JP2016039371A - Current sensing resistor and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a current sensing resistor which improves a heat dissipation property and is capable of preventing a resistance plate from being electrified with an external element, and a manufacturing method thereof.SOLUTION: A current sensing resistor includes: a lower plate 110 which is formed from a ceramic material and with which vertically penetrating via-holes are formed in a front end and a rear end; a resistance plate 130 which is formed on the lower plate and forms from a metal material; an upper plate 150 which is formed on the resistance plate and formed from a ceramic material; and a pair of terminals which are formed in the front end and the rear end of the lower plate and electrify the resistance plate. Heat that is generated in the resistance plate is dissipated vertically via the lower plate and the upper plate. The resistance plate is formed with a width smaller than that of the lower plate and the upper plate, and insulation spaces 131 are provided at right and left sides of the resistance plate. The insulation spaces prevent the resistance plate from being electrified in a side direction when a main path of a current flowing in a length direction is defined as a reference.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a current sensing resistor and a method for manufacturing the same, and more particularly to detecting a current, and a lower plate and an upper plate are disposed above and below the resistor plate. Heat dissipation is improved by releasing heat up and down, and an insulating space is secured by configuring the resistance plate narrower than the lower plate and the upper plate, and through the insulating space or the insulating film installed in the insulating space The present invention relates to a current sensing resistor capable of preventing a resistance plate from energizing an external element and a manufacturing method thereof.

  In general, a current measuring element used to detect a current is used as a distribution resistor when measuring a large DC current, and is less than 1Ω to prevent a voltage drop and a power loss. It is advantageous to use low resistance values.

  Examples of such a current measuring element include PRN, SMW (non-inductive wirewound resister), MPR (non-inductive metal plate resistor), CSR (current sensing resistor), and high power CSR (high sens.

  Among these, CSR can be classified into metal foil resistors and chip resistors.

  In the case of the metal foil resistor, since the metal foil and the resistor substrate are bonded with a resin material such as epoxy, heat generated by the resistor cannot be quickly released to the outside. Further, when the heat generated by the resistor rises, the resistance value can change, so the accuracy as the current detection resistor is lowered.

  FIG. 13 is a cross-sectional view showing the structure of a conventional chip resistor.

  Referring to FIG. 13, Patent Literature 1 includes a ceramic substrate, a joint formed on one surface of the ceramic substrate, and a resistor formed on the joint, and the joint is copper (Cu). A chip resistor including at least one of nickel (Ni) and copper-nickel (Cu-Ni) is disclosed.

  However, in the chip resistor of Patent Document 1, since the ceramic substrate is disposed at the lower part of the resistor, it has a structure in which the heat generated by the resistor is discharged to the lower side by conduction. There is a problem that is not done.

  Further, the chip resistor of Patent Document 1 has a structure in which the resistor and the ceramic substrate have the same size, and the resistor is exposed to the outside, so that when the resistor is energized in the lateral direction, There is a possibility that the resistance value cannot be measured accurately or connected to an external element.

Korean Published Patent No. 10-2014-0023819

  Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to arrange the lower plate and the upper plate above and below the resistance plate, so that the heating of the resistor is performed. It is an object of the present invention to provide a current sensing resistor having improved heat dissipation characteristics by being released vertically.

  Another object of the present invention is to secure an insulating space by configuring the resistor plate to be narrower than the lower plate and the upper plate, and the resistor plate is energized with an external element through the insulating space or an insulating film installed in the insulating space. It is an object of the present invention to provide a current sensing resistor that can prevent this.

  It is another object of the present invention to provide a method of manufacturing a current sensing resistor that can easily connect a lower terminal and an upper terminal by forming a via hole in the lower plate.

  Another object of the present invention is to form a via hole and a coupling hole in the lower plate, the resistance plate, and the upper plate, so that each plate is coupled while the adhesive member descends along the hole, thus simplifying the assembly process. It is an object to provide a method of manufacturing a current sensing resistor that can be realized.

  Another object of the present invention is to provide a method of manufacturing a current sensing resistor of a resistance plate that can integrally couple a lower plate, an upper plate, and a resistance plate through an “L” -shaped adhesive member composed of lower and upper layers. It is to provide.

  To this end, the current sensing resistor according to the present invention is made of a ceramic material, and includes a lower plate in which a via hole penetrating vertically is formed in a front end portion and a rear end portion; and formed on the lower plate and made of a metal material. A resistor plate formed on the resistor plate and made of a ceramic material; and a pair of terminal portions formed on the front end portion and the rear end portion of the lower plate for energizing the resistor plate; The heat generated in the resistance plate may be released up and down through the lower plate and the upper plate.

