JP2016059908A - Application method and application device - Google Patents

Application method and application device Download PDF

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JP2016059908A
JP2016059908A JP2014192510A JP2014192510A JP2016059908A JP 2016059908 A JP2016059908 A JP 2016059908A JP 2014192510 A JP2014192510 A JP 2014192510A JP 2014192510 A JP2014192510 A JP 2014192510A JP 2016059908 A JP2016059908 A JP 2016059908A
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application needle
application
tip
needle
liquid material
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JP6460694B2 (en
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博明 大庭
Hiroaki Oba
博明 大庭
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NTN Corp
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NTN Corp
NTN Toyo Bearing Co Ltd
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Priority to JP2014192510A priority Critical patent/JP6460694B2/en
Priority to PCT/JP2015/075292 priority patent/WO2016047422A1/en
Priority to CN201580050407.8A priority patent/CN107073513B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/28Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers

Abstract

PROBLEM TO BE SOLVED: To provide an application method capable of applying a liquid material of high viscosity without damaging an object.SOLUTION: In an ink application method, ink 22 is caused to adhere to the tip 24a of an application needle 24, the application needle 24 is arranged above a mechanism part 40a of MEMS 40, and the application needle 24 is lowered to bring the tip 24a into contact with the surface of the mechanism part 40a. After the stand-by for a prescribed time, the application needle 24 is raised while relatively moving the application needle 24 and the MEMS 40 in a horizontal direction, the tip 24a of the application needle 24 is separated from the surface of the mechanism part 40a, and an ink layer 22a is formed on the surface of the mechanism part 40a. The force by which the mechanism part 40a is pulled by the adhesive force of the ink 22 can be reduced as compared with the case where only the application needle 24 is raised in a vertical direction.SELECTED DRAWING: Figure 6

Description

この発明は塗布方法および塗布装置に関し、特に、対象物に液状材料を塗布する塗布方法および塗布装置に関する。   The present invention relates to a coating method and a coating apparatus, and more particularly to a coating method and a coating apparatus that apply a liquid material to an object.

先端径が数十μmの塗布針を用いてインクのような液状材料を塗布する技術や、スポット径が数μm〜数十μmのレーザ光を用いてパターンを加工する技術を、マイクロメートルオーダーの精密位置決め技術と組み合わせると、微細なパターンを作成したり、パターンの所定の位置を正確に加工することが可能となるので、これらの技術はフラットパネルディプレイの修正作業や太陽電池のスクライブ作業などに従来から利用されている(たとえば、特許文献1〜3参照)。   A technique for applying a liquid material such as ink using an application needle having a tip diameter of several tens of micrometers, and a technique for processing a pattern using laser light having a spot diameter of several micrometers to several tens of micrometers When combined with precision positioning technology, it is possible to create fine patterns and accurately process predetermined positions on the pattern, so these technologies can be used for flat panel display correction work and solar cell scribing work. It has been conventionally used (see, for example, Patent Documents 1 to 3).

特に塗布針を用いる技術は、ディスペンサが不得意とする粘度の高いインクでも塗布できるので、最近では、フラットパネルディプレイのパターンと比較して厚い10μm以上の厚膜の形成にも利用されている。この技術は、たとえば、MEMS(Micro Electro Mechanical Systems)やセンサなどの半導体デバイスの電子回路パターンやプリント基板配線の形成に用いられる。また、将来的に有望な製造技術であるプリンテッドエレクトロニクス技術で作製されるパターンも厚膜に分類される。したがって、塗布針を用いて液状材料を塗布する技術は、今後の用途拡大が期待される加工技術である。   In particular, the technique using a coating needle can be applied even with high-viscosity ink, which the dispenser is not good at, and has recently been used to form a thick film having a thickness of 10 μm or more as compared with a flat panel display pattern. This technique is used, for example, for forming electronic circuit patterns and printed circuit board wirings of semiconductor devices such as MEMS (Micro Electro Mechanical Systems) and sensors. Patterns produced by printed electronics technology, which is a promising manufacturing technology in the future, are also classified as thick films. Therefore, the technique of applying a liquid material using an application needle is a processing technique that is expected to be used in the future.

特開2007−268354号公報JP 2007-268354 A 特開2009−122259号公報JP 2009-122259 A 特開2012−006077号公報JP 2012-006077 A

ところで、たとえばMEMSに設けられた機構部の表面にインクの厚膜を形成する方法として、塗布針を用いて粘度の高いインクを塗布する方法が考えられる。しかし、この塗布方法では、インクが付着した塗布針の先端をMEMSの機構部に接触させて離脱させるとき、インクの粘着力によってMEMSの機構部が引っ張られて破損する恐れがある。   By the way, for example, as a method of forming a thick ink film on the surface of a mechanism portion provided in the MEMS, a method of applying high viscosity ink using an application needle is conceivable. However, in this coating method, when the tip of the coating needle to which ink is attached is brought into contact with the MEMS mechanism and separated, the MEMS mechanism may be pulled and damaged by the adhesive force of the ink.

それゆえに、この発明の主たる目的は、対象物を破損させることなく粘度の高い液状材料を塗布することが可能な塗布方法および塗布装置を提供することである。   Therefore, a main object of the present invention is to provide a coating method and a coating apparatus capable of coating a liquid material having a high viscosity without damaging an object.

