JP2016018827A - Heating element support substrate and substrate assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating element support substrate of high versatility that can be used for various heating elements, and to provide a substrate assembly including such a heating element support substrate.SOLUTION: A heating element support substrate 20 supports an induction device 1 as a heating element. The heating element support substrate 20 includes a heat receiving metal plate 8 coming into contact with the induction device 1 and receiving heat generated therefrom, a heat dissipation metal plate 4 arranged on the side of the heat receiving metal plate 8 opposite from the induction device 1, and dissipating heat received by the heat receiving metal plate 8, and a bonding material 5 interposed between by the heat receiving metal plate 8 and the heat dissipation metal plate 4, and bonding these metal plates. The bonding material 5 is mainly composed of a hardened or solidified resin composition for bonding material mainly containing a resin material and a filler.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heating element support substrate and a substrate assembly.

  In recent years, hybrid vehicles have been put into practical use from the viewpoint of protecting the global environment. A hybrid vehicle is a vehicle that includes an engine and a motor as drive sources and travels using one or both of them.

  In such a hybrid vehicle, the direct current of the battery is converted into alternating current by an inverter, and the alternating current is supplied to a motor for traveling. In particular, recent hybrid vehicles include a step-up converter (DC-DC converter) to reduce the size of the battery and motor. The boost converter has a role of boosting the voltage of the battery and supplying it to the inverter (motor), and a role of reducing the regenerative current from the generator (motor) to the battery voltage and charging the battery. The induction device can store electric energy as magnetic energy, and is used as one of components included in the boost converter (see, for example, Patent Document 1).

  For example, as shown in FIG. 5, such a guide device 1 has a configuration including a core portion 2 and a coil 3 wound around the core portion 2. In addition to being fixed to the bottom via the sealing member 60, it is sealed with a sealing material 60 (conventional guidance device sealing object 40). Thereby, heat generated by excitation in the coil 3 of the induction device 1 is radiated from the induction device 1 by being transmitted to the bottom of the housing 70 via the adhesive layer 50.

  However, in the configuration shown in FIG. 5, the formation area of the adhesive layer 50 has to be changed according to the size of the guidance device 1, and the versatility was poor.

JP 2004-241475 A

  An object of the present invention is to provide a highly versatile heating element support substrate that can be used for various heating elements, and a substrate assembly including the heating element support substrate.

Such an object is achieved by the present inventions (1) to (16) below.
(1) A heating element support substrate for supporting a heating element that generates heat,
A heat-receiving metal plate that is in contact with the heating element and receives heat generated by the heating element;
A heat-dissipating metal plate disposed on the opposite side of the heat-receiving metal plate to the heat-generating body and dissipating the heat received by the heat-receiving metal plate;
It is interposed between the heat receiving metal plate and the heat radiating metal plate, and includes a bonding material that joins the heat receiving metal plate and the heat radiating metal plate,
The heating element support substrate, wherein the bonding material is mainly composed of a cured or solidified resin composition for a bonding material containing a resin material and a filler.

(2) The heating element support substrate according to (1), wherein the resin material is a thermosetting resin.
(3) The heating element support substrate according to (2), wherein the thermosetting resin is an epoxy resin.

  (4) The heating element support substrate according to any one of (1) to (3), wherein the filler is a granular body mainly composed of aluminum oxide.

  (5) The heating element support substrate according to any one of (1) to (4), wherein a thickness of the heat receiving metal plate and a thickness of the heat dissipation metal plate are different from each other.

  (6) The heating element support substrate according to (5), wherein the heat receiving metal plate is thicker than the heat radiating metal plate.

  (7) The heating element support substrate according to (5) or (6), wherein the thickness of the bonding material is thinner than any of the thickness of the heat receiving metal plate and the thickness of the heat dissipation metal plate.

  (8) The heating element support substrate according to any one of (1) to (7), wherein the heat dissipation metal plate includes the heat receiving metal plate in a plan view of the heating element support substrate.

  (9) The heating element support substrate according to any one of (1) to (8), wherein a constituent material of the heat receiving metal plate and a constituent material of the heat dissipation metal plate are different from each other.

(10) The constituent material of the heat receiving metal plate is aluminum or an aluminum alloy,
The constituent material of the said heat radiating metal plate is a heat generating body support substrate as described in said (9) which is copper or a copper alloy.

  (11) The heating element support substrate according to any one of (1) to (10), further including a sealing material that collectively seals the heat receiving metal plate, the heat radiating metal plate, and the bonding material.

  (12) The heating element support substrate according to (11), wherein the sealing material is formed of a cured product of a resin composition for a sealing material containing a thermosetting resin.

  (13) The heating element support substrate according to (12), wherein the thermosetting resin in the resin composition for a sealing material is a phenol resin.

  (14) At least one of the heat receiving metal plate and the heat radiating metal plate is formed with a thin portion having a small thickness, and can be bent at the thin portion. The heating element support substrate according to any one of the above.

(15) The heating element support substrate according to any one of (1) to (14),
A substrate assembly, comprising: a heating element that is supported by the heating element support substrate and generates heat.
(16) The board assembly according to (15), wherein the heating element is a guidance device.

  According to the present invention, it is possible to provide a highly versatile heating element support substrate that can be used for various heating elements, and to provide a substrate assembly including such a heating element support substrate. it can.

FIG. 1 is a partial vertical cross-sectional view showing a first embodiment of a substrate assembly (heating element support substrate) of the present invention. FIG. 2 is a diagram (plan view) seen from the direction of arrow A in FIG. FIG. 3 is an enlarged cross-sectional view of a region [B] surrounded by an alternate long and short dash line in FIG. FIG. 4 is a partial longitudinal sectional view showing a second embodiment of the substrate assembly (heating element supporting substrate) of the present invention. It is a longitudinal cross-sectional view which shows embodiment of the conventional guidance device sealing object.

  Hereinafter, the heating element support substrate and the substrate assembly of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  The heating element in the present invention may be any heating element as long as it seals the heating element that generates heat by conduction. For example, the heating element includes a resistor such as a thermistor, a transformer, and a coil. , Relay elements such as switches, capacitors, diode power MOSFETs, power transistors such as insulated gate bipolar transistors (IGBT), and power modules combining these, induction devices, regulators (rectifiers), LEDs (light emitting diodes), LDs (Laser diodes), light emitting elements such as organic EL elements, integrated circuit elements such as LSI and CPU, temperature sensors, motors, battery packs, and the like. Below, the case where it applies to an induction device as a heat generating body is demonstrated to an example.