  Each terminal portion of the current sensing resistor according to the present invention is formed in the via hole, an upper terminal formed on the upper surface of the lower plate, a lower terminal formed on the lower surface of the lower plate, A terminal portion including a connecting portion for connecting the upper terminal and the lower terminal.

  The lower plate and the resistor plate of the current sensing resistor according to the present invention may be formed on the upper terminal, and may be formed on the first upper adhesive portion coupled to the resistor plate, on the connection portion, and It is characterized by being coupled by a first connecting part that is coupled to the upper adhesive part of one.

  The resistance plate and the upper plate of the current sensing resistor according to the present invention are coupled by a lower printing part formed on the lower surface of the upper plate and a second lower bonding part formed on the lower printing part. It is characterized by being.

  In addition, a first coupling hole penetrating vertically is formed at a front end portion and a rear end portion of the resistance plate of the current sensing resistor according to the present invention, and the first coupling hole includes the first coupling hole. A second connecting portion for connecting the upper adhesive portion and the second lower adhesive portion is formed.

  In addition, a second coupling hole penetrating vertically is formed at the front end and the rear end of the upper plate of the current sensing resistor according to the present invention. A printing part and a lower printing part are formed, and the upper plate and the resistance plate are formed in a second upper bonding part formed on the upper printing part and the second coupling hole, and the second upper part is formed. It is characterized by being connected by a third connecting part that connects the adhesive part and the second connecting part.

  In addition, the upper terminal, the lower terminal, and the printed part of the current sensing resistor according to the present invention are made of silver paste, and the adhesive part and the connecting part are made of an alloy containing at least one of tin, silver, and copper. It is characterized by.

  The resistance plate of the current sensing resistor according to the present invention may have a width smaller than that of the lower plate and the upper plate, and insulating spaces may be formed on the left and right sides of the resistance plate.

  Further, the insulating space of the current sensing resistor according to the present invention is characterized in that an insulating film is formed by adhering the lower plate and the upper plate and arranged in the length direction.

  In addition, the current sensing resistor manufacturing method according to the present invention includes a plurality of lengthwise cutting grooves and a plurality of lower plates that are divided into widthwise cutting grooves that are spaced apart from each other by a predetermined interval in the length direction. S1 step of providing a ceramic substrate; S2 step of forming a via hole in the width direction cutting groove that divides each lower plate adjacent in the length direction; and the width direction cutting groove on the upper surface and the lower surface of the lower ceramic substrate, respectively. Printing an upper terminal and a lower terminal made of silver paste in the front and rear areas of the substrate; forming a first adhesive member on the upper terminal and laminating the resistor plates corresponding to the lower plates; Step S4; forming a second adhesive member on each of the resistance plates, and stacking upper plates corresponding to the lower plates; Step S5; first and second Heating and melting the adhesive member to bond the lower plate, the resistor plate, and the upper plate; step S6; cutting the lower ceramic substrate along the length direction cutting groove and the width direction cutting groove; step S7; It is characterized by including.

  In addition, the step S6 of the method of manufacturing the current sensing resistor according to the present invention includes soldering the first and second adhesive members that are an alloy including at least one of tin, silver, and copper. The first adhesive member is melted and soldered while flowing down along the via hole.

  In addition, a lower printing part printed with a silver paste is formed on the lower surface of the upper plate of the method for manufacturing a current sensing resistor according to the present invention, and the second adhesive member in step S5 is bonded to the lower printing part. It is characterized by being.

  In addition, the resistance plate of the current sensing resistor manufacturing method according to the present invention has a first coupling hole formed through the front end portion and the rear end portion so as to penetrate vertically. In the step S6, the second bonding is performed. The member is melted and soldered while flowing down along the first coupling hole.

  The method of manufacturing a current sensing resistor according to the present invention includes forming via holes vertically passing through the front and rear ends of the lower plate, and printing silver paste on the upper surface, the lower surface, and the via holes of the lower plate, respectively. Forming an upper terminal, a lower terminal, and a first connecting part for connecting the upper terminal and the lower terminal; and a first coupling hole penetrating vertically at a front end part and a rear end part of the resistance plate; Forming a second coupling hole penetrating vertically at a front end portion and a rear end portion of the upper plate, and printing silver paste on the upper surface, the lower surface and the second coupling hole of the upper plate, Forming a lower printing unit, an upper printing unit, and a second connecting unit that connects the upper printing unit and the lower printing unit; and sequentially stacking the lower plate, the resistance plate, and the upper plate And applying an adhesive member made of an alloy containing at least one of tin, silver, and copper on the upper printing portion of the upper plate; heating and melting the adhesive member; And soldering while flowing down along the second coupling hole, the first coupling hole, and the via hole, and coupling the lower plate, the resistor plate, and the upper plate.

