JP2016016532A - Prepreg with primer layer for plating process, multilayer printed wiring board and manufacturing method therefor each using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg with a primer layer for plating process that can cope with a semi-additive method for achieving low thermal expansion, high elastic modulus and micro wiring and to provide a printed wiring board and a method for manufacturing the same each using the prepreg.SOLUTION: The prepreg with a primer layer for plating process is a prepreg with a primer layer laminated on one surface of the prepreg and is produced by laminating a film with a primer layer formed of a thermosetting resin composition including (A) an epoxy resin, (B) a polymer component, (C) an epoxy resin curing agent and (D) a curing accelerator in a thickness of 10 μm or less on the film on one surface of the prepreg.SELECTED DRAWING: None

Description

  The present invention relates to a prepreg with a primer layer, a multilayer printed wiring board using the same, and a method for producing the same.

In recent years, with the miniaturization, weight reduction, and multi-functionalization of electronic devices, multilayer wiring boards are rapidly becoming finer in order to increase the density of printed circuit board mounting and further improve the mounting density of electronic components and the like. A semi-additive construction method that uses interlayer insulation via holes using insulating resin (build-up film) that does not contain glass cloth as a prepreg as a manufacturing method for multilayer wiring boards that enables miniaturization, weight reduction, and fine wiring. An applied build-up multilayer wiring board is known. Such a multilayer wiring board does not contain a substrate such as glass cloth in the build-up layer, and therefore has higher thermal expansion and lower elastic modulus than the prepreg. For these reasons, there has been a problem that the possibility of chip cracks and mounting defects increases due to a decrease in the rigidity of the substrate and an increase in warpage. For this reason, in order to adapt to low thermal expansion, high elastic modulus, and fine wiring, there has been a demand for a semi-additive compatible material that exhibits high adhesive strength with plated copper.
This problem is high thermal expansion and low elastic modulus of the insulating resin. In order to solve these problems, for example, as in Patent Document 1, a non-woven fabric made of a liquid crystal polymer having high strength, high elastic modulus, and excellent dielectric properties is used as a base material, and this is impregnated with an insulating resin and semi-cured. There is a method of achieving low thermal expansion and high elastic modulus by using a sheet as a build-up compatible material.

JP 2005-175265 A

However, in the method of Patent Document 1, low thermal expansion and high elastic modulus are demanded with the highest priority, and it is possible to obtain low thermal expansion and high elastic modulus at the same level as a prepreg that is made of glass cloth as a base material and highly filled with filler. Can not.
On the other hand, when a prepreg having a glass cloth as a base material and a high filler content is used instead of the build-up film, low thermal expansion and high elastic modulus can be achieved. However, since this prepreg cannot secure a high adhesive strength with the plated copper, it is difficult to cope with a semi-additive construction method for the purpose of making fine wiring.

  The present invention eliminates the disadvantages of known methods, and provides a prepreg with a primer layer for a plating process that can be applied to a semi-additive method for the purpose of low thermal expansion, high elastic modulus, and fine wiring. The printed wiring board used and its manufacturing method are provided.

The present invention is [1] a prepreg with a primer layer bonded to one side of a prepreg, which is a primer layer on the film (A) epoxy resin, (B) polymer component, (C) epoxy resin curing agent (D) A prepreg with a primer layer for a plating process, characterized in that a film with a primer layer formed of a thermosetting resin composition containing a curing accelerator with a thickness of 10 μm or less is bonded to one side of the prepreg. .
According to the present invention, when a prepreg with a primer layer, a copper foil on the primer layer side, and a laminated board obtained by circuit processing on the opposite side are stacked and a laminated board obtained by heating and pressing is formed, the copper foil and the prepreg are formed between Since the primer layer capable of handling the ultra-thin semi-additive method is provided, it is possible to provide a wiring board having both the low thermal expansion and high elastic modulus of the prepreg and the fine wiring by the semi-additive method that allows the primer layer. Actually, when using this laminate, the entire surface of the copper foil is etched and put into a semi-additive method. The primer layer can be formed on both sides of the prepreg, and one primer layer and the other primer layer may have different compositions. The other primer layer can have a lower thermal expansion and a higher elastic modulus by blending a large amount of an inorganic filler.
Moreover, this invention is a prepreg with a primer layer for plating processes as described in said [1] whose [2] (A) epoxy resin is a novolak-type epoxy resin which has a biphenyl structure.
In the present invention, [3] (B) the polymer component is selected from acrylonitrile butadiene rubber particles, carboxylic acid-modified acrylonitrile butadiene rubber particles, carboxylic acid-modified acrylonitrile butadiene rubber particles, and butadiene rubber-acrylic resin core-shell particles. The prepreg with a primer layer for a plating process according to the above [1] or [2], characterized by comprising at least one kind.
Moreover, this invention is a prepreg with a primer layer for the plating process in any one of said [1]-[3] whose [4] (C) epoxy resin hardening | curing agent is a triazine ring containing novolak-type phenol resin. .
Moreover, this invention is [5] The plating process in any one of said [1]-[4] in which the said thermosetting resin composition contains the inorganic filler (E) with an average primary particle diameter of 100 nm or less further. It is a prepreg with a primer layer.
In addition, the present invention provides [6] a copper foil on the primer layer side of the prepreg with a primer layer for a plating process according to any one of [1] to [5] above, and a laminated board obtained by circuit processing on the opposite side. This is a method for producing a multilayer printed wiring board, in which a copper foil of a laminated board obtained by heating and pressing is removed by etching, and a circuit is formed on an exposed primer layer by a semi-additive method.
The present invention also provides [7] the method for producing a multilayer printed wiring board according to [6] above, wherein a copper foil is provided on the primer layer side of the prepreg with a primer layer for plating process, and at least one prepreg is provided on the opposite side. A method of manufacturing a multilayer printed wiring board in which stacked circuit boards are stacked.
Furthermore, the present invention is [8] a multilayer printed wiring board obtained by the method for producing a multilayer printed wiring board according to [6] or [7].

