JP2016068138A - Laser cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser cutting apparatus capable of efficiently cutting an object arranged in water.SOLUTION: A laser cutting apparatus cuts an object, which has a first member and a second member laminated and which is arranged in water, with a laser. The laser cutting apparatus comprises: a head or a hollow conduit to be arranged to face said first member and formed at the leading end with an opening in the axial direction of the conduit; a gas supply device for feeding a gas to the hollow conduit of the head for injecting the gas from an opening; a laser irradiation device for guiding a laser in the hollow conduit of the head to irradiate the laser from the opening; and a mobile device for moving in the opening of the head.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser cutting device that cuts a structure that is disposed in water and in which two or more members are stacked at intervals.

  As a cutting method for cutting a target object, there is a laser cutting method for cutting a target object by irradiating the target object with a laser as described in Patent Document 1. In addition, as a cutting method, there are a method of cutting by bringing a processing tool into contact with a target object and a water jet cutting method of cutting by jetting high-pressure water onto the target object.

  The target object may be required to cut not only a member disposed in the air, but also a structure disposed in water and having two or more members stacked at intervals. For example, Patent Document 2 describes a method of cutting a double pipe disposed in water with a water jet.

JP 2013-226590 A Japanese Patent No. 518742

  Here, when a target object in water is cut using a laser as described in Patent Document 1, the output of the laser irradiated on the target is reduced by the water present in the laser path. End up. On the other hand, it is possible to suppress a decrease in the output of the laser due to water by blowing gas to the position where the laser is irradiated and bringing the position where the laser is irradiated close to the gas atmosphere.

  However, as described in Patent Document 2, when a double tube is cut, the gap between the first tube on the laser irradiation side and the second tube in the back of the first tube is It will be in a state full of water. Therefore, the laser output may be attenuated before the laser reaches the second tube. In this case, it is necessary to increase the output of the laser, and it becomes difficult to cut efficiently. Moreover, even if it is structures other than a double tube, the same problem arises in the structure arrange | positioned in water and the two or more members laminated | stacked by providing the space | interval.

  This invention solves the subject mentioned above, and it aims at providing the laser cutting device which can cut | disconnect the target object arrange | positioned in water efficiently.

  In order to achieve the above object, the present invention provides a laser cutting device in which a first member and a second member are laminated and cuts an object placed in water with a laser, facing the first member. A head having an opening formed at the tip in the axial direction of the pipe, and a gas supply device for supplying gas to the hollow pipe of the head and injecting the gas from the opening And a laser irradiation device for guiding the inside of a hollow pipe line of the head and irradiating a laser from the opening, and a moving device for moving the opening of the head.

  Further, the laser irradiation device has a condensing optical system arranged upstream from a position where gas is supplied from the gas supply device to the pipeline, and the condensed laser passes through the pipeline. It is preferable.

  Further, the laser irradiation device is capable of circulating the gas to the parallel optical system disposed upstream from the position where the gas is supplied from the gas supply device to the pipeline, and to the opening side of the pipeline. It is preferable that a parallel light laser passes through the pipe.

  The condensing optical system is preferably a parabolic mirror.

  The condensing optical system preferably includes a lens.

  Moreover, it is preferable that the said laser irradiation apparatus has an optical fiber arrange | positioned in the state which can distribute | circulate the said gas to the said pipe line, and a laser passes the said optical fiber in the said pipe line.

  Moreover, it is preferable that the said laser irradiation apparatus has a reflective optical system which refracts the condensed laser with respect to the axial direction of the said pipe line.

  Moreover, it is preferable that a part of the opening side of the head is inclined with respect to an axis of another part.

  Moreover, it is preferable that the said moving apparatus rotates a part by the side of the said opening with respect to another part.

  Moreover, it is preferable to have an upper closing mechanism that closes the upper side in the vertical direction with respect to the position between the first member and the second member of the object cut by the laser.

  In the object, it is preferable that the first member has a cylindrical shape, and the upper closing mechanism further closes the space between the first member and the head.

  Moreover, it is preferable to have a lower closing mechanism that closes the lower side in the vertical direction with respect to the position cut by the laser between the first member and the second member of the object.

  In the object, it is preferable that the first member has a cylindrical shape, and the lower closing mechanism further closes a space inside the first member.

  Moreover, it is preferable to further have an assist gas supply device that supplies gas between the first member and the second member.

  The object is an outer peripheral tube in which the first member is an inner peripheral tube, the second member is disposed on an outer periphery of the first member, and the head is disposed on the inner side of the inner peripheral tube. The moving device preferably rotates the head.

  In addition, it is preferable to have a surrounding closing mechanism that closes the periphery of the opening between the first member and the head.

  Moreover, it is preferable that the said opening is a shape which injects the said gas with the width | variety more than the kerf width formed in the said 1st member with the said laser in the moving direction of the said opening.

  In the moving direction of the opening, it is preferable to include a closing material supply device that supplies the closing material to the cutting position of the first member, which is behind the irradiation position of the laser.

  Further, it is preferable that a flexible shielding member that is fixed to the outer periphery of the head and is inserted into the cutting position of the first member on the rear side of the laser irradiation position in the moving direction of the opening is provided. .

  In the moving direction of the opening, it is preferable to have a water injection device that jets water toward the cutting position of the first member on the rear side of the irradiation position of the laser.

  ADVANTAGE OF THE INVENTION According to this invention, the target object arrange | positioned in water can be cut | disconnected efficiently.

FIG. 1 is a schematic configuration diagram illustrating a laser cutting apparatus according to the present embodiment. FIG. 2 is a schematic configuration diagram of the laser cutting device shown in FIG. 1 viewed from another direction. FIG. 3 is a schematic configuration diagram showing the internal structure of the head. FIG. 4 is a schematic configuration diagram illustrating another example of a laser irradiation apparatus. FIG. 5 is a schematic configuration diagram illustrating another example of a laser irradiation apparatus. FIG. 6 is a flowchart for explaining an example of the operation of the laser cutting device. FIG. 7 is a flowchart for explaining an example of the operation of the laser cutting device. FIG. 8 is a flowchart for explaining an example of the operation of the laser cutting device. FIG. 9 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 10 is a schematic diagram showing the relationship between the rotation axis of the laser cutting device shown in FIG. 9 and the position of the laser. FIG. 11 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 12 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 13 is a flowchart for explaining an example of the operation of the laser cutting device. FIG. 14 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 15 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 16 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 17 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 18 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 19 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 20 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 21 is a schematic configuration diagram illustrating a laser cutting device according to another embodiment. FIG. 22 is a schematic configuration diagram of the laser cutting device shown in FIG. 21 viewed from another direction.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by this embodiment, and when there are two or more embodiments, what comprises combining each embodiment is also included.