この発明に係る塗布方法は、塗布針を用いて対象物に液状材料を塗布する塗布方法であって、塗布針の先端部に液状材料を付着させる第1のステップと、塗布針を下降させて先端部を対象物に接触させる第2のステップと、塗布針と対象物とを水平方向に相対移動させながら塗布針を上昇させて先端部を対象物から離脱させる第3のステップとを含む。   An application method according to the present invention is an application method in which a liquid material is applied to an object using an application needle, the first step of attaching the liquid material to the tip of the application needle, and the application needle is lowered. A second step of bringing the tip portion into contact with the object, and a third step of lifting the application needle while moving the application needle and the object in the horizontal direction to separate the tip portion from the object.

この発明に係る他の塗布方法は、塗布針を用いて対象物に液状材料を塗布する塗布方法であって、塗布針の先端部に液状材料を付着させる第1のステップと、塗布針を下降させて先端部を対象物に接触させる第2のステップと、液状材料の粘着力が予め定められた値よりも小さい場合は、塗布針と対象物とを水平方向に相対移動させずに塗布針を上昇させ、液状材料の粘着力が予め定められた値よりも大きい場合は、塗布針と対象物とを水平方向に相対移動させながら塗布針を上昇させる第3のステップとを含む。   Another application method according to the present invention is an application method in which a liquid material is applied to an object using an application needle, the first step of attaching the liquid material to the tip of the application needle, and the application needle being lowered. If the adhesive force of the liquid material is smaller than a predetermined value, the application needle without moving the application needle and the object relative to each other in the horizontal direction. And when the adhesive force of the liquid material is greater than a predetermined value, a third step of raising the application needle while relatively moving the application needle and the object in the horizontal direction is included.

好ましくは、塗布針の先端部を対象物に接触させて予め定められた時間だけ待機する。
また、この発明に係る塗布装置は、塗布針の先端部に液状材料を付着させる塗布ユニットと、塗布ユニットと対象物を相対移動させる駆動装置と、駆動装置を制御し、対象物の上方の予め定められた位置に塗布針の先端を配置し、塗布針を下降させて先端部を対象物に接触させ、塗布針と対象物とを水平方向に相対移動させながら塗布針を上昇させて先端部を対象物から離脱させ、対象物に液状材料を塗布する制御装置とを備えたものである。
Preferably, the tip of the application needle is brought into contact with the object and waits for a predetermined time.
In addition, the coating apparatus according to the present invention controls an application unit that attaches a liquid material to the tip portion of the application needle, a drive unit that moves the application unit and the object relative to each other, and a drive unit that controls the application unit in advance. Place the tip of the application needle at a predetermined position, lower the application needle to bring the tip into contact with the object, and raise the application needle while relatively moving the application needle and the object in the horizontal direction. And a control device for applying a liquid material to the object.

また、この発明に係る他の塗布装置は、塗布針の先端部に液状材料を付着させる塗布ユニットと、塗布ユニットと対象物を相対移動させる駆動装置と、駆動装置を制御し、対象物の上方の予め定められた位置に塗布針の先端を配置し、塗布針を下降させて先端部を対象物に接触させ、塗布針を上昇させて先端部を対象物から離脱させ、対象物に液状材料を塗布する制御装置とを備えたものである。この制御装置は、液状材料の粘着力が予め定められた値よりも小さい場合は、塗布針と対象物とを水平方向に相対移動させずに塗布針を上昇させ、液状材料の粘着力が予め定められた値よりも大きい場合は、塗布針と対象物とを水平方向に相対移動させながら塗布針を上昇させる。   Another application device according to the present invention includes an application unit that attaches a liquid material to a tip portion of an application needle, a drive device that relatively moves the application unit and the object, and a drive device that controls the upper side of the object. The tip of the application needle is placed at a predetermined position, the application needle is lowered, the tip is brought into contact with the object, the application needle is raised, the tip is separated from the object, and the liquid material is applied to the object. And a control device for applying the coating. When the adhesive force of the liquid material is smaller than a predetermined value, the control device raises the application needle without relatively moving the application needle and the object in the horizontal direction, and the adhesive force of the liquid material is When it is larger than the determined value, the application needle is raised while relatively moving the application needle and the object in the horizontal direction.

好ましくは、制御装置は、塗布針の先端部を対象物に接触させて予め定められた時間だけ待機した後に塗布針を上昇させる。   Preferably, the control device raises the application needle after waiting for a predetermined time by bringing the tip of the application needle into contact with the object.

この発明に係る塗布方法および塗布装置では、塗布針と対象物とを水平方向に相対移動させながら塗布針を上昇させて先端部を対象物から離脱させるので、液状材料の粘着力によって対象物が引っ張られる力を軽減することができる。したがって、対象物を破損させることなく粘度の高い液状材料を塗布することができる。   In the coating method and the coating apparatus according to the present invention, the tip of the coating needle is lifted while the coating needle and the object are relatively moved in the horizontal direction to separate the tip from the target. The pulling force can be reduced. Therefore, a liquid material having a high viscosity can be applied without damaging the object.

この発明の一実施の形態によるインク塗布方法において使用されるインク塗布装置の全体構成を示す図である。It is a figure which shows the whole structure of the ink application apparatus used in the ink application method by one embodiment of this invention. 図1に示した塗布機構部に含まれる塗布ユニットの構成を示す断面図である。It is sectional drawing which shows the structure of the application | coating unit contained in the application | coating mechanism part shown in FIG. 図2に示した容器および塗布針の構成を示す断面図である。It is sectional drawing which shows the structure of the container and application needle | hook shown in FIG. 図1〜図3で示したインク塗布装置を使用して粘度が低いインクを塗布する方法を示す断面図である。It is sectional drawing which shows the method of apply | coating ink with low viscosity using the ink application | coating apparatus shown in FIGS. 図1〜図3で示したインク塗布装置を使用して粘度が高いインクを塗布する方法を示す断面図である。It is sectional drawing which shows the method of apply | coating high viscosity ink using the ink application | coating apparatus shown in FIGS. 実施の形態の変更例を示す図である。It is a figure which shows the example of a change of embodiment.

