JP2016047630A - Optical element apparatus, optical writing head, image formation apparatus, and manufacturing method of optical element chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical element apparatus having small variation in characteristics for each microlens which constitutes a microlens array, an optical writing head including the optical element apparatus, an image formation apparatus including the optical writing head, and a manufacturing method of an optical element chip.SOLUTION: An LED array apparatus 100 comprises: an LED array chip 110 having a substrate 111, an LED array 114, and a microlens array 115; and an LED array chip 120 having a substrate 121, an LED array 124, and a microlens array 125. The substrate 111 and the substrate 121 are disposed so as to be adjacent to each other. A microlens 113 disposed closest to the substrate 121 comprises a projection 113a projecting from an end side 111b, which faces the substrate 121, of the substrate 111 toward the substrate 121.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical element device including an optical element and a microlens, an optical writing head including the optical element device, an image forming apparatus including the optical writing head, and an optical element chip manufacturing method.

  Conventionally, an LED array device as an optical element device of an optical writing head of an image forming apparatus forms an LED array as an optical element array on a substrate, and forms a microlens array on the substrate so as to cover the LED array, The micro lens array and the substrate are divided by dicing using a dicing blade to form a plurality of LED array chips as a plurality of optical element chips, and the plurality of LED array chips are arranged on a base member. (For example, see Patent Document 1).

JP 2007-276183 A (for example, FIG. 1, FIG. 3, FIG. 6)

  However, in the manufacture of the conventional optical element device, since dicing is performed after the microlens array is formed on the substrate, a part of the microlens at the end of the LED array chip may be removed by dicing. . In addition, chipping may occur in the microlens at the end of the LED array chip due to dicing. For these reasons, there are microlenses having different shapes (resulting in different characteristics) among the plurality of microlenses constituting the microlens array, and the microlenses are emitted from the LEDs as optical elements. There has been a problem in that a variation in the amount of transmitted outgoing light (that is, a variation in characteristics for each microlens) occurs.

  In addition, there is a proposal to slightly shift the position of the LED at the end of the LED array chip toward the center side of the LED array chip in order to suppress variations in the amount of light emitted from the LED and transmitted through the microlens (for example, patents) Reference 1). However, even if such a countermeasure is adopted, if the shape of the microlens at the end of the LED array chip is different from that of other microlenses, suppression of variation in the amount of light (that is, compensation for variation in characteristics of each microlens) There was a problem that was insufficient.

  Similarly, when the optical element device is a light-receiving element device (for example, a line sensor) including a light-receiving element, the amount of incident light that is transmitted through the microlens and incident on the light-receiving element due to characteristic variation for each microlens. There has been a problem that variation (that is, characteristic variation for each microlens) occurs.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical element device with small variation in characteristics for each microlens constituting the microlens array, an optical writing head including the optical element device, an image forming apparatus including the optical writing head, and an optical element chip. It is to provide a manufacturing method.

  An optical element device according to the present invention includes a first substrate, a first optical element array including a plurality of optical elements disposed on the first substrate, and the first optical element on the first substrate. A first optical element chip having a first microlens array including a plurality of first microlenses formed so as to cover the optical element array; a second substrate; and a second substrate on the second substrate. A second optical element array including a plurality of optical elements disposed; and a second optical element array including a plurality of second microlenses formed on the second substrate so as to cover the second optical element array. A second optical element chip having a microlens array, wherein the first substrate and the second substrate are disposed adjacent to each other, and the plurality of first microlenses are Arranged at a position closest to the second substrate First microlens is characterized in that it has a first protrusion protruding toward the end side to the second substrate facing the second substrate of the first substrate.

  The optical writing head according to the present invention includes the optical element device in which the first optical element array and the second optical element array are light emitting element arrays.

  In addition, an image forming apparatus according to the present invention includes the optical writing head.

  The method for manufacturing an optical element chip according to the present invention includes a step of disposing a plurality of optical elements on a main surface of a substrate, and forming a groove on the main surface of the substrate. A portion for the first substrate on which the first optical element array formed by a part of the optical elements is disposed, and a second optical element array formed by another part of the plurality of optical elements is disposed Forming a second substrate portion, and a microlens-forming resist film that covers the first optical element array and the second optical element array and covers the upper portion of the groove And forming a first microlens array including a plurality of first microlenses on the first optical element array from the resist film using photolithography, and the second optical element array Forming a second microlens array including a plurality of second microlenses, and dividing the substrate at the position of the groove to thereby form a first substrate comprising a portion for the first substrate A first optical element chip having the first optical element array and the first microlens array; a second substrate comprising a portion for the second substrate; the second optical element array; And a step of forming a second optical element chip having a second microlens array.

  According to the optical element device of the present invention, it is possible to reduce the variation in characteristics of each microlens constituting the microlens array, so that the characteristics in the longitudinal direction of the optical element device can be made substantially uniform.

  According to the optical writing head according to the present invention, it is possible to reduce the variation in characteristics of each microlens constituting the microlens array, and thus it is possible to reduce the variation in the amount of emitted light transmitted through the microlens array. .

  According to the image forming apparatus of the present invention, it is possible to reduce the variation in characteristics of each microlens constituting the microlens array of the optical element device of the optical writing head, thereby improving the quality of the formed image. Can do.

  According to the method for manufacturing an optical element chip according to the present invention, an optical element chip having a small variation in characteristics for each microlens constituting the microlens array can be manufactured by a simple process.

It is a top view which shows roughly the structure of the LED array apparatus as an optical element apparatus which concerns on Embodiment 1 of this invention. It is a top view which shows roughly the structure of the principal part of the LED array apparatus shown by FIG. It is a side view which shows roughly the structure of the principal part of the LED array apparatus shown by FIG. FIG. 10 is a side view schematically showing a configuration of a main part of an LED array device as an optical element device according to a first modification of the first embodiment. FIG. 11 is a side view schematically showing a configuration of a main part of an LED array device as an optical element device according to a second modification example of the first embodiment. FIG. 11 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a third modification example of the first embodiment. FIG. 12 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a fourth modification example of the first embodiment. FIG. 10 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a fifth modification example of the first embodiment. It is a longitudinal cross-sectional view which shows roughly the 1st process of the manufacturing method of the LED array apparatus as an optical element apparatus which concerns on Embodiment 2 of this invention. 12 is a longitudinal sectional view schematically showing a second step of the method of manufacturing the LED array device as the optical element device according to Embodiment 2. FIG. FIG. 10 is a longitudinal sectional view schematically showing a third step of the method for manufacturing the LED array device as the optical element device according to the second embodiment. FIG. 10 is a longitudinal sectional view schematically showing a fourth step of the method of manufacturing the LED array device as the optical element device according to the second embodiment. FIG. 10 is a longitudinal sectional view schematically showing a fifth step of the method of manufacturing the LED array device as the optical element device according to the second embodiment. FIG. 10 is a longitudinal sectional view schematically showing a sixth step of the method for manufacturing the LED array device as the optical element device according to the second embodiment. (A) And (b) is the top view and side view which show roughly the structure of the LED array apparatus as an optical element apparatus based on Embodiment 3 of this invention. FIG. 11 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a first modification example of Embodiment 3. FIG. 10 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a second modification example of the third embodiment. (A) And (b) is the top view and side view which show roughly the structure of the LED array apparatus as an optical element apparatus based on Embodiment 4 of this invention. (A) And (b) is the top view and side view which show roughly the structure of the LED array apparatus as an optical element apparatus which concerns on the 1st modification of Embodiment 4. FIG. FIG. 16 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a second modification example of the fourth embodiment. FIG. 16 is a plan view schematically showing a configuration of an LED array device as an optical element device according to a third modification example of the fourth embodiment. (A) And (b) is the side view and top view which show schematically the structure of the optical writing head based on Embodiment 5 of this invention. It is a longitudinal cross-sectional view which shows schematically the structure of the image forming apparatus which concerns on Embodiment 6 of this invention. It is a top view which shows the modification of an optical element roughly. It is a top view which shows roughly the modification of an optical element array. (A) And (b) is the side view and top view which show schematically the modification of a micro lens.

  Embodiments of the present invention will be described below with reference to the drawings. In the xyz orthogonal coordinate system shown in each drawing, the x-axis indicates the longitudinal direction of the optical element device, the y-axis indicates the short direction of the optical element device perpendicular to the longitudinal direction of the optical element device, and z The axis indicates the thickness direction of the optical element device orthogonal to both the x-axis and the y-axis.

Embodiment 1
FIG. 1 is a plan view schematically showing a configuration of a light emitting element device (also referred to as “LED array device”) 100 as an optical element device according to Embodiment 1 of the present invention. 2 is a plan view schematically showing the configuration of the main part of the LED array device 100 shown in FIG. 1, and FIG. 3 is a schematic view of the configuration of the main part of the LED array device 100 shown in FIG. FIG.