  FIG. 1 is a schematic configuration diagram illustrating a laser cutting apparatus according to the present embodiment. FIG. 2 is a schematic configuration diagram of the laser cutting device shown in FIG. 1 viewed from another direction. FIG. 3 is a schematic configuration diagram showing the internal structure of the head.

  A laser cutting device 20 shown in FIGS. 1 to 3 cuts an object (double tube) 10. The object 10 is a double pipe that is disposed in water and in which an inner peripheral pipe (first member) 12 and an outer peripheral pipe (second member) 14 are laminated. The inner peripheral tube 12 is a cylindrical member. The outer peripheral tube 14 is a cylindrical member disposed so as to cover the outer peripheral surface of the inner peripheral tube 12. Further, there is a gap between the inner peripheral pipe 12 and the outer peripheral pipe 14, and the gap is also filled with water.

  As shown in FIGS. 1 to 3, the laser cutting device 20 includes a laser irradiation device 22, a gas supply device 24, a head 25, a moving device 26, a control device 27, and a support device 28. First, the head 25 will be described. The head 25 is moved at the installation position by the moving device 26 and is disposed at a position facing the inner peripheral tube 12 of the object 10 when the object 10 is cut. The head 25 is a tubular member having a hollow inside, and an opening 38 is formed at the tip (end on the lower side in the vertical direction). The opening 38 is formed on the side surface of the hollow pipe line. In the head 25, the laser L output from the laser irradiation device 22 passes through the inside, and the passed laser is irradiated from the opening 38 toward the inner peripheral tube 12. Further, in the head 25, the gas G supplied from the gas supply device 24 passes through the pipeline, and the gas G that has passed through the head 25 is jetted from the opening 38 toward the inner peripheral pipe 12.

  Next, the moving device 26 supports the head 25 and moves the head 25 relative to the object 10. The moving device 26 includes a three-dimensional movement mechanism 26 a that moves the head 25 in a three-dimensional direction with respect to the object 10, and a rotational movement mechanism 26 b that rotates a portion including the tip of the head 25 with respect to the object 10. Have. The three-dimensional moving mechanism 26a is a mechanism that combines, for example, an arm and a lifting device, and moves the head 25 in the horizontal direction and the vertical direction. The rotational movement mechanism 26 b is provided in a part of the head 25. The rotational movement mechanism 26 b includes a fixed unit 90 and a rotating unit 92. The fixing unit 90 supports the base side of the head 25 (the side fixed to the three-dimensional movement mechanism 26a). The rotating unit 92 supports the tip side of the head 25 (the side that is not fixed to the three-dimensional movement mechanism 26a and the side where the opening 38 is formed). The rotational movement mechanism 26 b rotates the opening 38 around the central axis of the pipe line of the head 25 by moving the distal end side of the head 25 in the movement direction 29 with respect to the base side of the head 25. The position on the duct of the head 25 where the rotational movement mechanism 26b is provided is not particularly limited, and may be provided on the side close to the three-dimensional movement mechanism 26a.

  The laser irradiation device 22 includes a laser light source 80, a parallel optical system 82, and a parabolic mirror (condensing optical system) 84. The laser light source 80 is a light emission source that outputs a laser. The laser light source 80 makes a laser incident on the head 25. The laser irradiation device 22 makes the laser output from the laser light source 80 enter the head 25 using an optical system such as a lens and a mirror, or an optical fiber. The laser irradiation device 22 may be configured such that the laser light source 80 is installed on the end surface of the head 25 and the laser light source 80 and the head 25 are moved together, and the laser is directly incident on the head 25 from the laser light source 80.

  The parallel optical system 82 is disposed inside the head 25. The parallel optical system 82 is disposed in the vicinity of the end of the head 25 opposite to the opening 38. The parallel optical system 82 guides the laser L output from the laser light source 80 toward the parabolic mirror 84 as parallel light.

  The parabolic mirror 84 is disposed at the tip end side of the head 25, that is, at a portion rotated by the rotational movement mechanism 26b. The parabolic mirror 84 condenses while reflecting the laser incident as parallel light. The parabolic mirror 84 reflects the laser traveling along the pipe line of the head 25 toward the opening 38.

  The laser irradiation device 22 makes the laser irradiated from the laser light source 80 parallel by the parallel optical system 82 and guides the inside of the pipe of the head 25 along the axial direction of the pipe, and then opens the opening 38 by the parabolic mirror 84. The light is condensed while reflecting in the passing direction. The laser irradiation device 22 irradiates the laser L along the direction in which the opening 38 is formed. In the laser irradiation device 22, the head 25 is moved by the moving device 26, the opening 38 stops at a position facing the cutting position of the object 10, and the opening 38 and the parabolic mirror 84 are moved by the moving mechanism 26 while irradiating the laser L. Is rotated once (or a plurality of times) to cut the inner peripheral pipe 12 and the outer peripheral pipe 14.

  Further, the laser irradiation device 22 of the present embodiment serves as both a processing device and a cutting device, and has locking holes (gripping portions) 34 and 35 at upper ends of the outer peripheral tube 14 and the inner peripheral tube 12 as objects. And the predetermined positions of the outer peripheral tube 14 and the inner peripheral tube 12 are cut. The gripping portions 34 and 35 are not necessarily formed by the laser irradiation device 22.

  Here, the laser irradiation device 22 shown in FIG. 3 condenses the laser beam, which has been converted into parallel light by the parallel optical system 82 disposed on the entrance side of the head 25, while changing the direction with the parabolic mirror 84. Although the condensed laser was irradiated, it is not limited to this. For example, instead of the parabolic mirror 84, a condensing optical system and a reflecting mirror may be arranged.

