JP2016020069A - Printer, and method for recovering solder from printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printer capable of suppressing workload of an operator to recover residual solder.SOLUTION: A printer 100 includes a squeegee 21 which contains a contact part 21a and moves in a print direction Y to print a solder on a mask M on a substrate CB, a cleaner unit 4 which contains a contact surface 42a and can move in the print direction Y, and a control section 5 for controlling movement of the squeegee 21 and movement of the cleaner unit 4. The control section 5 performs a solder recovering action in which the squeegee 21 and the cleaner unit 4 are moved in the print direction Y in a state of sandwiching the mask M from the upper side and the lower side with the contact part 21a and the contact surface 42a.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a printing apparatus and a solder collection method for the printing apparatus, and more particularly to a printing apparatus including a squeegee for printing solder on a substrate and a solder collection method for the printing apparatus.

  Conventionally, a printing apparatus provided with a squeegee for printing solder on a substrate is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a printing apparatus that prints paste solder supplied onto a mask on a substrate by moving (sliding) a squeegee that is in contact with the mask in which an opening is formed in the printing direction. ing. During printing, the substrate is held in contact with the lower surface of the mask. By moving the squeegee in the printing direction, the solder on the mask is filled in the opening and transferred to the substrate, and excess solder is scraped off. The width dimension perpendicular to the printing direction of the contact portion (tip portion) of the squeegee is designed to be larger than the dimension in the width direction of the substrate so that it can cope with various sizes of the substrate.

JP2013-43362A

  In such a printing apparatus, in order to bring the squeegee and the substrate into close contact with the mask, the squeegee presses the upper surface of the mask downward in a state where the mask is bent slightly so as to be pushed up by the substrate. The pressure is supported by the substrate. In this case, a gap is likely to be formed between the mask and the squeegee in the range between the width direction end of the substrate and the width direction end of the squeegee (outside the printing area). Therefore, when the printing operation is executed, a line-shaped residual solder is formed on the mask at a position near the end in the width direction of the squeegee so as to follow the printing direction. Since this residual solder cannot be scraped off by a normal printing operation, it remains on the mask.

  Conventionally, the residual solder has been collected from the mask by an operator's manual work when the mask is replaced. Therefore, conventionally, there is a problem that an operator's work load increases in order to collect residual solder that remains without being scraped on the mask.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a printing apparatus and printing capable of suppressing an operator's work burden for collecting residual solder. An object of the present invention is to provide a solder recovery method for an apparatus.

  To achieve the above object, a printing apparatus according to a first aspect of the present invention includes a first abutting portion that abuts from above on a mask having an opening portion of a printed pattern on a substrate, and moves in a predetermined printing direction. A squeegee for printing the solder on the mask on the substrate, and a second abutting portion that abuts the mask from the lower side at least at an end position in the width direction that intersects the printing direction of the first abutting portion, and the printing direction And a control unit that controls movement of the squeegee and movement of the lower surface support unit, and the control unit applies the mask at a predetermined timing other than during a solder printing operation on the board. The solder collecting operation is performed to move the squeegee and the lower surface support portion in the printing direction while being sandwiched between the first contact portion and the second contact portion.

  As described above, the printing apparatus according to the first aspect of the present invention includes the second contact portion that contacts the mask from the lower side at least at the end position in the width direction that intersects the printing direction of the first contact portion. The lower surface support portion configured to be movable in the printing direction is provided, and the mask is sandwiched between the first contact portion and the second contact portion at a predetermined timing other than during the solder printing operation on the substrate. The control unit is configured to execute a solder recovery operation for moving the squeegee and the lower surface support unit in the printing direction. As a result, the solder on the mask is scraped in a state where the first contact portion and the mask are in close contact with each other without forming a gap between the widthwise end portion of the squeegee (first contact portion) and the mask. It can be performed. As a result, in the solder recovery operation, the residual solder formed in the vicinity of the edge of the squeegee can be scraped off on the mask without the operator's manual work, so the operator's work load for recovering the residual solder is reduced. Can be suppressed. In addition, if the timing of performing the solder recovery operation is set to the timing before the residual solder is cured after the printing operation, the residual solder can be recovered and merged into the solder pool before the residual solder is cured. The solder is agitated by the next printing operation, and as a result, hardening of the residual solder (that is, reduction in reusability) can be suppressed.

  In the printing apparatus according to the first aspect, preferably, the second contact portion has a length equal to or greater than the length of the first contact portion in the width direction. If comprised in this way, a mask and a 1st contact part can be closely_contact | adhered over the full length of the width direction of a 1st contact part at the time of solder collection | recovery operation | movement. Thus, the residual solder on the mask can be reliably recovered and joined to the solder pool by one solder recovery operation.

  In the printing apparatus according to the first aspect, the control unit preferably prints the squeegee in the previous printing operation with respect to the printing direction residual solder remaining on the mask and extending in the printing direction in the solder recovery operation. The solder recovery operation is performed by the first contact portion and the second contact portion from the recovery start position located on the outer side in the opposite direction to the end portion of the solder in the printing direction opposite to the printing direction. Yes. If comprised in this way, it can eliminate that a solder is filled with the opening part of a printing pattern with a squeegee at the time of solder collection | recovery operation | movement.

  In the printing apparatus according to the first aspect, preferably, the lower surface support portion includes a cleaning head that contacts the lower surface of the mask and cleans the mask, and is a cleaner unit configured to be movable along the printing direction. The second contact portion is provided on the cleaning head. If comprised in this way, it will become possible to implement the solder collection | recovery operation | movement which collect | recovers the residual solder on a mask using the cleaner unit provided for the cleaning of the lower surface and opening part of a mask. As a result, the solder recovery operation can be performed without separately providing a dedicated lower surface support portion. Further, since the cleaning head for cleaning is brought into contact with the lower surface of the mask, the solder adhered to the first contact portion of the squeegee passes through the opening of the mask during the solder recovery operation (drops from the opening). In this case, the solder can be removed by the cleaning head.

  In this case, preferably, the cleaner unit is provided on the cleaning head, and has a breathable cleaning sheet that contacts the lower surface of the mask and wipes the lower surface of the mask, and applies a negative pressure to the lower surface of the mask via the cleaning sheet. And a suction hole for acting. If comprised in this way, the solder which entered the opening part of the mask can be more reliably removed by the cleaning head at the time of the solder recovery operation.

  In this case, it is preferable that the control unit cleans the cleaner in a state where the squeegee is separated from the mask and the cleaning head is in contact with the lower surface of the mask after the solder recovery operation by the squeegee and the cleaner unit and before the solder printing operation. A mask cleaning operation for moving the unit in the printing direction is performed. If comprised in this way, even when the solder adhering to the 1st contact part of a squeegee will enter in the opening part of a mask in the case of a solder collection | recovery operation | movement, it can remove reliably the solder which entered into the opening part it can.

