JP2016055579A - Solder printing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder printing machine that suppresses member costs etc., and requires neither removal nor cleaning of test printed solder, and can be fully automated.SOLUTION: A solder printing machine comprises: a printing stage which holds a printed circuit board and moves the printed circuit board to and away from a metal mask; and a cleaning unit which draws cleaning paper out to between the metal mask and printed circuit board for test printing, and then carries out the test printing on the cleaning paper. The cleaning unit comprises: a delivery roller which is wound with the cleaning paper and holds it; a take-up roller which is fixed in position relative to the delivery roller, and takes up the cleaning paper delivered from the delivery roller; and a draw-out bar which is extended to the cleaning paper delivered from the delivery roller and taken up by the take-up roller to form a folding-back point of the cleaning roller, makes the delivery roller deliver the cleaning roller through motion to leave the delivery roller, and makes take up the cleaning paper through motion to move to the delivery roller.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a solder printer.

  2. Description of the Related Art When an electronic component or the like is soldered to a printed board, a technique is known in which a solder pattern is formed in advance on the printed board, the electronic component is placed on the printed board, and the solder is melted to melt the solder. At this time, the solder pattern is formed by placing a metal mask on a printed board and filling the opening of the metal mask with solder paste.

  Several proposals have been made regarding such solder pattern printing technology. For example, in Japanese Patent Application Laid-Open No. 4-247687, in order to fill the opening of the metal mask with a sufficiently kneaded solder paste, a cleaning paper is disposed between the metal mask and the printed board, Techniques for kneading have been proposed. The cleaning paper at this time is used to prevent the solder paste from adhering to the printed circuit board during kneading.

In Japanese Patent Laid-Open No. 2007-196562, a metal mask is cleaned each time a solder pattern is formed on a predetermined number of printed boards, and a cleaning film for protecting the printed board at that time is used as a metal mask. Techniques for arranging on the back side have been proposed.
That is, at the time of cleaning, the cleaning film is drawn out while the winding roller around which the cleaning film is wound is moved so as to cover the printed board, thereby protecting the printed board. When the cleaning is completed, the take-up roller returns to the position while winding the fed cleaning film.

JP-A-4-247687 JP 2007-196562 A

  However, in the configuration according to Japanese Patent Laid-Open No. 4-247687, a mechanism for arranging the cleaning paper between the printed board and the metal mask has not been proposed.

  In the configuration according to Japanese Patent Application Laid-Open No. 2007-196562, the winding roller that rotates is moved while feeding and winding the cleaning paper so that the printed circuit board is covered with the cleaning paper. At this time, it is necessary to perform printing while suppressing the slack of the cleaning paper. For this purpose, the feeding amount, winding amount, and moving amount of the cleaning paper must be controlled in conjunction with each other. However, the above patent document does not disclose such a configuration.

  Due to such problems, it is difficult to improve the solder pattern formation work efficiency in the configuration according to each patent document.

  Usually, when forming a solder pattern on a printed circuit board, it is necessary to confirm beforehand the conditions under which an appropriate solder pattern can be formed. Such conditions are acquired by performing test printing.

Of course, it is possible to perform test printing on a printed circuit board, but this is not preferable from the viewpoint of yield.
For this reason, masking the printed circuit board to prevent the solder pattern from adhering, or performing test printing on the printed circuit board, then removing the solder pattern formed on the printed circuit board and returning to the product process. Necessary.

Since the work for removing the solder pattern requires manual operation, the test printing cannot be automated. Therefore, it is difficult to improve the solder pattern forming work efficiency.
Further, in the process of masking the substrate surface of the printed circuit board, for example, use of the technique disclosed in Japanese Patent Application Laid-Open No. 2007-196562 can be considered. In this case, it is necessary that the cleaning paper does not slack, but it has been difficult to suppress such slack as described above.

Accordingly, a main object of the present invention is to provide a solder printing machine having a simple configuration and capable of fully automatic solder pattern formation including a test printing process.

  In order to solve the above problems, an invention relating to a solder printing apparatus that prints a solder pattern on a printed board using a metal mask includes a printing stage that holds the printed board and moves the printed board forward and backward with respect to the metal mask; A cleaning unit that pulls out the cleaning paper between the metal mask and the printed circuit board when performing test printing and performs test printing on the cleaning paper, and the cleaning unit winds and holds the cleaning paper. And a relative position with respect to the feeding roller, and is wound around a winding roller for winding the cleaning paper fed from the feeding roller and the cleaning paper fed from the feeding roller and taken up by the winding roller. Forms the turning point of the cleaning paper and feeds it The al away motion was fed the cleaning paper from the supply roller, characterized in that it comprises a drawer bar winds the cleaning paper in the winding roller by the movement of approaching the feeding roller.