  FIG. 4 is a schematic configuration diagram illustrating another example of a laser irradiation apparatus. The laser irradiation device 22a shown in FIG. 4 includes a laser light source 80 (not shown), a condensing optical system 85, and a reflection mirror 86. The laser light source 80 is a light emission source that outputs a laser. The laser light source 80 makes a laser incident on the head 25.

  The condensing optical system 85 is disposed inside the head 25. The condensing optical system 85 is disposed in the vicinity of the end of the head 25 opposite to the opening 38. The condensing optical system 84 guides the laser L output from the laser light source 80 toward the reflecting mirror 86 as condensed light. The condensing optical system 85 is a condensing optical system having a long focal point (having a long focal length) in which the focal point is positioned ahead of the reflecting mirror 86.

  The reflection mirror 86 is disposed at the tip end side of the head 25, that is, at a portion rotated by the rotational movement mechanism 26b. The reflection mirror 86 reflects the incident laser beam. The reflection mirror 86 reflects the laser traveling along the pipe line of the head 25 toward the opening 38.

  The laser cutting device 20 may be configured such that the focused laser beam, like the laser irradiation device 22 a, travels through the duct of the head 25 and is reflected toward the opening 38 by the reflection mirror 86.

  FIG. 5 is a schematic configuration diagram illustrating another example of a laser irradiation apparatus. The laser irradiation device 22b shown in FIG. 5 includes a laser light source 80 (not shown), an optical fiber 87, a condensing optical system 88, and a reflection mirror 89. The laser light source 80 is a light emission source that outputs a laser. The laser light source 80 makes a laser incident on the head 25. The optical fiber 87 guides the laser L incident on the head 25 toward the tip of the head 25. The optical fiber 87 is disposed up to a position facing the rotational movement mechanism 26b. The optical fiber 87 may be connected to the laser light source 80 and connected from the outside of the head 25. The optical fiber 87 is a linear member having a smaller diameter than the pipe line of the head 25. Thereby, the head 25 has a space in which the gas G flows between the optical fiber 87 and the pipe.

  The condensing optical system 88 is disposed on the tip side of the head 25, that is, on a portion rotated by the rotational movement mechanism 26b. The condensing optical system 88 guides the laser L output from the end face of the optical fiber 87 toward the reflection mirror 89 as condensed light. The condensing optical system 88 is a condensing optical system in which the focal point is positioned ahead of the reflecting mirror 89.

  The reflection mirror 89 is disposed at the tip end side of the head 25, that is, at a portion rotated by the rotational movement mechanism 26b. The reflection mirror 89 reflects the incident laser beam. The reflection mirror 89 reflects the laser traveling along the pipe line of the head 25 toward the opening 38.

  The laser cutting device 20 may be configured such that the optical fiber 87 is arranged inside the pipe line of the head 25 and the laser L moves inside the optical fiber 87 like the laser irradiation device 22b.

  Next, the gas supply device 24 includes a gas supply source 70 and a gas supply pipe 72. The gas supply source 70 includes a compression pump that sends gas. The gas supply source 70 is connected to the head 25 via a gas supply pipe 72. The gas supply pipe 72 is connected to the distal end side of the position where the parallel optical system 82 of the head 25 is disposed. The gas supply device 24 supplies the gas G sent from the gas supply source 70 to the head 25 via the gas supply pipe 72. The gas G supplied to the head 25 flows through a pipe line in the head 25 from the base portion toward the tip, and is ejected from the opening 38. Thus, the gas supply device 24 injects the gas G toward the inner peripheral pipe 12 at the facing position by flowing the gas G through the pipe line of the head 25 and injecting the gas G from the opening 38. The gas supply device 24 injects the gas G from the opening 38 together with the laser L, thereby irradiating the laser L of the inner peripheral tube 12 and the position serving as the path of the laser L from the laser irradiation device 22 to the object 10. Gas G is injected toward Here, the gas G is a substance that does not attenuate the output of the laser L more than water. As the gas G, air, argon gas, nitrogen gas, or the like can be used.

  The control device 27 controls operations of the laser irradiation device 22, the gas supply device 24, and the moving device 26.

  The support device 28 includes a first gripping device 41 for the outer peripheral tube 14 and a second gripping device 42 for the inner peripheral tube 12. The first gripping device 41 is disposed outside the outer peripheral tube 14, and the second gripping device 42 is disposed inside the inner peripheral tube 12. Therefore, the first gripping device 41 is accessed from the outside of the outer peripheral tube 14, and the second gripping device 42 is accessed from the inside of the inner peripheral tube 12. In the support device 28, the second gripping device 42 is disposed inside the first gripping device 41, and the first gripping device 41 and the second gripping device 42 are disposed to face each other in the radial direction, and have substantially the same configuration. It has become.

  The first gripping device 41 has a plurality of (preferably three or more, and the same position as the locking holes 34) gripping heads 51 arranged at equal intervals in the circumferential direction of the outer peripheral tube 14. Each gripping head 51 can move to the outer peripheral side at the upper end portion of the outer peripheral tube 14. Further, the first gripping device 41 has a locking member 52 that can move from each gripping head 51 toward the locking hole 34 of the outer peripheral tube 14. The second gripping device 42 has a plurality of (preferably three or more, the same position as the locking holes 35) gripping heads 61 arranged at equal intervals in the circumferential direction of the inner peripheral tube 12. The second gripping device 42 has a locking member 62 that can move from each gripping head 61 toward the locking hole 35 of the inner peripheral tube 12.

  The laser cutting device 20 injects the gas G toward the object 10 by supplying the gas G from the gas supply device 24 to the head 25 and injecting the gas G from the opening 38 via the head 25. Further, the laser cutting device 20 irradiates the head 25 with the laser L from the laser irradiation device 22, passes the head 25, and irradiates the laser beam L toward the object 10 from the opening 38. Thereby, the gas G is supplied to the path of the laser L, and the attenuation of the laser L is suppressed as compared with the state where the gas G is not supplied. As a result, the laser beam L can be applied to the object 10 with a stronger output. Further, the laser cutting device 20 injects a gas from the opening 38 toward the object 10 and irradiates the laser from the laser irradiation device 22 toward the object 10, and the moving device 26 opens and releases the opening 38. By moving the object mirror 84 (mechanism for moving the laser irradiation direction) in the moving direction 29, the inner tube 12 is formed with a through portion 100 along the moving direction 29, that is, along the rotation. The cutting portion 102 along the moving direction 29 can be formed. The penetration part 100 and the cutting part 102 are parts cut by a laser.

