JP2016042088A - Probe card structure and methods for assembling and replacing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card structure, and methods for assembling and replacing the same.SOLUTION: The present invention relates to a probe card structure, and methods for assembling and replacing the same. The probe card structure comprises a circuit board, and a probe head assembly. The circuit board comprises a first side, and a second side opposite to the first side. The circuit board also includes a first connection part, and a housing hole. The housing hole penetrates the first side and the second side. The probe head assembly is partly housed in the housing hole, and includes a fixed part and a probe head. The fixed part includes at least one second connection part corresponding to at least one first connection part, and is connected to the first connection part by the second connection part. The fixed part is also connected to the circuit board in an attachable/detachable method. The probe head and the fixed part are connected in an integrated or attachable/detachable method.SELECTED DRAWING: Figure 3A

Description

  The present invention relates to a probe card (PROBE CARD) structure, and in particular, a probe card structure of a probe head assembly that can be assembled and replaced without rotating a circuit board, and a correlated assembly and replacement method. It is about.

  The probe card is an important inspection tool in semiconductor circuit wafer testing. The electrical characteristics of the circuit on the wafer are measured by contacting the probe of the probe card with a specific bonding pad or electrical contact of the wafer to determine whether the wafer is good or bad. Determine defective products. A conventional wafer detection apparatus is shown in FIG. 1, and a probe card 100A includes a circuit board 110A and a probe head 120A. The circuit board 110A has a tester side (Tester Side) 112A and a wafer side 114A (Wafer Side), the probe head 120A is mounted on and electrically connected to the wafer side 114A, and the probe head 120A is The circuit of the wafer W is inspected using the upper pin 130A. In this conventional wafer detection apparatus, the probe head 120A has a multilayer assembly structure, and the probe head 120A is mounted on the circuit board 110A by concealing the mounting element 200A between the probe head 120A and the circuit board 110A. When the probe card 100A is damaged, worn or needs to be replaced, first, after rotating the probe card 100A, the probe head 120A is removed to some extent by a complicated and troublesome removal process, and then the mounting element 200A However, after the operator removes the mounting element 200A, the operator can completely remove the probe head 120A from the circuit board 110A, and the probe head 120A overlaps in the opposite direction. Can be used by removing the It is, by mounting the probe head 120A necessary to the circuit board 110A, since it is necessary to replace the probe head 120A, is very inefficient. In another embodiment (not shown), the circuit board 110A of the probe card 100A and the probe head 120A are integrated, and when the probe head 120A needs to be replaced, the entire probe card 100A must be replaced. There will be a cost.

  In one improved technique, as shown in FIG. 2A, the circuit board 110B and the probe head 120B of the probe card 100B are detachable connections, and the operator directly operates the mounting element 200B to operate the circuit board 110B. And the probe head 120B can be coupled and fixed to each other. However, in this improved technique, since the probe head 120B needs to be aimed at the position of the wafer W, the probe head 120B is installed on the wafer side 114B (opposite to the tester side 112B) of the circuit board 110B. When 120B needs to be replaced, the entire probe card 100B is still rotated backward and the mounting element 200B is not removed, so that one probe head 120B cannot be removed from the circuit board 110B, and similarly, it takes time and cost. . For example, when the probe card 100B is used for the test, the probe card 100B is connected to a test device (not shown) by a semi-automatic probe card exchange device (SACC; Semi-Automatic Probe Card Changer). An exchange process of the probe head 120B in the probe card 100B is shown in FIG. 2B. As shown in FIG. 2B, first, in step S201, the probe card 100B is removed from the test facility by the semi-automatic probe card exchange device. Subsequently, in step S202, the operator or the operation equipment takes out the probe card 100B from the semi-automatic probe card exchange device. In step S203, the same or different operator or operating equipment must first rotate the probe card 100B. Further, in step S204, the same or different operator or operating equipment removes the probe head 120B from the second side 114B of the circuit board 110B. In step S205, the same or different operator or operation equipment attaches another probe head 120B from the second side 114B of the circuit board 110B. Further, in step S206, the same or different operator or operation equipment rotates the probe card 100B. In step S207, the same or different operator or operation equipment attaches the probe card 100B to the semi-automatic probe card exchange device. Finally, in step S208, the probe card 100B is mounted on the test facility by the semi-automatic probe card exchange device. After completion of step S208, the probe card 100B can further proceed with a correlated test process.