  As shown in FIGS. 1 to 3, the LED array device 100 includes a plurality of light emitting element chips (also referred to as “LED array chips”) as a plurality of optical element chips on a base member (100 a in FIG. 2). It is configured by fixing them side by side (for example, bonding). 1 to 3, as a plurality of LED array chips, a first light emitting element chip (also referred to as “LED array chip”) 110 as a first optical element chip and a second optical element chip as a first optical element chip. 2 light emitting element chips (also referred to as “LED array chips”) 120. However, the number of LED array chips may be any number as long as it is two or more. In general, the number of the plurality of LED array chips provided in the LED array device 100 is in the range of 192 to 300. In the following description, the LED array chip 110 and the LED array chip 120 will be described as representative examples of a plurality of LED array chips. However, the other LED array chips have the same configuration and are arranged in the same manner. Yes.

  As shown in FIGS. 1 to 3, the LED array chip 110 includes a substrate (first substrate) 111 and a first light emitting element array (also referred to as “LED array”) as a first optical element array. 114 and a microlens array (first microlens array) 115 including a plurality of microlenses (first microlenses) 113. The LED array 114 includes a plurality of first light emitting elements (also referred to as “LEDs”) 112 as a plurality of first optical elements disposed on the major surface 111 a of the substrate 111. The plurality of microlenses 113 are formed of the same material and have the same shape, and desirably have the same optical characteristics. The micro lens 113 is a condenser lens. Although FIG. 3 illustrates the case where the microlens 113 is a hemispherical lens, the shape of the microlens 113 is not limited to the example of FIG.

  As shown in FIGS. 1 to 3, the LED array chip 120 is also referred to as a substrate (second substrate) 121 and a second light-emitting element array (“LED array”) as a second optical element array. .) 124 and a microlens array (second microlens array) 125 including a plurality of microlenses (second microlenses) 123. The LED array 124 includes a plurality of second light emitting elements (also referred to as “LEDs”) 122 as a plurality of second optical elements arranged on the main surface 121 a of the substrate 121. The plurality of microlenses 123 are formed of the same material and have the same shape, and desirably have the same optical characteristics. In addition, the microlens 123 is formed in the same shape with the same material as the microlens 113 and desirably has the same optical characteristics. The micro lens 123 is a condenser lens. Although FIG. 3 illustrates the case where the microlens 123 is a hemispherical lens, the shape of the microlens 123 is not limited to the example of FIG.

  The substrates 111 and 121 have substantially rectangular main surfaces 111a and 121a, and have a predetermined thickness in a direction orthogonal to the main surfaces 111a and 121a (thickness direction parallel to the z-axis). Main surfaces 111a and 121a have a pair of long sides extending in the longitudinal direction (x direction) and a pair of short sides extending in the short direction (y direction) orthogonal to the longitudinal direction. The length in the longitudinal direction (x direction) of one LED array chip is, for example, 9 mm. The number of LEDs provided on each of the substrates 111 and 121 is, for example, 26. However, the number of the plurality of LED array chips and the size of the substrate illustrated as the substrate 111 or 121 are not limited to the above example, and any number and size can be employed.

The substrate 111 or 121 can be formed of, for example, any one of a semiconductor substrate, a ceramic substrate, a glass substrate, a glass epoxy substrate, a metal substrate, and a plastic substrate. For example, any of Si, GaAs, GaP, InP, GaN, and ZnO can be used as the main material of the semiconductor substrate. The ceramic substrate can be made mainly of, for example, AlN or Al ₂ O ₃ . The metal substrate can be made of, for example, Cu or Al as a main material.

  As shown in FIGS. 1 to 3, in the first embodiment, a plurality of substrates adjacent to each other, for example, the substrate 111 and the substrate 121 are arranged in the longitudinal direction (x direction) of the LED array device 100. Yes. In the first embodiment, the longitudinal direction of the LED array device 100 is the longitudinal direction of the microlens array 115 (arrangement direction of the plurality of microlenses 113) and the longitudinal direction of the microlens array 125 (arrangement direction of the plurality of microlenses 123). Matches. In the first embodiment, a plurality of substrates adjacent to each other, for example, the substrate 111 and the substrate 121, are provided with a gap G1 of a predetermined distance between side surfaces adjacent to each other.

  In Embodiment 1, one LED 112 is covered with one microlens 113, and one LED 122 is covered with one microlens 123. However, you may comprise so that several LED may be covered with one microlens. As each of the LED 112 and the LED 122, for example, an LED formed as an LED epitaxial film can be used. In this case, what has one LED (light emission part) in one LED epitaxial film may be used, and what has several LED (light emission part) may be used. The thickness of the LED epitaxial film is several μm, for example, about 2 μm.

  As shown in FIGS. 1 to 3, in the first embodiment, among the plurality of microlenses 113 provided on the substrate 111, the end microlens 113 arranged at the position closest to the substrate 121 is The substrate 111 has a protruding portion 113 a protruding toward the substrate 121 from the end 111 b facing the substrate 121. In addition, among the plurality of microlenses 123 provided in the substrate 121, the end microlens 123 disposed at the position closest to the substrate 111 is directed from the end 121 b of the substrate 121 facing the substrate 111 toward the substrate 111. It has the protrusion part 123a which protruded. 1 to 3 do not show the left end portion of the substrate 111 and the right end portion of the substrate 121, the left end portion of the substrate 111 is also provided with a protruding portion similar to the protruding portion 113a. The right end of the substrate 121 can also be provided with a protrusion similar to the protrusion 123a. The manufacturing process of the protrusion 113a and the protrusion 123a will be described in Embodiment 2.

  1 to 3, in the first embodiment, the plurality of microlenses including the plurality of microlenses 113 and the plurality of microlenses 123 are arranged in the longitudinal direction of the substrate 111 (the length of the substrate 121). In the x direction). In the first embodiment, the plurality of microlenses 113 are arranged linearly in a predetermined direction, that is, the x direction, and the plurality of microlenses 123 are arranged linearly in a predetermined direction, that is, the x direction. The microlens array 115 and the microlens array 125 are linearly arranged in a predetermined direction, that is, in the x direction, and arranged in a line. In other words, the plurality of LEDs are arranged such that the distance L1 between the center positions C1 of the microlenses on the main surfaces 111a and 121a is equal (and therefore the distance L2 between adjacent microlenses is equal). Array chips are arranged. In this case, it is desirable that the plurality of LED array chips are arranged so that the plurality of LEDs arranged on the main surfaces 111a and 121a of the plurality of LED array chips are arranged in a straight line at an equal pitch. In this way, by arranging a plurality of microlenses at an equal pitch in the longitudinal direction of the LED array device 100, emitted light emitted from the LEDs 112 and 122 of the LED array device 100 and transmitted through the microlenses 113 and 123. Can be made substantially uniform in the longitudinal direction of the LED array device 100.

  As described above, in the LED array device 100 according to Embodiment 1, the protruding portion 113a of the microlens 113 arranged at the end portion in the longitudinal direction of the LED array chip 110 is formed on the main surface 111a of the substrate 111. The protruding portion 123a of the microlens 123 arranged at the end in the longitudinal direction of the LED array chip 120 so as to protrude outward from the end 111b is outside the end 121b of the main surface 121a of the substrate 121. It is formed to protrude. For this reason, the characteristic variation for every microlens becomes small, and the uniformity of the light quantity of the emitted light which radiate | emitted from LED and permeate | transmitted the microlens can be improved.

  Further, in the LED array device 100 according to the first embodiment, a plurality of microlenses arranged on the main surfaces 111a and 121a of the substrate 111 and the substrate 121 are linearly arranged at an equal pitch in the longitudinal direction of the LED array device 100. Can be arranged. For this reason, the light quantity of the emitted light from the LED array device 100 can be made substantially uniform in the longitudinal direction of the LED array device 100.

<< First Modification of Embodiment 1 >>
FIG. 4 is a side view schematically showing a configuration of a main part of the LED array device 101 as an optical element device according to a first modification of the first embodiment. In the LED array device 100 shown in FIGS. 1 to 3, the case where the microlenses at the ends of the LED array chips 110 and 120 have the protruding portions 113 a and 123 a has been described. However, as in the example of FIG. The microlens 113 at one end of the matching LED array chip may have a protrusion 113a, and the microlens 133 at the other end may not have a protrusion. As shown in FIG. 4, the LED array chip 130 includes a substrate 131, an LED array including a plurality of LEDs 132, and a microlens array including a plurality of microlenses 133. The LED array chip 130 is the same as the LED array chip 120 shown in FIG. 3 except that the microlens 133 is arranged so as not to have a protruding portion at the end facing the LED array chip 110. In the example of FIG. 4, it is desirable that the LED array chip 110 and the LED array chip 130 have the same structure, and a plurality of LED array chips including the LED array chip 110 and the LED array chip 130 are arranged in a line.

