method of the functional element of this invention prepares the base layer 3 containing the main material and the fluorine-type material which has an acrylic main skeleton (base layer preparation process). The underlayer 3 may be formed on the base material 2. In the underlayer preparation step, the underlayer 3 in which the fluorine-based material is unevenly distributed on at least one surface side of the underlayer can be prepared. FIG. 1A shows an example in which the base layer 3 has an unevenly distributed portion A of the fluorine-based material on the surface side opposite to the substrate 2 side. Next, as shown in FIG. 1B, the functional layer 4 is formed on the base layer 3 by a film forming method for depositing particles having energy (functional layer forming step). In the present invention, since the unevenly distributed portion A of the fluorine-based material can be used instead of the protective layer, the damage to the main material existing inside the underlayer 3 is suppressed more than the unevenly distributed portion A of the fluorine-based material. Can do. As described above, a functional element can be manufactured.

  According to the present invention, it is possible to prepare an underlayer in which the fluorine-based material is unevenly distributed on at least one surface of the underlayer by including the underlayer preparation step. Therefore, in the functional layer forming step, the unevenly distributed portion of the fluorine-based material functions as a protective layer, and damage to the main material existing on the inner side of the unevenly distributed portion of the fluorine-based material can be suppressed. Further, according to the present invention, it is not necessary to separately form a protective layer on the base layer, and a conventional film forming method can be applied. Therefore, the method for producing a functional element of the present invention can suppress damage to the underlying layer by a simple method when using a film forming method for depositing particles having energy.

Here, the damage of the underlayer generally caused by a film forming method for depositing particles having energy includes the following.
First, it is mentioned that the material which comprises an underlayer deteriorates when the particle | grains which have energy collide with the underlayer surface.
Another example is that the flatness of the surface of the underlayer is lowered by the collision of particles having energy with the surface of the underlayer. The functional layer easily enters the thickness direction of the underlayer.
In addition, when the functional layer is etched after the functional layer is formed on the base layer due to a decrease in the flatness of the base layer, an etching solution or the like can easily enter the base layer. There is a problem that some are etched together with the functional layer.

On the other hand, in the present invention, since the underlayer has an unevenly distributed portion of the fluorine-based material, the deterioration of the main material is suppressed by sacrificing the unevenly distributed portion with respect to collision of energetic particles. can do.
In addition, since the underlayer has an unevenly distributed portion of the fluorine-based material, the strength of the underlayer surface can be increased, and the resistance to collision of particles having energy can be increased. Can be suppressed.
Moreover, by having the uneven distribution portion of the fluorine-based material, it is possible to suppress the functional layer from entering the main material portion existing inside the uneven distribution portion of the fluorine-based material. Therefore, it is possible to suppress the intrusion of the etching solution or the like into the base layer, and it is possible to suppress problems such as the base layer peeling off when the functional layer is etched.

  Hereafter, each process of the manufacturing method of the functional element of this invention is demonstrated.

1. Underlayer preparation step The underlayer preparation step in the present invention is a step of preparing an underlayer including a main material and a fluorine-based material having an acrylic main skeleton.

(A) Fluorine-based material The fluorine-based material is largely distributed on the surface side of the underlayer in the underlayer obtained by this step. Moreover, in the functional layer forming process described later, the main material of the underlayer is protected from energetic particles.

  The fluorine-based material is not particularly limited as long as it can be distributed in a large amount on the surface side of the underlayer, and examples thereof include a compound represented by the following formula (1).

(In the above formula (1), R ₁ and R ₂ is a functional group having a hydrocarbon group, a hydrocarbon group which fluorine atoms are introduced, any functional group having a silicon backbone, the R ₁ and R ₂ (At least one is a hydrocarbon group into which a fluorine atom is introduced, and n is an integer of 50 to 3000.)

R ₁ in the above formula (1) is a functional group having any one of a hydrocarbon group, a hydrocarbon group into which a fluorine atom is introduced, and a functional group having a silicon skeleton. In the present invention, among these, R ₁ is preferably a hydrocarbon group having a fluorine atom introduced. More specifically, examples of R ₁ include —CF ₃ , —CF ₂ CF ₂ CH _{3, and the} like.