図1は、この発明の一実施の形態によるインク塗布方法において使用されるインク塗布装置1の全体構成を示す図である。図1において、インク塗布装置1は、基板の表面を観察する観察光学系2と、観察された画像を映し出すモニタ3と、観察光学系2を介して基板にレーザ光を照射し不要部をカットするカット用レーザ部4と、インクを塗布針の先端部に付着させて基板の対象領域に塗布する塗布機構部5と、対象領域に塗布されたインクを加熱する基板加熱部6と、対象領域を認識する画像処理部7と、装置全体を制御するホストコンピュータ8と、装置機構部の動作を制御する制御用コンピュータ9とを備える。さらに、その他に対象領域を有する基板をXY方向(水平方向)に移動させるXYステージ10と、XYステージ10上で基板を保持するチャック部11と、観察光学系2や塗布機構部5をZ方向(垂直方向)に移動させるZステージ12などが設けられている。   FIG. 1 is a diagram showing an overall configuration of an ink coating apparatus 1 used in an ink coating method according to an embodiment of the present invention. In FIG. 1, an ink coating apparatus 1 includes an observation optical system 2 for observing the surface of a substrate, a monitor 3 for displaying an observed image, and irradiating the substrate with laser light through the observation optical system 2 to cut unnecessary portions. A cutting laser unit 4 to be applied, an application mechanism unit 5 that applies ink to the tip of the application needle and applies the ink to a target region of the substrate, a substrate heating unit 6 that heats the ink applied to the target region, and a target region An image processing unit 7 for recognizing the image, a host computer 8 for controlling the entire apparatus, and a control computer 9 for controlling the operation of the apparatus mechanism unit. In addition, an XY stage 10 that moves a substrate having a target region in the XY direction (horizontal direction), a chuck unit 11 that holds the substrate on the XY stage 10, and the observation optical system 2 and the coating mechanism unit 5 are moved in the Z direction. A Z stage 12 that is moved in the (vertical direction) is provided.

XYステージ10は、塗布機構部5によってインクを対象領域に塗布する際や、観察光学系2によって基板の表面を観察する際などに、基板を適切な位置に相対移動させるために用いられる。図1に示したXYステージ10は、2つの一軸ステージを直角方向に重ねた構成を有している。ただし、このXYステージ10は、観察光学系2や塗布機構部5に対して基板を相対的に移動させることができるものであればよく、図1に示すXYステージ10の構成に限定されるものではない。基板サイズが大きい場合には、X軸方向とY軸方向にそれぞれ独立して移動可能なガントリ型のXYステージを用いてもよい。   The XY stage 10 is used to relatively move the substrate to an appropriate position when the ink is applied to the target area by the application mechanism unit 5 or when the surface of the substrate is observed by the observation optical system 2. The XY stage 10 shown in FIG. 1 has a configuration in which two uniaxial stages are stacked in a perpendicular direction. However, the XY stage 10 only needs to be able to move the substrate relative to the observation optical system 2 and the coating mechanism unit 5, and is limited to the configuration of the XY stage 10 shown in FIG. is not. When the substrate size is large, a gantry-type XY stage that can move independently in the X-axis direction and the Y-axis direction may be used.

図2(A)は、図1に示した塗布機構部5に含まれる塗布ユニット20の構成を示す断面図である。図2(A)において、塗布ユニット20は、その底に第1の孔21aが開口され、インク22が注入された容器21と、第2の孔23aが開口され、容器21を密封する蓋23と、第1および第2の孔21a,23aと略同じ径を有する塗布針24とを含む。塗布針24の先端部は、第2の孔23aを貫通してインク22に浸漬される。   FIG. 2A is a cross-sectional view illustrating a configuration of the coating unit 20 included in the coating mechanism unit 5 illustrated in FIG. 2A, the coating unit 20 has a first hole 21a at the bottom thereof, a container 21 into which ink 22 has been injected, and a lid 23 that has the second hole 23a opened and seals the container 21. And a coating needle 24 having substantially the same diameter as the first and second holes 21a and 23a. The tip of the application needle 24 penetrates the second hole 23a and is immersed in the ink 22.

図3は、塗布針24と容器21の部分を拡大した図であり、容器21の底に開口された第1の孔21aと、その蓋23に開口された第2の孔23aと、塗布針24との寸法関係を表したものである。第1の孔21aの径をDdとし、第2の孔23aの径をDuとし、塗布針24の径をDとすると、DdとDuはDよりも大きく、Dd>Du>Dの関係にある。なお、この関係式は、塗布針24が段付ではなく、ストレートのタイプの場合に成り立つ。   FIG. 3 is an enlarged view of the portion of the application needle 24 and the container 21. The first hole 21 a opened in the bottom of the container 21, the second hole 23 a opened in the lid 23, and the application needle The dimensional relationship with 24 is expressed. When the diameter of the first hole 21a is Dd, the diameter of the second hole 23a is Du, and the diameter of the application needle 24 is D, Dd and Du are larger than D and Dd> Du> D. . This relational expression is valid when the application needle 24 is not a step but a straight type.

