JP2016060060A - Semiconductor device, image forming device, and image reading device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving stable light irradiation performance or light receiving performance, and an image forming device and an image reading device including this semiconductor device irrespective of the change of a use environment.SOLUTION: The semiconductor device 100 includes an optical element array substrate having a plurality of semiconductor optical elements arrayed in a longitudinal direction, a lens array part 120 having a plurality of lens elements arrayed in the longitudinal direction, and a frame part 110 holding the optical element array substrate and the lens array part 120 so as to set the plurality of semiconductor optical elements and the plurality of lens elements oppositely to each other. The lens array part 120 has a first concave part 124 as a first engaging part set at a position opposite the frame part 110, and the frame part 110 has a first convex part 113 as a first engaged part engaged by the first concave part 124 to determine the longitudinal position of the lens array part 120 with respect to the frame part 110.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor device, an image forming apparatus including the semiconductor device, and an image reading apparatus.

  In general, in an LED (light emitting diode) printer which is an image forming apparatus using an electrophotographic method, an LED print head used as an exposure apparatus is an LED array having an LED array composed of a plurality of LEDs arranged in a row. It has a mounting substrate, a lens array arranged opposite to the LED array, a holder for holding these, and the like, and each of the lens array and the LED array mounting substrate is fixed to the holder or the like. For example, in Patent Document 1, an LED array mounting board (circuit board) on which an LED array is arranged is fixed to a base member that is a constituent element of an LED print head with an adhesive, and a rod lens is attached to a holder supported by the base member. The array is fixed with an adhesive.

JP 2009-119756 A

  However, in the LED print head as the conventional semiconductor device described above, when the adhesive force of the adhesive is weak, the relative positional relationship between the lens array and the LED array mounting substrate changes due to a change in use environment, and is stable. There was a problem that light irradiation could not be realized.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor device capable of realizing stable light irradiation performance or light receiving performance regardless of changes in usage environment, an image forming apparatus including the semiconductor device, and an image reading apparatus. is there.

  The semiconductor device according to the present invention includes a plurality of semiconductor optical elements arranged in the longitudinal direction, each of the optical element array substrate having the plurality of semiconductor optical elements having optical axes substantially parallel to each other, and the longitudinal direction. A plurality of lens elements arranged in a lens array section each having the plurality of lens elements each having a substantially parallel central axis, and the plurality of semiconductor optical elements and the plurality of lens elements face each other. The optical element array substrate and the frame portion that holds the lens array portion, the lens array portion has a first engagement portion disposed at a position facing the frame portion, The frame portion includes a first engaged portion that is engaged by the first engaging portion and determines a position in the longitudinal direction of the lens array portion with respect to the frame portion. And butterflies.

  According to the semiconductor device of the present invention, stable light irradiation performance or light reception performance can be realized regardless of changes in the use environment.

  According to the image forming apparatus of the present invention, it is possible to maintain stable print quality regardless of changes in the use environment.

  According to the image reading apparatus of the present invention, it is possible to maintain stable image reading quality regardless of changes in the use environment.

It is a top view which shows the structure of the optical print head as a semiconductor device concerning Embodiment 1 of this invention. (A) is an enlarged top view showing a part of the optical print head shown in FIG. 1, and (b) is an enlarged top view showing a part of the optical print head shown in FIG. It is an external appearance perspective view which shows the optical print head of the state which mounted | wore the lens part with the lens array part and the light emitting element array board | substrate. FIG. 4 is an enlarged perspective view showing the structure of the optical print head including a cross-sectional structure taken along line S4-S4 of the optical print head shown in FIG. FIG. 3 is an exploded perspective view showing an assembly structure of the optical print head according to the first embodiment. (A) is an expansion perspective view which shows a part of lens array part and frame part which are shown by FIG. 5, (b) is an expansion perspective view which shows a part of light emitting element array board | substrate shown by FIG. It is a top view showing an optical print head in a state where a lens array part is mounted on a frame part. (A) is an enlarged top view showing a region including the reference region of the optical print head shown in FIG. 7, and (b) is an enlarged view showing a region not including the reference region of the optical print head shown in FIG. It is a top view. FIG. 2 is a view of an optical print head mounted so as to face a photosensitive drum of a printer as an image forming apparatus in a direction perpendicular to the longitudinal direction of the optical print head. FIG. 10 is an enlarged view showing the vicinity of an end portion in a longitudinal direction of the optical print head shown in FIG. 9. 1 is an external perspective view showing a configuration of an image sensor head as a semiconductor device according to a first embodiment. FIG. 12 is an enlarged perspective view showing the structure of the image sensor head including a cross-sectional structure of the image sensor head shown in FIG. 11 taken along line segment S12-S12. FIG. 3 is an exploded perspective view showing an assembly structure of the image sensor head according to the first embodiment. FIG. 14A is an enlarged perspective view showing a part of the lens array portion and the frame portion shown in FIG. 13, and FIG. 14B is an enlarged perspective view showing a portion of the light emitting element array substrate shown in FIG. (A) And (b) is the top view and bottom view which show the optical print head concerning Embodiment 2 of this invention. (A) is an enlarged top view showing a part of the upper surface of the optical print head shown in FIG. 15 (a), and (b) shows a part of the upper surface of the optical print head shown in FIG. 15 (a). It is an enlarged top view. (A) is an enlarged bottom view showing a part of the lower surface of the optical print head shown in FIG. 15 (b), and (b) shows a part of the lower surface of the optical print head shown in FIG. 15 (b). It is an enlarged bottom view. FIG. 6 is an exploded perspective view showing an assembly structure of an optical print head according to a second embodiment. (A) is a top view showing the optical print head with the lens array portion mounted on the frame portion, and (b) is a bottom view showing the optical print head with the light emitting element array substrate mounted on the frame portion. It is. (A) is an enlarged top view showing a part of the upper surface of the optical print head shown in FIG. 19 (a), and (b) shows a part of the upper surface of the optical print head shown in FIG. 19 (a). It is an enlarged top view. FIG. 19A is an enlarged bottom view showing a part of the lower surface of the optical print head shown in FIG. 19B, and FIG. 19B shows a part of the lower surface of the optical print head shown in FIG. It is an enlarged bottom view. FIG. 10 is a diagram illustrating a modification of the second engaging portion and the second engaged portion in the second reference region of the optical print head according to the second embodiment. FIG. 10 is a longitudinal sectional view schematically showing the structure of an LED printer to which any of the optical print heads according to Embodiment 3 is applied. FIG. 10 is an external perspective view schematically showing a flat bed type image scanner to which an image sensor head according to a fourth embodiment is applied.

Embodiment 1 FIG.
FIG. 1 is a top view showing a configuration of an optical print head 100 according to Embodiment 1 of the present invention. FIG. 2A is an enlarged top view showing a region A1 which is a part of the optical print head 100 shown in FIG. FIG. 2B is an enlarged top view showing a region A2 which is a part of the optical print head 100 shown in FIG.

  As shown in FIG. 1 or FIGS. 2A and 2B, an optical print head 100 as a semiconductor device according to the first embodiment includes an optical element array substrate (a member 140 shown in FIG. 5 described later). The lens array unit 120 and a frame unit 110 that is a holding member that holds the optical element array substrate and the lens array unit 120 are provided.

  The optical element array substrate is a plurality of semiconductor optical elements arranged in the longitudinal direction (lateral direction in FIG. 1), and each has an optical axis substantially parallel to each other (an optical axis in a direction perpendicular to the paper on which FIG. 1 is drawn). ) Having a plurality of semiconductor optical elements (member 142 shown in FIG. 5 described later). Since the optical element array substrate (member 140 shown in FIG. 5 described later) is mounted on the lower surface side opposite to the upper surface 111 of the frame portion 110, the optical element array substrate is shown in FIGS. 1 and 2A, 2B. Is not shown.

  As shown in FIG. 1 or FIG. 2 (a), (b), the lens array unit 120 has a pair of long sides whose outer edges of the upper surface shape extend in the longitudinal direction, and a short direction perpendicular to the longitudinal direction ( It is formed to have a substantially rectangular shape having a pair of short sides extending in the vertical direction in FIG. The lens array unit 120 includes a plurality of lens elements 121 arranged in the longitudinal direction, each having a central axis substantially parallel to each other (a central axis in a direction perpendicular to the paper on which FIG. 1 is drawn). Have The lens array unit 120 has a first recess 124 as a first engagement portion disposed at a position facing the frame unit 110 in the slit-shaped opening 112 of the frame unit 110. In addition, each optical axis of the plurality of semiconductor optical elements is, for example, an optical axis in a direction orthogonal to both the longitudinal direction and the short direction.

  Also, as shown in FIG. 1 or FIG. 2 (a), (b), the planar shape of the frame part 110 is such that, for example, the shape of the outer edge of the upper surface 111 is a pair of long sides extending in the longitudinal direction. It is a substantially rectangular shape having a pair of short sides extending in the short direction perpendicular to the longitudinal direction. A slit-like opening 112 is provided on the upper surface 111 of the frame 110. For example, the inner edge (inner wall) of the opening 112 is formed to have substantially the same shape as the outer edge of the lens array unit 120 so as to surround the outer edge of the lens array unit 120. Since the shape of the opening 112 of the frame 110 is substantially the same as the shape of the outer edge of the lens array 120, the lens array 120 is inserted into the opening 112 of the frame 110. The lens array unit 120 is held in the opening 112 of the frame unit 110. A pair of first convex portions 113 as first engaged portions are provided inside the opening portion 112 of the frame portion 110. A pair of first concave portions 124 as first engaging portions are provided on the outer edge of the lens array portion 120. The first convex portion 113 of the frame portion 110 and the first concave portion 124 of the lens array portion 120 are engaged to position the lens array portion 120 in the longitudinal direction with reference to the frame portion 110. In addition, it is desirable that the frame portion 110 is configured using, for example, a metal such as structural steel or aluminum, or a resin material having excellent dimensional stability such as a liquid crystal polymer (LCP).

  The reference area A3 shown in FIG. 1 or FIG. This is a region including a portion with which the first convex portion 113 provided is engaged.