  In the printing apparatus according to the first aspect, preferably, the lower surface support portion includes a clamp member that holds a side end surface of the substrate, and is a substrate table configured to be movable in the printing direction, and the second contact portion. Is provided on the clamp member. If comprised in this way, it will become possible to implement the solder collection | recovery operation | movement which collect | recovers the residual solder on a mask using the board | substrate table which hold | maintains a board | substrate at the time of printing operation. As a result, the solder recovery operation can be performed without separately providing a dedicated lower surface support portion.

  In this case, it is preferable that the cleaning unit further includes a cleaning head configured to come into contact with the lower surface of the mask and clean the lower surface of the mask, and to be movable along the printing direction, and the control unit includes the squeegee and the clamp member. After performing the solder recovery operation by, before the solder printing operation, perform the mask cleaning operation to move the cleaner unit in the printing direction with the squeegee separated from the mask and the cleaning head in contact with the lower surface of the mask It is configured. If comprised in this way, even if a solder will enter into the opening part of a mask during solder collection | recovery operation | movement, this solder can be more reliably removed before the next printing operation | movement.

  According to a second aspect of the present invention, there is provided a solder recovery method for a printing apparatus, wherein a solder is collected at a predetermined timing other than during a solder printing operation on a board in a printing apparatus that prints solder on the board using a mask having an opening of a print pattern. A method of contacting a first contact portion of a squeegee from above a mask having an opening portion of a printed pattern on a substrate, and an end in a width direction intersecting at least the printing direction of the first contact portion The squeegee and the lower surface in a state where the second contact portion of the lower surface support portion is contacted from the lower side of the mask at the position of the mask, and the mask is vertically sandwiched between the first contact portion and the second contact portion. Moving the support portion in the printing direction.

  In the solder collecting method for a printing apparatus according to the second aspect of the present invention, as described above, at least at the end position in the width direction intersecting the printing direction of the first abutting portion, There are provided a step of contacting the second contact portion, and a step of moving the squeegee and the lower surface support portion in the printing direction with the mask sandwiched between the first contact portion and the second contact portion. As a result, the residual solder formed in the vicinity of the end of the squeegee can be scraped off while the widthwise end of the squeegee (first contact portion) is in close contact with the mask, and the residual solder is recovered. Therefore, the work burden on the operator can be suppressed. In addition, if the timing of performing the solder recovery method is set to the timing before the residual solder is cured after the printing operation, the residual solder can be recovered and merged into the solder pool before the residual solder is cured. The solder is agitated by the next printing operation, and as a result, hardening of the residual solder (that is, reduction in reusability) can be suppressed.

  According to the present invention, as described above, an operator's work burden for recovering residual solder can be suppressed.

It is the schematic diagram which showed the whole structure of the printing apparatus by 1st and 2nd embodiment of this invention. FIG. 3 is a schematic plan view showing a mask, a squeegee, and a cleaning head of the printing apparatus according to the first embodiment of the present invention. It is the typical perspective view which showed the cleaner unit of the printing apparatus by 1st Embodiment of this invention. FIG. 6A is a diagram illustrating a first stage (plate matching) of a printing operation of the printing apparatus. FIG. 6B is a diagram illustrating a second stage (squeezing) of the printing operation. (C) is a diagram for explaining a third stage (separation) of the printing operation. It is the schematic diagram which looked at the squeegee in printing operation from the printing direction. (A) is a figure explaining the 1st step (movement to a collection start position) of solder collection operation of a printing device. (B) is a figure explaining the 2nd step (clamping of a mask) of solder recovery operation. (C) is a figure explaining the 3rd step (synchronous movement) of solder recovery operation. It is the schematic diagram which looked at the squeegee in solder recovery operation from the printing direction. (A) is a figure explaining the 1st step (movement to a cleaning start position) of the mask cleaning operation | movement of a printing apparatus. (B) is a figure explaining the 2nd step (raising of a cleaning head) of mask cleaning operation. (C) is a figure explaining the 3rd step (movement) of mask cleaning operation. FIG. 3 is a flowchart illustrating operation control of the printing apparatus according to the first embodiment of the present invention. FIG. 10 is a flowchart showing operation control (subroutine) of the solder recovery operation of FIG. 9. (A) is a figure explaining the 1st step of the solder recovery operation | movement of the printing apparatus by 2nd Embodiment of this invention. (B) is a figure explaining the 2nd step of solder recovery operation. (C) is a figure explaining the 3rd step of solder recovery operation. It is the schematic diagram which looked at the squeegee in the solder collection | recovery operation | movement of the printing apparatus by 2nd Embodiment from the printing direction.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the configuration of the printing apparatus 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  The printing apparatus 100 according to the first embodiment uses the solder M on the surface of the substrate CB using the mask M in which the paste Ap is used as a printing (coating) material and the opening Ap (see FIG. 2) is formed with a predetermined printing pattern. This is a device for screen printing Sp. The opening Ap is formed corresponding to the circuit pattern formed on the substrate CB.

  As shown in FIG. 1, the printing apparatus 100 includes a base 1, a squeegee unit 2 including a squeegee 21, and a substrate table 3. The squeegee unit 2 and the substrate table 3 are disposed on the base 1. A cleaner unit 4 is provided on the substrate table 3. The squeegee unit 2 performs a printing operation by moving the squeegee 21 in the Y direction. The Y direction is an example of the “printing direction” in the present invention. Also, as shown in FIG. 2, the X direction that intersects (orthogonally) the Y direction is referred to as the width direction. The Z direction (see FIG. 1) is the vertical direction of the printing apparatus 100.

  The printing apparatus 100 includes a control unit 5 that controls the movement of the squeegee 21 and the movement of the cleaner unit 4 as shown in FIG. In the first embodiment, the solder recovery operation is executed by the squeegee 21 and the cleaner unit 4 of the squeegee unit 2. The cleaner unit 4 is an example of the “lower surface support portion” in the present invention.

  As shown in FIG. 2, the mask M includes a printing area in which an opening Ap having a predetermined pattern is provided and a non-printing area in which no opening is provided. The mask M has a rectangular shape in plan view, and the outer peripheral portion is attached to the frame 6. The printing apparatus 100 holds the frame 6 by a mask holding unit (not shown).

  The squeegee unit 2 is arranged above the mask M as shown in FIG. The squeegee unit 2 includes a squeegee 21, a squeegee Y-axis drive mechanism 22, a squeegee Z-axis drive mechanism 23, a squeegee R-axis drive mechanism 24, and a solder supply unit 25.

  The squeegee 21 includes an abutting portion 21a that abuts on the mask M from above, and is configured to move in a predetermined printing direction Y and print the solder Sp on the mask M on the substrate CB. Further, as shown in FIG. 2, the squeegee 21 is formed so as to extend in the X direction. The contact portion 21a has a length L1 in the width direction (X direction). The length L1 is formed to be larger than the width dimension W (dimension in the X direction) of the substrate CB. The contact portion 21a is an example of the “first contact portion” in the present invention.

