JP2016063098A - Component mounting apparatus, mounting stage, and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of mounting an electronic component of low heat resistance by suppressing reheating.SOLUTION: The component mounting apparatus suppresses reheating with heat heated by laser light by providing a contact surface with a substrate 10 with a heat conduction changing part 50 of heat conductivity lower than heat conductivity of a base material 21 of a mounting stage 20 for holding the substrate 10 by being in contant with the substrate 10 in accordance with a portion at which a mounting component 30 is mounted on the substrate 10 when melting solder 40 at a lower part of the mounting component 30 with the laser light.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting apparatus, a mounting stage, and a component mounting method that can mount an electronic component with low heat resistance.

  In recent years, along with social trends such as the development of the Internet environment and the suppression of power consumption, electronic devices are required to be smaller, thinner, larger in capacity, and more multifunctional. In the mounting area of electronic devices, the density of component mounting is increasing.

  Under such circumstances, various components having different heat resistance temperatures, such as ICs (Integrated Circuits), sensors, and connectors, are mounted at high density on a substrate of an electronic device. Temperature management when mounting various parts at high density is complicated. In general, components with a high heat resistance temperature are heat-mounted first, and components with a low heat resistance temperature are heat-mounted later. For example, for the sake of productivity, parts having a high heat-resistant temperature are collectively heat-bonded by a reflow method, and components having low heat-resistant temperatures to be mounted later are individually heat-bonded by a soldering iron or a pulse heat method. At this time, individually heating components to be mounted later has a risk that the joint portion of the component mounted earlier is reheated. By reheating the joint part of components, there exists a possibility that the joint quality and reliability of a joint part may fall. That is, there is a problem that the risk due to reheating increases as the density of component mounting increases.

  Patent Document 1 discloses a soldering method by light irradiation. The technique of Patent Document 1 is a technique for adjusting the amount of light irradiation for each component by a light receiving amount adjusting member and uniformizing unevenness in soldering temperature due to light irradiation.

  Patent Document 2 discloses an apparatus for soldering a component to a flexible substrate by a reflow method. In the technique of Patent Document 2, a through hole is provided in a substrate holding plate that holds a flexible substrate on which a heat resistant component and a weak heat resistant component are mounted, corresponding to a part to be soldered of the weak heat resistant component. The technique of Patent Document 2 is a technique for mounting a weak heat-resistant component by direct irradiation with infrared rays through a through hole when soldering the heat-resistant component by a reflow method.

  Patent Document 3 discloses a system for soldering a component to a flexible substrate by a reflow method. Specifically, in the technique of Patent Document 3, a cavity is provided in a pallet holding a flexible substrate, and heat is absorbed from the flexible substrate held by the pallet by the phase change material in the cavity.

  Patent Document 4 discloses a component mounting apparatus that brazes components. The technique of Patent Document 4 is a technique for suppressing a temperature difference between a portion that is locally heated and its surroundings when brazing a component.

  Patent Document 5 discloses a component mounting method by laser light irradiation. In the technique of Patent Document 5, a conversion element that converts the wavelength of laser light is provided at a predetermined position on a substrate. In the technique of Patent Document 5, at a predetermined position of a substrate, for example, the wavelength of laser light is converted by a conversion element, and for example, an insulating resin is solidified to mount a component. In the technique of Patent Document 5, a component is mounted by melting the solder, for example, by transmitting the wavelength of the laser beam as it is at another position of the substrate. That is, the technique of Patent Document 5 is a technique for realizing component mounting using a plurality of bonding materials depending on the presence or absence of a conversion element that converts the wavelength of laser light.

JP 2009-054749 A (page 5-7, FIGS. 1 and 2) Japanese Patent Laying-Open No. 2006-040920 (page 4-7, FIG. 1) JP 2004-511091 A (page 4-7, FIG. 2b) Japanese Patent Laying-Open No. 2004-290993 (page 4-6, FIG. 1) Japanese Patent Laid-Open No. 9-260820 (2nd and 3rd pages, FIGS. 2 and 3)

  The technique of Patent Document 1 is to uniformize the unevenness of the soldering temperature due to light irradiation and perform soldering in a lump, and does not mount electronic components with low heat resistance.

  The technology of Patent Document 2 provides a through hole in the substrate holding plate of the flexible substrate and irradiates infrared rays to shorten the soldering time of the weak heat-resistant component, and collectively when the reflow soldering of the heat-resistant component is performed. This is a soldering technique. However, the technique of Patent Document 2 does not mount an electronic component with low heat resistance, which does not allow reflow soldering.

