JP2016058261A - Heat radiation socket and manufacturing method of the same, and led component including heat radiation socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heat radiation properties from a mount member of an LED to a socket, and to secure electrical insulation of a socket from a power supply line.SOLUTION: This invention is regarding a heat radiation socket 20, a manufacturing method of the same and an LED component 1 including the heat radiation socket 20. The heat radiation socket includes: a socket-like molding 21 which is made by dispersing a filler 55 which has excellent electrical conductivity and thermal conductivity compared to resin 56 in the resin 56 as a base material, and which can be electrically connected to a mount member 10 on which an LED 15 is mounted; a power supply line 30 arranged inside the molding 21, and for connecting the LED 15 and an external power source; and an insulation covering member 50 for covering a portion coming into contact at least with the molding 21 of the power supply line 30 and having more excellent insulation properties than the filler 55.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat dissipation socket excellent in heat dissipation, a method for manufacturing the same, and an LED component including the heat dissipation socket.

  A light emitting diode (LED) is a pn junction diode obtained by joining a p-type semiconductor and an n-type semiconductor, and is known as a light source capable of directly converting electric power into light energy. When a voltage is applied in the forward direction (direction from p to n) of the light emitting diode, holes flowing in the conduction band in the p-type semiconductor and electrons flowing in the valence band in the n-type semiconductor are near the pn junction. Recombine beyond the forbidden body. At this time, energy corresponding to the width of the forbidden body is emitted as light. Unlike light bulbs with a built-in filament, light emitted from LEDs is converted from electric power without passing through heat generation, and thus has features such as low heat generation and low power consumption.

  In recent years, for example, in a high brightness application such as a headlight for automobiles, it is required to mount a plurality of LEDs. Further, when a high-power LED of 5 W or more is used, it is known that even when the number of mounted LEDs is small, the heat is high and the life of the headlight is shortened (see, for example, Patent Document 1). In order to prevent the temperature rise of the LED element, it is necessary to enhance the heat dissipation function. From such a need, for example, a technique is known in which a large number of LEDs are mounted on an elongated mounting member made of aluminum or an aluminum alloy, and heat can be quickly radiated from the LEDs to the mounting member (for example, patents). Reference 2).

JP 2005-125993 A JP2013-020911A

  However, there are still problems to be improved in the above-described conventional technology. When a large number of LEDs are mounted on a mount member made of aluminum or aluminum alloy having excellent thermal conductivity, heat can be quickly radiated by radiating heat from the mount member to the atmosphere. In this case, if the outside of the mount member is covered, if the heat transferability of the covering member is low, the heat dissipation is not necessarily improved. It is sufficient if heat can be dissipated to the socket connected to the mount member. However, if graphite or metal particles are dispersed in the resin that constitutes the socket to improve heat dissipation, the power supply line inside the socket and the socket become conductive, and the power supply line This causes a problem that the electrical insulation of the socket cannot be ensured.

  The present invention has been made to solve the above-described problems, and it is intended to improve the heat dissipation from the LED mounting member to the socket and to ensure the electrical insulation of the socket from the power supply line. Objective.

  One form of the present invention for achieving the above object is a mounting member on which a light emitting diode is mounted, in which a filler having excellent conductivity and thermal conductivity is dispersed in a resin as a base material. A socket-shaped molded body that can be electrically connected, a power supply line that is arranged inside the molded body and connects the light emitting diode and the external power source, and covers at least a portion of the power supply line that contacts the molded body, and a filler A heat radiating socket including an insulating covering member that is more excellent in insulation.

  Another embodiment of the present invention is a heat radiating socket in which the insulating covering member is made of silicone rubber.

  Another embodiment of the present invention is a heat radiation socket in which the molded body is obtained by dispersing graphite in polycarbonate, polyamide, or polyphenylene sulfide.

  One aspect of the present invention is a method for producing the above-described heat dissipation socket, and a filler-dispersed uncured resin obtained by mixing a filler having excellent conductivity and thermal conductivity with the uncured resin in comparison with the resin. A filler-dispersed uncured resin manufacturing process, a coating process for coating an insulating coating member with better insulation than a filler on a part of a power supply line connecting a light emitting diode and an external power source, and a filler-dispersed uncured resin A power supply line arranging step of including a power supply line coated with an insulating covering member in a socket formed by molding a resin.