  In addition, the method of manufacturing a current sensing resistor according to the present invention includes providing a lower plate having via holes penetrating vertically at the front end portion and the rear end portion; and at the front end portion and the rear end portion of the lower plate; Step S12 of forming an adhesive member; providing a resistance plate having fitting grooves formed at the front end portion and the rear end portion, and laminating the resistance plate on the lower plate with the fitting groove fitted into the adhesive member. And step S13 for stacking the upper plate on the adhesive member; and step S15 for heating the adhesive member and integrally connecting the lower plate, the upper plate, and the resistance plate. To do.

  The adhesive member of the current sensing resistor manufacturing method according to the present invention may include a lower layer on which the resistor plate is placed and an upper layer that is formed higher than the resistor plate and on which the upper plate is placed. .

  Also, the adhesive member of the current sensing resistor manufacturing method according to the present invention has a shape corresponding to the fitting groove, and is formed higher than the resistance plate.

  In addition, the adhesive member of the current sensing resistor manufacturing method according to the present invention is arranged to be separated from the via hole.

  In addition, in step S11 of the method of manufacturing the current sensing resistor according to the present invention, the lower ceramic substrate is temporarily cut into a length direction cutting groove and a width direction cutting groove and partitioned into a plurality of the lower plates, and then the width direction. Forming the via hole on the cutting groove, and further comprising step S16 of cutting and separating the temporarily cut lower plate after step S15;

  In the current sensing resistor according to the present invention configured as described above, since the lower plate and the upper plate are arranged above and below the resistor plate, the heat generation of the resistor is released up and down to improve the heat dissipation characteristics. be able to.

  In addition, the current sensing resistor according to the present invention secures an insulating space by configuring a resistance plate narrower than the lower plate and the upper plate, and the resistance plate passes through the insulating space or an insulating film installed in the insulating space. It has the effect that it can prevent supplying with an external element.

  In addition, the current sensing resistor manufacturing method according to the present invention has an effect that the lower terminal and the upper terminal can be easily connected by forming a via hole in the lower plate.

  In addition, in the current sensing resistor manufacturing method according to the present invention, by forming via holes and coupling holes in the lower plate, the resistance plate, and the upper plate, the plates are coupled while the adhesive member flows down along the holes. As a result, the assembly process can be simplified.

  In addition, the current sensing resistor manufacturing method according to the present invention has an effect that the lower plate, the upper plate, and the resistance plate can be integrally coupled through an “L” -shaped adhesive member constituted by a lower layer and an upper layer. .

1 is a perspective view showing a first embodiment of a current sensing resistor according to the present invention. FIG. 1 is an exploded perspective view showing a first embodiment of a current sensing resistor according to the present invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 showing a first embodiment of the current sensing resistor according to the present invention. It is a disassembled perspective view which shows the state in which the insulating film was formed in the insulating space of this invention. It is a BB line sectional view showing the state where the insulating film was formed in the insulating space of the present invention. 3B is an exploded perspective view showing a state in which an insulating film having a structure different from that of FIGS. 3B and 3C is formed. FIG. 3B is a side view showing a state in which an insulating film having a structure different from that of FIGS. 3B and 3C is formed. FIG. FIG. 3c corresponds to FIG. 3a and is a cross-sectional view showing a second embodiment of the current sensing resistor according to the present invention. FIG. 4 is a cross-sectional view corresponding to FIG. 3 a and showing a third embodiment of the current sensing resistor according to the present invention. FIG. 9 is an exploded perspective view corresponding to FIG. 2 and showing a fourth embodiment of the current sensing resistor according to the present invention. FIG. 4 is a cross-sectional view corresponding to FIG. 3 a and showing a fourth embodiment of the current sensing resistor according to the present invention. It is sectional drawing which shows the current sensing resistor provided with the adhesive member of a structure different from the adhesive member of FIG. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows one Example of the manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the other manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the other manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the other manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the other manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the further another manufacturing method of the current sensing resistor which concerns on this invention. It is a figure which shows the further another manufacturing method of the current sensing resistor which concerns on this invention. FIG. 9 is an exploded perspective view of FIG. 8. It is sectional drawing which shows the structure of the conventional chip resistor.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  In the description of the present invention, when it is determined that a specific description of a related known function or configuration may obscure the gist of the present invention, a detailed description thereof will be omitted. In addition, each term to be described later is a term defined in consideration of the function in the present invention, and these may vary depending on the intention or precedent of the user and the operator. Therefore, these terms should be defined based on the contents throughout this specification.