  According to the present invention, solder pattern formation including a test printing process can be fully automated with a simple configuration, and solder pattern formation work efficiency is improved.

It is a side view of the solder printer which is performing test printing. It is a perspective view of the solder printer which is performing test printing. FIGS. 4A and 4B are diagrams illustrating steps in trial printing, where FIG. 5A shows a standby state immediately before the start of trial printing, and FIG. 5B shows a cleaning paper feeding state. It is a figure which shows the process in test printing, (a) is a printable state, (b) is a solder paste filling state, (c) is a cleaning paper winding state. It is a figure which shows a metal mask cleaning process, (a) shows the state at the time of the cleaning nozzle moving right, (b) has shown the state at the time of the cleaning nozzle moving left. FIGS. 4A and 4B are diagrams showing a printed circuit board cleaning process, in which FIG. 3A shows a state in which the sliding portion faces the printed circuit board side, FIG. 3B shows a state in which the cleaning nozzle is moved to the right, and FIG. It shows the state. It is a side view of the solder printer provided with the cleaning nozzle which has a sliding part in which four surfaces differ in shape.

  An embodiment of the present invention will be described. FIG. 1 is a side view of the solder printer 2 when trial printing is performed by the solder printer 2 according to the present embodiment, and FIG. 2 is a perspective view.

  The solder printer 2 includes a printing stage 10 and a cleaning unit 20 as main components. Reference numeral 4 denotes cleaning paper, reference numeral 5 denotes a metal mask, reference numeral 6 denotes a squeegee, reference numeral 7 denotes solder paste, and reference numeral 8 denotes a printed board.

  The solder printer 2 can perform the test printing process, the cleaning process, and the printing process fully automatically. The test printing process is a process for printing a solder pattern on the cleaning paper 4, and the printing process is a process for printing a solder pattern on the printed circuit board 8.

  The cleaning process is a generic term for a metal mask cleaning process and a substrate cleaning process. The metal mask cleaning process is a process of cleaning the surface of the metal mask 5 on the printed board 8 side (surface to be cleaned) and the inner side surface (surface to be cleaned) of the opening 5a formed in the metal mask 5. Is a process of cleaning. The board cleaning process is a process of cleaning the surface (surface to be cleaned) of the printed board 8 on which the solder pattern is printed.

  The metal mask 5 has an opening 5a corresponding to a solder pattern to be transferred (printed). The squeegee 6 slides on the metal mask 5 and fills the opening 5 a while kneading the solder paste 7 on the metal mask 5.

  The printing stage 10 is a table that holds a printed circuit board 8 on which a solder pattern is printed, and is provided so as to be able to advance and retract with respect to the metal mask 5. That is, the printing stage 10 moves up and down in FIG.

  The cleaning unit 20 includes a winding roller 21, a feeding roller 22, a drawing bar 23, and a cleaning nozzle 24.

  The cleaning unit 20 can advance and retreat with respect to the metal mask 5 within a narrower range than the printing stage 10. That is, the cleaning unit 20 moves up and down in FIG.

  The relative positions of the feeding roller 22 and the winding roller 21 are fixed, and the rotation direction is controlled. Further, the drawing bar 23 advances and retreats integrally with the cleaning nozzle 24 with respect to the feeding roller 22. That is, the drawer bar 23 moves toward and away from the feeding roller 22.

  The cleaning paper 4 is wound around the feeding roller 22. Then, when the cleaning paper 4 is fed out, and when the unused cleaning paper 4 is collected by the cleaning paper 4 fed out, the cleaning paper 4 rotates in the opposite direction.

  The pull-out bar 23 is a rod body that extends over the width direction of the cleaning paper 4 and forms a folded end where the cleaning paper 4 is folded back. In order to reduce friction between the drawer bar 23 and the cleaning paper 4, the drawer bar 23 may be a rotatable rod.

  The take-up roller 21 is provided so as to be rotatable only in one direction, and rotates in a direction in which the fed cleaning paper 4 is taken up.

  Thus, when the drawing bar 23 is separated from the feeding roller 22 side, the cleaning paper 4 is fed from the feeding roller 22, and when the drawing bar 23 approaches the feeding roller 22 side, the fed cleaning paper 4 is taken up by the winding roller 21.

  The cleaning nozzle 24 is a generally polygonal column that is rotatably provided, and extends in the width direction of the cleaning paper 4. The side surface portion of the polygonal column body forms a sliding portion 24 a that comes into contact with the cleaning paper 4. The sliding portion 24a of the cleaning nozzle 24 has a vacuum function, for example.

  In FIG. 1 and the like, a cleaning nozzle 24 having a substantially trapezoidal column is shown, and one side surface portion forms a sliding portion 24a. The sliding portion 24a rotates in the direction toward the metal mask 5 during the metal mask cleaning process, and the sliding portion 24a rotates in the direction toward the printed circuit board 8 during the substrate cleaning process. That is, the cleaning nozzle 24 rotates 180 degrees during the metal mask cleaning process and the substrate cleaning process.