  According to another aspect of the present invention, in the power supply line arranging step, a power supply line covering the insulating coating member is set in the mold, and the resin supply for supplying the filler-dispersed uncured resin into the mold is provided. It is a manufacturing method of a heat radiating socket including a process and a resin curing process of curing a filler-dispersed uncured resin in a mold.

  Another embodiment of the present invention is a method for manufacturing a heat radiating socket, wherein the insulating covering member is formed into a tube shape, and the covering step includes an insertion step of inserting a power supply line into the tube-shaped insulating covering member.

  Another form of the present invention is a method for manufacturing a heat radiating socket, wherein the covering step includes an adhesion step in which the tube-shaped insulating covering member is heated and brought into close contact with the power supply line following the insertion step.

  One embodiment of the present invention is an LED component in which a mounting member on which a light emitting diode is mounted is electrically connected to the above-described heat dissipation socket.

  ADVANTAGE OF THE INVENTION According to this invention, while improving the heat dissipation from the mounting member of LED to a socket, the electrical insulation of the socket from an electric power feeding line is securable.

FIG. 1 shows an assembled perspective view (1A) and an assembled perspective view (1B) of an LED component according to an embodiment of the present invention. 2 shows an assembled perspective view (2A) of the mount member constituting the LED component of FIG. 1 and a partially transparent perspective view (2B) of the light member on which the LED component of FIG. 1 is mounted. 3 is a perspective view of the heat radiation socket of FIG. 1 (3A), a C plane cut surface (3B) when the C plane of (3A) is moved in the direction of the black arrow and cut, and a D plane of (3A). The D-plane cut surface (3C) when cut by moving in the direction of the white arrow is shown. FIG. 4 shows an enlarged view of a part E of (3B) of FIG. FIG. 5 shows a flow of the manufacturing method of the heat dissipation socket according to the embodiment of the present invention. FIG. 6 shows a flow that embodies some of the steps of FIG. FIG. 7 is a diagram for explaining an example of the covering step (step S102) in FIG. 5, in a state (7A) before the tube-shaped insulating covering member is coated on the power supply line and the tube-shaped power supply line. The state (7B) after coating the insulating covering member is shown respectively. FIG. 8 is a modified example of the LED component of FIG. 1 and shows an assembled perspective view (8A) and an assembled perspective view (8B).

  Next, each embodiment of the thermal radiation socket which concerns on this invention, its manufacturing method, and LED component is described. However, the embodiment described below is a preferred form of the heat dissipation socket according to the present invention, its manufacturing method, and the LED component, and each configuration included in the form includes the heat dissipation socket according to the present invention, its It is not necessarily an essential configuration for the manufacturing method and the LED component.

<1. Thermal socket and LED component>
FIG. 1 shows an assembled perspective view (1A) and an assembled perspective view (1B) of an LED component according to an embodiment of the present invention. 2 shows an assembled perspective view (2A) of the mount member constituting the LED component of FIG. 1 and a partially transparent perspective view (2B) of the light member on which the LED component of FIG. 1 is mounted.

  The LED component 1 according to this embodiment includes a mount member 10 on which a light emitting diode (hereinafter referred to as “LED”) 15 is mounted, and a heat dissipation socket 20. The mount member 10 is electrically connected to the heat dissipation socket 20 and constitutes the LED component 1.

(1) Structure of Mount Member The mount member 10 preferably includes a plurality of LEDs 15 on the upper surface and side surfaces of the cylindrical member 11. As shown in FIG. 2 (2 A), the mount member 10 includes a sleeve 11, a convex transparent member 12, a substrate 13, a side surface covering transparent member 14, and a flexible substrate 19.

