JP2016068110A - Laser processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing device that processes a workpiece by irradiating it with a laser beam, and that is capable of suppressing reduction in service life of a visible-light laser source.SOLUTION: A laser processing device 1 comprises: a laser oscillation unit 12; a galvano scanner 19; a visible semiconductor laser 28; a temperature sensor 65; and a laser controller 5. By using a laser beam L, the laser processing device can process a workpiece W according to processing contents based on drawing data. Further, the laser processing device 1 can draw the processing contents based on the drawing data on the workpiece W by using a visible laser beam M emitted from the visible semiconductor laser 28 according to control by the laser controller 5. When drawing the processing contents with the visible laser beam M, a CPU 61 acquires (S3) a setting value at which a light amount of the visible laser beam M becomes smaller as the environmental temperature of the visible semiconductor laser 28 measured by the temperature sensor 65 gets higher.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a laser processing apparatus that processes a workpiece by irradiating a laser beam.

  Conventionally, a laser processing apparatus is configured to perform processing by irradiating a processing target with laser light, and sequentially outputs emitted laser light so as to be at an arbitrary position on the processing target. Scanning is performed to draw characters and symbols. In such a laser processing apparatus, in order to perform processing at a user-desired position on the processing target, it is necessary to adjust the processing position, processing range, and the like on the processing target before processing with the laser beam. In order to realize this, a laser processing apparatus having a visible light laser light source that emits a weak output visible light laser has been developed.

  For example, the invention described in Patent Document 1 is known as an invention relating to a laser processing apparatus having a visible light laser source. The laser processing apparatus described in Patent Literature 1 irradiates a laser beam from the visible light laser light source on the object to be processed through a scanning unit such as the galvanometer mirror before starting processing. The projection image of the processing content etc. processed by is projected on the processing object. At this time, the laser processing apparatus described in Patent Document 1 replaces some characters, symbols, figures, etc. with simplified characters, symbols, figures, etc., and simplifies and projects the projection time of the visible light laser. We are trying to shorten it.

JP 2003-117669 A

  However, in the laser processing apparatus described in Patent Document 1, when the visible light laser is continuously projected over a long period of time, or when the laser processing apparatus is used for many years, the light amount of the visible light laser Is output with a predetermined amount of light, the required energy increases, and the Joule heat increases accordingly. As the Joule heat is generated, the temperature in the vicinity of the visible light laser is increased. Therefore, the visible light laser is used in a high temperature environment, which may shorten the life of the visible light laser light source.

  The present disclosure has been made in view of the above-described problems, and relates to a laser processing apparatus that processes a workpiece by irradiating a laser beam, and is capable of suppressing the shortening of the lifetime of a visible light laser light source. An object is to provide an apparatus.

  In order to achieve the above object, a laser processing apparatus according to one aspect of the present invention includes an emission unit that emits a laser for processing a workpiece, a storage unit that stores drawing data indicating the processing content of the laser, A visible light laser light source that emits a visible light laser for indicating the processing content on the object to be processed, a measurement unit that measures an environmental temperature of the visible light laser light source, and a laser emitted from the emission unit or A scanning unit that scans a visible light laser emitted from a visible light laser light source, and a control unit that controls the emitting unit, the visible light laser light source, and the scanning unit based on the drawing data stored in the storage unit The control unit acquires and acquires a setting value that decreases the amount of light of the visible light laser as the environmental temperature of the visible light laser light source measured by the measuring unit is higher. The light quantity corresponding to the set value of the visible laser, the processing content based on the drawing data to be drawn on the workpiece, and controls the visible light laser source and the scanning unit.

  The laser processing apparatus includes an emission unit, a storage unit, a visible light laser light source, a measurement unit, an operation unit, and a control unit, and is controlled based on drawing data stored in the storage unit. When the unit controls the emitting unit and the scanning unit, the processing object can be processed based on the drawing data using the laser emitted from the emitting unit. Further, in the laser processing apparatus, the control unit controls the visible light laser light source and the scanning unit, so that the processing content based on the drawing data is applied to the processing object using the visible light laser emitted from the visible light laser light source. Drawing can be performed, and the processing content can be confirmed. Here, the lifetime of the visible light laser light source tends to be shortened when the surroundings are in a high temperature environment. In addition, the visible light laser light source generates more Joule heat and increases the ambient temperature as the amount of light of the visible light laser (total power consumed per unit time) increases. In this regard, according to the laser processing apparatus, the higher the environmental temperature of the visible light laser light source measured by the measurement unit, the smaller the light amount of the visible light laser is acquired, and the acquired Since the processing content based on the drawing data is drawn on the processing object with the light amount corresponding to the set value, the influence of temperature such as Joule heat can be reduced, and the shortening of the lifetime of the visible light laser light source can be suppressed. .

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 1, wherein the control unit is configured such that an ambient temperature of the visible light laser light source measured by the measurement unit is a predetermined first temperature. When it is determined whether or not the environmental temperature is not equal to or higher than the first temperature, the visible light laser is irradiated with a predetermined light amount, and the environmental temperature is equal to or higher than the first temperature. When it is determined that there is, the visible light laser light source is controlled to be turned on and off in a predetermined first cycle unit, whereby the light amount of the visible light laser is made smaller than the predetermined light amount.

  When the laser processing apparatus determines that the environmental temperature of the visible light laser light source is equal to or higher than the first temperature, the laser processing device reduces the light amount of the visible light laser below the predetermined light amount, Draw the details of the process. That is, according to the laser processing apparatus, when the ambient temperature of the visible light laser light source is high, the amount of visible light laser light is reduced, so that Joule heat is less generated in the visible light laser light source, and the lifetime of the visible light laser light source is reduced. Can be shortened.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 2, wherein the control unit has an ambient temperature of the visible light laser light source measured by the measurement unit equal to or higher than the first temperature. When the ambient temperature is higher, the duty ratio indicating the ratio of the on-period of the visible light source in the first period is smaller, so that the amount of light of the visible light laser is reduced. It is characterized by doing.

  When the laser processing apparatus determines that the environmental temperature of the visible light laser light source is equal to or higher than the first temperature, the laser processing apparatus sets a duty ratio indicating a ratio of an on period of the visible light laser light source within the first period. The amount of light of the visible light laser is reduced by decreasing the environmental temperature as it is higher. Here, the visible light laser transmits the processing content to the user by drawing the processing content based on the drawing data on the processing object. If the amount of light of the visible light laser is large, the processing content can be drawn clearly, but the generated Joule heat increases. As the light amount of the visible light laser decreases, the generated Joule heat also decreases along with the clarity of the drawn processing content. That is, according to the laser processing apparatus, by decreasing the duty ratio in the first period as the environmental temperature is higher, the amount of visible light laser is reduced, and the clarity of the processing content drawn by the visible light laser, The amount of light can be determined in consideration of the influence of the ambient temperature and the Joule heat on the lifetime of the visible light laser light source.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 2 or 3, wherein the control unit is configured such that an environmental temperature of the visible light laser light source measured by the measurement unit is It is determined whether or not the temperature is equal to or higher than a second temperature higher than the first temperature, and when it is determined that the environmental temperature is equal to or higher than the second temperature, the visible light laser light source is turned on / off by the first cycle unit. In addition to the control, the on / off control of the visible light laser light source in units of the second period longer than the first period is performed, so that only the on / off control of the light amount of the visible light laser in the first period unit is performed. It is characterized in that the amount of light is less than that in the case where the

  According to the laser processing apparatus, when it is determined that the environmental temperature of the visible light source is equal to or higher than the second temperature, only the on / off control of the light amount of the visible light laser by the first cycle unit is performed. The processing content is drawn on the processing object by reducing the amount of light when it is broken. That is, according to the laser processing apparatus, when the environmental temperature of the visible light laser light source is higher than the second temperature higher than the first temperature, the amount of light of the visible light laser is further reduced. Is further reduced, and the shortening of the lifetime of the visible light laser light source can be further suppressed.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to claim 4, wherein the control unit has an environmental temperature of the visible light laser light source measured by the measurement unit equal to or higher than the second temperature. When the ambient temperature is higher, the duty ratio indicating the ratio of the on-period of the visible light laser light source in the second period is decreased as the environmental temperature is higher. It is characterized by doing.