  The technique of Patent Document 3 is a technique for ensuring dimensional stability by absorbing heat from a flexible board held by a pallet during reflow to prevent softening of the flexible board. The technique of Patent Document 4 is a technique for reducing the occurrence of residual stress due to the thermal expansion of members joined by local heating, reduction in strength, damage, and the like by suppressing the temperature difference between the local heating site and its surroundings. The techniques of Patent Documents 3 and 4 are techniques for equalizing the temperature of the part mounting region and the surrounding temperature, as in Patent Document 1, and do not mount electronic components with low heat resistance.

  The technique of patent document 5 is a technique which implement | achieves the component mounting by a some joining raw material using the conversion element which converts the wavelength of a laser beam.

  As described above, the techniques of Patent Documents 1 to 5 have a problem that electronic components with low heat resistance cannot be mounted.

  An object of the present invention is to provide a component mounting apparatus, a mounting stage, and a component mounting method capable of mounting an electronic component with low heat resistance while suppressing reheating.

  In the component mounting apparatus of the present invention, the first thermal conductivity change of the first member having a lower thermal conductivity than the base material of the mounting stage that holds the first mounting component in contact with the substrate in correspondence with the portion where the first mounting component is mounted on the substrate. The portion is provided on the contact surface with the substrate.

  The mounting stage of the present invention corresponds to a portion where the first mounting component is mounted on the substrate, and the first heat conduction changing portion of the first member having a lower thermal conductivity than the base material of the mounting stage that is in contact with the substrate and holds it. Is provided on the contact surface with the substrate.

  The component mounting method of the present invention mounts the first mounting component of the mounting stage on the first mounting component of the first member having a lower thermal conductivity than the base material of the mounting stage held in contact with the substrate. It is provided on the contact surface with the substrate corresponding to the part, and the first component is mounted by heating the bonding material of the first mounting component.

  According to the present invention, it is possible to mount an electronic component with low heat resistance while suppressing reheating.

It is a section explanatory view showing the example of composition of the component mounting device of a 1st embodiment of the present invention. It is sectional explanatory drawing which showed the structural example of the component mounting apparatus of the 2nd Embodiment of this invention. It is sectional explanatory drawing which showed the structural example of the component mounting apparatus of the 3rd Embodiment of this invention. It is sectional explanatory drawing which showed the structural example of the component mounting apparatus of the 4th Embodiment of this invention. It is sectional explanatory drawing which showed the structural example of the component mounting apparatus of the 5th Embodiment of this invention.

Embodiments of the present invention will be described below in detail with reference to the drawings.
(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is an explanatory cross-sectional view showing a configuration example of a component mounting apparatus 101 according to the first embodiment of the present invention.

  With reference to FIG. 1, the component mounting apparatus 101 of this embodiment is demonstrated. In the component mounting apparatus 101, laser light output by a laser oscillation unit (not shown) is guided by a laser light guiding unit (not shown, for example, an optical fiber), and is irradiated from the laser irradiation unit 110 to the outside.

  The laser light emitted from the laser irradiation unit 110 melts the solder 40 under the mounting component 30 of the substrate 10 held on the mounting stage 20. When the laser irradiation of the laser irradiation unit 110 is stopped, the solder 40 under the mounting component 30 is solidified. Thus, the mounting component 30 is mounted on the substrate 10 by the laser light from the laser irradiation unit 110.

  The mounting stage 20 is held by an XY stage (not shown) that moves in the X and Y directions in the horizontal plane. The mounting stage 20 includes a filling portion 22 penetrating the mounting stage base material 21 corresponding to the mounting position of the mounting component 30 on the substrate 10. The filling unit 22 is provided on the mounting stage 20 as a heat conduction changing unit 50 filled with a member having a lower thermal conductivity than the mounting stage base material 21.

  The substrate 10 includes a substrate base material 11, a mounting surface conduction part 12 for mounting components, and a back surface conduction part 13. The peripheral component 31 and the peripheral component 32 are already mounted on the mounting surface side on the substrate 10. A Z stage (not shown) that moves in the vertical direction is provided with a gripping part (not shown) that grips a mounted component by a method such as suction. The mounting component 30 is gripped by the gripping portion, moved vertically downward, and placed on the mounting position of the mounting portion 30 of the substrate 10. The mounting component 30 is a post-installation component having low heat resistance, and the solder 40 is melted by the laser light from the laser irradiation unit 110 and joined to the mounting surface conduction unit 12 at the mounting position.

