JP2016018121A - Method for manufacturing optical amplification module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical amplification module in which an optical amplification element and an optical connection member having an isolator can be easily optically aligned.SOLUTION: There is provide the method for manufacturing an optical amplification module comprising a module body 10 for housing an optical amplification element 41, a first optical connection member 22 optically joined to one end face 41A of the optical amplification element 41, and a second optical connection member 32 optically joined to the other end face 41B and having a first isolator 35 for cutting off light from the optical amplification element 41. The method comprises a step of driving the optical amplification element 41 to cause the element 41 to generate first light comprising natural emission light, observing the first light via the first optical connection member 22, and carrying out optical alignment between the optical amplification element 41 and the first optical connection member 22, and a step of inputting second light from an end 32B of the second optical connection member 32 opposite the optical amplification element side, observing the second light amplified by the optical amplification element 41 via the first optical connection member 22, and carrying out optical alignment between the optical amplification element 41 and the second optical connection member 32.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an optical amplification module.

  Patent Document 1 discloses a semiconductor amplifier. The optical amplification module includes a module main body in which an optical amplification element that amplifies an optical signal is accommodated, and an optical connection member including an optical fiber that is optically coupled to the module main body.

Japanese Patent Laid-Open No. 6-232814

  The module body and the optical connecting member are joined after optical alignment between the optical amplifying element and the optical connecting member is performed. In the optical alignment between the optical amplifying element and the optical connecting member, for example, the amount of light passing through the optical connecting member that is generated by the light emitted from the optical amplifying element is used. However, for example, in an optical amplifying module in which an isolator for blocking return light from the optical amplifying element is provided in the optical connecting member, the optical amplifying element is optically connected using light generated by light emission of the optical amplifying element. It is difficult to perform optical alignment with the member.

  An object of this invention is to provide the method of manufacturing the optical amplification module which can perform the optical alignment of an optical amplification element and the optical connection member which has an isolator simply.

  A method of manufacturing an optical amplification module according to the present invention includes a module main body that houses an optical amplification element, a first optical connection member that is optically coupled to one end face of the optical amplification element, and another optical amplification element. And a second optical connection member having a first isolator that is optically coupled to an end face and transmits light directed to the optical amplification element and blocks light from the optical amplification element. The optical amplifying element is driven to generate first light composed of spontaneously emitted light, the first light is observed through the first optical connecting member, and the optical alignment between the optical amplifying element and the first optical connecting member is performed. The second light is input from the end of the second optical connection member opposite to the optical amplification element side, and the second light amplified by the optical amplification element is passed through the first optical connection member. Observing and performing optical alignment between the optical amplifying element and the second optical connecting member. No.

  ADVANTAGE OF THE INVENTION According to this invention, the method of manufacturing the optical amplification module which can perform the optical alignment of an optical amplification element and the optical connection member which has an isolator simply can be provided.

It is sectional drawing of the optical amplification module manufactured by the manufacturing method which concerns on 1st Embodiment of this invention. It is a flowchart which shows the method of manufacturing the optical amplification module which concerns on 1st Embodiment of this invention. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is sectional drawing of the optical amplification module manufactured by the manufacturing method which concerns on 2nd Embodiment of this invention. It is a flowchart which shows the method of manufacturing the optical amplification module which concerns on 2nd Embodiment of this invention. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is a figure which shows each process for manufacturing the optical amplification module shown in FIG. It is sectional drawing of the optical amplification module manufactured by the manufacturing method which concerns on 3rd Embodiment of this invention.

  The contents of the embodiment of the present invention will be described. A method of manufacturing an optical amplification module according to an aspect of the present invention includes a module main body that houses an optical amplification element, a first optical connection member that is optically coupled to one end face of the optical amplification element, and an optical amplification element And a second optical connection member having a first isolator that is optically coupled to the other end face and passes light directed to the optical amplification element and blocks light from the optical amplification element. And driving the optical amplifying element to generate the first light composed of spontaneous emission light, observing the first light through the first optical connecting member, and determining the relationship between the optical amplifying element and the first optical connecting member. A step of performing optical alignment, and the second light is input from the end of the second optical connection member opposite to the optical amplification element side, and the second light amplified by the optical amplification element is supplied to the first optical connection member The optical alignment between the optical amplifying element and the second optical connecting member is performed through observation And a degree.

