JP2016018829A - Substrate assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate assembly capable of sufficiently dissipating the heat produced in a heating element.SOLUTION: A substrate assembly 10 comprises a guidance device 1 as a heating element which produces heat, and a first heat dissipation substrate 20A and a second heat dissipation substrate 20B which are composed of a hardened material or a solidified material of a resin composition mainly containing a resin material and a filler, include a bonding layer 5 bonded to the guidance device 1, and dissipate the heat produced by the guidance device 1. The first heat dissipation substrate 20A and the second heat dissipation substrate 20B are arranged around a central axis 11.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate assembly.

In recent years, hybrid vehicles have been put into practical use from the viewpoint of protecting the global environment. A hybrid vehicle is a vehicle that includes an engine and a motor as drive sources and travels using one or both of them.

  In such a hybrid vehicle, the direct current of the battery is converted into alternating current by an inverter, and the alternating current is supplied to a motor for traveling. In particular, recent hybrid vehicles include a step-up converter (DC-DC converter) to reduce the size of the battery and motor. The boost converter has a role of boosting the voltage of the battery and supplying it to the inverter (motor), and a role of reducing the regenerative current from the generator (motor) to the battery voltage and charging the battery. The induction device can store electric energy as magnetic energy, and is used as one of components included in the boost converter (see, for example, Patent Document 1).

  For example, as shown in FIG. 5, such a guide device 1 has a configuration including a core portion 2 and a coil 3 wound around the core portion 2. In addition to being fixed to the bottom via the sealing member 60, it is sealed with a sealing material 60 (conventional guidance device sealing object 40). Thereby, heat generated by excitation in the coil 3 of the induction device 1 is radiated from the induction device 1 by being transmitted to the bottom of the housing 70 via the adhesive layer 50.

  However, in the configuration shown in FIG. 5, the heat generated in the induction device 1 is configured to dissipate heat mainly in one direction (downward in the drawing), that is, on the bottom surface side of the housing 70. There was a problem of insufficient heat dissipation.

JP 2004-241475 A

  An object of the present invention is to provide a substrate assembly that can sufficiently dissipate heat generated by a heating element.

Such an object is achieved by the present inventions (1) to (13) below.
(1) a heating element that generates heat;
A plurality of heat dissipating substrates that are composed of a cured or solidified resin composition mainly containing a resin material and a filler, have a bonding layer bonded to the heating element, and dissipate heat generated by the heating element. Prepared,
The substrate assembly, wherein the plurality of heat dissipating boards are arranged around a central axis when the central axis of the heating element is assumed.

(2) Two heat dissipation substrates are provided,
The heating element is a guide device having a polygonal outline when viewed from the central axis direction,
Each said heat dissipation board | substrate is a board | substrate assembly as described in said (1) arrange | positioned facing each two adjacent sides of the polygon.

(3) The induction device includes a core portion and a coil formed by winding a conductive linear body around the core portion, and both end portions of the linear body protrude in the same direction. And
Each said heat dissipation board | substrate is a board | substrate assembly as described in said (2) which is not arrange | positioned with respect to the said coil in the protrusion direction of the both ends of the said linear body, respectively.

(4) A gap is formed between the linear bodies adjacent in the central axis direction,
The substrate assembly according to (3), wherein a bonding layer is embedded in the gap at a position corresponding to a region where the end face of the coil is bonded to the bonding layer in the gap.

  (5) The board assembly according to any one of (1) to (4), wherein the heat dissipation boards adjacent to each other around the central axis have different sizes.

(6) The board assembly according to any one of (1) to (5), wherein the resin material is a thermosetting resin.
(7) The board assembly according to (6), wherein the thermosetting resin is an epoxy resin.

  (8) The substrate assembly according to any one of (1) to (7), wherein the filler is a granular body mainly composed of aluminum oxide.

  (9) The board assembly according to any one of (1) to (8), wherein the heat dissipation board includes a metal plate disposed on a side opposite to the heating element of the bonding layer.

  (10) The substrate assembly according to any one of (1) to (9), further including a sealing material that seals the heating element by covering the heating element together with the bonding layer.

  (11) The substrate assembly according to (10), wherein the sealing material is formed of a cured product of a resin composition for a sealing material containing a thermosetting resin.

  (12) The board assembly according to (11), wherein the thermosetting resin in the resin composition for a sealing material is a phenol resin.

  (13) The substrate assembly according to any one of (10) to (12), wherein the filler is dispersed on the sealing material side at an interface between the bonding layer and the sealing material.

  According to the present invention, the heat generated in the heating element is reliably radiated through each heat radiating substrate. Thereby, the heat radiation to the heating element can be performed sufficiently and reliably.

FIG. 1 is a partial longitudinal sectional view showing a first embodiment of a substrate assembly of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an enlarged cross-sectional view of a region [B] surrounded by an alternate long and short dash line in FIG. FIG. 4 is a cross-sectional view showing a second embodiment of the substrate assembly of the present invention. It is a longitudinal cross-sectional view which shows embodiment of the conventional guidance device sealing object.

  Hereinafter, a substrate assembly of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  The heating element in the present invention may be any heating element as long as it seals the heating element that generates heat by conduction. For example, the heating element includes a resistor such as a thermistor, a transformer, and a coil. , Relay elements such as switches, capacitors, diode power MOSFETs, power transistors such as insulated gate bipolar transistors (IGBT), and power modules combining these, induction devices, regulators (rectifiers), LEDs (light emitting diodes), LDs (Laser diodes), light emitting elements such as organic EL elements, integrated circuit elements such as LSI and CPU, temperature sensors, motors, battery packs, and the like. Below, the case where it applies to an induction device as a heat generating body is demonstrated to an example.

<First Embodiment>
FIG. 1 is a partial longitudinal sectional view showing a first embodiment of a substrate assembly of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an enlarged cross-sectional view of a region [B] surrounded by an alternate long and short dash line in FIG. In the following, for convenience of explanation, the upper side in FIGS. 1 to 3 (the same applies to FIG. 4) is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.

  A guidance device structure 100 shown in FIG. 1 includes a board assembly 10 having a guidance device 1 and a housing 7 that houses the board assembly 10. For example, a booster included in a hybrid car, an electric car, or the like. It is mounted as a part of the converter.

  The board assembly 10 includes an induction device 1 (step-up coil), a first heat radiation board (lower surface heat radiation board) 20A, and a second heat radiation board (side surface heat radiation board) 20B. The assembly obtained by sealing with the sealing material 6.