  Using the prepreg with a primer layer for the plating process of the present invention, a copper foil is laminated on the primer layer side, and at least one prepreg on the opposite side is laminated with a circuit processed laminate, and heated and pressed. By using the resulting laminate, a primer layer capable of handling an ultra-thin semi-additive method can be provided between the copper foil and the prepreg, and the semi-addition that the prepreg has low thermal expansion, high elasticity, and primer layer is possible. It is possible to provide a wiring board having fine wiring by an additive method.

  The primer layer-attached prepreg for the plating process of the present invention uses a primer layer-attached film and a prepreg. The thermosetting resin composition used for this film with a primer layer is a thermosetting resin composition containing (A) an epoxy resin, (B) a polymer component (C) an epoxy resin curing agent, and (D) a curing accelerator. Yes, a film with a primer layer using the resin composition as a primer layer is obtained by laminating a copper foil on the primer layer side, and a laminated board obtained by circuit processing with or without at least one prepreg on the opposite side. In the laminated plate obtained by heating and pressing, since a primer layer capable of handling an ultra-thin semi-additive method is provided between the copper foil and the prepreg, the semi-preparation that enables the low thermal expansion, high elastic modulus and primer layer of the prepreg is possible. It is possible to provide a wiring board having fine wiring by an additive method.

The epoxy resin of the component (A) constituting the thermosetting resin composition used in the present invention is not particularly limited as long as it is an epoxy resin having at least two epoxy groups in one molecule, for example, bisphenol A type, Bisphenol F, biphenyl, novolak, polyfunctional phenol, naphthalene, alicyclic, and alcoholic glycidyl ether, glycidylamine, and glycidyl ester may be mentioned. Can be used. Specifically, bisphenol F type epoxy resin, bisphenol A type epoxy resin, bisphenol S type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene ring-containing epoxy resin, anthracene type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy Examples include resins, phenol novolac type epoxy resins, and cresol novolac type epoxy resins.
In the present invention, it is desirable to include a novolac type epoxy resin. The novolac type epoxy resin in the present invention is preferably a novolac type epoxy resin having a biphenyl structure. The novolak-type epoxy resin having a biphenyl structure refers to a novolac-type epoxy resin containing an aromatic ring of a biphenyl derivative in the molecule, for example, the formula (1):

（式（１）中、ｐは、１〜５を示す）で示されるエポキシ樹脂が挙げられる。

(In formula (1), p represents 1 to 5).

  Commercially available products include NC-3000 (epoxy resin of formula (1) where p is 1.7) and NC-3000-H (epoxy resin of formula (1) where p is 2.8) manufactured by Nippon Kayaku Co., Ltd. ).

  The (A) component epoxy resin can also be used in combination with a rubber-modified epoxy resin. The rubber-modified epoxy resin can be used without particular limitation as long as it is a product marketed for adhesives or paints.

  Examples of commercially available products include EPICLON TSR-960 manufactured by DIC Corporation, EPOTOHTO YR-102 manufactured by Tohto Kasei Co., Ltd., Sumiepoxy ESC-500, and the like.