  Therefore, when it is necessary to replace the probe head in the conventional technique, it is necessary to repeatedly rotate the probe card, which complicates the assembly and replacement process. In addition, the probe card front pin may be damaged during probe card rotation or removal, resulting in poor contact or a problem of probe pin damage.

  In order to solve the above-mentioned problems, the present invention provides a probe card structure, and a method for assembling and replacing the probe card structure. The relationship between the structure and arrangement between the circuit board and the probe head assembly makes it possible to The purpose is to simplify the assembly and replacement process.

  A probe card structure according to an embodiment of the present invention includes a circuit board and a probe head assembly. The circuit board has a first side and a second side opposite the first side. The circuit board has at least one first connection portion and one accommodation hole, and the accommodation hole penetrates the first side and the second side of the circuit board. A part of the probe head assembly is accommodated in the accommodation hole, and has a fixing portion and a probe head. The fixing part has at least one second connection part corresponding to at least one first connection part, and the fixing part connects at least one first connection part by at least one second connection part. In a detachable manner, it is fixedly connected to the circuit board. The probe head and the fixed part are connected together or in a detachable manner.

  Preferably, the probe head assembly has a first maximum width and the receiving hole has a second maximum width. The first maximum width is greater than the second maximum width. Thus, the entire probe head assembly does not pass from the first side of the circuit board to the second side of the circuit board.

  Preferably, the probe card structure further includes an object to be measured, which is in a position aiming at the second side of the circuit board, and the probe head includes a plurality of pins, and the probe head includes a plurality of pins. The pin is electrically connected to the object to be measured.

  Preferably, the first side of the circuit board has a specific shape to define the accommodation space, the accommodation space communicates with the accommodation hole, and the shape of the accommodation space corresponds to the shape of the fixing portion.

  Preferably, the probe card is installed in a semi-automatic probe card exchange device.

  According to one embodiment of the present invention, a method for assembling a probe card provides a circuit board having a first side and a second side opposite the first side, the circuit board comprising at least one first connection. And a housing hole, the housing hole penetrating the first side and the second side of the circuit board, and one probe head assembly is mounted from the first side of the circuit board, and the probe head assembly is fixed And the fixing portion has at least one second connection portion corresponding to at least one first connection portion, and is connected to at least one first connection portion by at least one second connection portion. And including.

  Preferably, the probe head assembly includes a probe head, and the probe head and the fixed portion are connected together or in a detachable manner.

  Preferably, one object to be measured is at a position aiming at the second side of the circuit board, and the object to be measured and the probe head are electrically connected.

  A probe card replacement method according to one embodiment of the present invention provides a probe card, which includes a circuit board and a probe head assembly, the circuit board being opposite the first side and the first side. The circuit board has a first connection and a receiving hole, the receiving hole penetrates the first side and the second side of the circuit board, and the probe head assembly is partially The fixing portion has at least one second connecting portion corresponding to at least one first connecting portion, and the fixing portion has at least one second connecting portion. A step of connecting at least one first connecting portion by the connecting portion and fixedly connecting to the circuit board in a detachable manner; and at least one second connecting portion of the fixing portion from the first side of the circuit board; Connection between at least one first connection on the circuit board A step of releasing the relationships, and, from the first side of the circuit board directly, having the step of removing the probe head assembly.

  Preferably, the method of replacing the probe card after removing the probe head assembly further includes mounting another probe head assembly from the first side of the circuit board, and the other probe head assembly is fixed to the other. A step of having at least one second connecting portion corresponding to at least one first connecting portion and another part of the probe head assembly. And a step of inserting at least one other second connection portion and at least one first connection portion into the receiving hole of the plate.

  Preferably, the probe head assembly includes a probe head, and the probe head and the fixed portion are connected together or in a detachable manner.

  Preferably, the device under test is at a position aiming at the second side of the circuit board, and the device under test and the probe head are electrically connected.

  Many other objects, advantages and features of the present invention will become apparent from the following description of one embodiment of the invention when read in conjunction with the accompanying drawings.

  The probe card according to the present invention, and its assembling method and replacement method reduce the step of replacing the probe head in the prior art, and damage or contact the probe card by rotating the probe card in the prior art. Reduce the risk of defects and damage.