  Of course, the present invention is not limited to such a configuration. For example, as shown in FIG. 7, it is good also considering the side part of a polygonal column as the sliding part 24a of a respectively different shape. In FIG. 7, the sliding surfaces 24a having different shapes on the four surfaces are formed. Then, the cleaning nozzle 24 can be rotated by 90 degrees so that the state of the surface to be cleaned (in the case of the metal mask 5, the amount of solder paste 7, the degree of adhesion, the shape and distribution of the opening 5 a, etc.) In the case of 8, it can be selected and used according to the type, amount, and adhesion state of dust. Examples of the sliding portion 24a include a suction type, a squeegee type, a plane type, and a curved type.

  Next, the movement in the solder printer 2 having the above-described configuration will be described by dividing it into (1) trial printing process, (2) cleaning process, and (3) printing process.

(1) Trial Printing Process The trial printing process is a process for performing trial printing on the cleaning paper 4. 3A and 3B are diagrams showing processing steps in the trial printing. FIG. 3A shows a standby state immediately before the start of trial printing, and FIG. 3B shows a cleaning paper feeding state. FIGS. 4A and 4B are diagrams showing processing steps in the trial printing. FIG. 4A shows a printable state, FIG. 4B shows a solder paste filling state, and FIG. 4C shows a cleaning paper winding state.

  In the standby state shown in FIG. 3A, the printing stage 10 holds the printed circuit board 8 and descends away from the metal mask 5. In the standby state, the draw bar 23 is located on the feed roller 22 side.

  When the drawing bar 23 moves away from the feeding roller 22 from this state, the feeding roller 22 rotates and feeds the cleaning paper. At this time, the rotation of the winding roller 21 is restricted so that the cleaning paper 4 is not drawn out from the winding roller 21.

  When the extraction bar 23 reaches a position that appropriately exceeds the end of the printed circuit board 8 (the state shown in FIG. 3B), the cleaning unit 20 and the printing stage 10 start to rise. When the printed circuit board 8 comes into contact with the metal mask 5 via the cleaning paper 4, the cleaning unit 20 and the printing stage 10 are stopped from rising, and the printable state shown in FIG.

  Thereafter, the solder paste 7 is placed on the metal mask 5, and the squeegee 6 slides on the metal mask 5 surface. By sliding the squeegee 6, the solder paste 7 is filled in the opening 5a while being kneaded. This state is a solder paste filling state shown in FIG. Since the cleaning paper 4 is located between the printed board 8 and the metal mask 5, the filled solder paste 7 adheres to the cleaning paper 4.

  When the solder paste 7 is filled into the opening 5 a of the metal mask 5, the printing stage 10 and the cleaning unit 20 are moved down away from the metal mask 5. At this time, the solder paste 7 filled in the opening 5 a of the metal mask 5 descends together with the cleaning paper 4. That is, the solder pattern is released from the opening 5 a while being attached to the cleaning paper 4. Thereby, the trial printing is completed (the state shown in FIG. 4C).

  When the drawing bar 23 moves to the feeding roller 22 side, the drawn cleaning paper 4 is taken up by the take-up roller 21. At this time, for example, the cleaning paper 4 facing the printed circuit board 8 in FIG. 4C is in an unused state. Accordingly, the feeding roller 22 rotates so as to rewind (collect) the unused cleaning paper 4.

(2) Cleaning Process First, the metal mask cleaning process will be described. 5A and 5B are diagrams showing the metal mask cleaning process, in which FIG. 5A shows a state when the cleaning nozzle 24 is moving right, and FIG. 5B shows a state when the cleaning nozzle 24 is moving left. ing.

  When starting the metal mask cleaning process, the sliding portion 24a of the cleaning nozzle 24 is directed toward the metal mask 5 side. Thereafter, the cleaning unit 20 moves up until the sliding portion 24 a comes into contact with the surface to be cleaned of the metal mask 5. When the sliding portion 24a contacts the surface to be cleaned of the metal mask 5, the cleaning unit 20 stops rising. Then, the cleaning nozzle 24 moves (moves to the right) in a direction away from the feeding roller 22 side.

  The cleaning paper 4 is located between the sliding portion 24 a of the cleaning nozzle 24 and the surface to be cleaned of the metal mask 5, and the sliding portion 24 a has a vacuum function, so that the sliding portion 24 a passes through the cleaning paper 4. Thus, it moves to the right while in contact with the metal mask 5.