R ₂ in the above formula (1) is a functional group having any one of a hydrocarbon group, a hydrocarbon group into which a fluorine atom is introduced, and a functional group having a silicon skeleton. In the present invention, among them, R ₂ is preferably a functional group having a silicon skeleton. This is because the strength of the uneven distribution of the fluorine-based material can be further increased and the resistance to particles having energy can be further increased. Examples of R ₂ include —Si (CH ₃ ) ₂ —O—CH ₃ .

In the above formula (1), at least one of R ₁ and R ₂ is a hydrocarbon group having a fluorine atom introduced.

  Moreover, n in the said Formula (1) is an integer of 50-3000. In this invention, it is more preferable that n is an integer of 70-1500, and it is more preferable that it is an integer of 100-500.

The weight average molecular weight of the fluorine-based material is not particularly limited as long as the strength of the surface of the underlayer can be improved, but it is preferably 10,000 or more, and particularly within the range of 14,000 to 200,000, particularly 20,000 to 100,000. It is preferable to be within the range. If the weight-average molecular weight of the fluorine-based material is too small, it is difficult to have sufficient resistance to particle damage against the uneven distribution of the fluorine-based material in the underlayer even when the fluorine-based material is added. This is because there is a possibility of becoming. Moreover, it is because it may become difficult to mix with a main material when the weight average molecular weight of a fluorine-type material is too large.
Here, the weight average molecular weight refers to a polystyrene equivalent value measured by gel permeation chromatography under the following conditions.
A gel permeation chromatography device (device name: Shodex (registered trademark) GPC system-11) was used. It can be determined by measuring using a column (column type: KF-806L, number: 3), tetrahydrofuran (THF) as a solvent, and a flow rate of 1.0 ml / min at room temperature.

The acrylic equivalent of the fluorine-based material is not particularly limited, but is preferably in the range of 50 to 6000, more preferably in the range of 70 to 3000, and particularly preferably in the range of 100 to 1000.
Here, acrylic equivalent shows the value which remove | divided the weight average molecular weight of the fluorine-type material by the number of (meth) acryl groups in 1 molecule.

The surface tension of the fluorine-based material is preferably lower than the surface tension of the main material. This is because more fluorine-based material can be distributed on the surface of the underlayer.
As the surface tension of the fluorine-based material, at 25 ° C., the difference from the surface tension of the main material is 3 mN / m or more, particularly in the range of 5 mN / m to 30 mN / m, particularly in the range of 10 mN / m to 20 mN / m. It is preferable to be within. This is because if the difference between the surface tension of the fluorine-based material and the surface tension of the main material is too small, the fluorine-based material may not be unevenly distributed on at least one surface side in the underlayer. In addition, if the difference between the surface tension of the fluorinated material and the surface tension of the main material is too large, it may be difficult to uniformly mix the fluorinated material in the main material in forming the underlayer. It is.

The surface tension of the fluorine-based material is, for example, 25 mN / m or less at 25 ° C., preferably 10 mN / m to 23 mN / m, particularly 15 mN / m to 20 mN / m. This is because if the surface tension of the fluorine-based material is too large, it may be difficult to distribute a large amount of the fluorine-based material on the surface of the underlayer.
The method for measuring the surface tension is not particularly limited as long as the surface tension can be accurately measured. For example, the Wilhelmy method (plate method), the hanging drop method (pendant drop method), Young -Laplace method, du Nouy method, etc. Moreover, as a measuring method of surface tension, a high precision surface tension meter (Kyowa Interface Science DY-700) can be used.

  Specific examples of the fluorine-based material include trifluoroethyl (trimethylsiloxanyl) acrylate.

The content of the fluorine-based material with respect to the entire underlayer is not particularly limited as long as particle damage can be suppressed, but within a range of 3.5 × 10 ⁻⁴ mass% to 1.0 mass%, Especially, it is preferable to be in the range of 1.0 × 10 ⁻² mass% to 0.5 mass%, particularly in the range of 5.0 × 10 ⁻² mass% to 0.1 mass%. This is because if the content of the fluorine-based material is small, it may be difficult to suppress damage. On the other hand, if the content of the fluorine-based material is large, the function of the main material may be hindered.