It is sectional drawing of the conventional probe card structure. It is sectional drawing of another conventional probe card structure. It is a figure which shows the exchange process of a probe card when a probe card is installed in a semi-automatic probe card exchange apparatus based on the probe card of FIG. 2A. 1 is an exploded cross-sectional view of a probe card structure according to an embodiment of the present invention. FIG. 3B is a cross-sectional view of the probe card structure based on FIG. 3A and an example of the probe head assembly. FIG. 3C illustrates another example of a probe head assembly relative to FIG. 3B. FIG. 3B illustrates another example of a probe head assembly relative to FIGS. 3B and 3C. FIG. 5 is an exploded cross-sectional view of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are screwed together. FIG. 5 is a cross-sectional combination diagram of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are screwed together. FIG. 6 is an exploded cross-sectional view of one example in which a first connection portion of a circuit board and a second connection portion of a probe card assembly are engaged and joined. FIG. 6 is a cross-sectional combination view of one example in which a first connection portion of a circuit board and a second connection portion of a probe card assembly are engaged and joined. FIG. 10 is a sectional combination operation diagram of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are engaged and joined. FIG. 10 is a sectional combination operation diagram of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are engaged and joined. FIG. 10 is a sectional combination operation diagram of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are engaged and joined. FIG. 10 is a sectional combination operation diagram of another example in which the first connection portion of the circuit board and the second connection portion of the probe card assembly are engaged and joined. 2 is a cross-sectional view of the width of a probe head assembly and circuit board according to one embodiment. FIG. 3B is a cross-sectional exploded view of another example of a circuit board in a probe card structure opposite to FIG. 3A. FIG. FIG. 3B is a cross-sectional combination view of the probe card structure based on FIG. 3A. It is an operation | movement figure with which the probe head assembly was mounted | worn from the 1st side of the circuit board. It is an operation | movement figure with which the probe head assembly was mounted | worn from the 1st side of the circuit board. It is an operation | movement figure which removes a probe head assembly from the 1st side of a circuit board. It is an operation | movement figure which removes a probe head assembly from the 1st side of a circuit board. It is a figure which shows the process of replacing | exchanging a probe head assembly, when the probe card by this invention is installed in a semi-automatic probe card exchange apparatus.

  Referring to FIGS. 3A and 3B, the probe card 1 according to one embodiment of the present invention includes a circuit board 10 and a probe head assembly 20. The circuit board 10 has a first side 12 and a second side 14 opposite to the first side 12, and the circuit board 10 has at least one first connection portion 16. The circuit board 10 has an accommodation hole 18, and the accommodation hole 18 passes through the first side 12 and the second side 14 of the circuit board 10. Preferably, the first side 12 is a tester side and connects a tester (not shown), and the second side 14 is a wafer side and corresponds to a wafer (not shown). The probe head assembly 20 is detachable, is connected to the circuit board 10, and is partially installed in the accommodation hole 18, and the probe head assembly 20 has a fixing portion 22 and a probe head 24. In addition, the probe head 24 is integrated with the fixing portion 22 or is detachably connected. There are the following three types of arrangements in which the probe head assembly 20 is partially installed in the receiving hole 18. In one example, only a portion of the probe head 24 is installed in the receiving hole 18 (shown in FIG. 3B). In another example, a portion of both the fixed portion 22 and the probe head 24 are installed in the receiving hole (shown in FIG. 3C). In yet another example, only a portion of the fixed portion 22 is installed in the receiving hole 18 (shown in FIG. 3D). When the probe head assembly 20 is connected to the circuit board 10, the fixing portion 22 is electrically connected to the circuit board 10 by a Pogo Pin (not shown). In one example, when the probe head 24 is integrated with the fixed portion 22, the probe head 24 and the fixed portion 22 are integrally formed by a ball grid array (BGA) (not shown) connection method. In another example, when the probe head 24 is detachably connected to the fixing portion 22, the probe head 24 and the fixing portion 22 are electrically connected by a Pogo Pin (not shown).

