JP2016051862A - Imprint device, and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device favorable in terms of throughput for filtering an imprint material of a discharge section.SOLUTION: The imprint device for patterning on a substrate includes a discharge section 17 including a container 8 housing an imprint material for patterning, and a discharge port 7 for discharging the imprint material onto the substrate, and a filtering section 15 connected with the discharge section 17 and filtering the imprint material in the container 8. Here, a plurality of discharge sections 17 are provided, and filtering is performed in parallel with the patterning, using one of the plurality of discharge sections 17, for at least another one of the plurality of discharge sections 17.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  In addition to the conventional photolithography technique, there is a microfabrication technique in which an imprint material on a substrate is formed with a mold and a pattern is formed on the substrate by the imprint material. This technique is also called an imprint technique, and can form a fine pattern (structure) on the order of several nanometers on a substrate. For example, one of the imprint techniques is a photocuring method. In an imprint apparatus employing a photocuring method, first, a photocurable resin is discharged to one of shot areas on a substrate. Next, the resin on the substrate is molded using a mold. Then, the resin pattern is formed on the substrate by releasing the mold after irradiating light to cure the resin. In addition to the photocuring method, for example, there is a thermal cycling method, but these differences are in the method of curing the resin, and the same is true in that a resin pattern is molded using a mold. Here, Patent Document 1 discloses a cluster-type imprint apparatus including a plurality of imprint processing units in order to improve production efficiency per unit installation area of the imprint apparatus.

JP 2012-9831 A

  One of the causes of defects in patterns and molds formed on the substrate is that particles (particles) exist in an imprint material discharged onto the substrate in excess of an allowable value. The imprint apparatus can include a discharge unit including a container that stores the imprint material and a discharge port that discharges the imprint material. And in order to reduce the above defects, it is better to filter the imprint material. However, it is not preferable to reduce the throughput of the imprint apparatus for the filtration.

  An object of the present invention is to provide an imprint apparatus that is advantageous in terms of throughput for filtering, for example, an imprint material in a discharge section.

  The present invention is an imprint apparatus that performs pattern formation on a substrate, and includes a discharge unit that includes a container that stores an imprint material for pattern formation and a discharge port that discharges the imprint material onto the substrate. A filtration unit that is connected to the ejection unit and filters the imprint material in the container, and a plurality of ejection units are provided in parallel with pattern formation using one of the plurality of ejection units. Filtration is performed on at least one of the plurality of discharge units.

  According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous in terms of throughput for filtering the imprint material of the discharge unit.

It is a figure which shows the structure of the imprint apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of an imprint process part. It is a figure which shows the operation | movement by which a discharge part is conveyed. It is a figure which shows the mode of carrying out of a discharge part in time series. It is a figure which shows a mode that a discharge part is delivered to a filtration part in time series. It is a figure which shows the relationship between each discharge part and each filtration apparatus. It is a figure which shows the structure of the filtration apparatus in a filtration part. It is a figure which shows the structure of the filtration part in the case of using only resin of the same component.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  First, the configuration of an imprint apparatus according to an embodiment of the present invention will be described. An imprint apparatus is an apparatus used for manufacturing a semiconductor device as an article. The imprint apparatus is formed by bringing an uncured resin applied on a wafer (on a substrate) into contact with a mold and molding the resin on the wafer. The pattern is formed. Note that the imprint apparatus according to the present embodiment includes, as an example, a so-called cluster including a plurality of imprint processing units that respectively perform pattern formation processing on a wafer supplied from an adjacent preprocessing apparatus in parallel. It shall be a mold device. Here, although not shown, the pre-processing apparatus is a cleaning apparatus or a coating apparatus that performs pre-processing such as wafer cleaning and adhesion layer application on a lot of wafers designated by the imprint apparatus (cluster apparatus). And so on. The adhesion layer is a layer formed on the entire surface of the wafer in order to improve the adhesion between the resin and the wafer and to improve the spreadability of the uncured resin on the wafer surface. It consists of a material containing a monomolecular film or a reactive functional group.

