JP2016025304A - Position confirmation apparatus and die bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a position confirmation apparatus capable of obtaining a distortionless observation image and performing accurate position confirmation without being influenced by shimmer and a die bonder.SOLUTION: The position confirmation apparatus is used for observing an observing site in an atmosphere having a refractive index difference from the ambient air. An opening part for work is formed at a position above the observation site. A non-shimmer generation path for preventing generation of shimmer is formed at a position near the opening part for work so as not to restrict work through the opening part for work. Imaging means for imaging an observation site image through the non-shimmer generation path is included.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a die bonder for mounting a semiconductor chip or the like on a lead frame or the like, and a position confirmation device that can be used for such a die bonder.

  When manufacturing a semiconductor device, die bonding for mounting a semiconductor chip on a lead frame as a mounted member is performed. For this die bonding, a die bonder having a collet for adsorbing chips is used.

  As shown in FIG. 5, such a die bonder includes a bonding arm (not shown) having a collet 3 for attracting the semiconductor chip 1 of the supply unit 2 and a recognition camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. And a recognition camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

  The supply unit 2 includes a semiconductor wafer, and the semiconductor wafer is divided into a large number of semiconductor chips 1. Further, the bonding arm holding the collet 3 can be moved between the pickup position and the bonding position via the conveying means.

  Further, the collet 3 is vacuum-sucked through the suction holes opened in the lower end surface thereof, and the chip 1 is adsorbed on the lower end surface of the collet 3. If this vacuum suction (evacuation) is released, the chip 1 is detached from the collet 3.

  Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed with a recognition camera arranged above the supply unit 2, and the collet 3 is positioned above the chip 1 to be picked up, and then the collet 3 as indicated by an arrow A. Is lowered to pick up the chip 1. Thereafter, the collet 3 is raised as shown by the arrow B.

  Next, with the recognition camera arranged above the bonding position, the island portion 5 of the lead frame 4 to be bonded is observed, the collet 3 is moved in the direction of arrow C, and the island portion 5 is positioned above the island portion 5. After being positioned, the collet 3 is moved downward as indicated by an arrow D, and the chip 1 is supplied to the island portion 5. In addition, after the chip is supplied to the island portion 5, the collet 3 is raised as indicated by the arrow E and then returned to the standby position above the pip-up position as indicated by the arrow F.

  That is, by moving the collet 3 sequentially as indicated by arrows A, B, C, D, E, and F, the chip 1 positioned based on the observation of the pickup recognition camera is picked up by the collet 3. The chip 1 is mounted on the island portion 5.

  By the way, as such a bonding apparatus, there is a case where the chip 1 is bonded to the island part (mount part) 12 of the lead frame 11 conveyed in the heater rail 10 as shown in FIG.

  Here, the heater rail 10 constitutes a heating means and a conveying means, and the inside is filled with an inert gas such as nitrogen to form a high temperature atmosphere (for example, about 300 ° C. to 500 ° C.). The

  The heater rail 10 is provided with a window (working opening) 13, and the chip 1 is bonded through the window 13. Under the present circumstances, the observation means 14 used for chip | tip positioning etc. is arrange | positioned above this window part 13. As shown in FIG. The observation means 14 includes a lens system 15 and a camera unit 16.

  However, since the inside of the heater rail 10 is a high temperature atmosphere, a refractive index difference is generated between the high temperature atmosphere and the normal temperature air, and a positive flame is generated in the space between the observation means 14 and the window portion 13 of the heater rail 10. To do. In this way, when a hot flame occurs, the recognition image is affected by the hot flame, and the recognition of the chip and the island portion becomes unstable, so that a highly accurate bonding operation cannot be performed.

  Therefore, various countermeasures against the hot flame have been conventionally taken. For example, there is one that can reduce a temperature difference in a normal temperature space that causes a flame during recognition by temporarily storing radiant heat from a high-temperature stage (Patent Document 1).