The content of the rubber-modified epoxy resin used in combination is preferably 10 to 80% by mass of the total epoxy resin. When a rubber-modified epoxy resin is blended, the elongation at the time of curing is increased, and the adhesion to the copper foil surface is improved. However, if it is less than 10% by mass, the effect cannot be sufficiently exhibited, and if it exceeds 80% by mass, the heat resistance is poor. The range of 30-70 mass% is more preferable.
Two or more kinds of rubber-modified epoxy resins may be used, but the total amount is preferably within the above-mentioned mass%.

As the polymer component of the component (B) used in the present invention, polyvinyl acetal resin such as polyvinyl butyral resin and polyvinyl formal resin, polyester resin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, polyurethane resin, urea resin, acrylic rubber And crosslinked rubber particles. These polymer components preferably have a molecular weight of 5,000 to 500,000.
It is preferably made of at least one selected from polyvinyl acetal resin, carboxylic acid-modified polyvinyl acetal resin, acrylic rubber, and crosslinked rubber particles.

  Although the kind of polyvinyl acetal resin, the amount of hydroxyl groups, and the amount of acetyl groups are not particularly limited, those having a number average polymerization degree of 1000 to 2500 are preferred. Within this range, solder heat resistance can be secured, and the viscosity and handling properties of the varnish are good. Here, the number average degree of polymerization of the polyvinyl acetal resin can be determined, for example, from the number average molecular weight of polyvinyl acetate as a raw material (measured using a standard polystyrene calibration curve by gel permeation chromatography). Moreover, a carboxylic acid modified product etc. can also be used.

  Polyvinyl acetal resin is, for example, trade names manufactured by Sekisui Chemical Co., Ltd., ESREC BX-1, BX-2, BX-5, BX-55, BX-7, BH-3, BH-S, KS-3Z, Use KS-5, KS-5Z, KS-8, KS-23Z ("ESREC" is a registered trademark), a trade name manufactured by Denki Kagaku Kogyo Co., Ltd., electrified butyral 4000-2, 5000A, 6000C, 6000EP, etc. Can do. These resins can be used alone or in admixture of two or more.

  The polymer component is preferably crosslinked rubber particles, and specifically comprises at least one selected from acrylonitrile butadiene rubber particles, carboxylic acid-modified acrylonitrile butadiene rubber particles, and core-shell particles of butadiene rubber-acrylic resin. Is preferred.

  The acrylonitrile butadiene rubber particles are those obtained by copolymerizing acrylonitrile and butadiene and partially cross-linking at the stage of copolymerization. It is also possible to obtain carboxylic acid-modified acrylonitrile butadiene rubber particles by copolymerizing together carboxylic acids such as acrylic acid and methacrylic acid. The core-shell particles of butadiene rubber-acrylic resin can be obtained by a two-stage polymerization method in which butadiene particles are polymerized by emulsion polymerization, followed by addition of monomers such as acrylic acid ester and acrylic acid. The size of the particles can be 50 nm to 1 μm as the primary average particle size. These may be used alone or in combination of two or more.

  For example, as a commercial product of carboxylic acid-modified acrylonitrile butadiene rubber particles, XER-91 manufactured by Nippon Synthetic Rubber Co., Ltd. can be cited, and core shell particles of butadiene rubber-acrylic resin include EXL-2655 manufactured by Kureha Chemical Industry Co., Ltd. An example is AC-3832 from Kogyo Corporation.

  The polymer component (B) is preferably 0.5 to 30 parts by mass of component (B) with respect to 100 parts by mass of component (A). If the component (B) is less than 0.5 parts by mass, the peel strength and peel strength of the electroless plating after chemical roughening are low, and if it exceeds 30 parts by mass, the solder heat resistance and insulation reliability are lowered, which is not preferable. . In particular, when 1 mass part or more of each of the crosslinked rubber particles and the polyvinyl acetal resin is blended, the peel strength of the copper foil and the peel strength of the electroless plating after chemical roughening are further improved.

As the epoxy resin curing agent of component (C) used in the present invention, those usually used as curing agents for epoxy resins can be used. Examples thereof include phenol resins such as bisphenol A, bisphenol F, bisphenol S, phenol novolac resin, and bisphenol novolac resin, which are compounds having two or more in one molecule.
The phenol resin is not particularly limited as long as it has two or more phenolic hydroxyl groups in the molecule. For example, phenol novolak resin, cresol novolak resin, phenol aralkyl resin, cresol naphthol formaldehyde polycondensate, triphenylmethane type A polyfunctional phenol resin and various polyfunctional phenol resins can be used. These can be used alone or as a mixture of two or more. The equivalent ratio of the epoxy resin and the phenol resin is desirably set to 0.4 to 1.2 from the viewpoints of curability, adhesiveness, storage stability, and the like.