<First Embodiment>
FIG. 1 is a partial vertical cross-sectional view showing a first embodiment of a substrate assembly (heating element support substrate) of the present invention. FIG. 2 is a diagram (plan view) seen from the direction of arrow A in FIG. FIG. 3 is an enlarged cross-sectional view of a region [B] surrounded by an alternate long and short dash line in FIG. In the following, for convenience of explanation, the upper side in FIGS. 1 and 3 (the same applies to FIG. 4) is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.

  A guidance device structure 100 shown in FIG. 1 includes a substrate assembly 10 having a guidance device 1 (boost coil) and a housing 7 that houses the substrate assembly 10. For example, in a hybrid vehicle, an electric vehicle, and the like, It is mounted as a component of the boost converter included in these.

  The board assembly 10 includes an induction device 1 and a support substrate (a heating element support substrate) 20 that supports the induction device 1, and is an assembly obtained by assembling and sealing them together.

  The induction device 1 is a heating element that generates heat when energized, can store electrical energy as magnetic energy, and is used as one of the components included in the boost converter.

  Moreover, the support substrate 20 has the heat radiating metal plate 4, the joining material (joining layer) 5, and the heat receiving metal plate 8, and these are laminated | stacked in order from the downward direction. The support substrate 20 also includes a sealing material (sealing portion) 6 that seals the heat radiating metal plate 4, the bonding material (bonding layer) 5, and the heat receiving metal plate 8 together with the induction device 1.

  As shown in FIG. 1, the guidance device 1 includes a core part 2 and a coil 3 wound around the core part 2.

  In this embodiment, the core portion 2 is configured by an I-type core having a linear shape in plan view, and a coil 3 is provided on the outer peripheral portion thereof via an insulating bobbin or insulating paper (not shown).

  Moreover, this core part (I type core) 2 is comprised with the powder magnetic core formed by press-molding magnetic powder, and as such magnetic powder, although not specifically limited, for example, iron, iron-silicon type Alloys, iron-nitrogen alloys, iron-nickel alloys, iron-carbon alloys, iron-boron alloys, iron-cobalt alloys, iron-phosphorus alloys, iron-nickel-cobalt alloys and iron-aluminum- Examples thereof include silicon-based alloys.

  The coil 3 is formed by winding a linear body obtained by coating the surface of the copper wire 31 with the resin layer 32 around the core portion 2, and the resin layer 32 is formed on the surface of the copper wire 31. Insulating properties of the coil 3 are maintained by forming them.

  Although it does not specifically limit as a constituent material of this resin layer 32, For example, a polyester resin, a polyesterimide resin, a polyamideimide resin, a polyimide resin, a polyurethane resin etc. are mentioned, Among these, 1 type or 2 types or more are mentioned. They can be used in combination. Among these, a polyamideimide resin is preferable. Thereby, the insulation of the copper wire 31, ie, the insulation of the coil 3, can be ensured reliably. Moreover, the adhesiveness with respect to the sealing material 6 can be made excellent.

  Moreover, the thickness of the resin layer 32 is, for example, preferably 10 μm or more and 50 μm or less, more preferably 20 μm or more and 30 μm or less. Thereby, the insulation of the copper wire 31, ie, the insulation of the coil 3, can be ensured reliably.

  Moreover, as shown in FIG. 3, the cross-sectional shape of the end surface (outer peripheral surface) 33 located on the outer peripheral side of the coil 3 is flat. Thereby, compared with the case where the end surface 33 is rounded, the contact area with respect to the heat receiving metal plate 8 can be ensured large, Therefore, the grade of the transmission of the heat from the induction | guidance | derivation apparatus 1 to the heat receiving metal plate 8 improves. .

  A support substrate 20 is disposed immediately below the guidance device 1. As described above, the support substrate 20 includes the heat receiving metal plate 8 and the heat radiating metal plate 4 which are bonded to each other via the bonding material 5.

  As shown in FIG. 1, the heat receiving metal plate 8 is a member that contacts the coil 3 of the induction device 1 from the outer peripheral side and receives heat Q generated by excitation in the coil 3 when energized. As shown in FIG. 2, the size of the heat receiving metal plate 8 is larger than the size of the guidance device 1 in a plan view of the support substrate 20. Thereby, when determining the arrangement position of the induction device 1 with respect to the heat receiving metal plate 8, for example, it can be determined to a desired position according to the use environment or use state of the induction device structure 100. Thus, the support substrate 20 has high versatility. In the present embodiment, as shown in FIGS. 1 and 2, the induction device 1 is arranged unevenly on the left side in the drawing with respect to the central portion of the heat receiving metal plate 8.

  On the opposite side of the heat receiving metal plate 8 from the induction device 1, that is, on the lower side of the heat receiving metal plate 8, the heat radiating metal plate 4 is disposed. The heat radiating metal plate 4 is a member that transmits the heat Q received by the heat receiving metal plate 8 to the bottom portion 71 of the housing 7 and releases it.

As shown in FIG. 3, the thickness t ₈ of the heat-receiving metal plate 8 and the thickness t ₄ of the radiation metal plate 4 are different from each other, i.e., the thickness t ₈ of the heat-receiving metal plate 8, the heat radiating metal plate It is thicker than a thickness t4 of ₄ . The thickness _{t 4,} for example, is preferably about 5 to 250 microns, and more preferably about 12～105Myuemu. The thickness _{t 8,} for example, 1 mm or more, preferably not more than 3 mm.

In addition, as shown in FIG. 2, in the present embodiment, the heat radiating metal plate 4 and the heat receiving metal plate 8 each have a rectangular shape, and the central portions overlap each other, that is, are concentrically arranged in plan view. ing. The area S ₄ of the heat radiating metal plate 4 is larger than the area S ₈ of the heat receiving metal plate 8, and the heat radiating metal plate 4 includes the heat receiving metal plate 8. The area S ₈ is preferably not more than the projected area of the induction device 1.

  Combined with the magnitude relationship of such thickness and the inclusion relationship (positional relationship) in plan view, the heat Q diffuses as wide as possible in the heat receiving metal plate 8 before reaching the heat radiating metal plate 4, As a result, the heat radiating metal plate 4 quickly radiates heat (see FIG. 1), that is, the heat radiating efficiency is improved. Moreover, when the sealing material 6 is comprised with the thermosetting resin, there exists a heat insulation effect. Therefore, when the heat dissipation mechanism is installed on the bottom 71 side of the housing 7, the heat Q can partially diffuse the heat Q over a wide range, and the part to be insulated can block the heat Q. Furthermore, the heat generated by the excitation in the coil 3 can be efficiently transmitted to the bottom 71 of the housing 7 via the bonding material 5 and the heat radiating metal plate 4.