  When the laser processing apparatus determines that the ambient temperature of the visible light laser light source is equal to or higher than the second temperature, the laser processing apparatus sets a duty ratio indicating a ratio of an on period of the visible light laser light source within the second period. The light amount of the visible light laser is made smaller as the environmental temperature is higher than the light amount when the on / off control is performed only in the first cycle unit. That is, according to the laser processing apparatus, even when the environmental temperature of the visible light laser light source is equal to or higher than the second temperature, which is higher than the first temperature, the amount of light of the visible light laser is drawn by the visible light laser. The amount of light can be determined in consideration of the clarity of the processing content to be processed and the magnitude of the influence of the ambient temperature and Joule heat on the lifetime of the visible light laser light source.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to any one of claims 1 to 5, wherein the control unit is based on the drawing data stored in the storage unit. Then, the drawing time required for drawing the processing content based on the drawing data by the visible light laser is calculated, and the longer the calculated drawing time, the light amount of the visible light laser is calculated based on the environmental temperature. The light quantity is changed to a light quantity smaller than the light quantity corresponding to the acquired set value.

  The laser processing apparatus calculates a drawing time required for drawing the processing content based on the drawing data by the visible light laser. Here, the longer the drawing time, the longer the time during which the visible light laser is emitted and Joule heat is generated. That is, the longer the drawing time, the higher the temperature of the visible light laser light source, which may shorten the life of the visible light laser light source. According to the laser processing apparatus, as the calculated drawing time is longer, the light amount of the visible light laser is changed to a light amount smaller than the light amount corresponding to the set value acquired based on the environmental temperature. The light quantity of the optical laser can be set to a light quantity that takes into account the temperature rise associated with the drawing of the processing content during the drawing time, and thus the shortening of the lifetime of the visible light laser light source can be suppressed.

  A laser processing apparatus according to another aspect of the present invention is the laser processing apparatus according to any one of claims 1 to 5, wherein the control unit measures an accumulated usage time during which the visible light laser is irradiated. The light amount of the visible light laser is changed to a light amount smaller than the light amount corresponding to the set value acquired based on the environmental temperature as the cumulative usage time is longer.

  The said laser processing apparatus measures the accumulation use time with which the said visible light laser was irradiated. Here, it is known that the longer the cumulative use time of the visible light laser light source, the higher the possibility of failure due to an increase in environmental temperature. According to the laser processing apparatus, the longer the measured accumulated usage time is, the more the light amount of the visible light laser is changed to a light amount smaller than the light amount corresponding to the set value acquired based on the environmental temperature. The amount of laser light can be set to a light amount that takes into account the possibility that the visible light laser light source will fail with the cumulative use time, and thus shortening the lifetime of the visible light laser light source can be suppressed. .

It is explanatory drawing which shows schematic structure of the laser processing apparatus 1 regarding 1st Embodiment. It is a top view which shows the structure of the laser head part 3 regarding 1st Embodiment. It is a block diagram which shows the control system of the laser processing apparatus 1 regarding 1st Embodiment. It is a flowchart of the visible laser beam lighting process program in 1st Embodiment. It is explanatory drawing which shows an example of the visible laser light quantity selection table. It is explanatory drawing (1) which shows the relationship between EN signal and DATA signal, and the amount of visible laser beams. It is explanatory drawing (2) which shows the relationship between EN signal and DATA signal, and the amount of visible laser beams. It is explanatory drawing (3) which shows the relationship between EN signal and DATA signal, and the amount of visible laser beams. It is a flowchart of the visible laser light quantity correction processing program in the first embodiment. It is a flowchart of the visible laser light quantity correction process program in 2nd Embodiment.

(First embodiment)
Hereinafter, an embodiment in which a laser processing apparatus according to the present invention is embodied in a laser processing apparatus 1 will be described in detail with reference to the drawings.

(Schematic configuration of laser processing equipment)
First, a schematic configuration of the laser processing apparatus 1 according to the first embodiment will be described in detail with reference to the drawings. As shown in FIG. 1, the laser processing apparatus 1 according to the first embodiment includes a laser processing apparatus main body 2, a laser controller 5, and a power supply unit 6.

  The laser processing apparatus main body 2 performs marking processing by two-dimensionally scanning the processing surface WA of the workpiece W with the laser beam L. The laser controller 5 is configured by a computer, is connected to the PC 7 so as to be capable of bidirectional communication, and is electrically connected to the laser processing apparatus main body 2 and the power supply unit 6. The PC 7 is composed of a personal computer or the like, and is used for creating drawing data. The laser controller 5 drives and controls the laser processing apparatus main body 2 and the power supply unit 6 based on drawing data, control parameters, various instruction information, and the like transmitted from the PC 7.

  1 shows a schematic configuration of the laser processing apparatus 1, and therefore the laser processing apparatus main body 2 is schematically shown. Therefore, a specific configuration of the laser processing apparatus main body 2 will be described later.

(Schematic configuration of the laser processing device main unit)
Next, a schematic configuration of the laser processing apparatus main body 2 will be described with reference to FIGS. In the description of the laser processing apparatus main body 2, the left direction, the right direction, the upper direction, and the lower direction in FIG. 1 are the front direction, the rear direction, the upper direction, and the lower direction, respectively. Therefore, the emission direction of the laser light L from the laser oscillator 21 is the forward direction. The direction perpendicular to the main body base 11 and the laser beam L is the vertical direction. And the direction orthogonal to the up-down direction and the front-rear direction of the laser processing apparatus main body 2 is the left-right direction of the laser processing apparatus main body 2.

  The laser processing apparatus main body 2 includes a laser head 3 (see FIG. 2) that emits laser light L and visible laser light M coaxially from the fθ lens 20, and a substantially box body in which the laser head 3 is fixed to the upper surface. And a cylindrical processing container (not shown).

  As shown in FIG. 2, the laser head unit 3 includes a main body base 11, a laser oscillation unit 12 that emits laser light L, an optical shutter unit 13, an optical damper 14, a half mirror 15, and a guide light unit 16. And a reflection mirror 17, an optical sensor 18, a galvano scanner 19, an fθ lens 20, and the like, and is covered with a substantially rectangular parallelepiped housing cover (not shown).

  The laser oscillation unit 12 includes a laser oscillator 21, a beam expander 22, and a mounting base 23. The laser oscillator 21 has a fiber connector, a condenser lens, a reflecting mirror, a laser medium, a passive Q switch, an output coupler, and a window in a casing. The laser oscillation unit 12 constitutes a part of the emission part in the present invention. An optical fiber F is connected to the fiber connector, and pumping light emitted from the pumping semiconductor laser unit 40 constituting the power supply unit 6 enters through the optical fiber F.