  FIG. 1 is a perspective view showing a first embodiment of a current sensing resistor according to the present invention, and FIG. 2 is an exploded perspective view showing a first embodiment of the current sensing resistor according to the present invention. 3a is a cross-sectional view taken along the line AA of FIG. 1 showing a first embodiment of the current sensing resistor according to the present invention.

  1 to 3a, a current sensing resistor 100 according to the present invention is roughly divided into a lower plate 110, an upper plate 150, and a resistance plate disposed between the lower plate 110 and the upper plate 150. 130 is included.

  The lower plate 110 is made of a ceramic material, and serves to release heat generated by the resistance plate 130 to the lower portion. Via holes 111 and terminal portions 113 that penetrate vertically in the front end portion and the rear end portion, respectively. It is formed.

  The terminal part 113 includes a lower terminal 114 formed on the lower surface of the lower plate 110 so as to be directly surface-mounted on the substrate 300, an upper terminal 115 formed on the upper surface and connected to the resistor plate 130, The via hole 111 includes a connection portion 116 that electrically connects the lower terminal 114 and the upper terminal 115. The lower terminal 114, the upper terminal 115, and the connection part 116 can be formed by printing silver paste.

  The via hole 111 provides a space penetrating vertically so that the connection part 116 is printed on the inner surface, and may be a semi-cylindrical one.

  The resistance plate 130 is made of a metal material, for example, an alloy of at least two metals of Ni, Cr, and Cu, and is stacked on the lower plate 110 and is connected to the substrate via the pair of terminal portions 113. 300 pattern terminals 301 are connected to be energized.

  A first adhesive member 120 is formed on the terminal portion 113, specifically, a first upper adhesive portion 123 formed on the upper terminal 115 and a first upper portion formed on the connection portion 116. A connecting portion 122 and a first lower adhesive portion 121 formed on the lower terminal are formed.

  And the said adhesive member can illustrate what consists of an alloy containing at least one among tin, silver, and copper excellent in heat conductivity compared with general adhesive resin.

  The upper plate 150 is stacked on the resistance plate 130 and serves to release heat generated by the resistance plate 130, and is preferably made of a ceramic material.

  The upper plate 150 and the resistance plate 130 may be coupled to each other by a lower printing unit 151 formed on the lower surface of the upper plate 150 and a second lower bonding unit 141 formed on the lower printing unit 151. Here, the lower printing portion 151 is a silver paste, and the second lower bonding portion 141 is preferably made of an alloy containing at least one of tin, silver, and copper having excellent adhesive strength and thermal conductivity. .

  As described above, in the current sensing resistor 100 according to the present invention, the lower plate 110 and the upper plate 150 are disposed above and below the resistance plate 130, so that heat generated by the resistance plate 130 is released upward and downward. Will improve.

  In the present invention, the resistance plate 130 has a narrower width than the lower plate 110 and the upper plate 150, and the insulating spaces 131 are formed on the left and right sides of the resistance plate 130. There is an advantage.

  3b and 3c are an exploded perspective view and a cross-sectional view taken along line BB showing a state in which an insulating film is formed in the insulating space of the present invention. FIGS. 3d and 3e are different from FIGS. 3b and 3c. It is the disassembled perspective view and side view which show the state in which the insulating film was formed.

  Referring to FIGS. 3 b to 3 e, an insulating layer 133 may be formed in the insulating space 131.

  The insulating film 133 is made of an adhesive material, such as a resin such as epoxy, and can bond the upper plate 150 and the lower plate 110.

  As shown in FIGS. 3b and 3c, one insulating layer 133 may be disposed in the longitudinal direction on the insulating space 131 between the upper plate 150 and the lower plate 110, as shown in FIGS. 3d and 3e. As shown in FIG. 6, a plurality of insulating films 133a, 133b, and 133c separated by a predetermined interval in the length direction may be disposed. At this time, the insulating film 133 may be disposed so as to be separated from the left and right side surfaces of the resistance plate 130 or may be disposed so as to be in contact therewith.

  Hereinafter, other embodiments of the current sensing resistor according to the present invention will be described in detail with reference to the accompanying drawings. However, detailed description of the same or similar configurations as those described above is omitted.

  FIG. 4 corresponds to FIG. 3a and is a cross-sectional view showing a second embodiment of the current sensing resistor according to the present invention.

  Referring to FIG. 4, in the present embodiment, first coupling holes 143 that are vertically formed through the front end portion and the rear end portion of the resistance plate 130 are formed.

  The first coupling hole 143 may be configured to be formed with a second connecting portion 144 that couples the first upper bonding portion 123 and the second lower bonding portion 141.

  FIG. 5 corresponds to FIG. 3a and is a cross-sectional view showing a third embodiment of the current sensing resistor according to the present invention.