(B) Main material The main material constitutes the base layer.
The main material is not particularly limited as long as the above-described fluorine-based material can be dispersed, and may be an organic material, an inorganic material, or a mixed material including an organic material and an inorganic material. Good.

Examples of the organic material used for the main material include a resin material, an organic conductive material, an organic semiconductor material, and an organic electroluminescence material.
Examples of the resin material include a curable resin material, a photosensitive resin material, and a thermoplastic resin material. As the resin material, a general resin material can be used, for example, acrylic resin, phenol resin, fluorine resin, epoxy resin, cardo resin, vinyl resin, imide resin, novolac resin, and the like. Can be mentioned.
A general thing can be used as an organic electroconductive material, For example, electroconductive polymer materials, such as PEDOT / PSS, can be mentioned.
A general thing can be used as an organic-semiconductor material, For example, the thing of Unexamined-Japanese-Patent No. 2009-076791 can be mentioned.
A general thing can be used as an organic electroluminescent material, For example, the thing of Unexamined-Japanese-Patent No. 2013-251191 can be mentioned.

Examples of the inorganic material used for the main material include inorganic material particles.
The inorganic material used for the inorganic material particles may be an inorganic conductive material or an inorganic insulating material. Specific examples of the inorganic conductive material include metals, alloys, metal oxides, and carbon materials. More specifically, silver, copper, gold, platinum, nickel, palladium, rhodium, iridium, ruthenium, osmium, iron, cobalt, tin, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, lead, etc. Or metal alloys such as ITO and IZO, carbon materials such as carbon nanotubes, fullerene, and graphite.
Moreover, a transparent conductive material can be mentioned as an inorganic conductive material. Examples of the transparent conductive material include general materials, such as the above metal oxides and carbon nanotubes. Moreover, as a transparent conductive material, the nanotube or nanowire etc. which have silver and copper as a main component can be mentioned, for example.
The inorganic insulating materials _may include _{SiO 2, SiN x, Al 2} O 3 or the like.

The average particle diameter of the inorganic material particles is not particularly limited as long as the underlying layer can be formed, but within the range of 0.01 nm to 100 nm, particularly within the range of 0.1 nm to 50 nm, particularly within the range of 1 nm to 30 nm. Preferably there is. This is because if the inorganic material particles are too small or too large, it may be difficult to form the underlayer.
Here, an average particle diameter is an average particle diameter by microscopic observation. The average particle diameter by microscopic observation is obtained, for example, by performing microscopic observation at a magnification of 100, measuring 100 particle diameters of arbitrary fine particles with image processing software or the like, and averaging the number. The particle diameter refers to the average value of the major axis diameter and minor axis diameter of the fine particles.

  Examples of the mixed material used for the main material include those containing the inorganic material particles and the resin material described above.

  In the present invention, the main material preferably contains metal particles, and more preferably contains metal particles and a resin. In general, when a material containing metal particles is used as the underlayer, there is a problem that the underlayer is easily etched when the functional layer is etched in a pattern. Further, when the underlayer further contains a resin, there is a problem that the resin is easily deteriorated when the functional layer is formed, and the underlayer is liable to be deteriorated, and there is a problem that unevenness of the underlayer surface is likely to occur. For this reason, it is possible to greatly exert the operational effect by unevenly distributing the fluorine-based material on the surface of the underlayer.

  When the main material is a mixed material, the content of the resin material with respect to the entire main material can be appropriately selected according to the application of the functional element, and is not particularly limited.

The surface tension of the main material can be appropriately selected according to the type of the main material, but usually, the difference from the surface tension of the above-described fluorine-based material is within the above-described range.
The specific surface tension of the main material is preferably 50 mN / m or less at 25 ° C., more preferably in the range of 20 mN / m to 40 mN / m, and particularly preferably in the range of 30 mN / m to 35 mN / m.

(C) Other components The underlayer in the present invention is not particularly limited as long as it contains the main material and the fluorine-based material described above, and necessary components can be appropriately selected and added. For example, examples of the additive include a polymerization initiator, a coloring material, and a dispersant.

(D) Configuration of Underlayer The underlayer includes a main material and a fluorine material, and the fluorine material is unevenly distributed on at least one surface side.
Here, “the fluorine material is unevenly distributed on one surface side of the underlayer” means that the content of the fluorine material on at least one surface side of the underlayer is that of the fluorine material on the inner side of the underlayer. More than the content.
As will be described later, when the underlayer is formed on the substrate, the fluorine-based material is usually unevenly distributed on the surface side opposite to the substrate side in the underlayer.