  At this time, a force is applied so that the cleaning paper 4 is fed out from the feeding roller 22 and the winding roller 21, but the winding roller 21 is restricted so as not to rotate in the direction in which the cleaning paper 4 is fed out. Accordingly, the cleaning paper 4 is fed out from the feeding roller 22. As a result, the cleaning nozzle 24 works to the right while pressing the cleaning paper 4 against the metal mask 5 to remove the solder paste 7 and the like adhering to the surface to be cleaned of the metal mask 5, as shown in FIG. It will be in the state shown.

  When the cleaning paper 4 has air permeability and the vacuum function is activated by the cleaning nozzle 24, the removed solder paste 7 and the like are strongly adsorbed to the cleaning paper 4.

  Thereafter, the cleaning nozzle 24 moves (moves to the left) toward the feeding roller 22 side. As a result, the surface to be cleaned of the metal mask 5 is overlaid and cleaned while the fed cleaning paper 4 is wound around the winding roller 21, and the state shown in FIG. 5B is obtained.

  Next, the substrate cleaning process will be described. 6A and 6B are diagrams showing a cleaning process for the printed circuit board 8, in which FIG. 6A shows a state in which the sliding portion 24a faces the printed circuit board 8, FIG. 6B shows a state in which the cleaning nozzle 24 is moving to the right, ) Shows a state where the cleaning nozzle 24 is moving to the left.

  As shown in FIG. 6A, in the substrate cleaning process, the same procedure as the above-described metal mask cleaning process is repeated with the sliding portion 24a facing the printed circuit board 8 side.

  That is, when the substrate cleaning process is started, the printing stage 10 is moved up so that the sliding portion 24 a comes into contact with the printed circuit board 8 through the cleaning paper 4. When the sliding portion 24a comes into contact with the printed circuit board 8, the upward movement of the printing stage 10 stops and the cleaning nozzle 24 moves in the direction away from the feeding roller 22 side (moves to the right).

  As a result, the sliding portion 24a works to the right while pressing the cleaning paper 4 against the printed circuit board 8, so that foreign matters such as dust adhering to the printed circuit board 8 are wiped off.

  Then, when the cleaning nozzle 24 reaches the position shown in FIG. 6B, the cleaning nozzle 24 moves to the feeding roller 22 side (moves to the left). Thus, while the printed circuit board 8 is cleaned again, the fed cleaning paper 4 is wound around the winding roller 21 to be in the state shown in FIG.

  As described above, when performing test printing, the solder pattern is transferred (printed) to the cleaning paper, so that the work such as masking processing on the printed circuit board 8 can be reduced.

  As a result, the entire process of the solder printing machine including test printing can be automated, and work efficiency is improved.

  Further, by rotating the cleaning nozzle, the metal mask and the printed board can be continuously cleaned. In particular, by setting the cleaning nozzle in various shapes, cleaning according to the state of the surface to be cleaned is possible, and the cleaning efficiency is improved.

DESCRIPTION OF SYMBOLS 2 Solder printer 4 Cleaning paper 5 Metal mask 5a Opening 6 Squeegee 7 Solder paste 8 Printed circuit board 10 Print stage 20 Cleaning unit 21 Winding roller 22 Feeding roller 23 Pull-out bar 24a Sliding part

Claims (5)

A solder printing apparatus for printing a solder pattern on a printed circuit board using a metal mask,
A printing stage that holds the printed circuit board and advances and retracts the printed circuit board with respect to the metal mask;
A cleaning unit that pulls out cleaning paper between the metal mask and the printed circuit board when performing test printing, and performs the test printing on the cleaning paper,
The cleaning unit includes
A feeding roller for winding and holding the cleaning paper;
A winding roller that winds up the cleaning paper fed from the feeding roller, the relative position of the feeding roller being fixed;
The cleaning paper is fed from the feeding roller and is wound around the cleaning paper wound by the winding roller to form a turning point of the cleaning paper, and the cleaning paper is fed from the feeding roller by a movement away from the feeding roller. A draw bar for winding the cleaning paper with the take-up roller by a movement approaching the feed roller;
A solder printing machine comprising: The solder printer according to claim 1,
The cleaning unit includes
A sliding portion that moves in cooperation with the extraction bar and slides while contacting the metal mask or the surface to be cleaned of the printed circuit board through the cleaning paper drawn out by the extraction bar A solder printing machine comprising a cleaning nozzle. The solder printer according to claim 2,
The cleaning nozzle is a substantially polygonal column body provided rotatably, and each side surface portion of the polygonal column body forms the sliding portion having a different shape, and has a shape corresponding to the state of the surface to be cleaned. The solder printing machine is characterized in that the sliding portion rotates so as to correspond to the surface to be cleaned. The solder printer according to any one of claims 1 to 3,
The solder printing machine, wherein the cleaning unit and the printing stage move forward and backward with respect to the metal mask. The solder printer according to any one of claims 1 to 4,
The above-described feeding roller rotates when the drawing bar is separated from the feeding roller and then approaches the feeding roller to collect unused cleaning paper that has been fed out.

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