  In this embodiment, the sleeve 11 has a cylindrical shape, but may have a polygonal cylindrical shape of a triangle or more. Further, instead of the sleeve 11, a solid columnar or polygonal columnar member may be used. The sleeve 11 extends in one direction and has an area where many LEDs 15 can be mounted. The sleeve 11 is made of a material having high thermal conductivity so that heat can be effectively radiated from the LED 15. The constituent material of the sleeve 11 includes a metal material with high thermal conductivity typified by aluminum, aluminum alloy, etc .; ceramics with high thermal conductivity typified by aluminum nitride, diamond-like carbon, etc .; Examples include metal materials or composite materials in which ceramics are dispersed. Since the sleeve 11 is not in contact with the wiring on the substrate 13 and the flexible substrate 19, the sleeve 11 does not have to be made of a material having excellent electrical insulation. For this reason, a metal material such as aluminum can be used as the constituent material of the sleeve 11.

  The sleeve 11 includes a concave region 17 whose outer surface is slightly recessed inward at a substantially central portion in the length direction. The recessed area 17 includes a through hole 18 having a shape and a size capable of exposing the LED 15 from the inner side to the outer side of the sleeve 11. The number of through holes 18 is not particularly limited, but is preferably equal to or more than the number of LEDs 15.

  The LED 15 exposed from the side surface of the sleeve 11 is mounted on a sleeve-shaped flexible substrate 19 having a smaller diameter than the sleeve 11. The constituent material of the flexible substrate 19 is not particularly limited as long as it is excellent in electrical insulation and has elasticity. On the surface of the flexible substrate 19, wiring (not shown) (preferably made of a metal capable of being energized and having excellent electrical conductivity) is formed. The flexible substrate 19 is inserted into the sleeve 11 with its cylindrical diameter being reduced, and the LED 15 is passed through the through hole 18 and is fixed inside the sleeve 11. The flexible substrate 19 is not completely closed, and a part thereof is cut in the vertical direction so that the cylinder diameter can be easily changed. However, you may comprise the flexible substrate 19 in the cylinder shape closed completely in the circumferential direction. Further, instead of the cylindrical flexible substrate 19, three LEDs 15 are vertically mounted on a strip-shaped flexible substrate, and a plurality of the strip-shaped flexible substrates are arranged on the inner wall of the sleeve 11 along the circumferential direction. It may be fixed. Further, the flexible substrate 19 may be attached to the outer surface of the sleeve 11. In that case, the through hole 18 is not necessarily required.

  The side covering transparent member 14 is a substantially cylindrical member that can be attached to the concave region 17 of the sleeve 11, and is preferably composed of highly transparent resin, rubber, or glass that allows light emitted from the LED 15 to be transmitted outside. The Similarly to the flexible substrate 19, the side covering transparent member 14 is not completely closed, and a part of the side covering transparent member 14 is cut in the vertical direction so that the concave region 17 can be covered easily. You may be comprised in the cylinder shape closed in the direction.

  The substrate 13 can be attached to the top surface (also referred to as the upper surface) of the sleeve 11 and has a thin disk shape in this embodiment. If the shape of the upper surface of the sleeve 11 is a polygon, the substrate 13 is preferably a plate-like member having the same shape as the polygon. The substrate 13 includes LEDs 15 on the outer surface thereof. The number of LEDs 15 is not limited as long as it is one or more. However, the LED 15 is not necessarily provided on the top surface of the sleeve 11.

  The convex transparent member 12 is preferably composed of a highly transparent resin, rubber, or glass that allows light emitted from the LED 15 provided on the top surface side of the sleeve 11 to be transmitted to the outside. When the LED 15 does not protrude from the top surface of the sleeve 11, a flat plate-type transparent member may be used instead of the convex transparent member 12. Further, when the LED 15 is not provided on the top surface of the sleeve 11, it is not necessary to provide the convex transparent member 12.

  The mount member 10 includes a flexible substrate 19 and a current-carrying terminal 16 electrically connected from the substrate 13 so as to protrude toward the heat radiating socket 20. As shown in (1A) of FIG. 1, the energization terminal 16 can receive power from an external power source by being connected to the power supply line 30 on the heat dissipation socket 20 side in the direction of arrow A.