  That is, the image recognition apparatus described in Patent Document 1 includes an auxiliary lens barrel 24 with a transparent cover glass 23 between an objective lens 21 and a workpiece 22 of an optical system 20 as shown in FIG. It is provided. In this case, the tip of the auxiliary lens barrel 24 is brought close to the workpiece 22 and the high-temperature stage 25. As a result, the temperature difference in the room temperature space, which causes a hot flame at the time of recognition, is reduced by temporarily storing the radiant heat from the high temperature stage 25.

  Conventionally, an observation apparatus for a high-temperature object that is not used in a die bonder but is not easily affected by radiation light, fluctuation, or the like has been proposed (Patent Document 2). This observation apparatus includes an ultraviolet illumination for irradiating an observation target with ultraviolet rays and a camera having sensitivity to the ultraviolet rays.

  In this case, the object to be observed is housed in a heating furnace, and an illumination window that transmits ultraviolet rays and a camera window on which the camera is mounted are formed in the heating furnace. In other words, by using ultraviolet rays for illumination, it is intended to clarify the observation target by eliminating the influence of radiation light from an object other than the observation target. Moreover, a pair of cylinder parts are protruded from the body part of the heating furnace, a window is provided at the tip of each cylinder part, and a space extending from the window toward the observation object is formed.

  In this case, the influence of fluctuations (hot flame) due to convection in the heating furnace is prevented by providing a cylindrical side wall (cylinder part) that widens toward the end in order to block it from the surroundings. And while installing a heat insulating material in a heating furnace, the cylinder part from a trunk | drum to a window is covered with the water cooling jacket.

  Further, conventionally, as a checking device in a hot air passage, there is one that uses a water cooling jacket and inserts a periscope with a built-in camera into this water cooling jacket (Patent Document 3). In other words, this inspection device prevents the hot lens phenomenon in front of the camera lens from occurring by allowing the camera lens to face the gap between the inner tube of the water-cooled jacket where air does not flow and the outer peripheral surface of the periscope. ing.

  In addition to the above Patent Documents 1 to 3, as a means for solving the problem that the observation image is distorted due to the heat flame generated due to the temperature difference between the high temperature atmosphere and the outside air, the atmosphere of the heat flame part is blown outside air Those that replace with, those that obtain a reference target in the vicinity of the target, those that correct positioning or image distortion based on the deviation from the ideal position of the standard target, those that closely contact the lens system of the imaging means in a high temperature atmosphere, There is one that estimates the true value by averaging the distortion over time.

JP 2005-183639 A JP 2000-292076 A JP-A-8-239707

  In the thing of the said patent document 1, an auxiliary | assistant lens tube etc. are required, and a number of parts will increase and it will cause complication as an apparatus. In addition, there is a gap between the tip of the auxiliary lens barrel and the high temperature stage. By the way, the positive flame is a phenomenon that occurs when light enters a gas boundary having locally different refractive indexes, and the difference in refractive index of the gas depends on the density and properties of the gas. For this reason, there is a possibility that a hot flame may occur in this gap, and it cannot be said that stable observation is possible.

  In the thing of patent document 2, the ultraviolet illumination which irradiates an ultraviolet-ray is required, and it is necessary to provide the filter etc. for making only an ultraviolet-ray enter into an imaging device. Moreover, in this patent document 2, the partition plate etc. are provided in the conical space formed in a cylinder part so that the influence of the convection at the time of a heating may not be exerted. That is, in Patent Document 2, the influence of fluctuation due to convection in the heating furnace is prevented. Therefore, a water-cooling jacket, a partition plate, or the like that covers the cylinder portion is required, and the entire apparatus cannot be simplified. There are drawbacks.

  Also in Patent Document 3, it is necessary to use a water-cooled jacket, and it is necessary to insert a periscope with a built-in camera into this water-cooled jacket, which makes it impossible to simplify the entire apparatus.