  FIG. 1 is a schematic plan view showing a configuration of an imprint apparatus 1 according to the present embodiment. The imprint apparatus 1 includes a plurality of imprint processing units 100, a wafer conveyance unit (not shown), a first conveyance unit 14 that conveys a cartridge-type resin discharge unit, a filtration unit 15 that performs resin filtration, A cluster control unit 20. In the present embodiment, the imprint apparatus 1 includes four imprint processing units 100A to 100D as an example. In the following drawings, the Z axis is taken in parallel to the optical axis of the illumination system that irradiates the resin on the wafer with ultraviolet rays, and the X axis and the Y axis perpendicular to each other are taken in a plane perpendicular to the Z axis. ing.

  FIG. 2 is a schematic side view showing a configuration of an imprint processing unit (hereinafter simply referred to as “processing unit”) 100. Here, the processing unit 100 employs a photocuring method, and the employed resin (imprint material) is an ultraviolet curable resin (photocurable resin) having a property of being cured by receiving ultraviolet rays 19. Suppose that In addition, the configurations of the four processing units 100A to 100D are all the same. The processing unit 100 includes an illumination system 6, a mold holding mechanism 16, a wafer stage 3, an alignment measurement system 11, a discharge unit 17, a second transport unit 10, and a third transport unit 13 (see FIG. 3). And a processing unit internal control unit 18.

  The illumination system 6 adjusts the ultraviolet rays 19 emitted from the light source to light suitable for imprinting and irradiates the mold 5 during imprint processing. The light source may be a lamp such as a mercury lamp, but is not particularly limited as long as it is a light source that transmits light having a wavelength that passes through the mold 5 and cures the resin R. In this embodiment, since the photocuring method is employed, the illumination system 6 is installed. However, for example, when the thermosetting method is employed, the thermosetting resin is cured instead of the illumination system 6. The heat source part will be installed.

  The mold 5 has a polygonal shape (preferably, a rectangle or a square) as an outer peripheral shape, and a pattern portion 5a in which a concavo-convex pattern to be transferred such as a circuit pattern is formed three-dimensionally on the surface of the wafer W Including. The pattern size varies depending on the article to be manufactured, but a fine pattern includes a pattern of several tens of nanometers. The material of the mold 5 is preferably capable of transmitting the ultraviolet rays 19 and has a low coefficient of thermal expansion, and may be, for example, quartz.

  Although not shown, each of the mold holding mechanisms 16 includes a mold chuck that holds the mold 5 and a mold driving mechanism that holds the mold chuck and moves the mold 5. The mold chuck can hold the mold 5 by attracting the outer peripheral area of the irradiation surface of the ultraviolet ray 19 in the mold 5 by a vacuum adsorption force or electrostatic force. Further, the mold chuck and the mold drive mechanism have an opening region at the center (inner side) so that the ultraviolet rays 19 irradiated from the illumination system 6 pass through the mold 5 toward the wafer W. The mold driving mechanism moves the mold 5 in each axial direction so as to selectively press or separate the mold 5 and the resin R on the wafer W. Examples of the power source that can be used in the mold driving mechanism include a linear motor and an air cylinder. Moreover, in order to correspond to the highly accurate positioning of the mold 5, you may be comprised from several drive systems, such as a coarse motion drive system and a fine motion drive system. In addition to the Z-axis direction, there is also a configuration having a position adjustment function in the X-axis direction, the Y-axis direction, or the θ (rotation around the Z-axis) direction, a tilt function for correcting the tilt of the mold 5, and the like. sell. Note that the pressing and separating operation during the imprint process may be realized by moving the mold 5 in the Z-axis direction, but may be realized by moving the wafer stage 3 in the Z-axis direction, or Both of them may be moved relatively.

  The wafer W is, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate, and a resin R molded by the pattern portion 5a formed on the mold 5 is applied to the surface to be processed.