  Referring to FIG. 5, in the present embodiment, a second coupling hole 155 penetrating vertically is formed at the front end portion and the rear end portion of the upper plate 150, and the upper printing portion 153 is formed on the upper and lower surfaces, respectively. The lower printing unit 151 may be formed.

  The upper plate 150 and the resistance plate 130 are formed in the second upper bonding part 142 formed on the upper printing part 153 and the second coupling hole 155, and the second upper bonding part 142. And the third connecting part 157 that joins the second connecting part 144 to each other.

  As described above, the via hole 111, the first coupling hole 143, and the second coupling hole 155 communicate with each other, and the first coupling portion 122, the second coupling portion 144, and the third coupling hole are formed in each hole. The connecting portion 157 can be coupled together.

  Further, since the upper plate and the lower plate have the same structure, it is not necessary to separately manufacture the upper plate and the lower plate in the manufacturing process, and there is an advantage that they can be used together.

  When the resistor is connected to the substrate, the solder 303 is firmly surface-mounted while being lifted along the connecting portions 122, 144, and 157 due to the wettability of the solder.

  FIG. 6 corresponds to FIG. 2 and is an exploded perspective view showing a fourth embodiment of the current sensing resistor according to the present invention. FIG. 7 corresponds to FIG. FIG. 9 is a sectional view showing a fourth embodiment of the current sensing resistor according to the invention, and FIG. 9 is a sectional view showing a current sensing resistor having an adhesive member having a structure different from that of the adhesive member of FIG.

  Referring to FIGS. 6 and 7, in this embodiment, fitting grooves 145 are formed at the front end portion and the rear end portion of the resistance plate 130.

  The adhesive member 125 includes a lower layer 126 on which the resistance plate 130 is placed, and an upper layer 128 that is formed higher than the resistance plate 130 and on which the upper plate 150 is placed.

  Three surfaces of the fitting groove 145 are bonded to the side surface of the upper layer 128, and the lower surface of the resistance plate 130 is bonded to the upper surface of the lower layer 126.

  The upper plate 150 is bonded to the upper surface of the upper layer 128.

  As described above, the adhesive member 125 is formed in a stepped shape, and the fitting plate 145 is formed in the resistance plate 130, so that the lower plate 110, the resistance plate 130, and the upper plate 150 can be bonded simultaneously by one adhesive member 125. There is an advantage.

  Referring to FIGS. 6 and 8, unlike FIG. 7, the adhesive member 125a has a flat plate shape that is not stepped, and the fitting groove 145 is formed in the state in which the resistance plate 130 is in contact with the lower plate 110. It is fitted and glued. Accordingly, the contact area between the resistance plate 130 and the lower plate 110 is increased, so that heat can be easily released through the lower plate.

  Hereinafter, a method of manufacturing a current sensing resistor according to the present invention will be described with reference to the accompanying drawings.

  9a to 9f are drawings showing an embodiment of a method of manufacturing a current sensing resistor according to the present invention.

  Referring to FIGS. 9a to 9f, the method of manufacturing the current sensing resistor according to the present invention may be roughly divided into S1 to S7.

  Referring to FIG. 9a, the step S1 is a step of providing a lower ceramic substrate 200 on which a plurality of lower plates divided into a length direction cutting groove 201 and a width direction cutting groove 203 are disposed.

  At this time, the length direction cutting groove 201 and the width direction cutting groove 203 are formed on at least one surface of the lower plate 110 to perform temporary cutting. Allow the plates to be easily separated.

  Referring to FIG. 9b, the step S2 is a step of forming a via hole 111 at the center of the width direction cutting groove 203 that partitions the lower plates 110 adjacent in the length direction. Therefore, the via hole 111 of the lower plate 110 separated in step S7 has a semicircular shape as shown in FIG.

  The step S3 is a step of printing the upper terminal 115 and the lower terminal 114 made of silver paste on the upper and lower surfaces of the lower ceramic substrate 200 in the front and rear regions of the width direction cutting groove 203, respectively.

  Referring to FIG. 9C, silver paste is applied to the inner wall of the via hole 111 in the process of printing the upper terminal 115 and the lower terminal 114 in step S3, and the upper terminal 115 and the lower terminal 114 are connected to each other.

  Referring to FIG. 9 d, the step S 4 is a step of applying the first adhesive member 120 on the upper terminal 115 and laminating the resistance plates 130 corresponding to the lower plates 110.

  Referring to FIG. 9e, the step S5 is a step of forming a second lower adhesive part 141 on each resistance plate 130 and laminating each upper plate 150 corresponding to each lower plate 110.

  At this time, since the lower printing portion 151 printed with silver paste is formed on the lower surface of the upper plate 150, the upper plate 150 made of a shellac material and the second lower bonding portion 141 can be bonded. . This is because the second lower bonding portion 141 is made of a metal alloy as described above, and is not directly bonded to the upper plate 150 made of ceramic material, but is bonded via the lower printing portion 151 made of silver paste. .