The distribution of the fluorine-based material in the underlayer can be evaluated using the distribution of the amount of fluorine present in the underlayer.
In the present invention, the amount of fluorine in the range of 10 nm in the thickness direction from the outermost surface of the underlayer is preferably 5 atomic% or more, and more preferably in the range of 7 atomic% to 30 atomic%, particularly 10 atomic% to 20 atomic%. It is preferable to be within the range.
In the present invention, the amount of fluorine present in the portion exceeding 0.01 μm in the thickness direction from the outermost surface of the underlayer is preferably 5 atomic% or less, and particularly within the range of 0.01 atomic% to 1 atomic%, It is preferably in the range of 0.1 atomic% to 0.5 atomic%.
The abundance of the fluorine can be measured using X-ray photoelectron spectroscopy (XPS). Specifically, it can be measured using an XPS apparatus (ESCALAB 220i-XL) manufactured by Thermo Fisher Scientific.

  As a base layer prepared by this step, the base layer itself may constitute a base material, or the base layer may be formed on the base material. In the present invention, it is particularly preferable that a base layer is formed on the substrate.

The base material on which the underlayer is formed can be appropriately selected according to the use of the functional element. For example, a rigid substrate such as a glass substrate, a film made of a plastic resin, or the like The flexible board | substrate which has (1) flexibility can be mentioned.
In addition, a barrier layer, a planarizing layer, or the like may be formed on the substrate, and an electrode or the like may be further formed.
In addition, when base layer itself comprises a base material, it becomes a base material containing at least resin.

  The thickness of the underlayer is appropriately selected according to the use of the functional element, and is not particularly limited. preferable. This is because if the thickness of the underlayer is too thin, even when a fluorine-based material is added, it may be difficult to sufficiently suppress damage to the underlayer due to energetic particles. Further, if the thickness of the underlayer is too thick, it may be difficult to achieve high definition and high integration of the functional element.

(E) Formation method of foundation layer The formation method of the foundation layer can be appropriately selected according to the application of the functional element, and is not particularly limited. For example, when the base layer constitutes the base material itself, a general injection molding method can be used.
Moreover, when a base layer is formed on a base material, a base layer may be formed in the whole surface on a base material, and may be formed in a predetermined pattern shape on a base material. Specifically, the underlayer can be formed by applying or printing an underlayer coating solution containing the main material and the fluorine-based material on the substrate.
As a method for forming the underlayer, for example, a spin coating method, a die coating method, a roll coating method, a bar coating method, an LB method, a dip coating method, a spray coating method, a blade coating method, a casting method and the like, an inkjet method, and the like Method, screen printing method, gravure printing method, flexographic printing method and the like.

  The base layer coating solution may contain a solvent as necessary. Examples of the solvent include general solvents such as propylene glycol monomethyl ether acetate (PEGMEA), isopropyl alcohol (IPA), methyl ethyl ketone (MEK), ethanol, and methanol.

  In this invention, you may perform the acceleration | stimulation process which promotes distribution to the surface of a fluorine-type material as needed after application | coating of base material. Examples of the acceleration treatment include a treatment for heating the coating film and a treatment for irradiating ultrasonic waves.

2. Functional layer forming step The functional layer forming step in the present invention is a step of forming a functional layer on the underlying layer by a film forming method for depositing particles having energy.

  Here, the “film formation method for depositing particles having energy” refers to a method for forming a layer having a desired thickness by colliding and depositing particles having energy on an underlayer.

Further, the energy of the particles is not particularly limited as long as the functional layer can be formed, but the energy of at least some of the colliding particles is preferably 6 eV or more, for example, 6 eV to It is preferable to be in the range of 100 eV, particularly in the range of 10 eV to 50 eV.
About the energy of particle | grains, it can adjust suitably according to the kind of particle | grain, a film-forming apparatus, etc.

  Specific examples of the film formation method for depositing particles having energy include a vacuum evaporation method and a film formation method using plasma. Examples of the film forming method using plasma include a sputtering method, various ion plating methods, a metal organic chemical vapor deposition method (MOCVD method), a cluster ion beam method, and the like. preferable.