  At this time, the solder 40 under the mounting component 30 is heated by the laser beam, and the applied heat is thermally conducted to the periphery. Since the heat conduction changing portion 50 below the mounting component 30 has a lower thermal conductivity than the surrounding mounting stage base material 21, the heat applied to the solder 40 below the mounting component 30 is maintained. On the other hand, since the mounting stage base material 21 around the heat conduction changing unit 50 has a higher thermal conductivity than the heat conduction changing unit 50, the conduction of the heat applied to the solder 40 to the periphery is the peripheral mounting stage base. To the material 21. Therefore, the heat applied by the laser light is effectively held by melting the solder 40 below the mounting component 30, and the other heat is mostly transferred to the peripheral mounting stage base material 21, and the joints between the peripheral components 31 and 32. Reheating to is reduced.

  As described above, the mounting stage of the present embodiment includes a heat conduction changing unit in which a filling unit provided in the mounting stage base material is filled with a member having a lower thermal conductivity than the mounting stage base material. The heat conduction changing portion is provided corresponding to the mounting component, and promotes mounting of the mounting component by maintaining heat applied to the bonding material of the mounting component. On the other hand, the conduction of heat applied to the bonding material of the mounted component to the periphery is performed on the mounting stage base material around the heat conduction changing portion, so that reheating to the peripheral components is suppressed. For this reason, the risk of deterioration of the bonding quality due to reheating of the peripheral parts to the bonded portion is reduced.

  As described above, the component mounting apparatus of this embodiment can mount an electronic component with low heat resistance while suppressing reheating.

  In the present embodiment, the material of the mounting stage base material is not limited, but generally metals and alloys such as iron, copper, and aluminum are applied. The member filled in the filling portion of the mounting stage as the heat conduction changing portion may be any member having a lower thermal conductivity than the mounting stage base material. For example, glass or air may be used.

  In the present embodiment, the number of heat conduction change units is described as one, but the number of heat conduction change units is not limited as long as the number is one or more. That is, the heat conduction changing unit may be provided on the mounting stage corresponding to the mounted component.

  Moreover, in this embodiment, the shape in the mounting stage surface of a heat conduction change part is not limited. For example, the heat conduction changing portion may have a shape along the outer shape projected on the substrate surface of the mounting component, or may have a shape along the terminal outer shape of the mounting component. That is, the surface shape of the heat conduction changing portion may not overlap with the surface shape of the heat conduction changing portion of another mounting component or the mounting site of another mounting component.

  Also. In the present embodiment, it has been described that the mounting stage is held by the XY stage. However, the mounting stage is not limited to being held on the XY stage. For example, the mounting stage may be held on a rotary stage having a vertical axis as a rotation axis. That is, it is sufficient if the mounting stage holding the substrate is further held, and it may be a transfer stage that moves the mounting stage, or a fixed stage that does not move. In the case of the fixed stage, the laser irradiation unit may be moved to a predetermined position where the bonding material of the mounted component can be melted.

Moreover, in this embodiment, it demonstrated that the Z stage provided with the holding part which hold | grips a mounting component was provided. However, the grip portion and the Z stage may not be provided. It is only necessary that the mounting component is placed in alignment with the mounting position of the substrate held on the mounting stage. For example, the mounting component may be placed on the board with a robot hand or hand.
(Second Embodiment)
A second embodiment of the present invention will be described. FIG. 2 is an explanatory cross-sectional view showing a configuration example of the component mounting apparatus 102 according to the second embodiment of the present invention.

  With reference to FIG. 2, the component mounting apparatus 102 of this embodiment is demonstrated. In the component mounting apparatus 102, the mounting stage 20 described in FIG. 1 is changed to the mounting stage 23, the filling unit 22 is changed to the filling unit 24, and the heat conduction changing unit 50 is changed to the heat conduction changing unit 51. This is different from the embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and changes will be described.

  The filling portion 24 is a recess provided at a predetermined depth from the surface of the mounting stage 23 corresponding to the mounting position of the mounting component 30 on the substrate 10. The concave portion which is the filling portion 24 is provided on the mounting stage 23 as a heat conduction changing portion 25 filled with a member having a lower thermal conductivity than the mounting stage 23. In addition, the recessed part of the filling part 24 does not need to be filled. The concave portion of the filling portion 24 is provided as a heat conduction changing portion 51 having a thermal conductivity lower than that of the mounting stage base material 21.