  The constituent material of the heat receiving metal plate 8 and the constituent material of the heat radiating metal plate 4 are different from each other. For example, the constituent material of the heat receiving metal plate 8 is preferably aluminum or an aluminum alloy, and the constituent material of the heat radiating metal plate 4 is copper or Copper alloys are preferred. Such a metal material has a relatively high thermal conductivity, and the heat dissipation efficiency for the induction device 1 can be improved.

  When the heat receiving metal plate 8 is made of aluminum or an aluminum alloy and the heat radiating metal plate 4 is made of copper or a copper alloy, the heat radiating metal plate 4 has a higher thermal conductivity than the heat receiving metal plate 8. Thereby, when the heat Q is transmitted to the heat receiving metal plate 8, it is once diffused over a wide range as much as possible, and reaches the heat radiating metal plate 4 in the diffused state. In the heat radiating metal plate 4, heat radiation is promoted more than in the heat receiving metal plate 8, and thus the heat Q is quickly released to the outside.

  The heat conductivity of the heat radiating metal plate 4 is preferably 3 W / m · K or more and 500 W / m · K or less, more preferably 10 W / m · K or more and 400 W / m · K or less. . The heat conductivity of the heat receiving metal plate 8 is preferably 15 W / m · K or more and 500 W / m · K or less, and is 200 W / m · K (aluminum) or more and 400 W / m · K or less (copper). It is more preferable.

  A bonding material 5 is interposed between the heat receiving metal plate 8 and the heat radiating metal plate 4. This joining material 5 joins the heat receiving metal plate 8 and the heat radiating metal plate 4. The bonding material 5 covers the entire upper surface 41 of the heat radiating metal plate 4 in a layered manner.

  The bonding material 5 is configured to exhibit excellent thermal conductivity. Thereby, the bonding material 5 can reliably transmit the heat Q on the induction device 1 side to the heat radiating metal plate 4.

  The bonding material 5 having a high thermal conductivity is preferably used. Specifically, the bonding material 5 is preferably 1 W / m · K or more and 15 W / m · K or less, preferably 5 W / m · K or more. More preferably, it is 10 W / m · K or less. Accordingly, the bonding material 5 can efficiently transmit the heat Q on the induction device 1 side to the heat radiating metal plate 4.

The thickness _{t 5} of the bonding material 5, the thickness _{t 8} of the heat-receiving metal plate 8, thinner than any of the thickness of the thickness _{t 4} of the radiation metal plate 4, for example, is preferably about 40Myuemu～300myuemu, 60 [mu] m More preferably, it is about ~ 200 μm. Thereby, the thermal conductivity of the bonding material 5 can be improved while ensuring the bonding property between the heat receiving metal plate 8 and the heat radiating metal plate 4. Therefore, heat generated by excitation in the coil 3 can be efficiently transmitted to the bottom 71 of the housing 7 through the bonding material 5 and the heat radiating metal plate 4.

  In addition, it is preferable that it is about 60-300 micrometers, for example, and, as for the total average thickness of the heat sink metal plate 4 and the joining material 5, it is more preferable that it is about 115-270 micrometers. By setting the total average thickness within such a numerical range, the induction device 1 can be reduced in size while ensuring the necessary mechanical strength of the induction device 1 and the heat generated by excitation in the coil 3 can be reduced. Further, it can be efficiently transmitted to the bottom portion 71 of the housing 7 through the bonding material 5 and the heat radiating metal plate 4.

  The bonding material 5 has a glass transition temperature of preferably 100 ° C. or higher and 200 ° C. or lower. Thereby, since the rigidity of the bonding material 5 can be increased and the warpage of the bonding material 5 can be reduced, peeling between the heat receiving metal plate 8 and the heat radiating metal plate 4 can be prevented.

  The glass transition temperature of the bonding material 5 can be measured as follows based on JIS C 6481.

  Using a dynamic viscoelasticity measuring apparatus (DMA / 983 manufactured by TA Instruments Inc.), applying a tensile load under a nitrogen atmosphere (200 ml / min), a frequency of 1 Hz, a temperature of −50 ° C. to 300 ° C. The range is measured at a temperature rising rate of 5 ° C./min, and the glass transition temperature Tg is obtained from the peak position of tan δ.

  Further, the elastic modulus (storage elastic modulus) E ′ at 25 ° C. of the bonding material 5 is preferably 10 GPa or more and 70 GPa or less. Thereby, since the rigidity of the bonding material 5 is increased, warpage generated in the bonding material 5 can be reduced. As a result, the bonding reliability with the heat receiving metal plate 8 and the heat radiating metal plate 4 can be maintained.

  The storage elastic modulus can be measured with a dynamic viscoelasticity measuring device. Specifically, the storage elastic modulus E ′ is obtained by applying a tensile load to the bonding material 5, a frequency of 1 Hz, and a heating rate of 5 It is measured as the value of the storage elastic modulus at 25 ° C. when measured from −50 ° C. to 300 ° C. at −10 ° C./min.

  The bonding material 5 having such a function has a configuration in which fillers are dispersed in a layer composed of a resin material as a main material.

  The resin material exhibits a function as a binder for holding the filler in the bonding material 5, and the filler has a thermal conductivity higher than that of the resin material. By making the bonding material 5 have such a configuration, the thermal conductivity of the bonding material 5 can be increased.

  In the present invention, such a bonding material 5 is composed of a solidified product or a cured product formed by solidifying or curing a resin composition for a bonding material mainly containing a resin material and a filler. That is, the bonding material 5 is composed of a cured product or a solidified product obtained by forming the resin composition for bonding material into a layer shape.

  As described above, the resin composition for a bonding material mainly includes a resin material and a filler.

  The resin material is not particularly limited, and various resin materials such as a thermoplastic resin and a thermosetting resin can be used.

  Examples of the thermoplastic resin include polyolefins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymer, modified polyolefins, polyamides (eg, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 11, nylon 12). , Nylon 6-12, nylon 6-66), thermoplastic polyimide, aromatic polyester and other liquid crystal polymers, polyphenylene oxide, polyphenylene sulfide, polycarbonate, polymethyl methacrylate, polyether, polyether ether ketone, polyether imide, polyacetal, Styrene, polyolefin, polyvinyl chloride, polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluoro rubber, salt Various thermoplastic elastomers, etc., or a copolymer of these His polyethylene type or the like, blends, polymer alloys and the like, can be used as a mixture of two or more of them.

  On the other hand, examples of the thermosetting resin include epoxy resin, phenol resin, urea resin, melamine resin, polyester (unsaturated polyester) resin, polyimide resin, silicone resin, polyurethane resin, and the like. Or 2 or more types can be mixed and used.