  According to the method for manufacturing the optical amplification module, in the optical amplification module in which the second optical connection member has the first isolator, the optical amplification element and the first optical connection member are selectively used by light emission and amplification of the optical amplification element. Optical alignment with both the second optical connecting member and the second optical connecting member is easily performed. That is, according to the method for manufacturing the optical amplification module, in the optical alignment between the optical amplification element and the first optical connection member, the optical amplification element emits light, and the first passing light amount that passes through the first optical connection member is obtained. Use. In addition, in the optical alignment between the optical amplifying element and the second optical connecting member, the second light is incident from the outside of the optical amplifying module, and the second passing light amount passing through the first optical connecting member after being amplified by the optical amplifying element is used. Use. Thereby, the optical alignment between the optical amplifying element and the optical connecting member having the isolator can be easily performed.

  In the method of manufacturing the optical amplification module, the first optical connection member is optically coupled to one end face of the optical amplification element, and allows light from the optical amplification element to pass therethrough and blocks light traveling toward the optical amplification element. It is preferable to have a second isolator. According to this method for manufacturing an optical amplification module, since the first optical connection member has the second isolator, it is possible to suppress, for example, return light from the optical amplification element from passing through the first optical connection member. Thereby, for example, in the optical amplification module in which the semiconductor laser element is optically coupled to the first optical connection member, optical damage that the semiconductor laser element suffers can be reduced. And according to said optical amplification module, even in such a case, optical alignment with an optical amplification element and an optical connection member can be performed simply.

  A method for manufacturing an optical amplification module according to some embodiments will be described below with reference to the drawings. In the following description, the same reference numerals are given to the same elements in the description of the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view of an optical amplification module manufactured by the manufacturing method according to the first embodiment. The optical amplification module 1 includes a module body 10, a first optical connection member 22, and a second optical connection member 32. The module main body 10 accommodates the optical amplification element 41. The second optical connection member 32 is optically coupled to the optical amplification element 41, and the optical amplification element 41 is optically coupled to the first optical connection member 22. An axis Ax1 in FIG. 1 is an optical axis connecting the optical amplification element 41 and the first optical connection member 22, and an axis Ax2 is an optical axis connecting the second optical connection member 32 and the optical amplification element 41.

  The module body 10 has a first joint surface 11 </ b> A, and the first joint surface 11 </ b> A has a first opening 12. A first lens 23 is installed in the first opening 12. The optical amplification element 41 is optically coupled to the first optical connection member 22 through the first lens 23. The first optical connection member 22 has a second bonding surface 22A. The first joint surface 11A of the module body 10 is joined to the second joint surface 22A of the first optical connection member 22. The module body 10 is made of, for example, an Fe—Ni—Co alloy. The first optical connection member 22 can include, for example, a first optical fiber 24, and the first optical connection member 22 is made of stainless steel, for example.

  The module main body 10 further has a third joint surface 11B, and the third joint surface 11B has a second opening 13. A second lens 33 is installed in the second opening 13. The second optical connection member 32 is optically coupled to the optical amplification element 41 via the second lens 33. The second optical connection member 32 has a fourth bonding surface 32A. The third joint surface 11 </ b> B of the module body 10 is joined to the fourth joint surface 32 </ b> A of the second optical connection member 32. The second optical connection member 32 can be, for example, an optical receptacle, and the second optical connection member 32 is made of, for example, stainless steel.