  As described above, in this embodiment, the concave portion, which is the filling portion provided in the mounting stage base material, serves as a heat conduction changing portion having a lower thermal conductivity than the mounting stage base material, and heat applied to the bonding material of the mounting component. Maintain and promote mounting of mounting components. On the other hand, the conduction of heat applied to the bonding material of the mounted component to the periphery is performed on the mounting stage base material around the heat conduction changing portion, so that reheating to the peripheral components is suppressed. For this reason, the risk of deterioration of the bonding quality due to reheating of the peripheral parts to the bonded portion is reduced. Furthermore, in this embodiment, since the filling amount of the member into the filling portion can be reduced or the filling step can be eliminated, the manufacturing cost of the mounting stage can be reduced.

  As described above, the component mounting apparatus according to the present embodiment can mount an electronic component with low heat resistance while suppressing reheating as in the first embodiment. This embodiment can reduce the manufacturing cost of the mounting stage.

In the present embodiment, the filling portion has been described as a concave portion having a predetermined depth from the mounting stage. However, the filling portion may be a through hole provided in the mounting stage. That is, the same effect can be obtained even if the filling portion and the heat conduction changing portion are left as through holes. Moreover, the manufacturing cost of the mounting stage can be further reduced by leaving the filling portion as a through hole.
(Third embodiment)
A third embodiment of the present invention will be described. FIG. 3 is an explanatory cross-sectional view showing a configuration example of the component mounting apparatus 103 according to the third embodiment of the present invention.

  With reference to FIG. 3, the component mounting apparatus 103 of this embodiment is demonstrated. In the component mounting apparatus 103, the mounting stage 20 described in FIG. 1 is changed to the mounting stage 25, the heat conduction changing unit 50 is changed to the heat conduction changing unit 52, and the cooling flow path 63 is added to the mounting stage base material 21. This is different from the first embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and changes will be described.

  The filling portion 22 is a through hole that penetrates the mounting stage 25 corresponding to the mounting position of the mounting component 30 of the substrate 10. The through hole which is the filling portion 22 is provided in the mounting stage 25 as a heat conduction changing portion 52 having a lower thermal conductivity than the mounting stage 25.

  A portion of the mounting stage 25 excluding the filling portion 22 is provided with a cooling flow path 63 for flowing the cooling medium, including an inlet 61 and a discharge port 62 for allowing the cooling medium to flow in.

  Heat conduction to the periphery of the heat that heats the solder 40 under the mounting component 30 is performed on the mounting stage base material 21 around the heat conduction changing portion 52. The heat transferred to the mounting stage base material 21 is transferred from the inlet 61 to the cooling medium flowing in the cooling flow path 63. The heat transferred to the cooling medium is exhausted to the outside through the discharge port 62. Further, the mounting stage base material 21 itself is cooled by the cooling medium flowing in from the inlet 61. Therefore, reheating to the peripheral components 31 and 32 located around the mounting component 30 is further suppressed. Note that a pump for flowing the cooling medium, a radiating fin for discarding the heat of the cooling medium, a pipe for circulating the cooling medium outside, and the like are not shown.

  As described above, in this embodiment, the heat conduction to the periphery of the heat for heating the bonding material of the mounting component is performed by causing the cooling medium to flow in the cooling flow path provided in the mounting stage base material. Is carried out on the mounting stage base material and the cooling medium in the vicinity of. The heat transferred to the cooling medium is carried to the outside by the cooling medium and exhausted. Since the mounting stage base material itself is cooled by the cooling medium, reheating to the peripheral components is further suppressed. For this reason, the risk of deterioration of the bonding quality due to the reheating of the peripheral parts to the bonded portion is further reduced. Also, even when multiple mounting components are mounted in sequence, the cooling effect of the mounting stage is enhanced, so heat storage on the substrate base material and mounting stage base material is suppressed, and the risk of reheating is reduced. .

  As described above, the component mounting apparatus according to the present embodiment can mount an electronic component with low heat resistance while suppressing reheating as in the first and second embodiments. Furthermore, since this embodiment improves the cooling effect of the mounting stage, it is possible to reduce the risk of reheating the peripheral components.

In addition, the cooling medium of this embodiment should just be a thing which can flow the cooling flow path of a mounting stage and can cool a mounting stage. For example, the cooling medium may be water or a gel fluid, or may be a gas of a specific element.
(Fourth embodiment)
A fourth embodiment of the present invention will be described. FIG. 4 is an explanatory cross-sectional view showing a configuration example of the component mounting apparatus 104 according to the fourth embodiment of the present invention.