  As shown in FIG. 1, holes as positioning portions 114 are formed at predetermined positions near both ends in the longitudinal direction of the upper surface 111 of the frame portion 110. For example, when the optical print head 100 is mounted on an image forming apparatus such as a printer, the positioning unit 114 can be used for positioning to determine the relative position of the optical print head 100 with respect to the printer body structure. In FIG. 1, a hole near both ends of the upper surface 111 of the frame portion 110 is illustrated as the positioning portion 114. However, the positioning portion is not limited to the hole, and protrudes from the upper surface 111 of the frame portion 110 and faces the hole. It may be a convex structure that engages with the positioning printer body structure. Further, the positioning portion 114 may be formed only at an end portion on one end side in the longitudinal direction of the frame portion 110.

  As shown in FIGS. 2A and 2B, the lens array unit 120 includes a refractive index distribution type lens 121 as a plurality of lens elements arranged in the longitudinal direction, and the plurality of refractive index distribution type lenses 121. And a pair of side plates 123 sandwiched between both side surfaces in the short direction. As shown in FIGS. 2A and 2B, the lens array unit 120 includes a first-row lens group and a second-row lens group that are linearly arranged in the longitudinal direction. It includes two rows of lens groups arranged in the width direction of the array unit 120. Specifically, each of the plurality of gradient index lenses 121 has a central axis in a direction orthogonal to both the longitudinal direction and the lateral direction, and the lens array so that the central axes are substantially parallel to each other. The lens unit has two rows of lens groups arranged in parallel in the unit 120. However, the number of columns of the lens group (the number in the short direction) may be one column or three or more columns. When a rod lens is used as the gradient index lens, the lens array unit 120 is a rod lens array unit. When a lens group composed of a plurality of gradient index lenses 121 is sandwiched from both sides by a pair of side plates 123, gaps formed between the plurality of gradient index lenses 121, and a plurality of gradient index types A gap generated between the lens 121 and the side plate 123 is filled with an adhesive 122. A plurality of gradient index lenses 121 are fixed inside the pair of side plates 123 by the adhesive 122. The gradient index lens 121 is a lens made of, for example, glass or acrylic. The side plate 123 is made of, for example, a resin such as fiber reinforced plastic, phenol resin, epoxy resin, or ABS resin (acrylonitrile butadiene styrene resin). Further, as the adhesive 122, for example, an adhesive whose main material is epoxy, acrylic, or urethane is used.

  As shown in FIG. 2A, on the outward surface of the pair of side plates 123, which is the side surface in the region A1 in the substantially central portion in the longitudinal direction of the lens array unit 120, a first engaging portion is provided. First recesses 124 are respectively formed. The pair of first recesses 124 is a recess structure that is recessed inward from the outward surface of the side plate 123. The pair of first recesses 124 are arranged so as to be arranged in the lateral direction of the lens array unit 120 with a plurality of gradient index lenses 121 arranged in the longitudinal direction. However, the first recess 124 is not limited to the configuration formed as a pair aligned in the short direction, and may be formed on any one of the side plates 123 of the lens array unit 120. The position where the first recess 124 is formed is not limited to the substantially central portion in the longitudinal direction of the lens array unit 120, but the first recess 124 is a position in the longitudinal direction of the lens array unit 120 with respect to the frame unit 110. Therefore, it is desirable to form the lens array portion 120 near the central portion in the longitudinal direction.

  A pair of first pairs having a convex structure corresponding to the shape of the first concave portion 124 of the lens array portion 120 inside the slit-shaped opening 112, which is a substantially central portion in the longitudinal direction of the frame portion 110. One convex portion 113 is formed at a position corresponding to the position where the first concave portion 124 is formed. As a result, the first convex portion 113 in the opening 112 of the frame portion 110 and the first concave portion 124 of the side plate 123 of the lens array portion 120 are engaged, and the lens array portion 120 and the frame portion 110 are thus engaged. The relative positional relationship in the longitudinal direction is determined. In the first embodiment, a region including a portion where the first concave portion 124 and the first convex portion 113 are engaged is referred to as a reference region A3. Note that the position at which the first protrusion 113 is formed is determined in accordance with the position of the first recess 124 and is not limited to the vicinity of the central portion in the longitudinal direction of the frame portion 110, but in the longitudinal direction of the frame portion 110. It is desirable to be near the center. Note that a convex portion may be provided as the first engaging portion of the lens array portion 120, and a concave portion may be provided as the first engaged portion in the opening 112 of the frame portion 110.

  When the rigidity of the lens array unit 120 is low, the lens array unit 120 is distorted due to stress generated when the lens array unit 120 is press-fitted into the opening 112 of the frame unit 110 to be fitted, and the length of the lens array unit 120 is increased. The center position in the direction may deviate from the center position in the longitudinal direction of the light emitting array element 142 (a member 142 shown in FIG. 5 described later) as an optical element array. Therefore, it is desirable to provide a gap for giving a predetermined play between the outer surface of the lens array unit 120 according to Embodiment 1 and the inner surface of the opening 112 of the frame unit 110. Specifically, gaps 130 and 131 are formed between the outer surface of the side plate 123 of the lens array unit 120 and the inner surface of the opening 112 of the frame unit 110. The gap 131 is formed between the first concave portion 124 of the lens array portion 120 and the first convex portion 113 in the opening portion 112 of the frame portion 110. In other words, the size of the first recess 124 in the longitudinal direction is set so that a gap 131 is formed between the first recess 124 and the first projection 113 in the longitudinal direction of the optical print head 100. The first protrusion 113 is formed slightly larger than the size in the longitudinal direction. The width of the gap 131 in the short direction is smaller than the width in the short direction of the gap 130 formed at a position other than between the first recess 124 and the first protrusion 113. The size of the concave portion 124 in the short direction is slightly larger than the size of the first convex portion 113 in the short direction.

  The air gap may be formed only in the reference area A3, and the air gap may not be provided in any area other than the reference area A3. The width of the gap 131 in the short direction is preferably larger than 0 μm and smaller than 500 μm. As will be described later, the lens array portion 120 and the frame portion 110 are fixed to each other by filling the gaps 130 and 131 with the adhesive 153. By filling the gaps 130 and 131 with the adhesive 153, the rigidity can be increased at the bonded portion between the lens array portion 120 and the frame portion 110. Alternatively, the adhesive 153 may be used to fix only the gap 131 in the reference area A3 or the gap 130 in an area other than the reference area A3. As the adhesive 153, for example, any one of ultraviolet curable adhesives mainly composed of epoxy, acrylic, urethane, or the like can be used.

  FIG. 3 is an external perspective view showing the optical print head 100 in a state where the lens array unit 120 and the light emitting element array substrate 140 as an optical element array substrate are mounted on the frame unit 110. The light emitting element array substrate 140 is not shown in FIG. 3 because it is mounted on the lower surface side of the frame part 110. In this specification, the “light emitting element array substrate” has a structure in which the light emitting element array 142 is provided on the printed wiring board 141. As shown in FIG. 3, after the lens array unit 120 is bonded to the frame unit 110 using the adhesive 153, the gaps 130 and 131 between the lens array unit 120 and the inner wall of the opening 112 of the frame unit 110 are used. Is provided with a sealing material 150. By providing the sealing material 150, the optical print head 100 can be sealed from the outside so that foreign matter such as dust or toner for the printer does not enter from the outside.

  FIG. 4 is an enlarged perspective view showing the structure of the optical print head 100 including a cross-sectional structure taken along line S4-S4 of the optical print head 100 shown in FIG. As shown in FIG. 4, in the lens array unit 120, a part on the lower surface 120 b side of the lens array unit 120 is inserted into the opening 112 of the frame unit 110, for example, an adhesive (a member shown in FIG. 7 described later). 153) to the frame portion 110. The upper surface 120a of the lens array unit 120 protrudes outside the opening 112 of the frame unit 110 (upward in FIG. 4). In order to close the gap between the lens array part 120 and the opening part 112 of the frame part 110, a sealing material 150 is provided along the longitudinal direction of the lens array part 120 and the frame part 110.

  As shown in FIG. 4, the optical print head 100 according to Embodiment 1 further includes a light emitting element array substrate 140 in addition to the lens array unit 120 and the frame unit 110. The light emitting element array substrate 140 includes, for example, a glass epoxy substrate 141 formed such that the outer edge on the upper surface has a substantially rectangular shape including a pair of long sides in the longitudinal direction and a pair of short sides in the short direction. . On the glass epoxy substrate 141, a plurality of light emitting elements as a plurality of semiconductor optical elements that irradiate light are arranged in the longitudinal direction. Specifically, each of the plurality of light emitting elements has an optical axis (vertical direction in FIG. 4), and is arranged in parallel in the longitudinal direction of the light emitting element array substrate 140 so that the optical axes thereof are substantially parallel to each other. Has been. Here, in this specification, “a plurality of light emitting elements arranged in a row” is referred to as a light emitting element array (or a light emitting array element). That is, a light emitting element array 142 including a plurality of light emitting elements arranged in the longitudinal direction is provided on the light emitting element array substrate 140.

  The light emitting element array 142 is composed of, for example, a plurality of light emitting diodes. Note that the light emitting element array substrate 140 is not limited to a substrate made of glass epoxy, and may be a substrate made of another material. The light emitting element array substrate 140 is inserted from the opening of the frame part 110 on the opposite side (lower side in FIG. 4) to the side where the opening 112 into which the lens array part 120 is inserted is located (upper side in FIG. 4). The lens array unit 120 is fixed with an adhesive at a position where the distance between the lower surface 120b of the lens array unit 120 and the light emitting element array 142 is L0. Here, L 0 is the focal length of the gradient index lens 121. That is, the arrangement positions of the lens array unit 120 and the light emitting element array substrate 140 are adjusted so that the lower surface 120b of the lens array unit 120 and the light emitting element array 142 are separated by a distance L0, and are fixed to the frame unit 110, respectively. Yes.

  In a state where the light emitting element array substrate 140 is fixed to the frame part 110, the gap between the light emitting element array substrate 140 and the frame part 110 is blocked in the longitudinal direction of the light emitting element array substrate 140 and the frame part 110. The sealing material 151 is arrange | positioned along. By disposing the sealing material 151, it is possible to seal the optical print head 100 from the outside so that foreign matter such as dust or toner for printer does not enter from the outside. That is, sealing is performed so that foreign matter such as dust or printer toner does not enter between the lens array unit 120 and the light emitting element array substrate 140 through a gap between the light emitting element array substrate 140 and the frame unit 110. be able to.