(2) External structure of heat dissipation socket As shown in FIGS. 1 and 2, the heat dissipation socket 20 includes a socket-shaped molded body 21, a power supply line 30, and at least a portion of the power supply line 30 that contacts the molded body 21. And an insulating covering member (see FIG. 3) to be covered. The socket-shaped molded body 21 has a substantially L-shape, and in order from the connection portion with the mount member 10, a substantially cylindrical first cylindrical member 22 and a diameter larger than that of the first cylindrical member 22. The flange portion 23, a substantially L-shaped tube member 24, and a substantially cylindrical second tubular member 25 having a larger diameter than the tube member 24 are connected to each other. In addition, although the shape of the pipe member 24 is a substantially L shape in this embodiment, other shapes, for example, a straight pipe shape may be used. In order to further improve the heat dissipation of the heat dissipation socket 20, it is preferable to form a plurality of fins on any outer wall of the molded body 21.

  The molded body 21 is a member that is electrically connectable to the mount member 10 on which the LED 15 is mounted, in which a filler having excellent conductivity and thermal conductivity compared to the resin is dispersed in a resin as a base material. . In this embodiment, the first cylindrical member 22, the flange 23, the pipe member 24, and the second cylindrical member 25 constituting the molded body 21 are all composite members of resin and filler. However, as long as the main part of the molded body 21 is composed of the composite member, a part may be composed of a material other than the composite member. For example, only the pipe member 24 is composed of the composite member, and the first tubular member 22, the flange 23, and the second tubular member 25 are made of other highly insulating members (for example, filler is excluded from the composite member). (Resin). Moreover, the pipe member 24 and the collar part 23 may be comprised by the said composite member, and the 1st cylindrical member 22 and the 2nd cylindrical member 25 may be comprised from another member with high insulation. As long as all or the main part of the molded body 21 is formed of a composite member so that heat can be effectively radiated from the mount member 10 to the heat dissipation socket 20 side, combinations of composite members other than the above examples and other materials are free. Can be selected.

  The first cylindrical member 22 is a connection portion with the mount member 10, and a first connection portion 31 that can be electrically connected to the current-carrying terminal 16 on the mount member 10 side protrudes in the cylinder 26. The first connection portion 31 is formed at one end of the power supply line 30. In this embodiment, the shape of the first connection portion 31 is a tube shape into which the current-carrying terminal 16 can be inserted. However, as long as the current-carrying terminal 16 can be connected, the shape of the first connection portion 31 is a shape other than the tube. It can also be.

  The second cylindrical member 25 is a part that can be connected to the external power supply (whether it is an AC power supply or a DC power supply) side, and is electrically connected to the external power supply side in the cylinder 27. A possible second connection 32 is provided protruding. The second connection portion 32 is formed at one end of the power supply line 30 opposite to the first connection portion 31. The shape of the second connection portion 32 is a thin plate shape in this embodiment, but may be any other shape as long as it can be connected to an external power source.

(3) Structure of light member As shown in (2B) of FIG. 2, the mount member 10 of the LED component 1 is mainly disposed inside the cup of the cup-shaped reflector 40. The upper opening of the reflecting plate 40 is covered with a transparent member 41. The light member having such a configuration can transmit a part of light from the many LEDs 15 mounted on the mount member 10 to the outside from the transparent member 41 while being reflected by the reflecting plate 40. The heat from the LED 15 is also effectively transmitted to the heat radiating socket 20 connected to the mount member 10 and is released into the air. For this reason, since the heat dissipation route can be formed in addition to the route that dissipates heat from the mount member 10 to the air via the reflector 40 by configuring the heat dissipation socket 20, a light member with high heat dissipation can be realized. .

(4) Internal structure of heat radiating socket FIG. 3 is a perspective view of the heat radiating socket of FIG. 1 (3A), C surface cut surface (3B) when cut by moving the C surface of (3A) in the direction of the black arrow, And D plane cut surface (3C) when the D plane of (3A) is moved in the direction of the white arrow and cut. FIG. 4 shows an enlarged view of a part E of (3B) of FIG.

