JP2016023368A5 - - Google Patents

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JP2016023368A5
JP2016023368A5 JP2014151336A JP2014151336A JP2016023368A5 JP 2016023368 A5 JP2016023368 A5 JP 2016023368A5 JP 2014151336 A JP2014151336 A JP 2014151336A JP 2014151336 A JP2014151336 A JP 2014151336A JP 2016023368 A5 JP2016023368 A5 JP 2016023368A5
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alloy powder
atomic concentration
elements
range
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JP2014151336A
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JP2016023368A (en
JP6388278B2 (en
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Priority to PCT/JP2015/070465 priority patent/WO2016013492A1/en
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Claims (7)

Al、Co、Cr、Fe及びNiの5種の元素を含有し、
不可避的不純物として、Pを0.005wt%以下、Siを0.040wt%以下、Sを0.002wt%以下、Snを0.005wt%以下、Sbを0.002wt%以下、Asを0.005wt%以下、Mnを0.050wt%以下、Oを0.001wt%以下、Nを0.002wt%以下の原子濃度の範囲で含有することを特徴とする溶融積層造形に用いる合金粉末。
Containing five elements of Al, Co, Cr, Fe and Ni ,
As inevitable impurities, P is 0.005 wt% or less, Si is 0.040 wt% or less, S is 0.002 wt% or less, Sn is 0.005 wt% or less, Sb is 0.002 wt% or less, and As is 0.005 wt%. An alloy powder for use in melt lamination modeling, comprising:% or less, Mn 0.055 wt% or less, O 0.001 wt% or less, and N 0.0025 wt% or less.
前記不可避的不純物として、Pを0.002wt%以上0.005wt%以下、Siを0.010wt%以上0.040wt%以下、Sを0.001wt%以上0.002wt%以下、Snを0.002wt%以上0.005wt%以下、Sbを0.001wt%以上0.002wt%以下、Asを0.001wt%以上0.005wt%以下、Mnを0.020wt%以上0.050wt%以下、Oを0.0003wt%以上0.001wt%以下、Nを0.001wt%以上0.002wt%以下の原子濃度の範囲で含有することを特徴とする請求項1に記載の溶融積層造形に用いる合金粉末。   As the inevitable impurities, P is 0.002 wt% or more and 0.005 wt% or less, Si is 0.010 wt% or more and 0.040 wt% or less, S is 0.001 wt% or more and 0.002 wt% or less, and Sn is 0.002 wt%. % To 0.005 wt%, Sb from 0.001 wt% to 0.002 wt%, As from 0.001 wt% to 0.005 wt%, Mn from 0.020 wt% to 0.050 wt%, and O to 0 2. The alloy powder for use in melt lamination modeling according to claim 1, wherein the alloy powder contains .0003 wt% or more and 0.001 wt% or less and N in an atomic concentration range of 0.001 wt% or more and 0.002 wt% or less. 前記不可避的不純物として、Pを0.002wt%以下、Siを0.005wt%以下、Sを0.001wt%以下、Snを0.002wt%以下、Sbを0.001wt%以下、Asを0.001wt%以下、Mnを0.005wt%以下、Oを0.0003wt%以下、Nを0.001wt%以下の原子濃度の範囲で含有することを特徴とする請求項1に記載の溶融積層造形に用いる合金粉末。   As the inevitable impurities, P is 0.002 wt% or less, Si is 0.005 wt% or less, S is 0.001 wt% or less, Sn is 0.002 wt% or less, Sb is 0.001 wt% or less, and As is 0.00. 2. The melt additive manufacturing according to claim 1, wherein 001 wt% or less, Mn is 0.005 wt% or less, O is 0.0003 wt% or less, and N is 0.001 wt% or less in the atomic concentration range. Alloy powder to be used. 前記合金粉末の粒子径分布が1μm以上500μm以下の範囲にあることを特徴とする請求項1に記載の溶融積層造形に用いる合金粉末。   2. The alloy powder used for melt lamination modeling according to claim 1, wherein a particle size distribution of the alloy powder is in a range of 1 μm to 500 μm. 前記5種の元素をそれぞれ5at%以上30at%以下の原子濃度の範囲で含有することを特徴とする請求項1に記載の合金粉末。2. The alloy powder according to claim 1, wherein each of the five elements is contained in an atomic concentration range of 5 at% to 30 at%. 前記5種の元素のうち少なくとも4種の元素の原子濃度の差が3at%未満の範囲にあることを特徴とする請求項6に記載の合金粉末。The alloy powder according to claim 6, wherein the difference in atomic concentration of at least four elements among the five elements is in a range of less than 3 at%. 前記5種の元素のうちの少なくとも4種の元素を、15at%以上23.75at%以下の原子濃度の範囲で含有し、他の1種の元素を、5at%以上30at%以下の原子濃度の範囲で含有することを特徴とする請求項1に記載の合金粉末。Containing at least four of the five elements in an atomic concentration range of 15 at% to 23.75 at%, and the other one element having an atomic concentration of 5 at% to 30 at% The alloy powder according to claim 1, wherein the alloy powder is contained in a range.
JP2014151336A 2014-07-23 2014-07-25 Alloy powder used for melt lamination molding Active JP6388278B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014151336A JP6388278B2 (en) 2014-07-25 2014-07-25 Alloy powder used for melt lamination molding
PCT/JP2015/070465 WO2016013492A1 (en) 2014-07-23 2015-07-17 Alloy powder used in fused deposition modeling

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Application Number Priority Date Filing Date Title
JP2014151336A JP6388278B2 (en) 2014-07-25 2014-07-25 Alloy powder used for melt lamination molding

Publications (3)

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JP2016023368A JP2016023368A (en) 2016-02-08
JP2016023368A5 true JP2016023368A5 (en) 2017-07-20
JP6388278B2 JP6388278B2 (en) 2018-09-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114682800B (en) * 2022-05-31 2022-09-06 太原理工大学 Method for manufacturing eutectic high-entropy alloy plate by ultrasonic rolling surface strengthening laser additive
CN117230336B (en) * 2023-09-19 2024-05-03 上海大学 Method for preparing high-entropy alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4190720B2 (en) * 2000-11-29 2008-12-03 國立清華大學 Multi-component alloy
JP6132523B2 (en) * 2012-11-29 2017-05-24 キヤノン株式会社 Metal powder for metal stereolithography, manufacturing method of three-dimensional structure, and manufacturing method of molded product

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