  Among these, as a resin material used for the resin composition for bonding material, it is preferable to use a thermosetting resin, and it is more preferable to use an epoxy resin. Thereby, the heat resistance of the obtained bonding material 5 can be made excellent. Further, the heat receiving metal plate 8 and the heat radiating metal plate 4 can be firmly bonded via the bonding material 5. Therefore, the heat dissipation and durability of the obtained substrate assembly 10 can be made excellent. The substrate assembly 10 is sufficiently larger in size in plan view than the induction device 1, and therefore, when radiating heat, the substrate assembly 10 can be used for a heating element such as the induction device 1 and other various heating elements. Therefore, it is highly versatile to be used suitably. As described above, the heating element in the present invention is not limited to the one in this embodiment, that is, not limited to the induction device.

  Moreover, it is preferable that an epoxy resin contains the epoxy resin (A) which has at least any one of an aromatic ring structure and an alicyclic structure (alicyclic carbocyclic structure). By using such an epoxy resin (A), the glass transition temperature can be increased and the thermal conductivity of the bonding material 5 can be further improved. Moreover, the adhesiveness with respect to the heat receiving metal plate 8 and the heat radiating metal plate 4 can be improved.

  Examples of the epoxy resin (A) having an aromatic ring or alicyclic structure include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, Bisphenol P type epoxy resin, bisphenol type epoxy resin such as bisphenol Z type epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, novolak type epoxy resin such as tetraphenol group ethane type novolak type epoxy resin, biphenyl type epoxy resin , Arylalkylene type epoxy resins such as phenol aralkyl type epoxy resins having a biphenylene skeleton, and epoxy resins such as naphthalene type epoxy resins. It can be used in combination of at least Chino one or.

  The epoxy resin (A) is preferably a naphthalene type epoxy resin. Thereby, a glass transition temperature can be made still higher, generation | occurrence | production of the void of the joining material 5 can be suppressed, thermal conductivity can be improved further, and a dielectric breakdown voltage can be improved.

  The naphthalene type epoxy resin is one having a naphthalene ring skeleton and having two or more glycidyl groups.

  The content of the naphthalene type epoxy resin in the epoxy resin is preferably 20% by mass or more and 80% by mass or less, more preferably 40% by mass or more and 60% by mass or less with respect to 100% by mass of the epoxy resin. is there.

  Examples of the naphthalene type epoxy resin include any of the following formulas (5) to (8).

［式中、ｍ、ｎはナフタレン環上の置換基の個数を示し、それぞれ独立して１〜７の整数を示す。］

[Wherein, m and n represent the number of substituents on the naphthalene ring, and each independently represents an integer of 1 to 7. ]

  In addition, as a compound of Formula (6), it is preferable to use any 1 or more types of the following.

［式中、Ｍｅはメチル基を示し、ｌ、ｍ、ｎは１以上の整数を示す。］

[Wherein, Me represents a methyl group, and l, m, and n represent an integer of 1 or more. ]

［式中、ｎは１以上、２０以下の整数であり、ｌは１以上、２以下の整数であり、Ｒ_１はそれぞれ独立に水素原子、ベンジル基、アルキル基または下記式（９）で表される構造であり、Ｒ_２はそれぞれ独立に水素原子またはメチル基である。］

[Wherein, n is an integer of 1 or more and 20 or less, l is an integer of 1 or more and 2 or less, and R ₁ is independently a hydrogen atom, a benzyl group, an alkyl group or the following formula (9). And each R ₂ independently represents a hydrogen atom or a methyl group. ]

［式中、Ａｒはそれぞれ独立にフェニレン基またはナフチレン基であり、Ｒ_２はそれぞれ独立に水素原子またはメチル基であり、ｍは１または２の整数である。］

[Wherein, Ar is each independently a phenylene group or a naphthylene group, R ₂ is each independently a hydrogen atom or a methyl group, and m is an integer of 1 or 2. ]

  The naphthalene type epoxy resin of the formula (8) is classified as a so-called naphthylene ether type epoxy resin, and the compound represented by the formula (8) is exemplified by those represented by the following formula (10). It is done.

［上記式（１０）式において、ｎは１以上、２０以下の整数であり、好ましくは１以上、１０以下の整数であり、より好ましくは１以上、３以下の整数である。Ｒはそれぞれ独立に水素原子または下記式（１１）で表される構造であり、好ましくは水素原子である。］

[In the above formula (10), n is an integer of 1 or more and 20 or less, preferably an integer of 1 or more and 10 or less, more preferably an integer of 1 or more and 3 or less. Each R is independently a hydrogen atom or a structure represented by the following formula (11), preferably a hydrogen atom. ]

［上記式（１１）式において、ｍは１または２の整数である。]

[In the above formula (11), m is an integer of 1 or 2. ]

  Furthermore, specific examples of the naphthylene ether type epoxy resin represented by the above formula (10) include those represented by the following formulas (12) to (16).

  Further, the content of the resin material is preferably 30% by volume or more and 70% by volume or less, and preferably 40% by volume or more and 60% by volume or less of the entire resin composition for bonding material (excluding the solvent). Is more preferable. Thereby, the mechanical strength and thermal conductivity of the obtained bonding material 5 can be made excellent. Moreover, the adhesiveness with respect to the heat receiving metal plate 8 and the heat radiating metal plate 4 can be improved.

  On the other hand, when the content is less than the lower limit, depending on the type of the resin material, the resin material cannot sufficiently exhibit a function as a binder for bonding fillers, and the obtained bonding material 5 is obtained. There is a risk that the mechanical strength of the steel will decrease. In addition, depending on the constituent material of the resin composition for bonding material, the viscosity of the resin composition for bonding material becomes too high, and it becomes difficult to perform the filtering operation and layer forming (coating) of the resin composition for bonding material (varnish). Otherwise, the flow of the bonding material resin composition becomes too small, and a void may be generated in the bonding material 5.

  On the other hand, if the content exceeds the upper limit, depending on the type of the resin material, it may be difficult to make the bonding material 5 excellent in thermal conductivity while ensuring the insulation of the bonding material 5. There is.

  Moreover, when the resin material contains an epoxy resin, the bonding material resin composition preferably contains a phenoxy resin. Thereby, since the bending resistance of the bonding material 5 can be improved, it is possible to suppress a decrease in handling properties of the bonding material 5 due to high filling of the filler.

  Moreover, when a phenoxy resin is contained, the fluidity | liquidity at the time of a press reduces by an increase in a viscosity, and it can suppress that a void etc. generate | occur | produce. Further, the adhesion between the bonding material 5, the heat radiating metal plate 4 and the induction device 1 is improved. These synergistic effects can further increase the insulation reliability and thermal conductivity of the substrate assembly 10.

  Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having an anthracene skeleton, and a phenoxy resin having a biphenyl skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

  Among these, it is preferable to use bisphenol A type or bisphenol F type phenoxy resin. A phenoxy resin having both a bisphenol A skeleton and a bisphenol F skeleton may be used.

The weight average molecular weight of the phenoxy resin is not particularly limited, but is preferably 4.0 × 10 ⁴ or more and 8.0 × 10 ⁴ or less.

  In addition, the weight average molecular weight of a phenoxy resin is a value in terms of polystyrene measured by gel permeation chromatography (GPC).

  The content of the phenoxy resin is preferably 1% by mass or more and 15% by mass or less, more preferably 2% by mass or more and 10% by mass or less with respect to 100% by mass of the total solid content of the resin composition for bonding material, for example. is there.

  In addition, such a resin composition for a bonding material contains a curing agent as necessary depending on the type of the resin material described above (for example, in the case of an epoxy resin).

  The curing agent is not particularly limited, and examples thereof include amide curing agents such as dicyandiamide and aliphatic polyamide, amine curing agents such as diaminodiphenylmethane, methanephenylenediamine, ammonia, triethylamine, and diethylamine, bisphenol A, and bisphenol F. And phenolic curing agents such as phenol novolac resin, cresol novolak resin, p-xylene-novolak resin, and acid anhydrides.

  Moreover, the resin composition for bonding materials may further contain a curing catalyst (curing accelerator). Thereby, the sclerosis | hardenability of the resin composition for joining materials can be improved.

  Examples of the curing catalyst include amine catalysts such as imidazoles, 1,8-diazabicyclo (5,4,0) undecene, phosphorus catalysts such as triphenylphosphine, and the like. Of these, imidazoles are preferred. Thereby, especially the quick-hardening property and the preservability of the resin composition for bonding material can be made compatible.

  Examples of imidazoles include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ′)]-Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 -[2'-Methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole Null acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino -6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine isocyanuric acid adduct, etc. Can be mentioned. Among these, 2-phenyl-4,5-dihydroxymethylimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole is preferable. Thereby, especially the preservability of the resin composition for bonding materials can be improved.

  Moreover, the content of the curing catalyst is not particularly limited, but is preferably about 0.01 to 30 parts by mass, more preferably about 0.5 to 10 parts by mass with respect to 100 parts by mass of the resin material. preferable. When the content is less than the lower limit, the curability of the bonding material resin composition may be insufficient. On the other hand, when the content exceeds the upper limit, the bonding material resin composition It shows a tendency to decrease the storage stability.

  The average particle diameter of the curing catalyst is not particularly limited, but is preferably 10 μm or less, and more preferably 1 to 5 μm. When the average particle size is within the above range, the reactivity of the curing catalyst is particularly excellent.

  Moreover, it is preferable that the resin composition for bonding materials further contains a coupling agent. Thereby, the adhesiveness of the resin material with respect to a filler, the heat-receiving metal plate 8, and the heat radiating metal plate 4 can be improved more.

  Examples of such coupling agents include silane coupling agents, titanium coupling agents, aluminum coupling agents, and the like. Of these, silane coupling agents are preferred. Thereby, the heat resistance and heat conductivity of the resin composition for bonding materials can be further improved.

  Among these, as the silane coupling agent, for example, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyl Dimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysila N-phenyl-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, bis (3 -Triethoxysilylpropyl) tetrasulfane and the like.

  Although content of a coupling agent is not specifically limited, It is preferable that it is about 0.01-10 mass parts with respect to 100 mass parts of resin materials, and it is more preferable that it is especially about 0.5-10 mass parts. . When the content is less than the lower limit, the effect of improving the adhesion as described above may be insufficient. On the other hand, when the content exceeds the upper limit, the bonding material 5 is formed. May cause outgassing and voids.

  Moreover, the filler in the resin composition for joining materials is comprised with an inorganic material. Thereby, a filler exhibits heat conductivity higher than the heat conductivity of a resin material. Therefore, the thermal conductivity of the bonding material 5 can be increased by dispersing the filler in the bonding resin composition.

Such a filler is preferably a granular body composed of at least one of aluminum oxide (alumina, Al ₂ O ₃ ) and aluminum nitride among those composed of inorganic materials, and is mainly mainly oxidized. A granular body made of aluminum is preferable. Thereby, it can be set as the filler excellent in heat conductivity (heat dissipation) and insulation. Aluminum oxide is particularly preferably used because it is highly versatile and can be obtained at low cost.

  Therefore, hereinafter, a case where the filler is a granular body mainly composed of aluminum oxide will be described as an example.

  The content of the filler is preferably 30% by volume or more and 70% by volume or less, more preferably 40% by volume or more and 60% by volume or less, based on the entire resin composition for a bonding material (excluding the solvent). . The thermal conductivity of the bonding material 5 can be made excellent by increasing the filler content in the bonding material resin composition within this range.

  On the other hand, when the content is less than the lower limit value, it is difficult to ensure the heat conductivity of the bonding material 5 while securing the bonding property of the bonding material 5. On the other hand, if the content exceeds the upper limit, depending on the constituent material of the resin composition for bonding material, the viscosity of the resin composition for bonding material becomes too high, and the varnish is filtered or formed into a layer (coating). ) Becomes difficult, or the flow of the resin composition for the bonding material becomes too small, and voids may be generated in the obtained bonding material 5.

  In addition, even if the filler content in the resin composition for bonding material is set high as in the above range, the viscosity under the conditions of a temperature of 25 ° C. and a shear rate of 1.0 rpm is used as the resin composition for bonding material. A / B (thixo ratio) is 1.2 or more and 3.0 or less, where A [Pa · s], viscosity at a temperature of 25 ° C. and a shear rate of 10.0 rpm is B [Pa · s]. By using a material that satisfies this relationship, the viscosity and flowability of the bonding material resin composition (varnish) can be made appropriate when the substrate assembly 10 is manufactured.

  The water content of the filler is preferably 0.10% by mass or more and 0.30% by mass or less, more preferably 0.10% by mass or more and 0.25% by mass or less. More preferably, it is 12 mass% or more and 0.20 mass% or less. Thereby, even if the content of the filler is increased, it has a more appropriate viscosity and flowability. Therefore, it is possible to form the bonding material 5 having excellent thermal conductivity while preventing generation of voids in the obtained bonding material 5. That is, the bonding material 5 having excellent thermal conductivity and bondability can be formed.

  Aluminum oxide is usually obtained by firing aluminum hydroxide. The obtained aluminum oxide granules are composed of a plurality of primary particles, and the average particle size of the primary particles can be set according to the firing conditions.