また、第1の孔21aの径Ddと塗布針24の径Dとの差の半分(片側隙間)をΔdとし、第2の孔23aの径Duと塗布針24の径Dとの差の半分(片側隙間)をΔuとすると、Δd>Δuの関係にあり、蓋23に開口された第2の孔23aと塗布針24との隙間よりも、容器21の底に開口された第1の孔21aと塗布針24との隙間の方が大きく設定されている。このため、第2の孔23aと塗布針24で容器21の姿勢を保つことができ、さらに、塗布針24が第2の孔23aの内面に接触した状態にあっても、塗布針24が第1の孔21aの内面に接触しないため、第1の孔21aの磨耗による変形を抑制できる。したがって、塗布針24の先端部24aに付着するインク22の液量が変化しないので安定した塗布が可能となる。   Further, half of the difference between the diameter Dd of the first hole 21 a and the diameter D of the application needle 24 (one-side gap) is Δd, and half of the difference between the diameter Du of the second hole 23 a and the diameter D of the application needle 24. If (one-side gap) is Δu, there is a relationship of Δd> Δu, and the first hole opened at the bottom of the container 21 rather than the gap between the second hole 23a opened at the lid 23 and the application needle 24. The gap between 21a and application needle 24 is set larger. For this reason, the attitude of the container 21 can be maintained by the second hole 23a and the application needle 24. Furthermore, even if the application needle 24 is in contact with the inner surface of the second hole 23a, the application needle 24 is Since it does not contact the inner surface of the first hole 21a, deformation due to wear of the first hole 21a can be suppressed. Therefore, since the amount of the ink 22 adhering to the tip 24a of the application needle 24 does not change, stable application is possible.

図2に戻って、塗布針24の基端部は塗布針固定板25に固定支持される。塗布針固定板25は直動案内部材26のスライド部26bに固定され、直動案内部材26のレール部26aは支持台29に固定される。直動案内部材26は、レール部26aとスライド部26bの間に転動体(ボールなど)を介在させた転がり案内の構成を有し、レール部26aとスライド部26bとは極軽い力で自在に直線運動することが可能なリニアガイドとなっている。塗布精度を向上するために、軽い予圧を与える場合もある。   Returning to FIG. 2, the base end portion of the application needle 24 is fixedly supported by the application needle fixing plate 25. The application needle fixing plate 25 is fixed to the slide portion 26 b of the linear motion guide member 26, and the rail portion 26 a of the linear motion guide member 26 is fixed to the support base 29. The linear motion guide member 26 has a rolling guide configuration in which a rolling element (ball or the like) is interposed between the rail portion 26a and the slide portion 26b, and the rail portion 26a and the slide portion 26b are freely movable with extremely light force. It is a linear guide that can move linearly. In order to improve application accuracy, a light preload may be applied.

直動案内部材26の上下端にはそれぞれストッパ27,28が設けられ、スライド部26bがレール部26aから抜け出ることを防止する。なお、直動案内部材26にストッパ機能が内蔵されていれば、ストッパ27,28は無くてもよい。   Stoppers 27 and 28 are respectively provided at the upper and lower ends of the linear motion guide member 26 to prevent the slide portion 26b from coming out of the rail portion 26a. If the linear motion guide member 26 has a stopper function, the stoppers 27 and 28 may be omitted.

支持台29には、出力軸30aを上方に向けてエアシリンダ30が設けられる。エアシリンダ30の出力軸30aの先端には、先端にピン31aを固着した駆動板31が水平に固定されており、出力軸30aと一体となって上下動する。ピン31aは、図2(B)に示すように、塗布針固定板25に設けた切り欠き部25aの下方から接して、エアシリンダ30の出力軸30aの上下動により、塗布針固定板25を上下に移動させる機能を持つ。   The support base 29 is provided with an air cylinder 30 with the output shaft 30a facing upward. A drive plate 31 having a pin 31a fixed to the tip is fixed horizontally at the tip of the output shaft 30a of the air cylinder 30, and moves up and down integrally with the output shaft 30a. As shown in FIG. 2B, the pin 31a is in contact with the lower side of the notch 25a provided in the application needle fixing plate 25, and the application needle fixing plate 25 is moved by the vertical movement of the output shaft 30a of the air cylinder 30. Has the ability to move up and down.

容器21は、たとえば、ポリプロピレン樹脂、フッ素樹脂、ポリアセタール樹脂等の樹脂からなり、容器21の側部には突起部21bが設けられている。この突起部21bには、磁性体のピン32が突起部21bから上方に突出するように固着される。容器21は射出成形により作成してもよく、この場合、ピン32は射出成形時に一体成形することも可能である。   The container 21 is made of, for example, a resin such as polypropylene resin, fluororesin, or polyacetal resin, and a protruding portion 21 b is provided on a side portion of the container 21. A magnetic pin 32 is fixed to the protrusion 21b so as to protrude upward from the protrusion 21b. The container 21 may be formed by injection molding. In this case, the pin 32 can be integrally formed at the time of injection molding.