  FIG. 6 is a flowchart for explaining an example of the operation of the laser cutting device. Next, an example of the operation of the laser cutting device will be described with reference to FIG. In FIG. 6, the case where the laser cutting device 20 cuts the object 10 will be described.

  The laser cutting device 20 installs the laser irradiation device 22 and the gas supply device 24 at a position facing the object (step S12). That is, the laser irradiation device 22 and the gas supply device 24 are installed at a position facing the underwater inner peripheral pipe 12. The laser irradiation device 22 and the gas supply device 24 may be installed by moving the entire laser cutting device 20, or the laser irradiation device 22 and the gas supply device 24 arranged may be moved by the moving device 26. Also good.

  After installing the laser irradiation device 22 and the gas supply device 24, the laser cutting device 20 determines the processing conditions (step S14). The processing conditions are the output and angle of the laser irradiated from the laser irradiation device 22, the flow velocity, the flow rate and the angle of the gas injected from the gas supply device 24, and the relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10. Speed, laser movement speed, gas injection position movement speed, and the like.

  After determining the processing conditions, the laser cutting device 20 starts relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10 (step S16). That is, the laser irradiation device 22 and the gas supply device 24 are moved by the moving device 26 and relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10 is started.

  When the laser cutting device 20 starts relative movement, the laser cutting device 20 irradiates the laser while injecting gas toward the inner peripheral tube 12 of the object 10, thereby forming the penetration portion 100 in the inner peripheral tube 12 and The tube 14 is cut (step S18). The laser cutting device 20 performs laser irradiation and gas injection while performing relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10, and the through portion 100 and the outer periphery of the inner peripheral tube 12 on the line. By forming the cutting part 102 of the pipe 14, the inner peripheral pipe 12 and the outer peripheral pipe 14 can be cut by the penetrating part 100 and the cutting part 102.

  As described above, the laser cutting device 20 causes the laser L and the gas G to pass through the pipe line of the head 25, and is ejected and irradiated from the opening 38, so that the gas G is ejected to the region irradiated with the laser L. be able to. Thereby, attenuation | damping of the output of the laser L can be suppressed and the target object 10 can be cut | disconnected suitably. Moreover, the laser cutting device 20 can rotate the position which injects the gas G and the position which irradiates the laser L on the same axis | shaft by allowing the laser L and the gas G to pass through the pipe line of the head 25, The pipe line inserted into the object can be made thin.

  Here, in the said embodiment, although the penetration part of the inner periphery pipe | tube and the cutting part of the outer periphery pipe | tube were performed at the same process timing, ie, the same path | pass, it is not limited to this. FIG. 7 is a flowchart for explaining an example of the operation of the laser cutting device. Next, another example of the operation of the laser cutting device will be described with reference to FIG.

  The laser cutting device 20 installs the laser irradiation device 22 and the gas supply device 24 at a position facing the object (step S30). After installing the laser irradiation device 22 and the gas supply device 24, the laser cutting device 20 determines processing conditions (step S32). In the case of the process shown in FIG. 7, at least two conditions are set as the processing conditions: a processing condition for forming the penetration portion 100 in the inner peripheral tube 12 and a processing condition for forming the cutting portion 102 in the outer peripheral tube 14.

  After determining the processing conditions, the laser cutting device 20 starts relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10 (step S34). When the laser cutting device 20 starts relative movement, the laser cutting device 20 irradiates the laser while irradiating the gas toward the inner peripheral tube 12 of the object 10, thereby forming the penetration portion 100 in the inner peripheral tube 12 (step S36). ).

  Next, after forming the penetration part 100 in the inner peripheral tube 12, the laser cutting device 20 starts relative movement between the laser irradiation device 22, the gas supply device 24, and the object 10 (step S38). Here, the laser cutting device 20 moves the laser irradiation device 22 and the gas supply device 24 to a position where the laser L and the gas G can be ejected with respect to the position where the penetration part 100 of the object 10 is formed. When the laser cutting device 20 starts relative movement, the laser cutting device 20 irradiates the laser L while injecting the gas G toward the outer peripheral tube 14 after passing through the penetration part 100 of the inner peripheral tube 12 of the object 10. Then, the cutting portion 102 is formed in the outer peripheral tube 14, and the outer peripheral tube 14 is cut (step S40).

  As shown in FIG. 7, the laser cutting apparatus may perform the process of forming the penetration part 100 in the inner peripheral tube 12 and the process of forming the cutting part 102 in the outer peripheral tube 14 in different steps and different passes. Good. In this way, by performing separate processing, the focal position in the case of irradiating the inner tube 12 with the laser and the case of irradiating the outer tube 14 can be changed, and the inner tube 12, The outer tube 14 can be irradiated.

  FIG. 8 is a flowchart for explaining an example of the operation of the laser cutting device. Next, another example of the operation of the laser cutting device will be described with reference to FIG. The laser cutting device 20 installs the laser irradiation device 22 and the gas supply device 24 at a position facing the object (step S70). After installing the laser irradiation device 22 and the gas supply device 24, the laser cutting device 20 determines the processing conditions (step S72). The processing conditions include the output and angle of the laser irradiated from the laser irradiation device 22, the flow velocity, the flow rate, and the angle of the gas injected from the gas supply device 24. In the example shown in FIG. 8, the relative movement amount moved in steps is also included.

  After determining the processing conditions, the laser cutting device 20 moves the laser irradiation device 22, the gas supply device 24, and the object 10 relative to each other, moves them to the processing position, and then stops them (step S74).