  Moreover, the aluminum oxide which has not been treated at all after the firing is composed of aggregates (secondary particles) in which primary particles are aggregated due to fixation.

  Therefore, the final filler can be obtained by solving the aggregation of the primary particles as necessary by pulverization. The average particle diameter of the final filler can be set according to the pulverization conditions (for example, time).

  During the pulverization, the aluminum oxide has a very high hardness, so the primary particles themselves are hardly broken, and the average particle size of the primary particles is almost maintained even after pulverization. The Rukoto.

  Therefore, as the grinding time becomes longer, the average particle size of the filler approaches the average particle size of the primary particles. And when grinding | pulverization time becomes more than predetermined time, the average particle diameter of a filler will become equal to the average particle diameter of a primary particle. That is, the filler is mainly composed of secondary particles when the grinding time is shortened, and the content of primary particles increases as the grinding time is lengthened. It will be.

  Further, for example, primary particles of aluminum oxide obtained by firing aluminum hydroxide as described above have a shape having a flat surface such as a scaly shape instead of a spherical shape. Therefore, the contact area between fillers can be increased. As a result, the thermal conductivity of the obtained bonding material 5 can be increased.

  Furthermore, the filler is a mixed system of three components (large particle size, medium particle size, and small particle size) having different average particle sizes, and the large particle size component is spherical, and the medium particle size component and small particle size are The component is preferably polyhedral.

  More specifically, the filler belongs to the first particle size range in which the average particle size is 5.0 μm or more and 50 μm or less, preferably 5.0 μm or more and 25 μm or less, and the circularity is 0.80 or more, 1 0.02 or less, preferably 0.85 or more, 0.95 or less of the large particle size alumina, the average particle size belongs to the second particle size range of 1.0 μm or more and less than 5.0 μm, and the circularity is 0.50 or more, 0.90 or less, preferably 0.70 or more and 0.80 or less, medium particle size aluminum oxide and an average particle size of 0.1 μm or more and less than 1.0 μm in the third particle size range It is preferable to be a mixture with a small particle size aluminum oxide having a circularity of 0.50 or more and 0.90 or less, preferably 0.70 or more and 0.80 or less.

  The particle size of the filler can be measured by dispersing aluminum oxide in water for 1 minute using a laser diffraction particle size distribution analyzer SALD-7000.

  As a result, the medium particle size component is filled in the gap between the large particle size components, and the small particle size component is filled in the gap between the medium particle size components. The contact area can be increased. As a result, the thermal conductivity of the bonding material 5 can be further improved. Furthermore, the heat resistance, bending resistance, and insulation of the bonding material 5 can be further improved.

  Further, by using such a filler, the bonding strength between the heat radiating metal plate 4 and the heat receiving metal plate 8 through the bonding material 5 can be further increased.

  Due to these synergistic effects, the bonding reliability and the heat radiation reliability of the substrate assembly 10 can be further enhanced.

  In addition to the components described above, the resin composition for a bonding material may contain additives such as a leveling agent and an antifoaming agent.

  Moreover, the resin composition for joining materials contains solvents, such as methyl ethyl ketone, acetone, toluene, a dimethylformaldehyde, for example. Thereby, the resin composition for bonding materials becomes a varnish state when the resin material or the like is dissolved in the solvent.

  In addition, the resin composition for a bonding material having such a varnish shape can be obtained, for example, by mixing a resin material and a solvent as necessary to form a varnish, and further mixing a filler. .

  The mixer used for mixing is not particularly limited, and examples thereof include a disperser, a composite blade type stirrer, a bead mill, and a homogenizer.

As shown in FIG. 1, the sealing material 6 collectively seals the induction device 1 disposed in contact with the heat receiving metal plate 8 together with the heat receiving metal plate 8, the heat radiating metal plate 4, and the bonding material 5. To do (mold). Thereby, the state where the positional relationship between each member is regulated can be reliably maintained. Moreover, since the guidance device 1 is covered with the sealing material 6, the guidance device 1 can also be protected. In addition, although the external shape of the sealing material 6 is a rectangular parallelepiped in this embodiment, it is not specifically limited.
This sealing material 6 is comprised with the hardened | cured material of the resin composition for sealing materials containing a thermosetting resin.

Hereinafter, this resin composition for sealing materials will be described.
The thermosetting resin is not particularly limited. For example, phenol resin, epoxy resin, urea (urea) resin, resin having a triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide (BMI) resin, polyurethane resin , Diallyl phthalate resin, silicone resin, resin having a benzoxazine ring, cyanate ester resin, and the like, and one or more of them can be used in combination. Among these, since the phenol resin has good fluidity, the fluidity of the resin composition for a sealing material can be improved. Therefore, when the sealing material 6 is formed, the shape of the induction device 1 (especially the coil) Since the guiding device 1 can be sealed without depending on the shape 3), it is preferably used.

  Examples of the phenol resin include unmodified phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, novolak type phenol resin such as arylalkylene type novolak resin, dimethylene ether type resole resin, methylol type resole resin and the like. And resole phenolic resins such as oil-modified resole phenolic resins modified with tung oil, linseed oil, walnut oil and the like.

  Moreover, when using a novolak-type phenol resin, although the hardening | curing agent is contained in the resin composition for sealing materials, hexamethylenetetramine is normally used as this hardening | curing agent. Further, when hexamethylenetetramine is used, its content is not particularly limited, but it is preferably 10 parts by weight or more and 30 parts by weight or less, more preferably 15 parts by weight or more with respect to 100 parts by weight of the novolac type phenol resin. 20 parts by weight or less is preferable. By setting the content of hexamethylenetetramine within the above range, the cured product of the resin composition for a sealing material, that is, the mechanical strength and molding shrinkage of the sealing material 6 can be improved.

  Among such phenol resins, it is preferable to use a resol type phenol resin. When a novolac type phenol resin is used as a main component, as described above, hexamethylenetetramine is usually used as a curing agent, and corrosive gas such as ammonia gas is generated when the novolac type phenol resin is cured. For this reason, the core portion 2 and the coil 3 included in the induction device 1 may corrode due to this, and therefore, a resol type phenol resin is preferably used as compared with a novolac type phenol resin.

  Moreover, a resol type phenol resin and a novolac type phenol resin can be used in combination. Thereby, while being able to raise the intensity | strength of the sealing material 6, toughness can also be improved.