  The module body 10 further includes a subcarrier 42, a first collimating lens 43, a second collimating lens 44, a thermistor 45, a carrier 46, and a temperature control unit 47 in addition to the optical amplification element 41. The optical amplification element 41 can be, for example, a semiconductor optical amplifier (SOA). The SOA is made of, for example, an InP-based semiconductor. Specifically, it has a structure in which an n-type InP clad layer, an active layer (multi-quantum well structure comprising an InGaAsP well / InGaAsP barrier), and a p-type InP clad layer are sequentially laminated on an n-type InP substrate. The optical amplifying element 41 has a first end face (one end face) 41A and a second end face (other end face) 41B facing the first end face 41A. The optical amplifying element 41 is sandwiched between the first collimating lens 43 and the second collimating lens 44, and the first end face 41 </ b> A of the optical amplifying element 41 is optically coupled to the first collimating lens 43. The second end surface 41B is optically coupled to the second collimating lens 44. In order to reduce the return light from the first end face 41A and the second end face 41B of the optical amplifying element 41, the first end face 41A and the second end face 41B are inclined with respect to the plane perpendicular to the axes Ax1 and Ax2. Opposite.

  On the temperature control unit 47 in the module main body 10, a subcarrier 42 on which the semiconductor optical amplification element 41 is mounted, a first collimating lens 43, a second collimating lens 44, and a thermistor 45 are mounted on the carrier 46. The temperature control unit 47 can be, for example, a Peltier element. The thermistor 45 is installed in the vicinity of the optical amplification element 41 in order to detect the element temperature of the optical amplification element 41.

  The module body 10 further includes a first side surface 11E. The first side surface 11 </ b> E has a third opening 14, and a feedthrough 51 is provided in the third opening 14. For example, six metal wirings 52a to 52f are provided in the feedthrough 51, and the metal wirings 52a to 52f are connected to the temperature control unit 47, the semiconductor optical amplification element 41, and the thermistor 45 through wires, respectively. The feedthrough 51 is further provided with external terminals 53a to 53f connected to the metal wirings 52a to 52f, respectively. The external terminals 53a to 53f are used as, for example, a drive terminal for the optical amplifying element 41, a drive terminal for the temperature control unit 47, and a drive terminal for the thermistor 45. The semiconductor optical amplifying element 41 and the thermistor 45 transmit and receive electrical signals to and from the outside of the optical amplification module 1 via any of the metal wirings 52a to 52f and the external terminals 53a to 53f. The feedthrough 51 is made of, for example, ceramic, and the metal wirings 52a to 52f and the external terminals 53a to 53f are made of, for example, Au.

  In the first embodiment, when the second optical connecting member 32 is an optical receptacle, the second optical connecting member 32 includes a stub 34 and a first isolator 35 as shown in FIG. , Optically coupled to the first isolator 35, and the first isolator 35 is optically coupled to the second lens 33. The stub 34 is an optical coupling component for an optical receptacle, and is made of, for example, ceramic. The first isolator 35 is an optical element for blocking light from the second end face 41 </ b> B of the optical amplifying element 41 while allowing light traveling toward the second end face 41 </ b> B of the optical amplifying element 41 to pass therethrough.

  FIG. 2 is a flowchart showing a method of manufacturing the optical amplification module according to the first embodiment. The manufacturing method of 1st Embodiment has process S11-process S13. 3 to 5 are diagrams showing steps S11 to S13 for manufacturing the optical amplification module shown in FIG.

  As shown in FIG. 3, in the manufacturing method of the first embodiment, first, in the module main body 10, the subcarrier 42 on which the semiconductor optical amplifying element 41 is mounted, the first collimating lens 43, and the second collimating lens 44. The temperature control unit 47 having the carrier 46 on which the thermistor 45 is mounted is housed (step S11). Further, as a pre-process of step S <b> 11, the first lens 23 is provided in the first opening 12 of the module body 10, and the second lens 33 is provided in the second opening 13. Further, a feedthrough 51 is provided in the third opening 14 of the module body 10.