  Next, a method for assembling the optical print head 100 will be described. FIG. 5 is an exploded perspective view showing the assembly structure of the optical print head 100 according to the first embodiment. FIG. 6A is an enlarged perspective view showing a region C1 which is a part of the lens array portion 120 and the frame portion 110 shown in FIG. FIG. 6B is an enlarged perspective view showing a region C2 which is a part of the light emitting element array substrate 140 shown in FIG.

  An opening 112 and a first protrusion 113 are formed in the frame part 110. The opening 112 and the first protrusion 113 can be formed at the same time when the frame part 110 is die-formed by press. The first concave portion 124 of the lens array unit 120 is formed at a position corresponding to the position of the reference point T2 of the lens array unit on the side plate 123 of the lens array unit 120. The first recess 124 can be formed by router processing the outer surface of the pair of side plates 123 after the gradient index lens 121 is sandwiched between the pair of side plates 123. However, the method for forming the first recess 124 is not limited to this, and a slit structure or a recess structure that becomes the first recess 124 may be formed in advance on the material that becomes the side plate 123 by router processing. After forming the lens array portion 120, the gradient index lens 121 is sandwiched between the materials used as the side plates 123, and both ends are cut into an arbitrary length.

  Here, the reference point T1 of the light emitting element array 142 (that is, the light emitting array element) and the reference point T2 of the lens array unit 120 will be described. As shown in FIG. 5 and FIG. 6A and FIG. 6B, a predetermined point in the central portion in the longitudinal direction of the light emitting element array 142 arranged on the glass epoxy substrate 141 of the light emitting element array substrate 140 is a light emitting element. A reference point T1 in the longitudinal direction of the array 142 is used. In other words, the length from one end of the light emitting element array 142 in the longitudinal direction to a predetermined point in the central portion in the longitudinal direction is L1, and the length from the other end in the longitudinal direction of the light emitting element array 142 to the predetermined portion in the central portion in the longitudinal direction. A position where the length L1 and the length L2 are equal when the length to the point is L2 is defined as a reference point T1. In this case, an intersection of a virtual straight line t1 extending from the reference point T1 in a direction orthogonal to both the longitudinal direction and the short direction of the light emitting element array substrate 140 and the lens array unit 120 is defined as a reference point T2. That is, when the central portion in the longitudinal direction of the light emitting element array 142 disposed on the glass epoxy substrate 141 is set as the reference point T1, the lens array unit 120 and the light emitting element array substrate 140 are mounted on the frame unit 110. A position corresponding to the reference point T1 in the longitudinal direction and the short direction of the lens array unit 120 is defined as a reference point T2.

  As shown in FIG. 5 and FIG. 6A, the lens array unit 120 is inserted into the opening 112 formed in the upper surface 111 of the frame unit 110. On the other hand, the light emitting element array substrate 140 is inserted into the frame portion 110 from the side opposite to the side where the lens array portion 120 is inserted. A connector 143 disposed on one end side of the light emitting element array substrate 140 electrically connects an external power supply unit and the light emitting element array 142. When the lens array part 120 is inserted into the frame part 110, the lens array part 120 is inserted into the opening part 112 of the frame part 110 so that the first concave part 124 and the first convex part 113 are engaged. Thereby, the 1st recessed part 124 and the 1st convex part 113 engage, and the lens array part 120 and the frame part 110 are positioned in a longitudinal direction. After the lens array unit 120 is inserted into the opening 112, the gaps 130 and 131 (FIGS. 2A and 2B) formed between the side plate 123 of the lens array unit 120 and the frame unit 110 are filled with the adhesive 153. Then, the lens array unit 120 is bonded to the frame unit 110.

  However, in the longitudinal direction of the optical print head 100, it may be configured such that either or both of the gaps 130 and 131 are not formed between the side plate 123 of the lens array unit 120 and the frame unit 110. In the case where the gap 131 is not formed between the side plate 123 of the lens array unit 120 and the frame unit 110 in the longitudinal direction of the optical print head 100, the first concave portion 124 and the first convex portion 113 are not formed. Each of the first concave portion 124 and the first convex portion 113 may be formed so as to closely contact each other. When using the lens array part 120 and the frame part 110 in which the gaps 130 and 131 are not formed, the lens array part 120 is press-fitted into the frame part 110 to engage the first concave part 124 and the first convex part 113. The lens array unit 120 may be fixed to the frame unit 110. In this case, an adhesive is not always necessary, but an adhesive 153 is applied to the adjacent portion of the lens array 120 and the frame 110 so that the press-fitted lens array 120 is firmly fixed to the frame 110. May be. At this time, it is desirable to apply the adhesive 153 so as to cover a portion where the first concave portion 124 and the first convex portion 113 are engaged.

  FIG. 7 is a top view showing the optical print head 100 in a state in which the lens array unit 120 is mounted in the opening 112 of the frame unit 110. FIG. 8A is an enlarged top view showing a region D1 that is a region including the reference region A3 of the optical print head 100 shown in FIG. FIG. 8B is an enlarged top view showing a region D2 other than the reference region A3 of the optical print head 100 shown in FIG. As shown in FIG. 7, after the lens array unit 120 is inserted into the opening 112 of the frame unit 110, the lens array unit 120 is bonded using an adhesive 153 at an arbitrary position in the longitudinal direction of the frame unit 110. In the example shown in FIG. 8A, the lens array unit 120 is fixed to the frame unit 110 by filling the gap 131 (FIG. 2A) with the adhesive 153 in the reference region A3. Further, in the example shown in FIG. 8B, the lens array unit 120 is fixed to the frame unit 110 by filling the gap 130 with the adhesive 153 at a place other than the reference region A3.

  The optical print head 100 according to the first embodiment has mounting surfaces 115 on both ends in the longitudinal direction. That is, in the example shown in FIG. 7, the mounting surface 115 is provided on both ends in the longitudinal direction of the upper surface 111 of the frame portion 110. The mounting surface 115 is used when, for example, the optical print head 100 is mounted on an image forming apparatus such as a printer, and is a surface that comes into contact with a spacer 116 described later. When the optical print head 100 is used as an exposure device that exposes the surface of the photosensitive drum of a printer, a spacer 116 is interposed between the photosensitive drum and the optical print head 100 to increase the distance between the surface of the photosensitive drum and the optical print head 100. Keep constant.

  FIG. 9 is a view of the optical print head 100 mounted so as to face the photosensitive drum 408 of the printer as the image forming apparatus, in a direction perpendicular to the longitudinal direction of the optical print head. FIG. 10 is an enlarged view showing a region E near the ends in the longitudinal direction of the optical print head 100 and the photosensitive drum 408 shown in FIG. As shown in FIG. 9, the spacers 116 are respectively arranged on the surfaces of the photosensitive drums 408 at both ends in the longitudinal direction, which is the direction in which the rotation shaft 408 a of the photosensitive drum 408 extends, and the mounting surface 115 of the optical print head 100. Are abutted against the corresponding spacers 116, and the distance between the surface of the photosensitive drum 408 and the optical print head 100 is kept constant.

  As shown in FIG. 10, the height of the spacer 116 from the surface of the photosensitive drum 408 is L1, and the length from the mounting surface 115 to the surface of the lens array unit 120 is L2. L0 is the focal length of the gradient index lens 121. Accordingly, the focal length L0 is a value obtained by subtracting the length L2 from the height L1. As shown in FIG. 9, when the optical print head 100 is mounted as a means for exposing the surface of the photosensitive drum 408 of the printer, the surface of the photosensitive drum 408 is appropriately exposed by the light emitted from the lens array unit 120. Thus, the height L1 of the spacer 116 may be adjusted according to the length L2. Further, the length L2 may be adjusted according to the height L1 of the spacer 116. When adjusting the length L2, the lens array unit 120 may be instantaneously bonded to the frame unit 110 using the adhesive 153 at a position where the length L2 is appropriate. In FIG. 10, the arrangement example of the spacer 116 on one end side in the longitudinal direction of the optical print head 100 and the photosensitive drum 408 is shown, but the spacer 116 may be arranged similarly on the other end side.

  As described above, the optical print head 100 according to Embodiment 1 includes the second optical plate 100 formed on the side plate 123 of the lens array unit 120 in a state where the lens array unit 120 is fixed in the opening 112 of the frame unit 110. 1 and the first convex portion 113 formed in the opening 112 of the frame portion 110 are engaged with each other, so that an adhesive portion other than the reference region A3 (for example, in the region D2 shown in FIG. 7). The rigidity in the reference region A3 can be made higher than the rigidity in the bonding portion). Therefore, in the optical print head that does not have the engaging portion and the engaged portion, for example, as compared with a configuration in which the optical print head is fixed only by two types of adhesive and is positioned in the longitudinal direction, In the configuration, the optical print head 100 can have high rigidity against tensile stress from the adhesive portion other than the reference region A3, and the shear failure can be significantly suppressed. For this reason, the position variation due to the expansion or contraction of the lens array unit 120 caused by the change in the use environment or the position variation due to the deformation caused when the internal stress of the lens array unit 120 is relieved is set as the starting point (reference point). They can be sorted in the longitudinal direction. In addition, since the first concave portion 124 and the first convex portion 113 are formed in the lens array portion 120 and the frame portion 110, respectively, the reference point can be accurately set. Accordingly, it is possible to reduce the longitudinal displacement between the lens array unit 120 and the frame unit 110 and to reduce the relative positional deviation between the center positions of the lens array unit 120 and the semiconductor optical element 142. . Therefore, according to the semiconductor device according to the first embodiment, stable light irradiation performance can be realized regardless of changes in the use environment.

  Further, according to the configuration according to the first embodiment, since the gaps 130 and 131 are provided between the lens array unit 120 and the frame unit 110, the lens array unit 120 is press-fitted into the opening 112 of the frame unit 110. It is possible to suppress the deformation of the lens array unit 120 due to the stress generated in the case. Further, by filling the gap 131 in the reference area A3 with the adhesive 153, it is possible to obtain a rigidity higher than the rigidity in the adhesion part (for example, the adhesion part in the area D2 illustrated in FIG. 7) in a place other than the reference area A3. it can. Furthermore, when only the gap 131 in the reference area A3 is filled with the adhesive 153, the positional variation due to the expansion or contraction of the lens array unit 120 caused by the change in the use environment or the internal stress of the lens array unit 120 is alleviated. The positional variation due to the deformation that occurs can be easily distributed in the longitudinal direction starting from the reference area A3.