  Examples of the epoxy resin include bisphenol type epoxy resins such as bisphenol A type, bisphenol F type and bisphenol AD type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, brominated bisphenol A type, bromine Brominated epoxy resin such as a fluorinated phenol novolak type, biphenyl type epoxy resin, naphthalene type epoxy resin, tris (hydroxyphenyl) methane type epoxy resin and the like. Among these, bisphenol A type epoxy resins, phenol novolac type epoxy resins, and cresol novolac type epoxy resins having a relatively low molecular weight are preferable. Thereby, the workability and moldability at the time of forming the sealing material 6 can be further improved. Further, from the viewpoint of heat resistance of the sealing material 6, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, and a tris (hydroxyphenyl) methane type epoxy resin are preferable, and a tris (hydroxyphenyl) methane type epoxy resin is particularly preferable.

  When using a tris (hydroxyphenyl) methane type epoxy resin, the number average molecular weight is not particularly limited, but is preferably 500 to 2000, and more preferably 700 to 1400.

  Moreover, when using an epoxy resin, it is preferable that a hardening | curing agent is contained in the resin composition for sealing materials. The curing agent is not particularly limited, and examples thereof include amine compounds such as aliphatic polyamines, aromatic polyamines and diciamine diamide, alicyclic acid anhydrides, acid anhydrides such as aromatic acid anhydrides, and novolak phenols. Examples thereof include polyphenol compounds such as resins, imidazole compounds, and the like. Among these, novolac type phenol resins are preferable. Thereby, while handling and the workability | operativity of the resin composition for sealing materials improve, it can make the resin composition for sealing materials excellent in the environmental aspect.

  In particular, when a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, or a tris (hydroxyphenyl) methane type epoxy resin is used as the epoxy resin, it is preferable to use a novolac type phenol resin as the curing agent. Thereby, the heat resistance of the hardened | cured material obtained from the resin composition for sealing materials can be improved. In addition, the addition amount of the curing agent is not particularly limited, but it is preferable that the curing width is within ± 10% by weight from the theoretical equivalent ratio of 1.0 to the epoxy resin.

  Moreover, the resin composition for sealing materials may contain a hardening accelerator with the said hardening | curing agent as needed. Although it does not specifically limit as a hardening accelerator, For example, an imidazole compound, a tertiary amine compound, an organic phosphorus compound, etc. are mentioned. Although content of a hardening accelerator is not specifically limited, It is preferable that it is 0.1-10 weight part with respect to 100 weight part of epoxy resins, and it is more preferable that it is 3-8 weight part.

  Moreover, it is preferable that the resin composition for sealing materials contains the fiber reinforcement which functions as a filler. Thereby, the mechanical strength and rigidity of the sealing material 6 itself can be made excellent.

  The fiber reinforcing material is not particularly limited. For example, glass fiber, carbon fiber, aramid fiber (aromatic polyamide), poly-p-phenylenebenzobisoxazole (PBO) fiber, polyvinyl alcohol (PVA) fiber, polyethylene (PE ) Fibers, plastic fibers such as polyimide fibers, inorganic fibers such as basalt fibers, and metal fibers such as stainless steel fibers. One or more of these can be used in combination.

  Further, these fiber reinforcements may be subjected to a surface treatment with a silane coupling agent for the purpose of improving the adhesion with the thermosetting resin. Although it does not specifically limit as a silane coupling agent, For example, an aminosilane coupling agent, an epoxy silane coupling agent, a vinyl silane coupling agent etc. are mentioned, It is used combining these 1 type (s) or 2 or more types. it can.

  Of these fiber reinforcements, it is preferable to use carbon fibers or aramid fibers. Thereby, the mechanical strength of the sealing material 6 can be further improved. In particular, the use of carbon fibers can further improve the wear resistance at high loads. In addition, from the viewpoint of further reducing the weight of the sealing material 6, it is preferably a plastic fiber such as an aramid fiber. Furthermore, from the viewpoint of improving the mechanical strength of the sealing material 6, it is preferable to use a fiber base material such as glass fiber or carbon fiber as the fiber reinforcing material.

  The content of the fiber reinforcement in the cured product is, for example, 10% by volume or more, preferably 20% by volume or more, and more preferably 25% by volume or more with respect to the total amount of the cured product. Moreover, the upper limit of content of the fiber reinforcement with respect to hardened | cured material whole quantity is although it does not specifically limit, Preferably it is 80 volume% or less. Thereby, the mechanical strength of the sealing material 6 can be improved reliably.

  Furthermore, the resin composition for a sealing material may contain a material other than the fiber reinforcing material as the filler, and the filler may be either an inorganic filler or an organic filler.

  As the inorganic filler, for example, one or more selected from titanium oxide, zirconium oxide, silica, calcium carbonate, boron carbide, clay, mica, talc, wollastonite, glass beads, milled carbon, graphite and the like are used. . The inorganic filler preferably contains a metal oxide such as titanium oxide, zirconium oxide, or silica. Thereby, the oxide film with which a metal oxide is provided exhibits the function as a passivating film | membrane, and can improve the acid resistance as the whole hardened | cured material.

  As the organic filler, one or more selected from polyvinyl butyral, acrylonitrile butadiene rubber (NBR), pulp, wood powder, and the like are used. The acrylonitrile butadiene rubber may be either partially crosslinked or carboxy modified type. Of these, acrylonitrile butadiene rubber is preferred from the viewpoint of further enhancing the effect of improving the toughness of the cured product.

  In addition to the components described above, additives such as a mold release agent, a curing aid, and a pigment may be added to the resin composition for a sealing material.

  Moreover, in the induction device 1 having the above-described configuration, the coil 3 is provided by winding a linear body composed of the copper wire 31 and the resin layer 32 around the core portion 2. As shown in FIG. 3, a gap 35 is formed between adjacent linear bodies. A gap 36 is also formed between the inner peripheral portion of the coil 3 and the outer peripheral portion of the core portion 2. The gaps 35 and 36 are filled with the sealing material 6, that is, filled. The heat Q can be transmitted to the heat receiving metal plate 8 also through the filled sealing material 6, thereby improving the heat dissipation of the support substrate 20.

  In addition, an interface 11 where the bonding material 5 and the sealing material 6 are in contact with each other is formed. At the interface 11, the filler contained in the bonding material 5 is preferably dispersed on the sealing material 6 side. Thereby, it can be said that the state in which the bonding material 5 and the sealing material 6 are mixed is formed at the interface 11, and the adhesion between the bonding material 5 and the sealing material 6 is improved. Therefore, the durability of the substrate assembly 10 can be made excellent.

  As shown in FIG. 1, the substrate assembly 10 configured as described above is housed in a housing 7. The housing 7 includes a bottom portion 71 that functions as a pedestal having heat dissipation properties, and a frame body 72 that stands on the edge of the bottom portion 71.