  The epoxy resin curing agent of component (C) is preferably a novolak-type phenol resin, and if it is a triazine ring-containing novolak-type phenol resin, the peel strength of copper foil and the peel strength of electroless plating after chemical roughening Therefore, it is more preferable.

  In the present invention, the triazine ring-containing novolak type phenol resin means a novolak type phenol resin containing a triazine ring in the main chain of the novolak type phenol resin, and may be a cresol novolak type phenol resin containing a triazine ring. The nitrogen content is preferably 10 to 25% by mass, more preferably 12 to 19% by mass in the triazine ring-containing novolac type phenol resin. When the nitrogen content in the molecule is in this range, the dielectric loss does not become too large, and when it is used as a varnish, the solubility in the solvent is appropriate, and the residual amount of undissolved material is suppressed. As the triazine ring-containing novolac type phenol resin, one having a number average molecular weight of 500 to 600 can be used. These may be used alone or in combination of two or more.

  The triazine ring-containing novolak type phenol resin can be obtained by reacting phenol, aldehyde, and a triazine ring-containing compound under conditions of pH 5-9. When cresol is used instead of phenol, a triazine ring-containing cresol novolac type phenol resin is obtained. Any of o-, m-, and p-cresol can be used as the cresol, and melamine, guanamine and derivatives thereof, cyanuric acid and derivatives thereof can be used as the triazine ring-containing compound.

  As a commercial item, the triazine ring containing cresol novolac type phenol resin phenolite LA-3018 (nitrogen content 18 mass%) by DIC Corporation is mentioned.

As the curing accelerator for the component (D) used in the present invention, any kind may be used, but various imidazoles, BF ₃ amine complexes, cycloamidine compounds, derivatives thereof, which are latent thermosetting agents, It is preferable to blend phosphines.
As imidazoles, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano- 2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ') ] -Ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2 '-Methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-pheny Imidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxy methyl imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, and the like adducts of epoxy resins and imidazoles. Among these, from the viewpoints of curability and storage stability, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, which are adducts of imidazoles and organic acids, 2 , 4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1') ] -Ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, high 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole which is a melting point imidazole It is preferred. These may be used alone or in combination of two or more. Moreover, you may use what microencapsulated these and raised the potential.

  Examples of cycloamidine compounds and derivatives thereof include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonene-5, 1,8-diazabicyclo [5.4.0] undecene-7, and the like. Examples of phosphines include triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra (4-methylphenyl) borate, and tetraphenylphosphonium (4-fluorophenyl) borate.

  (D) The compounding quantity of a component has the preferable range of 0.1-5 mass parts with respect to 100 mass parts of (A) epoxy resins in a thermosetting resin composition, and the range of 0.3-1 mass parts. Is more preferable. Within these ranges, sufficient solder heat resistance, good adhesion, storage stability, and good handleability when using a B stage can be obtained.

In the thermosetting resin composition used in the present invention, an inorganic filler may be used as the component (E). Inorganic fillers include silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate , Calcium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate and the like. Of these, fumed silica is preferable.
The inorganic filler preferably has a specific surface area of 20 m ² / g or more from the viewpoint of forming fine wiring on the interlayer insulating layer. Further, from the viewpoint of reducing the surface shape after the roughening treatment in the plating process, the average primary particle size is preferably 100 nm or less.

  The “average primary particle size” here refers to the average particle size of aggregated particles, that is, not the secondary particle size, but the average particle size of single particles that are not aggregated. The average primary particle size (primary average particle size) can be determined by, for example, measuring with a laser diffraction particle size distribution meter.

  Furthermore, the inorganic filler is preferably surface-treated with a surface treatment agent such as a silane coupling agent in order to improve moisture resistance, and is preferably hydrophobized to improve dispersibility.

  As content of (E) component, it is preferable that it is 10 mass% or less in a thermosetting resin composition. When the blending amount is 10% by mass or less, a good surface shape after the roughening treatment can be maintained, and deterioration of plating characteristics and interlayer insulation reliability can be prevented.

Commercially available inorganic fillers having an average primary particle size of 100 nm or less include AEROSIL R972 (trade name, “AEROSIL” is a registered trademark) manufactured by Nippon Aerosil Co., Ltd.) and PL-1 manufactured by Fuso Chemical Industries, Ltd. (Trade name, specific surface area 181 m ² / g) and PL-7 (trade name, specific surface area 36 m ² / g). Only one type of inorganic filler as described above may be used, or two or more types may be used in combination. Further, these inorganic fillers may be used by a known kneading / dispersing method such as a kneader, a ball mill, a bead mill, a three roll, a nanomizer for the purpose of improving dispersibility.