  When the laser cutting device 20 is moved to the processing position, the laser cutting device 20 irradiates the laser while irradiating the gas toward the inner peripheral tube 12 of the object 10, thereby forming the penetration portion 100 in the inner peripheral tube 12. The outer tube 14 is cut (step S76). The laser cutting device 20 determines whether or not the cutting is finished (when a hole is made) in the inner peripheral tube 12 and the outer peripheral tube 14 at the processing position (step S78). When the laser cutting device 20 determines that the cutting is not finished (No in step S78), the laser cutting device 20 returns to step S74 and cuts the next processing position. If the laser cutting device 20 determines that the cutting is finished (Yes in step S78), the process is finished.

  As shown in FIG. 8, the laser cutting device 20 performs processing with the relative position being fixed, and then moves the processing position to perform processing at the next position, that is, performs processing by step movement. Thus, it is possible to make it difficult for the deviation between the irradiation direction of the laser L and the injection direction of the gas G to occur. Thereby, gas G can be used efficiently and the amount of gas required for processing can be reduced.

  Next, another example of the laser cutting device will be described with reference to FIGS. FIG. 9 is a schematic configuration diagram illustrating another example of a laser cutting device. FIG. 10 is a schematic diagram showing the relationship between the rotation axis of the laser cutting device shown in FIG. 9 and the position of the laser. In the laser cutting device shown in FIGS. 9 and 10, a part of the tip side of the head 25a is inclined with respect to the rotation axis 134 of the pipe line of the head 25a. Further, the laser irradiation device 22 has reflection mirrors 130 and 132 on the tip side. The reflection mirrors 130 and 132 refract the optical path (path) of the laser L in accordance with the deformation of the tip of the head 25a. The laser cutting apparatus shown in FIGS. 9 and 10 can make the path of the laser L longer by refracting the optical path of the laser L on the tip side. Thereby, the focal length of the laser L can be made longer, and the condensing angle can be made smaller. Since the condensing angle can be reduced, the distance of the portion where the output of the laser L is strong can be increased, and the inner peripheral tube 12 and the outer peripheral tube 14 can be suitably cut without adjusting the focal length.

  FIG. 11 is a schematic configuration diagram illustrating another example of a laser cutting device. 9 and 10, the shape of the head 25a is offset. However, the head 25 may have a straight tube shape, and reflection mirrors 136 and 138 may be provided to refract the optical path of the laser L.

  Here, the laser cutting device closes the inner peripheral tube 12, a closing mechanism for closing the space between the inner peripheral tube 12 and the outer peripheral tube 14, a closing mechanism for closing the space between the head 25 and the inner peripheral tube 12. Preferably at least one of the mechanisms is provided. Hereinafter, description will be made with reference to FIGS. Here, the basic configuration of the laser cutting device shown in FIG. 12 to FIG. 20 is the same as that of the laser cutting device shown in FIG.

  FIG. 12 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. 12 has an upper closing mechanism 140. The upper closing mechanism 140 closes the space between the inner peripheral tube 12 and the outer peripheral tube 14 above the position cut by the laser L in the vertical direction. The upper closing mechanism 140 of the present embodiment closes the upper ends of the inner peripheral pipe 12 and the outer peripheral pipe 14. By providing the upper closing mechanism 140, air or water does not leak from between the inner peripheral tube 12 and the outer peripheral tube 14 above the position cut by the laser L in the vertical direction.

  FIG. 13 is a flowchart for explaining an example of the operation of the laser cutting device. Next, another example of the operation of the laser cutting device will be described with reference to FIG.

  The laser cutting device 20 installs the laser irradiation device 22 and the gas supply device 24 at a position facing the object (step S90). After installing the laser irradiation device 22 and the gas supply device 24, the laser cutting device 20 determines the processing conditions (step S92). In the case of the processing shown in FIG. 13, as the processing conditions, the processing conditions for forming the penetration portion 100 in the inner peripheral tube 12, the processing conditions for forming the cutting portion 102 in the outer peripheral tube 14, and the inner peripheral tube 12 and the outer peripheral tube 14 At least three conditions for filling the gas in between are set.

  After determining the processing conditions, the laser cutting device 20 starts relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10 (step S94). When the laser cutting device 20 starts relative movement, the laser cutting device 20 irradiates the laser while irradiating the gas toward the inner peripheral tube 12 of the object 10, thereby forming the penetration portion 100 in the inner peripheral tube 12 (step S <b> 96). ).

  Next, after forming the penetration part 100 in the inner peripheral tube 12, the laser cutting device 20 fills the gas between the inner peripheral tube 12 and the outer peripheral tube 14 (step S98). Specifically, the space between the inner peripheral tube 12 and the outer peripheral tube 14 that is vertically higher than the penetrating portion 100 of the inner peripheral tube 12 is closed, and gas is injected into the closed space. Thereby, there is no water between the inner peripheral pipe 12 and the outer peripheral pipe 14 above the penetrating portion 100 of the inner peripheral pipe 12, and a gas atmosphere is created. The gas may be injected from the gas supply device 24 or from another device that supplies another gas.

  Next, after filling the gas, the laser cutting device 20 starts relative movement between the laser irradiation device 22 and the gas supply device 24 and the object 10 (step S100). Here, the laser cutting device 20 moves the laser irradiation device 22 and the gas supply device 24 to a position where the laser L and the gas G can be ejected with respect to the position where the penetration portion 100 of the inner peripheral tube 12 of the object 10 is formed. Let When the laser cutting device 20 starts relative movement, the laser cutting device 20 irradiates the laser L while injecting the gas G toward the outer peripheral tube 14 after passing through the penetration part 100 of the inner peripheral tube 12 of the object 10. Then, the cutting portion 102 is formed in the outer peripheral tube 14, and the outer peripheral tube 14 is cut (step S102).

  As shown in FIG. 12, the laser cutting device is provided with an upper closing mechanism 140 that supplies gas between the inner peripheral tube 12 and the outer peripheral tube 14, and gas between the inner peripheral tube 12 and the outer peripheral tube 14. By filling G, the region through which the laser L that has passed through the inner tube 12 at the time of cutting the outer tube 14 passes can be more surely made into a gas atmosphere. Thereby, the output of the laser L reaching the outer tube 14 can be made stronger. In addition, since the gas G can be filled between the inner peripheral tube 12 and the outer peripheral tube 14, the gas is supplied even when the amount of gas supplied between the inner peripheral tube 12 and the outer peripheral tube 14 is reduced during cutting. And the amount of gas used can be reduced.

