JP2016029748A5 - - Google Patents
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- Publication number
- JP2016029748A5 JP2016029748A5 JP2015235803A JP2015235803A JP2016029748A5 JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5 JP 2015235803 A JP2015235803 A JP 2015235803A JP 2015235803 A JP2015235803 A JP 2015235803A JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5
- Authority
- JP
- Japan
- Prior art keywords
- shield
- insulating layer
- shield film
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 36
- 230000001681 protective Effects 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 230000001070 adhesive Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015235803A JP2016029748A (ja) | 2015-12-02 | 2015-12-02 | シールドプリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015235803A JP2016029748A (ja) | 2015-12-02 | 2015-12-02 | シールドプリント配線板の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012278551A Division JP2014123630A (ja) | 2012-12-20 | 2012-12-20 | シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016029748A JP2016029748A (ja) | 2016-03-03 |
| JP2016029748A5 true JP2016029748A5 (fr) | 2016-11-10 |
Family
ID=55435491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015235803A Pending JP2016029748A (ja) | 2015-12-02 | 2015-12-02 | シールドプリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2016029748A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7228330B2 (ja) * | 2017-02-10 | 2023-02-24 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板 |
| JP6872567B2 (ja) * | 2017-02-13 | 2021-05-19 | タツタ電線株式会社 | シールドプリント配線板及びシールドプリント配線板の製造方法 |
| KR102467723B1 (ko) * | 2017-02-13 | 2022-11-16 | 타츠타 전선 주식회사 | 그라운드 부재, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법 |
| WO2018147426A1 (fr) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | Film de blindage, carte de circuit imprimé blindée et procédé de fabrication d'une carte de circuit imprimé blindée |
| CN115243477A (zh) * | 2022-07-27 | 2022-10-25 | 北京八度阳光科技有限公司 | 一种基于分层叠加生产电子线路板的方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3498386B2 (ja) * | 1994-10-19 | 2004-02-16 | 住友電気工業株式会社 | シールド付きフレキシブル配線板及びその製造方法 |
| JP2005056906A (ja) * | 2003-08-05 | 2005-03-03 | Reiko Co Ltd | 電磁波遮蔽性転写フイルム |
| JP4914262B2 (ja) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | シールドフィルム及びシールドプリント配線板 |
| JP2011171523A (ja) * | 2010-02-19 | 2011-09-01 | Toyo Ink Sc Holdings Co Ltd | 硬化性電磁波シールド性接着性フィルムおよびその製造方法 |
-
2015
- 2015-12-02 JP JP2015235803A patent/JP2016029748A/ja active Pending
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