  The first heat dissipation substrate 20 </ b> A and the second heat dissipation substrate 20 </ b> B are laminated bodies each having a metal plate 4 and a bonding layer (bonding material) 5. As shown in FIG. 2, the first heat dissipation substrate 20 </ b> A is disposed immediately below the guidance device 1, and the second heat dissipation substrate 20 </ b> B is disposed in the vicinity of the right side of the guidance device 1 in the drawing. Hereinafter, the surface of the guidance device 1 on the side where the first heat dissipation substrate 20A is disposed is referred to as “lower surface 12”, and the surface on the side of which the second heat dissipation substrate 20B is disposed is referred to as “right side surface 13”.

  The induction device 1 is a heating element that generates heat when energized, can store electrical energy as magnetic energy, and is used as one of the components included in the boost converter.

  As shown in FIG. 1, the guidance device 1 includes a core part 2 and a coil 3 wound around the core part 2.

  In this embodiment, the core portion 2 is formed of a linear I-shaped core, and the coil 3 is provided on the outer peripheral portion thereof via an insulating bobbin or insulating paper (not shown). As shown in FIG. 2, in the present embodiment, the cross-sectional shape of the core portion 2 is a square in which the corner portions 21 are rounded.

  Moreover, this core part (I type core) 2 is comprised with the powder magnetic core formed by press-molding magnetic powder, and as such magnetic powder, although not specifically limited, for example, iron, iron-silicon type Alloys, iron-nitrogen alloys, iron-nickel alloys, iron-carbon alloys, iron-boron alloys, iron-cobalt alloys, iron-phosphorus alloys, iron-nickel-cobalt alloys and iron-aluminum- Examples thereof include silicon-based alloys.

  The coil 3 is composed of a linear body (see FIG. 3) obtained by coating the surface of the conductive copper wire 31 with the resin layer 32, and by winding the linear body around the core portion 2. It is formed. The insulating property of the coil 3 is maintained by forming the resin layer 32 on the surface of the copper wire 31.

  In addition, since the coil 3 is wound around the outer peripheral portion of the core portion 2 having the square cross-sectional shape described above, the coil 3 is also wound along the cross-sectional shape (see FIG. 2). Thereby, as for guidance device 1, the outline shape seen from the direction of central axis 11 makes the same square as the cross section shape of core part 2.

  Further, as shown in FIG. 2, one end portion 36 of the linear body constituting the coil 3 protrudes toward the left side in the drawing, and similarly, the other end portion 37 faces toward the left side in the drawing. Protruding. The one end portion 36 and the other end portion 37 are arranged on opposite sides with respect to the central axis 11.

  Although it does not specifically limit as a constituent material of the resin layer 32, For example, a polyester resin, a polyesterimide resin, a polyamideimide resin, a polyimide resin, a polyurethane resin etc. are mentioned, Among these, it combines 1 type or 2 types or more. Can be used. Among these, a polyamideimide resin is preferable. Thereby, the insulation of the copper wire 31, ie, the insulation of the coil 3, can be ensured reliably. Moreover, the adhesiveness with respect to the sealing material 6 can be made excellent.

  Moreover, the thickness of the resin layer 32 is, for example, preferably 10 μm or more and 50 μm or less, more preferably 20 μm or more and 30 μm or less. Thereby, the insulation of the copper wire 31, ie, the insulation of the coil 3, can be ensured reliably.

  Further, as described above, the coil 3 is formed by winding a linear body around the core portion 2, and an end surface (outer peripheral surface) 33 located on the outer peripheral side thereof is flat as shown in FIG. It is composed of planes. Thereby, since the contact area with respect to each joining layer 5 of 20 A of 1st heat sinks and 2nd heat sink 20B can each be ensured large, the adhesiveness with respect to each said joining layer 5 improves. In addition, since the thickness of each bonding layer 5 can be kept substantially constant at the position where the end face 33 contacts, the insulation of the coil 3 with respect to the metal plate 4 is reliably maintained.

  As shown in FIG. 2, the first heat radiating board 20 </ b> A and the second heat radiating board 20 </ b> B are members that radiate heat Q generated by excitation in the coil 3 of the induction device 1 when energized. , And a joining layer 5 that joins the metal plate 4 and the coil 3.

  The first heat radiating board 20A and the second heat radiating board 20B are arranged around the central axis 11 of the induction device 1, respectively. That is, in the present embodiment, the first heat dissipation board 20A is disposed to face the lower surface 12 of the guidance device 1, and the second heat dissipation board 20B is disposed to face the right side surface 13 adjacent to the lower surface 12. ing. In addition, the central portion of the first heat dissipation board 20A and the central axis 11 of the guidance device 1 overlap in plan view, and the central portion of the second heat dissipation board 20B and the central axis 11 of the guidance device 1 in right side view. Are overlapping.

  Due to such a positional relationship, the heat Q generated in the induction device 1 is surely radiated from the lower surface 12 side via the first heat radiating substrate 20A, and from the right side surface 13 the second heat radiating substrate 20B. The heat is reliably radiated through. Thereby, the heat dissipation with respect to the induction device 1 can be performed mainly from two directions, and thus the heat dissipation is sufficient.

  Further, as described above, the first heat dissipation board 20A is disposed on the lower surface 12 side of the guidance device 1, and the second heat dissipation board 20B is disposed on the right side surface 13 side. Therefore, the first heat dissipation board 20A and the second heat dissipation board 20B are not arranged in the protruding direction of the one end portion 36 and the other end portion 37 of the coil 3 with respect to the coil 3, respectively. Thereby, arrangement | positioning of 20 A of 1st heat sinks with respect to the coil 3 at the time of manufacture of the board assembly 10 and the 2nd heat sink 20B becomes easy.

  Further, in the first heat dissipation substrate 20A and the second heat dissipation substrate 20B, the metal plate 4 having a rectangular shape in plan view is disposed on the opposite side of the bonding layer 5 from the induction device 1. As a result, the metal plate 4 of the first heat dissipation board 20A abuts on the bottom portion 71 of the housing 7 and exhibits a function as a heat dissipation plate that transfers the heat Q to the bottom portion 71 and releases it. The metal plate 4 of 20B abuts on the frame body 72 of the housing 7 and exhibits a function as a heat radiating plate that transfers the heat Q to the frame body 72 and releases it. Moreover, the strength of each heat dissipation substrate itself is improved by the metal plate 4.

  As a constituent material of the metal plate 4, it is preferable to use aluminum or an aluminum alloy, copper, a copper alloy, a stainless material, or the like. By constituting the metal plate 4 with these metals, the thermal conductivity of the metal plate 4 can be made excellent.