  With reference to FIG. 4, the component mounting apparatus 104 of this embodiment is demonstrated. In the component mounting apparatus 104, the laser irradiation unit 110 of FIG. 1 is the laser irradiation unit 111, the mounting stage 20 is the mounting stage 26, the filling unit 22 is the filling unit 27, and the heat conduction changing unit 50 is the heat conduction changing unit 53. The substrate 10 is changed to the substrate 14, which is different from the first embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and changes will be described.

  In the component mounting apparatus 104, the laser beam output from the laser oscillation unit (not shown) is guided by the laser beam guiding unit (not shown) and is irradiated to the outside from the laser irradiation unit 111. The laser light emitted from the laser irradiation unit 111 passes through the filling part 27 penetrating the mounting stage 20 and the hole 15 provided in the back surface conduction part 13 of the substrate 14, passes through the substrate base material 11, and is mounted. The lower solder 40 is melted. Therefore, the laser light emitted from the laser irradiation unit 111 is changed to a wavelength band that transmits the substrate base material 11 of the substrate 14, and a hole 15 is provided in the back surface conduction unit 13 of the substrate 14. The hole 15 is a laser light passage hole provided in the back surface conductive portion 13 for efficiency of heating by laser light, and is provided corresponding to the solder 40 below the mounting component 30. When the laser irradiation of the laser irradiation unit 111 is stopped, the solder 40 under the mounting component 30 is solidified. As described above, the mounting component 30 is mounted on the substrate 14 by the laser light from the laser irradiation unit 111.

  The filling portion 27 is a through hole that penetrates the mounting stage 26 corresponding to the mounting position of the mounting component 30 on the substrate 14. The through hole which is the filling portion 27 is also used as a heat conduction changing portion 53 having a lower thermal conductivity than the mounting stage 26 and also as a passage hole for laser light from the laser irradiation portion 111. Note that if the mounting stage 26 is held on, for example, an XY stage (not shown), the XY stage may be provided with a passing portion that allows the laser light from the laser irradiation unit 111 to pass therethrough.

  As described above, in this embodiment, the heat conduction changing portion provided in the mounting stage base material is also used as the laser light passing portion, and the bonding material is used with the laser beam in the wavelength band that transmits the substrate base material from the back surface of the substrate. The mounting component is mounted on the substrate by heating. For this reason, it is possible to ensure mounting quality free from damages of mounted components and substrates by laser light, solder scattering, and the like. Moreover, this embodiment can also suppress the reheating to the junction part of peripheral components similarly to the previous embodiment.

  As described above, the component mounting apparatus according to the present embodiment can mount an electronic component with low heat resistance while suppressing reheating as in the previous embodiments. Furthermore, this embodiment can improve mounting quality by heating from the back surface of the substrate.

In addition, it demonstrated that the filling part of this embodiment permeate | transmits the laser beam of a laser irradiation part as a through-hole which penetrates a mounting stage. However, the filling portion may be filled as long as it is a member that can transmit laser light. That is, the filling portion may be filled as long as it has a lower thermal conductivity than the mounting stage base material and has low reflection and high transmission with respect to the laser beam. For example, when the substrate base material is silicon, the laser light may be in the near infrared wavelength band, and the member filled in the filling portion may be quartz glass or the like.
(Fifth embodiment)
A fifth embodiment of the present invention will be described. FIG. 5 is an explanatory cross-sectional view showing a configuration example of a component mounting apparatus 105 according to the fifth embodiment of the present invention.

  With reference to FIG. 5, the component mounting apparatus 105 of this embodiment is demonstrated. The component mounting apparatus 105 is different from the fourth embodiment in that the mounting stage 26 described with reference to FIG. 4 is changed to a mounting stage 28 and a cooling flow path 63 is added to the mounting stage base material 21. Therefore, the same components as those in the fourth embodiment are denoted by the same reference numerals, description thereof will be omitted, and changes will be described.

  A portion of the mounting stage 28 excluding the filling portion 27 is provided with a cooling flow path 63 for flowing the cooling medium, which includes an inlet 61 and an outlet 62 for allowing the cooling medium to flow in.