  In the LED array device 101 of FIG. 4, the gap G <b> 2 is set to an appropriate value according to the position of the microlens 133 disposed at the end in the longitudinal direction of the LED array chip 130. In the example of FIG. 4, the LED array chip 110 and the LED array chip 130 are arranged so that the gap G2 is narrower than the gap G1 (FIG. 3). As described above, the arrangement of the adjacent LED array chips 110 is adjusted according to the position of the microlens 133 arranged at the end in the longitudinal direction of the LED array chip 130, so that the main surfaces of the substrate 111 and the substrate 131 are adjusted. A plurality of microlenses arranged on 111a and 131a can be arranged linearly at an equal pitch in the longitudinal direction of the LED array device 101. For this reason, the light quantity of the emitted light from the LED array device 101 can be made substantially uniform in the longitudinal direction of the LED array device 101.

  The LED array device 101 of FIG. 4 is the same as the device shown in FIGS. 1 to 3 except for the points described above.

<< Second Modification of Embodiment 1 >>
FIG. 5 is a side view schematically showing a configuration of a main part of the LED array device 102 as an optical element device according to a second modification of the first embodiment. As shown in FIG. 5, the LED array chip 140 includes a substrate 141, an LED array composed of a plurality of LEDs 142, and a microlens array including a plurality of microlenses 143. The LED array chip 140 basically has the same structure as the LED array chip 120 shown in FIG. 3, but the microlenses 143 are arranged so as not to have a protruding portion on the end side 141 b facing the LED array chip 110. Also good. In the LED array device 102, the protrusion 113 a of the microlens 113 closest to the substrate 141 of the LED array chip 140 among the plurality of microlenses 113 on the LED array chip 110 overlaps the substrate 141 of the LED array chip 140. Have In the example of FIG. 5, it is desirable that the LED array chip 110 and the LED array chip 140 have the same structure and are arranged in a line. Further, as shown in FIG. 5, in the LED array device 102, the end portion of the substrate 141 of the LED array chip 140 is positioned below the protruding portion 113 a of the microlens 113 at the end portion of the LED array chip 110. Except for this point, it is the same as the LED array device 101 shown in FIG.

  In the LED array device 102 of FIG. 5, by appropriately setting the gap G <b> 3, a plurality of microlenses arranged on the main surfaces 111 a and 141 a of the substrate 111 and the substrate 141 are arranged in the longitudinal direction of the LED array device 102. They can be arranged in a straight line at an equal pitch. For this reason, the light quantity of the emitted light from the LED array apparatus 102 can be made substantially uniform in the longitudinal direction of the LED array apparatus 102.

  The LED array device 102 in FIG. 5 is the same as the device shown in FIGS. 1 to 4 except for the points described above.

<< Third Modification of Embodiment 1 >>
FIG. 6 is a plan view schematically showing a configuration of an LED array device 103 as an optical element device according to a third modification of the first embodiment. As illustrated in FIG. 6, the LED array chip 150 includes a substrate 151, an LED array including a plurality of LEDs 152, and a microlens array 155 including a plurality of microlenses 153. As shown in FIG. 6, each of the microlenses arranged at the mutually facing ends of the two adjacent LED array chips among the plurality of LED array chips may be shifted to a position not facing each other. Good. For example, as shown in FIG. 6, the LED array chip 110 includes a plurality of microlenses 113 arranged linearly in a predetermined direction (x direction), and the LED array chip 150 includes a plurality of microlenses 153 including x The first microlens array 115 and the second microlens array 155 are arranged at different positions in the direction (y direction) orthogonal to the x direction. In this example, the microlens array 115 on the odd-numbered LED array chip 110 and the microlens array 155 on the even-numbered LED array chip 150 are alternately and regularly arranged (for example, a staggered arrangement). Are lined up. When the LED array device 103 shown in FIG. 6 is used, since the microlenses 113 and 153 are arranged at different positions in the short side direction (y direction) of the LED array device 103, the LED array chip 110 and the LED array chip 150 are arranged. By adjusting the light emission timing, it is possible to perform linear light irradiation on the irradiation target.

  In the LED array device 103 of FIG. 6, a plurality of microlenses arranged in the LED array chips 111 and 151 are arranged at an equal pitch in the longitudinal direction of the LED array device 103 by appropriately setting the gap G1. Can do. For this reason, the light quantity of the emitted light from the LED array device 103 can be made substantially uniform in the longitudinal direction of the LED array device 103.

  The LED array device 103 in FIG. 6 is the same as the device shown in FIGS. 1 to 5 except for the points described above. FIG. 6 shows a case where the microlens 153 closest to the substrate 111 among the plurality of microlenses 153 has the protruding portion 153a. However, as in the case of FIGS. 4 and 5, the protruding portion 153a. It can also be formed so as not to have.

<< Fourth Modification of Embodiment 1 >>
FIG. 7 is a plan view schematically showing a configuration of an LED array device 104 as an optical element device according to a fourth modification of the first embodiment. As shown in FIG. 7, the LED array device 104 includes a microlens 163 closest to the substrate 171 among the plurality of microlenses 163 and a microlens 173 closest to the substrate 161 among the plurality of microlenses 173. They are arranged at different positions in the direction orthogonal to the longitudinal direction of the substrate 161. In the example shown in FIG. 7, the LED array chips 160 and 170 of the LED array device 104 are arranged in an inclined direction in which the arrangement directions of the LEDs 162 and 172 and the microlenses 163 and 173 are inclined with respect to a predetermined direction (x direction). The LED array device 103 shown in FIG. 6 is different from the LED array device 103 shown in FIG. When the LED array device 104 shown in FIG. 7 is used, since the microlenses 163 and 173 are arranged at different positions in the short direction of the LED array device 104, the light emission timing is set for the LEDs having different positions in the short direction. By adjusting, it is possible to perform linear light irradiation on the irradiation target.

  In the LED array device 104 of FIG. 7, a plurality of microlenses arranged in the LED array chips 161 and 171 are arranged at an equal pitch in the longitudinal direction of the LED array device 104 by appropriately setting the gap G1. Can do. For this reason, the light quantity of the emitted light from the LED array device 104 can be made substantially uniform in the longitudinal direction of the LED array device 104.

  The LED array device 104 in FIG. 7 is the same as the device shown in FIGS. 1 to 6 except for the points described above. In FIG. 7, the microlens 163 closest to the substrate 171 among the plurality of microlenses 163 has the protruding portion 163 a, and the microlens 173 closest to the substrate 161 among the plurality of microlenses 173 is the protruding portion. Although the case of having 173a is shown, it may be configured to have only one of the protrusions 163a or 173a as in the case of FIGS.

<< Fifth Modification of Embodiment 1 >>
FIG. 8 is a plan view schematically showing a configuration of an LED array device 105 as an optical element device according to a fifth modification of the first embodiment. As shown in FIG. 8, the LED array chips 180 and 190 of the LED array device 105 are such that all of the microlenses 183 and 193 have protrusions 183a and 193a, and the protrusions 183a and 193a are in the short direction. It differs from the apparatus of FIGS. 1 to 7 in that it protrudes. In this LED array device 105, LED array chips 180 and 190 are arranged in a staggered manner. When the LED array device 105 shown in FIG. 8 is used, since the microlenses 183 and 193 are arranged at different positions in the short direction of the LED array device 105, the light emission timing is set for the LEDs having different positions in the short direction. By adjusting, it is possible to perform linear light irradiation on the irradiation target.

  In the LED array device 105 of FIG. 8, a plurality of microlenses 183 and 193 arranged on the LED array chips 180 and 190 can be arranged at an equal pitch in the longitudinal direction of the LED array device 105. For this reason, the amount of light emitted from the LED array device 105 can be made substantially uniform in the longitudinal direction of the LED array device 105.

  The LED array device 105 in FIG. 8 is the same as the device shown in FIGS. 1 to 7 except for the points described above.