  The fixing portion 22 has at least one second connecting portion 26 corresponding to the first connecting portion 16, and the fixing portion 22 is connected to the first connecting portion 16 by the second connecting portion 26 and is removable. Connected to the circuit board 10. The probe head 24 optionally has a plurality of pins 28 extending in a direction away from the fixing portion 22 and is used to electrically connect to an object to be measured or a wafer (not shown). That is, the device under test is in a position where it is aimed at the second side 14 of the circuit board 10, and the probe head 24 is electrically connected to the device under test by the pin 28. Optionally, it further includes a tester (not shown) in a position to aim at the first side 12 of the circuit board 10. More specifically, the first connection portion 16 and the second connection portion 26 are connected by a method such as screw contact or engagement joining, but is not limited to this. For example, in one example, as shown in FIGS. 3A to 3D, when the first connection portion 16 and the second connection portion 26 are connected by a screw connection method, the one mounting element 30 is replaced by the second connection portion. 26 is used to fix the first connecting portion 16 to the first connecting portion 16, and the operator removes the mounting element 30 to release the connection relationship between the first connecting portion 16 and the second connecting portion 26, thereby 20 and the circuit board 10 are separated. In another example, as shown in FIGS. 4A and 4B, when the first connection portion 16 and the second connection portion 26 are connected in a screw-contact manner, the first connection portion 16 has a first thread. And the second connecting portion 18 has a second thread corresponding to the first thread, and the operator rotates the probe head assembly 20 relative to the circuit board 10 so that the first thread and the second thread The threads are engaged with each other to achieve attachment and separation of the probe head assembly 20 and the circuit board 10. In yet another example, as shown in FIGS. 5A to 5B, the first connection portion 16 and the second connection portion 26 are connected by an engagement joining method, and the first connection portion 16 and the second connection portion are connected. Each of the portions 26 includes a first engagement mechanism and a second engagement mechanism, and the probe head assembly 20 is attached to the circuit board 10 by the engagement of the first engagement mechanism and the second engagement mechanism. The operator can separate the probe head assembly 20 and the circuit board 10 by operating the first engagement mechanism or the second engagement mechanism. In still another example, when the first connection portion 16 and the second connection portion 26 are engaged and joined by a specific engagement method (operation of an engagement position or an engagement angle), the operator The probe head assembly 20 and the circuit board 10 can be mounted and separated by the combination method. For example, as shown in FIGS. 6A to 6D, the first connection portion 16 is a slot having a specific track, and the second connection portion 26 is a protrusion that can be accommodated in the slot. Therefore, with the arrangement as described above, the probe head assembly 20 is separated from the circuit board 10 from the first side 12 of the circuit board 10, and when the operator removes the probe head assembly 20 from the circuit board 10, It can be removed at the first side 12 of the circuit board and as in the prior art (shown in FIGS. 1 and 2), the probe heads 120A, 120B cannot be removed without first rotating the probe cards 100A, 100B. There is no such thing. It should be noted that in FIG. 3A to FIG. 6D, the illustration of the first connection part 16 and the second connection part 26 is one or two, but the structure of the probe card 1 of the present invention is as follows. However, the present invention is not limited to this, and at least one or a plurality of first and second connection portions 16 and 26 may be provided. In addition, it should be noted that the structure of the first connection portion 16 and the second connection portion 26 in FIGS. 3A to 6D has been described by a connection method such as a screw connection or an engagement connection, but is not limited thereto. .

In the preferred embodiment, as shown in FIG. 7, the probe head assembly 20 has a first maximum width L _1, the accommodation hole 18 of the circuit board 10 has a second maximum width L _2, the first maximum width L ₁ is greater than the second maximum width L _{2 and} the entire probe head assembly 20 does not pass from the first side 12 of the circuit board 10 to the second side 14 of the circuit board 10. More specifically, when the probe head assembly 20 is mounted on the circuit board 10, the first maximum width L ₁ is located at one position in the direction from the second side 14 to the first side 12 of the circuit board 10.

  Preferably, the first side 12 of the circuit board 10 has a specific shape. More preferably, in one example, as shown in FIG. 8A, the first side 12 having a specific shape defines a receiving space 40, and the first side 12 includes the first surface 12a and the first surface 12a. The probe head assembly 20 is attached to the circuit board 10 so that the accommodation space 40 communicates with the accommodation hole 18, and the shape of the accommodation space 40 corresponds to the shape of the fixed portion 22. When done, the one surface 22a that extends out of the fixed portion 22 / away from the second side 12 is substantially coplanar with the first surface 12a on the first side (shown in FIG. 8B). With such an arrangement, when the probe head assembly 20 is mounted on the circuit board 10, a part of the fixing portion 22 protrudes from the first side 12 of the circuit board 10, and between the tester (not shown) and the circuit board 10. It is possible to prevent the mounting from being affected. In another exemplary embodiment, the shape of the receiving space 40 corresponds to the shape of the fixed portion 22, thereby providing a localization effect when the probe head assembly 20 is attached to the circuit board 10. The fixing portion 22 is accommodated in the accommodation space 40 partially or entirely.

