JP2016048687A - Lamp, lamp device and lighting fixture - Google Patents

Lamp, lamp device and lighting fixture Download PDF

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JP2016048687A
JP2016048687A JP2015203930A JP2015203930A JP2016048687A JP 2016048687 A JP2016048687 A JP 2016048687A JP 2015203930 A JP2015203930 A JP 2015203930A JP 2015203930 A JP2015203930 A JP 2015203930A JP 2016048687 A JP2016048687 A JP 2016048687A
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led
lamp
cover
lighting circuit
housing
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JP6103322B2 (en
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加藤 剛
Takeshi Kato
剛 加藤
鎌田 征彦
Masahiko Kamata
征彦 鎌田
淳一 木宮
Junichi Kimiya
淳一 木宮
憲二 根津
Kenji Nezu
憲二 根津
善之 玉木
Yoshiyuki Tamaki
善之 玉木
洋人 中村
Hiroto Nakamura
洋人 中村
大塚 誠
Makoto Otsuka
誠 大塚
義行 富澤
Yoshiyuki Tomizawa
義行 富澤
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp capable of radiating heat effectively with a simple structure.SOLUTION: An LED lamp 14 includes a lightning circuit 39, a housing part 31, a heat radiation body 32, an LED substrate 34 and a cover 35. The housing part 31 includes a pair of electrode pins 49, 49 electrically connected to the lightning circuit 39, and houses the lightning circuit 39 inside. The heat radiation body 32 integrally includes a lid part 57 for covering the housing part 31, an arrangement part 58 located around the lid part 57 and a plurality of connection parts 59 for connecting the lid part 57 and the arrangement part 58. The LED substrate 34 includes an LED 86 for emitting light by power supply from the lightning circuit 39, and arranged by being thermally connected to the arrangement part 58 of the heat radiation body 32. The cover 35 has light transmissivity and covers the LED substrate 34.SELECTED DRAWING: Figure 1

Description

本発明の実施形態は、点灯回路を収容部の内部に収容したランプ、これを有するランプ装置、および、これを備えた照明器具に関する。   Embodiments described herein relate generally to a lamp in which a lighting circuit is housed in a housing portion, a lamp device having the lamp, and a lighting fixture including the lamp device.

従来、一対の電極ピンを備えたいわゆるGX53形の口金を用いたランプがある。このランプは、全体形状が扁平な円筒状であり、扁平な金属製の本体部の表面に、光源としてのLEDとが実装された光源基板であるLED基板が熱的に接続されて取り付けられているとともに、この本体部の裏面に、電極ピンと電気的に接続される給電用の点灯回路が収納された口金ケース部が配置され、LED基板が、本体部に取り付けられた反射体などにより覆われている。   Conventionally, there is a lamp using a so-called GX53 type base provided with a pair of electrode pins. This lamp has a flat cylindrical shape as a whole, and an LED substrate, which is a light source substrate on which an LED as a light source is mounted, is attached to the surface of a flat metal main body portion. In addition, a base case portion containing a power supply lighting circuit electrically connected to the electrode pins is disposed on the back surface of the main body portion, and the LED substrate is covered with a reflector attached to the main body portion. ing.

特開2011−70974号公報JP 2011-70974 A

しかしながら、従来の構成では、点灯回路での発熱とLED基板での発熱とが本体部の表裏で発生することとなるため、熱が局所的に溜まりやすく、効果的な放熱ができないという問題がある。この点、それぞれに放熱体を設けることも考えられるものの、このような構成の場合には構成が複雑化する。   However, in the conventional configuration, since heat generated in the lighting circuit and heat generated in the LED substrate are generated on the front and back of the main body, there is a problem that heat tends to accumulate locally and effective heat dissipation cannot be performed. . In this regard, although it is conceivable to provide a heat radiator for each, in such a configuration, the configuration becomes complicated.

本発明が解決しようとする課題は、点灯回路および光源基板を筐体の上下および径方向に分離して配置できるランプ、これを有するランプ装置、および、これを備えた照明器具を提供することである。 The problem to be solved by the present invention is to provide a lamp in which a lighting circuit and a light source substrate can be arranged separately in the vertical and radial directions of the casing , a lamp device having the lamp, and a lighting fixture provided with the lamp. is there.

実施形態のランプは、点灯回路、収容部、筐体、光源基板、および、カバーを備える。収容部は、基体部、および、一対の電極ピンを備える。基体部は、点灯回路を内部に収容   The lamp of the embodiment includes a lighting circuit, a housing portion, a housing, a light source substrate, and a cover. The accommodating part includes a base part and a pair of electrode pins. The base unit houses the lighting circuit inside

し下側が開放する。一対の電極ピンは、基体部の上側に設けられ点灯回路と電気的に接続される。筐体は、収容部の基体部の下側を覆う蓋部、この蓋部の周囲に位置する円環状の配置部、および、蓋部と配置部とを連結する複数の連結部を一体に備える。光源基板は、点灯回路からの給電により発光する光源を備え、筐体の配置部の下側に配置される。カバーは、透光性を有し、光源基板を覆う。 The lower side opens. The pair of electrode pins is provided on the upper side of the base portion and is electrically connected to the lighting circuit. The housing integrally includes a lid portion that covers the lower side of the base portion of the housing portion, an annular arrangement portion that is positioned around the lid portion, and a plurality of connection portions that connect the lid portion and the arrangement portion. . The light source substrate includes a light source that emits light by power feeding from the lighting circuit, and is disposed below the arrangement portion of the housing. The cover has translucency and covers the light source substrate.

本発明によれば、筐体が、点灯回路を内部に収容して下側が開放する収容部の基体部の下側を覆う蓋部と、この蓋部の周囲に位置し光源基板を下側に配置する配置部と、蓋部と配置部とを連結する複数の連結部とを一体に備えることで、点灯回路および光源基板を筐体の上下および径方向に分離して配置できる。 According to the present invention, the housing houses the lighting circuit inside and the lid that covers the lower side of the base portion of the housing that is open on the lower side, and the light source substrate that is positioned around the lid and on the lower side. The lighting circuit and the light source substrate can be separated and arranged in the vertical and radial directions of the housing by integrally including the placement portion to be placed and a plurality of connection portions that connect the lid portion and the placement portion .

第1の実施形態のランプを下方から示す分解斜視図である。It is a disassembled perspective view which shows the lamp | ramp of 1st Embodiment from the downward direction. 同上ランプを示す断面図である。It is sectional drawing which shows a lamp | ramp same as the above. 同上ランプの一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of lamp same as the above. 同上ランプのカバーを除去した状態を下方から示す平面図である。It is a top view which shows the state which removed the cover of the lamp same as the above from the downward direction. 同上ランプの収容部を下方から示す平面図である。It is a top view which shows the accommodating part of a lamp | ramp same as the above from the downward direction. 同上ランプを下方から示す平面図である。It is a top view which shows a lamp same as the above from the bottom. 同上ランプを上方から示す平面図である。It is a top view which shows a lamp same as the above from the top. 同上ランプを有するランプ装置を備えた照明器具を模式的に示す側面図である。It is a side view which shows typically the lighting fixture provided with the lamp device which has a lamp same as the above. 第2の実施形態のランプを下方から示す分解斜視図である。It is a disassembled perspective view which shows the lamp | ramp of 2nd Embodiment from the downward direction. 同上ランプの一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of lamp same as the above. 同上ランプの他の一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of other lamp | ramp same as the above. 同上ランプを下方から示す平面図である。It is a top view which shows a lamp same as the above from the bottom. 同上ランプを上方から示す平面図である。It is a top view which shows a lamp same as the above from the top. 第3の実施形態のランプを示す断面図である。It is sectional drawing which shows the lamp | ramp of 3rd Embodiment. 第4の実施形態のランプの一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of lamp | ramp of 4th Embodiment. 同上ランプの他の一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of other lamp | ramp same as the above. 第5の実施形態のランプの一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of lamp | ramp of 5th Embodiment. 同上ランプのカバーを除去した状態を下方から示す平面図である。It is a top view which shows the state which removed the cover of the lamp same as the above from the downward direction. 同上ランプの収容部を下方から示す平面図である。It is a top view which shows the accommodating part of a lamp | ramp same as the above from the downward direction. 同上ランプを下方から示す平面図である。It is a top view which shows a lamp same as the above from the bottom. 同上ランプを上方から示す平面図である。It is a top view which shows a lamp same as the above from the top. 第6の実施形態の照明器具を模式的に示す側面図である。It is a side view which shows typically the lighting fixture of 6th Embodiment.

以下、第1の実施形態の構成を図1ないし図8を参照して説明する。   The configuration of the first embodiment will be described below with reference to FIGS.

図8に示すように、照明器具11は、天井面に設置される器具本体12と、この器具本体12の中央部などに取り付けられるソケット13およびこのソケット13に着脱可能なランプであるLEDランプ14を備えたランプ装置15と、このランプ装置15を覆うグローブ16とを備えている。なお、以下、上下方向などの方向は、ランプ装置15を水平に取り付ける状態を基準とし、器具本体12およびソケット13側を上側、ランプ装置15側を下側として説明する。   As shown in FIG. 8, the lighting fixture 11 includes a fixture main body 12 installed on a ceiling surface, a socket 13 attached to a central portion of the fixture main body 12 and the like, and an LED lamp 14 which is a lamp detachable from the socket 13. And a glove 16 that covers the lamp device 15. In the following description, directions such as the vertical direction will be described with reference to the state in which the lamp device 15 is mounted horizontally, with the fixture body 12 and socket 13 side as the upper side and the lamp device 15 side as the lower side.