  In addition, the optical print head 100 according to the first embodiment has a first recess 124 as a first engaging portion in a pair of side plates 123 that are side surfaces of the lens array portion 120, and an opening of the frame portion 110. The portion 112 has a first convex portion 113 as a first engaged portion that engages with the first concave portion 124. That is, since the optical print head 100 according to the first embodiment has the reference area A3 where the lens array unit 120 and the frame unit 110 are engaged, the lens array unit is inserted when the lens array unit 120 is inserted into the frame unit 110. Positioning in the longitudinal direction of 120 becomes easy. Further, when the lens array unit 120 is fixed to the frame unit 110, the lens array unit 120 can be fixed with one type of adhesive, so that the working efficiency is improved.

Modification of the first embodiment.
In the above description, the case where the semiconductor device according to the first embodiment is an optical print head has been described, but the case where the semiconductor device is an image sensor head 160 will be described below. FIG. 11 is an external perspective view showing an external configuration of the image sensor head 160 in which the lens array unit 120 according to Embodiment 1 is arranged. The image sensor head 160 is a contact image sensor head whose reading object contacts the image sensor head 160. In the example of FIG. 11, the lens array unit 120 is not shown in FIG. 11 because it is disposed inside the image sensor head 160. The image sensor head 160 as a semiconductor device is mounted on, for example, an image scanner that is an image reading device, and is used as a device that receives reflected light from a document to be read and generates image data. The image sensor head 160 includes a cover glass 180 and a frame portion 161 that holds the cover glass 180, and the lens array portion 120 and a plurality of light receiving elements as a plurality of semiconductor optical elements are arranged inside the frame portion 161. A light receiving element array substrate 170 serving as the optical element array substrate and a light guide 181 in which a light source for irradiating a document is disposed are disposed. Here, in this specification, “a plurality of light receiving elements” is referred to as a light receiving element array (or a light receiving array element). The light receiving element array substrate 170 includes a printed wiring board 171 and a light receiving element array 172 arranged thereon. The light receiving element array 172 includes, for example, a plurality of photodiodes or a plurality of CMOS (complementary metal oxide semiconductor) image sensors, and receives reflected light from a document to be read. The frame portion 161 may be configured by using a resin material having excellent dimensional stability such as structural steel and metal such as aluminum, or liquid crystal polymer (LCP), for example.

  FIG. 12 is an enlarged perspective view showing the structure of the image sensor head 160 including a cross-sectional structure of the image sensor head 160 shown in FIG. 11 taken along line segments S12-S12. The lens array unit 120 is supported by a support unit 162 formed on the inner wall of the frame unit 161, and is fixed by an adhesive. Similarly, the light guide 181 is inserted into the frame portion 161 and fixed with an adhesive. As the material of the light guide 181, an acrylic resin or a transparent plastic such as polycarbonate is used. In a state where the lens array unit 120 and the light guide 181 are fixed inside the frame unit 161, the cover glass 180 is installed on the top of the frame unit 161 to protect the inside of the frame unit 161. The light receiving element array substrate 170 is inserted from the second opening 166 of the frame part 161 on the opposite side to the side where the lens array part 120 is inserted, and the lower surface 120b of the lens array part 120 and the light receiving element array 172 are arranged. It is fixed with an adhesive at a position where the distance between them is L3. Here, L3 is a focal length of the gradient index lens 121 of the lens array unit 120. That is, the arrangement positions of the lens array unit 120 and the light receiving element array substrate 170 are adjusted so that the lower surface 120b of the lens array unit and the light receiving element array 172 are separated by L3, and are fixed to the frame unit 161, respectively. In order to close the gap between the cover glass 180 and the frame portion 161, silicone rubber as a sealing material may be filled. Similarly, silicone rubber as a sealing material may be filled in order to close the gap between the light receiving element array substrate 170 and the frame portion 161.

  Next, a method for assembling the image sensor head 160 will be described. FIG. 13 is an exploded perspective view showing an assembly structure of the image sensor head 160 according to a modification of the first embodiment. FIG. 14A is an enlarged perspective view showing a region G1 which is a part of the lens array unit 120 and the frame unit 161 shown in FIG. FIG. 14B is an enlarged perspective view showing a region G2 which is a part of the light receiving element array substrate 170 shown in FIG.

  As shown in FIG. 13, the image sensor head 160 can store a lens array unit 120, a light receiving element array substrate 170 as an optical element array substrate, and a light guide 181 inside a frame unit 161. As shown in FIG. 13 and FIGS. 14A and 14B, the light receiving element array substrate 170 includes a pair of long sides whose outer edges on the upper surface extend in the longitudinal direction and a pair of short sides that extend in the short direction. A glass epoxy substrate 171 (printed wiring substrate 171) formed to have a substantially rectangular shape. On this glass epoxy substrate 171, a plurality of light receiving elements as a plurality of semiconductor optical elements that receive light are arranged in the longitudinal direction. Specifically, the plurality of light receiving elements each have an optical axis, and are arranged in parallel in the longitudinal direction of the light receiving element array substrate 170 so that the optical axes thereof are substantially parallel to each other. These optical axes are, for example, optical axes in a direction orthogonal to both the longitudinal direction and the short direction.

  Here, the central portion in the longitudinal direction of the light receiving element array 172 arranged on the glass epoxy substrate 171 of the light receiving element array substrate 170 is defined as a reference point T3 of the light receiving element array. In other words, the length from one end in the longitudinal direction of the light receiving element array 172 arranged in the longitudinal direction to a predetermined point in the central portion in the longitudinal direction is L4, and the length from the other end in the longitudinal direction of the light receiving element array 172 is long. A position where the length L4 and the length L5 are equal when the length to a predetermined point in the center of the direction is L5 is defined as a reference point T3 of the light receiving element array. In this case, an intersection of a virtual straight line t2 extending from the reference point T3 of the light receiving element array in a direction orthogonal to both the longitudinal direction and the short direction of the light receiving element array substrate 170 and the lens array unit 120 is the lens array unit. The reference point T4. That is, when the center portion in the longitudinal direction of the light receiving element array 172 arranged on the glass epoxy substrate 171 is set as the reference point T3 of the light receiving element array, the lens array unit 120 and the light receiving element array substrate 170 are attached to the frame unit 161. In this state, a position corresponding to the reference point T3 of the light receiving element array in the longitudinal direction and the short direction of the lens array unit 120 is set as a reference point T4 of the lens array unit.

  As shown in FIG. 14A, the lens array unit 120 has a side plate 123 on the side surface, and the first engagement unit is located at a position corresponding to the position of the reference point T4 of the lens array unit on the side plate 123. The first recess 124 is formed. The first concave portion 124 has a concave structure, and is formed as a pair in the lateral direction of the lens array portion 120 with the gradient index lens 121 arranged in the longitudinal direction interposed therebetween. However, the first recesses 124 are not limited to the configuration formed as a pair, and may be formed in any one of the short sides of the lens array unit 120. A first convex portion 163 as a first engaged portion having a convex structure corresponding to the shape of the first concave portion 124 is formed on the inner wall of the frame portion 161.

  As shown in FIGS. 13 and 14A, the lens array unit 120 is inserted into the frame unit 161 from the upper surface side. At this time, the lens array portion 120 is inserted into the inside from the first opening 164 at the upper portion of the frame portion 161 so that the first concave portion 124 and the first convex portion 163 are engaged with each other. As a result, the first concave portion 124 and the first convex portion 163 are engaged, and the relative position in the longitudinal direction between the lens array portion 120 and the frame portion 161 is determined. After the lens array unit 120 is inserted into the frame unit 161, the lens array is formed using an adhesive so that the lens array unit 120 is supported by the support units 162 formed on the inner walls of the frame unit 161 located on both sides of the lens array unit 120. The part 120 is bonded to the frame part 161. The light guide 181 may be inserted into the frame portion 161 and bonded to the inside of the frame portion 161 using an adhesive.

  In addition, the lens array unit 120 may be fitted into the frame unit 161 by press-fitting so that no gap is generated between the first concave portion 124 of the lens array unit 120 and the first convex unit 163 of the frame unit 161. it can. In addition, the lens array portion 120 and the frame portion 161 are respectively formed so that a gap larger than 0 μm and smaller than 500 μm is formed between the first concave portion 124 and the first convex portion 163, and an adhesive is used. The lens array unit 120 can also be bonded to the frame unit 161.

  The light receiving element array substrate 170 is inserted from the second opening 166 of the frame part 161 on the side opposite to the side where the lens array part 120 is inserted, and between the lower surface 120 b of the lens array part 120 and the light receiving element array 172. Is fixed with an adhesive at a position where the distance becomes L3. Finally, the first opening 164 of the frame part 161 located on the side opposite to the light receiving element array substrate 170 is covered with the cover glass 180, and the cover glass 180 is fixed to the frame part 161. In this way, the first opening 164 of the frame part 161 is covered with the cover glass 180, and the second opening 166 of the frame part 161 is covered with the light receiving element array substrate 170.

  As described above, the image sensor head 160 according to the modification of the first embodiment has the first sensor plate 160 formed on the side plate 123 of the lens array unit 120 in a state where the lens array unit 120 is fitted to the frame unit 161. Since the first concave portion 124 and the first convex portion 163 formed in the frame portion 161 are engaged, the rigidity in the reference region A3 can be increased. For this reason, the position variation due to the expansion or contraction of the lens array unit 120 caused by the change in the use environment or the position variation due to the deformation caused when the internal stress of the lens array unit 120 is relieved is set as the starting point (reference point). They can be sorted in the longitudinal direction. Further, since the first concave portion 124 and the first convex portion 163 are formed in the lens array portion 120 and the frame portion 161, respectively, the reference point can be accurately set. Therefore, the lens array unit 120 and the frame unit 161 can be prevented from greatly deviating from each other, and the relative positional shift between the center positions of the lens array unit 120 and the semiconductor optical element 172 can be reduced. Therefore, according to the semiconductor device according to the modification of the first embodiment, stable light irradiation performance or light reception performance can be realized regardless of changes in the use environment.