  In the case where the atmosphere of the hot flame portion is replaced by the outside air by blowing, a separate blowing means is required and control of the blow amount, blow timing, etc. is also necessary, and the elimination of fluctuation is not stable. In addition, the positioning correction or the image distortion correction requires a plurality of times of image capturing and a complicated image processing process, which may increase the work time.

  If the true value is estimated by averaging the distortion of the heat flame over time, the heat flame may not be constant. In such a case, if the calculation time (estimation time) is long, it may be possible to estimate the true value, but the work time becomes long as a whole. For this reason, it becomes difficult to adopt for time-constrained die bonders and the like.

  When the lens system is brought into close contact with a high temperature atmosphere, it is necessary to dispose observation means (imaging means) having the lens system directly above the object to be observed. As described above, when the imaging unit is arranged right above the object to be observed, the imaging unit may interfere with the operation (operation) at the time of the operation on the object to be observed (for example, the operation of bonding the chip). There is.

  In view of the above-described problems, the present invention provides a position confirmation device and a die bonder that can obtain an observation image without distortion without being affected by the heat and can perform highly accurate position confirmation.

  The position confirmation apparatus of the present invention is a position confirmation apparatus for observing an observation site in an atmosphere having a refractive index difference from the atmosphere, and has a working opening formed above the observation site, and generation of a hot flame. A non-flame generation path is formed at a position in the vicinity of the work opening that does not restrict the work through the work opening, and an imaging means for photographing an observation site image through the non-heat generation path is provided. Is. Note that the atmosphere having a refractive index difference from the atmosphere is, for example, a high-temperature atmosphere having a higher temperature than the atmosphere.

  According to the position confirmation apparatus of the present invention, since the imaging unit that captures the observation site image through the non-heat generation path is provided, the image captured by the imaging unit is transmitted through the optical path in which no flame is generated. Therefore, distortion can be avoided. In addition, a work opening is formed above the observation site, and work (for example, work for bonding chips, wires, etc.) can be performed through this work opening. A non-flame generation path is provided at a position where the work is not restricted through the work opening, and this work can be performed stably.

  The photographing means includes a lens system and a camera unit, and the non-flame generation path extends in an oblique direction with respect to the observation site on the outer peripheral side of the working opening, and the inside is a projection having an atmosphere having a refractive index difference from the atmosphere. It can be constituted by a cylindrical portion and a lens system of the photographing means attached to the opening of the protruding cylindrical portion.

  The photographing means includes a lens system and a camera unit, and the non-flame generation path extends in an oblique direction with respect to the observation site on the outer peripheral side of the working opening, and the inside is a projection having an atmosphere having a refractive index difference from the atmosphere. It can comprise with a cylinder part and the glass plate attached to the opening part of this protrusion cylinder part.

  The photographing means is preferably arranged so that the lens system, the camera unit, and the observation site are a Shine proof optical system. In the Scheimpflug optical system, the subject surface, the lens main surface, and the image surface intersect at one point. For this reason, even when observing an observation site from an oblique direction, it is possible to perform observation with a focus on the plane as seen in a plan view.

  A plurality of the photographing means may be arranged on the outer peripheral side of the work opening. As described above, in the case of a plurality of arrangements, it is possible to detect a positional shift in the horizontal direction or the vertical direction (vertical direction) of the observation site.

  It is also possible to attach an openable / closable lid member to the working opening. By providing such a lid member, it can be opened only when the working opening is used or when other desired.

  It is also possible to perform positioning and inspection using an image photographed by the photographing means. In this case, it is preferable to photograph one or more images for positioning and one for inspection.

  The die bonder of the present invention is a die bonder for bonding a chip to a work conveyed to a heater rail constituting a heating means and a conveying means, and the inside of the heater rail becomes a high temperature atmosphere that is an atmosphere having a refractive index difference from the atmosphere, A position confirmation device is provided.