ソケット13は、いわゆるGX53形口金に対応するもので、電気絶縁性を有する合成樹脂製の扁平な円筒状のソケット本体21を有し、このソケット本体21の中央部に図示しない挿通孔が形成されている。さらに、ソケット本体21の下面には、中央部に対して対称な位置に、図示しないソケット開口が形成されている。各ソケット開口は、円弧状に湾曲した長孔状となっており、外部電源(商用電源)と電気的に接続され電源を供給するための受金が内部に配置されている。さらに、各ソケット開口の一端には、拡径部が形成されている。   The socket 13 corresponds to a so-called GX53 type base, and has a flat cylindrical socket body 21 made of synthetic resin having electrical insulation, and an insertion hole (not shown) is formed at the center of the socket body 21. ing. Further, a socket opening (not shown) is formed on the lower surface of the socket main body 21 at a position symmetrical to the central portion. Each socket opening is in the shape of a long hole that is curved in an arc shape, and a metal receiving part for supplying power by being electrically connected to an external power source (commercial power source) is disposed inside. Further, an enlarged diameter portion is formed at one end of each socket opening.

また、図1ないし図8に示すように、LEDランプ14は、上側から下側へと、口金ケースである収容部31、金属筐体である放熱体32、絶縁部材である絶縁シート33、光源基板としての発光素子基板であるLED基板34、および、ランプグローブであるカバー35が一体的に組み付けられて薄型の円筒状となっている。   As shown in FIGS. 1 to 8, the LED lamp 14 includes, from the upper side to the lower side, a housing part 31 that is a base case, a radiator 32 that is a metal housing, an insulating sheet 33 that is an insulating member, a light source An LED substrate 34, which is a light-emitting element substrate, and a cover 35, which is a lamp globe, are integrally assembled into a thin cylindrical shape.

収容部31は、例えばGX53形の口金部構造を有しており、電気絶縁性を有する合成樹脂製である。この収容部31は、収容部本体37を備え、点灯回路39が実装された電源基板40が内部に収容されている。   The accommodating part 31 has, for example, a GX53 type base part structure and is made of a synthetic resin having electrical insulation. The accommodating portion 31 includes an accommodating portion main body 37, and the power supply board 40 on which the lighting circuit 39 is mounted is accommodated therein.

収容部本体37は、扁平な基体部42と、この基体部42の中央部に突出する基体突出部43と、基体部42の外方に離間された位置、すなわち基体部42の周囲に位置する円環状の周縁部44と、径方向に沿って放射状に形成され基体部42と周縁部44とを連結する複数、例えば3つの連結腕部45とを一体に備えている。そして、この収容部本体37には、基体部42の外周側、周縁部44の内周側、および、連結腕部45,45間に、貫通口である通気開口46がそれぞれ設けられている。   The housing portion main body 37 is located in a flat base portion 42, a base protrusion portion 43 protruding from the central portion of the base portion 42, and a position spaced outward from the base portion 42, that is, around the base portion 42. An annular peripheral portion 44 and a plurality of, for example, three connecting arm portions 45 that are formed radially along the radial direction and connect the base portion 42 and the peripheral portion 44 are integrally provided. The accommodating portion main body 37 is provided with a ventilation opening 46 as a through hole between the outer peripheral side of the base portion 42, the inner peripheral side of the peripheral portion 44, and the connecting arm portions 45 and 45, respectively.

基体部42は、扁平な有蓋円筒状となっており、電源基板40(点灯回路39)を内部に保持するための複数の保持部48が下方に向けて突設されている。また、この基体部42には、中央部に対して対称な位置に、電極ピン49,49が内側(下側)から挿入されて外側(上側)に露出している。各電極ピン49は、円柱状に形成されており、ソケット13の各ソケット開口の拡径部に嵌合する拡大部49aを先端側に有している。したがって、これら電極ピン49は、ソケット13のソケット開口の拡径部に拡大部49aを挿入嵌合した状態でLEDランプ14を周方向に回転(旋回)させることで、拡大部49aがソケット開口の他端側に係止されて受金と電気的に接続されるとともに、LEDランプ14がソケット13(器具本体12)に接続固定されるようになっている。さらに、基体部42の外周縁部には、連結腕部45の基端に対応する位置に、ボス状のねじ受部50が形成されている。   The base portion 42 has a flat, covered cylindrical shape, and a plurality of holding portions 48 for holding the power supply substrate 40 (lighting circuit 39) inside are projected downward. In the base portion 42, electrode pins 49, 49 are inserted from the inner side (lower side) and exposed to the outer side (upper side) at positions symmetrical to the central portion. Each electrode pin 49 is formed in a columnar shape, and has an enlarged portion 49a fitted to the enlarged diameter portion of each socket opening of the socket 13 on the distal end side. Therefore, these electrode pins 49 are rotated (turned) in the circumferential direction with the enlarged portion 49a inserted and fitted into the enlarged diameter portion of the socket opening of the socket 13, so that the enlarged portion 49a is The LED lamp 14 is locked to the other end side and electrically connected to the receiver, and the LED lamp 14 is connected and fixed to the socket 13 (the instrument body 12). Further, a boss-like screw receiving portion 50 is formed on the outer peripheral edge portion of the base portion 42 at a position corresponding to the base end of the connecting arm portion 45.

また、基体突出部43は、扁平な有蓋円筒状となっており、基体部42よりも径寸法が小さく設定されている。そして、この基体突出部43は、LEDランプ14をソケット13に装着した状態でソケット本体21の挿通孔に挿入される。   The base protrusion 43 has a flat, covered cylindrical shape and is set to have a diameter smaller than that of the base 42. The base protrusion 43 is inserted into the insertion hole of the socket body 21 with the LED lamp 14 mounted on the socket 13.

また、各連結腕部45は、基端側(内側)から先端側(外側)へと徐々に幅狭となるように形成されている。さらに、これら連結腕部45は、先端側が周縁部44の外周縁よりも外方に突出している。   Further, each connecting arm portion 45 is formed so as to gradually become narrower from the proximal end side (inner side) to the distal end side (outer side). Further, the connecting arm portions 45 protrude outward from the outer peripheral edge of the peripheral edge portion 44 at the distal end side.

また、点灯回路39は、電極ピン49,49を介して図示しない外部電源(商用電源)から供給された電力を変換してLED基板34に給電するための回路である。   The lighting circuit 39 is a circuit for converting power supplied from an external power source (commercial power source) (not shown) via the electrode pins 49 and 49 and feeding the LED board 34 with power.

そして、電源基板40は、電源基板本体51と、この電源基板本体51に実装され点灯回路39を構成する電子部品52とを備え、収容部本体37の基体部42の保持部48に保持固定されている。電子部品52は、電源基板本体51を保持部48に保持した状態で基体突出部43の内部に一部が嵌合して位置している。さらに、この電源基板40には、各電極ピン49と電気的に接続される配線53と、LED基板34と電気的に接続される複数の配線54とがそれぞれ導出されている。これら配線54は、収容部31のいずれかの連結腕部45に沿って配置され、この連結腕部45にて周縁部44の外縁部よりも外方の位置に突設された角筒状の配線挿通部55内に挿通されてLED基板34側へと導かれている。また、これら配線54の先端側は、一つのコネクタ56に接続されている。   The power supply board 40 includes a power supply board main body 51 and an electronic component 52 that is mounted on the power supply board main body 51 and constitutes the lighting circuit 39, and is held and fixed to the holding portion 48 of the base portion 42 of the housing portion main body 37. ing. A part of the electronic component 52 is fitted and positioned inside the base protrusion 43 in a state where the power supply substrate body 51 is held by the holding portion 48. Further, the power supply board 40 is provided with a wiring 53 electrically connected to each electrode pin 49 and a plurality of wirings 54 electrically connected to the LED board 34. These wirings 54 are arranged along any one of the connecting arm portions 45 of the accommodating portion 31, and the connecting arm portion 45 projects in a rectangular tube shape projecting outward from the outer edge portion of the peripheral edge portion 44. It is inserted into the wiring insertion part 55 and led to the LED board 34 side. Further, the leading ends of these wirings 54 are connected to one connector 56.

また、放熱体32は、放熱性および熱伝導性に優れた例えばアルミニウムなどの金属により薄板状に形成されている。この放熱体32は、収容部31を覆う円形状の蓋部57と、この蓋部57の外方の周囲に位置する円環状の配置部58と、径方向に沿って放射状に形成され蓋部57と配置部58とを連結する複数、例えば3つの連結部59とを一体に備えている。このため、放熱体32には、蓋部57の外周側、配置部58の内周側、および、連結部59,59間に、開口部60がそれぞれ設けられている。そして、この放熱体32は、収容部31に対して、放熱体固定部材である複数のねじ61により固定されている。   Further, the radiator 32 is formed in a thin plate shape with a metal such as aluminum having excellent heat dissipation and thermal conductivity. The heat dissipating body 32 includes a circular lid portion 57 that covers the accommodating portion 31, an annular arrangement portion 58 that is located on the outer periphery of the lid portion 57, and a lid portion that is formed radially along the radial direction. A plurality of, for example, three connecting portions 59 for connecting 57 and the placement portion 58 are integrally provided. For this reason, the heat radiating body 32 is provided with openings 60 between the outer peripheral side of the lid portion 57, the inner peripheral side of the arrangement portion 58, and between the connecting portions 59, 59, respectively. The heat radiating body 32 is fixed to the housing portion 31 by a plurality of screws 61 that are heat radiating body fixing members.