  Further, according to the configuration according to the modification of the first embodiment, since the gaps 130 and 131 are provided between the lens array unit 120 and the frame unit 161, the lens array unit 120 is press-fitted into the frame unit 161. The deformation of the lens array unit 120 due to the stress generated when the two are fitted together can be suppressed. Further, by filling the gap 131 in the reference area A3 with the adhesive 153, it is possible to obtain a rigidity higher than the rigidity in the adhesion part (for example, the adhesion part in the area D2 illustrated in FIG. 7) in a place other than the reference area A3. it can. Furthermore, by filling only the gap 131 in the reference region A3 with the adhesive, the positional variation due to the expansion or contraction of the lens array unit 120 caused by the change in the use environment or the internal stress of the lens array unit 120 is alleviated. Positional variation due to deformation can be easily distributed in the longitudinal direction starting from the reference area A3.

  In addition, the image sensor head 160 according to the modification of the first embodiment has a first recess 124 as an engaging portion in the side plate 123 that is the side surface of the lens array portion 120, and the first recess in the frame portion 161. The first convex portion 163 is provided as an engaged portion that engages with 124. That is, since the lens array part 120 and the frame part 161 have the reference region A3 to be engaged, when the lens array part 120 is inserted into the frame part 161, the lens array part 120 can be easily positioned in the longitudinal direction. In addition, when the lens array unit 120 is fixed to the frame unit 161, the lens array unit 120 can be fixed with one kind of adhesive, so that work efficiency is improved.

Embodiment 2. FIG.
FIGS. 15A and 15B are a top view and a bottom view of an optical print head 200 according to Embodiment 2 of the present invention. The optical print head 200 according to the second embodiment includes a second recess as a second engaging portion for engaging the light emitting element array substrate 140 and the frame portion 110 according to the first embodiment, and a second Unlike the optical print head 100 according to the first embodiment, the other configuration is the same as that of the optical print head 100 according to the first embodiment in that it further includes a second convex portion as an engaged portion. is there.

  An optical print head 200 as a semiconductor device shown in FIGS. 15A and 15B is a plurality of semiconductor optical elements arranged in the longitudinal direction and each having a plurality of semiconductor optics each having an optical axis substantially parallel to each other. An optical element array substrate 240 having elements, a lens array unit 220 having a plurality of lens elements arranged in the longitudinal direction and having a plurality of lens elements each having a substantially parallel central axis, and a plurality of semiconductor optical elements And a frame portion 210 that holds the optical element array substrate 240 and the lens array portion 220 so that the plurality of lens elements face each other. The lens array unit 220 includes a first engagement unit disposed at a position facing the frame unit 210. The frame part 210 has a first engaged part that is engaged by the first engaging part and determines the position of the lens array part 220 in the longitudinal direction with respect to the frame part 210. Furthermore, the optical element array substrate 240 has a second engagement portion disposed at a position facing the frame portion 210, and the frame portion 210 is engaged by the second engagement portion, so that the frame portion 210 is engaged. A second engaged portion that determines the position of the optical element array substrate 240 in the longitudinal direction.

  The lens array section 220 is formed so that the outer edge on the upper surface has a substantially rectangular shape including a pair of long sides in the longitudinal direction and a pair of short sides in the short direction. The upper surface of the frame portion 210 is formed so that the outer edge is a substantially rectangular shape having a pair of long sides in the longitudinal direction and a pair of short sides in the short direction, and the inner edge (inner wall) is the lens array portion. A slit-shaped opening 212 is formed so as to have substantially the same shape as the outer edge of 220. Since the shape of the opening 212 is formed so as to be substantially the same as the shape of the outer edge of the lens array unit 220, the lens array unit 220 is inserted and held in the opening 212. Further, in the first reference region H3, in the optical print head 200, the first engaging portion disposed in the lens array portion 220 and the first engaged portion disposed in the frame portion 210 are engaged. It is an area including the part to be. Further, the second reference region J3 includes a second engagement portion disposed on the light emitting element array substrate 240 as the optical element array substrate in the optical print head 200 and a second covered portion disposed on the frame portion 210. It is an area including a portion that engages with the engaging portion. The frame part 210 is configured using, for example, a metal such as structural steel or aluminum, or a resin material having excellent dimensional stability such as a liquid crystal polymer (LCP).

  Holes as positioning portions 214 are formed on both ends of the frame portion 210 in the longitudinal direction. The positioning unit 214 can be used for positioning when the optical print head 200 is mounted on an image forming apparatus such as a printer, for example. FIG. 15A shows an example in which holes are formed at both ends of the frame unit 210 as the positioning unit 214. However, the positioning unit 214 is not limited to the hole, and, for example, a convex structure is formed as the positioning unit 214. Then, positioning may be performed by engaging with a hole-like structure formed in a part facing the frame portion 210. The positioning part 214 may be formed only on one end side in the longitudinal direction of the frame part 210. A connector 246 arranged on one end side of the optical element array substrate 240 electrically connects an external power supply unit and a light emitting element array 242 described later.

  FIG. 16A is an enlarged top view showing a region H1 which is a part of the top surface of the optical print head 200 shown in FIG. FIG. 16B is an enlarged top view showing a region H2 which is a part of the top surface of the optical print head 200 shown in FIG. As shown in FIG. 16A, in the lens array unit 220, a plurality of gradient index lenses 221 as lens elements are arranged in the longitudinal direction, and both side surfaces of the arranged gradient index lenses 221 are arranged on the side plate 223. Is sandwiched between. Specifically, the plurality of gradient index lenses 221 each have a central axis, and are arranged in parallel in the longitudinal direction of the lens array unit 220 such that the central axes are substantially parallel to each other. When the gradient index lens 221 is sandwiched between the side plates 223, an adhesive 222 is applied to the gap generated between the gradient index lenses 221 and the gap generated between the gradient index lens 221 and the side plate 223. By filling, the gradient index lens 221 is fixed inside the side plate 223. As the gradient index lens 221, for example, a lens made of glass or acrylic can be used. The side plate 223 may be made of fiber reinforced plastic, phenol resin, epoxy resin, or ABS resin. In addition, the adhesive 222 may be made of epoxy, acrylic, or urethane as a main material.

  As shown in FIG. 16A, the side plate 223, which is the side surface in the region H1 (FIG. 15A) in the substantially central portion of the lens array portion 220 in the longitudinal direction, has a first engaging portion as a first engaging portion. The recess 224 is formed. The first concave portion 224 has a concave structure and is formed in a pair in the lateral direction of the lens array portion 220. However, the first concave portion 224 is not limited to the configuration formed as a pair, and may be formed in either one of the short sides of the lens array unit 220. Note that the position where the first recess 224 is formed is not limited to the center in the longitudinal direction of the lens array unit 220, and may be in the vicinity of the center in the longitudinal direction of the lens array unit 220.

  A first convex portion 213 serving as a first engaged portion having a convex structure corresponding to the shape of the first concave portion 224 is provided at a substantially central portion in the longitudinal direction of the frame portion 210. It is formed corresponding to the position where 224 is formed. As a result, the first convex portion 213 and the first concave portion 224 are engaged, and the lens array portion 220 and the frame portion 210 are positioned. The position where the first convex portion 213 is formed is not limited to the center in the longitudinal direction of the frame portion 210, but is desirably near the center in the longitudinal direction of the frame portion 210.

  When the rigidity of the lens array unit 220 is low, the lens array unit 220 is deformed by a stress generated when the lens array unit 220 is press-fitted into the frame unit 210 and fitted into the frame unit 210, and the center of the lens array unit 220 and the center of a light emitting element array 242 to be described later. May shift. Therefore, as shown in FIGS. 16A and 16B, a gap for providing a predetermined play is provided between the lens array unit 220 and the frame unit 210 according to the second embodiment. Yes. Specifically, gaps 230 and 231 are formed between the side plate 223 of the lens array unit 220 and the frame unit 210. The gap 231 is formed between the first concave portion 224 and the first convex portion 213. In other words, the first concave portion 224 and the first convex portion 213 are formed such that a gap 231 is formed between the first concave portion 224 and the first convex portion 213 in the longitudinal direction of the optical print head 200. Are formed in each of the lens array unit 220 and the frame unit 210. The width in the short direction of the gap 231 is preferably narrower than the width in the short direction of the gap 230 formed at a position other than between the first recess 224 and the first projection 213.

  As for the air gap, the air gap 231 may be formed only in the first reference region H3. The width of the gap 231 in the short direction is preferably larger than 0 μm and smaller than 500 μm. As will be described later, the lens array part 220 and the frame part 210 are fixed to each other by filling the gaps 230 and 231 with the adhesive 225. By filling the gaps 230 and 231 with the adhesive 225, the rigidity can be increased at the bonded portion between the lens array portion 220 and the frame portion 210. Further, only the gap 230 or the gap 231 in the reference area H3 may be filled with the adhesive 225. As the adhesive 225, for example, any one type of ultraviolet curable adhesive among the ultraviolet curable adhesive mainly composed of epoxy, acrylic, urethane, or the like can be used for bonding.

  FIG. 17A is an enlarged bottom view showing a region J1 which is a part of the bottom surface of the optical print head 200 shown in FIG. FIG. 17B is an enlarged bottom view showing a region J2 which is a part of the bottom surface of the optical print head 200 shown in FIG. As shown in FIGS. 17A and 17B, the light emitting element array substrate 240 as an optical element array substrate is inserted and held inside the frame portion 210. As shown in FIG. 17A, a second recess 244 serving as a second engaging portion is formed on the side surface of the region J1 (FIG. 15B) in the substantially central portion of the light emitting element array substrate 240 in the longitudinal direction. Is formed. The second concave portions 244 have a concave structure and are formed in pairs in the short direction of the light emitting element array substrate 240. However, the second recesses 244 are not limited to the configuration formed as a pair, and may be formed in any one of the short sides of the light emitting element array substrate 240. Note that the position where the second concave portion 244 is formed is not limited to the center in the longitudinal direction of the light emitting element array substrate 240, and may be in the vicinity of the center in the longitudinal direction of the light emitting element array substrate 240.

  A second convex portion 216 serving as a second engaged portion having a convex structure corresponding to the shape of the second concave portion 244 is formed on the inner wall at a substantially central portion in the longitudinal direction of the frame portion 210. Are formed corresponding to the positions where the recesses 244 are formed. Thereby, the 2nd convex part 216 and the 2nd recessed part 244 engage, and the light emitting element array substrate 240 and the frame part 210 are positioned in a longitudinal direction. Note that the position where the second convex portion 216 is formed is not limited to the center in the longitudinal direction of the frame portion 210, and may be in the vicinity of the center in the longitudinal direction of the frame portion 210.