  Further, the thickness of the metal plate 4 is not particularly limited, but is preferably about 5 μm to 100 μm, and more preferably about 30 μm to 60 μm. By setting the thickness of the metal plate 4 in such a numerical range, it is possible to reduce the size of the substrate assembly 10 while ensuring the necessary mechanical strength of each heat dissipation substrate. Furthermore, heat generated by excitation in the coil 3 can be efficiently transmitted to the bottom 71 of the housing 7 via the bonding layer 5 and the metal plate 4.

  The thermal conductivity in the thickness direction of the metal plate 4 is preferably 3 W / m · K or more and 500 W / m · K or less, preferably 10 W / m · K or more and 400 W / m · K or less. Is more preferable. Such a metal plate 4 can be said to be a substrate having excellent thermal conductivity, and heat Q generated by excitation in the coil 3 can be efficiently transmitted to the housing 7 via the metal plate 4.

  The bonding layer 5 is bonded to the coil 3 of the induction device 1 on the induction device 1 side of the metal plate 4.

  Further, the bonding layer 5 has an insulating property. Thereby, the insulation state of the metal plate 4 and the guidance apparatus 1 is ensured.

  Furthermore, the bonding layer 5 is configured to exhibit excellent thermal conductivity. Thereby, the bonding layer 5 can transfer the heat Q on the induction device 1 side to the metal plate 4.

  The bonding layer 5 having a high thermal conductivity is preferably used. Specifically, the bonding layer 5 is preferably 1 W / m · K or more and 15 W / m · K or less, preferably 5 W / m · K or more. More preferably, it is 10 W / m · K or less. As a result, the bonding layer 5 efficiently transmits the heat Q on the induction device 1 side to the metal plate 4, thereby improving the heat dissipation efficiency.

  The average thickness of the bonding layer 5 is not particularly limited, but is preferably about 40 μm to 300 μm, and more preferably about 60 μm to 200 μm. Thereby, size reduction of the induction device 1 can be achieved while ensuring the insulation of the bonding layer 5. Furthermore, the thermal conductivity of the bonding layer 5 can be improved. Therefore, heat generated by excitation in the coil 3 can be efficiently transmitted to the bottom 71 of the housing 7 through the bonding layer 5 and the metal plate 4.

  In particular, the thickness of the bonding layer 5 is preferably about 30 μm to 300 μm, more preferably about 30 μm to 150 μm, and more preferably about 30 μm to 60 μm at the position where it is bonded to the end face 33 of the coil 3. Further preferred. Thereby, the said effect can be exhibited more notably.

  The total average thickness of the metal plate 4 and the bonding layer 5 is preferably, for example, about 60 μm to 300 μm, and more preferably about 115 μm to 270 μm. By setting the total average thickness within such a numerical range, the heat generated by excitation in the coil 3 can be reduced while ensuring the necessary mechanical strength of the induction device 1 and reducing the size of the induction device 1. Further, it can be efficiently transmitted to the bottom portion 71 of the housing 7 through the bonding layer 5 and the metal plate 4.

  The bonding layer 5 has a glass transition temperature of preferably 100 ° C. or higher and 200 ° C. or lower. Thereby, since the rigidity of the joining layer 5 increases and the warp of the joining layer 5 can be reduced, the displacement of the guidance device 1 with respect to the metal plate 4 can be suppressed.

  The glass transition temperature of the bonding layer 5 can be measured as follows based on JIS C 6481.

  Using a dynamic viscoelasticity measuring device (DMA Instruments' DMA / 983) under a nitrogen atmosphere (200 ml / min), a tensile load was applied, and a frequency of 1 Hz and a temperature of −50 ° C. to 300 ° C. The range is measured at a temperature rising rate of 5 ° C./min, and the glass transition temperature Tg is obtained from the peak position of tan δ.

  The elastic modulus (storage elastic modulus) E ′ of the bonding layer 5 at 25 ° C. is preferably 10 GPa or more and 70 GPa or less. Thereby, since the rigidity of the joining layer 5 increases, the curvature which arises in the joining layer 5 can be reduced. As a result, the bonding reliability with the induction device 1 and the metal plate 4 can be maintained.

  The storage elastic modulus can be measured with a dynamic viscoelasticity measuring device. Specifically, the storage elastic modulus E ′ is obtained by applying a tensile load to the bonding layer 5, a frequency of 1 Hz, and a heating rate of 5 It is measured as the value of the storage elastic modulus at 25 ° C. when measured from −50 ° C. to 300 ° C. at −10 ° C./min.

  The bonding layer 5 having such a function has a configuration in which a filler is dispersed in a layer formed using a resin material as a main material.

  The resin material exhibits a function as a binder for holding the filler in the bonding layer 5, and the filler has a thermal conductivity higher than that of the resin material. By making the bonding layer 5 have such a configuration, the thermal conductivity of the bonding layer 5 can be increased.

  Such a joining layer 5 is comprised with the solidified material or hardened | cured material formed by solidifying or hardening the resin composition for joining layer formation mainly containing a resin material and a filler. That is, the bonding layer 5 is composed of a cured product or a solidified product obtained by forming the bonding layer forming resin composition into a layer shape.

Hereinafter, the bonding layer forming resin composition will be described.
As described above, the bonding layer forming resin composition mainly includes a resin material and a filler.

  The resin material is not particularly limited, and various resin materials such as a thermoplastic resin and a thermosetting resin can be used.

  Examples of the thermoplastic resin include polyolefins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymer, modified polyolefins, polyamides (eg, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 11, nylon 12). , Nylon 6-12, nylon 6-66), thermoplastic polyimide, aromatic polyester and other liquid crystal polymers, polyphenylene oxide, polyphenylene sulfide, polycarbonate, polymethyl methacrylate, polyether, polyether ether ketone, polyether imide, polyacetal, Styrene, polyolefin, polyvinyl chloride, polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluoro rubber, salt Various thermoplastic elastomers, etc., or a copolymer of these His polyethylene type or the like, blends, polymer alloys and the like, can be used as a mixture of two or more of them.

  On the other hand, examples of the thermosetting resin (second thermosetting resin) include an epoxy resin, a phenol resin, a urea resin, a melamine resin, a polyester (unsaturated polyester) resin, a polyimide resin, a silicone resin, and a polyurethane resin. 1 type or 2 types or more of these can be mixed and used.

  Among these, as a resin material used for the resin composition for forming a bonding layer, it is preferable to use a thermosetting resin, and it is more preferable to use an epoxy resin. Thereby, the heat resistance of the joining layer 5 obtained can be made excellent. Further, the metal plate 4 and the induction device 1 (coil 3) can be firmly bonded via the bonding layer 5. Therefore, the heat dissipation and durability of the obtained substrate assembly 10 can be made excellent.