蓋部57は、収容部31の収容部本体37全体を覆う円形状に形成されている。また、この蓋部57の外周縁部近傍には、各連結部59の基端に対応する位置に、ねじ61が挿入されるねじ孔65がそれぞれ設けられている。これらねじ孔65は、放熱体32を収容部31に取り付けた状態で収容部31のねじ受部50とそれぞれ連通し、これらねじ孔65に挿入されたねじ61がねじ受部50にねじ止めされるようになっている。さらに、この蓋部57の外周縁部は、上側に屈曲されて突出しており、この外周縁部の各開口部60の中央部には、放熱体32を収容部31に対して回り止めおよび位置決めするための放熱体側係合部としての引っ掛け受部66がそれぞれ上側、すなわち収容部31側に向けて突設されている。これら引っ掛け受部66は、ループ状に形成されており、放熱体32を収容部31に取り付けた状態で、収容部本体37の基体部42の外周に突設されたフック状の収容部側係合部としての引っ掛け部67にそれぞれ係合されるようになっている。   The lid portion 57 is formed in a circular shape that covers the entire housing portion main body 37 of the housing portion 31. Further, in the vicinity of the outer peripheral edge portion of the lid portion 57, screw holes 65 into which the screws 61 are inserted are provided at positions corresponding to the base ends of the connection portions 59, respectively. These screw holes 65 communicate with the screw receiving portions 50 of the accommodating portion 31 in a state in which the radiator 32 is attached to the accommodating portion 31, and the screws 61 inserted into these screw holes 65 are screwed to the screw receiving portions 50. It has become so. Further, the outer peripheral edge portion of the lid portion 57 is bent upward and protrudes, and the heat radiating body 32 is prevented from rotating and positioned with respect to the housing portion 31 at the central portion of each opening 60 of the outer peripheral edge portion. A hook receiving portion 66 as a radiator-side engagement portion for projecting is provided on the upper side, that is, toward the accommodating portion 31 side. These hook receiving portions 66 are formed in a loop shape, and in the state where the heat radiating body 32 is attached to the housing portion 31, a hook-like housing portion side engagement projecting from the outer periphery of the base portion 42 of the housing portion main body 37 is provided. Each is engaged with a hooking portion 67 as a joint portion.

また、配置部58は、円環平板状に形成されLED基板34の配置面となる配置面部71と、この配置面部71の外周縁から下方に向けて屈曲して突出した屈曲部72とを一体に備えている。配置面部71の内周縁近傍、すなわち蓋部57の外周縁近傍の位置には、角孔状の開口73が設けられている。また、この配置面部71の外周縁近傍には、LED基板34を放熱体32に固定部材である複数のねじ75によって固定するための複数のねじ孔76が設けられている。また、屈曲部72には、カバー35を放熱体32に係止するための角孔状の係止開口78が複数設けられている。   The placement portion 58 is formed by integrating a placement surface portion 71 that is formed in an annular flat plate shape and serves as a placement surface of the LED substrate 34 and a bent portion 72 that is bent and protrudes downward from the outer peripheral edge of the placement surface portion 71. In preparation. A square hole-shaped opening 73 is provided in the vicinity of the inner peripheral edge of the arrangement surface portion 71, that is, in the vicinity of the outer peripheral edge of the lid portion 57. A plurality of screw holes 76 for fixing the LED substrate 34 to the heat radiating body 32 with a plurality of screws 75 as fixing members are provided in the vicinity of the outer peripheral edge of the arrangement surface portion 71. The bent portion 72 is provided with a plurality of square hole-like locking openings 78 for locking the cover 35 to the heat radiating body 32.

開口73は、蓋部57の外周縁と隣接して位置しており、放熱体32を収容部31に取り付けた状態で配線挿通部55が挿入される。この開口73に挿入された配線挿通部55の先端側は、放熱体32の配置部58(配置面部71)の下面よりもカバー35側である下側に突出しており、各配線54と開口73の縁部との干渉を防止している。   The opening 73 is positioned adjacent to the outer peripheral edge of the lid portion 57, and the wiring insertion portion 55 is inserted in a state where the radiator 32 is attached to the housing portion 31. The distal end side of the wiring insertion part 55 inserted into the opening 73 protrudes downward from the lower surface of the disposing part 58 (arrangement surface part 71) of the radiator 32 on the cover 35 side. Interference with the edge of the

また、各連結部59は、収容部31の各連結腕部45の基端側を覆う部分であり、基端側(内側)から先端側(外側)へと徐々に幅狭となるように形成されている。   Each connecting portion 59 is a portion that covers the base end side of each connecting arm portion 45 of the accommodating portion 31, and is formed so as to gradually become narrower from the base end side (inner side) to the distal end side (outer side). Has been.

また、絶縁シート33は、放熱体32とLED基板34とを絶縁するためのもので、円環状に形成され、放熱体32の配置部58の配置面部71の下面を覆ってLED基板34とともに取り付け固定されている。この絶縁シート33は、配置面部71と略等しい幅寸法に設定されており、配置面部71の下面の略全体を覆っている。さらに、この絶縁シート33には、内周縁側の位置に、放熱体32の開口73と連通して各配線54が挿通される角孔状の連通開口81が設けられている。また、この絶縁シート33には、外周縁近傍の位置に、放熱体32の各ねじ孔76と連通する連通孔82がそれぞれ設けられている。   The insulating sheet 33 is for insulating the radiator 32 and the LED substrate 34, is formed in an annular shape, covers the lower surface of the arrangement surface portion 71 of the arrangement portion 58 of the radiator 32, and is attached together with the LED substrate 34. It is fixed. The insulating sheet 33 is set to have a width dimension substantially equal to that of the arrangement surface portion 71 and covers substantially the entire lower surface of the arrangement surface portion 71. Further, the insulating sheet 33 is provided with a rectangular hole-shaped communication opening 81 that communicates with the opening 73 of the heat radiating body 32 and through which each wiring 54 is inserted, at a position on the inner peripheral edge side. The insulating sheet 33 is provided with a communication hole 82 communicating with each screw hole 76 of the heat radiating body 32 at a position near the outer peripheral edge.

また、LED基板34は、LEDモジュールとも呼ばれるものであり、円環平板状の基板本体85と、この基板本体85に実装された固体発光素子としての光源である複数のLED86とを一体的に備えている。   The LED board 34 is also called an LED module, and integrally includes an annular flat plate board body 85 and a plurality of LEDs 86 that are light sources as solid light emitting elements mounted on the board body 85. ing.

基板本体85は、配置部58の配置面部71よりも狭い幅寸法に設定されている。このため、LED基板34は、配置部58の配置面部71に取り付けられた状態で、内周縁および外周縁がそれぞれ配置部58の配置面部71(絶縁シート33)の内周縁および外周縁に対して所定幅オフセットしている。また、この基板本体85には、放熱体32の開口73および絶縁シート33の連通開口81と連通して各配線54が挿通される切欠開口部88が内周縁に切り欠き形成されている。さらに、この基板本体85の下面には、切欠開口部88の近傍に、この切欠開口部88(開口73および連通開口81)から導出された各配線54がコネクタ56を介して電気的に接続されるコネクタ受部89が実装されている。そして、この基板本体85には、放熱体32の各ねじ孔76および絶縁シート33の各連通孔82と連通しねじ75が挿入される通孔90がそれぞれ設けられている。   The substrate body 85 is set to have a narrower width dimension than the placement surface portion 71 of the placement portion 58. For this reason, the LED substrate 34 is attached to the arrangement surface portion 71 of the arrangement portion 58, and the inner peripheral edge and the outer peripheral edge are respectively relative to the inner edge and the outer periphery of the arrangement surface portion 71 (insulating sheet 33) of the arrangement portion 58. A predetermined width is offset. Further, the substrate body 85 is formed with a notch opening portion 88 formed in the inner peripheral edge thereof, which is in communication with the opening 73 of the heat radiating body 32 and the communication opening 81 of the insulating sheet 33 and through which each wiring 54 is inserted. In addition, on the lower surface of the substrate body 85, each wiring 54 led out from the notch opening 88 (the opening 73 and the communication opening 81) is electrically connected via the connector 56 in the vicinity of the notch opening 88. A connector receiving portion 89 is mounted. The board body 85 is provided with through holes 90 into which the screw holes 76 of the radiator 32 and the communication holes 82 of the insulating sheet 33 and the communication screws 75 are inserted.

また、各LED86は、例えば青色光を発光するLEDチップを、黄色発光系の樹脂封止層によって覆った面実装型の素子であり、基板本体85の下面、すなわちカバー35に対向する面の外周側の位置に、所定の列(仮想円C)上に沿って互いに略等間隔に離間されて配置されている。なお、この仮想円Cは、基板本体85と同心の円であり、この仮想円C上には、通孔90が位置している。したがって、LED基板34は、この仮想円C上の位置で放熱体32に対して各ねじ75によって固定され、放熱体32に対して熱的に接続されている。   Each LED 86 is a surface-mounted element in which, for example, an LED chip that emits blue light is covered with a yellow light-emitting resin sealing layer, and the outer periphery of the lower surface of the substrate body 85, that is, the surface facing the cover 35 At a position on the side, they are arranged at substantially equal intervals along a predetermined row (virtual circle C). The virtual circle C is a concentric circle with the substrate body 85, and the through hole 90 is located on the virtual circle C. Therefore, the LED substrate 34 is fixed to the heat radiating body 32 at each position on the virtual circle C by the screws 75 and is thermally connected to the heat radiating body 32.

また、カバー35は、透光性を有する合成樹脂製であり、放熱体32の配置部58(配置面部71)に対応する円環状に形成されている。さらに、このカバー35は、LED基板34(LED86)の下側(発光側)に対向する円環帯状の覆い部93と、この覆い部93の外周縁に設けられカバー35を放熱体32に係止するための係止部としての係止爪部94とを一体に備えている。   The cover 35 is made of a synthetic resin having translucency, and is formed in an annular shape corresponding to the arrangement portion 58 (arrangement surface portion 71) of the heat radiating body 32. Further, the cover 35 is provided on an annular belt-like cover portion 93 facing the lower side (light emitting side) of the LED substrate 34 (LED 86), and the cover 35 is provided on the outer peripheral edge of the cover portion 93. A locking claw portion 94 as a locking portion for stopping is integrally provided.

覆い部93は、平面状に形成されており、LED基板34に対して下方に離間されて位置している。   The cover portion 93 is formed in a planar shape, and is positioned so as to be spaced downward with respect to the LED substrate 34.