  Based on the structure of the probe card 1 of the present invention as described above, a method of attaching the probe head assembly 20 to the circuit board 10 and exchanging from the circuit board 10 will be described below. When assembling the probe head assembly 20 to the circuit board 10, that is, the method of assembling the probe card 1 provides the circuit board 10, which includes a first side 12 and a second side 14 opposite the first side 12. The first side 12 has at least one first connecting portion 16, the circuit board 10 has a receiving hole 18, and the receiving hole 18 is connected to the first side 12 of the circuit board 10 and the second side 12. Mounting the probe head assembly 20 from the first side 12 of the circuit board 10 (shown in FIG. 9A), the probe head assembly 20 having a fixing portion 22, A step of having at least one second connection portion 26 corresponding to at least one first connection portion 16, inserting a portion of the probe head assembly 20 into the receiving hole 18 of the circuit board 10, and a second connection; 26 and by connecting the first connecting portion 16 (shown in FIG. 9B), to complete the process of attaching the probe head assembly 20 to the circuit board 10. When the probe head assembly 20, particularly the probe head 24 fails or needs to be replaced, that is, the method of replacing the probe card 1 provides the probe card 1, which includes the circuit board 10 and the probe head assembly 20. The circuit board 10 has a first side 12 and a second side 14 opposite the first side 12, the first side 12 has at least one first connection 16, and The circuit board 10 has an accommodation hole 18, a process in which the accommodation hole 18 passes through the first side 12 and the second side 14 of the circuit board 10, and a probe head assembly 20 partially in the accommodation hole 18. The fixed portion 22 is accommodated and has at least one second connecting portion 18 corresponding to the at least one first connecting portion 16, and the fixing portion 22 has a second connecting portion 26. By the first A step of connecting to the circuit board 10 in a detachable manner, connected to the connection part 16, and the second connection part 26 of the fixing part 22 and the circuit board 10 first directly from the first side 12 of the circuit board 10. The step of releasing the connection relationship between one connection 16 (shown in FIG. 9C) and removing the probe head assembly 20 directly from the first side 12 of the circuit board 10 (shown in FIG. 9D) Removing the head assembly 20. Subsequently, the assembly process corresponding to FIGS. 9A to 9B is further duplicated by another probe head assembly 20, which attaches another probe head assembly 20 from the first side 12 of the circuit board 10 ( 9A), the other probe head assembly 20 has another fixing portion 22, and the other fixing portion 22 is at least one corresponding to at least one first connection portion 16. The second connecting portion 26 and the other probe head assembly 20 are partially inserted into the receiving hole 18 of the circuit board 10 and the second connecting portion 26 and the first connecting portion. 16 is connected (shown in FIG. 9B) and the process of attaching another probe head assembly 20 to the circuit board 10 is completed. And, now, the process of replacing the probe card 1 is completely finished.

  More specifically, when the probe card 1 of the present invention is used for testing, the probe card 1 is installed in a semi-automatic probe card exchange device (not shown) and connected to the test device by the semi-automatic probe card exchange device ( Not shown). When the probe head 24 in the probe card 1 needs to be replaced, the replacement process is shown in FIG. 10 based on the arrangement and method as described above in the specification of the present invention. First, in step S61, the probe card 1 is removed from the test facility by the semi-automatic probe card exchange device. Subsequently, in step S <b> 62, the operator or the operation facility directly removes the probe head assembly 20 from the first side 12 of the circuit board 10. Subsequently, in step S63, the same or different operator or operation equipment assembles another probe head assembly 20 directly from the first side 12 of the circuit board 10. Finally, in step S64, the probe card 1 is mounted on the test facility by the semi-automatic probe card exchange device. After step S64 is completed, the probe card 1 can perform a correlated test process.