  As shown in FIG. 1, the squeegee Y-axis drive mechanism 22 includes a Y-axis motor 22a, a ball screw 22b, a ball nut 22c, and a Y-axis rail (not shown). When the Y-axis motor 22a rotates the ball screw 22b and moves the ball nut 22c fixed to the squeegee unit 2, the squeegee unit 2 (squeegee 21) is moved in the Y direction along the Y-axis rail. The squeegee Z-axis drive mechanism 23 is configured to raise and lower the squeegee R-axis drive mechanism 24 and the squeegee 21 in the Z direction. The squeegee R-axis drive mechanism 24 is configured to rotate the squeegee 21 about the X axis. The solder supply unit 25 is disposed above the mask M and has a function of supplying the solder Sp onto the upper surface of the mask M.

  The squeegee 21 moves in the printing direction (Y direction) while applying a predetermined printing pressure (load) from the upper side (Z1 direction side) to the mask M, so that printing is performed while rolling (rotating) the solder Sp. It is configured. The squeegee unit 2 moves the squeegee 21 along the upper surface of the mask M by reciprocating in the front-rear direction (Y direction). The squeegee 21 is rotated by the squeegee R-axis drive mechanism 24 so as to face in opposite directions during the forward printing and the backward printing.

  The substrate table 3 is disposed at a position below the mask M (Z2 side position), and is configured to reciprocate in the Y direction on the base 1. The substrate table 3 performs an operation of transporting and holding the substrate CB to a predetermined printing position and an operation of unloading the printed substrate CB.

  The substrate table 3 includes a base plate 3a, a pair of conveyors 31, a clamp member (clamp plate) 32, a Y-axis moving mechanism 33, a Z-axis moving mechanism 34, an X-axis moving mechanism and an R-axis moving mechanism (not shown). Is included. Further, a cleaner unit 4 is provided on the base plate 3a.

  The pair of conveyors 31 has a function of carrying an unprinted substrate CB from the upstream device, transporting the substrate CB to a predetermined printing position, and carrying the printed substrate CB to the downstream device. . The pair of conveyors 31 are arranged in parallel to each other at a predetermined distance in the Y direction. The pair of conveyors 31 are provided so as to extend along the conveyance direction (X direction) of the substrate CB. In addition, the pair of conveyors 31 are configured to convey while supporting both edges in the Y direction of the substrate CB from the lower surface side. The pair of conveyors 31 is configured so that the interval in the Y direction can be adjusted in accordance with the width (dimension in the Y direction) of the substrate CB to be conveyed.

  A pair of clamp members 32 are provided so as to be adjacent to the upper side of the pair of conveyors 31 and have a function of holding the side end surface of the substrate CB. Specifically, each clamp member 32 is provided so as to extend linearly in the transport direction (X direction) of the substrate CB. The pair of clamp members 32 are arranged at a predetermined interval in the Y direction so as to sandwich the substrate CB, and are configured to reciprocate in the Y direction by a drive mechanism (such as an air cylinder) not shown. . Accordingly, the clamp member 32 is configured to be fixed (held) by sandwiching (clamping) the side end surface in the Y direction of the substrate CB from both sides at a predetermined printing position below the mask M.

  The Y-axis moving mechanism 33 includes a Y-axis motor 33a, a ball screw 33b, a ball nut 33c, and a Y-axis rail 33d. The Y-axis motor 33a rotates the ball screw 33b and moves the ball nut 33c fixed to the base plate 3a of the substrate table 3, whereby the base plate 3a (substrate table 3) is moved in the Y direction along the Y-axis rail 33d. The

  An X-axis moving mechanism is disposed above the base plate 3a, an R-axis moving mechanism is disposed above the X-axis moving mechanism, and a Z-axis moving mechanism 34 is disposed above the R-axis moving mechanism. The Z-axis moving mechanism 34 includes a Z-axis table 34a, four ball screws 34b, four ball nuts 34c, and a Z-axis motor (not shown). The Z-axis table 34 a is disposed above the substrate table 3. When the Z-axis motor rotates each ball screw 34b and moves each ball nut 34c fixed to the Z-axis table 34a, the Z-axis table 34a is moved (lifted) in the Z direction. On the Z-axis table 34a, a substrate elevating part 35 and a pair of bracket members 3b are provided, and a conveyor 31 and a clamp member 32 are provided on each upper portion of the bracket members 3b.

  The substrate raising / lowering unit 35 is disposed at a position in the Y direction between the pair of conveyors 31 and is configured to move (elevate) the support plate 35a in the Z direction. A plurality of backup pins 35b (see FIG. 4, omitted in FIG. 1) are arranged on the support plate 35a. The substrate elevating unit 35 supports the substrate CB by the backup pins 35b.

  An X-axis movement mechanism (not shown) has a function of moving the substrate CB in the X direction, and an R-axis movement mechanism (not shown) has a function of rotating the substrate CB in the horizontal plane (in the XY plane). While the relative position (position and inclination in the horizontal plane) of the substrate CB with respect to the mask M is accurately positioned by the X-axis moving mechanism, the Y-axis moving mechanism 33, and the R-axis moving mechanism, the substrate is moved by the Z-axis moving mechanism 34. CB is brought into contact with the lower surface of the mask M.

  The cleaner unit 4 is configured to clean the mask M by removing the solder attached to the mask M during board printing. The cleaner unit 4 is disposed on the base plate 3a, and moves in the Y direction together with the substrate table 3 as the base plate 3a moves in the Y direction. As shown in FIG. 3, the cleaner unit 4 includes a sheet supply unit 41, a cleaning head 42, and a sheet collection unit 43.

  The sheet supply unit 41 holds an unused cleaning sheet Cs wound around a shaft portion extending in the X direction. The cleaning sheet Cs passes through the plurality of guide rollers from the sheet supply unit 41 so as to cover the upper surface of the cleaning head 42 and is then guided to the sheet collection unit 43. The cleaning sheet Cs is composed of a cloth material having flexibility and air permeability. In addition, you may use the cleaning sheet comprised by materials other than cloth materials, such as paper material and leather.

  The cleaning head 42 is configured such that the contact surface 42a, which is the upper surface, contacts the lower surface of the mask M (contacts via the cleaning sheet Cs) to clean the mask M. The cleaning head 42 is configured to be movable up and down in the vertical direction (Z direction) by an elevating drive source 42b. The cleaning head 42 is configured to bring the contact surface 42 a into contact with the lower surface of the mask M through the cleaning sheet Cs by moving upward when cleaning the mask M. The contact surface 42a is an example of the “second contact portion” in the present invention.

  Here, in the first embodiment, as shown in FIG. 2, the contact surface 42 a is configured to be able to contact the mask M from below at least at the end position in the width direction X of the contact portion 21 a of the squeegee 21. Has been. In the first embodiment, the contact surface 42a is formed in the width direction X so as to have a length L2 that is greater than the length L1 of the contact portion 21a of the squeegee 21. Therefore, in the first embodiment, the contact surface 42a is not limited to the position of the end portion of the contact portion 21a of the squeegee 21 in the X direction, but the lower surface of the mask M within the range of the entire width of the contact portion 21a in the X direction. It is comprised so that contact | abutting is possible. Further, the contact surface 42a is formed in a flat surface shape and is formed in a rectangular shape in plan view. The contact surface 42a has a length L3 in the Y direction.