  In the process shown in FIG. 13, since a gas can be filled more reliably, a process of supplying gas is provided between the inner peripheral pipe 12 and the outer peripheral pipe 14. Since it stores between the pipe | tube 12 and the outer periphery pipe | tube 14, it is not necessary to provide the process of supplying gas.

  Moreover, although the upper side obstruction | occlusion mechanism of the said embodiment obstruct | occluded the upper end of the inner periphery pipe | tube 12 and the outer periphery pipe | tube 14, what is necessary is just to obstruct | occlude the vertical direction upper side from the position cut | disconnected by the laser L. FIG.

  Next, another example of the closing mechanism will be described with reference to FIGS. 14 and 15. FIG. 14 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. 14 includes an upper closing mechanism 140a, a lower closing mechanism 142, a closing mechanism installation device 144, an assist gas supply device 146, and a pipe 148. The upper closing mechanism 140a closes the space between the inner peripheral tube 12 and the outer peripheral tube 14 above the position cut by the laser L in the vertical direction. The upper closing mechanism 140a of the present embodiment closes the lower side in the vertical direction from the upper ends of the inner peripheral tube 12 and the outer peripheral tube. The lower closing mechanism 142 closes the space between the inner peripheral tube 12 and the outer peripheral tube 14 below the position cut by the laser L in the vertical direction. By providing the upper closing mechanism 140 a and the lower closing mechanism 142, the space between the inner peripheral tube 12 and the outer peripheral tube 14 including the position to be cut by the laser L is air from other than the through portion 100 and the cutting portion 102. And the shape does not leak water.

  The closing mechanism installation device 144 is a device that installs the upper closing mechanism 140a and the lower closing mechanism 142 at their respective positions. The closing mechanism installation device 144 includes an arm, a rod for insertion, and the like.

  The assist gas supply device 146 is a supply source that supplies the assist gas Ga. As the assist gas Ga, the same gas as the gas G can be used. The pipe 148 connects the assist gas supply device 146 and the upper closing mechanism 140a. The pipe 148 guides the assist gas Ga supplied from the assist gas supply device 146 into a space surrounded by the upper closing mechanism 140a and the lower closing mechanism 142.

  In the laser cutting device shown in FIG. 14, the upper closing mechanism 140a and the lower closing mechanism 142 are installed by the closing mechanism installation device 144, so that the inner tube 12 and the outer tube 14 including the position to be cut by the laser L are provided. The space between them can be made into a structure in which water or air does not flow in from other than the penetration part 100 and the cutting part 102, or is difficult to flow in. Thereby, the space between the inner peripheral tube 12 and the outer peripheral tube 14 through which the laser L passes can be brought closer to the air, and attenuation of the output of the laser L can be suppressed. Further, by supplying the assist gas Ga with the assist gas supply device 146, the gas can be efficiently supplied to the space between the inner peripheral tube 12 and the outer peripheral tube 14 through which the laser L passes. Thereby, the usage-amount of gas can be decreased.

  When both the upper blocking mechanism 140a and the lower blocking mechanism 142 are provided, at least one of the upper blocking mechanism 140a and the lower blocking mechanism 142 has a hole through which air or water passes, the inner peripheral tube 12, and the outer peripheral tube. 14 is preferably provided. By providing a hole or gap through which air or water passes, when the gas G is supplied, water in the space surrounded by the upper closing mechanism 140a and the lower closing mechanism 142 can be easily discharged out of the space. be able to. In addition, since the laser cutting apparatus can more suitably hold the gas in the region through which the laser L passes, it is preferable to provide the upper closing mechanism 140a, but only the lower closing mechanism 142 may be provided.

  FIG. 15 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. 15 includes an upper closing mechanism 140b, a lower closing mechanism 142a, a closing mechanism installation device 144, an assist gas supply device 146, and a pipe 148. The upper closing mechanism 140 b includes an inter-tube blocking portion 150 and an in-tube blocking portion 152. The inter-tube blocking part 150 has the same structure as the upper blocking mechanism 140ab described above, and blocks the space between the inner peripheral tube 12 and the outer peripheral tube 14 above the position cut by the laser L in the vertical direction. . The in-tube blocking portion 152 closes the space between the head 25 and the inner peripheral tube 12 above the position cut by the laser L in the vertical direction.

  The lower closing mechanism 142a includes an inter-tube blocking portion 154 and an in-tube blocking portion 156. The inter-tube blocking part 154 has the same structure as the lower blocking mechanism 142 described above, and blocks the space between the inner peripheral tube 12 and the outer peripheral tube 14 on the lower side in the vertical direction than the position cut by the laser L. It is out. The in-tube blocking portion 156 closes the space inside the inner peripheral tube 12 on the lower side in the vertical direction than the position cut by the laser L.

  The upper closing mechanism 140 b and the lower closing mechanism 142 a are provided with the in-tube closing portions 152 and 156, so that the space inside the inner peripheral tube 12 including the position to be cut by the laser L is other than the through portion 100 and the cutting portion 102. Can be shaped so that air and water do not leak.

  The closing mechanism installation device 144 is a device that installs the upper closing mechanism 140b and the lower closing mechanism 142a at respective positions. The closing mechanism installation device 144 includes an arm, a rod for insertion, and the like.

  The assist gas supply device 146 is a supply source that supplies the assist gas Ga. As the assist gas Ga, the same gas as the gas G can be used. The pipe 148 connects the assist gas supply device 146 and the upper closing mechanism 140b. The pipe 148 guides the assist gas Ga supplied from the assist gas supply device 146 into a space surrounded by the upper closing mechanism 140b and the lower closing mechanism 142a.

  The laser cutting device shown in FIG. 15 penetrates the space between the inner peripheral pipe 12 and the outer peripheral pipe 14 including the position to be cut by the laser L by installing the upper closing mechanism 140b and the lower closing mechanism 142a. It is possible to make a structure in which water or air does not flow in from other than the part 100 and the cutting part 102 or does not flow easily. Thereby, the space between the inner peripheral tube 12 and the outer peripheral tube 14 through which the laser L passes can be brought closer to the air, and attenuation of the output of the laser L can be suppressed.