  The heat dissipation socket 20 includes a power supply line 30 bent in a substantially L shape therein. The power supply line 30 is not particularly limited as long as it is a material having excellent conductivity, and examples thereof include copper, silver, aluminum, aluminum alloy, and tungsten. One end of the power supply line 30 includes a first connection portion 31 and is exposed in the cylinder 26 of the first cylindrical member 22. Further, the end of the power supply line 30 opposite to the first connection portion 31 includes a second connection portion 32 and is exposed in the cylinder 27 of the second cylindrical member 25. In this embodiment, the first connection portion 31 does not protrude outward from the opening surface of the first tubular member 22, and the second connection portion 32 extends outward from the opening surface of the second tubular member 25. Each is formed so as not to protrude. However, the first connection portion 31 and the second connection portion 32 may protrude from the opening surface of the first tubular member 22 and the opening surface of the second tubular member 25, respectively.

  A portion of the power supply line 30 that comes into contact with the molded body 21 is covered with an insulating covering member 50 because it needs to be electrically insulated from the molded body 21. The insulating covering member 50 may be coated on the power supply line 30 bent in advance in an L shape, or after being coated on the straight power supply line 30, the power supply line 30 is bent in an L shape. May be. In this embodiment, the inside of the molded body 21 is solid except for the cylinder interior 26 and the cylinder interior 27. For this reason, all portions of the power supply line 30 other than the first connection portion 31 and the second connection portion 32 are covered with the insulating covering member 50. However, when there is a space inside the molded body 21, or when a part of the molded body 21 is made of a material having extremely low electrical conductivity other than the composite member, it exists in the space or the composite It is not necessary to cover a part of the power supply line 30 in contact with the material other than the member with the insulating covering member 50. That is, at least the portion of the power supply line 30 that should be electrically insulated from the composite member of the molded body 21 may be covered with the insulating covering member 50.

  When the first cylindrical member 22 is composed of a composite member, the first cylindrical member 22, the first connection portion 31, and the first connection portion 31 are arranged between the first connection portion 31 and the cylinder bottom surface of the cylinder 26. Insulating sheet 51 is preferably interposed from the viewpoint of reliably preventing the electrical connection. This is because if the diameter of the first connection portion 31 is formed larger than the diameter of the main portion of the power supply line 30, there is a possibility of energization between the bottom portion of the first connection portion 31 and the bottom surface of the cylinder. . On the other hand, in this embodiment, the second connection portion 32 is configured in a thin plate shape with a width equal to or less than the diameter of the main portion of the power supply line 30. For this reason, the necessity of laying the insulating sheet 51 on the inner bottom portion of the second cylindrical member 25 is low. However, the insulating covering member 50 that covers the power supply line 30 is the same as the inner bottom surface of the second cylindrical member 25 from the viewpoint of reliably preventing the power supply line 30 and the pipe member 24 or the second cylindrical member 25 from being energized. It is preferable to exist up to a position that is exposed to the position 27 or more on the side of the cylinder 27.

  As shown in FIG. 4, the molded body 21 is formed by dispersing a filler 55 having excellent conductivity and thermal conductivity in a resin 56 as a base material as compared with the resin 56. Due to the presence of the filler 55, the composite member in which the filler 55 is dispersed in the resin 56 imparts thermal conductivity to the molded body 21 and at the same time imparts conductivity. If a filler having a high thermal conductivity and a low conductivity, for example, a filler such as diamond or aluminum nitride is dispersed in the resin 56, it is not necessary to cover the power supply line 30 with the insulating covering member 50. However, such a filler having high thermal conductivity and low conductivity is expensive, and may increase the cost of the heat radiating socket 20. Therefore, it is preferable to use a filler 55 having a lower price and excellent thermal conductivity, for example, a metal such as graphite or aluminum. Since such a filler 55 is relatively high in conductivity, an insulating covering member 50 having a higher insulating property than the filler 55 is provided between the power supply line 30 and the portion formed of the composite material in the molded body 21. Intervene.

  The resin 56 constituting the molded body 21 can be used without particular limitation, and polyamide, polypropylene, polyethylene terephthalate, acrylic resin, polybutylene terephthalate, polycarbonate, polyphenylene sulfide, ABS resin, and the like can be suitably used. Particularly preferred resins are polycarbonate, polyamide or polyphenylene sulfide. Further, as the filler 55 dispersed in the resin 56, those having various shapes such as a granular shape, a fiber shape, a needle shape, and a plate shape can be used. The filler 55 is contained in 5 to 50% by volume, preferably 10 to 30% by volume, and more preferably 15 to 25% by volume in 100% by volume of the composite member of the resin 56 and the filler 55. Moreover, as a material of the filler 55, graphite, aluminum, an aluminum alloy, etc. can be illustrated suitably. A more preferable combination of the resin 56 and the filler 55 is a combination of any one of polycarbonate, polyamide, or polyphenylene sulfide and graphite.