また、直動案内部材26を固定する支持台29の下端面には磁石33が固着される。容器21に固着されたピン32の上端面を磁石33の下端面に吸着させることで、容器21を支持台29に1点で吊り下げた状態で支持するとともに、蓋23に開口された第2の孔23aに塗布針24を貫通させると、その隙間Δuは小さいため、容器21は所定位置に保持される。また、容器21の底に開口した第1の孔21aと塗布針24との隙間ΔdをΔuよりも十分大きく設定することで、塗布針24は、第1の孔21aに接触することなく上下動することが可能となる。たとえば、Δd=200μm、Δu=100μmに設定する。   A magnet 33 is fixed to the lower end surface of the support base 29 that fixes the linear motion guide member 26. By adsorbing the upper end surface of the pin 32 fixed to the container 21 to the lower end surface of the magnet 33, the container 21 is supported by being suspended from the support base 29 at one point, and the second opened in the lid 23. When the application needle 24 is passed through the hole 23a, the gap Δu is small, so that the container 21 is held at a predetermined position. Also, by setting the gap Δd between the first hole 21a opened at the bottom of the container 21 and the application needle 24 to be sufficiently larger than Δu, the application needle 24 moves up and down without contacting the first hole 21a. It becomes possible to do. For example, Δd = 200 μm and Δu = 100 μm are set.

塗布針24が容器21の蓋23に開口した第2の孔23aに挿入されれば、容器21の姿勢は塗布針24と第2の孔23aによりある程度拘束され、容器21の姿勢が決まり、その姿勢を保持する。   If the application needle 24 is inserted into the second hole 23a opened in the lid 23 of the container 21, the posture of the container 21 is restricted to some extent by the application needle 24 and the second hole 23a, and the posture of the container 21 is determined. Hold posture.

容器21の底に開口した第1の孔21aと塗布針24とが接触しないため、ダストの発生を防止することができ、インク22中へのダストの侵入を抑制することができる。また、容器21は磁石33と容器21に固着したピン32の吸引力で1面支持されているだけであり、塗布針24と第2の孔23aとが接触しても、容器21の固定方法には調心性があるため、塗布針24に与える影響は少ない。ピン32と磁石33とが接する面はほぼ平らで、それらは3mm前後の直径である。なお、第1の孔21aの中心と第2の孔23aとの中心を結ぶ基準線が、塗布針24の中心線とほぼ一致するように、ピン32と磁石33の接触面が設定される。   Since the first hole 21a opened at the bottom of the container 21 and the application needle 24 do not come into contact with each other, generation of dust can be prevented, and entry of dust into the ink 22 can be suppressed. Further, the container 21 is only supported on one surface by the suction force of the magnet 33 and the pin 32 fixed to the container 21. Even if the application needle 24 and the second hole 23 a come into contact with each other, the container 21 is fixed. Has a self-aligning property and therefore has little influence on the application needle 24. The surface where the pin 32 and the magnet 33 contact is almost flat, and they have a diameter of about 3 mm. The contact surface between the pin 32 and the magnet 33 is set so that a reference line connecting the center of the first hole 21a and the center of the second hole 23a substantially coincides with the center line of the application needle 24.

図4(A)〜(D)は、図1〜図3で示したインク塗布装置を使用して粘度が低いインク22を基板35の表面の対象領域35aに塗布する工程を示す断面図である。粘度が低いインク22の粘着力は予め定められた値よりも小さいため、インク22が付着した塗布針24の先端部24aを対象領域35aに接触させた後に塗布針24を垂直に上昇させても、インク22の粘着力によって対象領域35aが引っ張られて破損することはないものとする。   4A to 4D are cross-sectional views showing a process of applying the low viscosity ink 22 to the target region 35a on the surface of the substrate 35 using the ink application device shown in FIGS. . Since the adhesive force of the ink 22 having a low viscosity is smaller than a predetermined value, even if the tip 24a of the application needle 24 to which the ink 22 is attached is brought into contact with the target area 35a, the application needle 24 is raised vertically. It is assumed that the target area 35a is not pulled and damaged by the adhesive force of the ink 22.

また、塗布機構部5は、塗布ユニット20をZ軸方向(垂直方向、塗布針24の長さ方向)に下降および上昇させる副Zステージ34を含む。副Zステージ34は、Z軸方向に伸縮する駆動軸34aを有し、駆動軸34aの先端部が支持台29の上端部に固定されている。副Zステージ34は、Z軸方向の座標を有し、駆動軸34aを任意の第1座標から任意の第2座標まで所望の速度で移動させる機能を有する。まず、図4(A)に示すように、XYステージ10およびZステージ12を用いて塗布ユニット20と基板35を相対移動させ、基板35の対象領域35aの上方に塗布針24の先端を配置する。   The coating mechanism unit 5 also includes a sub-Z stage 34 that lowers and raises the coating unit 20 in the Z-axis direction (vertical direction, the length direction of the coating needle 24). The sub-Z stage 34 has a drive shaft 34 a that expands and contracts in the Z-axis direction, and the distal end portion of the drive shaft 34 a is fixed to the upper end portion of the support base 29. The sub-Z stage 34 has coordinates in the Z-axis direction, and has a function of moving the drive shaft 34a from any first coordinate to any second coordinate at a desired speed. First, as shown in FIG. 4A, the coating unit 20 and the substrate 35 are relatively moved using the XY stage 10 and the Z stage 12, and the tip of the coating needle 24 is disposed above the target area 35a of the substrate 35. .