  When the rigidity of the light emitting element array substrate 240 is low, the light emitting element array substrate 240 is deformed due to stress generated when the light emitting element array substrate 240 is press-fitted into the frame portion 210 to be fitted, and the center of the lens array portion 220 and a light emitting element array 242 to be described later. May be misaligned. Therefore, as shown in FIGS. 17A and 17B, a gap is provided between the light emitting element array substrate 240 and the frame portion 210 according to Embodiment 2 to provide a predetermined play. ing. Specifically, gaps 250 and 251 are formed between the light emitting element array substrate 240 and the frame part 210. The gap 251 is formed between the second concave portion 244 and the second convex portion 216. In other words, the second concave portion 244 and the second convex portion 216 are formed such that a gap 251 is formed between the second concave portion 244 and the second convex portion 216 in the longitudinal direction of the optical print head 200. Are formed on each of the light emitting element array substrate 240 and the frame portion 210. The width in the short direction of the gap 251 is preferably narrower than the width in the short direction of the gap 250 formed at a position other than between the second concave portion 244 and the second convex portion 216.

  The air gap 251 may be formed only in the second reference region J3. The width of the gap 251 in the short direction is desirably larger than 0 μm and smaller than 500 μm. As will be described later, the light emitting element array substrate 240 and the frame portion 210 are fixed to each other by filling the gaps 250 and 251 with the adhesive 225. By filling the gaps 250 and 251 with the adhesive 225, the rigidity can be increased at the bonded portion between the light emitting element array substrate 240 and the frame portion 210. Alternatively, only the gap 250 or the gap 251 in the reference area J3 may be filled with the adhesive 225.

  Next, a method for assembling the optical print head 200 will be described. FIG. 18 is an exploded perspective view showing an assembly structure of the optical print head 200 according to the second embodiment. In FIG. 18, the second convex portion 216 hidden inside the frame portion 210 is indicated by a dotted line. The opening part 212 is formed in the frame part 210, the lens array part 220 is inserted into the opening part 212 from the upper surface side of the frame part 210 where the opening part 212 is formed, and the side where the lens array part 220 is inserted. The light emitting element array substrate 240 is inserted into the frame part 210 from the opposite side.

  As shown in FIG. 18, the light emitting element array substrate 240 has a glass epoxy substrate 241 formed so that the outer edge on the upper surface has a substantially rectangular shape composed of a longitudinal direction and a short direction. On the glass epoxy substrate 241, a plurality of light-emitting elements as a plurality of semiconductor optical elements that irradiate light are arranged in the longitudinal direction. Specifically, the plurality of light emitting elements each have an optical axis, and are arranged in parallel in the longitudinal direction of the light emitting element array substrate 240 so that the optical axes thereof are substantially parallel to each other. That is, the light emitting element array 242 is arranged in the longitudinal direction on the light emitting element array substrate 240. Note that the light emitting element array 242 includes, for example, a plurality of light emitting diodes.

  Here, a predetermined point at the center in the longitudinal direction of the light emitting element array 242 arranged on the light emitting element array substrate 240 is set as a reference point T5 of the light emitting element array. In this case, an intersection of a virtual straight line t3 orthogonal to both the longitudinal direction and the short direction of the light emitting element array substrate 240 from the reference point T5 of the light emitting element array and the lens array part 220 is defined as a reference point T6 of the lens array part. And That is, when the central portion in the longitudinal direction of the light emitting element array 242 disposed on the glass epoxy substrate 241 is set as the reference point T5 of the light emitting element array, the lens array unit 220 and the light emitting element array substrate 240 are attached to the frame unit 210. In this state, the position corresponding to the reference point T5 of the light emitting element array in the longitudinal direction and the short direction of the lens array unit 220 is set as a reference point T6 of the lens array unit.

  As shown in FIG. 18, the first recess 224 is formed at a position corresponding to the position of the reference point T <b> 6 of the lens array unit on the side plate 223 of the lens array unit 220. The first concave portion 224 is formed by router processing the side plate 223 after the gradient index lens 221 is sandwiched between the side plates 223. Moreover, the 2nd recessed part 244 is formed collectively, when making small pieces from a fixed-size board material. However, the formation method of the 1st recessed part 224 and the 2nd recessed part 244 is not restricted to these. For the first recess 224, a slit structure or a recess structure that becomes the first recess 224 may be formed in the material that becomes the side plate 223 in advance by router processing. After the first recess 224 is formed, the side plate 223 and The lens array unit 220 can also be manufactured by sandwiching the gradient index lens 221 with a material and cutting both ends into an arbitrary length. The first convex portion 213 and the second convex portion 216 may be formed by mold formation when the frame portion 210 is formed of a resin such as a liquid crystal polymer. Further, when aluminum is cut out when forming the frame portion 210, the first convex portion 213 and the second convex portion 216 may be formed by cutting out so as to form a convex structure. Furthermore, when the structural steel is manufactured by pressing the frame portion 210, a method of forming a convex structure by extruding by pressing or a method of forming a convex structure by bending can be employed. .

  When the lens array unit 220 is inserted into the frame unit 210, the lens array unit 220 is inserted into the slit-shaped opening 212 of the frame unit 210 so that the first recess 224 and the first projection 213 are engaged. . After the lens array unit 220 is inserted into the opening 212, the lens array unit 220 is bonded to the frame unit 210 using an adhesive 225.

  The optical print head 200 according to Embodiment 2 has a second concave portion 244 in the light emitting element array substrate 240 which is a constituent element thereof, and has a second convex portion 216 in the frame portion 210. The second recess 244 is formed on the side surface of the light emitting element array substrate 240 corresponding to the position of the reference point T5 of the light emitting element array. When the light emitting element array substrate 240 is inserted into the frame portion 210, the light emitting element array substrate 240 is inserted into the frame portion 210 so that the second concave portion 244 and the second convex portion 216 are engaged with each other. After the light emitting element array substrate 240 is inserted into the frame portion 210, the light emitting element array substrate 240 is bonded to the frame portion 210 using an adhesive 225.

  In addition, in the longitudinal direction of the optical print head 200, it may be configured such that either or both of the gaps 230 and 231 are not formed between the side plate 223 of the lens array unit 220 and the frame unit 210. Similarly, in the longitudinal direction of the optical print head 200, either or both of the gaps 250 and 251 may not be formed between the light emitting element array substrate 240 and the frame part 210. In the case where the gap 231 is not formed between the side plate 223 of the lens array unit 220 and the frame unit 210 in the longitudinal direction of the optical print head 200, the first concave portion 224 and the first convex portion 213 are formed. Each of the first concave portion 224 and the first convex portion 213 may be formed so as to closely contact each other. Similarly, when the gap 251 is not formed between the light emitting element array substrate 240 and the frame portion 210 in the longitudinal direction of the optical print head 200, the second concave portion 244, the second convex portion 216, and the like. Each of the second concave portion 244 and the second convex portion 216 may be formed so that they are in close contact with each other.

  When using the lens array part 220 and the frame part 210 in which the gaps 230 and 231 are not formed, the lens array part 220 is press-fitted into the frame part 210 to engage the first concave part 224 and the first convex part 213. The lens array unit 220 may be fixed to the frame unit 210. Similarly, in the case of using the light emitting element array substrate 240 and the frame portion 210 in which the gaps 250 and 251 are not formed, the light emitting element array substrate 240 is press-fitted into the frame portion 210 and the second concave portion 244 and the second convex portion. 216 may be engaged to fix the light emitting element array substrate 240 to the frame portion 210. Further, the lens array part 220 or the light emitting element array substrate 240 that is press-fitted without providing a gap is firmly fixed to the frame part 210, or the adjacent part of the lens array part 220 and the frame part 210, or the light emitting element array. An adhesive 225 may be applied to an adjacent portion between the substrate 240 and the frame portion 210. At this time, bonding is performed so as to cover a portion where the first concave portion 224 and the first convex portion 213 are engaged or a portion where the second concave portion 244 and the second convex portion 216 are engaged. It is desirable to apply agent 225.

  FIG. 19A is a top view showing the optical print head 200 in a state where the lens array unit 220 is mounted on the frame unit 210. FIG. 19B is a bottom view showing the optical print head 200 with the light emitting element array substrate 240 mounted on the frame portion 210. FIG. 20A is an enlarged top view showing a region K1 which is a part of the top surface of the optical print head 200 shown in FIG. FIG. 20B is an enlarged top view showing a region K2 which is a part of the top surface of the optical print head 200 shown in FIG. FIG. 21A is an enlarged bottom view showing a region M1 which is a part of the bottom surface of the optical print head shown in FIG. FIG. 21B is an enlarged bottom view showing a region M2 which is a part of the bottom surface of the optical print head shown in FIG.

  As shown in FIGS. 19A and 19B, the lens array unit 220 and the light emitting element array substrate 240 are inserted into the opening 212 of the frame unit 210 and then arbitrarily positioned in the longitudinal direction of the frame unit 210. It is bonded using an adhesive. In the example shown in FIG. 20A, the adhesive 225 is filled in the gap 231 in the first reference region K3 in which the first concave portion 224 and the first convex portion 213 are engaged with each other to form a lens array. The part 220 is fixed to the frame part 210. Further, in the example shown in FIG. 20B, a location other than the location where the first concave portion 224 and the first convex portion 213 are engaged with each other, that is, an arbitrary location other than the first reference region K3. At a location, the gap 230 is filled with an adhesive 225 to fix the lens array unit 220 to the frame unit 210.

  Similarly, in the example shown in FIG. 21A, the adhesive 245 is filled into the gap 251 in the second reference region M3 where the second concave portion 244 and the second convex portion 216 are engaged with each other. Thus, the light emitting element array substrate 240 is fixed to the frame portion 210. Further, in the example shown in FIG. 21B, a location other than the location where the second concave portion 244 and the second convex portion 216 are engaged with each other, that is, an arbitrary location other than the second reference region M3. The light emitting element array substrate 240 is fixed to the frame portion 210 by filling the gap 250 with the adhesive 245 at the location. As the adhesive 245, for example, any one kind of ultraviolet curable adhesive among the ultraviolet curable adhesive mainly composed of epoxy, acrylic, urethane, or the like can be used for adhesion.

  The configuration described as the second embodiment is not limited to the example applied only to the optical print head 200, and can be applied to a contact image sensor head as an image sensor head as in the first embodiment. A contact image sensor head to which the configuration described as the second embodiment is applied is referred to as an image sensor head 260.