  The wafer stage 3 holds the wafer W and aligns the mold 5 and the resin R when the mold 5 and the resin R on the wafer W are pressed. The wafer stage 3 has a wafer chuck 2 that holds the wafer W by an adsorbing force, and a stage drive mechanism that holds the wafer chuck 2 by mechanical means and is movable on the surface plate 4 at least in the direction along the surface of the wafer W. And have. Examples of power sources that can be used in the stage drive mechanism include a linear motor and a planar motor. The stage drive mechanism may also be composed of a plurality of drive systems such as a coarse drive system and a fine drive system in each direction of the X axis and the Y axis. Furthermore, there may be a configuration having a drive system for position adjustment in the Z-axis direction, a position adjustment function for the wafer W in the θ direction, or a tilt function for correcting the tilt of the wafer W. The alignment measurement system 11 optically observes an alignment mark previously formed on the mold 5 and an alignment mark previously formed on the wafer W, and measures the relative positional relationship between them.

  The discharge unit 17 is installed in the vicinity of the mold holding mechanism 16 and is on the wafer W held by the wafer chuck 2 (specifically, a shot as a pattern formation region existing on the processing surface of the wafer W). Resin (uncured resin) 15 is applied. The discharge unit 17 includes a discharge port (discharge nozzle) 7 that discharges the resin R and a container (tank) 8 that stores the resin R. The discharge port 7 receives supply of the resin R from the container 8. Here, the discharge port 7 and the container 8 are integrated, and the discharge unit 17 is a so-called cartridge type unit. Here, as will be described later, the discharge unit 17 is detachable (connectable) to each processing unit 100 and each filtration unit 15, and if the discharge port 7 and the container 8 are integrated in advance, the discharge unit 17 discharges. There is no need to attach and detach the discharge port 7 and the container 8 when the entire portion 17 is attached or detached. In addition, when the resin R having a different component is used in each discharge portion 17, it is generally not possible to share the discharge port 7 with the resin R having a different component. For these reasons, it is mechanically efficient and simple if the discharge port 7 and the container 8 are previously integrated. The resin R is appropriately selected according to various conditions such as a device manufacturing process, and the amount of the resin R ejected from the ejection unit 17 is also the desired thickness of the resin R formed on the wafer W and the pattern to be formed. It is determined appropriately depending on the density of the material. The container 8 is pre-filled with a desired resin R determined based on such conditions.

  FIG. 3 is a schematic view showing an operation of transporting the cartridge type ejection unit 17 in the processing unit 100. Among these, FIG. 3A is a diagram regarding the arrangement relationship between the second transport unit 10 and the third transport unit 13 in particular. The second transport unit 10 is located between a discharge position where the discharge unit 17 discharges the resin R onto the wafer W and a retreat position where the discharge unit 17 is subjected to maintenance such as cleaning and replacement. In the state where the discharge unit 17 is held, it is possible to move in each axial direction. Specifically, the second transport unit 10 is driven while holding the discharge unit 17 while being guided by the transport path (rail) 10a suspended between the discharge position and the retreat position and the transport path 10a. And a drive unit (not shown). Further, the second transport unit 10 can remove the discharge unit 17 and can transmit a coating instruction signal from the processing unit control unit 18 to the discharge unit 17 (discharge port 7) in a state of being held. And having electrical contacts.

  FIG. 3B is a diagram relating to the arrangement relationship between the third transport unit 13 and the first transport unit 14 in particular. The third transport unit 13 is a transport robot that is installed in the vicinity of the retreat position and can deliver the discharge unit 17 between the processing unit 100 and the first transport unit 14 installed outside the processing unit 100. is there. Specifically, after receiving the discharge unit 17 from the first transfer path 14, the third transfer unit 13 can deliver the discharge unit 17 to the second transfer unit 10 located at the retracted position (discharge). Loading part 17). On the other hand, after receiving the discharge unit 17 from the second transfer unit 10 located at the retracted position, the third transfer unit 13 can deliver the discharge unit 17 to the first transfer path 14 (discharge unit). 17 carry out).