  Therefore, the probe card 1 provided by the present invention, and its assembly method and replacement method, in a situation where the probe card 1 and the circuit board 10 are not rotated, directly on the first side 12 above the circuit board 10, The probe head assembly 20 can be assembled and replaced, reducing the step of replacing the probe head in the prior art, and damaging the probe card, contact failure, etc. by rotating the probe card in the prior art. Reduce the risk of damage.

1 probe card 10 circuit board 12 first side 12a first surface 12b second surface 14 second side 16 first connection portion 18 receiving hole 20 probe head assembly 22 fixing portion 22a surface 24 probe head 26 second connection portion 28 pin 30 Mounting element 40 Housing space 100A, 100B Probe card 110A, 110B Circuit board 112A, 120B Tester side 114A, 114B Wafer side 120A, 120B Probe head 130A, 130B Pins 200A, 200B Mounting element L ₁ First maximum width L ₂ Second maximum Large W wafer S61-S64 Step S201-S208 Step

Claims (10)

A probe card structure,
It has a first side and a second side opposite to the first side, and has at least one first connecting portion and a receiving hole, and the receiving hole penetrates the first side and the second side A circuit board, and
In part, a probe head assembly received in the receiving hole;
The probe head assembly comprises:
Having at least one second connection corresponding to the at least one first connection, connecting the at least one first connection by the at least one second connection, and detachable, A fixed portion fixedly connected to the circuit board; and
A probe head that is integrated with the fixed part or connected in a removable manner;
A probe card structure comprising:   The probe according to claim 1, wherein the probe head assembly has a first maximum width, the receiving hole has a second maximum width, and the first maximum width is larger than the second maximum width. Card structure.   Further, the device has an object to be measured, the object to be measured is at a position aiming at the second side of the circuit board, the probe head has a plurality of pins, and the probe head has the plurality of pins. The probe card structure according to claim 1, wherein the probe card structure is electrically connected to the device under test.   The first side of the circuit board has a specific shape and defines an accommodation space, the accommodation space communicates with the accommodation hole, and the shape of the accommodation space corresponds to the shape of the fixing portion. The probe card structure according to any one of claims 1 to 3, wherein   The probe card structure according to claim 1, wherein the probe card is installed in a semi-automatic probe card exchange device. A method for assembling a probe card,
A circuit board is provided, having a first side and a second side opposite to the first side, the first side having at least one first connecting portion, and the circuit board having a receiving hole And the housing hole passes through the first side and the second side of the circuit board,
A probe head assembly is mounted from the first side of the circuit board, the probe head assembly has a fixing portion, and the fixing portion corresponds to at least one second connection portion. A step having a part;
A probe card, wherein a part of the probe head assembly is inserted into the receiving hole of the circuit board and is connected to the at least one first connection part by the at least one second connection part. Assembly method.   The probe card assembly method according to claim 6, wherein the probe head assembly includes a probe head, and the probe head and the fixing portion are integrated or connected in a removable manner. A probe card replacement method,
Provided is a probe card having a circuit board and a probe head assembly, wherein the circuit board has a first side and a second side opposite to the first side, wherein the first side is at least one first connection portion. And the circuit board has an accommodation hole, the accommodation hole penetrates the first side and the second side of the circuit board, and the probe head assembly is partially accommodated in the accommodation The fixing portion is accommodated in the hole and has a fixing portion, and the fixing portion has at least one second connecting portion corresponding to the at least one first connecting portion, and the fixing portion has the at least one connecting portion. A step of connecting the at least one first connection part by a second connection part and connecting to the circuit board in a detachable manner;
From the first side of the circuit board, releasing the connection relationship between the at least one second connection part of the fixed part and the at least one first connection part of the circuit board; and
Removing the probe head assembly directly from the first side of the circuit board;
A method for replacing a probe card, comprising:   After removing the probe head assembly, another probe head assembly is mounted from the first side of the circuit board, and the other probe head assembly has another fixing portion, and The other fixing portion has at least one other second connection portion corresponding to the at least one first connection portion, and the other probe head assembly is partially connected to the circuit board. 9. The probe card according to claim 8, further comprising a step of connecting the at least one second connection part and the at least one first connection part while being inserted into the accommodation hole. method of exchange.   The probe card replacement method according to claim 8 or 9, wherein the probe head assembly has one probe head, and the probe head and the fixing portion are connected together or in a detachable manner. .