また、係止爪部94は、放熱体32の係止開口78に挿入されて係止される部分であり、覆い部93の外周縁に爪状に形成されている。   The locking claw portion 94 is a portion that is inserted into the locking opening 78 of the heat radiating body 32 to be locked, and is formed in a claw shape on the outer peripheral edge of the cover portion 93.

そして、グローブ16は、透光性を有する合成樹脂などにより、例えば上側が開口した有底円筒状に形成され、LEDランプ14(ランプ装置15)を覆って、LEDランプ14(LED86)からの発光を拡散させるように構成されている。   The globe 16 is formed of a light-transmitting synthetic resin or the like, for example, into a bottomed cylindrical shape having an upper opening, covers the LED lamp 14 (lamp device 15), and emits light from the LED lamp 14 (LED 86). Is configured to diffuse.

次に、上記第1の実施形態の作用を説明する。   Next, the operation of the first embodiment will be described.

LEDランプ14を組み立てる際には、まず、各電極ピン49を取り付けた収容部31の収容部本体37に対して、電子部品52を電源基板本体51に実装した電源基板40(点灯回路39)を挿入して保持部48により保持し、各電極ピン49と電源基板40とを各配線53により電気的に接続する。また、電源基板40から導出された各配線54は、いずれかの連結腕部45上に沿って引き出し、配線挿通部55に挿通して収容部31の下側に導出する。   When assembling the LED lamp 14, first, the power supply board 40 (lighting circuit 39) in which the electronic component 52 is mounted on the power supply board main body 51 with respect to the housing part main body 37 of the housing part 31 to which each electrode pin 49 is attached. The electrode pins 49 and the power supply substrate 40 are electrically connected by the wirings 53 by being inserted and held by the holding part 48. In addition, each wiring 54 led out from the power supply substrate 40 is drawn out along any one of the connecting arm portions 45, inserted into the wiring insertion portion 55, and led out below the housing portion 31.

次いで、この収容部31に対して、放熱体32を取り付ける。このとき、放熱体32は、各連結部59を収容部31の各連結腕部45とそれぞれ位置合わせし、各ねじ孔65を各ねじ受部50と位置合わせするとともに、各引っ掛け受部66を各引っ掛け部67と位置合わせしつつ、収容部31側へと押し込むことで、各引っ掛け部67が各引っ掛け受部66に係合し、放熱体32が収容部31に対して仮係止される。このとき、配線挿通部55から導出された各配線54およびコネクタ56は、配置部58の配置面部71の開口73に挿通して、この配置面部71の下側に導出する。この後、ねじ61を各ねじ孔65に挿入して各ねじ受部50にねじ止めすることで、放熱体32が収容部31に取り付け固定される。この状態で、放熱体32は、蓋部57により収容部31の収容部本体37の基体部42を覆うとともに、各連結部59の背面である上面に収容部31の各連結腕部45が位置し、かつ、配置部58が蓋部57(収容部31)の外方の周囲に位置する。   Next, the heat radiating body 32 is attached to the housing portion 31. At this time, the heat radiator 32 aligns each connecting portion 59 with each connecting arm portion 45 of the accommodating portion 31, aligns each screw hole 65 with each screw receiving portion 50, and each hook receiving portion 66. Each hook 67 is engaged with each hook receiving portion 66 by being pushed into the accommodating portion 31 side while being aligned with each hook 67, and the radiator 32 is temporarily locked with respect to the accommodating portion 31. . At this time, each wiring 54 and connector 56 derived from the wiring insertion portion 55 are inserted into the opening 73 of the arrangement surface portion 71 of the arrangement portion 58 and led out below the arrangement surface portion 71. Thereafter, the heat radiator 32 is attached and fixed to the housing portion 31 by inserting the screw 61 into each screw hole 65 and screwing it to each screw receiving portion 50. In this state, the radiator 32 covers the base portion 42 of the accommodating portion main body 37 of the accommodating portion 31 with the lid portion 57, and each connecting arm portion 45 of the accommodating portion 31 is positioned on the upper surface that is the back surface of each connecting portion 59. And the arrangement | positioning part 58 is located in the outer periphery of the cover part 57 (accommodating part 31).

さらに、この放熱体32に対して、絶縁シート33を介して、予め基板本体85にLED86およびコネクタ受部89などを実装したLED基板34を取り付ける。このとき、絶縁シート33は、連通開口81を放熱体32の開口73と位置合わせするとともに、各連通孔82を放熱体32の各ねじ孔76と位置合わせする。また、LED基板34は、基板本体85の切欠開口部88を絶縁シート33の連通開口81および放熱体32の開口73と位置合わせするとともに、各通孔90を絶縁シート33の各連通孔82および放熱体32の各ねじ孔76と位置合わせする。この状態で、ねじ75を各通孔90および各連通孔82に挿入して各ねじ孔76にねじ止めすることで、LED基板34が絶縁シート33を介して放熱体32の配置部58の配置面部71に取り付け固定される。また、放熱体32の開口73から導出した各配線54およびコネクタ56は、絶縁シート33の連通開口81およびLED基板34の切欠開口部88から導出して、コネクタ56をコネクタ受部89に接続することで、点灯回路39が各LED86と電気的に接続される。   Further, the LED substrate 34 on which the LED 86 and the connector receiving portion 89 are mounted in advance on the substrate body 85 is attached to the heat radiating body 32 via the insulating sheet 33. At this time, the insulating sheet 33 aligns the communication opening 81 with the opening 73 of the radiator 32 and aligns the communication holes 82 with the screw holes 76 of the radiator 32. In addition, the LED board 34 aligns the notch opening 88 of the substrate body 85 with the communication opening 81 of the insulating sheet 33 and the opening 73 of the heat radiating body 32, and each through hole 90 is connected to each communication hole 82 of the insulating sheet 33 and Alignment with each screw hole 76 of the radiator 32 is performed. In this state, the screws 75 are inserted into the respective through holes 90 and the respective through holes 82 and screwed into the respective screw holes 76, so that the LED substrate 34 is disposed in the arrangement portion 58 of the radiator 32 via the insulating sheet 33. Attached and fixed to the surface portion 71. Further, each wiring 54 and connector 56 led out from the opening 73 of the heat radiating body 32 are led out from the communication opening 81 of the insulating sheet 33 and the notch opening 88 of the LED substrate 34 to connect the connector 56 to the connector receiving portion 89. Thus, the lighting circuit 39 is electrically connected to each LED 86.

そして、このLED基板34を覆ってカバー35を放熱体32に取り付ける。このとき、カバー35は、各係止爪部94を放熱体32の各係止開口78に位置合わせしつつ放熱体32側へと押し込むことで、これら係止爪部94が係止開口78にそれぞれ係合する。この結果、カバー35の覆い部93がLED基板34の各LED86を覆った状態となる。   Then, the cover 35 is attached to the radiator 32 so as to cover the LED substrate 34. At this time, the cover 35 pushes the locking claw portions 94 into the locking openings 78 by pushing the locking claw portions 94 to the radiator 32 side while aligning the locking claws 94 with the locking openings 78 of the heat radiator 32. Engage with each other. As a result, the cover portion 93 of the cover 35 covers the LEDs 86 of the LED substrate 34.

このように組み立てたLEDランプ14は、各電極ピン49をソケット13のソケット開口の拡径部に挿入した状態で周方向に旋回させることで、器具本体12に対して取り付けられ、各電極ピン49が、受金を介して外部電源(商用電源)と電気的に接続される。この後、LEDランプ14を覆って器具本体12に対してグローブ16を取り付けることで、照明器具11が完成する。   The LED lamp 14 assembled in this way is attached to the instrument body 12 by turning each electrode pin 49 in the circumferential direction in a state where the electrode pin 49 is inserted into the enlarged diameter portion of the socket opening of the socket 13, and each electrode pin 49 However, it is electrically connected to an external power source (commercial power source) via the money receiver. Then, the lighting fixture 11 is completed by covering the LED lamp 14 and attaching the globe 16 to the fixture body 12.

ソケット13により外部電源(商用電源)から各電極ピン49を介して点灯回路39に供給された電力は、この点灯回路39によって変換されて各LED86に供給され、これらLED86が点灯する。各LED86からの発光は、カバー35の覆い部93によって拡散されるとともに、グローブ16によって拡散されて照射される。   The electric power supplied from the external power source (commercial power source) to the lighting circuit 39 via the electrode pins 49 by the socket 13 is converted by the lighting circuit 39 and supplied to the LEDs 86, and the LEDs 86 are lit. Light emitted from each LED 86 is diffused by the cover portion 93 of the cover 35 and is also diffused and irradiated by the globe 16.

点灯回路39からの熱は、この点灯回路39を覆う放熱体32の蓋部57に伝達される。また、LED基板34(LED86)からの熱は、基板本体85から絶縁シート33を介して、放熱体32の配置部58に伝達される。したがって、点灯回路39とLED基板34(LED86)とで発熱領域が分離されて局所的(部分的)な熱のこもり(溜まり)が最小限に抑制されるとともに、放熱体32は、蓋部57によって大きな表面積を確保し、LED基板34(LED86)からの熱を効果的に大気中に放出する。   Heat from the lighting circuit 39 is transmitted to the lid portion 57 of the radiator 32 that covers the lighting circuit 39. Further, the heat from the LED board 34 (LED 86) is transmitted from the board body 85 to the arrangement portion 58 of the heat radiating body 32 through the insulating sheet 33. Therefore, the heat generating area is separated by the lighting circuit 39 and the LED board 34 (LED 86), and local (partial) heat accumulation (accumulation) is suppressed to a minimum. Thus, a large surface area is secured, and heat from the LED board 34 (LED 86) is effectively released into the atmosphere.