  The thermosetting resin composition for a primer layer in the present invention is obtained by blending the above-described (A) to (D), (E) component, and thixotropic agent used for ordinary resin compositions. Various additives such as surfactants and coupling agents can be appropriately blended. After sufficiently stirring them, a thermosetting resin composition for a primer layer can be obtained in a state where bubbles are eliminated by defoaming treatment or the like.

  The primer layer thermosetting resin composition used in the present invention may contain (F) a phenolic hydroxyl group-containing phosphorus compound in order to improve flame retardancy.

  (F) The phenolic hydroxyl group-containing phosphorus compound has the general formula (2):

(In the general formula (2), when n is 1, R ₄ is a hydrogen atom, a linear or branched alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group. Each R ₄ is independently a hydrogen atom, a linear or branched alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, or two R ₄ are carbons to which each is bonded. A phosphorus group containing a phenolic hydroxyl group, as shown by the following, together with an atom, forming a benzene ring that is unsubstituted or substituted with an alkyl or cycloalkyl group, and x is a natural number of 2 or more: A compound. These may be used alone or in combination of two or more.

In the general formula (2), when R ₄ is a linear or branched alkyl group, a C _{1 to} C ₆ (C _{1 to} C ₆ ) alkyl group is preferable, and in the case of a cycloalkyl group, , _C 6 -C ₈ cycloalkyl group. In the case of an aryl group, a phenyl group is preferable, and in the case of an aralkyl, a C _{7 to} C ₁₀ aralkyl group is preferable. x is preferably 2. In the general formula (2), n is 2, and two R _{4 s} are combined with the carbon atom to which each is bonded, and two R ₄ are each a carbon atom to which each is bonded, together, to form a benzene ring substituted in the unsubstituted or alkyl or cycloalkyl group, it is unsubstituted or substituted C ₁ -C ₄ alkyl or C ₆ -C ₈ cycloalkyl group A benzene ring is preferred.

  Specifically, formula (3) or formula (4):

(In formulas (3) and (4), R ₅ represents a hydrogen atom, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl group, or cyclohexyl group). And phosphorus compounds.

  In particular, 10- (2,5-dihydroxyphenyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and derivatives thereof are preferred.

  As a commercial item, Sanko Co., Ltd. HCA-HQ is mentioned.

  In the case of imparting flame retardancy, the blending amount of the (F) phenolic hydroxyl group-containing phosphorus compound in the thermosetting resin composition for the primer layer used in the present invention is the sum of the masses of the components (A) to (E). In terms of phosphorus atom, it is in the range of 1.5 to 3.5 mass%, more preferably in the range of 1.8 to 2.5 mass%. When the blending amount is within this range, the flame retardancy is good, the insulation reliability is excellent, and the Tg of the cured coating film is not too low.

  The thermosetting resin composition for a primer layer in the present invention may contain (G) a thermoplastic resin in order to improve flexibility.

  Examples of the thermoplastic resin (G) in the present invention include fluororesin, polyphenylene ether, modified polyphenylene ether, polyphenylene sulfide, polycarbonate, polyether imide, polyether ether ketone, polyarylate, polyamide, polyamide imide, and polybutadiene. However, it is not limited to these. One type of thermoplastic resin may be used alone, or two or more types may be mixed and used.

  Among thermoplastic resins, blending polyphenylene ether and modified polyphenylene ether is useful because it improves the dielectric properties of the cured product. Examples of polyphenylene ether and modified polyphenylene ether include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-dimethyl-1,4-phenylene) ether and polystyrene alloyed polymer, poly Alloyed polymer of (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene copolymer, Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-maleic anhydride copolymer Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and polyamide, alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene-acrylonitrile copolymer, etc. Is mentioned. In addition, in order to impart reactivity and polymerizability to polyphenylene ether, functional groups such as amino groups, epoxy groups, carboxyl groups, styryl groups, and methacryl groups are introduced at the ends of polymer chains, or amino groups are introduced into the side chains of polymer chains. In addition, a functional group such as an epoxy group, a carboxyl group, a styryl group, or a methacryl group may be introduced.

  Among thermoplastic resins, polyamideimide resin is useful because it has excellent heat resistance and moisture resistance, and also has good adhesion to metal. Among the raw materials of polyamideimide, trimellitic anhydride and trimellitic anhydride monochloride as the acid component, and metaphenylenediamine, paraphenylenediamine, 4,4′-diaminodiphenyl ether, 4,4′- as the amine component Examples include, but are not limited to, diaminodiphenylmethane, bis [4- (aminophenoxy) phenyl] sulfone, 2,2′-bis [4- (4-aminophenoxy) phenyl] propane, and the like. In order to improve drying property, it may be modified with siloxane. In this case, siloxane diamine is used as the amino component. In consideration of film processability, it is preferable to use a molecular weight of 50,000 or more.