<< Embodiment 2 >>
9 to 14 are longitudinal sectional views schematically showing each step (first to sixth steps) of the method of manufacturing the LED array device as the optical element device including the LED array chip according to the second embodiment of the present invention. FIG. Note that the manufacturing process of the LED array device according to the present embodiment includes a manufacturing process of an LED array chip as an optical element chip. First, as shown in FIG. 9, a plurality of LEDs 212 as optical elements are arranged on the main surface 211 a of the substrate 211. In FIG. 9, D1 indicates the thickness of the substrate 211, and A1 indicates a groove forming region (dicing region). On the substrate 211, the LED 212 includes a first optical element array 214 that is a part of the plurality of LEDs 212 and a second optical element array 224 that is another part of the plurality of LEDs 212 via the dicing area A <b> 1. It is arranged by dividing into. The LED 212 is, for example, an LED film (for example, an LED epitaxial film) formed on a growth substrate. The arrangement position of the plurality of LEDs 212 can be, for example, the position of the LEDs described with reference to FIGS.

  Next, as shown in FIG. 10, a groove (optical element chip dividing groove) 211c is formed on the main surface 211a of the substrate 211 by dicing using a dicing blade. By forming the groove 211c, the substrate 211 is a portion for the first substrate in which the first optical element array 214 formed by a part of the plurality of LEDs 212 is disposed (for example, the substrate 111 in FIG. 1). ) And a portion for the second substrate on which the second optical element array 224 formed by the other part of the plurality of LEDs 212 is disposed (for example, the substrate 121 in FIG. 1). A two-dot chain line t <b> 1 shown in FIG. 10 is an imaginary line showing the back surfaces of the first substrate 111 and the second substrate 121 when the LED array device is completed. Dicing is performed so that the depth D2 of the groove 211c is deeper than the depth D3 up to the two-dot chain line t1. However, the groove 211c may be formed so that the depth D2 of the groove 211c is equal to the thickness D3 of the first substrate 111 and the second substrate 121 when the LED array device 100 is completed. Further, the method is not limited to the method of forming the groove 211c by dicing, and the groove is formed by dry etching using a chlorine-based gas or fluorine-based gas, or wet etching using a potassium hydroxide aqueous solution or a mixed solution of hydrofluoric acid and nitric acid. 211c may be formed.

  Next, as shown in FIG. 11, the groove 211c is tented so as to cover the main surface 211a of the substrate 211, the first optical element array 214, the second optical element array 224, and the groove 211c. Like) A microlens-forming resist film (dry film resist) 250 is disposed. In the step of disposing the microlens forming resist film 250, for example, a negative type microlens forming resist film 250 is laminated on the main surface 211a of the substrate 211 on which the groove 211c is formed. At this time, the groove 211 c as well as the plurality of LEDs 212 are covered with the microlens forming resist film 250. The microlens-forming resist film 250 is desirably made of a material having a high transmittance with respect to the wavelength emitted from the LED 212. Further, it is desirable to use a material that has a low decrease in transmittance of emitted light from the LED due to deterioration of the microlens. Therefore, as a main material of the microlens forming resist film 250, for example, a material selected from epoxy, acrylic, silicone, polyimide, and amideimide is preferable. In the second embodiment, a negative dry film resist is used as the microlens-forming resist film 250, but any material that can cover the groove 211c (a material that can be tented) may be used. A type of dry film resist may be used.

  Next, as shown in FIGS. 12 and 13, in the step of forming the microlens 213 so as to cover the LED 212 from the microlens-forming resist film 250 by photolithography, the photomask 260 is formed by an ultraviolet exposure device. Then, the microlens forming resist film 250 is exposed. Thereby, only the microlens forming resist film 250 corresponding to the pattern of the photomask 260 is exposed. The exposure apparatus and the exposure irradiation conditions may be selected as appropriate, and exposure is performed through a photomask 260 using a light source such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, a deep ultraviolet lamp, and the like. 250 is photocured. If necessary, baking is performed after exposure to promote the reaction of the photocured portion and insolubilize in the developer. Furthermore, the development which elutes an unexposed part using alkaline aqueous solution or a solvent is performed, the micro lens 213 is formed, and the unnecessary part of the resist film 250 for micro lens formation is removed. If necessary, post-baking (thermal baking) is performed as post-drying to cure the microlens 213. By removing unnecessary portions of the microlens forming resist film 250, a first microlens array 215 including a plurality of microlenses 213 is formed on the first optical element array 214, and the second optical element array 224 is formed. A second microlens array 225 including a plurality of microlenses 213 is formed thereon. In the step of forming the microlens 213 (the first microlens array 215 and the second microlens array 225), the microlens 213 is disposed at a position closest to a second substrate 211e described later in the first microlens array 215. The microlens 213 is formed so as to have a protruding portion 213a protruding toward the second substrate 211e from an end of the first substrate 211d, which will be described later, facing the second substrate 211e. Similarly, in the second microlens array 225, a microlens 213 disposed at a position closest to a first substrate 211d to be described later is an end of a second substrate 211e to be described that faces the first substrate 211d. It is formed so as to have a protruding portion 213a protruding from the side toward the first substrate 211d. However, the microlens array may be formed so that one of the microlens arrays 215 and 225 does not have the protruding portion 213a. What is necessary is just to adjust suitably the protrusion amount of the protrusion part 213a with the pattern of the photomask 260, exposure irradiation conditions, etc. FIG.

  Next, as shown in FIG. 14, the substrate 211 is divided at the position of the groove 211c. The substrate 211 is divided by, for example, polishing the back surface that is the surface opposite to the main surface 211a of the substrate 211 shown in FIG. Dotted lines t1 and t2 shown in FIG. 13 are virtual lines indicating the back surfaces of the first substrate 111 (FIG. 1) and the second substrate 121 (FIG. 1) when the LED array device is completed. By polishing the back surface of the substrate 211, as shown in FIG. 14, the substrate 211d (substrate 111) drawn on the left side and the substrate 211e (substrate 121) drawn on the right side are grooves (optical element chips). Dividing at the dividing groove 211c, two LED array chips are completed. By dividing the substrate 211 at the position of the groove 211c, the substrate 211 is divided into a first substrate 211d composed of a first substrate portion and a second substrate 211e composed of a second substrate portion. Through the above steps, LED array chips 210 and 220 as optical element chips can be manufactured. The LED array chip 210 illustrated on the left side illustrated in FIG. 14 corresponds to, for example, the LED array chip 110 illustrated in FIG. 1, and the LED array chip 220 illustrated on the right side is illustrated in FIG. It corresponds to the LED array chip 120 shown. The substrate is divided into two parts by polishing the back surface of the substrate 211 to the position of the line segment t2 which is the same position as the depth of the groove 211c. However, the polishing is continued to an arbitrary position (for example, the line segment t1). The thickness of the substrates 211d and 211e divided into two may be adjusted by polishing. Further, an LED array device (for example, FIG. 1) is formed by a step of disposing the divided first substrate 211d and second substrate 211e on a base member (for example, 100a illustrated in FIG. 2) so as to be adjacent to each other. LED array device 100) is manufactured.

  As described above, according to the LED array chip and the method for manufacturing the LED array device according to the second embodiment, the microlens can be formed after the groove 211c is formed in the substrate 211. Therefore, the microlens by dicing is used. Can be avoided, and the tolerance of dicing can be reduced. In addition, since the microlens can be formed such that a part of the microlens (projecting portion 213a) protrudes outside the end portion of the main surface 211a of the substrate 211, regardless of the position of the end portion of the LED array chip. The degree of freedom in setting the lens diameter can be increased. In addition, since a material that can cover the groove 211c (a material that can be tented) is used as the microlens-forming resist film 250, it is easy to form a resist for protecting the surface of the LED array device during dry etching. Can do.

<< Embodiment 3 >>
The LED array device 300 according to Embodiment 3 is different from the LED array device 103 shown in FIG. 6 in that stepped portions 316 and 326 are formed on the main surfaces 311a and 321a of the substrates 311 and 321. Further, the manufacturing method of the LED array chip and the LED array device 300 according to Embodiment 3 is the same as that of Embodiment 2 in that it includes a step of forming step portions 316 and 326 on the main surfaces 311a and 321a of the substrates 311 and 321. Although different from the manufacturing method of the LED array chip and the LED array device, other steps can be the same as those in the second embodiment.

  FIGS. 15A and 15B are a plan view and a side view schematically showing a configuration of an LED array device 300 as an optical element device according to Embodiment 3 of the present invention. Among the plurality of microlenses 313 arranged on the main surface 311a of the substrate 311 of the LED array chip 310, the microlens 313 disposed at the end in the longitudinal direction of the LED array chip 310 protrudes from the microlens 313. A protrusion (first protrusion) 313a is provided as a part. The LED array chip 320 has a stepped portion 326 that is an end portion facing the LED array chip 310 and at the end portion in the longitudinal direction of the LED array chip 320 and having a lower main surface. Similarly, among the plurality of microlenses 323 arranged on the LED array chip 320, the microlens 323 disposed at the end in the longitudinal direction of the LED array chip 320 is a protruding portion as a protruding portion of the microlens 323. (Second protrusion) 323a is provided. The LED array chip 310 has a stepped portion 316 that is an end portion facing the LED array chip 320 and is a portion having a lower main surface at the end portion in the longitudinal direction of the LED array chip 310. That is, the substrate 321 of the LED array chip 320 has a stepped portion 326 at the end of the substrate 321 facing the protruding portion 313a of the microlens 313 in the adjacent LED array chip 310, and similarly, the substrate of the LED array chip 310. 311 has a stepped portion 316 at the end of the substrate 311 facing the protruding portion 323a of the microlens 323 in the adjacent LED array chip 320.