  As shown in FIG. 4, in the manufacturing method according to the first embodiment, the module body 10 and the first optical connection member 22 are then joined (step S12). In step S12, the light amplifying element 41 emits light, and spontaneous emission light is generated by this light emission. The first light L <b> 1 that is spontaneous emission light is emitted from the first end face 41 </ b> A of the optical amplification element 41, and the emitted first light L <b> 1 is collimated by the first collimating lens 43. After the first light connection member 22 is brought into contact with the module body 10 so that the first light L1 passes through the first light connection member 22, the first light L1 is collected by the first lens 23 and is first condensed. 1 enters the optical connection member 22. The first light L1 that has passed through the first optical connection member 22 is detected by a photodetector (not shown) provided outside the optical amplification module 1. Based on the first passing light amount of the first light L1 that has passed through the first optical connecting member 22, optical alignment between the optical amplifying element 41 and the first optical connecting member 22 is performed. After this optical alignment, the module main body 10 and the first optical connection member 22 are laser-welded, for example, so that the first bonding surface 11A of the module main body 10 and the second bonding surface 22A of the first optical connection member 22 are connected. Be joined. At this time, the laser beam is applied to the outer end of the joint between the first joint surface 11A of the module body 10 and the second joint surface 22A of the first optical connection member 22, and laser welding is performed. As a light source for laser welding, for example, a YAG laser can be used.

  As shown in FIG. 5, in the manufacturing method of the first embodiment, the module body 10 and the second optical connection member 32 are subsequently joined (step S13). Since the second optical connecting member 32 of the first embodiment is provided with the first isolator 35, the spontaneous emission light from the second end face 41 </ b> B of the optical amplifying element 41 is difficult to pass through the second optical connecting member 32. For this reason, in step S13, the second light L2 passes through the second optical connection member 32 in contact with the module main body 10 from the end 32B of the second optical connection member 32 opposite to the optical amplification element side. Then, the light is incident on the second end face 41B of the optical amplifying element 41. The second light L2 is amplified by the optical amplification element 41 and emitted from the first end face 41A. The emitted second light L2 is collimated by the first collimating lens 43. The second light L <b> 2 is collected by the first lens 23 after collimation and is incident on the first optical connection member 22. Similarly to step S <b> 12, a photodetector (not shown) is installed, and this photodetector detects the second passing light amount through which the second light L <b> 2 collected by the first lens 23 passes through the first optical connection member 22. Is detected. Based on the second passing light amount, optical alignment between the optical amplifying element 41 and the second optical connecting member 32 is performed. After this optical alignment, the module body 10 and the second optical connection member 32 are laser-welded, for example, and the third joint surface 11B of the module body 10 and the fourth joint surface 32A of the second optical connection member 32 are joined. Is done. At this time, the laser light is applied to the outer end of the joint between the third joint surface 11B of the module body 10 and the fourth joint surface 32A of the second optical connection member 32, and laser welding is performed.

  The effects obtained by the method for manufacturing the optical amplification module 1 described above will be described. According to the method of manufacturing the optical amplification module 1, in the optical amplification module 1 in which the second optical connection member 32 includes the first isolator 35, the light amplification element 41 and the light amplification element 41 are separated from each other by using light emission and amplification. The optical alignment with both the first optical connecting member 22 and the second optical connecting member 32 is easily performed. That is, according to the method for manufacturing the optical amplification module 1, the optical amplification element 41 is caused to emit light in the optical alignment between the optical amplification element 41 and the first optical connection member 22, and the first light L1 that is spontaneous emission light is emitted. Uses the first passing light amount that passes through the first optical connecting member 22. In the optical alignment between the optical amplifying element 41 and the second optical connecting member 32, the second light L2 is incident from the outside of the optical amplifying module 1, and passes through the first optical connecting member 22 after being amplified by the optical amplifying element 41. The second passing light amount is used. Thereby, the optical alignment between the optical amplifying element and the optical connecting member having the isolator can be easily performed.

  In addition, since the first isolator 35 is provided in the second optical connection member 32, the return light from the optical amplification element 41 or the like to the second optical connection member 32 is reduced. For example, in an optical amplification module in which a semiconductor laser element is optically coupled to the second optical connection member 32, optical damage that the semiconductor laser element suffers from return light is reduced.