  Moreover, it is preferable that an epoxy resin contains the epoxy resin (A) which has at least any one of an aromatic ring structure and an alicyclic structure (alicyclic carbocyclic structure). By using such an epoxy resin (A), the glass transition temperature can be increased, and the thermal conductivity of the bonding layer 5 can be further improved. Moreover, the adhesiveness with respect to the metal plate 4 and the guidance apparatus 1 (coil 3) can be improved.

  Examples of the epoxy resin (A) having an aromatic ring or alicyclic structure include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, Bisphenol P type epoxy resin, bisphenol type epoxy resin such as bisphenol Z type epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, novolak type epoxy resin such as tetraphenol group ethane type novolak type epoxy resin, biphenyl type epoxy resin , Arylalkylene type epoxy resins such as phenol aralkyl type epoxy resins having a biphenylene skeleton, and epoxy resins such as naphthalene type epoxy resins. It can be used in combination of at least Chino one or.

  The epoxy resin (A) is preferably a naphthalene type epoxy resin. Thereby, the glass transition temperature can be further increased, the generation of voids in the bonding layer 5 can be suppressed, the thermal conductivity can be further improved, and the dielectric breakdown voltage can be improved.

  The naphthalene type epoxy resin is one having a naphthalene ring skeleton and having two or more glycidyl groups.

  The content of the naphthalene type epoxy resin in the epoxy resin is preferably 20% by mass or more and 80% by mass or less, more preferably 40% by mass or more and 60% by mass or less with respect to 100% by mass of the epoxy resin. is there.

  Examples of the naphthalene type epoxy resin include any of the following formulas (5) to (8).

［式中、ｍ、ｎはナフタレン環上の置換基の個数を示し、それぞれ独立して１〜７の整数を示す。］

[Wherein, m and n represent the number of substituents on the naphthalene ring, and each independently represents an integer of 1 to 7. ]

  In addition, as a compound of Formula (6), it is preferable to use any 1 or more types of the following.

［式中、Ｍｅはメチル基を示し、ｌ、ｍ、ｎは１以上の整数を示す。］

[Wherein, Me represents a methyl group, and l, m, and n represent an integer of 1 or more. ]

［式中、ｎは１以上、２０以下の整数であり、ｌは１以上、２以下の整数であり、Ｒ_１はそれぞれ独立に水素原子、ベンジル基、アルキル基または下記式（９）で表される構造であり、Ｒ_２はそれぞれ独立に水素原子またはメチル基である。］

[Wherein, n is an integer of 1 or more and 20 or less, l is an integer of 1 or more and 2 or less, and R ₁ is independently a hydrogen atom, a benzyl group, an alkyl group or the following formula (9). And each R ₂ independently represents a hydrogen atom or a methyl group. ]

［式中、Ａｒはそれぞれ独立にフェニレン基またはナフチレン基であり、Ｒ_２はそれぞれ独立に水素原子またはメチル基であり、ｍは１または２の整数である。］

[Wherein, Ar is each independently a phenylene group or a naphthylene group, R ₂ is each independently a hydrogen atom or a methyl group, and m is an integer of 1 or 2. ]

  The naphthalene type epoxy resin of the formula (8) is classified as a so-called naphthylene ether type epoxy resin, and the compound represented by the formula (8) is exemplified by those represented by the following formula (10). It is done.

［上記式（１０）式において、ｎは１以上、２０以下の整数であり、好ましくは１以上、１０以下の整数であり、より好ましくは１以上、３以下の整数である。Ｒはそれぞれ独立に水素原子または下記式（１１）で表される構造であり、好ましくは水素原子である。］

[In the above formula (10), n is an integer of 1 or more and 20 or less, preferably an integer of 1 or more and 10 or less, more preferably an integer of 1 or more and 3 or less. Each R is independently a hydrogen atom or a structure represented by the following formula (11), preferably a hydrogen atom. ]

［上記式（１１）式において、ｍは１または２の整数である。］

[In the above formula (11), m is an integer of 1 or 2. ]

  Furthermore, specific examples of the naphthylene ether type epoxy resin represented by the above formula (10) include those represented by the following formulas (12) to (16).

  The content of the resin material is preferably 30% by volume or more and 70% by volume or less, and preferably 40% by volume or more and 60% by volume or less of the entire resin composition for forming a bonding layer (excluding the solvent). More preferably. Thereby, the mechanical strength and thermal conductivity of the obtained bonding layer 5 can be made excellent. Moreover, the adhesiveness with respect to the metal plate 4 and the guidance apparatus 1 (coil 3) can be improved.

  On the other hand, when the content is less than the lower limit value, depending on the type of the resin material, the resin material cannot sufficiently exhibit the function as a binder for bonding the fillers together, and the resulting bonding layer 5 is obtained. There is a risk that the mechanical strength of the steel will decrease. Moreover, depending on the constituent material of the resin composition for forming the bonding layer, the viscosity of the resin composition for forming the bonding layer becomes too high, and the filtering operation or layered molding (coating) of the resin composition for forming the bonding layer (varnish) may occur. It becomes difficult or the flow of the resin composition for forming the bonding layer becomes too small, and there is a possibility that voids are generated in the bonding layer 5.

  On the other hand, when the content exceeds the upper limit, depending on the type of the resin material, it may be difficult to ensure the thermal conductivity of the bonding layer 5 while ensuring the insulation of the bonding layer 5. There is.

  Moreover, when the resin material contains an epoxy resin, the bonding layer forming resin composition preferably contains a phenoxy resin. Thereby, since the bending resistance of the joining layer 5 can be improved, the fall of the handleability of the joining layer 5 by highly filling a filler can be suppressed.

  Moreover, when a phenoxy resin is contained, the fluidity | liquidity at the time of a press reduces by an increase in a viscosity, and it can suppress that a void etc. generate | occur | produce. In addition, the adhesion between the bonding layer 5 and the metal plate 4 and the induction device 1 is improved. These synergistic effects can further increase the insulation reliability and thermal conductivity of the substrate assembly 10.

  Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having an anthracene skeleton, and a phenoxy resin having a biphenyl skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

  Among these, it is preferable to use bisphenol A type or bisphenol F type phenoxy resin. A phenoxy resin having both a bisphenol A skeleton and a bisphenol F skeleton may be used.

The weight average molecular weight of the phenoxy resin is not particularly limited, but is preferably 4.0 × 10 ⁴ or more and 8.0 × 10 ⁴ or less.

  In addition, the weight average molecular weight of a phenoxy resin is a value in terms of polystyrene measured by gel permeation chromatography (GPC).