  In the LED array device 300, the microlenses 313 and 323 arranged at the mutually facing ends of the two LED array chips 310 and 320 adjacent to each other among the plurality of LED array chips are shifted from each other so as not to face each other. Has been. The LED array chip 310 and the LED array chip 320 are configured such that the protruding portion 313a of the microlens 313 located at the end of the LED array chip 310 partially overlaps the stepped portion 326 of the LED array chip 320, and the LED array The protrusions 323a of the microlenses 323 located at the ends of the chip 320 are arranged adjacent to each other so as to partially overlap the stepped portion 316 of the LED array chip 310. In the LED array device 300, a gap G4 is formed between the LED array chip 310 and the LED array chip 320, but the end surfaces of the LED array chip 310 and the LED array chip 320 are arranged in close contact with each other. Also good.

  The step portion 316 in the LED array chip 310 is arranged so that adjacent LED array chips (for example, 310 and 320) among the plurality of LED array chips are arranged close to each other. Is formed in a region facing the protruding portion 323a of the micro lens 323 located at the end of the LED array chip 320. Therefore, the length of the stepped portion 316 in the short direction of the LED array chip 310 is desirably formed longer than the diameter of the micro lens 323 of the LED array chip 320. Further, the length of the stepped portion 316 in the longitudinal direction of the LED array chip 310 is the protruding amount of the protruding portion 323a of the micro lens 323 of the LED array chip 320 (the length of the lens portion protruding from the end portion of the LED array chip 320). It is desirable to form it longer. The depth of the stepped portion 316 of the LED array chip 310 is desirably formed so as to ensure a depth that the end surface of the substrate 311 of the LED array chip 310 is not in contact with the protruding portion 323a. The stepped portion 326 in the LED array chip 320 may be formed in the same manner as the stepped portion 316 in the LED array chip 310 described above.

  The manufacturing method of the LED array device 300 according to the third embodiment is the same as the manufacturing process of the LED array device 100 according to the first embodiment, except for the steps of forming the step portions 316 and 326 on the substrates 311 and 321. is there. The step portions 316 and 326 can be formed after the microlens 213 is formed in the manufacturing process of the LED array device 200 according to Embodiment 2, for example, by the photolithography process. The step portions 316 and 326 can be formed by dry etching, but may be formed by other processes such as wet etching.

  Further, instead of the stepped step portions 316 and 326 formed on the substrates 311 and 321 of the LED array device 300, either or both of the regions where the stepped portions 316 and 326 described above are formed are cut out. You may form the notch part to be formed. Further, instead of forming the step portions 316, 326 or the notches on the substrates 311 and 321, on the main surface other than these regions (regions where the step portions 316, 326 or the notches are formed), for example, Even if LEDs 312 and 322 as optical elements and microlenses 313 and 323 are arranged thereon using polyimide, the same shape as the substrates 311 and 321 having the step portions 316 and 326 can be formed. Good.

  The LED array device 300 according to the third embodiment is different from the LED array device 100 according to the first embodiment in that step portions 316 and 326 are formed on the main surfaces 311a and 321a of the substrates 311 and 321. Other configurations are the same as those of the LED array device 100 according to the first embodiment. For this reason, the LED array device 300 according to the third embodiment has the same effect as the LED array device 100 according to the first embodiment.

  In addition, according to the LED array device 300 according to the third embodiment, by having the step portions 316 and 326, when arranging the plurality of LED array chips 310 and 320 substantially linearly in the longitudinal direction, the LED array chip The protrusion 313a of the microlens 313 located at the end of 310 is overlapped with the step 326 of the LED array chip 320, and the protrusion 323a of the microlens 323 located at the end of the LED array chip 320 is the LED. Since a plurality of LED array chips 310 and 320 can be arranged so as to overlap with the stepped portion 316 of the array chip 310, the end portion of the adjacent LED array chip due to variations in the thickness of the substrate for each LED array chip, etc. Can be prevented from colliding with the microlens located in the position.

  Further, by forming the regions of the step portions 316 and 326 in a notch shape, the same effect as described above can be obtained, but by forming the step portions 316 and 326 in a step shape instead of the notch shape, The strength of the end portions of the LED array chips 310 and 320 can be increased as compared with the case of forming the cutout shape.

<< First Modification of Embodiment 3 >>
FIG. 16 is a plan view schematically showing a configuration of an LED array device 301 as an optical element device according to a first modification of the third embodiment. In the LED array device 300 shown in FIGS. 15A and 15B, the end microlenses of the LED array chips 310 and 320 have protrusions 313a and 323a, and the substrates 311 and 321 are stepped portions 316 and 316, respectively. In the example of FIG. 16, the microlens 333 at the end of one of the adjacent LED array chips has the protrusion 333a and the other LED array chip as in the example of FIG. The microlens 343 at the end of the LED array has no projecting portion, and the end of one LED array chip of adjacent LED array chips does not have a stepped portion, and the end of the other LED array chip May have a stepped portion 346. As illustrated in FIG. 16, the LED array chip 330 includes a substrate 331, an LED array including a plurality of LEDs 332, and a microlens array including a plurality of microlenses 333. In the LED array chip 340, microlenses 343 are arranged so as not to have a protruding portion at the end facing the LED array chip 330. In the example of FIG. 16, it is desirable to arrange the LED array chip 330 and the LED array chip 340 linearly.

  In the LED array device 301 of FIG. 16, a plurality of microlenses 333 and 343 arranged on the LED array chips 330 and 340 can be arranged at an equal pitch in the longitudinal direction of the LED array device 301. For this reason, the amount of light emitted from the LED array device 301 and transmitted through the microlens can be made substantially uniform in the longitudinal direction of the LED array device 301.

  The LED array device 301 in FIG. 16 is the same as the device shown in FIGS. 15A and 15B except for the points described above.

<< Second Modification of Embodiment 3 >>
FIG. 17 is a plan view schematically showing a configuration of an LED array device 302 as an optical element device according to a second modification of the third embodiment. In the LED array device 300 shown in FIGS. 15A and 15B, the end microlenses of the LED array chips 310 and 320 have protrusions 313a and 323a, and the substrates 311 and 321 are stepped portions 316 and 316, respectively. In the example of FIG. 17, the microlens 353 at the end of one of the adjacent LED array chips has the protruding portion 353a, and the other LED array chip, as in the example of FIG. The microlens 363 at the end of the LED array chip does not have a protruding portion, and the end of one LED array chip of adjacent LED array chips does not have a stepped portion, and the end of the other LED array chip Has a step 366, and further tilts a microlens array including a plurality of microlenses 353 with respect to the longitudinal direction. Arranged in, it may be arranged a microlens array in the longitudinal direction in the inclined direction inclined with respect including a plurality of microlenses 363. As shown in FIG. 17, the LED array chip 350 includes a substrate 351, an LED array including a plurality of LEDs 352, and a microlens array including a plurality of microlenses 353. In the LED array chip 360, the microlens 363 is arranged so as not to have a protruding portion at an end facing the LED array chip 350. In the example of FIG. 17, it is desirable that the LED array chip 350 and the LED array chip 360 are linearly arranged.

  In the LED array device 302 of FIG. 17, a plurality of microlenses 353 and 363 arranged in the LED array chips 350 and 360 can be arranged at an equal pitch in the longitudinal direction of the LED array device 302. For this reason, the amount of light emitted from the LED array device 302 and transmitted through the microlens can be made substantially uniform in the longitudinal direction of the LED array device 302.

  17 is the same as the device shown in FIGS. 15A and 15B and FIG. 16 except for the points described above.

<< Embodiment 4 >>
The LED array device 400 according to the fourth embodiment is different from the LED array device 300 according to the third embodiment in that a protection member 417 and a collision mitigation member 418 described later are formed on the main surface 411a of the substrate 411. However, other configurations can be configured similarly to the third embodiment. Further, the manufacturing method of the LED array device 400 according to the fourth embodiment is a manufacturing method of the LED array device 300 according to the third embodiment in that the protective member 417 and the collision alleviating member 418 are formed on the main surface 411a of the substrate 411. However, the other steps can be the same as those in the second embodiment.