  The processing unit internal control unit 18 is configured by, for example, an information processing device (computer) or the like, and is connected to each component of the processing unit 100 via a line, and can control the operation and adjustment of each component according to a program or the like. . Although not shown, the processing unit internal control unit 18 includes a calculation unit such as a CPU or a DSP and a storage unit such as a memory for storing recipes and a hard disk. Here, the recipe is information including a series of processing parameters when processing the wafer W or a lot which is a wafer group performing the same processing. The processing parameters include, for example, shot layout, the order of shots to be imprinted, imprint conditions for each shot, and the like. The imprint conditions include, for example, a filling time that is a time for pressing the mold 5 against the resin R applied on the wafer W and an exposure time that is a time for curing the resin R by irradiating the ultraviolet rays 19. As imprint conditions, there is also a resin application amount that is the amount of resin R applied per shot. The processing unit internal control unit 18 receives the recipe from the cluster control unit 20, and performs imprint processing on the wafer W loaded by the wafer transfer unit based on the recipe. Note that the processing unit internal control unit 18 may be configured integrally with other parts of the processing unit 100 (in a common housing), or separate from other parts of the processing unit 100 (in another housing). To).

  Returning to the description of the overall configuration of the imprint apparatus 1, a wafer transfer unit (not shown) transfers the wafer W between the preprocessing apparatus and each processing unit 100, for example. Specifically, the wafer transfer unit can include a transfer path (rail) and a drive unit having an arm that supports the hand that holds the wafer W while traveling on the transfer path.

  The first transport unit 14 transports the discharge unit 17 between the processing units 100 </ b> A to 100 </ b> D and the filtering unit 15. FIG. 4 is a schematic diagram showing, in chronological order, how the discharge section 17 is specifically carried out for the region shown in FIG. Among these, FIG. 4A shows a state in which the third transport unit 13 receives the discharge unit 17 from the second transport unit 10. On the other hand, FIG. 4B shows a state in which the third transport unit 13 delivers the discharge unit 17 to the first transport unit 14. Here, specifically, the first transport unit 14 includes a transport path (rail) 14 a laid between the processing units 100 </ b> A to 100 </ b> D and the filtering unit 15, and a discharge unit while being guided by the transport path 14 a. And a drive unit (conveying robot) 14b that drives the robot 17 while holding it. Moreover, the discharge part 17 is removable from the 1st conveyance part 14 (drive part 14b). As shown in FIG. 4B, the drive unit 14 b that has received the discharge unit 17 conveys the discharge unit 17 to the filtering unit 15.

  The filtration unit 15 once collects and filters the uncured resin R stored in the container 8 (inside the container) of the discharge unit 17. FIG. 5 is a schematic diagram showing, in chronological order, how the driving unit 14b in the first transport unit 14 delivers the discharge unit 17 transported from the processing unit 100 to the filter unit 15. Among these, Fig.5 (a) shows the state which the drive part 14b moved the discharge part 17 to the filtration part 15 side. Here, in the imprint apparatus 1, a plurality of discharge units 17, that is, four in the present embodiment, are arranged in accordance with the number of installed processing units 100 so that the processing units 100 </ b> A to 100 </ b> D can perform processing in parallel. It shall exist. Moreover, it is assumed that the resin R accommodated in the container 8 of each discharge part 17 (the first discharge part 17A to the fourth discharge part 17D) has a different component (material, content, etc.). In this case, the filtering unit 15 individually corresponds to the first discharge unit 17A to the fourth discharge unit 17D, that is, four filtering devices (filter unit main bodies) 16 (first filtering unit) individually corresponding to the four types of resins R. Device 16A to fourth filtration device 16D). Moreover, the filtration part 15 contains the eight connection ports 21 (21a-21h) by which one opening is separately connected with each filtration apparatus 16, and the specific discharge part 17 is connected to the other opening. Among these, the connection port 21a and the connection port 21b are connected to the first discharge unit 17A. Similarly, the connection port 21c and the connection port 21d are connected to the second discharge unit 17B. The connection port 21e and the connection port 21f are connected to the third discharge unit 17C. Furthermore, the connection port 21g and the connection port 21h are connected to the fourth discharge portion 17D. In particular, in FIG. 5, for convenience, the first filtration device 16A that filters the resin R accommodated in the first discharge portion 17A is shown, and the second filtration device 16B to the fourth filtration device 16D are not shown. 5B shows a state in which the drive unit 14b connects (attaches) the discharge unit 17 (first discharge unit 17A) to the connection port 21a and the connection port 21b from the state shown in FIG. 5A. Show. Note that each of the ejection units 17 is not determined in a one-to-one correspondence with each of the processing units 100 </ b> A to 100 </ b> D, and can be applied to any processing unit 100. That is, for example, the first discharge unit 17A may be used in the second processing unit 100B, and conversely, the second discharge unit 17B may be used in the first processing unit 100A.