  The condensing lens condenses the excitation light incident from the fiber connector. The reflecting mirror transmits the excitation light collected by the condenser lens and reflects the laser light emitted from the laser medium with high efficiency. The laser medium is excited by excitation light emitted from the excitation semiconductor laser unit 40 and oscillates laser light. Examples of the laser medium include neodymium-added gadolinium vanadate (Nd: GdVO4) crystal to which neodymium (Nd) is added as a laser active ion, neodymium-added yttrium vanadate (Nd: YVO4) crystal, Nd: YAG crystal, and the like. Can be used.

  A passive Q switch is a crystal having a property that the transmittance becomes 80% to 90% when the light energy stored inside exceeds a certain value. Therefore, the passive Q switch functions as a Q switch that oscillates the laser light oscillated by the laser medium as a pulsed pulse laser. As the passive Q switch, for example, a chrome YAG (Cr: YAG) crystal or a Cr: MgSiO4 crystal can be used.

  The output coupler constitutes a reflecting mirror and a laser resonator. The output coupler is, for example, a partial reflecting mirror constituted by a concave mirror whose surface is coated with a dielectric layer film, and the reflectance at a wavelength of 1063 nm is 80% to 95%. The window is made of synthetic quartz or the like, and transmits the laser light emitted from the output coupler to the outside. Accordingly, the laser oscillator 21 oscillates a pulse laser through the passive Q switch, and outputs a pulse laser as the laser light L for performing the marking process on the processing surface WA of the processing target W.

  The beam expander 22 changes the beam diameter of the laser light L and is provided coaxially with the laser oscillator 21. The mounting base 23 is mounted so that the laser oscillator 21 can adjust the optical axis of the laser light L, and is fixed to the upper surface on the rear side of the main body base 11 in the front-rear direction by the mounting screws 25.

  The optical shutter unit 13 includes a shutter motor 26 and a flat shutter 27. The shutter motor 26 is composed of a stepping motor or the like. The shutter 27 is attached to the motor shaft of the shutter motor 26 and rotates coaxially. When the shutter 27 rotates to a position that blocks the optical path of the laser light L emitted from the beam expander 22, the shutter 27 reflects the laser light L to the optical damper 14 provided in the right direction with respect to the optical shutter unit 13. . On the other hand, when the shutter 27 rotates so as not to be positioned on the optical path of the laser light L emitted from the beam expander 22, the laser light L emitted from the beam expander 22 is directed to the front side of the optical shutter unit 13. It enters the arranged half mirror 15.

  The optical damper 14 absorbs the laser light L reflected by the shutter 27. The heat generated by the optical damper 14 is thermally conducted to the main body base 11 and cooled. The half mirror 15 is disposed so as to form an angle of 45 degrees obliquely in the lower left direction with respect to the optical path of the laser light L. The half mirror 15 transmits almost all of the laser light L incident from the rear side. The half mirror 15 reflects a part of the laser beam L incident from the rear side to the reflection mirror 17 at a reflection angle of 45 degrees. The reflection mirror 17 is arranged in the left direction with respect to the substantially central position of the rear side surface on which the laser light L of the half mirror 15 is incident.

  The guide light unit 16 includes, for example, a visible semiconductor laser 28 that emits red laser light as visible laser light, and a lens group (not shown) that converges the visible laser light M emitted from the visible semiconductor laser 28 into parallel light. It consists of and. The visible laser beam M has a wavelength different from that of the laser beam L emitted from the laser oscillator 21. The guide light unit 16 is disposed in the right direction with respect to a substantially central position where the laser light L of the half mirror 15 is emitted. As a result, the visible laser beam M is incident on the reflection surface corresponding to the front side of the half mirror 15 at an incident angle of 45 degrees at a substantially central position where the laser beam L of the half mirror 15 is emitted, and reflected by 45 degrees. It is reflected on the optical path of the laser beam L at the corner. That is, the visible semiconductor laser 28 emits the visible laser beam M onto the optical path of the laser beam L. The guide light unit 16 including the visible semiconductor laser 28 is an example of a visible light laser light source in the present invention.

  The reflection mirror 17 is disposed so as to form an angle of 45 degrees in the diagonally lower left direction with respect to the front-rear direction parallel to the optical path of the laser light L, and the reflection mirror 17 A part of the light is incident at an incident angle of 45 degrees with respect to a substantially central position of the reflecting surface. The reflection mirror 17 reflects the laser beam L incident on the reflection surface at an incident angle of 45 degrees toward the front side at a reflection angle of 45 degrees.

  The optical sensor 18 is configured by a photodetector or the like that detects the emission intensity of the laser light L, and is arranged in the front direction in FIG. 2 with respect to a substantially central position where the laser light L of the reflection mirror 17 is reflected. As a result, the optical sensor 18 receives the laser beam L reflected by the reflecting mirror 17 and detects the emission intensity of the incident laser beam L. Accordingly, it is possible to detect the emission intensity of the laser light L output from the laser oscillator 21 via the optical sensor 18.

  The galvano scanner 19 is attached to the upper side of a through hole 29 formed at the front end of the main body base 11, and the laser beam L emitted from the laser oscillation unit 12 and the visible laser beam M reflected by the half mirror 15 Is two-dimensionally scanned downward. The galvano scanner 19 is configured such that a galvano X-axis motor 31 and a galvano Y-axis motor 32 are fitted into the main body 33 by being fitted into respective mounting holes from the outside so that the respective motor shafts are orthogonal to each other. . Therefore, in the galvano scanner 19, the scanning mirrors attached to the tip portions of the motor shafts face each other inside. Then, the rotation of the galvano X-axis motor 31 and the galvano Y-axis motor 32 is controlled to rotate the respective scanning mirrors, thereby two-dimensionally scanning the laser light L and the visible laser light M downward. The two-dimensional scanning direction is a front-rear direction (X direction) and a left-right direction (Y direction). The galvano scanner 19 is an example of a scanning unit in the present invention.

  The fθ lens 20 concentrically condenses the laser beam L and the visible laser beam M that are two-dimensionally scanned by the galvano scanner 19 with respect to the processing surface WA of the processing target W disposed below. Therefore, by controlling the rotation of the galvano X-axis motor 31 and the galvano Y-axis motor 32, the laser beam L and the visible laser beam M are moved back and forth in a desired machining pattern on the machining surface WA of the workpiece W ( Two-dimensional scanning is performed in the X direction) and the left and right direction (Y direction).

(Schematic configuration of the power supply unit)
Next, a schematic configuration of the power supply unit 6 in the laser processing apparatus 1 will be described with reference to FIG. As shown in FIG. 1, the power supply unit 6 includes a pumping semiconductor laser unit 40, a laser driver 51, a power supply unit 52, and a cooling unit 53 in a casing 55. The power supply unit 52 supplies a driving current for driving the pumping semiconductor laser unit 40 to the pumping semiconductor laser unit 40 via the laser driver 51. The laser driver 51 DC drives the pumping semiconductor laser unit 40 based on drive information input from the laser controller 5 as described later.

  The pumping semiconductor laser unit 40 is optically connected to the laser oscillator 21 by an optical fiber F. The pumping semiconductor laser unit 40 emits pumping light, which is laser light having an output wavelength proportional to the current value exceeding the threshold current for generating laser light, with respect to the pulsed driving current input from the laser driver 51. The light is emitted into the optical fiber F. Therefore, the pumping light from the pumping semiconductor laser unit 40 is incident on the laser oscillator 21 via the optical fiber F. For example, a laser bar using GaAs can be used for the excitation semiconductor laser unit 40.

  The cooling unit 53 is a unit for adjusting the power supply unit 52 and the pumping semiconductor laser unit 40 within a predetermined temperature range. For example, the cooling unit 53 is cooled by an electronic cooling method, so that the temperature of the pumping semiconductor laser unit 40 is increased. Control is performed, and the oscillation wavelength of the pumping semiconductor laser unit 40 is finely adjusted. The cooling unit 53 may be a water cooling type cooling unit, an air cooling type cooling unit, or the like.