(Second Embodiment)
FIG. 6 is a cross-sectional view of an optical amplification module manufactured by the manufacturing method according to the second embodiment. The configuration of the optical amplification module 1P of the second embodiment is different from the first joint surface 11C and the third joint surface 11D of the module body 10P, and the first intermediate member 21 and the second intermediate member 31 that are newly provided, The configuration is the same as that of the optical amplification module 1 of the first embodiment.

  In the optical amplifying module 1P of the second embodiment, the thickness of the side wall including the first joint surface 11C and the side wall including the third joint surface 11D of the module body 10P are both the side walls including the first side surface 11E of the first embodiment. It is thinner than the thickness of. In accordance with this, the first bonding surface 11C and the third bonding surface 11D have the first opening 12P and the second opening 13P, respectively, while the first opening 12P and the second opening 13P The first lens 23 and the second lens 33 are not provided. The first intermediate member 21 and the second intermediate member 31 that are newly provided include a fourth opening 21c and a fifth opening 31c, respectively, and the fourth opening 21c and the fifth opening 31c are respectively the first lens 23P. And the second lens 33P.

  The first intermediate member 21 has a fifth joint surface 21A and a sixth joint surface 21B facing the fifth joint surface 21A. The optical amplifying element 41 is optically coupled to the first lens 23P of the first intermediate member 21, and the first lens 23P of the first intermediate member 21 is optically coupled to the first optical connecting member 22. The second intermediate member 31 has a seventh joint surface 31A and an eighth joint surface 31B facing the seventh joint surface 31A. The second optical connecting member 32 is optically coupled to the second lens 33P of the second intermediate member 31, and the second lens 33P of the second intermediate member 31 is optically coupled to the optical amplification element 41.

  The first joint surface 11C of the module body 10P is joined to the fifth joint surface 21A of the first intermediate member 21, and the sixth joint surface 21B of the first intermediate member 21 is the second joint surface of the first optical connection member 22. 22A is joined. The third joint surface 11D of the module body 10P is joined to the seventh joint surface 31A of the second intermediate member 31, and the eighth joint surface 31B of the second intermediate member 31 is the fourth joint surface of the second optical connection member 32. It is joined to 32A. Both the first intermediate member 21 and the second intermediate member 31 are made of stainless steel, for example.

  FIG. 7 is a flowchart showing a method of manufacturing the optical amplification module according to the second embodiment. The manufacturing method of 2nd Embodiment has process S21-process S24. 8 to 11 are diagrams showing respective steps S21 to S24 for manufacturing the optical amplification module shown in FIG.

  As shown in FIG. 8, in the manufacturing method of the second embodiment, first, the module body 10P, the first intermediate member 21 and the second intermediate member 31 are joined (step S21). That is, in the manufacturing method of the second embodiment, the first joint surface 11C of the module body 10P and the fifth joint surface 21A of the first intermediate member 21 are joined, and the third joint surface 11D of the module body 10P and the first joint surface 11D are joined. 2 The seventh joining surface 31A of the intermediate member 31 is joined. This joining can be performed by soldering, for example, as in the manufacturing method of the first embodiment. In the case of soldering, the fifth joint surface 21A of the first intermediate member 21 and the seventh joint surface 31A of the second intermediate member 31 are heated by, for example, an electromagnetic induction heating method. For example, the solder placed on the fifth joint surface 21A and the seventh joint surface 31A is melted by heating, and the melted solder causes the fifth joint surface 21A of the first intermediate member 21 to move to the module body 10. The seventh joint surface 31 </ b> A of the second intermediate member 31 is joined to the first joint surface 11 </ b> A, and the seventh joint surface 11 </ b> B of the module body 10 is joined. As a pre-process of the process S <b> 21, the first side surface 11 </ b> E of the module body 10 is provided with a feedthrough 51 in the third opening 14.

  As shown in FIG. 9, in the manufacturing method of the second embodiment, next, in the module main body 10 </ b> P, the subcarrier 42 on which the semiconductor optical amplifying element 41 is mounted, the first collimating lens 43, and the second collimating lens 44. The temperature control unit 47 having the carrier 46 on which the thermistor 45 is mounted is housed (step S22).