  Since the board assembly 10 has a configuration in which the guidance device 1 is sealed, simply placing the guidance device 1 in the housing 7 ensures the sealing performance of the guidance device 1. That is, the sealing performance of the guidance device 1 can be ensured without potting a liquid material containing urethane resin or the like with respect to the housing 7. Furthermore, since the heat radiating metal plate 4 in contact with the bottom 71 has excellent heat dissipation, the heat Q generated in the induction device 1 is passed through the heat receiving metal plate 8, the bonding material 5, and the heat radiating metal plate 4 in this order. It can be transmitted to the bottom 71.

  Moreover, both the bottom part 71 and the frame 72 are comprised with aluminum, its alloy, etc. so that the outstanding heat dissipation can be exhibited.

Second Embodiment
FIG. 4 is a partial longitudinal sectional view showing a second embodiment of the substrate assembly (heating element supporting substrate) of the present invention.

  Hereinafter, the second embodiment of the heating element support substrate and the substrate assembly according to the present invention will be described with reference to this figure. However, the description will focus on the differences from the above-described embodiment, and the same matters will be described. Omitted.

  This embodiment is the same as the first embodiment except that the shape of the heating element support substrate is different.

  As shown in FIG. 4A, in this embodiment, a thin wall portion 82 is formed on the heat receiving metal plate 8, and a thin wall portion 42 is also formed on the heat radiating metal plate 4 on the opposite side through the bonding material 5. Yes.

The thin-walled portion 82 is a fragile portion by forming a groove 83 on the upper surface 81 of the heat receiving metal plate 8 so that the thickness t8 of the heat receiving metal plate ₈ is reduced. In addition, although the cross-sectional shape of the groove | channel 83 is a wedge shape by the structure of illustration, it is not limited to this, For example, a semicircle shape may be sufficient.

The thin portion 42 is a fragile portion by forming the groove 43 on the lower surface 44 of the heat radiating metal plate 4 so that the thickness t8 of the heat receiving metal plate ₈ is reduced. In addition, although the cross-sectional shape of the groove | channel 43 is a wedge shape by the structure of illustration, it is not limited to this, For example, a semicircle shape may be sufficient.

  Then, as shown in FIG. 4B, the substrate assembly 10 can be bent in a desired direction (upward in the drawing) by the thin portions 42 and 82. Each member can be sealed with the sealing material 6 after bending.

  Thus, in this embodiment, the support substrate 20 can be bent into a desired shape according to the size and position of the guidance device 1, and the versatility is further improved.

  In addition, in this embodiment, although the thin parts 42 and 81 are formed, it is not limited to this, You may abbreviate | omit one thin part.

  As mentioned above, although the heating element support substrate and the substrate assembly of the present invention have been described with respect to the illustrated embodiment, the present invention is not limited to this, and the respective parts constituting the heating element support substrate and the substrate assembly are: It can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Further, the heating element support substrate and the substrate assembly of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, although the end surface of the coil is configured as a flat surface in the present embodiment, it is not limited to this, and may be rounded, for example.

  Further, the heat receiving metal plate may have an oxide film formed on the upper surface thereof. Thereby, the insulation of a heat receiving metal plate and a coil is ensured more reliably.

DESCRIPTION OF SYMBOLS 1 Guide apparatus 2 Core part 3 Coil 31 Copper wire 32 Resin layer 33 End surface (outer peripheral surface)
35, 36 Gap 4 Radiating metal plate 41 Upper surface 42 Thin portion 43 Groove 44 Lower surface 5 Bonding material (bonding layer)
6 Sealing material (sealing part)
7 Housing 71 Bottom 72 Frame 8 Heat Receiving Metal Plate 81 Upper Surface 82 Thin Wall 83 Groove 10 Substrate Assembly 11 Interface 20 Support Substrate (Heating Element Support Substrate)
40 Guiding device sealing material 50 Adhesive layer 60 Sealing material 70 Housing 100 Guiding device structure Q Heat S ₄ , S ₈ area t ₄ , t ₅ , t ₈ thickness

Claims (16)

A heating element support substrate for supporting a heating element that generates heat,
A heat-receiving metal plate that is in contact with the heating element and receives heat generated by the heating element;
A heat-dissipating metal plate disposed on the opposite side of the heat-receiving metal plate to the heat-generating body and dissipating the heat received by the heat-receiving metal plate;
It is interposed between the heat receiving metal plate and the heat radiating metal plate, and includes a bonding material that joins the heat receiving metal plate and the heat radiating metal plate,
The heating element support substrate, wherein the bonding material is mainly composed of a cured or solidified resin composition for a bonding material containing a resin material and a filler.   The heating element support substrate according to claim 1, wherein the resin material is a thermosetting resin.   The heating element support substrate according to claim 2, wherein the thermosetting resin is an epoxy resin.   The heating element support substrate according to any one of claims 1 to 3, wherein the filler is a granular body mainly composed of aluminum oxide.   The heating element support substrate according to any one of claims 1 to 4, wherein a thickness of the heat receiving metal plate and a thickness of the heat dissipation metal plate are different from each other.   The heating element support substrate according to claim 5, wherein a thickness of the heat receiving metal plate is thicker than a thickness of the heat radiating metal plate.   The heating element support substrate according to claim 5 or 6, wherein a thickness of the bonding material is thinner than any of a thickness of the heat receiving metal plate and a thickness of the heat dissipation metal plate.   The heating element support substrate according to any one of claims 1 to 7, wherein the heat dissipation metal plate includes the heat receiving metal plate in a plan view of the heating element support substrate.   The heating element support substrate according to any one of claims 1 to 8, wherein a constituent material of the heat receiving metal plate and a constituent material of the heat radiating metal plate are different from each other. The constituent material of the heat receiving metal plate is aluminum or aluminum alloy,
The heating element support substrate according to claim 9, wherein a constituent material of the heat radiating metal plate is copper or a copper alloy.   The heating element support substrate according to any one of claims 1 to 10, further comprising a sealing material that collectively seals the heat receiving metal plate, the heat radiating metal plate, and the bonding material.   The heating element support substrate according to claim 11, wherein the sealing material is formed of a cured product of a resin composition for a sealing material containing a thermosetting resin.   The heating element support substrate according to claim 12, wherein the thermosetting resin in the encapsulating resin composition is a phenol resin.   14. At least one of the heat receiving metal plate and the heat radiating metal plate is formed with a thin portion having a small thickness, and can be bent at the thin portion. Heating element support substrate. The heating element support substrate according to any one of claims 1 to 14,
A substrate assembly, comprising: a heating element that is supported by the heating element support substrate and generates heat.   The substrate assembly according to claim 15, wherein the heating element is a guidance device.

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