  18A and 18B are a plan view and a side view showing the configuration of the LED array device 400 according to Embodiment 4 of the present invention. A light emitting element device (LED array device) 400 as an optical element device has a plurality of LED array chips. FIG. 18 shows an LED array chip 410 and an LED array chip 420 that are adjacent to each other. Yes. Each of the plurality of LED array chips (for example, LED array chip 410) collides with a substrate 411, a light emitting element (LED) 412 as an optical element, a microlens 413, and a protective member (first member) 417. And a relaxation member (fourth member) 418.

  The LED array chip 410 has a protective member 417 protruding outward (toward the adjacent substrate) from the protruding portion 413a of the microlens 413, and the LED array chip 420 is a position facing the protective member 417, A collision mitigating member (second member) 428 protruding on the stepped portion 426 of the LED array chip 420 is provided.

  The LED array chip 420 includes a protective member (third member) 427 that protrudes outward (toward the adjacent substrate) from the protruding portion 423 a of the microlens 423, and the LED array chip 410 is attached to the protective member 427. A collision mitigating member 418 that protrudes on the stepped portion 416 of the LED array chip 410 at a position facing each other.

  The protection member 417 in the LED array chip 410 has a step 426 formed on the LED array chip 420 when the LED array chips adjacent to each other among the plurality of LED array chips 410 and 420 are arranged close to each other. Formed within the range. The collision alleviating member 428 in the LED array chip 420 is disposed at a position facing the protective member 417 on the main surface 411a of the LED array chip 410 and protruding on the step portion 426 of the LED array chip 420. The protective member 427 and the collision alleviating member 418 may be configured in the same manner as the protecting member 417 and the collision alleviating member 428 described above. The protection members 417 and 427 and the collision mitigation members 418 and 428 preferably have a rectangular parallelepiped block shape. However, as long as the protection members 417 and 427 and the collision mitigation members 418 and 428 facing each other can be in contact with each other, other shapes such as a triangular prism or a sphere may be used. Further, the protection members 417 and 427 and the collision relaxation members 418 and 428 can be formed of the same material as the microlens in the same process as the microlens formation process. However, the protection members 417 and 427 and the collision mitigation members 418 and 428 may be formed of a material different from that of the microlens.

  In the LED array device 400 according to Embodiment 4, a protection member 417 and a collision mitigation member 418 are formed on the main surface 411a of the substrate 411, and the protection member 427 and the collision mitigation member 428 are formed on the main surface 421a of the substrate 421. Is different from the LED array device 300 according to the third embodiment, but other configurations are the same as those of the LED array device 300 according to the third embodiment. Therefore, the LED array device 400 according to the fourth embodiment has the same effect as the LED array device 300 according to the third embodiment.

  Furthermore, according to the LED array device 400 according to the fourth embodiment, when the LED array chip 410 and the LED array chip 420 are arranged so as to be close to each other, the microlens arranged at the end of the LED array chip 410. Before the 413 collides with the LED array chip 420, the protection member 417 and the collision alleviating member 428 and the protection member 427 and the collision alleviating member 418 come into contact with each other. It is possible to reduce the damage of the microlens and the edge of the LED array chip. However, it is not always necessary to arrange the LED array chips 410 and 420 so that the protective member 417 and the collision mitigating member 428 are in contact with each other, and the protective member 427 and the collision mitigating member 418 are in contact with each other. The LED array chips 410 and 420 may be arranged so that the collision relaxation members 418 and 428 do not contact each other.

  18A and 18B are configuration examples in the case where the plurality of microlenses arranged in the longitudinal direction of the LED array device 400 are not at an equal pitch. That is, since the gap between the LED array chips 410 and 420 is set to be narrow, the pitch of the microlenses 413 and 423 disposed at the end portions where the LED array chips 410 and 420 face each other is set to other microlenses. It is narrower than the lens pitch. However, by adjusting the arrangement positions of the protection members 417 and 427 and the collision mitigation members 428 and 418 that are in contact with each other, the gaps between adjacent LED array chips can be positioned by bringing them into contact with each other. It is also possible to arrange a plurality of LED array chips so that the microlenses arranged in the longitudinal direction of the LED array device 400 have an equal pitch (described in a modification described later).

<< First Modification of Embodiment 4 >>
FIGS. 19A and 19B are a plan view and a side view schematically showing the configuration of the LED array device 401 according to the first modification of the fourth embodiment. 18A and 18B, when the arrangement pitch of the microlenses changes at the ends of the plurality of LED array chips 410 and 420 (that is, the plurality of microlenses arranged in the longitudinal direction of the LED array device 400). In the LED array device 401 shown in FIGS. 19A and 19B, the arrangement pitch of the microlenses is the same for the plurality of LED array chips 430 and 440 as a whole. It is. As shown in FIGS. 19A and 19B, the plurality of LED array chips 430 and 440 include substrates 431 and 441, LEDs 432 and 442 as light emitting elements as optical elements, micro lenses 433 and 443, and Have

  The LED array chip 430 includes a protective member (first member) 437 that protrudes to the outside of the protruding portion 433a of the micro lens 433 at the end, that is, the adjacent LED array chip 440 side. In addition, a collision mitigation member (second member) 448 that protrudes on the step portion 446 of the LED array chip 440 at a position facing the protection member 437 is provided. In addition, the LED array chip 440 includes a protective member (third member) 447 that protrudes to the outside of the protruding portion 443a of the micro lens 443 at the end, that is, the adjacent LED array chip 430 side. Reference numeral 430 denotes a position facing the protection member 447 and has a collision alleviating member (fourth member) 438 protruding on the stepped portion 436 of the LED array chip 430.

  The protection member 437 and the collision alleviation member 448 have a function of determining the distance between the LED array chips 430 and 440 in the longitudinal direction. Similarly, the protection member 447 and the collision alleviating member 438 have a function of determining the distance between the LED array chips 430 and 440 in the longitudinal direction. The protection members 437 and 447 and the collision mitigation members 438 and 448 preferably have a rectangular parallelepiped block shape, but may have other shapes such as a triangular prism or a sphere.

  According to the LED array device 401, when the LED array chip 430 and the LED array chip 440 are arranged so as to be close to each other, the microlens 433 disposed at the end of the LED array chip 430 collides with the LED array chip 440. Before the protection member 437 and the collision mitigation member 448 are in contact with each other, and the protection member 447 and the collision mitigation member 438 are in contact with each other. Can reduce breakage of the edges of the.

  Further, by adjusting the arrangement positions of the protective members 437 and 447 and the collision alleviating members 438 and 448 that are in contact with each other and bringing them into contact with each other, the gap between the adjacent LED array chips can be positioned.

  In the example shown in FIGS. 19A and 19B, the plurality of microlenses 433 and 443 arranged in the LED array device 401 are arranged at an equal pitch in the longitudinal direction of the LED array device 401. When the LED array device 401 is used, since the microlenses 433 and 443 are not linearly arranged in the longitudinal direction of the LED array device 401, the timing of light emission is controlled for each LED array chip, and the longitudinal direction of the LED array device 401 is The amount of light emission is controlled to be uniform.

<< Second Modification of Embodiment 4 >>
FIG. 20 is a plan view schematically showing a configuration of an LED array device 402 according to a second modification of the fourth embodiment. 18A and 18B includes a protection member (first member) 417, a collision mitigation member (fourth member) 418, a protection member (third member) 427, and a collision mitigation member. (Second member) 428 and two stepped portions 416 and 426, the LED array device 402 includes a pair of protective members (first members) at the end portions of the adjacent LED array chips facing each other. 457 and a collision alleviating member (second member) 468, and one step 466. In the LED array device 402, the microlens 463 at the end of the LED array chip 460 on the LED array chip 450 side does not have a protruding portion. In the LED array device 402 of FIG. 20, the arrangement pitch of the microlenses can be made equal to the whole of the plurality of LED array chips 450 and 460. As shown in FIG. 20, the plurality of LED array chips 450 and 460 include substrates 451 and 461, LEDs 452 and 462 as light emitting elements as optical elements, and microlenses 453 and 463, respectively.

  The LED array chip 450 has a protective member (first member) 457 that protrudes to the outside of the protruding portion 453a of the micro lens 453 at the end, that is, the adjacent LED array chip 460 side. , And a collision mitigating member (second member) 468 that protrudes on the stepped portion 466 of the LED array chip 460 at a position facing the protective member 457. The LED array device 402 is the same as the LED array device shown in FIGS. 18A and 18B or FIGS. 19A and 19B except for the points described above.