  The primer layer thermosetting resin composition used in the present invention may contain additives such as pigments, leveling agents, antifoaming agents, and ion trapping agents, if necessary.

  The primer layer thermosetting resin composition prepared as described above is diluted with a solvent to form a varnish, which is applied onto a release-treated film and semi-cured to obtain a film with a primer layer. Can do.

  Solvents include ketones such as acetone, methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, xylene and toluene, alcohols such as ethylene glycol monoethyl ether, esters such as ethyl ethoxypropionate, N, N -Amides such as dimethylformamide and N, N-dimethylacetamide. These solvents may be used alone or in combination of two or more. The usage-amount of the solvent with respect to a thermosetting resin composition is not specifically limited, It can be set as the quantity conventionally used.

  When the thermosetting resin composition for a primer layer used in the present invention is applied to a film with a comma coater or a gravure coater as a varnish, the total solid content of the thermosetting resin composition for the primer layer is 10 to 50% by mass. It is preferable to adjust the amount of the solvent used.

  The thickness of the primer layer at this time shall be 10 micrometers or less, and it is preferable that it is 1.0-5.0 micrometers. If it is less than 1.0 μm, the primer layer is lost during the desmear treatment, and there is a possibility that high adhesive strength with the plated copper cannot be secured during the semi-additive construction method. On the other hand, when the thickness exceeds 10 μm, the properties of the prepreg used at the time of molding, for example, the elastic modulus as a substrate after heating and pressurization, Tg, or the like may be significantly reduced. In order to sufficiently exhibit the characteristics of the prepreg, the primer layer is more preferably in the range of 2.0 to 4.0 μm.

  The film to which the primer is applied serves as a support for producing the film with a primer layer in the present invention, and is usually finally peeled off or removed when producing a multilayer printed wiring board. Examples of the support film include polyolefin such as polyethylene and polypropylene, polyethylene terephthalate (may be abbreviated as “PET”), polyester such as polyethylene naphthalate, polycarbonate, polyimide, and the like.

  The support film may be subjected to a release treatment, a mat treatment or a corona treatment, and a release-treated film is preferably used for easy peeling. The thickness of the support film is usually 10 to 150 μm, preferably 25 to 50 μm. When the thickness is 10 μm or more, handleability becomes easy. On the other hand, as described above, since the support film is usually finally peeled or removed, the thickness is set to 150 μm or less from the viewpoint of energy saving or the like.

The prepreg used in the present invention is obtained by impregnating or coating a resin composition on a base material. As the base material, well-known ones used for various laminates for electrical insulating materials can be used. Examples of the material of the substrate include inorganic fibers such as E glass, D glass, S glass, and Q glass, organic fibers such as polyimide, polyester, and tetrafluoroethylene, and mixtures thereof.
These base materials have shapes such as woven fabric, non-woven fabric, low-ink, chopped strand mat, surfacing mat, etc., and the material and shape are selected depending on the intended use and performance of the molded product, and can be used alone or as required. It can be used from more than a variety of materials and shapes. There is no particular limitation on the thickness of the base material, but usually 0.01 to 0.5 mm is used, and surface treated with a silane coupling agent or the like or mechanically subjected to fiber opening treatment is heat resistant. And from the viewpoint of moisture resistance and workability. In the present invention, it is preferable to use a commonly used E-glass woven fabric.

  As the resin composition used for the prepreg, a known and customary resin composition used as an insulating material for a printed wiring board can be used. Usually, thermosetting resin with good heat resistance and chemical resistance is used as the base, and as thermosetting resin, phenol resin, epoxy resin, cyanate resin, maleimide resin, isocyanate resin, benzocyclobutene resin, vinyl resin However, the present invention is not limited to these examples. One type of thermosetting resin may be used alone, or two or more types may be mixed and used.

  Among thermosetting resins, epoxy resins are particularly important because they are widely used as insulating resins because they are excellent in heat resistance, chemical resistance and electrical properties and are relatively inexpensive. Epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins and other bisphenol type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and bisphenol A novolak type epoxy resins. Type epoxy resin, cycloaliphatic epoxy resin, aliphatic chain epoxy resin, diglycidyl etherified product of biphenol, diglycidyl etherified product of naphthalenediol, diglycidyl etherified product of phenol, diglycidyl etherified product of alcohol, and these And alkyl-substituted products, halides, hydrogenated products, and the like. One type of epoxy resin may be used alone, or two or more types may be mixed and used. The curing agent used together with the epoxy resin can be used without limitation as long as it cures the epoxy resin. For example, polyfunctional phenols, polyfunctional alcohols, amines, imidazole compounds, acid anhydrides, organic There are phosphorus compounds and their halides. These epoxy resin curing agents may be used alone or in combination of two or more.