  The content of the phenoxy resin is preferably 1% by mass or more and 15% by mass or less, more preferably 2% by mass or more and 10% by mass or less, for example, with respect to 100% by mass of the total solid content of the resin composition for forming a bonding layer. It is.

  In addition, the bonding layer forming resin composition includes a curing agent as necessary depending on the type of the resin material described above (for example, in the case of an epoxy resin).

  The curing agent is not particularly limited, and examples thereof include amide curing agents such as dicyandiamide and aliphatic polyamide, amine curing agents such as diaminodiphenylmethane, methanephenylenediamine, ammonia, triethylamine, and diethylamine, bisphenol A, and bisphenol F. And phenolic curing agents such as phenol novolac resin, cresol novolak resin, p-xylene-novolak resin, and acid anhydrides.

  The bonding layer forming resin composition may further contain a curing catalyst (curing accelerator). Thereby, the sclerosis | hardenability of the resin composition for joining layer formation can be improved.

  Examples of the curing catalyst include amine catalysts such as imidazoles, 1,8-diazabicyclo (5,4,0) undecene, phosphorus catalysts such as triphenylphosphine, and the like. Of these, imidazoles are preferred. Thereby, in particular, both the fast curability and the storage stability of the resin composition for forming a bonding layer can be achieved.

  Examples of imidazoles include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ′)]-Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 -[2'-Methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole Null acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino -6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine isocyanuric acid adduct, etc. Can be mentioned. Among these, 2-phenyl-4,5-dihydroxymethylimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole is preferable. Thereby, especially the preservability of the resin composition for bonding layer formation can be improved.

  Moreover, the content of the curing catalyst is not particularly limited, but is preferably about 0.01 to 30 parts by mass, more preferably about 0.5 to 10 parts by mass with respect to 100 parts by mass of the resin material. preferable. When the content is less than the lower limit, the curability of the bonding layer forming resin composition may be insufficient. On the other hand, when the content exceeds the upper limit, the bonding layer forming resin composition may be used. It shows a tendency for the shelf life of the product to decrease.

  The average particle diameter of the curing catalyst is not particularly limited, but is preferably 10 μm or less, and more preferably 1 μm to 5 μm. When the average particle size is within the above range, the reactivity of the curing catalyst is particularly excellent.

  Moreover, it is preferable that the resin composition for forming a bonding layer further includes a coupling agent. Thereby, the adhesiveness of the resin material with respect to a filler, the guidance apparatus 1 (coil 3), and the metal plate 4 can be improved more.

  Examples of such coupling agents include silane coupling agents, titanium coupling agents, aluminum coupling agents, and the like. Of these, silane coupling agents are preferred. Thereby, the heat resistance and thermal conductivity of the resin composition for forming a bonding layer can be further improved.

  Among these, as the silane coupling agent, for example, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyl Dimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysila N-phenyl-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, bis (3 -Triethoxysilylpropyl) tetrasulfane and the like.

  Although content of a coupling agent is not specifically limited, It is preferable that it is about 0.01-10 mass parts with respect to 100 mass parts of resin materials, and it is more preferable that it is especially about 0.5-10 mass parts. . When the content is less than the lower limit, the effect of improving the adhesion as described above may be insufficient. On the other hand, when the content exceeds the upper limit, the bonding layer 5 is formed. May cause outgassing and voids.

  Moreover, the filler in the resin composition for bonding layer formation is comprised with an inorganic material. Thereby, a filler exhibits heat conductivity higher than the heat conductivity of a resin material. Therefore, the thermal conductivity of the bonding layer 5 can be increased by dispersing the filler in the bonding layer forming resin composition.

Such a filler is preferably a granular body composed of at least one of aluminum oxide (alumina, Al ₂ O ₃ ) and aluminum nitride among those composed of inorganic materials, and is mainly mainly oxidized. A granular body made of aluminum is preferable. Thereby, it can be set as the filler excellent in heat conductivity (heat dissipation) and insulation. Aluminum oxide is particularly preferably used because it is highly versatile and can be obtained at low cost.

  Therefore, hereinafter, a case where the filler is a granular body mainly composed of aluminum oxide will be described as an example.

  The filler content is preferably 30% by volume or more and 70% by volume or less, and more preferably 40% by volume or more and 60% by volume or less, based on the entire resin composition for forming a bonding layer (excluding the solvent). preferable. By increasing the filler content in the resin composition for forming a bonding layer as in this range, the heat conductivity of the bonding layer 5 can be made excellent.

  On the other hand, when the content is less than the lower limit value, it is difficult to ensure the heat conductivity of the bonding layer 5 while ensuring the insulating properties of the bonding layer 5. On the other hand, if the content exceeds the upper limit, depending on the constituent material of the bonding layer forming resin composition, the viscosity of the bonding layer forming resin composition becomes too high, and the varnish is filtered or formed into a layer. (Coating) may be difficult, or the flow of the resin composition for forming a bonding layer may be too small, and voids may be generated in the bonding layer 5 to be obtained.

  Even if the filler content in the bonding layer forming resin composition is set high as in the above range, the bonding layer forming resin composition has a temperature of 25 ° C. and a shear rate of 1.0 rpm. 2. A / B (thixo ratio) is 1.2 or more when the viscosity is A [Pa · s], the viscosity at a temperature of 25 ° C. and a shear rate of 10.0 rpm is B [Pa · s]. By using a material that satisfies the relationship of 0 or less, the viscosity and flowability of the bonding layer forming resin composition (varnish) can be made appropriate during the production of the substrate assembly 10.

  The water content of the filler is preferably 0.10% by mass or more and 0.30% by mass or less, more preferably 0.10% by mass or more and 0.25% by mass or less. More preferably, it is 12 mass% or more and 0.20 mass% or less. Thereby, even if the content of the filler is increased, it has a more appropriate viscosity and flowability. Therefore, it is possible to form the bonding layer 5 having excellent thermal conductivity while preventing generation of voids in the obtained bonding layer 5. That is, the bonding layer 5 having excellent thermal conductivity and insulating properties can be formed.

  Aluminum oxide is usually obtained by firing aluminum hydroxide. The obtained aluminum oxide granules are composed of a plurality of primary particles, and the average particle size of the primary particles can be set according to the firing conditions.

  Moreover, the aluminum oxide which has not been treated at all after the firing is composed of aggregates (secondary particles) in which primary particles are aggregated due to fixation.

  Therefore, the final filler can be obtained by solving the aggregation of the primary particles as necessary by pulverization. The average particle diameter of the final filler can be set according to the pulverization conditions (for example, time).

  During the pulverization, the aluminum oxide has a very high hardness, so the primary particles themselves are hardly broken, and the average particle size of the primary particles is almost maintained even after pulverization. The Rukoto.