  The insulating covering member 50 is a method in which a liquid composition capable of forming an insulating film is applied or coated on a portion of the power supply line 30 that imparts insulation to the power supply line 30; Examples of the dipping method include: forming the insulating covering member 50 into a tube shape, and inserting the power supply line 30 into the tube. The insulating covering member 50 can be used without particular limitation as long as it has higher insulating properties than the filler 55. When the insulating covering member 50 is made of resin, the same options as the resin 56 used as the base material of the molded body 21 can be used. When the insulating covering member 50 is made of rubber, for example, a thermosetting elastomer such as silicone rubber, urethane rubber, ethylene propylene rubber or ethylene propylene diene rubber; urethane, ester, styrene, olefin or Fluorine-based thermoplastic elastomers or composites thereof can be used. In particular, when the molded body 21 is molded by injection of a composite member, it is more preferable to use silicone rubber having excellent heat resistance. it can.

<2. Manufacturing method of heat dissipation socket>
FIG. 5 shows a flow of the manufacturing method of the heat dissipation socket according to the embodiment of the present invention. FIG. 6 shows a flow that embodies some of the steps of FIG.

  The heat radiating socket 20 according to this embodiment is a filler dispersion in which a filler-dispersed uncured resin is prepared by mixing an uncured resin 56 with a filler 55 having superior conductivity and thermal conductivity compared to the resin 56. An uncured resin manufacturing process (step S101), and a covering process (step S102) for covering an insulating covering member 50 having a better insulating property than the filler 55 on a part of the power supply line 30 that connects the LED 15 and the external power source. And a power feed line arranging step (step S103) in which a power feed line 30 covered with the insulating covering member 50 is contained in a socket formed by molding filler-dispersed uncured resin.

  Here, in the power supply line arrangement step (step S103), after setting the power supply line 30 covered with the insulating coating member 50 in a mold (not shown), the filler-dispersed uncured resin is supplied into the mold. An insert molding method; an assembly method in which the power supply line 30 covered with the insulating covering member 50 is sandwiched between the split sockets; and any method in which the power supply line 30 exists in the molded body 21 are included.

  In this embodiment, the insert molding method shown in FIG. 6 is adopted as follows. That is, in the power supply line arrangement step (step S103), the power supply line 30 that covers the insulating coating member 50 is set in a mold, and the resin supply step (step of supplying filler-dispersed uncured resin into the mold). S201) and a resin curing step (step S202) for curing the filler-dispersed uncured resin in the mold. The means for curing the filler-dispersed uncured resin is not particularly limited. However, when a thermosetting resin is used as the resin 56, heating is performed, and when a thermoplastic resin is used as the resin 56, cooling (natural cooling is also possible). In the case where an ultraviolet curable resin is used for the resin 56, UV irradiation is performed, and when an electron beam curable resin is used for the resin 56, electron beam irradiation is performed.

  FIG. 7 is a diagram for explaining an example of the covering step (step S102) in FIG. 5, in a state (7A) before the tube-shaped insulating covering member is coated on the power supply line and the tube-shaped power supply line. The state (7B) after coating the insulating covering member is shown respectively.

  As a covering step (step S102), a method of inserting the power supply line 30 into a tube-shaped insulating covering member 50 (referred to as “insulating tube 50a”) can be cited as a suitable example. That is, when the insulating covering member 50 is formed into a tube shape, the covering step (step S102) includes an inserting step of inserting the power supply line 30 into the insulating tube 50a as shown by the arrow F (see 7A). Further, the covering step (step S102) may include a contact step for heating the insulating tube 50a to be in close contact with the power supply line 30 following the insertion step (see 7B).