  Referring to FIGS. 9e and 9f, in step S6, the first adhesive member 120 and the second lower adhesive portion 141 are heated and melted, and the lower plate 110, the resistance plate 130, and the upper plate 150 are combined. It is the stage to do.

  That is, the step S6 includes soldering the first adhesive member 120 and the second lower adhesive portion 141 that are an alloy containing at least one of tin, silver, and copper, and the first adhesive member. The solder 120 is melted and soldered while flowing down along the via hole 111.

  At this time, the first adhesive member 120 and the second lower adhesive part 141 may be heated on a hot plate, or may be heated through a reflow process in the chamber (C).

  The resistance plate 130 may be formed with first coupling holes 143 penetrating vertically at the front end portion and the rear end portion (see FIG. 5). Therefore, in the step S6, the second lower adhesive portion 141 may be melted and soldered while flowing down along the first coupling hole 143.

  Referring back to FIG. 9 a, the step S 7 is a step of cutting the lower ceramic substrate 200 along the length direction cutting grooves 201 and the width direction cutting grooves 203.

  Since the temporary cutting is performed on the lower ceramic substrate 200 through the cutting grooves 201 and 203 in the step S1, in the step S7, for example, only a simple operation in which the operator bends the lower ceramic substrate by hand. The lower plate can be easily separated.

  Hereinafter, another method of manufacturing the current sensing resistor according to the present invention will be described with reference to the accompanying drawings.

  10a to 10d are diagrams showing another method of manufacturing the current sensing resistor according to the present invention.

  First, referring again to FIGS. 9a to 9c, in this embodiment as well, in the same manner as in the above-described embodiment, via holes 111 penetrating vertically are formed in the front end portion and the rear end portion of the lower plate 110, and the lower plate 110 is formed. Silver paste is printed on the upper surface, the lower surface, and the via hole 111, respectively, to form an upper terminal 115, a lower terminal 114, and a connection portion 116 that connects the upper terminal 115 and the lower terminal 114.

  Next, referring to FIGS. 10a to 10d, in the present embodiment, a step of forming a first coupling hole 143 penetrating vertically at the front end portion and the rear end portion of the resistance plate 130; A second coupling hole 155 penetrating vertically is formed in the front end portion and the rear end portion, and silver paste is printed on the upper and lower surfaces of the upper plate 150 and the second coupling hole 155, respectively, and the lower printing portion 151 and the upper portion are printed. Forming a printing unit 153 and a connection unit 116 for connecting the upper printing unit 153 and the lower printing unit 151; and sequentially stacking the lower plate 110, the resistance plate 130, and the upper plate 150; Applying a second adhesive member 140 made of an alloy containing at least one of tin, silver, and copper on the upper printing unit 153; and The adhesive member 140 is heated and melted, and the melted second adhesive member 140 is soldered while flowing down along the second coupling hole 155, the first coupling hole 143, and the via hole 111, and the lower plate 110 Bonding the resistance plate 130 and the upper plate 150 together.

  Hereinafter, another method of manufacturing the current sensing resistor according to the present invention will be described with reference to the accompanying drawings.

  11a and 11b are views showing still another method of manufacturing the current sensing resistor according to the present invention, and FIG. 12 is an exploded perspective view of FIG.

  Referring to FIGS. 11a, 11b, 6 and 7, in this embodiment, the lower plate is provided with a lower plate 110 in which via holes 111 penetrating vertically are formed in the front end portion and the rear end portion. Step S12 of forming the adhesive member 125 at the front end portion and the rear end portion of 110, and a resistance plate 130 having fitting grooves 145 formed at the front end portion and the rear end portion are provided, and the adhesive member 125 is fitted into the fitting groove 145. In step S13, the resistance plate 130 is stacked on the lower plate 110, and in step S14, the upper plate 150 is stacked on the adhesive member 125. The adhesive member 125 is heated, and the lower plate 110, S15, which joins the upper plate 150 and the resistance plate 130 together.

  In step S 11, the lower ceramic substrate 200 is temporarily cut into a length direction cutting groove 201 and a width direction cutting groove 203 and partitioned into a plurality of lower plates 110, and then the via hole is formed on the width direction cutting groove 203. 111 is formed.

  Here, the adhesive member 125 includes a lower layer 126 on which the resistance plate 130 is placed, and an upper layer 128 that is formed higher than the resistance plate 130 and on which the upper plate 150 is placed. Further, since the upper layer 128 is formed higher than the resistance plate 130, the adhesive member 125 can be firmly bonded by filling a gap between the upper plate 150 and the resistance plate 130 while being heated and melted. it can.