  As described above, the optical print head 200 according to the second embodiment has the first recess formed in the side plate 223 of the lens array unit 220 in a state where the lens array unit 220 is fitted to the frame unit 210. 224 and the first convex portion 213 formed on the frame portion 210 are engaged with each other, so that an adhesive portion other than the first reference region K3 (for example, an adhesive portion in the region K2 described in FIG. 19A) The rigidity in the first reference region K3 can be made higher than the rigidity in). Further, in a state where the light emitting element array substrate 240 is fitted to the frame portion 210, the second concave portion 244 formed in the light emitting element array substrate 240 and the second convex portion 216 formed in the frame portion 210 are engaged. Therefore, the rigidity in the second reference region M3 can be made higher than the rigidity in the adhesive portion other than the second reference region M3 (for example, the adhesive portion in the region M2 shown in FIG. 19B). it can. Therefore, in the configuration according to the second embodiment, the optical print head 200 can be provided with high rigidity against the tensile stress from the adhesive portion other than the first and second reference regions K3 and M3, and the shear failure occurs. This can be greatly suppressed. Therefore, position variation due to expansion or contraction of the lens array unit 220 or the light emitting element array substrate 240 caused by a change in the use environment or deformation caused when the internal stress of the lens array unit 220 or the light emitting element array substrate 240 is relaxed. The fluctuation can be distributed in the longitudinal direction starting from the first and second reference regions K3 and M3 (reference point). In addition, a first concave portion 224 and a first convex portion 213 are formed in the lens array portion 220 and the frame portion 210, respectively. Further, a second concave portion 244 and a second convex portion are formed in the light emitting element array substrate 240 and the frame portion 210, respectively. Since the portions 216 are formed, the reference point can be accurately set. Therefore, the lens array unit 220 and the frame unit 210, and the light emitting element array substrate 240 and the frame unit 210 are reduced from being greatly displaced from each other, and the relative positions of the center positions of the lens array unit 220 and the light emitting element array 242 are reduced. The deviation of the relationship can be reduced. Therefore, according to the configuration according to the second embodiment, the displacement of the relative positional relationship between the center positions of the lens array unit 220 and the light emitting element array 242 is further reduced as compared with the configuration according to the first embodiment. be able to. Similarly, a shift in the relative positional relationship between the center positions of the lens array unit 220 and the light receiving element array (semiconductor optical element) in the image sensor head 260 to which the configuration according to the second embodiment is applied can be reduced. .

  According to the configuration according to the second embodiment, the gaps 230 and 231 are provided between the lens array unit 220 and the frame part 210, and the gaps 250 and 251 are further provided between the light emitting element array substrate 240 and the frame part 210. Therefore, the deformation of the lens array unit 220 and the light emitting element array substrate 240 due to stress generated when the lens array unit 220 and the light emitting element array substrate 240 are press-fitted and fitted into the frame unit 210, respectively, is suppressed. Can do. In addition, the gaps 231 and 251 in the first reference region K3 and the second reference region M3 are filled with the adhesives 225 and 245, thereby bonding at locations other than the first reference region K3 and the second reference region M3. The rigidity higher than the rigidity in the part (for example, the adhesion part in the regions K2 and M2 described in FIGS. 19A and 19B) can be obtained. Furthermore, by filling only the gaps 231 and 251 in the first reference region K3 and the second reference region M3 with the adhesives 225 and 245, the lens array unit 220 and the light emitting element array substrate 240 that are generated due to a change in the use environment. Position variation due to expansion or contraction or position variation due to deformation that occurs when the internal stress of the lens array unit 220 and the light emitting element array substrate 240 is relaxed starts from the first reference region K3 and the second reference region M3, respectively. As shown in FIG.

  In the optical print head 200 according to the second embodiment, the first reference region K3 in which the lens array unit 220 and the frame unit 210 are engaged, and the second reference region K3 in which the light emitting element array substrate 240 and the frame unit 210 are engaged. Therefore, when the lens array unit 220 and the light emitting element array substrate 240 are inserted into the frame unit 210, the lens array unit 220 and the light emitting element array substrate 240 can be easily positioned in the longitudinal direction. In addition, when the lens array unit 220 and the light emitting element array substrate 240 are fixed to the frame unit 210, the working efficiency is improved because the lens array unit 220 and the light emitting element array substrate 240 can be fixed with one type of adhesive. As described above, according to the semiconductor device according to the second embodiment, stable light irradiation performance can be realized regardless of changes in the use environment.

Modified example of the second embodiment.
FIG. 22 is a diagram illustrating a modification of the second engaging portion and the second engaged portion in the second reference region of the optical print head 300 according to the second embodiment. An optical print head 300 shown in FIG. 22 includes an optical element array substrate 340 having a plurality of semiconductor optical elements arranged in the longitudinal direction and each having a plurality of semiconductor optical elements having optical axes substantially parallel to each other. A plurality of lens elements arranged in a direction and having a plurality of lens elements each having a substantially parallel central axis, and the plurality of semiconductor optical elements and the plurality of lens elements face each other. The optical element array substrate 340 and the frame array 310 which is a holding member for holding the lens array section 320 are provided.

  The light emitting element array substrate 340 as an optical element array substrate is formed so that the outer edge on the upper surface has a substantially rectangular shape including a pair of long sides extending in the longitudinal direction and a pair of short sides extending in the short direction. A glass epoxy substrate 341 (printed wiring substrate 341) is included. On the glass epoxy substrate 341, a plurality of light emitting elements as a plurality of semiconductor optical elements for irradiating light are arranged in the longitudinal direction. Specifically, the plurality of light emitting elements each have an optical axis, and are arranged in parallel in the longitudinal direction of the light emitting element array substrate 340 so that the optical axes thereof are substantially parallel to each other. That is, the light emitting element array 342 is arranged in the longitudinal direction on the light emitting element array substrate 340. The light emitting element array 342 is composed of, for example, a plurality of light emitting diodes. These optical axes are, for example, optical axes in a direction orthogonal to both the longitudinal direction and the short direction.

  The lens array unit 320 includes a first concave portion 324 as a first engagement portion disposed at a position facing the frame unit 310 in the slit-shaped opening 312 of the frame unit 310. The frame part 310 is engaged by a first recess 324 as a first engaging part, and serves as a first engaged part that determines the position of the lens array part 320 in the longitudinal direction with respect to the frame part 310. It has the 1st convex part 313. FIG.

  The optical print head 300 shown in FIG. 22 has the second convex portion 343 of the light emitting element array substrate 340 as the second engaging portion, and the second of the frame portion 310 as the second engaged portion. The optical print head 200 is different from the optical print head 200 shown in FIG.

  As shown in FIG. 18, when a convex structure (second convex portion 216) is formed on the frame portion 210 of the optical print head 200, when a method of pressing structural steel is employed, the convex structure is highly accurate. Is relatively difficult to form. Therefore, in the example shown in FIG. 22, the second convex portion 343 as the second engaging portion having the convex structure is formed on the light emitting element array substrate 340 as the optical element array substrate of the optical print head 300, and the frame A second concave portion (slit portion) 314 is formed in the portion 310 as a second engaged portion that engages with the second convex portion 343. The second recess 314 was cut out in the shape of a long groove in the direction orthogonal to the longitudinal direction (vertical direction in FIG. 22) on the side surface of the frame portion 310 facing the second convex portion 343 of the light emitting element array substrate 340. Has a slit structure.

  Similar to the configuration of the optical print head 200 shown in FIG. 18, it is desirable to provide a gap for giving a predetermined play between the light emitting element array substrate 340 and the frame portion 310 shown in FIG. 22. Specifically, a gap is formed between the light emitting element array substrate 340 and the frame portion 310. By filling the gap between the light emitting element array substrate 340 and the frame part 310 with the adhesive 225, the light emitting element array substrate 340 and the frame part 310 can be fixed. Note that, in the gap between the light emitting element array substrate 340 and the frame portion 310, the adhesive 245 is formed in the gap between the second convex portion 343 and the second concave portion 314 formed in the second reference region. It is good also as a structure which is filled and does not use an adhesive agent in another area | region. The width of the gap between the second convex part 343 and the second concave part 314 in the short direction is preferably larger than 0 μm and smaller than 500 μm. Alternatively, a structure may be employed in which a gap is not provided between the light emitting element array substrate 340 and the frame portion 310, and the light emitting element array substrate 340 is press-fitted into and fitted into the frame portion 310. The second convex portion 343 formed on the light emitting element array substrate 340 can be formed together by router processing when the light emitting element array substrate 340 is made into small pieces from the standard plate material. On the other hand, the 2nd recessed part 314 which is the slit structure formed in the frame part 310 can be formed collectively in the case of external punching of structural steel by press work. The configuration as a modified example shown in FIG. 22 is not limited to the example applied to the optical print head, and can also be applied to the image sensor head shown in the description of the first embodiment.

Embodiment 3 FIG.
FIG. 23 is a diagram schematically showing the structure of an LED printer 400 as an image forming apparatus according to the third embodiment. The LED printer 400 is a printer to which any one of the optical print heads 100, 200, and 300 is applied as a light source of an exposure apparatus.

  As shown in FIG. 23, the LED printer 400 forms a black-and-white or color image by an electrophotographic method using yellow (Y), magenta (M), cyan (C), and black (K) developers. To do. The LED printer 400 includes four process units 402Y, 402M, 402C, and 402K corresponding to the respective colors of yellow (Y), magenta (M), cyan (C), and black (K). Each process unit 402Y, 402M, 402C, 402K is arranged along a conveyance path 406 of a recording medium 404 such as paper. Each process unit 402Y, 402M, 402C, 402K includes a photosensitive drum 408 as an image carrier, a charging device 410 arranged around the photosensitive drum 408 to charge the surface of the photosensitive drum 408, and a charged photosensitive drum. The exposure apparatus 412 forms an electrostatic latent image by irradiating the surface 408 with light corresponding to image data input from the outside. The light source of the exposure apparatus 412 can be any of the optical print heads 100, 200, and 300 described in the first and second embodiments.