次に図4(B)に示すように、エアシリンダ30の出力軸30aを下方(図では、出力軸30aを引き込む方向)に移動させ、出力軸30aと一体となって移動する駆動板31を下方に移動させる。駆動板31の先端に固着したピン31aは、塗布針固定板25に設けた切り欠き部25aに下方から接しており、駆動板31の下降により塗布針固定板25は直動案内部材26に沿って下方に移動する。それに合わせて塗布針24も下方に移動し、容器21の底に開口された第1の孔21aから塗布針24の先端部24aが突出する。この状態で、塗布針24の先端部24aにはインク22が付着しており、塗布できる状態となる。このとき、塗布針24の先端は対象領域35aの真上に配置され、塗布針24の先端と対象領域35aの表面との間隔は所定の距離に設定されている。つまり、対象領域35aの上方の予め定められた位置に塗布針24の先端が配置される。   Next, as shown in FIG. 4B, the output shaft 30a of the air cylinder 30 is moved downward (in the direction in which the output shaft 30a is pulled in), and the drive plate 31 that moves integrally with the output shaft 30a is moved. Move down. The pin 31 a fixed to the tip of the drive plate 31 is in contact with a notch 25 a provided on the application needle fixing plate 25 from below, and the application needle fixing plate 25 moves along the linear motion guide member 26 as the drive plate 31 descends. Move down. Accordingly, the application needle 24 also moves downward, and the tip end portion 24a of the application needle 24 protrudes from the first hole 21a opened at the bottom of the container 21. In this state, the ink 22 is attached to the tip end portion 24a of the application needle 24, and the application needle 24 can be applied. At this time, the tip of the application needle 24 is disposed immediately above the target area 35a, and the distance between the tip of the application needle 24 and the surface of the target area 35a is set to a predetermined distance. That is, the tip of the application needle 24 is arranged at a predetermined position above the target area 35a.

その後、図4(C)に示すように、副Zステージ34を用いて塗布ユニット20全体を所定の速度で下降させ、インク22が付着した塗布針24の先端を基板35の対象領域35aに接触させる。これにより、塗布針先端部24aのインク22が対象領域35aに塗布され、インク層22aが形成される。   Thereafter, as shown in FIG. 4C, the entire coating unit 20 is lowered at a predetermined speed using the sub Z stage 34, and the tip of the coating needle 24 to which the ink 22 has adhered contacts the target area 35 a of the substrate 35. Let Thereby, the ink 22 of the application needle tip 24a is applied to the target area 35a, and the ink layer 22a is formed.

なお、塗布針24の先端が対象領域35aに接触した後に継続して塗布ユニット20を下降させてもスライド部26bがレール部26aに沿って上方に退避するので、塗布針24の先端には過大な負荷が加わらない。そのため、塗布時に基板35に加えられる荷重は、スライド部26bと、塗布針固定板25と、塗布針24の合成重量となり、たとえば、約10g前後と軽荷重である。   Even if the application unit 20 is continuously lowered after the tip of the application needle 24 comes into contact with the target area 35a, the slide portion 26b retreats upward along the rail portion 26a. Load is not applied. Therefore, the load applied to the substrate 35 at the time of application is a combined weight of the slide portion 26b, the application needle fixing plate 25, and the application needle 24, for example, a light load of about 10 g.

塗布針24の先端を一定時間、対象領域35aに接触させた後、図4(D)に示すように、エアシリンダ30の出力軸30aを上方(図では、出力軸30aを突出させる方向)に移動させ、塗布針24の先端部24aを容器21のインク22中に浸漬した状態に戻すとともに、副Zステージ34の駆動軸34aを上方に移動させて塗布ユニット20全体を上方に移動させ、1回の塗布動作が終了する。   After the tip of the application needle 24 is brought into contact with the target area 35a for a certain period of time, as shown in FIG. 4D, the output shaft 30a of the air cylinder 30 is moved upward (in the direction in which the output shaft 30a protrudes). The tip 24a of the application needle 24 is returned to the state immersed in the ink 22 of the container 21 and the drive shaft 34a of the sub Z stage 34 is moved upward to move the entire application unit 20 upward. The coating operation is completed.

なお、ここでは塗布ユニット20の下降を副Zステージ34によって行なっているが、その代わりに観察光学系2を搭載したZステージ12によって行なってもよい。   Here, the lowering of the coating unit 20 is performed by the sub-Z stage 34, but it may be performed by the Z stage 12 on which the observation optical system 2 is mounted instead.

このようなインク塗布装置1を使用し、基板35の対象領域35aの表面にインク22の厚膜を形成する方法として、粘度の高いインク22を塗布する方法が考えられる。しかし、粘度が高いインク22の粘着力は予め定められた値よりも大きいため、インク22が付着した塗布針24の先端部24aを対象領域35aに接触させた後に塗布針24を垂直に上昇させると、インク22の粘着力によって対象領域35aが引っ張られて破損する恐れがある。   As a method of forming such a thick film of the ink 22 on the surface of the target region 35a of the substrate 35 using such an ink application device 1, a method of applying the ink 22 having a high viscosity can be considered. However, since the adhesive force of the ink 22 having a high viscosity is larger than a predetermined value, the application needle 24 is raised vertically after the tip portion 24a of the application needle 24 to which the ink 22 has adhered is brought into contact with the target region 35a. Then, the target area 35a may be pulled and damaged by the adhesive force of the ink 22.