  The insulating tube 50a used here is heat-shrinkable and has a thickness that can reliably cover the power supply line 30 even when heat-shrinking. The said thickness is 0.1-1.0 mm, for example, Preferably it is 0.3-0.7 mm. The preferable hardness of the insulating tube 50a is 40 to 70 degrees in durometer hardness (type A), and can be appropriately selected according to the shape of the power supply line 30, the type of the filler 55 in the molded body 21, and the like. .

<3. Actions and effects according to the embodiment>
As described above, the heat radiating socket 20 according to this embodiment is formed by dispersing the filler 55 having excellent conductivity and thermal conductivity compared to the resin 56 in the resin 56 as a base material, and mounting the LED 15. A socket-shaped molded body 21 that can be electrically connected to the mount member 10, a power supply line 30 that is disposed inside the molded body 21 and connects the LED 15 and an external power source, and at least the molded body 21 of the power supply line 30 are in contact with each other. An insulating covering member 50 that covers the portion and is more excellent in insulation than the filler 55. For this reason, even when the filler 55 has a relatively high conductivity, the heat dissipation from the mounting member 10 of the LED 15 to the heat dissipation socket 20 is enhanced, and at the same time, the electrical insulation of the heat dissipation socket 20 from the power supply line 30 is achieved. Can also be secured.

  Further, when the insulating covering member 50 is made of silicone rubber, the risk of the insulating covering member 50 being melted or broken is low even when the temperature is high in manufacturing the molded body 21 due to its high heat resistance. Become.

  Further, since the molded body 21 is formed by dispersing graphite (an example of the filler 55) in polycarbonate, polyamide, or polyphenylene sulfide (an example of the resin 56), the molded body 21 can be manufactured relatively easily.

  In addition, the above-described heat dissipation socket 20 is a filler-dispersed uncured material in which a filler-dispersed uncured resin is prepared by mixing an uncured resin 56 with a filler 55 having superior conductivity and thermal conductivity compared to the resin 56. A resin manufacturing process (step S101), a coating process (step S102) for coating an insulating coating member 50 having a better insulating property than the filler 55 on a part of the power supply line 30 connecting the LED 15 and an external power source; A power supply line arranging step (step S103) in which a power supply line 30 covered with an insulating covering member 50 is contained in a socket-shaped molded body 21 formed by molding a dispersion uncured resin. . According to the heat dissipation socket 20 manufactured by such a manufacturing method, the heat dissipation from the mounting member 10 of the LED 15 to the heat dissipation socket 20 is enhanced, and at the same time, the electrical insulation of the heat dissipation socket 20 from the power supply line 30 is ensured. it can.

  In the power supply line arranging step (step S103), the power supply line 30 covering the insulating covering member 50 is set in the mold, and the resin supply step (step of supplying filler-dispersed uncured resin into the mold) S201) and a resin curing step (step S202) for curing the filler-dispersed uncured resin in the mold. For this reason, the heat radiation socket 20 can be easily manufactured using insert molding.

  The insulating covering member 50 is formed into a tube shape, and the covering step (step S102) includes an inserting step of inserting the power supply line 30 into the tube-shaped insulating covering member 50. For this reason, the insulating coating member 50 can be easily coated on the power supply line 30.

  Further, the covering step (step S102) includes an adhesion step for heating the tube-shaped insulating covering member 50 to be in close contact with the power supply line 30 following the insertion step. For this reason, the risk of the filler-dispersed uncured resin entering from the gap between the insulating coating member 50 and the power supply line 30 during the manufacture of the heat radiating socket 20 is reduced, and the insulation between the molded body 21 and the power supply line 30 is reduced. It becomes easy to secure.

  The LED component 1 is formed by electrically connecting a mount member 10 on which the LED 15 is mounted to a heat radiating socket 20. Such an LED component 1 is excellent in heat dissipation even if many LEDs 15 are mounted, and thus becomes a light emitting member with high luminance and long life.

<4. Other Embodiments>
The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and can be implemented with various modifications.

  FIG. 8 is a modified example of the LED component of FIG. 1 and shows an assembled perspective view (8A) and an assembled perspective view (8B).