  FIG. 6 is a conceptual diagram showing the relationship between the discharge units 17A to 17D and the filtration devices 16A to 16D (the connection relationship is shown, but the structure does not correspond to FIG. 5). About the 1st discharge part 17A connected to the connection port 21a and the connection port 21b, it is as having shown in FIG. On the other hand, for example, for the second discharge part 17B connected to the connection port 21c and the connection port 21d (see FIG. 5), the second filtration device 16B is responsible for filtering the resin R. According to such a configuration, each filtration device 16 enables the resin R to be simultaneously filtered for the discharge units 17 corresponding thereto. In addition, each filtering device 16 can filter the resin R with respect to at least one of the plurality of ejection units 17 in parallel with pattern formation using one of the plurality of ejection units 17.

  FIG. 7 is a schematic diagram showing the configuration of the filtration device 16. In addition, all the structures of each filtration apparatus 16 shall be the same, and in FIG. 7, only the 1st filtration apparatus 16A is shown as an example. 16 A of 1st filtration apparatus has the circulation mechanism of resin R inside, and circulates resin R accommodated in the container 8 in the 1st discharge part 17A. Specifically, the circulation mechanism includes a pump 22, a switching valve 23, a filtration filter 24, and a particle counter 25. The pump 22 sucks the resin R accommodated in the container 8 through the connection port 21b in a state where the first discharge part 17A is connected to the connection port 21a and the connection port 21b, and passes through the connection port 21a. The resin R is circulated so that the resin R is returned to the container 8. The switching valve 23 appropriately switches the flow path of the resin R circulating in the circulation mechanism. The filtration filter 24 filters particles contained in the resin R (particles (generic name including various foreign substances)). The particle counter 25 measures (counts) the number of particles contained in the resin R. In particular, the driving of the pump 22 and the switching valve 23 which are driving systems in the filtration device 16 is not shown, but when the filtration device 16 itself has a control unit, it is based on a drive command from the cluster control unit 20. Thus, the control unit may control the drive system. Alternatively, when the filtering device 16 itself does not have a control unit, the cluster control unit 20 may directly control the drive system.

  The cluster control unit 20 controls the operation of each component of the imprint apparatus 1 that is a cluster type. Further, the cluster control unit 20 is configured by an information processing device (computer), for example. Between the cluster control unit 20, each processing unit 100, the wafer transfer unit, the first transfer unit 14 and the filtering unit 15, control signals and various information (processing recipe, unloading schedule, etc.) via a communication line (not shown). Are sent and received.

  Next, the operation of the imprint apparatus 1 will be described. First, an imprint processing operation as a pattern forming process in each processing unit 100 will be briefly described. First, the discharge unit 17 moves to a discharge position and discharges the resin R to a desired position on the wafer W held on the wafer stage 3 (application process). Next, the mold driving mechanism moves the mold 5 to contact (press) the uncured resin R applied on the wafer W with the mold 5 and mold (molding process). Next, the illumination system 6 irradiates the ultraviolet rays 19 toward the mold 5 in contact with the resin R to cure the resin R (curing step). Then, after the resin R is cured, the mold driving mechanism moves the mold 5 in a direction opposite to the pressing process, and separates the resin R on the wafer W from the mold (mold releasing process). By such a series of operations, a pattern of the resin R is formed on the wafer W.