図5(A)〜(D)は、図1〜図3で示したインク塗布装置を使用して粘度が高いインク22を基板35の表面の対象領域35aに塗布する工程を示す断面図であって、図4(A)〜(D)と対比される図である。図5(A)〜(D)で示される塗布工程が図4(A)〜(D)で示した塗布工程と異なる点は、図5(C)(D)で示すように、インク22が付着した塗布針24の先端部24aを対象領域35aに接触させて離脱させるとき、XYステージ10を制御して塗布針24と基板35とを水平方向に相対移動させながら、副Zステージ34を制御して塗布針24を上昇させる点である。図5(D)では、塗布針24に対して基板35を左方向に相対移動させたために、インク層22aが塗布針24の左斜め下に配置されている状態が示されている。   5A to 5D are cross-sectional views showing a process of applying the ink 22 having a high viscosity to the target area 35a on the surface of the substrate 35 using the ink application apparatus shown in FIGS. FIG. 5 is a diagram contrasted with FIGS. The application process shown in FIGS. 5A to 5D is different from the application process shown in FIGS. 4A to 4D in that the ink 22 is used as shown in FIGS. When the tip 24a of the applied application needle 24 is brought into contact with the target area 35a to be detached, the sub-Z stage 34 is controlled while the application needle 24 and the substrate 35 are relatively moved in the horizontal direction by controlling the XY stage 10. Thus, the application needle 24 is raised. FIG. 5D shows a state in which the ink layer 22 a is disposed diagonally to the left of the application needle 24 because the substrate 35 is moved relative to the application needle 24 in the left direction.

このように本実施の形態では、粘度の高いインク22を塗布する場合、塗布針24の先端部24aを対象領域35aから離脱させるときに塗布針24と基板35とを水平方向に相対移動させながら塗布針24を上昇させるので、インク22の粘着力によって対象領域35aが引っ張られる力を軽減することができる。したがって、対象領域35aを破損させることなく粘度の高いインク22を塗布することができる。   As described above, in the present embodiment, when the ink 22 having high viscosity is applied, the application needle 24 and the substrate 35 are relatively moved in the horizontal direction when the tip portion 24a of the application needle 24 is separated from the target region 35a. Since the application needle 24 is raised, the force with which the target region 35a is pulled by the adhesive force of the ink 22 can be reduced. Therefore, it is possible to apply the ink 22 having a high viscosity without damaging the target area 35a.

また、粘度の低いインク22を塗布する場合、塗布針24の先端部24aを対象領域35aから離脱させるときに塗布針24と基板35とを水平方向に相対移動させることなく塗布針24を上昇させるので、塗布針24を待機位置に迅速に復帰させることができ、塗布時間を短縮することができる。   When applying the ink 22 having a low viscosity, the application needle 24 is raised without causing the application needle 24 and the substrate 35 to move relative to each other in the horizontal direction when the tip 24a of the application needle 24 is detached from the target area 35a. Therefore, the application needle 24 can be quickly returned to the standby position, and the application time can be shortened.

図6(A)〜(C)は、上記実施の形態の変更例を示す図であって、MEMS40の機構部40aの表面に粘度が高いインク22を塗布する方法を示す図である。図6(A)に示すように、インク22が付着した塗布針24の先端部24aを機構部40aの表面に接触させ、一定時間待機する。次に図6(B)(C)に示すように、副Zステージ34およびXYステージ10を制御し、塗布針24とMEMS40とを水平方向に相対移動させながら塗布針24を上昇させ、塗布針24の先端部24aを機構部40aの表面から離脱させて機構部40aの表面にインク層22aを形成する。このとき、塗布針24を垂直方向に上昇させるだけの場合と比較して、インク22の粘着力によって機構部40aが引っ張られる力を軽減することができる。したがって、MEMS40の機構部40aを破損させることなく粘度の高いインク22を塗布し、厚いインク層22aを形成することができる。   FIGS. 6A to 6C are diagrams showing a modification of the above embodiment, and showing a method of applying the ink 22 having a high viscosity to the surface of the mechanism portion 40a of the MEMS 40. FIG. As shown in FIG. 6A, the tip 24a of the application needle 24 to which the ink 22 is attached is brought into contact with the surface of the mechanism 40a and waits for a predetermined time. Next, as shown in FIGS. 6B and 6C, the auxiliary Z stage 34 and the XY stage 10 are controlled, and the application needle 24 is raised while the application needle 24 and the MEMS 40 are relatively moved in the horizontal direction. The ink layer 22a is formed on the surface of the mechanism portion 40a by separating the 24 tip portions 24a from the surface of the mechanism portion 40a. At this time, compared with the case where the application needle 24 is merely raised in the vertical direction, the force by which the mechanism portion 40a is pulled by the adhesive force of the ink 22 can be reduced. Therefore, the thick ink layer 22a can be formed by applying the ink 22 having a high viscosity without damaging the mechanical part 40a of the MEMS 40.

今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 パターン修正装置、2 観察光学系、3 モニタ、4 カット用レーザ部、5 塗布機構部、6 基板加熱部、7 画像処理部、8 ホストコンピュータ、9 制御用コンピュータ、10 XYステージ、11 チャック部、12 Zステージ、20 塗布ユニット、21 容器、21a 第1の孔、22 インク、23 蓋、23a 第2の孔、24 塗布針、24a 先端部、25 塗布針固定板、25a 切り欠き部、26 直動案内部材、26a レール部、26b スライド部、27,28 ストッパ、29 支持台、30 エアシリンダ、30a 出力軸、31 駆動板、31a,32 ピン、33 磁石、35 基板、35a 対象領域、40 MEMS、40a 機構部。   DESCRIPTION OF SYMBOLS 1 Pattern correction apparatus 2 Observation optical system 3 Monitor 4 Cutting laser part 5 Coating mechanism part 6 Substrate heating part 7 Image processing part 8 Host computer 9 Control computer 10 XY stage 11 Chuck part , 12 Z stage, 20 coating unit, 21 container, 21a first hole, 22 ink, 23 lid, 23a second hole, 24 coating needle, 24a tip, 25 coating needle fixing plate, 25a notch, 26 Linear motion guide member, 26a Rail portion, 26b Slide portion, 27, 28 Stopper, 29 Support base, 30 Air cylinder, 30a Output shaft, 31 Drive plate, 31a, 32 pin, 33 Magnet, 35 Substrate, 35a Target area, 40 MEMS, 40a Mechanism part.