  According to the die bonder of the present invention, the image photographed by the photographing means is through an optical path in which no heat is generated, and an island part image and / or a chip image without distortion can be obtained. it can. Further, the chip can be bonded to the bonding portion through the work opening. The non-flame generation path does not regulate the bonding operation.

  In the position confirmation apparatus of the present invention, the image captured by the image capturing means can be prevented from being distorted, and high-accuracy image recognition is possible. In addition, when working through the work opening, the non-flame generation path does not hinder the work, and a stable work can be performed. That is, it is possible to simplify the entire apparatus without the need for a moving mechanism for moving the non-flame generation path or the like. Furthermore, there is no need to correct the influence of the heat, it is excellent in processability, the position recognition process can be performed in a short processing time, and the workability is excellent.

  The non-flame generation path can be composed of the projection cylinder and the lens system of the photographing means, or can be composed of the projection cylinder and the glass plate, and the non-flame generation path is formed at a low cost with a simple structure. In addition, it is possible to form an optical path in which no heat is generated stably.

  If it is provided with a lid member, the work opening is not always open, and an unnecessary outflow of inert gas and hot air from the work opening can be prevented, thereby saving energy. , It is possible to avoid heating to parts that do not require heating.

  It becomes possible to perform positioning and inspection, and the apparatus is excellent in versatility.

  In the die bonder of the present invention, an island portion image and / or a chip image without distortion can be obtained, positioning with high accuracy is possible with respect to the chip, and the chip is placed at a predetermined position in a predetermined posture. Can be bonded. In addition, the chip can be bonded to the bonding part through the working opening, and the non-heat generation path does not restrict (obstruct) this bonding operation, so a moving mechanism is required to move the non-heat generation path. Instead, it is possible to simplify the die bonder. Furthermore, there is no need to correct the influence of the heat, it is excellent in processability, position recognition processing can be performed in a short processing time, and highly accurate bonding in a short time becomes possible.

It is a simplified sectional view of a heater rail of a die bonder using a position confirmation device showing an embodiment of the present invention. It is a cross-sectional view of a heater rail. It is explanatory drawing of a Scheimpflug principle. It is a simplified sectional view of a heater rail of a die bonder using a position confirmation device showing another embodiment of the present invention. It is a simplified diagram showing a bonding process. It is a simplified diagram of a heater rail of a die bonder. It is a simplified diagram of a conventional position confirmation device.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 shows a heater rail 51 of a die bonder using the position confirmation device according to the present invention. This die bonder picks up the chip 53 at the pickup position, and reciprocates between the pickup position and the bonding position so as to bond the chip 53 to the lead frame 52 as the work W heated at the bonding position (not shown). It is equipped with.

  In this case, the chip 53 is bonded to the workpiece W (lead frame 52) conveyed to the heater rail 51 constituting the heating means and the conveying means. As shown in FIG. 2, the heater rail 51 is a hollow rail formed by combining a lower rail 55 and an upper rail 56, and a work conveyance path 57 is formed therein. In this case, the lower rail 55 includes a bottom wall 55 a and a pair of side walls 55 b and 55 b erected from the bottom wall 55 a, and the upper rail 56 has a lid shape that closes the upper opening of the lower rail 55. .

  The work conveyance path 57 is filled with an antioxidant gas such as an inert gas such as nitrogen gas. For example, as shown in the figure, a gas supply path 60 is provided on each of the pair of side walls 55 b and 55 b, and the antioxidant gas is supplied to the work transfer path 57 via the gas supply path 60. A heater 58 is attached to the lower surface of the lower rail 55. For this reason, the inside of the work conveyance path 57 is set to a high temperature atmosphere (for example, about 300 ° C. to 500 ° C.).

  That is, the lead frame 52 is supplied to the work transport path 57, and the lead frame 52 travels on the work transport path 57 in a high temperature atmosphere. In this case, for example, the sheet is conveyed sequentially from the upstream side to the downstream side intermittently via a feeding mechanism having a feeding claw or the like.