(Control system for laser processing equipment)
Next, the control system configuration of the laser processing apparatus 1 will be described with reference to the drawings. As shown in FIG. 3, the laser processing apparatus 1 includes a laser controller 5, a laser driver 51, a galvano controller 56, a galvano driver 57, a visible light laser driver 58, a temperature sensor 65, and the like that control the entire laser processing apparatus 1. Has been. A laser driver 51, a galvano controller 56, an optical sensor 18, a visible light laser driver 58, a temperature sensor 65, and the like are electrically connected to the laser controller 5.

  The laser controller 5 includes a CPU 61, a RAM 62, a ROM 63, a timer 64 for measuring time, and the like as an arithmetic device for controlling the entire laser processing apparatus 1 and a control device. The CPU 61, RAM 62, ROM 63, and timer 64 are connected to each other by a bus line (not shown), and exchange data with each other.

  The RAM 62 is for temporarily storing various calculation results calculated by the CPU 61, XY coordinate data of a drawing pattern, and the like. The ROM 63 stores various programs, and stores various programs such as calculating XY coordinate data of a drawing pattern based on the drawing data transmitted from the PC 7 and storing it in the RAM 62. The ROM 63 stores, for each font type, data such as the font start point, end point, focus, and curvature of each character composed of straight lines and elliptical arcs. The ROM 63 stores a control program (see, for example, FIGS. 4, 9, and 10) and a visible laser light quantity selection table (see FIG. 5) which will be described later.

  The CPU 61 performs various calculations and controls based on various programs stored in the ROM 63. For example, the CPU 61 outputs XY coordinate data, galvano scanning speed information, and the like of the drawing pattern calculated based on the drawing data input from the PC 7 to the galvano controller 56. Further, the CPU 61 outputs drive information of the pumping semiconductor laser unit 40 such as the pumping light output of the pumping semiconductor laser unit 40 and the pumping light output period set based on the drawing data input from the PC 7 to the laser driver 51. To do. Further, the CPU 61 outputs XY coordinate data of the drawing pattern, a control signal for instructing ON / OFF of the galvano scanner 19, and the like to the galvano controller 56.

  The laser driver 51 drives and controls the pumping semiconductor laser unit 40 based on the laser driving information and the like such as the pumping light output of the pumping semiconductor laser unit 40 and the pumping light output period input from the laser controller 5. Specifically, the laser driver 51 generates a pulsed drive current having a current value proportional to the excitation light output of the laser drive information input from the laser controller 5, and is based on the output period of the excitation light of the laser drive information. Output to the pumping semiconductor laser unit 40 during the period. Thereby, the pumping semiconductor laser unit 40 emits pumping light having an intensity corresponding to the pumping light output into the optical fiber F during the output period.

  The galvano controller 56 calculates the drive angle, rotation speed, and the like of the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the XY coordinate data, galvano scanning speed information, and the like of the drawing pattern input from the laser controller 5. Motor drive information representing the drive angle and rotation speed is output to the galvano driver 57. The galvano driver 57 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the motor drive information representing the drive angle and rotation speed input from the galvano controller 56, and two-dimensionally scans the laser beam L. To do.

  The visible light laser driver 58 controls the guide light unit 16 including the visible semiconductor laser 28 based on the control signal output from the laser controller 5. The visible light laser driver 58 controls the amount of visible laser light M emitted from the visible semiconductor laser 28 based on, for example, a control signal based on a control program (see FIGS. 4, 9, and 10) described later. . The temperature sensor 65 is disposed in the housing cover of the laser head unit 3, and is constituted by a thermistor, for example. The temperature sensor 65 measures the temperature around the guide light unit 16 including the visible light laser driver 58 and outputs the measured temperature to the laser controller 5 as temperature data. The temperature sensor 65 is an example of a measurement unit in the present invention.

  A PC 7 is connected to the laser controller 5 so as to be capable of two-way communication. Drawing data indicating processing contents transmitted from the PC 7, control parameters of the laser processing apparatus main body 2, various instruction information from the user, and the like. It is configured to be able to receive. The PC 7 is electrically connected to an input operation unit 71 including a mouse and a keyboard, a liquid crystal display 72, and the like via an input / output interface (not shown). Accordingly, the PC 7 is used for creating drawing data, setting control parameters, and the like using the input operation unit 71 and the liquid crystal display 72.

(Processing contents of visible laser light lighting processing program)
Next, the visible laser light lighting processing program in the first embodiment will be described in detail with reference to the drawings. The visible laser light lighting processing program is read from the ROM 63 of the laser controller 5 and executed by the CPU 61 when the processing content based on the drawing data is drawn on the workpiece W by the visible laser light M.

  In the following description, it is assumed that drawing data created in the PC 7 is already stored in the RAM 62 of the laser controller 5. The drawing data is data indicating the processing content of performing laser processing on the processing target W with the laser light L, and includes information such as the XY coordinate data of the drawing pattern and the intensity of the laser light L. Accordingly, the laser processing apparatus 1 is in a state in which laser processing can be performed on the workpiece W by the laser light L based on the drawing data stored in the RAM 62, and processing is performed by the visible laser light M. The processing content can be drawn on the object W.

  As shown in FIG. 4, when the visible laser light lighting processing program is executed, first, the CPU 61 reads temperature data from the temperature sensor 65 arranged in the housing cover of the laser head unit 3 (S1). The temperature data indicates the measurement result of the environmental temperature that is the temperature around the guide light unit 16 including the visible light laser driver 58 at the present time. Thereafter, the CPU 61 shifts the processing to S2.

  In S <b> 2, the CPU 61 determines whether temperature data has been received from the temperature sensor 65. When the temperature data is received (S2: YES), the CPU 61 stores the received temperature data in the RAM 62, and the process proceeds to S3. On the other hand, when temperature data is not received (S2: NO), the CPU 61 stands by for processing until temperature data is received from the temperature sensor 65.

  In S3, the CPU 61 executes a visible laser light quantity acquisition process, and processes the processing content based on the drawing data based on the temperature data in the vicinity of the visible semiconductor laser 28 and the visible laser light quantity selection table (see FIG. 5). The amount of visible laser light M and the drawing method when drawing on the object W are acquired.

  Here, the contents of the visible laser light quantity selection table will be described in detail with reference to FIGS. As shown in FIG. 5, the visible laser light quantity selection table corresponds the register value, the duty ratio of the EN signal, and the duty ratio of the DATA signal to a plurality of numerical ranges related to the environmental temperature measured by the temperature sensor 65. It is configured with. The register values are associated with each other so as to indicate a larger numerical value as the plurality of numerical value ranges related to the environmental temperature are higher.

  The DATA signal is a signal for controlling on / off of the visible semiconductor laser 28 at a predetermined first period Td (for example, 150 μs to 500 μs), and the duty ratio in the DATA signal is the visible semiconductor with respect to the first period Td. The ratio of the period during which the laser 28 is on is shown. The EN signal is a signal for ON / OFF control of the visible semiconductor laser 28 in a second period Te (for example, several hundred ms) longer than the first period Td, and the duty ratio in the EN signal is the second period Te. The ratio of the period during which the visible semiconductor laser 28 is on is shown.