  Here, a defect (breakage) may occur in the pattern on the wafer W formed in a certain processing unit 100 or the mold 5 itself (or the defect increases). In this case, it is considered that one of the causes is that particles exist in the resin R in excess of the allowable value. Therefore, in the present embodiment, particles existing in the resin R before coating, which is in an uncured state, are removed (reduced so as to be within an allowable value) by the following procedure. Hereinafter, as an example, it is assumed that a defect may occur in the pattern of the resin R applied using the first discharge unit 17A in the first processing unit 100A, and the particles in the imprint apparatus 1 in this case The removal process will be specifically described.

  First, the cluster control unit 20 instructs the first transport unit 14 to move the drive unit 14b to the vicinity of the application unit loading / unloading port (not shown) of the first processing unit 100A. Next, the cluster control unit 20 instructs the in-processing unit control unit 18 in the first processing unit 100A to deliver the first ejection unit 17A to the driving unit 14b. Receiving this instruction, the processing unit internal control unit 18 moves the first ejection unit 17A to the retreat position shown in FIG. After receiving the first discharge unit 17A from the second transport unit 10, an instruction is given to the drive unit 14b. The drive unit 14b that has received the first discharge unit 17A conveys the first discharge unit 17A to the filter unit 15, and as described with reference to FIG. 5, the drive unit 14b is connected to the connection port 21a and the connection port 21b in the filter unit 15. One discharge part 17A is connected.

  Next, the cluster control unit 20 drives the pump 22 in the filtration unit 15 to circulate the resin R accommodated in the container 8 in the first discharge unit 17A. In addition, the cluster control unit 20 switches the flow path of the switching valve 23 to the first flow path so that the resin R flows directly into the particle counter 25. Next, the cluster control unit 20 causes the particle counter 25 to measure the number of particles in the resin R. Next, the cluster control unit 20 determines the necessity of circulation filtration based on the measurement result (output) of the particle counter 25. Here, for example, when the number of particles exceeds an allowable value, the cluster control unit 20 determines that circulation filtration is necessary, and sets the flow path of the switching valve 23 so that the resin R flows into the filtration filter 24. Switch to the second flow path and circulate the resin R. Since the particle counter 25 is installed on the downstream side of the filter 24, the particle counter 25 continues to measure the number of particles, and the cluster control unit 20 determines that the measurement result is less than the allowable value. At the stage, the circulation filtration is terminated.

  Then, the cluster control unit 20 replaces the first discharge unit 17A with the first transport unit 14 in the reverse procedure to the first processing unit 100A (or any processing unit 100 different from the first processing unit 100A). The imprint process is continued for the processing unit 100.

  As described above, in the imprint apparatus 1, the plurality of ejection units 17 can be removed and are automatically conveyed to the filtration unit 15, and the resin R accommodated in the container 8 is filtered. Here, in the conventional imprint apparatus, when the presence of excessive particles is suspected in the resin contained in the container, maintenance such as removing the container and replacing the resin has to be performed. On the other hand, since the imprint apparatus 1 can perform maintenance without such effort, it is possible to avoid the influence on the throughput due to an increase in the downtime of the apparatus as much as possible. In particular, the imprint apparatus 1 is higher in production efficiency than an imprint apparatus having only one processing unit, and is a cluster type in which a plurality of application units are installed. In particular, this effect is remarkable. Further, in the imprint apparatus 1, since one filter unit 15 is shared so as to perform filtration for a plurality of discharge units 17, the occupied area of the imprint apparatus 1 is installed for each processing unit 100. It is possible to realize a space saving that is smaller than the case of doing so.