  Therefore, as the grinding time becomes longer, the average particle size of the filler approaches the average particle size of the primary particles. And when grinding | pulverization time becomes more than predetermined time, the average particle diameter of a filler will become equal to the average particle diameter of a primary particle. That is, the filler is mainly composed of secondary particles when the grinding time is shortened, and the content of primary particles increases as the grinding time is lengthened. It will be.

  Further, for example, primary particles of aluminum oxide obtained by firing aluminum hydroxide as described above have a shape having a flat surface such as a scaly shape instead of a spherical shape. Therefore, the contact area between fillers can be increased. As a result, the thermal conductivity of the obtained bonding layer 5 can be increased.

  Furthermore, the filler is a mixed system of three components (large particle size, medium particle size, and small particle size) having different average particle sizes, and the large particle size component is spherical, and the medium particle size component and small particle size are The component is preferably polyhedral.

  More specifically, the filler belongs to the first particle size range in which the average particle size is 5.0 μm or more and 50 μm or less, preferably 5.0 μm or more and 25 μm or less, and the circularity is 0.80 or more, 1 0.02 or less, preferably 0.85 or more, 0.95 or less of the large particle size alumina, the average particle size belongs to the second particle size range of 1.0 μm or more and less than 5.0 μm, and the circularity is 0.50 or more, 0.90 or less, preferably 0.70 or more and 0.80 or less, medium particle size aluminum oxide and an average particle size of 0.1 μm or more and less than 1.0 μm in the third particle size range It is preferable to be a mixture with a small particle size aluminum oxide having a circularity of 0.50 or more and 0.90 or less, preferably 0.70 or more and 0.80 or less.

  The particle size of the filler can be measured by dispersing aluminum oxide in water for 1 minute using a laser diffraction particle size distribution analyzer SALD-7000.

  As a result, the medium particle size component is filled in the gap between the large particle size components, and the small particle size component is filled in the gap between the medium particle size components. The contact area can be increased. As a result, the thermal conductivity of the bonding layer 5 can be further improved. Furthermore, the heat resistance, bending resistance, and insulation of the bonding layer 5 can be further improved.

  Moreover, the adhesiveness of the joining layer 5, the metal plate 4, and the guidance apparatus 1 can be improved further by using such a filler.

  These synergistic effects can further increase the insulation reliability and heat dissipation reliability of the substrate assembly 10.

  In addition to the components described above, the bonding layer forming resin composition may contain additives such as a leveling agent and an antifoaming agent.

  Moreover, the resin composition for forming a bonding layer includes a solvent such as methyl ethyl ketone, acetone, toluene, dimethylformaldehyde, and the like. Thereby, the resin composition for bonding layer formation will be in a varnish state, when resin material etc. melt | dissolve in a solvent.

  In addition, the resin composition for forming a bonding layer having such a varnish shape can be obtained, for example, by mixing a resin material and a solvent as necessary to form a varnish, and further mixing a filler. it can.

  The mixer used for mixing is not particularly limited, and examples thereof include a disperser, a composite blade type stirrer, a bead mill, and a homogenizer.

  The sealing material 6 seals (molds) the guidance device 1 by covering the guidance device 1 together with the first heat dissipation substrate 20A (bonding layer 5) and the second heat dissipation substrate 20B (bonding layer 5).

  Thereby, the guidance device 1 is sealed so as to be surrounded by the first heat radiation substrate 20A, the second heat radiation substrate 20B, and the sealing material 6, and the sealing property of the guidance device 1 in the substrate assembly 10 is improved. Secured.

  Further, by setting the induction device 1 so as to surround the induction device 1 in this way, the difference in the coefficient of thermal expansion between the bonding layer 5 and the sealing material 6 can be set small. it can. Thereby, at the time of excitation in the coil 3 of the induction device 1, the induction device 1 itself generates heat and the bonding layer 5 and the sealing material 6 are heated, but the warpage between the bonding layer 5 and the sealing material 6 occurs. It is possible to accurately suppress or prevent the occurrence of peeling between the two due to this.

This sealing material 6 is comprised with the hardened | cured material of the resin composition for sealing materials containing a thermosetting resin.
Hereinafter, this composition for sealing materials is demonstrated.

  The thermosetting resin is not particularly limited. For example, phenol resin, epoxy resin, urea (urea) resin, resin having a triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide (BMI) resin, polyurethane resin , Diallyl phthalate resin, silicone resin, resin having a benzoxazine ring, cyanate ester resin, and the like, and one or more of them can be used in combination. Among these, since the phenol resin has good fluidity, the fluidity of the resin composition for a sealing material can be improved. Therefore, when the sealing material 6 is formed, the shape of the induction device 1 (especially the coil) Since the guiding device 1 can be sealed without depending on the shape 3), it is preferably used. Moreover, the adhesiveness with respect to the guidance apparatus 1 and the metal plate 4 can be improved.

  Examples of the phenol resin include unmodified phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, novolak type phenol resin such as arylalkylene type novolak resin, dimethylene ether type resole resin, methylol type resole resin and the like. And resole phenolic resins such as oil-modified resole phenolic resins modified with tung oil, linseed oil, walnut oil and the like.

  Moreover, when using a novolak-type phenol resin, although the hardening | curing agent is contained in the resin composition for sealing materials, hexamethylenetetramine is normally used as this hardening | curing agent. Further, when hexamethylenetetramine is used, its content is not particularly limited, but it is preferably 10 parts by weight or more and 30 parts by weight or less, more preferably 15 parts by weight or more with respect to 100 parts by weight of the novolac type phenol resin. 20 parts by weight or less is preferable. By setting the content of hexamethylenetetramine within the above range, the cured product of the resin composition for a sealing material, that is, the mechanical strength and molding shrinkage of the sealing material 6 can be improved.

  Among such phenol resins, it is preferable to use a resol type phenol resin. When a novolac type phenol resin is used as a main component, as described above, hexamethylenetetramine is usually used as a curing agent, and corrosive gas such as ammonia gas is generated when the novolac type phenol resin is cured. For this reason, the core portion 2 and the coil 3 included in the induction device 1 may corrode due to this, and therefore, a resol type phenol resin is preferably used as compared with a novolac type phenol resin.

  Moreover, a resol type phenol resin and a novolac type phenol resin can be used in combination. Thereby, while being able to raise the intensity | strength of the sealing material 6, toughness can also be improved.