  Here, the light quantity of the visible laser light M means the total power consumed by the visible semiconductor laser 28 per unit time. Since the energy can be calculated by multiplying the power by the time, the energy per unit time in the visible semiconductor laser 28 is obtained by multiplying the power of the visible semiconductor laser 28 by the on-time per unit time. Calculated. Further, by multiplying the energy per unit time in the visible semiconductor laser 28 by the thermal conversion rate of the visible semiconductor laser 28, the Joule heat of the visible semiconductor laser 28 per unit time can be calculated. The temperature of the visible semiconductor laser 28 rises in proportion to this Joule heat.

  Therefore, when the ON / OFF control of the EN signal and the DATA signal is performed, the total power (ie, the amount of energy or energy) consumed by the visible semiconductor laser 28 per unit time is reduced, so that the visible semiconductor laser 28 generates heat due to Joule heat. Can be suppressed. That is, the duty ratio of the EN signal and the duty ratio of the DATA signal function as set values corresponding to the light amount of the visible laser light M emitted by the visible semiconductor laser 28.

  Thus, in the visible laser light quantity acquisition process (S3), the CPU 61 acquires the environmental temperature indicated by the temperature data stored in the RAM 62, and refers to the visible laser light quantity selection table shown in FIG. The duty ratio of the EN signal and the duty ratio of the DATA signal corresponding to the environmental temperature are acquired.

  Next, the relationship between the duty ratio of the EN signal and the duty ratio of the DATA signal and the amount of the visible laser light M emitted from the visible semiconductor laser 28 will be described in detail with reference to FIGS. 6 to 8 represents the power consumption (mW) in the visible semiconductor laser 28, and the power when the visible semiconductor laser 28 is ON is 3 mW.

  Note that experimental values of the visible semiconductor laser 28 actually used will be mentioned. When a certain visible semiconductor laser 28 is driven by setting the duty ratio of the EN signal to 100% and the duty ratio of the DATA signal to 100% under the environment temperature of 50 ° C., the temperature of the visible semiconductor laser 28 is On average, it showed 63.2 ° C. When a certain visible semiconductor laser 28 is driven with the duty ratio of the EN signal set to 100% and the duty ratio of the DATA signal set to 50%, the temperature of the visible semiconductor laser 28 averages 56.6. ° C. That is, it is known that when the duty ratio of the DATA signal is lowered to 50%, the temperature of the visible semiconductor laser 28 is lowered by about 7 ° C. Further, since the guaranteed temperature of the visible semiconductor laser 28 that is actually used is 70 ° C. or lower, if it exceeds 70 ° C., the possibility that the semiconductor laser is broken becomes very high.

  As shown in FIG. 5, when the environmental temperature based on the temperature data is less than 41 ° C., the CPU 61 acquires 100% as the duty ratio of the EN signal based on the visible laser light quantity selection table, and as the duty ratio of the DATA signal. Get 100%.

  In this case, as shown in FIG. 6, since the visible semiconductor laser 28 is always turned on through the first period Td related to the DATA signal and the second period Te related to the EN signal, the visible laser light M is emitted with a predetermined light amount. Is done. In the first embodiment, 41 ° C. corresponds to the first temperature in the present invention, and the predetermined light amount is the second period with respect to 3 mV, which is the power consumed by the visible semiconductor laser 28 per unit time. A value obtained by multiplying Te.

  Next, the case where the environmental temperature based on temperature data is 48 degreeC, for example is demonstrated. In this case, the CPU 61 acquires 100% as the duty ratio of the EN signal and 60% as the duty ratio of the DATA signal based on the visible laser light quantity selection table.

  As shown in FIG. 7, the visible semiconductor laser 28 is on / off controlled in units of the first period Td so that it is turned on for 60% of the first period Td related to the DATA signal and turned off for 40%. . Since the duty ratio of the EN signal in this case is 100%, the CPU 61 always executes on / off control of the visible semiconductor laser 28 in units of the first period Td during the second period Te regarding the EN signal. Therefore, as shown in FIGS. 6 and 7, the amount of visible laser light M is greater than when the ambient temperature is less than 41 ° C. by performing on / off control of the visible semiconductor laser 28 in the first period Td. Less.

  Subsequently, a case where the environmental temperature based on the temperature data is, for example, 57 ° C. will be described. In this case, the CPU 61 acquires 60% as the duty ratio of the EN signal and 50% as the duty ratio of the DATA signal based on the visible laser light quantity selection table.

  As shown in FIG. 8, the visible semiconductor laser 28 is on / off controlled in units of the first period Td so that it is turned on for 50% of the first period Td related to the DATA signal and turned off for 50%. . In this case, since the duty ratio of the EN signal is 60%, the CPU 61 controls the on / off control of the visible semiconductor laser 28 in units of the first period Td during 60% of the second period Te related to the EN signal. Run, do not run for 40%. That is, the visible laser beam M is not emitted during the 40% off period in the second period Te (see FIG. 8). Therefore, as shown in FIGS. 7 and 8, the light quantity of the visible laser light M is controlled on and off in units of the second period Te in addition to on / off control of the visible semiconductor laser 28 in units of the first period Td. As a result, the environmental temperature is 41 ° C. or higher, which is lower than when it is lower than 51 ° C. In the first embodiment, 51 ° C. corresponds to the second temperature in the present invention.

  As described above, in the visible laser light quantity acquisition process (S3), the CPU 61 uses the DATA signal as a setting value related to the light quantity of the visible laser light M based on the temperature data and the visible laser light quantity selection table (see FIG. 5). And the EN signal duty ratio are acquired and stored in the RAM 62. Thereafter, the CPU 61 shifts the processing to S4 (see FIG. 4).

  In S4, the CPU 61 executes a visible laser light amount correction process, calculates a drawing time required for drawing the processing content of the drawing data with the visible laser light M, and based on the calculated drawing time, the visible laser The set value related to the light amount of the visible laser beam M acquired in the light amount acquisition process (S3) is corrected.

(Processing content of the visible laser light intensity correction processing program)
Here, the processing content of the visible laser light amount correction processing (S4) will be described in detail with reference to FIG. In the visible laser light quantity correction process (S4), the CPU 61 reads out and executes a visible laser light quantity correction process program from the ROM 63, thereby setting a setting value related to the light quantity of the visible laser light M acquired in the visible laser light quantity acquisition process (S3). to correct

  As shown in FIG. 9, when the process proceeds to the visible laser light amount correction process (S4), the CPU 61 reads the drawing line segment data from the drawing data stored in the RAM 62 (S11). The drawing line segment data is composed of a set of points determined by the XY coordinate data of the drawing pattern, and is continuously arranged on the line from the start point to the end point in the locus related to the processing content of the drawing data. The part is shown. That is, the processing content of the drawing data is constituted by an assembly of line segments based on one or a plurality of drawing line segment data. After reading the drawing line segment data, the CPU 61 shifts the processing to S12.

  In S12, the CPU 61 calculates the time required to draw each drawing line segment data with the visible laser light M based on all the drawing line segment data constituting the drawing data. Specifically, the CPU 61 first determines from the start point to the end point of the drawing line segment data based on the X coordinate and Y coordinate of the start point and the X coordinate and Y coordinate of the end point constituting one drawing line segment data. Count the required number of clocks. For example, the number of clocks required from a certain point indicated by (X coordinate, Y coordinate) = (50, 3000) to another point indicated by (X coordinate, Y coordinate) = (80, 5000) is 60. Is counted. Thereafter, the CPU 61 calculates the total number of clocks related to all drawing line segment data constituting the drawing data. Thereafter, the CPU 61 proceeds to S13.