  Heat conduction to the periphery of the heat for heating the solder 40 under the mounting component 30 is performed on the mounting stage base material 21 around the heat conduction changing portion 53. The heat transferred to the mounting stage base material 21 is transferred from the inlet 61 to the cooling medium flowing in the cooling flow path 63. The heat transferred to the cooling medium is exhausted to the outside through the discharge port 62. Further, the mounting stage base material 21 itself is cooled by the cooling medium flowing in from the inlet 61. Therefore, reheating to the peripheral components 31 and 32 located around the mounting component 30 is further suppressed. Note that a pump for flowing the cooling medium, a radiating fin for discarding the heat of the cooling medium, a pipe for circulating the cooling medium outside, and the like are not shown.

  As described above, in this embodiment, the heat conduction to the periphery of the heat for heating the bonding material of the mounting component is performed by causing the cooling medium to flow in the cooling flow path provided in the mounting stage base material. Is carried out on the mounting stage base material and the cooling medium in the vicinity of. The heat transferred to the cooling medium is carried to the outside by the cooling medium and is wasted. Since the mounting stage base material itself is cooled by the cooling medium, reheating to the peripheral components is further suppressed. For this reason, the risk of deterioration of the bonding quality due to the reheating of the peripheral parts to the bonded portion is further reduced. Also, even when multiple mounting components are mounted in sequence, the cooling effect of the mounting stage is enhanced, so heat storage on the substrate base material and mounting stage base material is suppressed, and the risk of reheating is reduced. .

  As described above, the component mounting apparatus according to the present embodiment can mount an electronic component with low heat resistance while suppressing reheating as in the fourth embodiment. Furthermore, since this embodiment enhances the cooling effect of the mounting stage, the risk of reheating the peripheral parts can be further reduced.

  In addition, the cooling medium of this embodiment should just be a thing which can flow the cooling flow path of a mounting stage and can cool a mounting stage. For example, the cooling medium may be water or a gel fluid, or may be a gas of a specific element.

  Note that the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit of the present invention.

  For example, the laser irradiation unit of the present invention may be provided on each of the mounting surface side and the back surface side of the substrate on which the mounting component is mounted, and the laser beam may be simultaneously irradiated onto the bonding material of the mounting component. The heating time is shortened by simultaneously heating the bonding material from both sides of the substrate, and the risk of reheating the peripheral components is further reduced.

DESCRIPTION OF SYMBOLS 10, 14 Board | substrate 11 Substrate base material 12 Mounting surface conduction | electrical_connection part 13 Back surface conduction | electrical_connection part 15 Hole 20, 23, 25, 26, 28 Mounting stage 21 Mounting stage base material 22, 24, 27 Filling part 30 Mounting parts 31, 32 Peripheral parts 40 Solder 50, 51, 52, 53 Thermal conduction changer 61 Inlet 62 Discharge 63 Cooling channel 101, 102, 103, 104, 105 Component mounting device 110, 111 Laser irradiation unit

Claims (10)

Corresponding to the portion where the first mounting component is mounted on the substrate, the first thermal conductivity changing portion of the first member having a lower thermal conductivity than the base material of the mounting stage that contacts and holds the substrate is in contact with the substrate. A component mounting apparatus provided on a surface. 2. The component mounting apparatus according to claim 1, wherein the first member is filled in a filling portion provided on the mounting stage with the first heat conduction changing portion. The component mounting apparatus according to claim 2, wherein the filling portion penetrates the base material. The component mounting apparatus according to claim 1, wherein the first member is air. A laser irradiation unit that irradiates a laser beam having a wavelength band that transmits the base material of the substrate;
The component mounting apparatus according to claim 1, wherein the first member transmits the laser light. 5. The component mounting apparatus according to claim 1, wherein the first heat conduction changing portion has a predetermined depth from the contact surface. A cooling flow path provided with an inflow port for allowing a cooling medium to flow in and a discharge port for discharging the cooling medium is provided in a portion excluding the filling portion of the mounting stage,
The component mounting apparatus according to claim 2, wherein the cooling medium is caused to flow inside the cooling flow path. Corresponding to the site where the second mounting component is mounted on the substrate, the second heat conduction changing portion of the first member,
The component mounting apparatus according to claim 1, further comprising a transfer stage that holds and moves the mounting stage. Corresponding to the portion where the first mounting component is mounted on the substrate, the first thermal conductivity changing portion of the first member having a lower thermal conductivity than the base material of the mounting stage that contacts and holds the substrate is in contact with the substrate. A mounting stage characterized by being provided on the surface. The substrate corresponding to a portion of the mounting stage on which the first mounting component is mounted on the substrate, the first heat conduction changing portion of the first member having a lower thermal conductivity than the base material of the mounting stage held in contact with the substrate And mounting the first component by heating the bonding material of the first mounting component.

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