特に、放熱体32は、LED基板34(LED86)からの熱を受け取った配置部58の内周側および外周側に向かって熱対流を生じるとともに、点灯回路39を覆う蓋部57とLED基板34が配置される配置部58との間に位置する開口部60(収容部31の通気開口46)を外気が通り抜けることにより(矢印H1,H2)、効果的に大気中に放熱する。   In particular, the radiator 32 generates thermal convection toward the inner peripheral side and the outer peripheral side of the arrangement portion 58 that has received heat from the LED substrate 34 (LED 86), and covers the lighting circuit 39 and the LED substrate 34. When the outside air passes through the opening 60 (the ventilation opening 46 of the housing portion 31) located between the disposing portion 58 where the air is disposed (arrows H1 and H2), heat is effectively radiated to the atmosphere.

上述したように、上記第1の実施形態によれば、放熱体32が、点灯回路39を内部に収容する収容部31を覆う蓋部57と、この蓋部57の周囲に位置しLED基板34を熱的に接続して配置する配置部58とを一体に備えることで、点灯回路39およびLED基板34(LED86)からの熱を蓋部57と配置部58とに分散させるとともに放熱体32の表面積を増加させることができ、簡単な構成で効果的に放熱できる。   As described above, according to the first embodiment, the heat radiating body 32 includes the lid portion 57 that covers the housing portion 31 that houses the lighting circuit 39 therein, and the LED substrate 34 that is positioned around the lid portion 57. Are integrally provided with a placement portion 58 that is thermally connected to disperse heat from the lighting circuit 39 and the LED board 34 (LED 86) to the lid portion 57 and the placement portion 58 and The surface area can be increased, and heat can be effectively radiated with a simple configuration.

次に、第2の実施形態を図9ないし図13を参照して説明する。なお、上記第1の実施形態と同様の構成および作用については、同一符号を付してその説明を省略する。   Next, a second embodiment will be described with reference to FIGS. In addition, about the structure and effect | action similar to the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

第2の実施形態のLEDランプ14は、収容部31が、収容部本体37と、この収容部本体37を覆う別体の合成樹脂製の蓋体96とを備え、カバー35が、LED基板34の各LED86から発光された光を拡散させるレンズ部97と、LED基板34を放熱体32に対して押さえつける押さえ部98とを有しているものである。   In the LED lamp 14 of the second embodiment, the housing portion 31 includes a housing portion main body 37 and a separate synthetic resin lid body 96 that covers the housing portion main body 37, and the cover 35 includes the LED substrate 34. The lens portion 97 for diffusing the light emitted from each LED 86 and the pressing portion 98 for pressing the LED substrate 34 against the heat radiating body 32 are provided.

収容部31は、収容部本体37のねじ受部50が各連結腕部45に配置されている。また、蓋体96は、収容部本体37の基体部42の下側を覆って閉塞する円板状に形成されている。さらに、この蓋体96の上部には、各電極ピン49を支持するボス状の電極ピン支持部101が突設されている。このため、蓋体96は、収容部本体37に取り付けられた状態で、この収容部本体37と熱的に接続される。また、この蓋体96の下面は、放熱体32の蓋部57に対して面状に接触し、全面が密着するようになっている。   In the accommodating portion 31, the screw receiving portion 50 of the accommodating portion main body 37 is disposed on each connecting arm portion 45. Further, the lid 96 is formed in a disc shape that covers and closes the lower side of the base portion 42 of the accommodating portion main body 37. Further, a boss-like electrode pin support portion 101 that supports each electrode pin 49 is provided on the upper portion of the lid 96. For this reason, the lid 96 is thermally connected to the housing main body 37 in a state where it is attached to the housing main body 37. Further, the lower surface of the lid 96 is in planar contact with the lid 57 of the heat radiating body 32 so that the entire surface is in close contact therewith.

また、カバー35は、覆い部93のLED基板34のLED86に対向する位置、すなわち仮想円Cに対応する位置に円環状に連続するレンズ部97を備えている。さらに、このカバー35は、レンズ部97の内周縁側の位置に、押さえ部98の一部をなす第1の押さえ部としての内側押さえ部103が形成されているとともに、内側押さえ部103よりも内周側の位置に、押さえ部98の一部をなす第2の押さえ部としての押さえリブ104が形成されている。また、このカバー35のレンズ部97よりも外周側、すなわちカバー35の外周縁側には、放熱体32の配置部58の配置面部71と密着する平面状の平面部105が全周に亘って連続して形成されている。そして、カバー35の内周縁には、このカバー35を放熱体32に対して係止するための複数、例えば3つのカバー係止部としての係止腕部106が中央部に向けて放射状に突設されている。   The cover 35 includes an annular lens portion 97 at a position facing the LED 86 of the LED substrate 34 of the cover portion 93, that is, a position corresponding to the virtual circle C. Further, the cover 35 is formed with an inner pressing portion 103 as a first pressing portion forming a part of the pressing portion 98 at a position on the inner peripheral edge side of the lens portion 97, and more than the inner pressing portion 103. A pressing rib 104 as a second pressing portion forming a part of the pressing portion 98 is formed at a position on the inner peripheral side. Further, on the outer peripheral side of the lens part 97 of the cover 35, that is, on the outer peripheral edge side of the cover 35, a flat planar part 105 that is in close contact with the arrangement surface part 71 of the arrangement part 58 of the heat radiating body 32 is continuous over the entire circumference. Is formed. On the inner peripheral edge of the cover 35, a plurality of, for example, three locking arm portions 106 serving as cover locking portions for locking the cover 35 to the heat radiating body 32 project radially toward the center portion. It is installed.

レンズ部97は、カバー35の厚さ方向である下側に突出し、断面が円弧状となっている。また、レンズ部97の頂部97aは、それぞれLED86の直下に対向して位置し、この頂部97aからカバー35の内周側および外周側に、それぞれ傾斜状の出射面97b,97bが形成されている。   The lens portion 97 protrudes downward in the thickness direction of the cover 35, and has a circular arc cross section. Further, the top part 97a of the lens part 97 is positioned directly below the LED 86, and inclined emission surfaces 97b and 97b are respectively formed on the inner peripheral side and the outer peripheral side of the cover 35 from the top part 97a. .

また、押さえ部98は、放熱体32を収容部31に取り付けた状態でLED基板34の基板本体85を放熱体32の配置部58(配置面部71)に押さえつけることで、LED基板34の熱をより確実に放熱体32(配置部58)に伝達するように構成されている。   Further, the holding portion 98 presses the substrate main body 85 of the LED substrate 34 against the arrangement portion 58 (arrangement surface portion 71) of the heat radiator 32 in a state where the heat radiator 32 is attached to the housing portion 31, thereby It is configured to transmit to the heat radiating body 32 (arrangement portion 58) more reliably.

内側押さえ部103は、レンズ部97の内周側の出射面97bと連続する位置、すなわちレンズ部97の内周縁の全周に亘って連続した円環平面状に形成されている。   The inner pressing portion 103 is formed in an annular planar shape that is continuous with the emission surface 97 b on the inner peripheral side of the lens portion 97, that is, over the entire circumference of the inner peripheral edge of the lens portion 97.

また、各押さえリブ104は、カバー35の背面である上面に径方向に沿って放射状にそれぞれ形成されて突出しており、互いに略等間隔に離間されている。   Further, the holding ribs 104 are radially formed on the upper surface, which is the back surface of the cover 35, and projecting radially along the radial direction, and are spaced apart from each other at substantially equal intervals.

また、平面部105は、レンズ部97の外周側にフランジ状に突出して連続している。   Further, the flat portion 105 is continuous and protrudes in a flange shape on the outer peripheral side of the lens portion 97.

さらに、各係止腕部106は、放熱体32の各連結部59に対応する位置に突設されており、基端側から先端側へと、徐々に幅狭となるように形成されている。また、これら係止腕部106の先端側の上部には、内周側に向けて爪部106aが突設されている。これら係止腕部106の爪部106aは、放熱体32の各連結部59の蓋部57の外周縁近傍に設けられた角孔状の係止開口部108に挿入係止されるようになっている。さらに、いずれかの係止腕部106には、LED基板34に実装されたコネクタ受部89、各配線54およびコネクタ56などとの干渉を避けるための干渉防止部106bが下側に膨出して形成されている。   Further, each locking arm portion 106 protrudes at a position corresponding to each connecting portion 59 of the heat radiating body 32, and is formed so as to gradually become narrower from the proximal end side to the distal end side. . Further, a claw portion 106a protrudes toward the inner peripheral side at the upper portion on the distal end side of the locking arm portion 106. The claw portions 106a of these locking arm portions 106 are inserted and locked in square hole-shaped locking openings 108 provided in the vicinity of the outer peripheral edge of the lid portion 57 of each connecting portion 59 of the heat radiating body 32. ing. Further, in any one of the locking arm portions 106, an interference preventing portion 106b for avoiding interference with the connector receiving portion 89, each wiring 54, the connector 56, etc. mounted on the LED substrate 34 bulges downward. Is formed.

そして、カバー35は、放熱体32に取り付ける際に、押さえ部98および平面部105などを接着することで、LED基板34を放熱体32の配置部58に対して押さえつけるとともに、このLED基板34に対してカバー35を熱的に接続する。この状態で、カバー35は、LED86(およびねじ75)にレンズ部97が対向する。すなわち、ねじ75は、カバー35のレンズ部97の内側に位置する。   Then, when the cover 35 is attached to the heat radiating body 32, the pressing portion 98, the flat surface portion 105, and the like are bonded to press the LED substrate 34 against the arrangement portion 58 of the heat radiating body 32, and to the LED substrate 34, On the other hand, the cover 35 is thermally connected. In this state, the lens portion 97 of the cover 35 faces the LED 86 (and the screw 75). That is, the screw 75 is located inside the lens portion 97 of the cover 35.