  After shifting to S13, the CPU 61 calculates a required drawing time required for drawing the processed content of the drawing data with the visible laser beam M based on the total number of clocks related to all drawing line segment data calculated in S12. decide. Specifically, the CPU 61 calculates and determines the required drawing time by multiplying the total number of clocks calculated in S12 by several hundred μs that is the clock order. After storing the required drawing time in the RAM 62, the CPU 61 shifts the processing to S14.

  In S14, the CPU 61 determines whether or not the drawing required time determined in S13 is 300 s or more. When the required drawing time is 300 s or more (S14: YES), the CPU 61 proceeds to S15. On the other hand, when the required drawing time is not 300 s or longer (S14: NO), the CPU 61 shifts the process to S16.

  In S <b> 15, the CPU 61 changes the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S <b> 3) to a light amount that is three steps lower. For example, when the register value related to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) is “3”, the CPU 61 is visible corresponding to “6” obtained by adding 3 to the acquired register value. The setting value is changed to a setting value relating to the amount of laser light M. When the register value exceeds the maximum value “10”, the CPU 61 changes the light amount of the visible laser beam M corresponding to the register value “10”. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  In step S16, the CPU 61 determines whether or not the required drawing time determined in step S13 is 180 seconds or longer. When the required drawing time is 180 s or more (S16: YES), the CPU 61 shifts the process to S17. On the other hand, when the required drawing time is not 180 seconds or more (S16: NO), the CPU 61 shifts the process to S18.

  In S <b> 17, the CPU 61 changes the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S <b> 3) to a light amount that is two steps smaller. For example, when the register value related to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) is “3”, the CPU 61 is visible corresponding to “5” obtained by adding 2 to the acquired register value. The setting value is changed to a setting value relating to the amount of laser light M. When the register value exceeds the maximum value “10”, the CPU 61 changes the light amount of the visible laser beam M corresponding to the register value “10”. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  In S18, the CPU 61 determines whether or not the required drawing time determined in S13 is 60 seconds or more. If the required drawing time is 60 seconds or more (S18: YES), the CPU 61 proceeds to S19. On the other hand, when the drawing required time is not 60 seconds or more (S18: NO), the CPU 61 executes the visible laser light amount correction processing program without changing the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3). finish.

  In S19, the CPU 61 changes the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) to a light amount that is lower by one step. For example, when the register value related to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) is “3”, the CPU 61 is visible corresponding to “4” obtained by adding 1 to the acquired register value. The setting value is changed to a setting value relating to the amount of laser light M. When the register value exceeds the maximum value “10”, the CPU 61 changes the light amount of the visible laser beam M corresponding to the register value “10”. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  With reference to FIG. 4 again, the processing content after the visible laser light amount correction processing (S4) will be described. In S <b> 5, the CPU 61 starts emitting the visible laser beam M by the visible semiconductor laser 28 and starts drawing the processing content based on the drawing data stored in the RAM 62. At this time, the CPU 61 outputs a DATA signal to the visible light laser driver 58, and based on the duty ratio of the DATA signal determined in the visible laser light quantity acquisition process (S3) or the visible laser light quantity correction process (S4). Then, on / off control of the visible semiconductor laser 28 in the first period Td is started.

  In S <b> 6, the CPU 61 starts outputting the EN signal to the visible light laser driver 58 at the same time as outputting the DATA signal to the visible light laser driver 58. That is, the CPU 61 performs on / off control of the visible semiconductor laser 28 in units of the second period Te based on the duty ratio of the EN signal determined in the visible laser light quantity acquisition process (S3) or the visible laser light quantity correction process (S4). Start.

  Thereby, the CPU 61 processes the drawing data with the light amount of the visible laser light M based on the duty ratio of the DATA signal and the EN signal determined in the visible laser light amount acquisition processing (S3) or the visible laser light amount correction processing (S4). Start drawing. Thereafter, the CPU 61 returns the process to S1, measures the environmental temperature of the visible semiconductor laser 28 with the temperature sensor 65, and draws the processing content of the drawing data with the visible laser light M with the light amount corresponding to the measured temperature. Take control.

  Note that the visible laser light lighting processing program shown in FIG. 4 can be configured to execute S1 again after S6 is completed, and repeat the processing of S1 to S6. In the case of executing the process, a predetermined operation may be performed as a condition. For example, when a predetermined operation using the input operation unit 71 of the PC 7 is performed, the processing content can be drawn again with the visible laser light M.

  As described above, the laser processing apparatus 1 according to the first embodiment includes the laser oscillation unit 12 and the excitation semiconductor laser unit 40, the galvano scanner 19, the visible semiconductor laser 28, the temperature sensor 65, and the laser controller 5. The processing object W is processed with the processing content based on the drawing data stored in the RAM 62 of the laser controller 5 using the laser light L emitted from the laser oscillation unit 12 under the control of the laser controller 5. Is possible. Further, the laser processing apparatus 1 uses the visible laser light M emitted from the visible semiconductor laser 28 under the control of the laser controller 5 to process the processing content based on the drawing data stored in the RAM 62 of the laser controller 5. The image can be drawn on the object W, and the processing content can be confirmed before the actual processing.

  Here, when the surroundings of the visible semiconductor laser 28 are in a high temperature environment, the lifetime thereof tends to be shortened. Further, the visible semiconductor laser 28 generates more Joule heat and raises the ambient temperature as the amount of the visible laser beam M to be emitted increases. In this regard, according to the laser processing apparatus 1 of the first embodiment, a setting value is obtained in which the amount of light of the visible light laser decreases as the environmental temperature of the visible semiconductor laser 28 measured by the temperature sensor 65 increases (S3). ) Since the processing content of the drawing data is drawn on the workpiece W by the visible laser light M having a light quantity based on the acquired set value, the influence of temperature such as Joule heat is reduced, and the lifetime of the visible semiconductor laser 28 is reduced. Shortening can be suppressed.

  Moreover, in the laser processing apparatus 1 of 1st Embodiment, as shown in FIG. 5, FIG. 7, when it is judged that the environmental temperature of the visible semiconductor laser 28 is 41 degreeC or more, CPU61 is visible laser beam. When the duty ratio of the DATA signal among the control signals for controlling the light quantity of M is decreased as the environmental temperature of the visible semiconductor laser 28 is higher, the light quantity of the visible laser light M is not higher than 41 ° C. The processing content is drawn on the processing target W by reducing the amount of light (see FIG. 6).

  Here, the visible laser beam M performs a function of transmitting the processing content to the user by drawing the processing content based on the drawing data on the processing object W. If the amount of visible laser light M is large, the processing content can be drawn clearly, but the generated Joule heat increases. On the other hand, as the amount of visible laser light M decreases, the generated Joule heat also decreases along with the clarity of the processing content drawn on the processing object W.

  That is, according to the laser processing apparatus 1, the duty ratio in the first period Td is decreased as the environmental temperature of the visible semiconductor laser 28 is increased, so that the processing content drawn by the visible laser beam M can be made as clear as possible. The amount of visible laser light M can be reduced so that the influence of the ambient temperature and Joule heat on the lifetime of the visible semiconductor laser 28 can be kept small while maintaining.

  Further, in the laser processing apparatus 1 of the first embodiment, as shown in FIGS. 5 and 8, when it is determined that the environmental temperature of the visible semiconductor laser 28 is 51 ° C. or higher, the CPU 61 outputs a DATA signal. In addition to the on / off control of the visible semiconductor laser 28 based on this, the duty ratio of the EN signal is made smaller as the environmental temperature of the visible semiconductor laser 28 is higher, and the amount of the visible laser light M is changed only by the on / off control based on the DATA signal. The processing content is drawn on the processing target W less than the case where the processing is performed (see FIG. 7).