  Examples of the epoxy resin include bisphenol type epoxy resins such as bisphenol A type, bisphenol F type and bisphenol AD type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, brominated bisphenol A type, bromine Brominated epoxy resin such as a fluorinated phenol novolak type, biphenyl type epoxy resin, naphthalene type epoxy resin, tris (hydroxyphenyl) methane type epoxy resin and the like. Among these, bisphenol A type epoxy resins, phenol novolac type epoxy resins, and cresol novolac type epoxy resins having a relatively low molecular weight are preferable. Thereby, the workability and moldability at the time of forming the sealing material 6 can be further improved. Further, from the viewpoint of heat resistance of the sealing material 6, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, and a tris (hydroxyphenyl) methane type epoxy resin are preferable, and a tris (hydroxyphenyl) methane type epoxy resin is particularly preferable.

  When using a tris (hydroxyphenyl) methane type epoxy resin, the number average molecular weight is not particularly limited, but is preferably 500 to 2000, and more preferably 700 to 1400.

  Moreover, when using an epoxy resin, it is preferable that a hardening | curing agent is contained in the resin composition for sealing materials. The curing agent is not particularly limited, and examples thereof include amine compounds such as aliphatic polyamines, aromatic polyamines and diciamine diamide, alicyclic acid anhydrides, acid anhydrides such as aromatic acid anhydrides, and novolak phenols. Examples thereof include polyphenol compounds such as resins, imidazole compounds, and the like. Among these, novolac type phenol resins are preferable. Thereby, while handling and the workability | operativity of the resin composition for sealing materials improve, it can make the resin composition for sealing materials excellent in the environmental aspect.

  In particular, when a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, or a tris (hydroxyphenyl) methane type epoxy resin is used as the epoxy resin, it is preferable to use a novolac type phenol resin as the curing agent. Thereby, the heat resistance of the hardened | cured material obtained from the resin composition for sealing materials can be improved. In addition, the addition amount of the curing agent is not particularly limited, but it is preferable that the curing width is within ± 10% by weight from the theoretical equivalent ratio of 1.0 to the epoxy resin.

  Moreover, the resin composition for sealing materials may contain a hardening accelerator with the said hardening | curing agent as needed. Although it does not specifically limit as a hardening accelerator, For example, an imidazole compound, a tertiary amine compound, an organic phosphorus compound, etc. are mentioned. Although content of a hardening accelerator is not specifically limited, It is preferable that it is 0.1-10 weight part with respect to 100 weight part of epoxy resins, and it is more preferable that it is 3-8 weight part.

  Moreover, it is preferable that the resin composition for sealing materials contains the fiber reinforcement which functions as a filler. Thereby, the mechanical strength and rigidity of the sealing material 6 itself can be made excellent.

  The fiber reinforcing material is not particularly limited. For example, glass fiber, carbon fiber, aramid fiber (aromatic polyamide), poly-p-phenylenebenzobisoxazole (PBO) fiber, polyvinyl alcohol (PVA) fiber, polyethylene (PE ) Fibers, plastic fibers such as polyimide fibers, inorganic fibers such as basalt fibers, and metal fibers such as stainless steel fibers. One or more of these can be used in combination.

  Further, these fiber reinforcements may be subjected to a surface treatment with a silane coupling agent for the purpose of improving the adhesion with the thermosetting resin. Although it does not specifically limit as a silane coupling agent, For example, an aminosilane coupling agent, an epoxy silane coupling agent, a vinyl silane coupling agent etc. are mentioned, It is used combining these 1 type (s) or 2 or more types. it can.

  Of these fiber reinforcements, it is preferable to use carbon fibers or aramid fibers. Thereby, the mechanical strength of the sealing material 6 can be further improved. In particular, the use of carbon fibers can further improve the wear resistance at high loads. In addition, from the viewpoint of further reducing the weight of the sealing material 6, it is preferably a plastic fiber such as an aramid fiber. Furthermore, from the viewpoint of improving the mechanical strength of the sealing material 6, it is preferable to use a fiber base material such as glass fiber or carbon fiber as the fiber reinforcing material.

  The content of the fiber reinforcement in the cured product is, for example, 10% by volume or more, preferably 20% by volume or more, and more preferably 25% by volume or more with respect to the total amount of the cured product. Moreover, the upper limit of content of the fiber reinforcement with respect to hardened | cured material whole quantity is although it does not specifically limit, Preferably it is 80 volume% or less. Thereby, the mechanical strength of the sealing material 6 can be improved reliably.

  Furthermore, the resin composition for a sealing material may contain a material other than the fiber reinforcing material as the filler, and the filler may be either an inorganic filler or an organic filler.

  As the inorganic filler, for example, one or more selected from titanium oxide, zirconium oxide, silica, calcium carbonate, boron carbide, clay, mica, talc, wollastonite, glass beads, milled carbon, graphite and the like are used. . The inorganic filler preferably contains a metal oxide such as titanium oxide, zirconium oxide, or silica. Thereby, the oxide film with which a metal oxide is provided exhibits the function as a passivating film | membrane, and can improve the acid resistance as the whole hardened | cured material.

  As the organic filler, one or more selected from polyvinyl butyral, acrylonitrile butadiene rubber (NBR), pulp, wood powder, and the like are used. The acrylonitrile butadiene rubber may be either partially crosslinked or carboxy modified type. Of these, acrylonitrile butadiene rubber is preferred from the viewpoint of further enhancing the effect of improving the toughness of the cured product.

  In addition to the components described above, additives such as a mold release agent, a curing aid, and a pigment may be added to the resin composition for a sealing material.

  Moreover, in the induction device 1 having the above-described configuration, the coil 3 is provided by winding a linear body composed of the copper wire 31 and the resin layer 32 around the core portion 2. As shown in FIG. 3, a gap 35 is formed between the linear bodies adjacent in the left and right (in the direction of the central axis 11) in the figure.

  In such a gap 35, the bonding layer 5 is embedded (filled) in the gap 35 at a position corresponding to a region where the end face 33 of the coil 3 is bonded to the bonding layer 5. Thereby, since the contact area of the joining layer 5 and the coil 3 becomes large, the adhesiveness between the joining layer 5 and the induction device 1 and the heat transfer property from the induction device 1 to the joining layer 5 can be improved. In this case, at the position where the end face 33 faces the bonding layer 5, the thickness of the bonding layer 5 is thinner than the average thickness, but is preferably 10 μm or more and 50 μm or less, preferably 20 μm or more, More preferably, it is 30 μm or less. Thereby, the insulation between the coil 3 and the metal plate 4 can be ensured reliably.