  As shown by an arrow G, the LED component 1a according to this modification is configured by attaching a substantially disc-shaped mounting member 60 to the heat dissipation socket 20 that constitutes the LED component 1 of FIG. The mount member 60 is thin unlike the mount member 10 of FIG. 1, and the plurality of LEDs 15 are exposed upward from the upper plate 61 and are distributed on the surface of the upper plate 61. The LED 15 is disposed on a circuit board (not shown), and is exposed from a through-hole through which the LED 15 formed on the upper surface of the upper plate 61 can pass. The mount member 60 includes an upper plate 61 having a diameter larger than that of the first tubular member 22, a lower plate 62 below which can be inserted into the cylinder 26 of the heat radiating socket 20, and the upper plate 61 and the lower plate 62. And an energizing terminal 16 projecting downward from the lower plate 62 while maintaining insulation. The upper plate 61 and the lower plate 62 are made of a material having high thermal conductivity so that heat can be effectively radiated from the LED 15. The upper plate 61 and the lower plate 62 are preferably made of a metal material with high thermal conductivity represented by aluminum, an aluminum alloy or the like, like the sleeve 11 of FIG. 1; high thermal conductivity represented by aluminum nitride, diamond-like carbon, or the like. A composite material in which the above-mentioned highly heat-conductive metal material or ceramic is dispersed in a resin or rubber. As described above, the LED component 1a may be configured using a lower-profile mount member 60 instead of the mount member 10 of FIG.

  The LED 15 is not an essential light source in the present invention, and other types of light sources may be used. For example, a filament-type light bulb may be used. The insulating covering member 50 that covers the power supply line 30 may cover a part of the first connecting portion 31 as long as the electrical connection between the energizing terminal 16 and the first connecting portion 31 is not hindered. Similarly, the insulating covering member 50 may cover a part of the second connection portion 32 as long as the electrical connection between the second connection portion 32 and the external power supply is not hindered.

  The present invention can be used for a light member for illumination such as an automobile, a room, and the outdoors.

1, 1a LED component 10 Mount member 15 LED (light emitting diode)
20 Heat Dissipation Socket 21 Molded Body 30 Power Supply Line 50 Insulating Cover Member 55 Filler 56 Resin 60 Mount Member

Claims (8)

A socket-shaped molded body that is formed by dispersing a filler that is superior in conductivity and thermal conductivity to the resin as a base material, and that can be electrically connected to a mount member on which a light-emitting diode is mounted,
A power supply line arranged inside the molded body and connecting the light emitting diode and an external power source;
An insulating covering member that covers at least a portion of the power supply line that comes into contact with the molded body, and has better insulating properties than the filler;
Heat dissipation socket with.   The heat dissipation socket according to claim 1, wherein the insulating covering member is made of silicone rubber.   The heat dissipation socket according to claim 1, wherein the molded body is formed by dispersing graphite in polycarbonate, polyamide, or polyphenylene sulfide. A method of manufacturing the heat dissipation socket according to claim 1,
In the uncured resin, a filler-dispersed uncured resin production step of preparing a filler-dispersed uncured resin by mixing a filler excellent in conductivity and thermal conductivity compared to the resin,
A coating step of coating an insulating coating member that is more insulative than the filler on a part of a power supply line that connects a light emitting diode and an external power source,
In a socket formed by molding the filler-dispersed uncured resin, a power feed line arranging step that includes the power feed line covered with the insulating coating member; and
A method for manufacturing a heat dissipation socket. The power supply line arranging step includes:
A resin supply step of setting the power supply line coated with the insulating covering member in a mold, and supplying filler-dispersed uncured resin into the mold;
A resin curing step of curing the filler-dispersed uncured resin in the mold;
The manufacturing method of the thermal radiation socket of Claim 4 containing this. The insulating covering member has a tube shape,
The said covering process is a manufacturing method of the thermal radiation socket of Claim 4 or Claim 5 including the insertion process which inserts the said electric power feeding line in the said insulating covering member of tube shape.   The said covering process is a manufacturing method of the heat radiating socket of Claim 6 including the contact | adherence process which heats the said tube-shaped insulating coating | coated member and adheres to the said electric power feeding line following the said insertion process. 4. An LED component comprising: a heat radiating socket according to claim 1; and a mounting member on which a light emitting diode is mounted is electrically connected.