  The adhesive member can be formed using a printing method, for example, a 3D printing method.

  The adhesive member 125 is preferably disposed so as to be separated from the via hole 111 to prevent the via hole 111 before cutting from being completely blocked.

  The reason is that if the via hole 111 is completely closed, when the lower plate 110 temporarily cut in step S16 is cut, the cutting member is not separated and a defect may occur.

  Meanwhile, referring to FIGS. 12 and 8, the adhesive member 125 a may have a shape corresponding to the fitting groove 145, for example, a rectangular flat plate shape. In this case, the structure of the adhesive member is simple, and generally used printing methods and masking methods can be used. Unlike FIGS. 11a and 11b, the interval between the lower plate and the resistance plate is eliminated. There is an advantage that you can. As described above, when the adhesive member is formed higher than the resistance plate, the adhesive force can be increased.

  On the other hand, although the detailed description of the present invention and the accompanying drawings have been described with reference to specific embodiments, the present invention is not limited to the disclosed embodiments and has ordinary knowledge in the technical field to which the present invention belongs. Those skilled in the art can make various substitutions, modifications, and changes without departing from the technical idea of the present invention. Therefore, the scope of the present invention should not be limited to the above-described embodiments, and should be construed to include not only the scope of claims described later but also equivalents to the scope of claims. Let's go.

100 Resistor 110 Lower plate 111 Via hole 113 Terminal part 114 Lower terminal 115 Upper terminal 116 Connection part 120 First adhesive member 121 First lower adhesive part 122 First connection part 123 First upper adhesive part 125, 125a Adhesion Member 126 Lower layer 128 Upper layer 130 Resistance plate 131 Insulating space 133 Insulating film 140 Second adhesive member 141 Second lower adhesive part 142 Second upper adhesive part 143 First coupling hole 144 Second connecting part 145 Fitting groove 150 Upper plate 151 Lower printing part 153 Upper printing part 155 Second coupling hole 157 Third connection part 200 Lower ceramic substrate 201 Length direction cutting groove 203 Width direction cutting groove 300 Substrate 301 Pattern terminal 303 Solder C chamber

Claims (19)