  Furthermore, by installing the in-tube blocking portions 152 and 156 of the upper closing mechanism 140b and the lower closing mechanism 142a, the space inside the inner peripheral tube 12 including the position to be cut by the laser L is also water from other than the through portion 100. In addition, a structure in which air does not flow in or is difficult to flow in can be achieved. Thereby, the space inside the inner peripheral tube 12 through which the laser L passes can be brought closer to the air, and attenuation of the output of the laser L can be suppressed. In addition, since the gas is easily held, the amount of gas used can be reduced.

  Even when both of the in-tube blocking portions 152 and 156 are provided, it is preferable to provide a hole through which at least one air or water of the in-tube closing portions 152 and 156 passes, or a gap between the inner peripheral tube 12 and the head 25. By providing a hole or a gap through which air or water passes, it is possible to easily discharge water in the space surrounded by the pipe closing portions 152 and 156 outside the space when the gas G is supplied. Further, since the laser cutting apparatus can more suitably hold the gas in the region through which the laser L passes, it is preferable to provide both the in-tube blocking portions 152 and 156, but only one of the in-tube blocking portions 152 and 156 is provided. May be provided.

  Further, as shown in FIG. 15, when the in-tube blocking portions 152 and 156 are provided, the gas may be supplied before the inner peripheral tube is cut, so that the inside is made into an air atmosphere.

  Next, FIG. 16 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. The surrounding blocking mechanism 160 blocks the portion other than the opening 38 between the inner peripheral tube 12 and the head 25 in the rotation direction of the head 25 and the opening 38. The peripheral blocking mechanism 160 is fixed to the distal end side of the head 25 and rotates together with the opening 38. The surrounding block mechanism 160 has a structure that surrounds the inner peripheral tube 12 and the head 25 around the position where the laser L and the gas G pass. By providing the peripheral blocking mechanism 160, it is possible to suppress water from entering the laser L path between the inner peripheral tube 12 and the head 25. In the present embodiment, it is provided around the entire circumference of the head 25, but it only needs to surround the opening 38.

  FIG. 17 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. 17 has an opening 170 for supplying the assist gas Gb. The opening 170 is provided behind the laser irradiation position in the rotation direction of the opening, and supplies the assist gas Gb to the rear side of the laser irradiation position. In the laser cutting device shown in FIG. 17, by providing the opening 170, the gas is injected with a width equal to or larger than the kerf width formed in the inner peripheral tube by the laser. As a result, it is possible to make it difficult for water to enter the region through which the laser L passes. In the present embodiment, the opening 170 is provided separately from the opening 38. However, the opening 38 may be shaped to inject gas with a width equal to or greater than the kerf width formed in the inner peripheral tube by the laser in the rotation direction of the opening 38. Good.

  FIG. 18 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. 18 has a closing material supply device 180. The closing material supply device 180 supplies the closing material 182 to the penetrating portion 100 of the inner peripheral tube 12, that is, the cutting position, behind the irradiation position of the laser L in the rotation direction of the opening 38. As the closing material 182, for example, a fireproof material such as rubber can be used. The blocking material 182 is a material that is torn off when the object is transported after cutting. The blocking material supply device 180 supplies the blocking material 182 to the penetrating portion 100 of the inner peripheral tube 12, that is, the cutting position, on the rear side of the irradiation position of the laser L, so that the water is supplied from the rear side of the irradiation position of the laser L. Suppresses intrusion.

  FIG. 19 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. The shielding member 190 is a flexible member that is fixed to the outer periphery of the head 25 on the rear side of the irradiation position of the laser L in the rotation direction of the opening 38 and is inserted into the penetrating portion 100 of the inner peripheral tube. As the shielding member 190, a wire brush or the like can be used. The laser cutting device shown in FIG. 19 is provided with a shielding member 190, and the shielding member 190 is inserted into the penetrating portion 100 of the inner peripheral tube 12, that is, the cutting position, behind the irradiation position of the laser L. It suppresses that water permeates from the rear side of the irradiation position.

  FIG. 20 is a schematic configuration diagram illustrating another example of a laser cutting device. The laser cutting device shown in FIG. The water injection device 196 is fixed to the outer periphery of the head 25 on the rear side of the irradiation position of the laser L in the rotation direction of the opening 38 and injects water into the penetrating portion 100 of the inner peripheral tube in a jet shape. That is, the water injection device 196 injects the jet water 198. The laser cutting device shown in FIG. 20 is provided with a water injection device 196, and jets water in the penetrating portion 100 of the inner peripheral tube 12, that is, the cutting position, on the rear side of the laser L irradiation position. It suppresses that water permeates from the rear side of the irradiation position of L.

  The laser cutting device can suppress the attenuation of the output of the laser L by providing the mechanism shown in FIGS. 16 to 20 and suppressing the ingress of water from the rear side of the irradiation position of the laser L, In addition, the gas supplied from the head 25 can be used efficiently.

  Moreover, although embodiment mentioned above demonstrated in the case where the cross section cut | disconnects circular as a target object, it is not limited to this. The present invention can cut structures of various shapes arranged in water in a shape in which an inner peripheral tube and an outer peripheral tube overlap. The object may be, for example, a polygonal cross section or a double tube having a cross section in which a curve and a straight line are combined.

  In addition, both the first member and the second member are pipe lines, the first member does not have to be an inner peripheral pipe, and the second member does not need to be an outer peripheral pipe. Any structure in which two or more members are stacked at intervals may be used.

  FIG. 21 is a schematic configuration diagram illustrating a laser cutting device according to another embodiment. FIG. 22 is a schematic configuration diagram of the laser cutting device shown in FIG. 21 viewed from another direction. As shown in FIGS. 21 and 22, the laser cutting device 220 is used for cutting the object 210. The object 210 is disposed in water, and the first member 212 and the second member 214 are laminated. The first member 212 and the second member 214 are plate-like members. The object 210 is disposed to face the first member 212 and the second member 214 with a gap therebetween. There is a gap between the first member 212 and the second member 214, and the gap is also filled with water.