  As shown in FIG. 3, a plurality of suction holes 42 c communicating with a suction unit (not shown) are arranged on the contact surface 42 a of the cleaning head 42 along the X direction. A negative pressure is supplied to the suction hole 42c from the suction unit. As a result, the cleaning head 42 is configured to stick out to the cleaning sheet Cs by sucking the solder wiped off by the cleaning sheet Cs by sticking to the lower surface of the mask M protruding from the opening Ap of the mask M. Yes. The sucked solder is held in a gap portion of the fiber that becomes a ventilation path of the cleaning sheet Cs.

  The sheet collecting unit 43 is configured to wind up the used cleaning sheet Cs by rotating a shaft portion extending in the X direction.

  As shown in FIG. 1, the substrate table 3 is provided with a mask camera 36 that images a mark (not shown) attached to the lower surface of the mask M from the lower surface side. A substrate camera 7 is provided at a predetermined position above the substrate table 3 to image a mark (not shown) attached to the substrate CB. The position of the mask M is recognized from the image captured by the mask camera 36. The position of the substrate CB relative to the substrate table 3 is recognized from the captured image of the substrate camera 7. Based on the recognized mask position and substrate position, the position of the substrate table 3 in the Y direction and the position of the Z-axis table 34a in the X direction and the R direction are respectively corrected, so that the substrate CB and the mask M are aligned. The position correction of the substrate CB at the time of alignment is performed. Thereby, the relative position between the position of the opening Ap of the mask M and the position of the substrate CB in the horizontal plane (XY plane) is accurately determined.

  The control unit 5 includes a computer including a CPU 51, a memory (not shown), a storage unit 52, and the like, and has a function of controlling each unit based on a print program stored in the storage unit 52. The control unit 5 is configured to control operations of the squeegee unit 2, each part of the substrate table 3, the cleaner unit 4, and the like. Thereby, the control unit 5 performs control for executing the solder printing operation of the printing apparatus 100, the mask cleaning operation by the cleaner unit 4, and the solder recovery operation by the squeegee 21 and the cleaner unit 4.

  Here, in the first embodiment, the controller 5 causes the mask M to contact the contact portion 21a (squeegee 21) and the contact surface 42a (cleaning head 42) at a predetermined timing other than during the solder printing operation on the substrate CB. In this state, the solder collecting operation for moving the squeegee 21 and the cleaner unit 4 in the printing direction Y is performed. In addition, the controller 5 separates the squeegee 21 from the mask M and causes the cleaning head 42 to contact the lower surface of the mask M after the solder recovery operation by the squeegee 21 and the cleaner unit 4 and before the solder printing operation. Thus, the mask cleaning operation for moving the cleaner unit 4 in the printing direction Y is executed.

  Next, a printing operation, a solder recovery operation, and a mask cleaning operation will be described.

  In the printing operation, first, as shown in FIG. 4A, plate alignment of the substrate CB before printing is performed. That is, the substrate CB is clamped (fixed) by the clamp member 32, and the substrate CB is predetermined by the Z-axis moving mechanism 34 in a state where the relative position (position and inclination in the horizontal plane) of the substrate CB with respect to the mask M is accurately positioned. To the printing position (Z-axis position). Further, the lower surface of the substrate CB is supported by the backup pins 35b. As a result, the substrate CB is held in contact with the lower surface of the mask M. In order to ensure that the substrate CB is in close contact with the mask M, at the printing position, the substrate CB pushes the mask M upward and is bent.

  Next, as shown in FIG. 4B, scraping (squeezing) by the squeegee 21 is performed. First, the squeegee unit 2 moves and the squeegee 21 is positioned at a predetermined print start position (Y-axis position). The squeegee Z-axis drive mechanism 23 lowers the squeegee 21 so that the contact portion 21 a of the squeegee 21 contacts the upper surface of the mask M. At this time, a predetermined printing pressure load is applied to the substrate CB side (downward) by the squeegee 21. The squeegee unit 2 moves in the Y direction with the contact portion 21 a in contact with the mask M, and slides the squeegee 21 along the upper surface of the mask M to the print end position. As a result, while the solder Sp on the mask M is scratched by the squeegee 21 and moves (rolls) on the mask M to the printing end position, the solder is filled into the opening Ap of the mask M.

  At the time of this scraping, as shown in FIG. 5, a gap is formed between the mask M and the squeegee 21 in a region between both ends of the substrate CB in the X direction and both ends of the squeegee 21. As a result, the residual solder Sp1 shown in FIG. The residual solder Sp1 is formed in a straight line along the edge in the width direction of the substrate CB on both sides in the width direction X of the position where the substrate CB is disposed (printing area of the mask M). On the other hand, most of the solder Sp on the mask M is carried to the printing end position to form a solder pool Sp2. In FIG. 2, the residual solder Sp1 and the solder pool Sp2 are illustrated with different hatchings. The residual solder Sp1 is an example of the “printing direction residual solder” in the present invention.

  When the scraping is completed, as shown in FIG. 4C, the printing plate CB is released. That is, the substrate CB is lowered by the Z-axis moving mechanism 34. As a result, the solder filled in the opening Ap of the mask M remains (transferred) on the substrate CB side, and a printed pattern of solder corresponding to the pattern of the opening Ap of the mask M is formed on the substrate CB. Thereafter, the clamp of the clamp member 32 is released, the backup pin 35b is separated from the substrate CB, and the substrate CB is again supported by the pair of conveyors 31.

  The printing operation is completed by releasing the plate. The printed circuit board CB is carried out by the conveyor 31. The printing operation on the next substrate CB is basically the same except that the scraping direction is reversed. That is, the squeegee 21 is rotated in the reverse direction by the squeegee R-axis drive mechanism 24 after the next substrate CB is aligned. Then, scraping (squeezing) is performed in the reverse direction in the Y direction, and the printing operation is completed by releasing the plate. The printed circuit board CB is carried out by the conveyor 31. If printing from the Y2 direction side to the Y1 direction side is forward printing, and printing from the Y1 direction side to the Y2 direction side is returning printing, the forward printing and the backward printing are alternately repeated, whereby the number of substrates CB to be produced is printed. The printing operation is performed.

  Next, the solder recovery operation will be described. As shown in FIG. 2, when a printing operation is performed, residual solder Sp <b> 1 is generated on both sides in the width direction X of the position where the substrate CB is disposed (printing area of the mask M) on the upper surface of the mask M. The solder recovery operation is an operation of scraping off the residual solder Sp1 and joining it to the solder pool Sp2 for printing.