  Each of the process units 402Y, 402M, 402C, and 402K removes the toner remaining on the surface of the photosensitive drum 408 and the developing device 414 that supplies toner as a developer to the surface of the photosensitive drum 408 on which the electrostatic latent image is formed. And a cleaning device 416. The photosensitive drum 408 is rotated in the direction of the arrow by a drive mechanism including a drive source and a gear. The LED printer 400 also includes a paper cassette 418 that stores a recording medium 404 such as paper, and a hopping roller 420 for separating and transporting the recording media 404 one by one. On the downstream side of the hopping roller 420 in the conveyance direction of the recording medium 404, the skew is corrected by sandwiching the recording medium 404 together with the pinch rollers 422a and 422b and the pinch rollers 422a and 422b, and the process units 402Y, 402M, 402C, and 402K are arranged. Registration rollers 424a and 424b are provided. The hopping roller 420 and the registration rollers 424a and 424b rotate in conjunction with driving sources such as a motor and a gear.

  The LED printer 400 further includes a transfer roller 426 disposed to face the process units 402Y, 402M, 402C, and 402K. The transfer roller 426 is made of semiconductive rubber or the like, and is disposed to face the photosensitive drum 408 of each process unit. The LED printer 400 includes a fixing device 434, discharge rollers 428a, 428b, 430a, 430b, and a stacker 432. The potential of the photosensitive drum 408 and the potential of the transfer roller 426 are set so that the toner image formed on the photosensitive drum 408 is transferred onto the recording medium 404. The discharge rollers 428a, 428b, 430a, and 430b convey the recording medium 404 in the discharging direction so as to discharge the recording medium 404 to the outside of the LED printer 400. The example of the LED printer 400 shown in FIG. 23 shows a configuration example in the case where only one side of the paper is printed. However, the paper reversing device 436 used to reverse the paper when printing both sides of the paper is used. 23 can also be provided at a position surrounded by a dotted line in FIG.

  The recording media 404 loaded on the paper cassette 418 are separated and conveyed one by one by the hopping roller 420. The recording medium 404 supplied from the paper cassette 418 passes through the registration rollers 424a and 424b and the pinch rollers 422a and 422b, and sequentially passes between the photosensitive drum 408 and the transfer roller 426 in each of the process units 402Y, 402M, 402C, and 402K. pass. The recording medium 404 passes between the photosensitive drum 408 and the transfer roller 426 in each of the process units 402Y, 402M, 402C, and 402K, and the toner images of the respective colors are sequentially transferred to the recording medium 404 and heated by the fixing device 434. Then, the toner image of each color is fixed on the recording medium 404 by being pressed. The recording medium 404 on which the toner image is fixed is discharged to a stacker 432 by discharge rollers 428a, 428b, 430a, 430b.

  As described above, in the LED printer 400 as the image forming apparatus according to the third embodiment, the semiconductor device including the light emitting element array is used as the light source of the exposure device 412 in a stable light irradiation regardless of changes in the use environment. Performance can be realized. Therefore, when the optical print heads 100, 200, and 300 including these semiconductor devices are used as an exposure apparatus in an image forming apparatus such as an LED printer, the variation in the amount of imaged light on the photosensitive drum 408 can be reduced, and the integrated energy distribution. Can be made uniform. Therefore, according to the LED printer 400 according to the third embodiment, it is possible to maintain stable print quality regardless of changes in the use environment.

Embodiment 4 FIG.
FIG. 24 is an external perspective view schematically showing a flatbed image scanner (image reading apparatus) 500 according to the fourth embodiment. The image scanner 500 is a flat bed type contact image scanner to which the image sensor head 160 is applied.

  As shown in FIG. 24, the image scanner 500 includes a housing 502, a document table 504 on which a document is placed, and a lid (document table cover) 506 that presses the document placed on the document table 504 from above. Have An image sensor head 160, guides 508a and 508b, a stepping motor 510, a drive belt 512, a control circuit 514, and a flexible flat cable 516 are arranged inside the housing 502.

  The image sensor head 160 is supported so as to be linearly movable along a pair of guides 508 a and 508 b fixed to the housing 502. In order to slide the image sensor head 160 in the sub-scanning direction along the guides 508a and 508b, the image sensor head 160 is connected to a drive belt 512 connected to a stepping motor 510. A control circuit 514 for controlling the image sensor head 160 is connected to the image sensor head 160 via a flexible flat cable 516. 24 shows an example in which the image sensor head 160 according to the first embodiment is applied as the image sensor head installed in the image scanner 500, but the image sensor head 260 to which the configuration of the second embodiment is applied. Can also be applied to the image scanner 500.

  As described above, in the image scanner 500 as the image reading apparatus according to the fourth embodiment, the semiconductor device including the light receiving element array provided in the image sensor head 160 is stable regardless of changes in the use environment. Light receiving performance can be realized. Therefore, when the image sensor head 160 including these semiconductor devices is used for an image scanner, fluctuations in the amount of light incident on the light receiving element array can be reduced, and the integrated energy distribution can be made uniform. Therefore, stable image reading quality can be maintained regardless of changes in the use environment.

  100, 200, 300 Optical print head (semiconductor device), 120, 220, 320 Lens array part, 110, 161, 210, 310 Frame part, 112, 212, 312 Opening part, 113, 163 First convex part (first 1 engaged portion), 114, 214 positioning portion, 115 mounting surface, 116 spacer, 121,221 gradient index lens (lens element), 130, 131, 230, 231, 250, 251 gap, 122,153 , 222, 225, 245 Adhesive, 123, 223 Side plate, 124 First recess (first engaging portion), 140, 240, 340 Light emitting element array substrate (optical element array substrate), 142, 242, 342 Light emitting Element array (semiconductor optical element), 150, 151 sealing material, 160 image sensor Sahead, 164 first opening, 166 second opening, 170 light receiving element array substrate (optical element array substrate), 172 light receiving element array (semiconductor optical element), 180 cover glass, 181 light guide, 213, 313 First convex portion (first engaged portion), 216 Second convex portion (second engaged portion), 224, 324 First concave portion (first engaging portion), 244 Second , Second concave portion (second engaged portion), 343 second convex portion (second engaging portion), 400 LED printer (image forming apparatus), 402Y, 402M, 402C, 402K Process unit, 404 recording medium, 406 transport path, 408 photosensitive drum (image carrier), 410 charging device, 412 exposure device, 414 developing device, 416 418 paper cassette, 420 hopping roller, 422a, 422b pinch roller, 424a, 424b registration roller, 426 transfer roller, 428a, 428b, 430a, 430b discharge roller, 432 stacker, 434 fixing device, 436 paper reversing device, 500 Image scanner (image reading device), 502 housing, 504 document table, 506 lid, 508a, 508b guide, 510 stepping motor, 512 drive belt, 514 control circuit, 516 flexible flat cable.

Claims (18)

A plurality of semiconductor optical elements arranged in the longitudinal direction, each having an optical element array substrate having the plurality of semiconductor optical elements each having an optical axis substantially parallel to each other;
A plurality of lens elements arranged in the longitudinal direction, each having a plurality of lens elements each having a substantially parallel central axis;
A frame portion that holds the optical element array substrate and the lens array portion so that the plurality of semiconductor optical elements and the plurality of lens elements face each other;
The lens array portion has a first engagement portion disposed at a position facing the frame portion,
The frame portion includes a first engaged portion that is engaged by the first engaging portion to determine a position in the longitudinal direction of the lens array portion with respect to the frame portion. .   The first engaging portion and the first engaged portion have a first gap between the first engaging portion and the first engaged portion in the longitudinal direction. The semiconductor device according to claim 1, wherein the semiconductor device is formed as described above.   The first engaging portion and the first engaged portion are formed so that the first engaging portion and the first engaged portion in the longitudinal direction are in close contact with each other. The semiconductor device according to claim 1. The first engaging portion is disposed at a substantially central portion in the longitudinal direction of the lens array portion,
The semiconductor device according to any one of claims 1 to 3, wherein the first engaged portion is disposed at a substantially central portion in the longitudinal direction of the frame portion.   5. The semiconductor device according to claim 1, further comprising a first adhesive that fixes the lens array portion to the frame portion. 6.   The semiconductor device according to claim 5, wherein the first adhesive is an ultraviolet curable adhesive. The first engagement portion is a first recess formed at a predetermined position in the longitudinal direction in the lens array portion,
The first engaged portion is a first convex portion that is formed at a predetermined position in the longitudinal direction of the frame portion and engages with the first concave portion. 7. The semiconductor device according to any one of 1 to 6. The optical element array substrate has a second engagement portion disposed at a position facing the frame portion,
The frame portion includes a second engaged portion that is engaged by the second engaging portion to determine a position in the longitudinal direction of the optical element array substrate with respect to the frame portion. Item 8. The semiconductor device according to any one of Items 1 to 7.   The second engaging portion and the second engaged portion have a second gap between the second engaging portion and the second engaged portion in the longitudinal direction. 9. The semiconductor device according to claim 8, wherein the semiconductor device is formed as described above.   The second engaging portion and the second engaged portion are formed so that the second engaging portion and the second engaged portion in the longitudinal direction are in close contact with each other. The semiconductor device according to claim 8.   11. The semiconductor device according to claim 8, further comprising a second adhesive for fixing the optical element array substrate to the frame portion.   The semiconductor device according to claim 11, wherein the second adhesive is an ultraviolet curable adhesive. The second engagement portion is a second recess formed at a predetermined position in the longitudinal direction of the optical element array substrate,
The second engaged portion is a second convex portion that is formed at a predetermined position in the longitudinal direction of the frame portion and engages with the second concave portion. The semiconductor device according to any one of 8 to 12. The second engaging portion is a second convex portion formed at a predetermined position in the longitudinal direction on the optical element array substrate,
The second engaged portion is a second concave portion that is formed at a predetermined position in the longitudinal direction of the frame portion and engages with the second convex portion,
The second concave portion is a slit portion cut out in a direction perpendicular to the longitudinal direction on a side surface of the frame portion facing the second convex portion of the optical element array substrate. Item 13. The semiconductor device according to any one of Items 8 to 12. The plurality of semiconductor optical elements are a plurality of light emitting elements,
The semiconductor device according to claim 1, wherein the optical element array substrate is a light emitting element array substrate. The plurality of semiconductor optical elements are a plurality of light receiving elements,
The semiconductor device according to claim 1, wherein the optical element array substrate is a light receiving element array substrate.   An image forming apparatus comprising an optical print head including the semiconductor device according to claim 15.   An image reading apparatus comprising an image sensor head including the semiconductor device according to claim 16.

Images