  By the way, the heater rail 51 is provided with a window as a work opening 61. That is, the work opening 61 is provided in the upper rail 56, and a collet (not shown) adsorbing the semiconductor chip (die) 53 enters the heater rail 51 through the work opening 61. Then, bonding is performed to the island portion of the lead frame 52 that is transported in the heater rail 51. After bonding, the collet is discharged from the heater rail 51 through the work opening 61.

  Thus, by providing the work opening 61 in the heater rail 51, a positive flame H is generated above the work opening 61. For this reason, in the present invention, the photographing means 70 which is not affected by such a heat flame H is provided.

  The photographing means 70 includes a lens system 71 and a camera unit 72 that is connected to the lens system 71. As the camera unit 72, a camera using an image sensor such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) can be used. The lens system 71, the camera unit 72, and the object (observation site) are arranged so as to be a Scheinproof optical system. Here, in the Scheimpflug optical system, as shown in FIG. 3, the extension line of the object plane 75, the lens principal plane 76 including the principal point of the imaging lens of the lens system 71, and the extension line of the image plane 77 are at one point O. It intersects with. The lens system 71 may be a resin lens system or a glass lens system.

  A pair of protruding cylindrical portions 80a and 80b are provided on the outer peripheral side of the working opening 61, and a photographing means 70 including the lens system 71 and the camera portion 72 is attached to the protruding cylindrical portions 80a and 80b. . The protruding cylinder portions 80a and 80b extend obliquely with respect to the observation site. That is, the protruding cylinder portions 80 a and 80 b are communicated with the work conveyance path 57 of the heater rail 51, and the inside thereof is the same atmosphere as the high temperature atmosphere of the work conveyance path 57. In this case, the protruding cylindrical portions 80a and 80b are arranged so that the center lines L1 and L2 are two-fold symmetrical with respect to the Z axis passing through the center of the observed portion. In addition, it is not always necessary to make it symmetrical twice, and it may be arranged so as to be symmetrical twice or more. Furthermore, it does not need to be symmetric and only has parallax.

  That is, as described above, since the lens system 71 is a Scheimpflug optical system, observation from an oblique direction is performed by setting the observed portion as the subject surface 75 and the imaging device surface of the camera portion 72 as the image plane 77. Even when observing a part, it is possible to observe the observation part as seen in a plan view.

  The lens system 71 of the photographing means 70 is attached to the opening portions of the protruding cylinder portions 80a and 80b, respectively, and the opening portions of the protruding cylinder portions 80a and 80b are sealed by the lens system 71. By the way, the positive flame is a phenomenon that occurs when light enters a boundary between gases having locally different refractive indexes. Since the inside of the protruding cylinder 80a (80b) and the outside air are blocked, the protruding cylinder 80a ( 80b), no flame is generated, and no light is refracted in the projection cylinder 80a (80b). Therefore, the projection cylinder 80a (80b) and the lens system 71 define a non-flame generation path M. Can be configured. In addition, the non-heat generation path M is not provided above the work opening, and the non-heat generation path M does not restrict (obstruct) the bonding operation (action) using the collet.

  For this reason, if this position confirmation apparatus is used, the image image | photographed with the imaging | photography means 70 is via the optical path in which the positive flame has not generate | occur | produced, and it can avoid that distortion arises. Accordingly, the island 54 of the lead frame 52 is used as an observation site, and the position of the island 54 is confirmed without causing distortion by using this position confirmation device in order to supply the chip 53 to the island 54. Can do. Further, if the island portion 54 and the chip 53 supplied to the island portion 54 are used as an observation site, the position of the chip 53 supplied to the island portion 54 can be confirmed.

  As described above, by checking the position of the chip 53 and the island portion 54, if there is a positional shift, the position of the collet side and / or the lead frame 52 side is corrected so that the chip has a proper posture in a proper position. 53 can be bonded to the position to be bonded.