  Further, according to such a configuration, even when the imprint apparatus 1 does not need to filter the resin R, the imprint apparatus 1 includes a plurality of discharge units 17 that accommodate the resins R having different components according to the recipe. It can be freely changed between the processing units 100. Here, unlike the configuration in the present embodiment, for example, each application unit fixedly installed in each processing unit and the filtration unit are connected by a flexible tube, and the flexible tube is automatically attached and detached from each application unit. Technology to do is also conceivable. However, in particular, when resins having different components are used in each application part, it is impossible to flow different components of resin through one flexible tube. Will be ready to. Therefore, in this case, the entire flexible tube is removed during maintenance such as exchanging the resin, and the same effect as in the present embodiment cannot be obtained.

  As described above, according to this embodiment, it is possible to provide an imprint apparatus that is advantageous in terms of throughput for filtering the imprint material of the discharge unit.

  In the above description, it is assumed that the resin R accommodated in the container 8 of each discharge portion 17 has different components, but they may all be the same component, that is, the same type of resin. In this case, as shown in FIG. 8, the filtration unit 15 can filter the resin R accommodated in the containers 8 of the plurality of discharge units 17 in parallel using one filtration device 16.

  In the above description, the imprint apparatus 1 is a cluster type including a plurality of processing units 100. However, the present invention is also applied to a so-called non-cluster type imprint apparatus having a single processing unit. Applicable. In particular, in the case of a non-cluster type imprint apparatus having a single processing unit but having a plurality of ejection units, in parallel with pattern formation using one of the plurality of ejection units, at least one other The resin R can be filtered with respect to the discharge part. In addition, when the resins R used in the plurality of discharge portions are the same type, the resin R can be filtered with respect to at least one other discharge portion in parallel with the pattern formation using the one discharge portion. Even in an imprint apparatus having a single processing unit, it is the same as described above that particles can be removed from the resin R without applying time and effort by applying the present invention.

(Product manufacturing method)
A method for manufacturing a device (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) using the above-described imprint apparatus. Furthermore, the manufacturing method may include a step of etching the substrate on which the pattern is formed. When manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Imprint apparatus 7 Discharge port 8 Container 14 1st conveyance part 15 Filtration part 17 Discharge part 100 Processing part

Claims (12)

An imprint apparatus that performs pattern formation on a substrate,
A discharge unit including a container for storing an imprint material for forming the pattern and a discharge port for discharging the imprint material onto the substrate;
A filtration unit connected to the discharge unit to filter the imprint material in the container;
With
A plurality of the discharge units are provided, and the filtration is performed on at least one other of the plurality of discharge units in parallel with the pattern formation using one of the plurality of discharge units.
An imprint apparatus characterized by that.   2. The imprint apparatus according to claim 1, wherein the imprint material of the discharge unit that performs the filtration in parallel with the pattern formation is the same type as the imprint material used for the pattern formation.   The imprint apparatus according to claim 1, further comprising a transport unit configured to transport the discharge unit to the filtration unit.   The imprint apparatus according to claim 1, wherein a plurality of the ejection units are provided so that a plurality of patterns can be formed in parallel.   The imprint apparatus according to any one of claims 1 to 4, wherein a plurality of the filtering units are provided. The plurality of ejection units respectively accommodate a plurality of different imprint materials,
5. The imprint apparatus according to claim 1, wherein the filtration unit includes a plurality of filtration units respectively corresponding to the plurality of imprint materials.   The imprint apparatus according to claim 1, wherein the filtering unit can be connected to the plurality of ejection units in parallel.   The imprint apparatus according to any one of claims 1 to 7, wherein the filtration unit includes a filter for the filtration, and circulates the imprint material through the filter. .   9. The imprint apparatus according to claim 1, wherein the filtering unit includes a counter that counts particles included in the imprint material. 10.   The filtration unit switches between the first flow path of the imprint material that passes through the filter, the second flow path of the imprint material that does not pass through the filter, and the first flow path and the second flow path. The imprint apparatus according to claim 8, further comprising a switching valve.   The filtration unit includes a counter that counts particles contained in the imprint material, and switches the first flow path and the second flow path by the switching valve based on an output of the counter. The imprint apparatus according to claim 10. A step of performing pattern formation on a substrate using the imprint apparatus according to any one of claims 1 to 11,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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