<< Third Modification of Embodiment 4 >>
FIG. 21 is a plan view schematically showing a configuration of an LED array device 403 as an optical element device according to a third modification of the fourth embodiment. As shown in FIG. 21, the plurality of LED array chips 470 and 480 of the LED array device 403 include substrates 471 and 481, LEDs 472 and 482 as light emitting elements as optical elements, and microlenses 473 and 483, respectively. Have. Further, the LED array device 403 includes a protection member (first member) 477, a collision alleviating member (fourth member) 478, a protection member (third member) 487, and a collision alleviating member (second member). 488, and stepped portions 476 and 486. In the apparatus of FIG. 21, a plurality of LEDs 472 and 482 are arranged in a predetermined tilt direction tilted with respect to the longitudinal direction (x direction), but the other points are shown in FIGS. 18 (a) and 18 (b). It is the same as the device.

<< Embodiment 5 >>
FIGS. 22A and 22B are a side view and a plan view schematically showing the configuration of the optical writing head 500 according to the fifth embodiment of the present invention. As shown in FIG. 22, the optical writing head 500 has a configuration in which a plurality of LED array chips 511 shown in the first to fourth embodiments are arranged on a base member 100a. Further, in front of the plurality of LED array chips 511 (positions facing the plurality of LED array chips 511), an optical system in which a large number of gradient index lenses are arranged to form one continuous image as a whole. An erecting equal-magnification imaging optical lens 550 is provided. According to the optical writing head 500 according to the fifth embodiment, it is possible to reduce variation in characteristics of each microlens constituting the microlens array shown in the first to fourth embodiments. The amount of emitted light (indicated by arrows) can be made substantially uniform.

<< Embodiment 6 >>
FIG. 23 is a longitudinal sectional view schematically showing a configuration of an LED printer 600 as an image forming apparatus according to Embodiment 6 of the present invention. The LED printer 600 is, for example, a color printer that employs an electrophotographic system. As shown in FIG. 23, the LED printer 600 has an image forming unit 10K that forms a developer image (toner image) on a recording medium P that is a sheet-like member such as paper by an electrophotographic method. 10Y, 10M, 10C, medium supply unit (paper feed unit) 30 for supplying the recording medium P to the image forming units 10K, 10Y, 10M, 10C, a transport unit 40 for transporting the recording medium P, and the image forming unit 10K. , 10Y, 10M, and 10C, a transfer roller 50 serving as a transfer device, and a fixing device 60 serving as a fixing device that fixes the toner image transferred onto the recording medium P onto the recording medium P. And a medium discharge section (sheet discharge section) 70 for discharging the recording medium P that has passed through the fixing device 60 to the outside of the image forming apparatus 600. In FIG. 23, four image forming units 10K, 10Y, 10M, and 10C are shown, but the number of image forming units included in the image forming apparatus 600 may be three or less, or five or more. FIG. 23 shows a color printer, but the present invention can be applied to a monochrome printer having one image forming unit as long as it is an apparatus that forms an image on a recording medium by electrophotography. Is also applicable. Furthermore, the present invention can be applied to other apparatuses such as a copying machine, a facsimile apparatus, and a multi-function peripheral apparatus (MFP) as long as the apparatus forms an image on a recording medium by an electrophotographic method.

  As shown in FIG. 23, the medium supply unit 30 in the housing 601 includes a medium cassette (paper cassette) 31 and a sheet feeding roller (hopping roller) that feeds out the recording media P stacked in the medium cassette 31 one by one. ) 32, a roller 33 for conveying the recording medium P fed out from the medium cassette 31, and a roller pair 34 for conveying the recording medium P toward the image forming units 10K, 10Y, 10M, and 10C. The medium cassette 31 is detachably mounted inside the housing 601 of the image forming apparatus 600. The recording media P stacked on the media cassette 31 are taken out one by one by the paper feed roller 32, and the taken-out recording media P travel on the medium conveyance path in the directions of the arrow D61 and the arrow D62, and the image forming unit 10K. , 10Y, 10M, 10C.

  The image forming units 10K, 10Y, 10M, and 10C are provided on the recording medium P with a black (K) toner image, a yellow (Y) toner image, a magenta (M) toner image, and a cyan (C) color. Each toner image is formed. The image forming units 10K, 10Y, 10M, and 10C are arranged along the medium conveyance path from the upstream side to the downstream side in the medium conveyance direction (arrow D63 direction). The image forming units 10K, 10Y, 10M, and 10C have image forming units 12K, 12Y, 12M, and 12C for the respective colors that are detachably formed. The image forming units 12K, 12Y, 12M, and 12C arranged in series are provided corresponding to the respective colors of the image forming units 10K, 10Y, 10M, and 10C. The image forming unit 12K forms an image with black toner, The image forming unit 12Y forms an image with yellow toner, the image forming unit 12M forms an image with magenta toner, and the image forming unit 12C forms an image with cyan toner. The image forming units 12K, 12Y, 12M, and 12C have basically the same structure except that the toner colors are different. The image forming units 10K, 10Y, 10M, and 10C have exposure optical units 11K, 11Y, 11M, and 11C as exposure apparatuses for the respective colors. The exposure optical units 11K, 11Y, 11M, and 11C are attached to the inner surface of a cover 602 that can be opened and closed. The user can replace each of the image forming units 12K, 12Y, 12M, and 12C by opening the cover 602. The exposure optical units 11K, 11Y, 11M, and 11C receive drive signals based on the image data of the respective colors, and irradiate the photosensitive drum 13 with exposure light corresponding to the input drive signals.

  As shown in FIG. 23, each of the image forming units 12K, 12Y, 12M, and 12C uniformly charges the photosensitive drum 13 as an image carrier that is rotatably supported and the surface of the photosensitive drum 13. An electrostatic latent image is formed on the surface of the photosensitive drum 13 by exposure with the charging roller 14 as a charging member to be used and the exposure optical units 11K, 11Y, 11M, and 11C, and then the toner is supplied to the surface of the photosensitive drum 13 And a developing device 15 for forming a toner image corresponding to the electrostatic latent image, and a cleaning blade 16 as a cleaning member.

  The developing device 15 includes a toner accommodating portion 651 as a developer accommodating portion that forms a developer accommodating space for accommodating the toner 652, and a toner that replenishes new toner into the toner accommodating portion 651 from the upper opening of the toner accommodating portion 651. A cartridge (developer cartridge). Further, the developing device 15 is rotatably supported, and a developing roller 653 as a developer carrying member that supplies toner to the surface of the photosensitive drum 13, and the toner accommodated in the toner accommodating portion 651 are supplied to the developing roller 653. It has a supply roller 654 to be supplied and a developing blade 655 as a toner regulating member that regulates the thickness of the toner layer on the surface of the developing roller 653.

  Exposure by the exposure optical units 11K, 11Y, 11M, and 11C is performed on the surface of the uniformly charged photosensitive drum 13 based on input image data. Each of the exposure optical units 11K, 11Y, 11M, and 11C includes an optical writing head (corresponding to 500 in FIG. 22) in which a plurality of light emitting elements are arranged in the axial direction of the photosensitive drum 13.

  As shown in FIG. 23, the transport unit 40 includes a transport belt (transfer belt) 43 that electrostatically attracts and transports the recording medium P, and a drive roller (drive roller) that is rotated by the drive unit and drives the transport belt 43. 41), a tension roller (driven roller) 42 that stretches the conveying belt 43 in pairs with the drive roller 41, a transfer belt cleaning blade 44 that scrapes and cleans the toner remaining on the conveying belt 43, and A waste toner storage unit 45 that stores toner collected by being scraped off by the transfer belt cleaning blade 44;

  As shown in FIG. 23, the transfer roller 50 is disposed to face the photosensitive drums 13 of the image forming units 12K, 12Y, 12M, and 12C with the conveyance belt 43 interposed therebetween. The developer image (toner image) formed on the surface of the photosensitive drum 13 of each of the image forming units 12K, 12Y, 12M, and 12C is the upper surface of the recording medium P that is conveyed in the direction of arrow D63 along the medium conveyance path. Are sequentially transferred by the transfer roller 50 to form a color image in which a plurality of toner images are superimposed.

  As shown in FIG. 23, the fixing device 60 includes a pair of rollers 61 and 62 that are in pressure contact with each other. The roller 61 is a heat roller with a built-in heater, and the roller 62 is a pressure roller pressed against the roller 61. The recording medium P having the unfixed developer image (toner image) transferred by the transfer roller 50 passes between the pair of rollers 61 and 62 of the fixing device 60 (directions of arrows D64 and D65). At this time, the unfixed toner image is fixed on the recording medium P by being heated and pressurized.