A lower plate made of a ceramic material and formed with a via hole penetrating vertically at the front end portion and the rear end portion;
A resistance plate formed on the lower plate and made of a metal material;
An upper plate formed on the resistance plate and made of a ceramic material;
A pair of terminal portions formed at the front end portion and the rear end portion of the lower plate and energizing the resistance plate;
The heat generated in the resistance plate is released up and down through the lower plate and the upper plate,
The resistance plate is configured to have a smaller width than the lower plate and the upper plate, and insulating spaces are provided on the left and right of the resistance plate,
The insulating space prevents the resistance plate from energizing in the lateral direction with reference to the main path of the current flowing in the length direction thereof.
A current sensing resistor characterized by that. Each terminal part is
A terminal including an upper terminal formed on an upper surface of the lower plate, a lower terminal formed on a lower surface of the lower plate, and a connection portion formed in the via hole and connecting the upper terminal and the lower terminal. Part;
The current sensing resistor according to claim 1. The lower plate and the resistance plate are
A first upper adhesive portion formed on the upper terminal and coupled to the resistor plate, and a first coupling portion formed on the connection portion and coupled to the first upper adhesive portion. ,
The current sensing resistor according to claim 2. The resistance plate and the upper plate are
The lower printing part formed on the lower surface of the upper plate and the second lower bonding part formed on the lower printing part are combined,
The current sensing resistor according to claim 3. The front end portion and the rear end portion of the resistance plate are formed with first coupling holes penetrating vertically.
The first coupling hole is formed with a second coupling portion that couples the first upper adhesive portion and the second lower adhesive portion.
The current sensing resistor according to claim 4. A second coupling hole penetrating vertically is formed at the front end portion and the rear end portion of the upper plate,
An upper printing part and a lower printing part are formed on the upper and lower surfaces of the upper plate,
The upper plate and the resistance plate are
A second upper adhesive portion formed on the upper printed portion; and a third connecting portion formed in the second connecting hole and connecting the second upper adhesive portion and the second connecting portion. Combined by
The current sensing resistor according to claim 5. The upper terminal, the lower terminal and the printing part are made of silver paste,
The bonding portion and the connecting portion are made of an alloy containing at least one of tin, silver, and copper.
The current sensing resistor according to any one of claims 3 to 6. In the insulating space, the lower plate and the upper plate are bonded, and an insulating film disposed in the length direction is formed.
The current sensing resistor according to claim 1. The insulating film is composed of a plurality spaced apart by a constant interval in the length direction.
The current sensing resistor according to claim 8. In a method of manufacturing a current sensing resistor having a structure in which a lower plate and an upper plate are arranged above and below a resistor plate,
Providing a lower ceramic substrate on which a number of lower plates are arranged in a lengthwise cutting groove and a widthwise cutting groove;
A step S2 of forming a via hole in the width direction cutting groove defining each lower plate adjacent in the length direction;
Step S3 of printing an upper terminal and a lower terminal made of silver paste on the upper and lower surfaces of the lower ceramic substrate, respectively, in front and rear regions of the widthwise cutting groove;
Forming a first adhesive member on the upper terminal and stacking the resistor plates corresponding to the lower plates;
Forming a second adhesive member on each resistance plate and stacking each upper plate corresponding to each lower plate;
Heating and melting the first and second adhesive members to connect the lower plate, the resistor plate, and the upper plate;
Cutting the lower ceramic substrate along the lengthwise cutting grooves and the widthwise cutting grooves;
The resistance plate is configured to have a smaller width than the lower plate and the upper plate, and insulating spaces are provided on the left and right of the resistance plate,
The insulating space is energized in the lateral direction with reference to the main path of the current flowing through the resistance plate in the length direction thereof.
The manufacturing method of the current sensing resistor characterized by preventing this. In step S6, the first and second adhesive members that are an alloy containing at least one of tin, silver, and copper are soldered.
The first adhesive member is melted and soldered while flowing down along the via hole.
The method of manufacturing a current sensing resistor according to claim 10. On the lower surface of the upper plate, a lower printing part printed with a silver paste is formed,
The second adhesive member in step S5 is bonded to the lower printing unit.
The method of manufacturing a current sensing resistor according to claim 11. The resistance plate is formed with a first coupling hole penetrating vertically at the front end portion and the rear end portion,
In step S6, the second adhesive member is melted and soldered while flowing down along the first coupling hole.
The method of manufacturing a current sensing resistor according to claim 12. In a method of manufacturing a current sensing resistor having a structure in which a lower plate and an upper plate are arranged above and below a resistor plate,
Via holes penetrating vertically are formed in the front end portion and the rear end portion of the lower plate, and silver paste is printed on the upper surface, the lower surface, and the via hole of the lower plate, respectively, and an upper terminal, a lower terminal, and the upper terminal and the lower terminal Forming a first connection connecting the two;
Forming a first coupling hole penetrating vertically at a front end portion and a rear end portion of the resistance plate;
Second coupling holes penetrating vertically are formed in the front end portion and the rear end portion of the upper plate, and silver paste is printed on the upper surface, the lower surface, and the second coupling hole of the upper plate, respectively. Forming a printing part and a second connecting part for connecting the upper printing part and the lower printing part;
Stacking the lower plate, the resistance plate, and the upper plate in sequence, and applying an adhesive member made of an alloy containing at least one of tin, silver, and copper on the upper printed portion of the upper plate;
The adhesive member is heated and melted, and the molten adhesive member is soldered while flowing down along the second coupling hole, the first coupling hole, and the via hole, and couples the lower plate, the resistance plate, and the upper plate. And the stage of
The manufacturing method of the current sensing resistor characterized by including. In a method of manufacturing a current sensing resistor having a structure in which a lower plate and an upper plate are arranged above and below a resistor plate,
Providing a lower plate in which via holes penetrating vertically are formed in the front end portion and the rear end portion;
Forming an adhesive member at a front end portion and a rear end portion of the lower plate;
Providing a resistance plate having fitting grooves formed in the front end portion and the rear end portion, and laminating the resistance plate on the lower plate in a state where the fitting groove is fitted in the adhesive member;
S14 stacking the upper plate on the adhesive member;
Heating the adhesive member and coupling the lower plate, the upper plate, and the resistance plate together;
The manufacturing method of the current sensing resistor characterized by including. The adhesive member includes a lower layer on which the resistance plate is placed, and an upper layer that is formed higher than the resistance plate and on which the upper plate is placed.
The method of manufacturing a current sensing resistor according to claim 15. The adhesive member has a shape corresponding to the fitting groove, and is formed higher than the resistance plate.
The method of manufacturing a current sensing resistor according to claim 15. The adhesive member is disposed so as to be separated from the via hole.
The method of manufacturing a current sensing resistor according to claim 15. The step S11 includes temporarily cutting the lower ceramic substrate into a length direction cutting groove and a width direction cutting groove to partition the lower ceramic substrate into a plurality of the lower plates, and then forming the via hole on the width direction cutting groove.
After the step S15, further comprising a step S16 of cutting and separating the temporarily cut lower plate;
The method of manufacturing a current sensing resistor according to claim 15.

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