  In the solder recovery operation, first, as shown in FIG. 6A, the cleaner unit 4 and the squeegee 21 are moved to a predetermined recovery start position (Y-axis position). That is, the substrate table 3 moves in the Y direction, and the cleaner unit 4 is positioned at the collection start position. Further, the squeegee unit 2 moves and the squeegee 21 is positioned at the same recovery start position as the cleaner unit 4. The collection start position is a position on the outer side in the Y direction with respect to the formation range of the residual solder Sp1, and is an outer position on the opposite side in the Y direction with respect to the solder pool Sp2. More specifically, with respect to the residual solder Sp1 remaining on the mask M and extending in the printing direction, the collection start position is the residual solder Sp1 on the opposite side to the printing direction of the squeegee 21 in the immediately preceding printing operation. It is a position outside the end in the opposite direction. In the example of FIG. 6A, since the immediately preceding printing operation is forward printing from the Y2 direction side to the Y1 direction side (the solder pool Sp2 is located on the Y1 side), the recovery start position is the Y2 direction of the residual solder Sp1. It is a position on the outer side in the Y2 direction from the side end. As a result, at the same position in the Y direction, the cleaning head 42 and the squeegee 21 are arranged vertically. The side opposite to the Y direction with respect to the solder pool Sp2 is an example of the “direction opposite to the printing direction of the squeegee in the immediately preceding printing operation” of the present invention.

  Next, as shown in FIG. 6B, the mask M is sandwiched between the contact portion 21 a of the squeegee 21 and the contact surface 42 a of the cleaning head 42. Specifically, first, the cleaning head 42 of the cleaner unit 4 is raised by the elevating drive source 42b. Thereby, the contact surface 42a of the cleaning head 42 contacts (adheres) to the lower surface of the mask M via the cleaning sheet Cs. Subsequently, the squeegee 21 is lowered by the squeegee Z-axis drive mechanism 23. Thereby, the contact part 21a of the squeegee 21 contacts the upper surface of the mask M, and a predetermined load in the downward direction of the contact part 21a is applied to the contact surface 42a of the cleaning head 42 via the mask M and the cleaning sheet Cs. Supported by As a result, the contact portion 21a of the squeegee 21 and the contact surface 42a of the cleaning head 42 are in close contact with the mask M so as to sandwich the mask M from above and below. The contact surface 42a of the cleaning head 42 is in close contact with the cleaning sheet Cs.

  Here, as shown in FIG. 2, the length L2 of the cleaning head 42 (contact surface 42a) in the width direction X is larger than the length L1 of the squeegee 21 (contact portion 21a). For this reason, as shown in FIG. 7, in the case of the solder recovery operation in which the lower surface side of the mask M is supported by the cleaning head 42 (contact surface 42a), unlike the printing operation, the squeegee 21 and the mask over the entire width of the squeegee 21. M can be adhered. That is, no gap is formed between the mask M and the squeegee 21.

  Next, as shown in FIG. 6C, scraping (squeezing) is performed by synchronous movement of the squeegee 21 and the cleaner unit 4. That is, the squeegee unit 2 and the substrate table 3 move in synchronization with the Y direction in a state where the mask M is sandwiched between the contact portion 21a (squeegee 21) and the contact surface 42a (cleaning head 42). More specifically, the squeegee 21 and the cleaner unit 4 are moved in the Y direction at the same speed while maintaining the relative positional relationship from the recovery start position to the recovery end position on the opposite side in the Y direction. As a result, the residual solder Sp1 on the upper surface of the mask M is scraped off while the contact portion 21a moves (slids) along the upper surface of the mask M. The collection end position is substantially the same as the print end position, and is the position of the solder pool Sp2. As a result, the residual solder Sp1 on the mask M merges with the solder pool Sp2, thereby completing the recovery of the residual solder Sp1.

  6A to 6C, the substrate table 3 disposed on the base plate 3a and moving in the Y direction integrally with the cleaner unit 4 is not shown. Prior to the solder recovery operation, the substrate table 3 is moved down by the Z-axis moving mechanism 34, the substrate lifting unit 35, the pair of bracket members 3b, the conveyor 31, and the clamp member 32 are lowered, and the mask. Separate from M.

  6A to 6C show the solder collecting operation in the forward printing direction, it is also possible to perform the solder collecting operation in the backward printing direction. The operation direction of the solder recovery operation may be determined depending on which side of the solder pool Sp2 is located in the Y direction (whether the previous printing operation is the forward printing or the backward printing), and the solder recovery operation toward the solder pool Sp2. Should be implemented. Therefore, in the first embodiment, the solder recovery operation is started from the recovery start position on the outer side in the opposite direction to the end portion of the residual solder Sp1 on the opposite side to the printing direction of the squeegee 21 in the previous printing operation. If the immediately preceding printing operation is forward printing in the Y1 direction as shown in FIGS. 6A to 6C, the collection start position is the outer position in the Y2 direction. On the other hand, if the previous printing operation is a return pass printing in the Y2 direction, the collection start position is the outer position in the Y1 direction. In other words, in the solder recovery operation, the squeegee 21 and the cleaner unit 4 are controlled to move in the same direction as the printing direction of the squeegee 21 in the immediately preceding printing operation.

  The residual solder Sp1 is formed linearly along the widthwise edge of the substrate CB on both sides in the width direction X of the printing area of the mask M. Therefore, during the solder recovery operation, the opening Ap of the mask M is formed. The solder is not filled with the solder, and the solder is not wasted by dropping downward from the opening Ap, and the lower surface of the mask M is not soiled with the solder. When the solder collecting operation is performed from the side where the solder pool Sp2 is disposed, the solder is filled in the opening Ap of the mask M and falls downward from the opening Ap so that the solder is wasted. There is a possibility that the lower part of M is stained with solder.

  The solder recovery operation is periodically performed by the control unit 5 at a predetermined timing other than during the printing operation. The execution timing of the solder recovery operation is the interval between printing operations (after the end of board printing and before the start of the next board printing), and when the number of printed board reaches the preset number, the specified set time has elapsed Or when the production of the substrate ends (that is, when the currently used mask M is replaced). The elapse of the set time is based on the elapsed time from the start of printing at the first execution, and is based on the elapsed time from the start of the next printing after the previous solder recovery operation is performed for the second and subsequent times. The set number of sheets and the set time are set in the storage unit 52 in advance.

  Next, the mask cleaning operation will be described. In the mask cleaning operation, solder adhered to the lower surface of the mask M (between the mask M and the substrate CB) or solder remaining in the opening Ap is removed from the mask M to maintain good printing accuracy. Is the operation. The mask cleaning operation may be performed after the solder recovery operation or may be performed independently of the solder recovery operation. At the time of the mask cleaning operation, the squeegee 21 is separated above the mask M and stands by at a retracted position on the outer side in the Y direction from the printing area where the opening Ap is formed.

  In the mask cleaning operation, first, as shown in FIG. 8A, the cleaner unit 4 is moved to a predetermined cleaning start position (Y-axis position). That is, the substrate table 3 moves in the Y direction, and the cleaner unit 4 is positioned at the cleaning start position. The cleaning start position is a predetermined position on the outer side in the Y direction with respect to the printing region in which the opening Ap is formed, and may be the same position as the collection start position. The unused portion of the cleaning sheet Cs is disposed on the contact surface 42a of the cleaning head 42 by winding the sheet collecting unit 43.