  That is, according to the laser processing apparatus 1, when the ambient temperature of the visible semiconductor laser 28 is higher than 51 ° C., the amount of visible laser light M can be further reduced. And the shortening of the lifetime of the visible light laser light source can be further suppressed. Further, according to the laser processing apparatus 1, even when the environmental temperature of the visible semiconductor laser 28 is 51 ° C. or higher, the environmental temperature and the processing temperature are maintained while maintaining the clarity of the processing content drawn by the visible laser light M as much as possible. The influence of Joule heat on the lifetime of the visible semiconductor laser 28 can be reduced.

  Furthermore, in the laser processing apparatus 1 of the first embodiment, the CPU 61 executes the visible laser light amount correction process (S4), and calculates the drawing time required for drawing the processing content based on the drawing data with the visible laser light M. Calculate (S13). Here, as the time required for drawing is longer, the visible laser beam M is emitted, and the time during which Joule heat is generated in the visible semiconductor laser 28 becomes longer. That is, as the time required for drawing increases, the temperature of the visible semiconductor laser 28 also increases, and the lifetime of the visible semiconductor laser 28 may be shortened. According to the laser processing apparatus 1, the longer the calculated drawing time is, the smaller the light amount of the visible laser light M is set to be smaller than the light amount set value obtained in the visible laser light amount acquisition process (S3). Since the value is changed to the value (S15, S17, S19), the light amount of the visible laser light M can be set to a light amount that takes into account the temperature rise associated with the drawing of the processing content during the drawing required time. The shortening of the lifetime can be suppressed.

(Second Embodiment)
Next, an embodiment (second embodiment) different from the above-described first embodiment will be described in detail with reference to the drawings. The laser processing apparatus 1 related to the second embodiment has the same basic configuration as the laser processing apparatus 1 related to the first embodiment, and the processing content of the visible laser light amount correction processing program is different. Accordingly, the description of the same configuration and processing contents as in the first embodiment is omitted.

(Processing content of the visible laser light intensity correction processing program)
Here, the contents of the visible laser light amount correction processing program in the second embodiment will be described in detail with reference to FIG. Also in the second embodiment, the CPU 61 executes the processing of S1 to S3 shown in FIG. 4 and based on the temperature data in the vicinity of the visible semiconductor laser 28 and the visible laser light quantity selection table (see FIG. 5). A set value of the light amount of the visible laser beam M when drawing the processing content based on the drawing data on the workpiece W is acquired. That is, the CPU 61 proceeds to the visible laser light amount correction process (S4) after performing the same processes S1 to S3 as in the first embodiment.

  In the visible laser light amount correction processing (S4) in the second embodiment, the CPU 61 executes the visible laser light amount correction processing program shown in FIG. The accumulated accumulated usage time is read, and based on the accumulated usage time, the set value relating to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) is corrected.

  As shown in FIG. 10, the CPU 61 first reads the accumulated usage time when the visible laser beam M is emitted by the visible semiconductor laser 28 from the RAM 62 (S21). The accumulated usage time is measured by counting the number of clocks during a period in which the visible semiconductor laser 28 is on-controlled and the visible laser beam M is emitted based on the DATA signal and the EN signal. That is, the CPU 61 measures the accumulated usage time and stores it in the RAM 62 in parallel with the on-control of the visible semiconductor laser 28. After reading the accumulated usage time, the CPU 61 shifts the processing to S22.

  In S22, the CPU 61 determines whether or not the accumulated usage time is 200,000 hours or more. When the accumulated usage time is 200,000 hours or more (S22: YES), the CPU 61 shifts the process to S23. On the other hand, when the accumulated usage time is not 200,000 hours or more (S22: NO), the CPU 61 shifts the processing to S24.

  When the process proceeds to S23, the CPU 61 changes the set value related to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) to a light amount that is smaller by three steps, similarly to S15 in the first embodiment. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  In S24, the CPU 61 determines whether or not the accumulated usage time is 100,000 hours or more. When the accumulated usage time is 100,000 hours or more (S24: YES), the CPU 61 shifts the process to S25. On the other hand, when the accumulated usage time is not 100,000 hours or more (S24: NO), the CPU 61 proceeds to S26.

  In S25, as in S17 in the first embodiment, the CPU 61 changes the set value relating to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) to a light amount that is less by two steps. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  After shifting to S26, the CPU 61 determines whether or not the accumulated usage time is 40,000 hours or more. Here, the maximum light amount of the visible semiconductor laser 28 is 3 mW (see FIGS. 6 to 8). Then, when the driving for irradiating the visible semiconductor laser 28 with a light amount of 3 mW is continued under the condition that the ambient temperature in the vicinity of the visible semiconductor laser 28 is 70 ° C., when about 40,000 hours have elapsed from the start of the irradiation of the visible laser light M. It is known that the visible semiconductor laser 28 fails with a probability of 50%. In S26, in view of these points, it is determined whether or not the cumulative usage time is 40,000 hours or more. When the accumulated usage time is 40,000 hours or more (S26: YES), the CPU 61 shifts the process to S27. On the other hand, when the accumulated usage time is not 40,000 hours or more (S26: NO), the CPU 61 performs visible laser light amount correction processing without changing the light amount of the visible laser light M acquired in the visible laser light amount acquisition processing (S3). Exit the program.

  In S27, as in S19 in the first embodiment, the CPU 61 changes the set value related to the light amount of the visible laser light M acquired in the visible laser light amount acquisition process (S3) to a light amount less by one step. After storing the changed amount of visible laser light M in the RAM 62, the CPU 61 ends the visible laser light amount correction processing program.

  Also in the second embodiment, the CPU 61 completes the visible laser light quantity correction process (S4), and then executes the processes of S5 and S6, thereby performing the visible laser light quantity acquisition process (S3) or the visible laser light quantity correction process (S4). The drawing of the processing content of the drawing data is started with the light amount of the visible laser beam M based on the duty ratio of the DATA signal and the EN signal determined in (1). After finishing S6, the CPU 61 returns the process to S1, thereby measuring the ambient temperature of the visible semiconductor laser 28 with the temperature sensor 65, and processing the processing content of the drawing data with the amount of light corresponding to the measured temperature. Control to draw by M is performed.

  As described above, the laser processing apparatus 1 according to the second embodiment uses the laser light L emitted from the laser oscillation unit 12 under the control of the laser controller 5 in the same manner as in the first embodiment. The processing object W can be processed with the processing content based on the drawing data stored in the RAM 62 of the laser controller 5 and simultaneously stored in the RAM 62 of the laser controller 5 using the visible laser light M emitted from the visible semiconductor laser 28. The machining content based on the rendered data can be drawn on the workpiece W.

  Also in the laser processing apparatus 1 of the second embodiment, the set value is obtained such that the higher the environmental temperature of the visible semiconductor laser 28 measured by the temperature sensor 65 is, the smaller the light amount of the visible light laser is (S3). Since the processing content based on the drawing data is drawn on the workpiece W by the visible laser beam M based on the set value, the influence of temperature such as Joule heat is reduced, and the lifetime of the visible semiconductor laser 28 is shortened. Can be suppressed.

  Also in the laser processing apparatus 1 of the second embodiment, as shown in FIGS. 5 and 7, when it is determined that the environmental temperature of the visible semiconductor laser 28 is 41 ° C. or higher, the CPU 61 When the duty ratio of the DATA signal among the control signals for controlling the light quantity of M is decreased as the environmental temperature of the visible semiconductor laser 28 is higher, the light quantity of the visible laser light M is not higher than 41 ° C. The processing content is drawn on the processing target W by reducing the amount of light (see FIG. 6).