The sputtering method used in this step can be the same as the method used for forming a general electrode. For example, the DC sputtering method, the bipolar sputtering method, the magnetron sputtering method, the ECR sputtering method, and the high frequency sputtering method. Various sputtering methods such as these can be used.
The DC sputtering method is a sputtering method using a metal material as a target and argon (Ar) gas as a sputtering gas.

  In this step, the functional layer may be formed on the entire surface of the base layer, or may be formed in a predetermined pattern. Examples of the method for forming the functional layer in a predetermined pattern on the lower layer include a method of forming a film using a mask such as a metal mask.

  The material of the functional layer is not particularly limited as long as it can be used in the method for depositing and forming particles having the energy described above, and can be appropriately selected according to the use of the functional element. Examples of the material for the functional layer include metals, alloys, metal oxides, and inorganic insulating materials. In addition, about a metal, an alloy, a metal oxide, and an inorganic insulating material, it can select and use from what was demonstrated by the term of the base layer mentioned above.

  The thickness of the functional layer can be appropriately selected according to the use of the functional element and is not particularly limited, but is within the range of 5 nm to 1000 nm, particularly within the range of 10 nm to 500 nm, and particularly within the range of 30 nm to 100 nm. It is preferable. This is because if the thickness of the functional layer is too thin, it may be difficult to form a functional layer having a desired function on the base layer. Further, if the functional layer is too thick, it may take time to form the functional layer.

3. Other Steps The method for producing a functional element of the present invention is not particularly limited as long as it has an underlayer preparation step and a functional layer formation step, and necessary steps can be appropriately selected and added.

In the present invention, for example, a step of etching the functional layer into a predetermined pattern may be included. Specifically, as shown in FIG. 2A, after forming a resist layer 5 in a predetermined pattern on the functional layer 4, the exposed portion of the functional layer 4 is etched. Thereafter, as shown in FIG. 2B, the functional layer 4 may be patterned by peeling the resist layer.
2A and 2B are process diagrams showing another example of the method for producing a functional element of the present invention.

The resist layer can be the same as the resist layer used in a general photolithography method.
The etching method may be a general etching method, and may be dry etching or wet etching.

4). Applications Examples of the use of the functional element manufacturing method of the present invention include formation of electrodes, semiconductor layers, gate insulating layers and interlayer insulating layers in semiconductor elements such as transistors and diodes, formation of pixel electrodes on TFT substrates, and solar cells. Back electrode formation in organic EL elements, back electrode formation in organic EL elements, formation of non-volatile memory electrodes and polymer layers, formation of pressure sensor electrodes and polymer layers, formation of wiring on wiring boards, colored layers and light shielding in color filters Part formation, biochip production, and the like. In particular, the method for producing a functional element of the present invention can be suitably used for producing an electronic device that requires a fine pattern.

B. Functional element member The functional element member of the present invention is used in a method for producing a functional element having a step of forming a functional layer on an underlayer using a film forming method for depositing particles having energy. And having the base layer containing a main material and a fluorine-based material having acrylic as a main skeleton, wherein the fluorine-based material is unevenly distributed on at least one surface side of the base layer. To do.

The functional element member of the present invention will be described with reference to the drawings.
FIG. 3 is a schematic cross-sectional view showing an example of the functional element member of the present invention. As shown in FIG. 3, the functional element member 10 of the present invention has a base layer 3 including a main material and a fluorine-based material having an acrylic main skeleton, and at least one surface of the base layer 3. The fluorinated material is unevenly distributed on the side. FIG. 3 shows an example in which the base layer 3 is formed on the base material 2, and an example in which the uneven distribution portion A of the fluorine-based material is provided on the surface side opposite to the base material 2 side of the base layer 3. Shows about.

  According to the present invention, when the fluorine-based material is unevenly distributed on at least one surface of the underlayer, the functional layer is formed on the underlayer by the film-forming method for depositing particles having energy. The unevenly distributed portion of the system material functions as a protective layer, and damage to the main material existing on the inner side of the unevenly distributed portion of the fluorine-based material can be suppressed. Further, according to the present invention, it is not necessary to separately form a protective layer on the base layer, and a conventional film forming method can be applied. Therefore, the member for a functional element of the present invention can suppress damage to the base layer by a simple method when using a film forming method for depositing energetic particles.