  As shown in FIG. 23, the medium discharge unit 70 includes a pair of conveyance rollers 71 that are made of a pair of rollers that are pressed against each other and face each other. The rollers constituting the conveying roller pair 71 are connected to a driving unit including a power transmission mechanism including a gear for transmitting a rotational driving force and a motor, and rotate to move the recording medium P in the direction of an arrow D66. Discharge. The configuration of the medium discharge unit 70 is not limited to the example of FIG. 23, and may further include other configurations such as another roller pair and a sensor that detects the passage of the recording medium P. The LED printer 600 shown in FIG. 23 shows a configuration example in which only one side of the recording medium P is printed. In order to invert the recording medium P when printing both sides of the recording medium P, FIG. A paper reversing device to be used can also be provided.

  By mounting the LED array device or the optical writing head according to Embodiments 1 to 5 on the exposure device, the amount of light emitted from the mounted LED array device can be made substantially uniform in the longitudinal direction of the LED array device. Therefore, it is possible to prevent exposure to an unintended portion on the photosensitive drum. Therefore, it is possible to more stably manufacture a high-quality exposure apparatus and LED printer that can suppress the generation of printing streaks.

  The LED array devices or optical writing heads of Embodiments 1 to 5 described above may be changed to configurations and manufacturing methods other than those shown in the drawings. For example, an electroluminescent (EL) element formed of an organic material or an EL element formed of an inorganic material may be used as the light emitting element instead of the LED. Moreover, you may mount LED as a light emitting element in an LED array apparatus by a flip-chip system.

<Modification>
FIG. 24 is a plan view schematically showing a modification of the LED as the optical element. In the above embodiment, the case where one LED is arranged in one microlens (for example, the microlenses 113 and 123 in the first embodiment) has been described. However, as shown in FIG. A plurality of LEDs 112 a may be arranged in the two microlenses 113 and 123.

  FIG. 25 is a plan view schematically showing a modification of the optical element array. In the above embodiment, the case where one light emitting portion (for example, LED) is provided in one LED epitaxial film has been described. However, as shown in FIG. A plurality of LEDs 112 b may be provided in the LED epitaxial film 112 c and each LED 112 b may be covered with the microlens 113.

  FIGS. 26A and 26B are a side view and a plan view schematically showing a modification of the microlens. In the above embodiment, the case where the microlens as the condensing lens (for example, the microlenses 113 and 123 in the first embodiment) is a hemispherical lens is illustrated, but FIGS. ), A microlens 713 which is a compound lens in which a plurality of lens portions are regularly arranged two-dimensionally may be employed.

  In the first to fourth embodiments, the case where the optical element device is a light emitting element device has been described. However, by providing a light receiving element (for example, a photodiode) as an optical element, the optical element device is changed to a light receiving element. It can be a line sensor as an image reading unit in an apparatus, for example, an image scanner. In this case, variation in the amount of incident light incident on the light receiving device as the optical element device can be reduced, and high-quality light receiving performance can be obtained.

  100-105, 300-302, 400-403 LED array device, 110, 160, 180, 310, 330, 350, 410, 430, 450, 470 LED array chip, 111, 161, 181, 311, 331, 351 411, 431, 451, 471 substrate (first substrate), 111a, 311a main surface, 111b edge, 112, 162, 182, 312, 332, 352, 412, 432, 452, 472 LED, 113, 163 183, 313, 333, 353, 413, 433, 453, 473 Microlens (first microlens), 113a, 163a, 183a, 313a, 333a, 353a Projection (first projection), 114 LED array, 120, 130, 140, 150, 170 190, 320, 340, 360, 420, 440, 460, 480 LED array chip, 121, 131, 141, 151, 171, 191, 321, 341, 361, 421, 441, 461, 481 substrate, 121a, 131a, 141a, 321a main surface, 121b edge, 122, 132, 142, 152, 172, 192, 322, 342, 362, 422, 442, 462, 482 LED, 123, 133, 143, 153, 173, 193, 323 , 343, 363, 423, 443, 463, 483 Microlens (second microlens), 123a, 153a, 173a, 193a, 323a Projection (second projection), 124 LED array, 211 substrate, 211a main Surface, 211c groove, 212 LED, 213 microlens, 250 resist film (dry film resist), 316, 326, 346, 366, 416, 426, 436, 446, 466, 476, 486, stepped portion, 417, 427, 437, 447, 457, 477 , 487 protection member, 418, 428, 438, 448, 468, 478, 488 collision mitigation member, 500 optical writing head, 600 image forming apparatus.

Claims (17)

A first substrate; a first optical element array including a plurality of optical elements disposed on the first substrate; and a first optical element array formed on the first substrate so as to cover the first optical element array. A first microlens array including a plurality of first microlenses, and a first optical element chip,
A second substrate; a second optical element array including a plurality of optical elements disposed on the second substrate; and the second optical element array formed on the second substrate so as to cover the second optical element array. A second optical element chip having a second microlens array including a plurality of second microlenses,
With
The first substrate and the second substrate are disposed adjacent to each other,
Of the plurality of first microlenses, the first microlens disposed at a position closest to the second substrate is the first microlens from the edge of the first substrate facing the second substrate. An optical element device comprising: a first protrusion protruding toward the second substrate.   Of the plurality of second microlenses, the second microlens disposed at a position closest to the first substrate is the first substrate of the second substrate from the side of the second substrate facing the first substrate. The optical element device according to claim 1, further comprising a second projecting portion projecting toward one substrate.   The plurality of microlenses including the plurality of first microlenses and the plurality of second microlenses are arranged at an equal pitch in a longitudinal direction of the first substrate. Or the optical element apparatus of 2. The plurality of first microlenses are arranged linearly in a predetermined direction,
The plurality of second microlenses are arranged linearly in the predetermined direction,
The optical element device according to any one of claims 1 to 3, wherein the first microlens array and the second microlens array are linearly arranged in the predetermined direction. . The plurality of first microlenses are arranged linearly in a predetermined direction,
The plurality of second microlenses are arranged linearly in the predetermined direction,
The first microlens array and the second microlens array are arranged at different positions in a direction orthogonal to the predetermined direction. Optical element device. The plurality of first microlenses are arranged in a first inclined direction inclined with respect to a longitudinal direction of the first substrate,
The plurality of second microlenses are arranged in a second inclined direction inclined with respect to a longitudinal direction of the second substrate,
A first microlens closest to the second substrate of the plurality of first microlenses, and a second microlens closest to the first substrate of the plurality of second microlenses; Are arranged at different positions in a direction perpendicular to the longitudinal direction of the first substrate. The optical element device according to any one of claims 1 to 3.   The first projecting portion of the first microlens closest to the second substrate among the plurality of first microlenses has a portion overlapping the second substrate. Item 7. The optical element device according to Item 5 or 6.   The optical element device according to claim 5, wherein the second substrate has a stepped portion at an end portion of the second substrate facing the first projecting portion.   The optical element device according to claim 8, wherein the first substrate has a step portion at an end portion of the first substrate facing the second projecting portion. The first optical element chip includes a first member provided on the first substrate and protruding toward the second substrate from the first protrusion,
The optical element device according to claim 9, wherein the second optical element chip includes a second member that is provided on the second substrate and is in contact with or faces the first member. The second optical element chip includes a third member that is provided on the second substrate and protrudes toward the first substrate from the second protrusion,
The optical element device according to claim 10, wherein the first optical element chip includes a fourth member that is provided on the first substrate and is in contact with or opposed to the third member.   12. The compound lens according to claim 1, wherein each of the plurality of first microlenses and the plurality of second microlenses is a compound lens including a plurality of lens portions regularly arranged. The optical element device according to item 1.   The optical element device according to any one of claims 1 to 12, wherein the first optical element array and the second optical element array are light emitting element arrays.   The optical element device according to any one of claims 1 to 12, wherein the first optical element array and the second optical element array are light receiving element arrays.   An optical writing head comprising the optical element device according to claim 13.   An image forming apparatus comprising the optical writing head according to claim 15. Arranging a plurality of optical elements on the main surface of the substrate;
A groove is formed in the main surface of the substrate, and a portion for the first substrate on which a first optical element array formed by a part of the plurality of optical elements is arranged from the substrate, and the plurality of the plurality Forming a second substrate portion on which a second optical element array formed by another part of the optical element is disposed;
A step of disposing a resist film for forming a microlens that covers the first optical element array and the second optical element array and covers an upper part of the groove;
Using photolithography, a first microlens array including a plurality of first microlenses is formed on the first optical element array from the resist film, and a plurality of first microlens arrays are formed on the second optical element array. Forming a second microlens array including two microlenses;
By dividing the substrate at the position of the groove, a first optical device having a first substrate composed of a portion for the first substrate, the first optical element array, and the first microlens array. Forming a second optical element chip having an element chip, a second substrate composed of a portion for the second substrate, the second optical element array, and the second microlens array; ,
A method of manufacturing an optical element chip, comprising:

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