  That is, according to the laser processing apparatus 1, the light amount of the visible laser light M is drawn by the visible laser light M by reducing the duty ratio in the first period Td as the environmental temperature of the visible semiconductor laser 28 is higher. The amount of light that can suppress the influence of the ambient temperature and Joule heat on the lifetime of the visible semiconductor laser 28 can be reduced while maintaining the clarity of the processing content to be maintained.

  Furthermore, also in the laser processing apparatus 1 of the second embodiment, as shown in FIGS. 5 and 8, when it is determined that the environmental temperature of the visible semiconductor laser 28 is 51 ° C. or higher, the CPU 61 outputs a DATA signal. In addition to the on / off control of the visible semiconductor laser 28 based on this, the duty ratio of the EN signal is made smaller as the environmental temperature of the visible semiconductor laser 28 is higher, and the amount of the visible laser light M is changed only by the on / off control based on the DATA signal. The processing content is drawn on the processing target W less than the case where the processing is performed (see FIG. 7).

  That is, according to the laser processing apparatus 1, when the ambient temperature of the visible semiconductor laser 28 is higher than 51 ° C., the amount of visible laser light M can be further reduced. And the shortening of the lifetime of the visible light laser light source can be further suppressed. Further, according to the laser processing apparatus 1, even when the environmental temperature of the visible semiconductor laser 28 is 51 ° C. or higher, the environmental temperature and the processing temperature are maintained while maintaining the clarity of the processing content drawn by the visible laser light M as much as possible. The influence of Joule heat on the lifetime of the visible semiconductor laser 28 can be reduced.

  Furthermore, in the laser processing apparatus 1 of the second embodiment, the CPU 61 executes a visible laser light amount correction process (S4), and reads the accumulated usage time of the visible semiconductor laser 28 (S21). Here, it is known that the longer the cumulative usage time of the visible semiconductor laser 28 is, the higher the possibility of failure due to an increase in environmental temperature. According to the laser processing apparatus 1, the longer the measured accumulated usage time, the light amount of the visible laser light M is set to a set value indicating a light amount smaller than the set value of the light amount acquired in the visible laser light amount acquisition process (S 3). Since the change is made (S23, S25, S27), the amount of visible laser light M can be set in consideration of the possibility that the visible semiconductor laser 28 will break down as the cumulative use time becomes longer. The shortening of the lifetime of the semiconductor laser 28 can be suppressed.

  In the embodiment described above, the laser processing apparatus 1 is an example of a laser processing apparatus in the present invention. The laser oscillation unit 12 and the pumping semiconductor laser unit 40 are an example of an emission unit in the present invention, and the guide light unit 16 is an example of a visible light laser light source in the present invention. The temperature sensor 65 is an example of a measurement unit in the present invention, and the galvano scanner 19 is an example of a scanning unit in the present invention. The RAM 62 is an example of a storage unit in the present invention, and the CPU 61 is an example of a control unit in the present invention.

  Although the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and various improvements and modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the visible laser light quantity acquisition process and the visible laser light quantity correction process are executed using the visible laser light quantity selection table (see FIG. 5), but the present invention is not limited to this aspect. .

  For example, in the visible laser light amount acquisition process, it is only necessary to acquire a smaller value as the light amount of the visible laser light M as the environmental temperature of the visible semiconductor laser 28 is higher. The configuration may be such that the amount of visible laser light M is calculated using the ambient temperature.

  Similarly, in the visible laser light amount correction process, it is only necessary to correct the light amount of the visible laser light M so that the longer the required drawing time or the accumulated use time is, the various modes can be adopted. For example, the correction amount (that is, the reduction width) of the visible laser beam M may be calculated using the required drawing time or the accumulated usage time.

  In the above-described embodiment, 41 ° C. is used as the first temperature and 51 ° C. is used as the second temperature in the present invention. However, the present invention is not limited to this value. The first temperature and the second temperature in the present invention need only be higher than the first temperature, and can be appropriately determined according to conditions such as the configuration or type of the visible semiconductor laser 28.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Laser processing apparatus main-body part 3 Laser head part 5 Laser controller 6 Power supply unit 12 Laser oscillation unit 16 Guide light part 19 Galvano scanner 28 Visible semiconductor laser 61 CPU
62 RAM
63 ROM
65 Temperature sensor L Laser light M Visible laser light W Work object

Claims (8)

An emission part for emitting a laser for processing the object to be processed;
A storage unit for storing drawing data indicating the processing content by the laser;
A visible laser beam source that emits a visible laser beam to indicate the processing content on the workpiece;
A measuring unit for measuring the environmental temperature of the visible light laser source;
A scanning unit that scans the laser emitted from the emission unit or the visible light laser emitted from the visible light laser source; and
A control unit for controlling the emission unit, the visible light laser light source, and the scanning unit based on the drawing data stored in the storage unit;
The controller is
The higher the ambient temperature of the visible light laser light source measured by the measuring unit, the lower the light amount of the visible light laser is obtained.
The visible light laser light source and the scanning unit are controlled so that the processing content based on the drawing data is drawn on the processing object with a light amount corresponding to the acquired setting value of the visible light laser. Laser processing equipment. The controller is
Determining whether the ambient temperature of the visible light laser light source measured by the measurement unit is equal to or higher than a predetermined first temperature;
When it is determined that the environmental temperature is not equal to or higher than the first temperature, the visible light laser is irradiated with a predetermined light amount,
When it is determined that the environmental temperature is equal to or higher than the first temperature, the visible light laser light source is turned on / off in a predetermined first cycle unit so that the light amount of the visible light laser is more than the predetermined light amount. The laser processing apparatus according to claim 1, wherein the number is reduced. The controller is
When it is determined that the ambient temperature of the visible light laser light source measured by the measuring unit is equal to or higher than the first temperature, a duty ratio indicating a ratio of an on period of the visible light laser light source within the first period 3. The laser processing apparatus according to claim 2, wherein the amount of light of the visible light laser is reduced by decreasing the temperature as the environmental temperature is higher. The controller is
Determining whether the environmental temperature of the visible light laser light source measured by the measurement unit is equal to or higher than a second temperature higher than the first temperature;
When it is determined that the environmental temperature is equal to or higher than the second temperature, in addition to the on / off control of the visible light laser light source in the first cycle unit, the visible light in a second cycle unit longer than the first cycle. 4. The on / off control of a laser light source makes the amount of light of the visible light laser smaller than the amount of light when only on / off control by the first period unit is performed. The laser processing apparatus as described. The controller is
When it is determined that the ambient temperature of the visible light laser light source measured by the measurement unit is equal to or higher than the second temperature, a duty ratio indicating a ratio of an on period of the visible light laser light source within the second period 5. The laser processing apparatus according to claim 4, wherein the amount of light of the visible light laser is reduced by decreasing the temperature as the environmental temperature is higher. The controller is
Based on the drawing data stored in the storage unit, calculate the drawing time required to draw the processing content based on the drawing data by the visible light laser,
The light amount of the visible light laser is changed to a light amount smaller than a light amount corresponding to a set value acquired based on the environmental temperature as the calculated drawing time is longer. The laser processing apparatus according to claim 5. The controller is
Measure the cumulative usage time irradiated with the visible light laser,
6. The light amount of the visible light laser is changed to a light amount smaller than a light amount corresponding to a set value acquired based on the environmental temperature as the cumulative usage time is longer. The laser processing apparatus in any one. 8. The laser processing apparatus according to claim 1, wherein the light amount is a sum of electric power consumed per unit time by the visible light laser light source. 9.

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