JP2017170477A5 - - Google Patents
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- JP2017170477A5 JP2017170477A5 JP2016058891A JP2016058891A JP2017170477A5 JP 2017170477 A5 JP2017170477 A5 JP 2017170477A5 JP 2016058891 A JP2016058891 A JP 2016058891A JP 2016058891 A JP2016058891 A JP 2016058891A JP 2017170477 A5 JP2017170477 A5 JP 2017170477A5
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- processing
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- laser
- flow path
- gas supply
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- 238000003754 machining Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000001678 irradiating Effects 0.000 claims 1
- 230000003287 optical Effects 0.000 description 3
- ITMSSWCUCPDVED-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane;oxo(oxoalumanyloxy)yttrium;oxo(oxoyttriooxy)yttrium Chemical compound O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Y]=O.O=[Y]O[Y]=O ITMSSWCUCPDVED-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
上述した課題を解決し、目的を達成するために、本発明は、加工ノズルを通して被加工材にレーザ光を集光照射するとともに、加工ヘッド内空間の加工ガスを加工ノズルから被加工材に噴射するレーザ加工装置の加工ヘッドであって、加工ノズルの中心軸に軸対称な形状であり、加工ヘッド内空間に連結流路を介して連結された環状流路と、環状流路に加工ガスを供給する加工ガス供給流路とを備える。加工ガス供給流路は、加工ノズルの中心軸に対してオフセットされて配置されている。 In order to solve the above-described problems and achieve the object, the present invention condenses and irradiates a workpiece material with laser light through a machining nozzle and injects a machining gas in the machining head space from the machining nozzle onto the workpiece material. to a processing head of a laser processing apparatus, an axis symmetric shape to the central axis of the processing nozzle, an annular passage which is connected via a connecting channel to the working head space, a process gas into the annular channel And a processing gas supply channel to be supplied. The processing gas supply channel is disposed offset with respect to the central axis of the processing nozzle.
本実施の形態において、レーザ発振器100には、CO2レーザ、ファイバレーザ、ディスクレーザ、YAG(Yttrium Aluminum Garnet)レーザ、ダイレクトダイオードレーザを適用できるがこれらに限定されない。図1に示した伝搬光学系101はミラー伝送であるが、途中に曲率ミラー又はレンズを用いた構成であってもよい。更には、上記ファイバレーザ、ディスクレーザ、YAGレーザ又はダイレクトダイオードレーザの場合には、光ファイバにより伝搬光学系101を構成することで、加工ヘッド1までレーザビーム3を導光させた後に、加工ヘッド1内に一般にはコリメートレンズを設置してコリメート光とした後に、加工レンズ4に導光させてもよい。あるいは、加工ヘッド1内の光学系は、2以上のレンズ群を用いたズームレンズであっても良い。加工レンズ4に入射するレーザビーム3は必ずしもコリメートされている必要は無く、レンズ系の位置を連動して制御することで所望のビーム径にて加工点に集光させることができる。 In this embodiment, a CO2 laser, a fiber laser, a disk laser, a YAG (Yttrium Aluminum Garnet) laser, and a direct diode laser can be applied to the laser oscillator 100, but it is not limited to these. Although the propagation optical system 101 shown in FIG. 1 is mirror transmission, a configuration using a curvature mirror or lens in the middle may be used. Furthermore, the fiber laser, in the case of a disk laser, YAG laser or direct diode laser, by forming the propagation optical system 101 by an optical fiber, the After guiding the laser beam 3 to the machining head 1, the processing Generally, a collimating lens may be installed in the head 1 to produce collimated light, and then guided to the processing lens 4. Alternatively, the optical system in the processing head 1 may be a zoom lens using two or more lens groups. The laser beam 3 incident on the processing lens 4 is not necessarily collimated, and can be focused on the processing point with a desired beam diameter by controlling the position of the lens system in conjunction with each other.