  Next, as shown in FIG. 8B, the contact surface 42 a of the cleaning head 42 is brought into contact with the lower surface of the mask M. That is, the cleaning head 42 is raised by the elevating drive source 42b, and the contact surface 42a contacts (adheres to) the lower surface of the mask M via the cleaning sheet Cs.

  Next, as shown in FIG. 8C, the cleaner unit 4 is moved in the Y direction with the contact surface 42 a in contact with the lower surface of the mask M. That is, the squeegee unit 2 is moved in the Y direction by the substrate table 3 from the cleaning start position to the cleaning end position on the opposite side in the Y direction. At this time, negative pressure is supplied from the plurality of suction holes 42c of the contact surface 42a, and the solder in the opening Ap is sucked to the cleaning sheet Cs side. As a result, the solder that protrudes from the opening Ap to the lower surface of the mask M and adheres to the lower surface of the mask M is wiped off, and the wiped solder is negatively applied to the gap portion of the fiber that becomes the ventilation path of the cleaning sheet Cs. It enters and is securely held by suction.

  If there is a possibility that the solder adhered (residual) in the opening Ap of the mask M may be cured, the negative pressure is increased to adhere to the opening Ap of the mask M through the cleaning sheet Cs. The (residual) solder can be sucked and attracted to the cleaning sheet Cs.

  When the cleaner unit 4 moves to the cleaning end position, the cleaning operation ends. The cleaning head 42 is lowered by the elevating drive source 42b and separated from the lower surface of the mask M (not shown).

  In the solder recovery operation, negative pressure may be supplied from the suction hole 42c of the contact surface 42a as in the mask cleaning operation.

  Next, with reference to FIGS. 4, 6, and 8 to 10, control processing in the basic operation of the printing apparatus 100 according to the first embodiment of the present invention will be described. Operation control of the printing apparatus 100 is performed by the control unit 5. Here, an example in which the mask cleaning operation is performed only at the same timing (after the solder recovery operation) as the solder recovery operation will be described.

  When the printing process of the printing apparatus 100 is started, the substrate CB is carried in in step S1 of FIG. Specifically, the substrate CB is carried into the conveyor 31 from the upstream device. The control unit 5 causes the conveyor 31 to convey the substrate CB to the printing position.

  In step S2, a printing operation on the substrate CB is performed. The control unit 5 controls the squeegee unit 2 and the substrate so that the plate alignment shown in FIG. 4A, the scraping (squeezing) shown in FIG. 4B, and the plate separation shown in FIG. Controls each part such as the table 3. As a result of this printing operation, solder is printed on the substrate CB, and a residual solder Sp1 is formed on the upper surface of the mask M.

  In step S <b> 3, the control unit 5 causes the printed board CB to be carried out by the conveyor 31. The printed substrate CB is conveyed to a downstream apparatus.

  Here, in the first embodiment, in step S4, the control unit 5 determines whether or not to execute the solder recovery operation. When the number of printed boards reaches the preset number, when the predetermined set time has elapsed, and when the board production is finished (when the printing of the predetermined number of printed boards is completed) When any of the conditions is met, it is determined that the solder recovery operation is performed. If none of the above conditions is met, the process proceeds to step S6.

  If any of the above conditions is met, the control unit 5 executes a solder recovery operation in step S5. Here, the control process of the solder recovery operation will be described with reference to FIG.

  In step S11 of FIG. 10, the control unit 5 moves the substrate table 3 in the Y direction, and positions the cleaner unit 4 at the recovery start position. Next, in step S12, the control unit 5 moves the squeegee unit 2 in the Y direction, and positions the squeegee 21 at the collection start position. Steps S11 and S12 correspond to the operation shown in FIG.

  In step S13, the control unit 5 drives the elevating drive source 42b to raise the cleaning head 42 so that the contact surface 42a contacts (contacts) the lower surface of the mask M (via the cleaning sheet Cs). . Subsequently, in step S <b> 14, the control unit 5 drives the squeegee Z-axis drive mechanism 23 to lower the squeegee 21 and bring the contact portion 21 a into contact with the upper surface of the mask M. Steps S13 and S14 correspond to the operation shown in FIG.

  In step S15, the control unit 5 moves the squeegee unit 2 and the substrate table 3 in synchronization with the Y direction toward the collection end position. As a result, the residual solder Sp1 on the upper surface of the mask M is scraped off by the squeegee 21, and joins the solder pool Sp2. Step S15 corresponds to the operation shown in FIG.

  Thereafter, in step S <b> 16, the control unit 5 performs a mask cleaning operation by the cleaner unit 4. In step S16, the control unit 5 controls the cleaner unit 4 and the substrate table 3 so that the operations shown in FIGS. 8A to 8C are sequentially executed. Details of step S16 are omitted. Thus, the solder recovery operation in step S5 is completed.

  Even if the residual solder Sp1 is recovered in step S5, when the printing operation (step S2) is performed next, the residual solder Sp1 is formed again on the upper surface of the mask M. However, the residual solder Sp1 is agitated each time the printing operation and the solder recovery operation are performed by joining the residual solder Sp1 to the solder pool Sp2 by the solder recovery operation. For this reason, it is suppressed that the residual solder Sp1 hardens | cures or deteriorates.

  In step S6 of FIG. 9, the control unit 5 determines whether or not to end production (printing). That is, the control unit 5 determines whether or not the printing of the number of printed boards is completed, and the process returns to step S1 when the unprinted board CB remains. By repeating steps S1 to S6, the printing of the substrate CB is executed for the number of prints.

  When the substrate printing for the number of prints to be printed is completed, the substrate printing operation process ends. As described above, when the printing is finished, it is determined in step S4 that the control unit 5 executes the solder recovery operation, and the process proceeds to step S5. For this reason, when the printing is finished, the processing is finished after the solder collecting operation and the mask cleaning operation (step S5) are executed last. Accordingly, at the end of printing, the residual solder Sp1 on the mask M is joined to the solder pool Sp2 by the solder recovery operation, and the solder remaining in the mask lower surface and the opening Ap is removed from the mask M by the mask cleaning operation. Thus, the process ends. As a result, the user only needs to collect the solder pool Sp2 when the mask M is replaced.

  In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, at least the end portion in the width direction X of the contact portion 21a includes the contact surface 42a that contacts the mask M from below, and is configured to be movable in the printing direction Y. A cleaner unit 4 is provided. In addition to the solder printing operation on the substrate CB, a solder collecting operation is performed in which the squeegee 21 and the cleaner unit 4 are moved in the printing direction Y with the mask M sandwiched between the contact portion 21a and the contact surface 42a. The control unit 5 is configured to execute. As a result, the solder on the mask M can be scraped off in a state where the contact portion 21 a and the mask M are in close contact with each other even at the end portion in the width direction X of the squeegee 21. As a result, since the residual solder Sp1 on the mask M can be scraped off without the operator's manual work, the work burden on the operator for collecting the residual solder Sp1 can be suppressed.