さらに、LED86に対向してカバー35の厚さ方向に突出するレンズ部97によってLED86からの直線的な光を拡散できるので、広配光を実現でき、既存の光源の代替使用が可能になる。また、LED基板34を押さえ部98によって放熱体32に対して押さえつけることで、LED基板34を放熱体32に対してより確実に固定でき、LED基板34(LED86)からの熱を放熱体32に対してより効果的に伝達できるとともに、押さえ部98を介してLED基板34(LED86)とカバー35とが直接熱的に接続されて、LED基板34(LED86)からの熱をカバー35からも放熱できるので、LED86の温度をより抑制でき、LEDランプ14をより高効率化できる。   Furthermore, since the linear light from the LED 86 can be diffused by the lens portion 97 that faces the LED 86 and protrudes in the thickness direction of the cover 35, a wide light distribution can be realized, and an existing light source can be used instead. Further, by pressing the LED board 34 against the heat radiating body 32 by the pressing portion 98, the LED board 34 can be more securely fixed to the heat radiating body 32, and the heat from the LED board 34 (LED 86) is transferred to the heat radiating body 32. The LED board 34 (LED86) and the cover 35 are directly and thermally connected to the cover 35 via the holding part 98, and the heat from the LED board 34 (LED86) is also radiated from the cover 35. Therefore, the temperature of the LED 86 can be further suppressed, and the efficiency of the LED lamp 14 can be increased.

なお、上記第2の実施形態において、図14に示す第3の実施形態のように、放熱体32の蓋部57を、レンズ部97(レンズ部97の頂部97a)よりもカバー35の厚さ方向である下側に突出する突出部110としてもよい。この突出部110は、載置面である下端部110aが平面状に形成され、LEDランプ14を平面P上に安定的に載置できるようになっている。そして、このように、収容部31側を上側とし、突出部110の下端部110aによって平面P上にLEDランプ14を載置した際には、突出部110(蓋部57)がレンズ部97よりも下方に突出しているため、レンズ部97が平面Pと干渉することがなく、レンズ部97の傷付きや破損を防止できる。   In the second embodiment, as in the third embodiment shown in FIG. 14, the cover portion 57 of the heat radiating body 32 is made thicker than the lens portion 97 (the top portion 97 a of the lens portion 97). The protrusion 110 may protrude downward in the direction. The projecting portion 110 has a lower end portion 110a, which is a mounting surface, formed in a flat shape so that the LED lamp 14 can be stably mounted on the plane P. As described above, when the LED lamp 14 is placed on the plane P by the lower end portion 110a of the projecting portion 110 with the accommodating portion 31 side as the upper side, the projecting portion 110 (the lid portion 57) is more than the lens portion 97. Since the lens portion 97 does not interfere with the plane P, the lens portion 97 can be prevented from being damaged or damaged.

また、上記各実施形態において、図15および図16に示す第4の実施形態のように、収容部31の内部に、例えば高熱伝導シリコーン(放熱シリコーン)などの放熱性および熱伝導性を有する放熱部材である樹脂Rを充填して点灯回路39(電源基板40)と放熱体32の蓋部57とを直接熱的に接続してもよい。この場合には、LED基板34(LED86)からの熱を受け取った放熱体32の配置部58の内周側と外周側との両方向に向かって熱対流が生じる(矢印H1,H2)とともに、点灯回路39からの熱を直接受け取った放熱体32の蓋部57から外周側に向かって熱対流が生じる(矢印H3)。すなわち、LED基板34(LED86)および点灯回路39から発生した熱がそれぞれ蓋部57と配置部58との間に設けられた同一の開口部60に流れ込む。この結果、これら双方の熱の流れ込みの相乗効果によって、より強力な熱対流が開口部60に生じ、LED基板34(LED86)から発生した熱をより効果的に大気中に放出できる。   Further, in each of the above embodiments, as in the fourth embodiment shown in FIGS. 15 and 16, the inside of the housing portion 31 has a heat dissipation property and a heat conductivity property such as a high thermal conductivity silicone (heat dissipation silicone). The lighting circuit 39 (power supply board 40) and the lid portion 57 of the radiator 32 may be directly thermally connected by filling the resin R as a member. In this case, heat convection is generated in both directions of the inner peripheral side and the outer peripheral side of the arrangement portion 58 of the radiator 32 that has received heat from the LED board 34 (LED 86) (arrows H1, H2), and lighting Thermal convection is generated from the lid portion 57 of the heat radiating body 32 that directly receives the heat from the circuit 39 toward the outer peripheral side (arrow H3). That is, the heat generated from the LED board 34 (LED 86) and the lighting circuit 39 flows into the same opening 60 provided between the lid 57 and the arrangement part 58, respectively. As a result, due to the synergistic effect of the flow of both heats, stronger thermal convection is generated in the opening 60, and the heat generated from the LED board 34 (LED 86) can be more effectively released into the atmosphere.

次に、第5の実施形態を図17ないし図21を参照して説明する。なお、上記各実施形態と同様の構成および作用については、同一符号を付してその説明を省略する。   Next, a fifth embodiment will be described with reference to FIGS. In addition, about the structure and effect | action similar to said each embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

第5の実施形態のLEDランプ14は、収容部31が、収容部本体37の連結腕部45,45間にそれぞれ支持部113を備えるとともに、蓋体96に配線挿通部55が設けられ、かつ、LED基板34と放熱体32とが共通の固定部材であるねじ114,115によって収容部31に対して取り付け固定されているものである。   In the LED lamp 14 of the fifth embodiment, the accommodating portion 31 includes a support portion 113 between the connecting arm portions 45 and 45 of the accommodating portion main body 37, and a wiring insertion portion 55 is provided in the lid 96. The LED board 34 and the heat radiating body 32 are attached and fixed to the housing part 31 by screws 114 and 115 which are common fixing members.

各支持部113は、周縁部44から収容部31の径方向に沿って外方へと放射状に突出して形成されており、連結腕部45,45の中間に位置している。したがって、連結腕部45と支持部113とは互いに略等間隔に離間されている。また、各支持部113、および、各連結腕部45には、先端近傍の位置に、ねじ114がねじ止めされるねじ受部117がそれぞれ突設されているとともに、各連結腕部45には、基端側の位置に、ねじ115がねじ止めされるねじ受部118がそれぞれ突設されている。   Each support portion 113 is formed to project radially outward from the peripheral portion 44 along the radial direction of the housing portion 31, and is located between the connecting arm portions 45 and 45. Therefore, the connecting arm portion 45 and the support portion 113 are separated from each other at substantially equal intervals. Each support portion 113 and each connecting arm portion 45 are provided with a screw receiving portion 117 to which a screw 114 is screwed at a position near the tip, and each connecting arm portion 45 has a protruding portion. A screw receiving portion 118 to which the screw 115 is screwed is protruded at a position on the base end side.

また、蓋体96は、いずれかの連結腕部45に嵌合する舌片状の突設部121が径方向に沿って放射状に突設され、この突設部121の先端側がねじ受部118の近傍まで延びている。さらに、この突設部121の先端側には、角筒状の配線挿通部55が一体形成されている。この配線挿通部55は、放熱体32のいずれかの連結部59の位置に設けられた開口73に挿入され、先端側がこの放熱体32の連結部59の下面よりもカバー35側である下側に突出している。そして、突設部121と連結腕部45の間に沿って点灯回路39(電源基板40)からの配線54が配線挿通部55に挿通され、LED基板34側へと導出されている。   In addition, the lid 96 has tongue-shaped projecting portions 121 that fit into any of the connecting arm portions 45 projecting radially along the radial direction, and the distal end side of the projecting portion 121 is the screw receiving portion 118. It extends to the vicinity. Further, a square tube-shaped wiring insertion portion 55 is integrally formed at the distal end side of the projecting portion 121. The wiring insertion portion 55 is inserted into an opening 73 provided at the position of any connecting portion 59 of the heat dissipating body 32, and the lower end of the front end side is closer to the cover 35 than the lower surface of the connecting portion 59 of the heat dissipating body 32. Protruding. Then, the wiring 54 from the lighting circuit 39 (power supply board 40) is inserted into the wiring insertion part 55 between the protruding part 121 and the connecting arm part 45 and led out to the LED board 34 side.

また、放熱体32には、ねじ114が挿通されるねじ孔76の他に、各連結部59に、ねじ115が挿通される図示しないねじ孔がそれぞれ設けられている。   Further, in addition to the screw hole 76 through which the screw 114 is inserted, the radiator 32 is provided with a screw hole (not shown) through which the screw 115 is inserted in each connecting portion 59.

また、絶縁シート33は、ねじ114が挿通される連通孔82が、収容部31の各連結腕部45および各支持部113に対応してそれぞれ設けられている。さらに、この絶縁シート33は、内周縁の各連結腕部45に対応する位置に、シート延出部124がそれぞれ延設されており、これらシート延出部124には、ねじ115が挿通される図示しない連通孔がそれぞれ設けられている。   In addition, the insulating sheet 33 is provided with communication holes 82 through which the screws 114 are inserted, corresponding to the respective connecting arm portions 45 and the respective support portions 113 of the accommodating portion 31. Further, the insulating sheet 33 has sheet extending portions 124 extending at positions corresponding to the connecting arm portions 45 on the inner peripheral edge, and screws 115 are inserted through the sheet extending portions 124. Each communication hole (not shown) is provided.

さらに、LED基板34は、基板本体85の内周縁の各連結腕部45に対応する位置に、延出部126がそれぞれ延設されている。また、基板本体85には、ねじ114が挿通される通孔90が、収容部31の各連結腕部45および各支持部113に対応してそれぞれ設けられているとともに、各延出部126に、ねじ115が挿通される通孔127が設けられている。   Further, the LED substrate 34 has extended portions 126 extending at positions corresponding to the connecting arm portions 45 on the inner peripheral edge of the substrate body 85. Further, the substrate body 85 is provided with through holes 90 through which the screws 114 are inserted, corresponding to the respective connecting arm portions 45 and the respective supporting portions 113 of the accommodating portion 31, and to the respective extending portions 126. A through hole 127 through which the screw 115 is inserted is provided.