  In the position confirmation device according to the present invention, the image captured by the image capturing means 70 can avoid the occurrence of distortion, and enables highly accurate image recognition. Moreover, the non-flame generation path M does not hinder the work during the work through the work opening 61, and a stable work can be performed. That is, a moving mechanism for moving the non-flame generation path M is not required, and the entire apparatus can be simplified. Furthermore, there is no need to correct the influence of the heat, it is excellent in processability, the position recognition process can be performed in a short processing time, and the workability is excellent.

  Further, as shown in FIG. 1, the protruding cylinder portions 80, 80 extend in an oblique direction with respect to the observation site. In this case, if it is arranged so as to be symmetrical twice with respect to the Z axis passing through the center of the observed part, it is possible to detect a positional deviation in the horizontal direction or the vertical direction (vertical direction) of the observation site. It becomes possible. By setting the symmetry twice or more, detection with higher accuracy becomes possible.

  For this reason, if this position recognition apparatus is used for a die bonder as in this embodiment, an image photographed by the photographing means 70 is through an optical path in which no heat is generated, and distortion may occur. No island image and chip image can be obtained. Further, the chip 53 can be bonded to the bonding portion (island portion 54) through the work opening 61. The non-flame generation path M does not regulate the bonding operation.

  Next, FIG. 4 shows another embodiment. In this embodiment, heat-resistant glass plates 81 and 81 are attached to the opening of the projecting cylinder portion 80a (80b) to form a window portion 82. FIG. In this case, the opening part of the projection cylinder part 80a (80b) is sealed by the glass plates 81,81. For this reason, the non-hot-flame generation path M which prevents generation | occurrence | production of a hot flame can be comprised with the projection cylinder part 80a (80b) and the glass plates 81 and 81. FIG. The glass plate 81 can be made of quartz glass having excellent heat resistance.

  Therefore, even if it is what is shown in this FIG. 4, the image image | photographed with the imaging | photography means 70 can avoid generating distortion, and a highly accurate image recognition is attained. Moreover, the non-flame generation path M does not hinder the work during the work through the work opening 61, and a stable work can be performed.

  In the embodiment shown in FIG. 4, a lid member 85 that closes the work opening 61 is attached. The lid member 85 may be one that swings around one side via a hinge mechanism, one that slides in the horizontal direction, or a bellows-type shutter.

  In this case, it is preferable that the opening and closing of the lid member 85 be interlocked with the operation of the collet. That is, the collet enters the heater rail 51 through the work opening 61, bonds the chip 53, and is discharged from the work opening 61. In other states, the collet is open. It is preferable to set the state.

  If the cover member 85 is provided, the work opening 61 is not always open, and unnecessary outflow of inert gas and hot air from the work opening 61 can be prevented, thereby saving energy. Heating to a part that does not require heating can be avoided.

  Further, the non-flame generation path M can be configured by the protruding cylindrical portion 80a (80b) and the lens system 71 of the photographing means 70, or can be configured by the protruding cylindrical portion 80a (80b) and the glass plate 81, which is simple. With the structure, the non-flame generation path M can be formed at low cost, and an optical path in which no flame is stably generated can be formed.

  Further, in this position confirmation device, it is possible to perform positioning and inspection using an image photographed by the photographing means. If comprised in this way, it will become the thing excellent in versatility as an apparatus. In this case, it is preferable to take one or more images for positioning and one for inspection. Thereby, positioning and inspection can be performed stably.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made. It may be the above. By providing a plurality, the accuracy of position confirmation can be further increased. In addition, the inclination angle of the projection cylinder portion with respect to the observation site can be variously changed depending on the angle formed by the subject surface 75, the lens main plane 76, and the image plane 77 of the Scheinproof to be used.