  The form, material, formation method, and the like of the underlayer in the present invention can be the same as the contents described in the above-mentioned section “A. Functional element manufacturing method”, and thus the description thereof is omitted here. .

  In this invention, it is more preferable that the member for functional elements has a base material and the said base layer formed on the said base material, and the said main material contains a metal particle. In addition, about the base material, since it can be made to be the same as that of the content demonstrated by the above-mentioned item of "A. Functional element manufacturing method", description here is abbreviate | omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Example]
A functional ink having the following composition was prepared.
<Composition of functional ink>
Silver nanowire: 1 part by mass Trifluoroethyl (trimethylsiloxanyl) acrylate: 0.05 part by mass 1-butanol: 30 parts by mass Cyclohexanone: 30 parts by mass Isopropyl alcohol: 38.95 parts by mass

  A polycarbonate film having a thickness of 100 μm was prepared as a substrate. The above functional ink was applied on the substrate with a wet film thickness of 8 μm and dried to form an underlayer.

[Comparative example]
A base layer was formed on the substrate in the same manner as in the Examples except that the following functional ink was used.
<Composition of functional ink>
Silver nanowires: 1 part by mass 1-butanol: 30 parts by mass Cyclohexanone: 30 parts by mass Isopropyl alcohol: 39 parts by mass

[Evaluation]
For the underlayers of Examples and Comparative Examples, damage by sputtering was evaluated by the following method.
The surface of the underlayer of the example and the comparative example was subjected to reverse sputtering treatment with the output shown in Table 1, and the abundance of atoms contained in the underlayer before and after the treatment was evaluated by the XPS method. ESCALAB 220i-XL (Thermo Fisher Scientific XPS device) was used as the device used, and Monochromated Al Kα (single-wired X-ray, hν = 1486.6 eV) was used as the incident X-ray. The X-ray output was 10 kV · 16 mA (160 W), and the measurement area was 700 μmφ. Moreover, the measurement was performed for the case where the sputtering output was 50 W and for the case where it was 300 W.
Table 1 shows the abundance of each atom in the range of 10 nm in the thickness direction from the outermost surface of the underlayer.

In the examples, after the reverse sputtering treatment, the amount of F atoms and Si atoms present on the surface of the underlayer decreased, and the amount of Ag atoms increased instead. This tendency was more remarkable when the sputter output (the speed of particles hitting the sample) was increased. On the other hand, in the comparative example, the amount of Ag atoms present on the surface of the underlayer decreased after the reverse sputtering treatment.
From this result, it can be determined in the examples that F atoms and Si atoms on the surface of the underlayer were removed by reverse sputtering, and Ag atoms that were present inside appeared, and in the comparative example, It can be determined that the Ag atoms present on the surface have been removed. Moreover, it was confirmed that by adding a specific fluorine-based material as the material for the underlayer, damage to the main material of the underlayer due to the sputtering treatment can be suppressed.

DESCRIPTION OF SYMBOLS 1 ... Functional element 2 ... Base material 3 ... Underlayer 4 ... Functional layer 10 ... Member for functional elements A ... Uneven distribution part of fluorine-type material

Claims (5)

A base layer preparation step of preparing a base layer including a main material and a fluorine-based material having acrylic as a main skeleton;
A functional layer forming step of forming a functional layer on the underlayer by a film forming method for depositing particles having energy; and
The manufacturing method of the functional element characterized by having.   The method for manufacturing a functional element according to claim 1, wherein the main material includes metal particles.   The method for producing a functional element according to claim 1, wherein the fluorine-based material further has a functional group having a silicon skeleton. A functional element member used in a method for manufacturing a functional element, which includes a step of forming a functional layer on an underlayer using a film forming method for depositing particles having energy,
The base layer includes a main material and a fluorine-based material having acrylic as a main skeleton,
The member for functional elements, wherein the fluorine-based material is unevenly distributed on at least one surface side of the base layer. The functional element member has a base material and the base layer formed on the base material,
The functional element member according to claim 4, wherein the main material includes metal particles.

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