また、カバー35の各係止腕部106の爪部106aは、カバー35の外方に向けて突出しており、放熱体32の各連結部59の蓋部57の外周縁近傍に立ち上げられたループ状の係止突出部128に係止されるようになっている。   Further, the claw portion 106a of each locking arm portion 106 of the cover 35 protrudes outward of the cover 35, and is raised in the vicinity of the outer peripheral edge of the lid portion 57 of each connecting portion 59 of the radiator 32. It is configured to be locked to the loop-shaped locking protrusion 128.

そして、LEDランプ14を組み立てる際には、まず、収容部31の収容部本体37に対して電源基板40(点灯回路39)を挿入保持し、各電極ピン49と電源基板40(点灯回路39)とを各配線53により電気的に接続する。   When assembling the LED lamp 14, first, the power supply board 40 (lighting circuit 39) is inserted and held in the housing part main body 37 of the housing part 31, and each electrode pin 49 and the power supply board 40 (lighting circuit 39) are held. Are electrically connected by each wiring 53.

次いで、この収容部本体37に蓋体96を嵌合させて取り付ける。このとき、電源基板40(点灯回路39)から導出した各配線54を蓋体96の突設部121に形成した配線挿通部55に挿通し、この蓋体96の外部(下側)に導出する。   Next, the lid 96 is fitted and attached to the housing main body 37. At this time, each wiring 54 derived from the power supply substrate 40 (lighting circuit 39) is inserted into the wiring insertion portion 55 formed in the protruding portion 121 of the lid body 96 and led out to the outside (lower side) of the lid body 96. .

この後、この収容部31に対して、放熱体32、絶縁シート33およびLED基板34を取り付ける。このとき、放熱体32のねじ孔76、絶縁シート33の連通孔82、および、LED基板34の通孔90を、それぞれ各ねじ受部117と位置合わせするとともに、放熱体32の図示しないねじ孔、絶縁シート33の図示しない連通孔、および、LED基板34の通孔127を、それぞれ各ねじ受部118と位置合わせし、ねじ114,115により一体的に固定する。この状態で、絶縁シート33の各シート延出部124およびLED基板34の各延出部126が、放熱体32の各連結部59上に重ねられるとともに、いずれかのシート延出部124およびいずれかの延出部126よりも中央部側の位置にて、開口73に配線挿通部55が挿入され、この配線挿通部55を通して各配線54およびコネクタ56が導出される。そして、このコネクタ56をコネクタ受部89に接続することで、点灯回路39が各LED86と電気的に接続される。   Thereafter, the radiator 32, the insulating sheet 33, and the LED substrate 34 are attached to the housing portion 31. At this time, the screw holes 76 of the heat radiating body 32, the communication holes 82 of the insulating sheet 33, and the through holes 90 of the LED substrate 34 are aligned with the respective screw receiving portions 117, and screw holes (not shown) of the heat radiating body 32 are also illustrated. The communication hole (not shown) of the insulating sheet 33 and the through hole 127 of the LED substrate 34 are aligned with the respective screw receiving portions 118 and fixed integrally with the screws 114 and 115. In this state, each sheet extending portion 124 of the insulating sheet 33 and each extending portion 126 of the LED substrate 34 are overlaid on each connecting portion 59 of the radiator 32, and any one of the sheet extending portions 124 and The wiring insertion part 55 is inserted into the opening 73 at a position closer to the center than the extension part 126, and the wirings 54 and the connectors 56 are led out through the wiring insertion part 55. The lighting circuit 39 is electrically connected to each LED 86 by connecting the connector 56 to the connector receiving portion 89.

そして、このLED基板34を覆ってカバー35を放熱体32に取り付ける。このとき、カバー35は、各係止爪部94を放熱体32の各係止開口78に位置合わせするとともに、各係止腕部106の爪部106aを、放熱体32の各係止突出部128に位置合わせしつつ押し込むことで、各係止爪部94および各爪部106aが、各係止開口78および各係止突出部128に係止される。この結果、カバー35の覆い部93のレンズ部97がLED基板34の各LED86に対向した状態となる。   Then, the cover 35 is attached to the radiator 32 so as to cover the LED substrate 34. At this time, the cover 35 aligns the respective locking claws 94 with the respective locking openings 78 of the heat radiating body 32, and the claw portions 106a of the respective locking arm portions 106 with the respective locking protrusions of the heat radiating body 32. By pushing while aligning with 128, each locking claw portion 94 and each claw portion 106a are locked to each locking opening 78 and each locking projection 128. As a result, the lens portion 97 of the cover portion 93 of the cover 35 faces the LEDs 86 of the LED board 34.

このように組み立てたLEDランプ14は、各電極ピン49を介してソケット13(器具本体12)に対して取り付けられて外部電源(商用電源)と電気的に接続され、LEDランプ14を覆って器具本体12に対してグローブ16を取り付けることで、照明器具11が完成する。   The LED lamp 14 assembled in this way is attached to the socket 13 (apparatus body 12) via each electrode pin 49 and is electrically connected to an external power source (commercial power supply). By attaching the globe 16 to the main body 12, the lighting fixture 11 is completed.

ソケット13により外部電源(商用電源)から各電極ピン49を介して点灯回路39に供給された電力は、この点灯回路39によって変換されて各LED86に供給され、これらLED86が点灯する。各LED86からの発光は、カバー35のレンズ部97によって拡散されるとともに、グローブ16によって拡散され、均一な光として照射される。   The electric power supplied from the external power source (commercial power source) to the lighting circuit 39 via the electrode pins 49 by the socket 13 is converted by the lighting circuit 39 and supplied to the LEDs 86, and the LEDs 86 are lit. Light emitted from each LED 86 is diffused by the lens portion 97 of the cover 35 and diffused by the globe 16 and is emitted as uniform light.

点灯回路39からの熱は、この点灯回路39を覆う放熱体32の蓋部57に伝達され、LED基板34(LED86)からの熱は、基板本体85から絶縁シート33を介して、放熱体32の配置部58に伝達される。したがって、点灯回路39とLED基板34(LED86)とで発熱領域が分離されて局所的(部分的)な熱のこもり(溜まり)が最小限に抑制されるとともに、放熱体32は、蓋部57によって大きな表面積を確保し、LED基板34(LED86)からの熱を効果的に大気中に放出する。   Heat from the lighting circuit 39 is transmitted to the lid portion 57 of the radiator 32 that covers the lighting circuit 39, and heat from the LED board 34 (LED 86) is passed from the board body 85 through the insulating sheet 33 to the radiator 32. Is transmitted to the arrangement unit 58. Therefore, the heat generating area is separated by the lighting circuit 39 and the LED board 34 (LED 86), and local (partial) heat accumulation (accumulation) is suppressed to a minimum. Thus, a large surface area is secured, and heat from the LED board 34 (LED 86) is effectively released into the atmosphere.

このように、円形板状の単純な形状である蓋体96に配線挿通部55を形成しているため、配線挿通部55を容易に形成できるとともに、収容部31の収容部本体37に配線挿通部を設ける場合と比較して、収容部本体37の形状を簡略化でき、この収容部本体37を安価に製造できる。   In this way, since the wiring insertion portion 55 is formed in the lid 96 that is a simple circular plate shape, the wiring insertion portion 55 can be easily formed, and the wiring insertion portion 55 of the accommodation portion 31 is inserted into the accommodation portion main body 37. Compared with the case where the portion is provided, the shape of the accommodating portion main body 37 can be simplified, and the accommodating portion main body 37 can be manufactured at low cost.

また、収容部31に対して、放熱体32、絶縁シート33およびLED基板34を共通のねじ114,115によって固定するため、LEDランプ14の組み立て作業が容易で、かつ、部品点数を抑制でき、軽量化および低コスト化が実現できる。   In addition, since the radiator 32, the insulating sheet 33 and the LED substrate 34 are fixed to the housing portion 31 with the common screws 114 and 115, the assembly work of the LED lamp 14 is easy, and the number of parts can be suppressed. Light weight and low cost can be realized.

さらに、上記第2ないし第5の実施形態によれば、LED基板34の基板本体85上に所定の列(仮想円C)上に並んで配置されたLED86の列の位置で、ねじ75あるいはねじ114によってLED基板34を放熱体32に対して固定することで、ねじ75あるいはねじ114の頭部がレンズ部97の内側に位置しこのレンズ部97と対向する位置となるので、ねじ75あるいはねじ114とカバー35との干渉を避けるための構成をカバー35に形成する必要がなく、カバー35の構成をより簡略化でき、低コスト化およびカバー35による配光特性のむらが生じにくくなるとともに、LED基板34のうちで発熱が最も大きいLED86に対応する位置でLED基板34を放熱体32に押さえつけて固定するため、LED86からの熱をより効果的に放熱体32に伝達できる。   Further, according to the second to fifth embodiments, the screw 75 or the screw is arranged at the position of the row of the LEDs 86 arranged in a predetermined row (imaginary circle C) on the substrate body 85 of the LED substrate 34. By fixing the LED substrate 34 to the heat radiating body 32 by 114, the screw 75 or the head of the screw 114 is located inside the lens portion 97 and faces the lens portion 97. Therefore, the screw 75 or screw It is not necessary to form the cover 35 to avoid the interference between the cover 114 and the cover 35, the structure of the cover 35 can be further simplified, the cost is reduced, and unevenness of the light distribution characteristics due to the cover 35 is less likely to occur. Since the LED board 34 is pressed against and fixed to the heat radiating body 32 at a position corresponding to the LED 86 that generates the largest amount of heat on the board 34, heat from the LED 86 can be transmitted to the heat radiating body 32 more effectively.

そして、収容部31は、点灯回路39(電源基板40)を内部に収容した収容部本体37を覆ってこの収容部本体37と熱的に接続される蓋体96を備えるため、この蓋体96に放熱体32の蓋部57を密着させることで、点灯回路39からの熱を、蓋体96を介して放熱体32の蓋部57へと、より確実に伝達でき、放熱性をより向上できる。   Since the housing portion 31 includes a lid body 96 that covers the housing portion main body 37 in which the lighting circuit 39 (power supply board 40) is housed and is thermally connected to the housing portion main body 37, the lid body 96 is provided. By closely contacting the lid portion 57 of the heat radiating body 32, the heat from the lighting circuit 39 can be more reliably transferred to the lid portion 57 of the heat radiating body 32 through the lid body 96, and the heat dissipation can be further improved. .