Claims (6)

塗布針を用いて対象物に液状材料を塗布する塗布方法であって、
前記塗布針の先端部に前記液状材料を付着させる第1のステップと、
前記塗布針を下降させて前記先端部を前記対象物に接触させる第2のステップと、
前記塗布針と前記対象物とを水平方向に相対移動させながら前記塗布針を上昇させて前記先端部を前記対象物から離脱させる第3のステップとを含む、塗布方法。
An application method of applying a liquid material to an object using an application needle,
A first step of attaching the liquid material to the tip of the application needle;
A second step of lowering the application needle and bringing the tip into contact with the object;
And a third step of lifting the application needle while relatively moving the application needle and the object in the horizontal direction to separate the tip from the object.
塗布針を用いて対象物に液状材料を塗布する塗布方法であって、
前記塗布針の先端部に前記液状材料を付着させる第1のステップと、
前記塗布針を下降させて前記先端部を前記対象物に接触させる第2のステップと、
前記液状材料の粘着力が予め定められた値よりも小さい場合は、前記塗布針と前記対象物とを水平方向に相対移動させずに前記塗布針を上昇させ、前記液状材料の粘着力が予め定められた値よりも大きい場合は、前記塗布針と前記対象物とを水平方向に相対移動させながら前記塗布針を上昇させる第3のステップとを含む、塗布方法。
An application method of applying a liquid material to an object using an application needle,
A first step of attaching the liquid material to the tip of the application needle;
A second step of lowering the application needle and bringing the tip into contact with the object;
When the adhesive force of the liquid material is smaller than a predetermined value, the application needle is raised without relatively moving the application needle and the object in the horizontal direction, and the adhesive force of the liquid material is determined in advance. And a third step of raising the application needle while moving the application needle and the object relative to each other in a horizontal direction when the value is larger than a predetermined value.
前記第2のステップでは、前記塗布針の前記先端部を前記対象物に接触させて予め定められた時間だけ待機する、請求項1または請求項2に記載の塗布方法。   3. The coating method according to claim 1, wherein, in the second step, the tip of the coating needle is brought into contact with the object and waits for a predetermined time. 塗布針の先端部に液状材料を付着させる塗布ユニットと、
前記塗布ユニットと対象物を相対移動させる駆動装置と、
前記駆動装置を制御し、前記対象物の上方の予め定められた位置に前記塗布針の先端を配置し、前記塗布針を下降させて前記先端部を前記対象物に接触させ、前記塗布針と前記対象物とを水平方向に相対移動させながら前記塗布針を上昇させて前記先端部を前記対象物から離脱させ、前記対象物に前記液状材料を塗布する制御装置とを備える、塗布装置。
An application unit for attaching a liquid material to the tip of the application needle;
A driving device for relatively moving the coating unit and the object;
Controlling the driving device, disposing the tip of the application needle at a predetermined position above the object, lowering the application needle to bring the tip into contact with the object; and A coating apparatus, comprising: a control device that raises the application needle while moving the object relative to the horizontal direction to disengage the tip from the object and applies the liquid material to the object.
塗布針の先端部に液状材料を付着させる塗布ユニットと、
前記塗布ユニットと対象物を相対移動させる駆動装置と、
前記駆動装置を制御し、前記対象物の上方の予め定められた位置に前記塗布針の先端を配置し、前記塗布針を下降させて前記先端部を前記対象物に接触させ、前記塗布針を上昇させて前記先端部を前記対象物から離脱させ、前記対象物に前記液状材料を塗布する制御装置とを備え、
前記制御装置は、前記液状材料の粘着力が予め定められた値よりも小さい場合は、前記塗布針と前記対象物とを水平方向に相対移動させずに前記塗布針を上昇させ、前記液状材料の粘着力が予め定められた値よりも大きい場合は、前記塗布針と前記対象物とを水平方向に相対移動させながら前記塗布針を上昇させる、塗布装置。
An application unit for attaching a liquid material to the tip of the application needle;
A driving device for relatively moving the coating unit and the object;
The driving device is controlled, the tip of the application needle is arranged at a predetermined position above the object, the application needle is lowered, the tip is brought into contact with the object, and the application needle is moved. A controller that raises and separates the tip from the object and applies the liquid material to the object;
When the adhesive force of the liquid material is smaller than a predetermined value, the control device raises the application needle without relatively moving the application needle and the object in the horizontal direction, and the liquid material An applicator that raises the applicator needle while relatively moving the applicator needle and the object in the horizontal direction when the adhesive strength of the applicator is greater than a predetermined value.
前記制御装置は、前記塗布針の前記先端部を前記対象物に接触させて予め定められた時間だけ待機した後に前記塗布針を上昇させる、請求項4または請求項5に記載の塗布装置。   The said control apparatus is an application apparatus of Claim 4 or 5 which raises the said application needle | hook after contacting the said front-end | tip part of the said application needle | hook with the said object, and waiting for predetermined time.
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