  As shown in FIG. 10, in the manufacturing method according to the second embodiment, the first intermediate member 21 and the first optical connection member 22 are subsequently joined (step S23). In step S23, as in the manufacturing method of the first embodiment, the first light L1 is generated by the light emission of the optical amplification element 41, and the first light L1 emitted from the first end face 41A passes through the first optical connection member 22. The optical alignment between the optical amplifying element 41 and the first optical connecting member 22 is performed based on the first passing light amount. After this optical alignment, the first intermediate member 21 and the first optical connection member 22 are laser-welded, for example, so that the sixth joint surface 21B of the first intermediate member 21 and the second joint of the first optical connection member 22 The surface 22A is joined. At this time, the laser beam is applied to the outer end of the joint between the sixth joint surface 21B of the first intermediate member 21 and the second joint surface 22A of the first optical connection member 22, and laser welding is performed.

  As shown in FIG. 11, in the manufacturing method of the second embodiment, the second intermediate member 31 and the second optical connection member 32 are subsequently joined (step) as in the manufacturing method of the first embodiment. S24). Since the second optical connection member 32 of the second embodiment is provided with the first isolator 35, the spontaneous emission light from the second end face 41 </ b> B of the optical amplification element 41 is unlikely to pass through the second optical connection member 32. Therefore, in step S24, the second light L2 is irradiated from the outside of the optical amplification module 1P to the optical amplification element 41 via the second optical connection member 32, and the second light L2 amplified by the optical amplification element 41 is Based on the second light amount passing through the first optical connecting member 22, the optical alignment between the optical amplifying element 41 and the second optical connecting member 32 is performed. After the optical alignment, the second intermediate member 31 and the second optical connection member 32 are laser-welded, for example, so that the eighth joint surface 31B of the second intermediate member 31 and the fourth optical connection member 32 are fourth. The joining surface 32A is joined. At this time, the laser beam is applied to the outer end portion of the joint portion of the eighth joint surface 31B of the second intermediate member 31 and the fourth joint surface 32A of the second optical connection member 32, and laser welding is performed.

  The effects obtained by the method for manufacturing the optical amplification module 1P described above will be described. In the method for manufacturing the optical amplification module 1P of the present embodiment, the first joint surface 11C of the module body 10P and the fifth joint surface 21A of the first intermediate member 21 are joined, and the third joint surface of the module body 10P. 11D and the seventh joining surface 31A of the second intermediate member 31 are joined by soldering. For this reason, even when the thickness of the first joint surface 11C and the third joint surface 11D of the module main body is thin, joining that does not cause penetration or the like in the first joint surface 11C and the third joint surface 11D is easily performed. Further, the sixth joint surface 21B of the first intermediate member 21 and the second joint surface 22A of the first optical connection member 22 are simply joined by laser welding, and the eighth joint surface 31B of the second intermediate member 31 is joined. And the 4th joint surface 32A of the 2nd optical connection member 32 is simply joined by laser welding. According to the method for manufacturing the optical amplification module 1P, the manufacturing process of the optical amplification module in which the thickness of the joint surface of the module main body is thin is further simplified.

  Similarly to the method of manufacturing the optical amplification module 1P of the present embodiment, the first optical isolator 35 is provided in the second optical connection member 32, so that the semiconductor laser element provided in the second optical connection member 32 is returned. Light damage caused by light is reduced. Further, in the optical amplifying module in which the second optical connecting member 32 has the first isolator 35, the optical amplifying element 41, the first optical connecting member 22, and the second optical connecting are selected depending on the light emission and amplification of the optical amplifying element 41. Optical alignment with both of the members 32 is easily performed.

(Third embodiment)
FIG. 12 is a cross-sectional view of an optical amplification module manufactured by the manufacturing method according to the third embodiment. The configuration of the optical amplification module 1Q of the third embodiment is the same as the configuration of the optical amplification module 1P of the second embodiment, except that the first optical fiber 24Q included in the first optical connection member 22Q has the second isolator 25. It is the same.