  The imaging means 70 is not limited to the Schein-proof optical system as long as it can observe an observation site from an oblique direction as long as it can be focused on the plane as seen in a plan view. In the embodiment, the island portion 54 of the lead frame 52 is used as the observation site. However, the position check device can be applied to a place where it is desired to check the position in the atmosphere where the hot flame is generated. That is, the position confirmation device is not limited to the die bonder, and may be used for other devices such as a wire bonder. Note that since an atmosphere having a refractive index difference from air (atmosphere) generates heat, the present invention is not limited to observing an observation site in a high-temperature atmosphere.

  As shown in FIG. 4, when the glass plate 81 is used, in the illustrated example, the lens system 71 of the photographing means 70 is brought into close contact with the glass plate 81, but the glass plate 81 and the lens system 71 are brought into close contact with each other. A gap may be formed without any problem. In other words, even in this gap, there should be no temperature difference or density difference that generates a hot flame.

  Even if the position confirmation device is a die bonder according to the embodiment or a device other than the die bonder, when the lid member 85 is provided, the opening / closing timing of the lid member 85 is not limited to that of the embodiment. It can be set so that it can be opened and closed at a desired timing of the user or the like. Of course, the lid member 85 may also be provided in the heater rail 51 shown in FIG.

  By the way, an opening different from the working opening 61 is formed in the vicinity of the working opening 61, and an observation window portion in which a glass material is fitted is provided in the opening, and the observation window portion is interposed therebetween. Thus, an image can be taken by the photographing means. For this reason, this observation window part can constitute a non-flame generation path M that does not generate a hot flame, and in such a case, the protruding cylinder part 80a (80b) as in the above embodiment does not have to be formed.

51 Heater rail 52 Lead frame 53 Chip 61 Working opening 70 Image taking means 71 Lens system 72 Camera part 80a, 80b Projection cylinder part 81 Glass plate 85 Lid member W Workpiece

Claims (9)

A position confirmation device for observing an observation site in an atmosphere having a refractive index difference from the atmosphere,
A work opening is formed at a position above the observation site, and a non-heat generation path that prevents the generation of heat is formed at a position near the work opening that does not restrict work through the work opening. A position confirmation apparatus comprising imaging means for taking an image of an observation site through the non-hot flame generation path.   The photographing means includes a lens system and a camera unit, and the non-flame generation path extends in an oblique direction with respect to the observation site on the outer peripheral side of the working opening, and the inside is a projection having an atmosphere having a refractive index difference from the atmosphere. 2. The position confirmation apparatus according to claim 1, comprising a cylindrical portion and a lens system of the photographing means attached to the opening of the protruding cylindrical portion.   The photographing means includes a lens system and a camera unit, and the non-flame generation path extends in an oblique direction with respect to the observation site on the outer peripheral side of the working opening, and the inside is a projection having an atmosphere having a refractive index difference from the atmosphere. The position confirmation device according to claim 1, comprising a cylindrical portion and a glass plate attached to an opening of the protruding cylindrical portion.   The position confirmation apparatus according to any one of claims 1 to 3, wherein the photographing unit is arranged such that a lens system, a camera unit, and an observation site are a Shineproof optical system.   5. The position confirmation device according to claim 1, wherein a plurality of the position confirmation devices are arranged on an outer peripheral side of the work opening.   The position confirmation device according to any one of claims 1 to 5, wherein a lid member that can be freely opened and closed is attached to the working opening.   The position confirmation apparatus according to any one of claims 1 to 6, wherein positioning and inspection are performed using an image photographed by the photographing means.   The position confirmation apparatus according to claim 7, wherein at least one image for positioning and one image for inspection are captured.   A die bonder for bonding a chip to a workpiece conveyed to a heater rail that constitutes a heating means and a conveying means, wherein the heater rail has a high temperature atmosphere in which the atmosphere has a refractive index difference from the atmosphere, A die bonder comprising the position confirmation device according to claim 8.

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