  In the first embodiment, the timing of performing the solder recovery operation is any of when the number of printed boards reaches a preset number, when a predetermined set time has elapsed, and when board production is terminated. Set to a timing that satisfies these conditions. That is, by configuring the control unit 5 so as to periodically perform the solder recovery operation at a predetermined timing before the residual solder Sp1 is cured, the residual solder is recovered before the residual solder Sp1 is cured and the solder pool Sp2 is collected. Can be joined. As a result, since the solder is stirred by the next printing operation after the recovery of the residual solder Sp1, it is possible to suppress the curing of the residual solder Sp1 (that is, a decrease in reusability).

  In the first embodiment, as described above, the length L2 of the contact surface 42a is set to a length equal to or longer than the length L1 of the contact portion 21a in the width direction X. Thereby, the mask M and the contact part 21a can be closely_contact | adhered over the full length of the width direction X of the contact part 21a at the time of solder collection | recovery operation | movement. As a result, the residual solder Sp1 on the mask M can be reliably recovered and merged with the solder pool Sp2 by one solder recovery operation.

  In the first embodiment, as described above, the cleaner unit 4 including the cleaning head 42 and configured to be movable along the printing direction Y is provided, and the contact surface 42 a is provided on the cleaning head 42. Accordingly, it is possible to perform the solder recovery operation using the cleaner unit 4 provided for cleaning the mask M without separately providing a dedicated lower surface support portion. In addition, the solder adhering to the squeegee 21 after the printing operation is dropped and joined onto the solder pool Sp2, but when shifting to the solder collecting operation immediately after the printing operation, the solder adhering to the squeegee 21 is If the viscosity of the solder is low, this solder may pass through the opening Ap of the mask M during the solder recovery operation (drop from the opening Ap). Even in this case, the solder can be removed by the cleaning head 42. Furthermore, even when the viscosity of the solder is relatively high and it does not fall downward from the opening Ap during the solder recovery operation, it takes a long time to move to the printing operation after the solder recovery operation. The solder that has entered the opening Ap may be deteriorated. However, when a negative pressure is applied to the cleaning head 42, the solder that has entered the opening Ap can be more reliably removed by the cleaning head 42.

  In the first embodiment, as described above, the controller 5 is configured to execute the mask cleaning operation after the solder recovery operation and before the solder printing operation. Thereby, even when the solder adhering to the squeegee 21 enters the opening Ap of the mask M during the solder recovery operation, the solder that has entered the opening Ap can be surely removed.

  Even when the solder that has entered the opening Ap cannot be completely removed in the solder recovery operation using the cleaner unit 4, the negative pressure is applied to the cleaning head 42 after the solder recovery operation using the cleaner unit 4 is performed. By performing the mask cleaning operation while acting, the solder that has entered the opening Ap can be more reliably removed.

  In the first embodiment, as described above, in the solder recovery operation, the remaining solder Sp1 is opposite to the end of the residual solder Sp1 on the opposite side to the printing direction of the squeegee 21 in the immediately preceding printing operation. The control unit 5 is configured to execute the solder recovery operation from the recovery start position located on the outer side in the direction. That is, the control unit 5 sets the collection start position outside the opposite Y2 direction when the forward pass printing in the Y1 direction is performed immediately before, and reverses when the return pass printing is performed immediately before in the Y2 direction. A collection start position is set outside the Y1 direction. Thereby, it is possible to eliminate the filling of the opening of the printed pattern with the squeegee during the solder collecting operation.

  In the first embodiment, as described above, the cleaning head 42 of the cleaner unit 4 has the air-permeable cleaning sheet Cs for wiping the lower surface of the mask M, and the lower surface of the mask M via the cleaning sheet Cs. A suction hole 42c for applying a negative pressure is provided. Thereby, the solder that has entered the opening Ap of the mask M can be more reliably removed by the cleaning head 42 during the solder recovery operation.

(Second Embodiment)
Hereinafter, a printing apparatus 200 according to a second embodiment of the present invention will be described with reference to FIGS. 1, 11, and 12. Unlike the first embodiment in which the cleaner unit 4 supports the lower surface of the mask M in the solder recovery operation, the second embodiment supports the lower surface of the mask M by the clamp member 32 in the solder recovery operation. An example of the configuration will be described.

  Note that the printing apparatus 200 according to the second embodiment (see FIG. 1) is different from the first embodiment only in the control unit 105, and has the same hardware configuration (apparatus structure). Only the important parts will be described.

  In the second embodiment, the lower surface of the mask M in the solder recovery operation is supported by the substrate table 3 that includes the clamp member 32 that holds the side end surface of the substrate CB and is movable in the printing direction Y. The printing apparatus 200 is configured. The substrate table 3 is an example of the “lower surface support portion” in the present invention.

  As shown in FIG. 12, the clamp member 32 has an abutment surface 132 that abuts against the mask M from below at least at the end position in the width direction X of the abutment portion 21 a of the squeegee 21. The contact surface 132 is the upper surface of the clamp member 32. The clamp member 32 is an elongated plate-like member having a flat upper surface and extending linearly in the width direction X. The contact surface 132 has a length L4 in the width direction X that is greater than the length L1 of the contact portion 21a. That is, the clamp member 32 itself is formed with a length L4. The contact surface 132 is an example of the “second contact portion” in the present invention.

  In the second embodiment, the control unit 105 moves the substrate table 3 in the Y direction and positions the clamp member 32 at the recovery start position as shown in FIG. 11A in the solder recovery operation. Then, the control unit 105 drives the Z-axis moving mechanism 34 to bring the contact surface 132 of the clamp member 32 into contact with the lower surface of the mask M, as shown in FIG. Thereafter, as shown in FIG. 11C, the control unit 105 lowers the squeegee 21 at the collection start position so that the mask M is brought into contact with the contact portion 21a of the squeegee 21 and the contact surface 132 of the clamp member 32. Hold it up and down. In this state, the control unit 105 moves the squeegee unit 2, the substrate table 3, and the collection start position to the collection end position in synchronization in the Y direction. In this way, the solder recovery operation in the second embodiment is performed. In the second embodiment, as in the first embodiment, the control unit 105 separates the squeegee 21 from the mask M after the solder recovery operation by the squeegee 21 and the clamp member 32 and before the solder printing operation. In the state where the cleaning head 42 is in contact with the lower surface of the mask M, the mask cleaning operation is performed to move the cleaner unit 4 in the printing direction.

  Other configurations of the second embodiment are the same as those of the first embodiment.

  In the second embodiment, the following effects can be obtained.

  In the second embodiment, the substrate table 3 including the clamp member 32 having the contact surface 132 and configured to be movable in the printing direction Y is provided. In addition, during a solder printing operation on the substrate CB, a solder recovery operation for moving the squeegee 21 and the substrate table 3 in the printing direction Y with the mask M sandwiched between the contact portion 21a and the contact surface 132 is performed. The control unit 105 is configured to execute. Thus, as in the first embodiment, in the solder recovery operation, the residual solder Sp1 on the mask M can be scraped off, so that the operator's work load for recovering the residual solder Sp1 can be suppressed. . Also in the second embodiment, by periodically performing the solder recovery operation at a predetermined timing, the residual solder Sp1 can be joined to the solder pool Sp2 before the residual solder Sp1 is hardened. , Reduction in reusability) can be suppressed.