なお、上記各実施形態において、図22に示す第6の実施形態のように、グローブ16を球面状に湾曲させてもよい。   In each of the above embodiments, the globe 16 may be curved into a spherical shape as in the sixth embodiment shown in FIG.

また、電源基板40の電子部品52は、例えばリード実装部品のみ、あるいは面実装部品のみで構成してもよい。電子部品52をリード実装部品のみで構成する場合には、電源基板本体51の片面に実装することで、電源基板40をフロー工程の1工程のみで実装できる。また、電子部品52を面実装(SMD)部品のみで構成する場合には、LED基板34とともに、電源基板40をリフロー工程の1工程のみで形成できる。   Further, the electronic component 52 of the power supply substrate 40 may be composed of, for example, only a lead mounting component or only a surface mounting component. When the electronic component 52 is composed of only lead mounting components, the power supply substrate 40 can be mounted in only one step of the flow process by mounting it on one side of the power supply substrate body 51. Further, when the electronic component 52 is composed of only surface mount (SMD) components, the power supply substrate 40 can be formed together with the LED substrate 34 in only one reflow process.

さらに、光源としては、LED86だけでなく、例えば有機EL素子、あるいは半導体レーザなどの固体発光素子や、平面状の蛍光ランプなどを用いてもよい。   Furthermore, as the light source, not only the LED 86 but also a solid light emitting element such as an organic EL element or a semiconductor laser, a flat fluorescent lamp, or the like may be used.

また、LED基板34の基板本体85は、複数に分割してもよい。   Further, the substrate body 85 of the LED substrate 34 may be divided into a plurality.

さらに、カバー35を放熱体32に取り付ける構成は、任意に設定できる。また、カバー35は、必ずしも放熱体32に固定するだけでなく、例えば収容部31に取り付ける構成などとすることもできる。   Further, the configuration for attaching the cover 35 to the heat radiating body 32 can be arbitrarily set. Further, the cover 35 is not necessarily fixed to the heat radiating body 32 but may be configured to be attached to the accommodating portion 31, for example.

そして、以上説明した少なくとも一つの実施形態によれば、放熱体32が、点灯回路39を内部に収容する収容部31を覆う蓋部57と、この蓋部57の周囲に位置しLED基板34を熱的に接続して配置する配置部58とを一体に備えることで、点灯回路39およびLED基板34(LED86)からの熱を蓋部57と配置部58とに分散させて局所的な熱の集中を防止できるとともに放熱体32の表面積を増加させることができ、簡単な構成で効果的に放熱できる。したがって、LEDランプ14の高効率化に伴う発熱量の増加に対応でき、LEDランプ14の高効率化が可能になる。   Then, according to at least one embodiment described above, the radiator 32 includes the lid portion 57 that covers the housing portion 31 that houses the lighting circuit 39 therein, and the LED substrate 34 that is positioned around the lid portion 57. By providing the arrangement portion 58 that is thermally connected and arranged integrally, the heat from the lighting circuit 39 and the LED board 34 (LED 86) is distributed to the lid portion 57 and the arrangement portion 58, and local heat is generated. Concentration can be prevented and the surface area of the radiator 32 can be increased, so that heat can be effectively radiated with a simple configuration. Therefore, it is possible to cope with an increase in the amount of heat generated as the efficiency of the LED lamp 14 increases, and the efficiency of the LED lamp 14 can be increased.

また、LED基板34(LED86)からの熱を受け取った放熱体32の配置部58は、円環状に形成されているので、内周側と外周側との両方向に向かって熱対流が生じる。このため、熱対流量が大幅に増加し、より効果的に放熱できる。しかも、放熱体32の点灯回路39を覆う蓋部57とLED基板34を配置した配置部58との間に開口した開口部60を空気が通過することにより、放熱および空気の循環による放熱体32の放熱特性の向上を図ることができるとともに、放熱体32の軽量化および低コスト化を実現できる。   In addition, since the arrangement portion 58 of the heat radiating body 32 that has received heat from the LED substrate 34 (LED 86) is formed in an annular shape, thermal convection occurs in both directions on the inner peripheral side and the outer peripheral side. For this reason, the heat-to-heat flow rate is greatly increased, and heat can be radiated more effectively. In addition, when air passes through the opening 60 that is opened between the lid 57 that covers the lighting circuit 39 of the heat radiating body 32 and the arrangement portion 58 where the LED substrate 34 is disposed, the heat radiating body 32 is radiated and circulated by air. The heat dissipation characteristics of the heat sink 32 can be improved, and the weight and cost of the heat radiator 32 can be reduced.

さらに、樹脂により形成した収容部31に、金属製の放熱体32に設けた開口73に挿入されてこの開口73からカバー35側へと突出する配線挿通部55を形成し、この配線挿通部55に点灯回路39とLED基板34とを電気的に接続する各配線54を挿通することにより、金属製の放熱体32の開口73の縁部に各配線54が干渉することを樹脂製の配線挿通部55によって防止できる。このため、各配線54が開口73の縁部と擦れるなどして各配線54を傷付けることがなく、各配線54を断線などから保護でき、信頼性をより向上できる。
本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。
Further, a wiring insertion portion 55 that is inserted into an opening 73 provided in the metal heat radiating body 32 and protrudes from the opening 73 toward the cover 35 is formed in the housing portion 31 formed of resin, and this wiring insertion portion 55 By inserting each wiring 54 that electrically connects the lighting circuit 39 and the LED substrate 34 to each other, it is possible to insert the resin wiring that each wiring 54 interferes with the edge of the opening 73 of the metal radiator 32. This can be prevented by the part 55. For this reason, each wiring 54 can be protected from disconnection or the like without damaging each wiring 54 by rubbing against the edge of the opening 73, and reliability can be further improved.
Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

11 照明器具
12 器具本体
13 ソケット
14 ランプであるLEDランプ
15 ランプ装置
16 グローブ
31 収容部
32 筐体である放熱体
34 光源基板としてのLED基板
35 カバー
39 点灯回路
42 基体部
49 電極ピン
54 配線
55 配線挿通部
57 蓋部
58 配置部
59 連結部
73 開口
86 光源であるLED
97 レンズ部
106 係止腕部





11 Lighting equipment
12 Instrument body
13 socket
14 LED lamp
15 Lamp device
16 Globe
31 containment
32 Heat sink as a housing
34 LED substrate as light source substrate
35 Cover
39 Lighting circuit
42 Base section
49 Electrode pin
54 Wiring
55 Wiring insertion part
57 Lid
58 Placement section
59 Connection
73 opening
86 LED as light source
97 Lens section
106 Locking arm





Claims (4)

点灯回路と;
この点灯回路を内部に収容し下側が開放する基体部、および、この基体部の上側に設けられ前記点灯回路と電気的に接続される一対の電極ピンを備えた収容部と;
この収容部の前記基体部の下側を覆う蓋部、この蓋部の周囲に位置する円環状の配置部、および、蓋部と配置部とを連結する複数の連結部を一体に備えた筐体と;
前記点灯回路からの給電により発光する光源を備え、前記放熱体の配置部の下側に配置された光源基板と;
透光性を有し、前記光源基板を覆うカバーと;
を具備していることを特徴とするランプ。
A lighting circuit;
A base portion that houses the lighting circuit and opens on the lower side; and a housing portion that is provided on the upper side of the base portion and includes a pair of electrode pins that are electrically connected to the lighting circuit;
A housing that integrally includes a lid portion that covers the lower side of the base portion of the housing portion, an annular arrangement portion that is disposed around the lid portion, and a plurality of connection portions that connect the lid portion and the arrangement portion. With the body;
A light source which emits light by supplying power from the lighting circuit, a light source substrate that is placed on the lower side of the placement portion of the radiator;
A cover having translucency and covering the light source substrate;
The lamp characterized by comprising.
前記筐体は、開口を備え、The housing includes an opening;
前記点灯回路と前記光源基板とは、前記開口を介して前記筐体の上側から下側に配設さ  The lighting circuit and the light source substrate are arranged from the upper side to the lower side of the casing through the opening.
れた配線により接続されているとともに、Connected by the connected wiring,
前記カバーは、前記連結部に対応する位置に係止腕部が突設され、前記係止腕部で前記配線が覆われていることを特徴とする請求項1に記載のランプ。  The lamp according to claim 1, wherein the cover has a locking arm portion protruding at a position corresponding to the connecting portion, and the wiring is covered with the locking arm portion.
ソケットと;
このソケットに電極ピンが接続される請求項1または2に記載のランプと;
を具備していることを特徴とするランプ装置。
With sockets;
The lamp according to claim 1 or 2, wherein an electrode pin is connected to the socket;
A lamp device comprising:
器具本体と;
この器具本体にソケットが配置された請求項3記載のランプ装置と;
このランプ装置のランプを覆うグローブと;
を具備していることを特徴とする照明器具。









An instrument body;
The lamp device according to claim 3, wherein a socket is disposed on the instrument body;
A glove covering the lamp of this lamp device;
The lighting fixture characterized by comprising.









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KR101860025B1 (en) 2017-02-24 2018-05-21 재단법인 한국조명연구원 Ceiling light Mounting and Separating Device

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JP2002109912A (en) * 2000-10-04 2002-04-12 Asahi National Lighting Co Ltd Lighting equipment
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JP2020177803A (en) * 2019-04-18 2020-10-29 パナソニックIpマネジメント株式会社 Light source unit and luminaire
JP7378041B2 (en) 2019-04-18 2023-11-13 パナソニックIpマネジメント株式会社 Light source unit and lighting equipment

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