  The cyanate ester resin is a resin that generates a cured product having a triazine ring as a repeating unit by heating, and the cured product is excellent in dielectric characteristics, and is often used particularly when high-frequency characteristics are required. Examples of cyanate ester resins include 2,2-bis (4-cyanatophenyl) propane, bis (4-cyanatophenyl) ethane, 2,2-bis (3,5-dimethyl-4-cyanatophenyl) methane, 2,2-bis (4-cyanatophenyl) -1,1,1,3,3,3-hexafluoropropane, α, α′-bis (4-cyanatophenyl) -m-diisopropylbenzene, phenol novolak And cyanate esterified products of alkylphenol novolac and the like. Among these, 2,2-bis (4-cyanatophenyl) propane is preferable because it has a particularly good balance between the dielectric properties and curability of the cured product and is inexpensive. Moreover, a cyanate ester compound may be used individually by 1 type, and 2 or more types may be mixed and used for it. The cyanate ester compound used here may be partially oligomerized in advance to a trimer or a pentamer. Furthermore, a curing catalyst or a curing accelerator may be added to the cyanate resin. As the curing catalyst, metals such as manganese, iron, cobalt, nickel, copper, and zinc are used. Specifically, organic metal salts such as 2-ethylhexanoate, naphthenate, octylate, and acetylacetone are used. Used as organometallic complexes such as complexes. These may be used alone or in combination of two or more. Phenols are preferably used as the curing accelerator, and monofunctional phenols such as nonylphenol and paracumylphenol, bifunctional phenols such as bisphenol A, bisphenol F, and bisphenol S, or polyfunctional phenols such as phenol novolac and cresol novolac. Etc. can be used. These may be used alone or in combination of two or more.

  The resin composition used as the insulating material may be blended with a thermoplastic resin in consideration of dielectric properties, impact resistance, film processability, and the like. Examples of the thermoplastic resin include, but are not limited to, fluororesin, polyphenylene ether, modified polyphenylene ether, polyphenylene sulfide, polycarbonate, polyether imide, polyether ether ketone, polyarylate, polyamide, polyamide imide, and polybutadiene. I don't mean. One type of thermoplastic resin may be used alone, or two or more types may be mixed and used.

  Among thermoplastic resins, blending polyphenylene ether and modified polyphenylene ether is useful because it improves the dielectric properties of the cured product. Examples of polyphenylene ether and modified polyphenylene ether include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-dimethyl-1,4-phenylene) ether and polystyrene alloyed polymer, poly Alloyed polymer of (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene copolymer, Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-maleic anhydride copolymer Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and polyamide, alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene-acrylonitrile copolymer, etc. Is mentioned. In addition, in order to impart reactivity and polymerizability to polyphenylene ether, functional groups such as amino groups, epoxy groups, carboxyl groups, styryl groups, and methacryl groups are introduced at the ends of the polymer chains, or amino groups are introduced into the side chains of the polymer chains. In addition, a functional group such as an epoxy group, a carboxyl group, a styryl group, or a methacryl group may be introduced.

  Among thermoplastic resins, polyamideimide resin is useful because it has excellent heat resistance and moisture resistance, and also has good adhesion to metal. Among the raw materials of polyamideimide, trimellitic anhydride and trimellitic anhydride monochloride as the acid component, and metaphenylenediamine, paraphenylenediamine, 4,4′-diaminodiphenyl ether, 4,4′- as the amine component Examples include, but are not limited to, diaminodiphenylmethane, bis [4- (aminophenoxy) phenyl] sulfone, 2,2′-bis [4- (4-aminophenoxy) phenyl] propane, and the like. In order to improve drying property, it may be modified with siloxane. In this case, siloxane diamine is used as the amino component. In consideration of film processability, it is preferable to use a molecular weight of 50,000 or more.

An inorganic filler may be mixed in the resin composition used as the insulating material.
Examples of the inorganic filler include alumina, aluminum hydroxide, magnesium hydroxide, clay, talc, antimony trioxide, antimony pentoxide, zinc oxide, fused silica, glass powder, quartz powder, and shirasu balloon. These inorganic fillers may be used alone or in combination of two or more.