  Further, in the second embodiment, as described above, the substrate table 3 that includes the clamp member 32 that holds the side end surface of the substrate CB and is movable in the printing direction Y is provided, and the contact surface 132 is clamped. Provided on member 32. Accordingly, it is possible to perform a solder recovery operation for recovering the residual solder Sp1 on the mask M by using the substrate table 3 that holds the substrate CB during the printing operation without separately providing a dedicated lower surface support portion. Become.

  Other effects of the second embodiment are the same as those of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the said 1st Embodiment, the example which uses the cleaner unit 4 as a lower surface support part of this invention is shown, In the said 2nd embodiment, the board | substrate table 3 which has the clamp member 32 is used as a lower surface support part of this invention. Although an example is shown, the present invention is not limited to this. In the present invention, a dedicated lower surface support portion that can move along the printing direction may be provided separately from the cleaner unit and the substrate table.

  In the first embodiment, an example of a configuration in which the cleaner unit 4 is moved in the printing direction Y by the substrate table 3 is shown, but the present invention is not limited to this. The cleaner unit may be movable in the printing direction independently of the substrate table.

  In the first embodiment and the second embodiment, the length L2 (L4) in the width direction X of the contact surface 42a (132), which is an example of the second contact portion of the present invention, is set in the present invention. Although the example made larger than the length L1 of the contact part 21a which is an example of a 1st contact part was shown, this invention is not limited to this. The length of the second contact portion may be equal to the length of the first contact portion, or may be smaller than the length of the first contact portion. When the length of the second contact portion is made smaller than the length of the first contact portion, the second contact portion is divided so as to contact the mask M at the end in the width direction X of the first contact portion. And what is necessary is just to arrange | position near the both ends of a 1st contact part. In this case, in the central part in the width direction X, a residual solder may be formed as a result of a gap formed in the second contact part. However, the residual solder formed in the central part of the mask M can be scraped off by a normal printing operation.

  Moreover, although the example which performs mask cleaning operation | movement (step S16 of FIG. 10) after execution of solder collection | recovery operation and before printing operation was shown in the said 1st Embodiment, this invention is not limited to this. In the present invention, the mask cleaning operation may be simultaneously performed on the lower surface side of the mask M during the scraping operation (step S15 in FIG. 10) in the solder recovery operation. In this case, step S16 can be omitted. In this case, for example, the width L3 (see FIG. 2) in the Y direction of the cleaning head 42 (contact surface 42a) is increased (for example, approximately doubled), so A configuration may be adopted in which a solder recovery operation is performed in which the mask M is sandwiched between the contact surface 42a, and a mask cleaning operation is performed in which only the contact surface 42a is in contact with the lower surface of the mask M and is sucked on the rear side in the traveling direction.

  In the first embodiment, the example in which the solder is sucked from the suction hole 42c of the contact surface 42a in the mask cleaning operation is shown. However, in the present invention, the suction hole 42c of the contact surface 42a is also used in the solder recovery operation. The solder may be sucked from.

  In the first embodiment, for convenience of explanation, the processing operation of the control unit has been described using a flow-driven flowchart that performs processing in order along the processing flow. However, the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

3 Substrate table (lower support)
4 Cleaner unit (bottom support)
5, 105 Control part 21 Squeegee 21a Contact part (1st contact part)
32 Clamp member 42 Cleaning head 42a Contact surface (second contact portion)
42c Suction hole 100, 200 Printing device 132 Contact surface (second contact portion)
Ap Opening CB Substrate Cs Cleaning Sheet M Mask SP1 Residual solder (residual solder in printing direction)

Claims (9)

A squeegee that includes a first abutting portion that abuts from above on a mask having an opening portion of a printed pattern on the substrate, moves in a predetermined printing direction, and prints the solder on the mask on the substrate;
A lower surface support portion configured to include a second abutting portion that abuts the mask from below at least at an end position in the width direction intersecting the printing direction of the first abutting portion, and is configured to be movable in the printing direction. When,
A controller that controls movement of the squeegee and movement of the lower surface support part,
The control unit supports the squeegee and the lower surface in a state where the mask is sandwiched between the first contact portion and the second contact portion at a predetermined timing other than during the solder printing operation on the substrate. A printing apparatus configured to perform a solder recovery operation for moving a portion in the printing direction.   The printing apparatus according to claim 1, wherein the second contact portion has a length equal to or longer than the length of the first contact portion in the width direction.   In the solder recovery operation, the control unit performs the printing on the side opposite to the printing direction of the squeegee in the immediately preceding printing operation with respect to the printing direction residual solder remaining on the mask and extending in the printing direction. The solder recovery operation by the first contact portion and the second contact portion is executed from a recovery start position positioned on the outer side in the opposite direction from the end portion of the direction residual solder. Item 3. The printing apparatus according to Item 1 or 2. The lower surface support portion includes a cleaning head that contacts the lower surface of the mask and cleans the lower surface of the mask, and is a cleaner unit configured to be movable along the printing direction.
The printing apparatus according to claim 1, wherein the second contact portion is provided in the cleaning head.   The cleaner unit is provided on the cleaning head, and has a breathable cleaning sheet that contacts the lower surface of the mask and wipes the lower surface of the mask, and applies a negative pressure to the lower surface of the mask via the cleaning sheet. The printing apparatus according to claim 4, further comprising a suction hole for acting.   The controller is configured to separate the squeegee from the mask and bring the cleaning head into contact with the lower surface of the mask after the solder recovery operation by the squeegee and the cleaner unit and before the solder printing operation. The printing apparatus according to claim 4 or 5, wherein a mask cleaning operation for moving the cleaner unit in the printing direction is executed. The lower surface support portion includes a clamp member that holds a side end surface of the substrate, and is a substrate table configured to be movable in the printing direction,
The printing apparatus according to claim 1, wherein the second contact portion is provided on the clamp member. A cleaning unit that includes a cleaning head that contacts the lower surface of the mask and cleans the lower surface of the mask, and further includes a cleaner unit configured to be movable along the printing direction;
The controller is configured to separate the squeegee from the mask and bring the cleaning head into contact with the lower surface of the mask after the solder recovery operation by the squeegee and the clamp member and before the solder printing operation. The printing apparatus according to claim 7, wherein the printing apparatus is configured to perform a mask cleaning operation for moving the cleaner unit in the printing direction. In a printing apparatus that prints solder on a substrate with a mask having an opening of a printed pattern, a solder recovery method that is performed at a predetermined timing other than during a solder printing operation on the substrate,
Contacting the first contact portion of the squeegee from the upper side of the mask having the opening portion of the printed pattern on the substrate;
Contacting the second contact portion of the lower surface support portion from the lower side of the mask at an end position in the width direction intersecting at least the printing direction of the first contact portion;
And a step of moving the squeegee and the lower surface support portion in the printing direction in a state where the mask is vertically sandwiched between the first contact portion and the second contact portion. .

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