  As shown in FIGS. 21 and 22, the laser cutting device 220 includes a laser irradiation device 22, a gas supply device 24, a head 25, a moving device 226, and a control device 27. The laser irradiation device 22 is disposed at a position facing the first member 12, irradiates the laser L toward the first member 12, and jets the gas G. The laser irradiation device 22, the gas supply device 24, the head 25, and the control device 27 have the same structure as the laser cutting device 22. The moving device 26 supports the head 25 and starts the object 10. The moving device 26 moves the head 25 in the moving direction 229 with respect to the object 10.

  The laser cutting device 220 supplies the gas G from the gas supply device 24 to the head 25 and injects the gas G toward the object 10 while supplying the laser from the laser irradiation device 22 to the head 25, Irradiate the laser L toward. Further, the laser cutting device 20 injects gas from the head 25 toward the target object 10 and irradiates the laser toward the target object 10 so that the laser cutting device 20 is moved in the moving direction 29 by the moving device 26. As shown in FIG. 22, the first member 12 can be formed with a through portion 230 along the moving direction 29, and the second member 14 can be formed with a cutting portion 232 along the moving direction 29. The penetration part 230 and the cutting part 232 are parts cut by a laser.

  As described above, the laser cutting device 220 efficiently cuts the object 210 by ejecting the gas G together with the laser L from the head 25 even when the object 210 has a shape in which two flat plates are stacked. can do.

10, 210 Object 12 Inner peripheral pipe (first member)
14 Outer pipe (second member)
20, 220 Laser cutting device 22, 22a, 22b Laser irradiation device 24 Gas supply device 25 Head 26 Moving device 26a Three-dimensional moving mechanism 26b Rotating moving mechanism 27 Control device 28 Support device 29 Moving direction 34, 35 Locking hole (gripping part) )
38, 170 Opening 41 First gripping device 42 Second gripping device 51, 61 Holding head 52, 62 Locking member 70 Gas supply source 72 Gas supply pipe 80 Laser light source 82 Parallel optical system 84 Parabolic mirror (condensing optical system)
85 Condensing optical system 86, 130, 132, 136, 138 Reflection mirror 87 Optical fiber 100 Through portion 102 Cutting portion 134 Rotating shaft 140, 140b Upper closing mechanism 142, 142a Lower closing mechanism 144 Closure mechanism installation device 146 Assist gas supply Device 148 Piping 150, 154 Inter-tube blocking portion 152, 156 In-tube blocking portion 160 Surrounding blocking mechanism 180 Blocking material supply device 182 Blocking material 190 Shielding member 196 Water injection device 212 First member 214 Second member G Gas Ga, Gb Assist gas L Laser

Claims (20)

A laser cutting device in which a first member and a second member are laminated, and a target object placed in water is cut with a laser,
A hollow pipe disposed facing the first member, a head having an opening formed in the axial direction of the pipe at the tip;
A gas supply device for supplying gas to the hollow pipe line of the head and ejecting the gas from the opening;
A laser irradiation device for guiding the inside of a hollow pipe line of the head and irradiating a laser from the opening;
And a moving device for moving the opening of the head.   The laser irradiation device has a condensing optical system arranged upstream from a position where gas is supplied from the gas supply device to the pipeline, and the condensed laser passes through the pipeline. The laser cutting device according to claim 1, wherein   The laser irradiation device includes a parallel optical system disposed upstream of a position where gas is supplied from the gas supply device to the pipeline, and a state in which the gas can flow to the opening side of the pipeline. The laser cutting device according to claim 1, further comprising: a condensing optical system disposed, wherein a parallel light laser passes through the pipe.   The laser cutting apparatus according to claim 3, wherein the condensing optical system is a parabolic mirror.   The laser cutting device according to claim 3, wherein the condensing optical system includes a lens.   The said laser irradiation apparatus has an optical fiber arrange | positioned in the state which can distribute | circulate the said gas through the said pipe line, A laser passes the said optical fiber in the said pipe line, The Claim 1 characterized by the above-mentioned. Laser cutting device.   The laser cutting device according to any one of claims 1 to 6, wherein the laser irradiation device includes a reflection optical system that refracts a focused laser beam with respect to an axial direction of the pipe line.   The laser cutting device according to claim 7, wherein a part of the opening side of the head is inclined with respect to an axis of another part.   The laser cutting device according to claim 1, wherein the moving device rotates a part of the opening side with respect to another part.   10. The apparatus according to claim 1, further comprising an upper closing mechanism that closes an upper side in a vertical direction from a position cut by the laser between the first member and the second member of the object. The laser cutting device according to one item. In the object, the first member has a cylindrical shape,
The laser cutting apparatus according to claim 10, wherein the upper closing mechanism further closes a gap between the first member and the head.   12. The lower closing mechanism that closes the lower side in the vertical direction with respect to the position cut by the laser between the first member and the second member of the object. The laser cutting device according to any one of the above. In the object, the first member has a cylindrical shape,
The laser cutting apparatus according to claim 12, wherein the lower closing mechanism further closes a space inside the first member.   10. The laser cutting device according to claim 1, further comprising an assist gas supply device configured to supply gas between the first member and the second member. 11. The object is an outer peripheral tube in which the first member is an inner peripheral tube and the second member is disposed on an outer periphery of the first member;
The head is disposed inside the inner peripheral pipe,
The laser cutting device according to claim 1, wherein the moving device rotates the head.   The laser cutting device according to any one of claims 1 to 15, further comprising a peripheral closing mechanism that closes a periphery of the opening between the first member and the head.   The said opening is a shape which inject | pours the said gas with the width | variety more than the kerf width formed in the said 1st member with the said laser in the moving direction of the said opening. The laser cutting device described in 1.   18. The apparatus according to claim 1, further comprising: a closing material supply device that supplies the closing material to a cutting position of the first member that is behind the irradiation position of the laser in the moving direction of the opening. The laser cutting device according to one item.   In the moving direction of the opening, there is provided a flexible shielding member that is fixed to the outer periphery of the head at the rear side of the laser irradiation position and is inserted into the cutting position of the first member. The laser cutting device according to any one of claims 1 to 17.   18. The water injection device according to claim 1, further comprising: a water injection device that jets water toward a cutting position of the first member at a rear side of the laser irradiation position in the moving direction of the opening. The laser cutting device according to one item.

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