  Further, in the region excluding the position corresponding to the region where the end surface 33 is bonded to the bonding layer 5, that is, in the region where the bonding layer 5 of the gap 35 is not embedded, the gap 35 is filled with the sealing material 6. . Thereby, since the contact area of the sealing material 6 and the coil 3 becomes large, sealing by the sealing material 6 of the guidance apparatus 1 can be performed with more excellent adhesiveness. In addition, since vibration generated by excitation in the coil 3 can be reduced, noise during excitation of the coil 3 can be reduced, and durability of the substrate assembly 10 can be improved.

  Further, until the bonding layer 5 and the sealing material 6 come into contact with each other to form the interface 14, the sealing material 6 is filled without forming a gap in the gap 35. In addition, at the interface 14 between the bonding layer 5 and the sealing material 6, it is preferable that the filler contained in the bonding layer 5 is dispersed on the sealing material 6 side. Accordingly, it can be said that a state in which the bonding layer 5 and the sealing material 6 are mixed is formed at the interface 14, and the adhesion between the bonding layer 5 and the sealing material 6 is improved. Therefore, the durability of the substrate assembly 10 can be made excellent.

  In this embodiment, the substrate assembly 10 having such a configuration is disposed in a housing 7 including a bottom 71 functioning as a pedestal having heat dissipation and a frame 72 standing at an edge of the bottom 71 ( (See FIG. 1). In the guidance device structure 100, since the guidance device 1 is sealed by being surrounded by the bonding layer 5 and the sealing material 6, the guidance device 1 is simply sealed in the housing 7. Stop is secured. That is, the sealing performance of the guidance device 1 can be ensured without potting a liquid material containing urethane resin or the like with respect to the housing 7. Furthermore, since each metal plate 4 in contact with the housing 7 has excellent heat dissipation, the heat Q generated by the induction device 1 can be transmitted to the housing 7.

  Moreover, both the bottom part 71 and the frame 72 are comprised with insulating aluminum, its alloy, etc. so that the outstanding heat dissipation may be exhibited.

Second Embodiment
FIG. 4 is a cross-sectional view showing a second embodiment of the substrate assembly of the present invention.

  Hereinafter, a second embodiment of the substrate assembly of the present invention will be described with reference to this figure, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.

  The present embodiment is the same as the first embodiment except that the size of the second heat dissipation substrate is different.

  As shown in FIG. 4, in this embodiment, the first heat dissipation board 20A and the second heat dissipation board 20B have different sizes, and the second heat dissipation board 20B is more than the first heat dissipation board 20A. small. The size (area) of the second heat dissipation board 20B is preferably 20% or more and 80% or less, for example, 30% or more and 50% or less of the size (area) of the first heat dissipation board 20A. More preferably. Further, the second heat dissipation board 20B is unevenly distributed on the first heat dissipation board 20A side.

  Such a configuration is effective when it is desired to preferentially dissipate heat from the lower surface 12 side, that is, when it is desired to suppress the degree of heat radiation from the right side surface 13 side.

  In the present embodiment, the second heat dissipation board 20B is smaller than the first heat dissipation board 20A, but the present invention is not limited to this, and the magnitude relationship may be reversed.

  As mentioned above, although the board | substrate assembly of this invention was demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises a board | substrate assembly is arbitrary structures which can exhibit the same function. Can be substituted. Moreover, arbitrary components may be added.

  In addition, the substrate assembly of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In addition, the number of heat dissipating boards provided in the board assembly is two in each embodiment, but is not limited thereto, and may be three or more, for example.

  In addition, the outline shape of the guidance device viewed from the central axis direction is a quadrangle in each of the embodiments described above, but is not limited thereto, and may be a polygon such as a triangle, a pentagon, and a hexagon.

  Moreover, although the end surface of the coil is configured as a flat surface in each of the embodiments described above, the present invention is not limited thereto, and may be rounded, for example.

  Further, as described above, the heating element in the present invention is not limited to the ones in the above embodiments, that is, not limited to the induction device.

DESCRIPTION OF SYMBOLS 1 Guide apparatus 11 Center axis | shaft 12 Lower surface 13 Right side 14 Interface 2 Core part 21 Corner | angular part 3 Coil 31 Copper wire 32 Resin layer 33 End surface 35 Gap 36 One end part 37 Other end part 4 Metal plate 5 Bonding layer (bonding material)
6 Sealant 7 Housing 71 Bottom 72 Frame 10 Substrate Assembly 20A First Heat Dissipation Board (Lower Side Heat Dissipation Board)
20B Second heat dissipation board (side surface heat dissipation board)
40 Guiding device sealing material 50 Adhesive layer 60 Sealing material 70 Housing 100 Guiding device structure Q Heat

Claims (13)

A heating element that emits heat;
A plurality of heat dissipating substrates that are composed of a cured or solidified resin composition mainly containing a resin material and a filler, have a bonding layer bonded to the heating element, and dissipate heat generated by the heating element. Prepared,
The substrate assembly, wherein the plurality of heat dissipating boards are arranged around a central axis when the central axis of the heating element is assumed. Two heat dissipation substrates are provided,
The heating element is a guide device having a polygonal outline when viewed from the central axis direction,
The substrate assembly according to claim 1, wherein each of the heat dissipating substrates is disposed to face two adjacent sides of the polygon. The induction device includes a core portion and a coil formed by winding a conductive linear body around the core portion, and both end portions of the linear body protrude in the same direction,
The board assembly according to claim 2, wherein each of the heat dissipation boards is not arranged in a protruding direction of both ends of the linear body with respect to the coil. A gap is formed between the linear bodies adjacent in the central axis direction,
4. The substrate assembly according to claim 3, wherein a bonding layer is embedded in the gap at a position corresponding to a region where the end face of the coil is bonded to the bonding layer in the gap. 5.   The board assembly according to any one of claims 1 to 4, wherein the heat dissipation boards adjacent to each other around the central axis have different sizes.   The substrate assembly according to claim 1, wherein the resin material is a thermosetting resin.   The board assembly according to claim 6, wherein the thermosetting resin is an epoxy resin.   The substrate assembly according to any one of claims 1 to 7, wherein the filler is a granular body mainly composed of aluminum oxide.   The board assembly according to any one of claims 1 to 8, wherein the heat dissipation board includes a metal plate disposed on a side of the bonding layer opposite to the heating element.   The substrate assembly according to any one of claims 1 to 9, further comprising: a sealing material that seals the heating element by covering the heating element together with the bonding layer.   The said sealing material is a board | substrate assembly of Claim 10 comprised with the hardened | cured material of the resin composition for sealing materials containing a thermosetting resin.   The board assembly according to claim 11, wherein the thermosetting resin in the encapsulating resin composition is a phenol resin.   The substrate assembly according to any one of claims 10 to 12, wherein the filler is dispersed on the sealing material side at an interface between the bonding layer and the sealing material.

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