Claims (7)
前記加工ノズルの中心軸に軸対称な形状であり、前記加工ヘッド内空間に連結流路を介して連結された環状流路と、
前記環状流路に前記加工ガスを供給する加工ガス供給流路とを備え、
前記加工ガス供給流路は、前記加工ノズルの中心軸に対してオフセットされて配置されていることを特徴とするレーザ加工装置の加工ヘッド。 A processing head of a laser processing apparatus for condensing and irradiating a processing material with laser light through a processing nozzle and injecting a processing gas in a processing head inner space from the processing nozzle to the processing material,
The axisymmetrical shape to the central axis of the processing nozzle, an annular passage which is connected via a connecting channel to the working head space,
A processing gas supply channel for supplying the processing gas to the annular channel,
The processing head of the laser processing apparatus, wherein the processing gas supply flow path is arranged offset with respect to a central axis of the processing nozzle.
各前記加工ガス供給流路が、前記中心軸に対して互いに異なる方向を向いて設置されていることを特徴とする請求項1又は2に記載のレーザ加工装置の加工ヘッド。 A plurality of the processing gas supply channels;
3. The processing head of the laser processing apparatus according to claim 1, wherein each of the processing gas supply passages is installed in different directions with respect to the central axis.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016058891A JP6425678B2 (en) | 2016-03-23 | 2016-03-23 | Processing head of laser processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016058891A JP6425678B2 (en) | 2016-03-23 | 2016-03-23 | Processing head of laser processing device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017170477A JP2017170477A (en) | 2017-09-28 |
JP2017170477A5 true JP2017170477A5 (en) | 2017-11-30 |
JP6425678B2 JP6425678B2 (en) | 2018-11-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016058891A Active JP6425678B2 (en) | 2016-03-23 | 2016-03-23 | Processing head of laser processing device |
Country Status (1)
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JP (1) | JP6425678B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018102348A1 (en) * | 2018-02-02 | 2019-08-08 | Precitec Gmbh & Co. Kg | Gas supply device and laser processing head with the same |
DE102018102337B4 (en) | 2018-02-02 | 2022-02-17 | Precitec Gmbh & Co. Kg | Gas supply device and laser processing head with the same |
JP6659745B2 (en) | 2018-02-16 | 2020-03-04 | ファナック株式会社 | Laser processing head with function to rectify assist gas |
CN108687440B (en) * | 2018-07-20 | 2023-06-20 | 苏州迅镭激光科技有限公司 | Laser cutting head gas circuit device with gentle and uniform blowing |
DE102018131886B3 (en) * | 2018-09-26 | 2020-02-13 | Scansonic Mi Gmbh | Device for flow control of a process medium for a laser processing device |
CN109468637B (en) * | 2019-01-08 | 2021-04-16 | 苏州大学 | Laser cladding device and laser cladding forming method |
DE102019103659B4 (en) * | 2019-02-13 | 2023-11-30 | Bystronic Laser Ag | Gas guide, laser cutting head and laser cutting machine |
JP6837092B2 (en) | 2019-05-07 | 2021-03-03 | 株式会社アマダ | Laser processing head and laser processing equipment |
CN111906439B (en) * | 2020-06-19 | 2022-02-22 | 宁波大艾激光科技有限公司 | Laser shock peening light path protection device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS56151191A (en) * | 1980-04-25 | 1981-11-24 | Hitachi Ltd | Method and apparatus for working by laser beam |
JP2004148360A (en) * | 2002-10-30 | 2004-05-27 | Toppan Forms Co Ltd | Laser beam machining head, and laser beam machining system using the same |
JP6159583B2 (en) * | 2013-06-07 | 2017-07-05 | 株式会社アマダホールディングス | Protection method of protective glass and laser processing head |
JP6372797B2 (en) * | 2014-05-16 | 2018-08-15 | 高橋金属株式会社 | Laser welding nozzle |
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2016
- 2016-03-23 JP JP2016058891A patent/JP6425678B2/en active Active
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