  The second isolator 25 is an optical element that allows light from the first end face 41 </ b> A of the optical amplifying element 41 to pass therethrough while blocking light directed toward the first end face 41 </ b> A of the optical amplifying element 41. Therefore, the spontaneous emission light generated by the light emission of the light amplifying element 41 can be used during the optical alignment between the light amplifying element 41 and the first optical connecting member 22Q. That is, since the first light L1 emitted from the first end face 41A of the light amplifying element 41 can pass through the first optical connection member 22Q, the first passing light amount through which the first light L1 passes through the first optical connection member 22Q. Is detected. Based on the first passing light amount, optical alignment between the optical amplifying element 41 and the first optical connection member 22Q is performed, and after this optical alignment, the first intermediate member 21 and the first optical connection member 22Q are For example, laser welding is performed. As a result, the sixth joint surface 21B of the first intermediate member 21 and the second joint surface 22A of the first optical connection member 22Q are joined. At this time, the laser light is applied to the outer end portion of the joint portion of the sixth joint surface 21B of the first intermediate member 21 and the second joint surface 22A of the first optical connection member 22Q, and laser welding is performed.

  In the method for manufacturing the optical amplification module 1Q of the present embodiment, since the first optical connection member 22 has the second isolator 25, for example, the return light from the optical amplification element 41 passes through the first optical connection member 22. Can be suppressed. Thereby, for example, in the optical amplification module 1Q in which the semiconductor laser element is optically coupled to the first optical connection member 22, the optical damage that the semiconductor laser element suffers can be reduced. And according to said optical amplification module 1Q, even in such a case, optical alignment with an optical amplification element and an optical connection member can be performed simply.

  While the principles of the invention have been illustrated and described in the preferred embodiments, it will be appreciated by those skilled in the art that the invention can be modified in arrangement and detail without departing from such principles. The present invention is not limited to the specific configuration disclosed in the present embodiment. We therefore claim all modifications and changes that come within the scope and spirit of the following claims.

DESCRIPTION OF SYMBOLS 1, 1P, 1Q ... Optical amplification module 10, 10P ... Module main body, 11A, 11C ... 1st junction surface, 11B, 11D ... 3rd junction surface, 21 ... 1st intermediate member, 21A ... 5th junction surface, 21B ... 6th joint surface, 22, 22Q ... 1st optical connection member, 22A ... 2nd joint surface, 23 ... 1st lens, 25 ... 2nd isolator, 31 ... 2nd intermediate member, 31A ... 7th joint surface, 31B ... 8th joining surface, 32 ... 2nd optical connection member, 32A ... 4th joining surface, 32B ... End part, 35 ... 1st isolator, 41 ... Optical amplification element, 41A ... 1st end surface (one end surface), 41B ... 2nd end surface (other end surface), L1 ... 1st light, L2 ... 2nd light.

Claims (2)

A module body that houses the optical amplification element;
A first optical connection member optically coupled to one end face of the optical amplification element;
A second optical connection member that is optically coupled to the other end face of the optical amplifying element, and has a first isolator that passes light directed to the optical amplifying element and blocks light from the optical amplifying element. A method of manufacturing an amplification module, comprising:
Driving the optical amplifying element to generate first light composed of spontaneous emission light, observing the first light through the first optical connecting member, and the optical amplifying element and the first optical connecting member; A step of performing optical alignment of
Second light is input from the end of the second optical connection member opposite to the optical amplification element side, and the second light amplified by the optical amplification element is observed through the first optical connection member. And the method of manufacturing an optical amplification module including the process of performing optical alignment with the said optical amplification element and the said 2nd optical connection member.   The first optical connecting member includes a second isolator that is optically coupled to the one end face of the optical amplifying element, and that blocks the light that passes through the light amplifying element and that is directed to the optical amplifying element. A method for manufacturing the optical amplification module according to claim 1.

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