  The resin composition used as the insulating material may contain an organic solvent. Examples of organic solvents include aromatic hydrocarbon solvents such as benzene, toluene, xylene and trimethylbenzene; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; ether solvents such as tetrahydrofuran; isopropanol and butanol. Suitable alcohol solvents; ether alcohol solvents such as 2-methoxyethanol and 2-butoxyethanol; amide solvents such as N-methylpyrrolidone, N, N-dimethylformamide and N, N-dimethylacetamide You may use together. The amount of solvent in the varnish when preparing the prepreg is preferably in the range of 40 to 80% by mass, and the viscosity of the varnish is preferably in the range of 20 to 1000 cP (0.02 to 1 Pa · s). .

  The resin composition used as the insulating material may contain a flame retardant. Examples of the flame retardant include bromine compounds such as decabromodiphenyl ether, tetrabromobisphenol A, tetrabromophthalic anhydride, tribromophenol, triphenyl phosphate, tricresyl phosphate, trixyl phosphate, cresyl diphenyl phosphate, etc. Known metal compounds such as phosphorus compounds, magnesium hydroxide and aluminum hydroxide, red phosphorus and modified products thereof, antimony compounds such as antimony trioxide and antimony pentoxide, and triazine compounds such as melamine, cyanuric acid and melamine cyanurate Conventional flame retardants can be used.

  Various additives and fillers such as curing agents, curing accelerators, thermoplastic particles, colorants, UV-opaque agents, antioxidants, reducing agents, etc., as necessary, for resin compositions used as insulating materials Add and mix.

  Usually, after impregnating or coating the base material so that the amount of the resin composition attached to the base material is 20 to 90% by mass in terms of the resin content of the prepreg after drying, it is usually 1 at a temperature of 100 to 200 ° C. Heat-dry for ˜30 minutes to obtain a semi-cured (B-stage) prepreg.

  When a primer layer having a film as a support is laminated on a prepreg, a protective film may be laminated simultaneously on the opposite surface of the prepreg. The heating temperature for pressure bonding to the prepreg while heating the primer layer with the film as a support is preferably 120 to 190 ° C., and the pressure is preferably about 0.1 to 2.0 MPa. There are no particular restrictions on the conditions. In addition, if the primer layer having the film as a support is heated to 120 to 190 ° C. as described above, it is not necessary to preheat the prepreg in advance, but in order to further improve the laminating property, the preheat treatment is not necessary. Can also be done. The laminating method may be a batch method or a continuous method using a roll. After lamination, the support film and protective film are peeled off before the lamination step.

  In the method for producing a substrate using the prepreg with a primer layer as described above, the copper foil and the prepreg with a primer layer are laminated and integrated by a conventionally known method to obtain a laminate.

The method for producing a multilayer printed wiring board of the present invention is a laminate obtained by stacking a copper foil on the primer layer side of the prepreg with a primer layer for a plating process of the present invention and laminating a laminate processed with a circuit on the opposite side, and heating and pressing the laminate. The copper foil is removed by etching, and a circuit is formed on the exposed primer layer by a semi-additive method. Circuit formation by the semi-additive method can be performed by a generally used method, and an example thereof is shown in the embodiment.
By using a release film instead of the copper foil, a circuit can be formed in the primer layer by a semi-additive method, which is efficient because no copper foil is used. In the case of using a copper foil, the formability and the roughened surface of the copper foil can be transferred to the primer layer, so that the adhesiveness of the copper circuit obtained by the semi-additive construction method is enhanced, which is suitable for fine processing.

(Example 1)
The following resin composition A was produced.
(Preparation of resin composition A)
(A) Epoxy resin / Novolac type epoxy resin having biphenyl structure, NC3000S-H (manufactured by Nippon Kayaku Co., Ltd.) 100 parts by mass (B) polymer component / carboxylic acid modified acrylonitrile butadiene rubber particles, XER-91SE-15 ( 10 parts by mass (C) epoxy resin curing agent / triazine ring-containing cresol novolac type phenol resin, phenolite LA-3018-50 (nitrogen content 18%, hydroxyl group equivalent 151, manufactured by DIC Corporation)
70 parts by mass (D) curing accelerator / amine compound, 1,8-diazabicycloundecene, DBU (manufactured by Kanto Chemical Co., Inc.)
1 part by mass / solvent, methyl ethyl ketone

(Preparation of primer B with film as support)
The resin composition A was applied to the release surface of the release-treated PET film to prepare a primer B having the film as a support. After coating, drying was performed at 180 ° C. for 10 minutes so that the residual solvent was 1% by mass or less. The thickness of the applied resin composition A was 3.0 μm.

(Preparation of prepreg with primer layer)
Using a laminator, a primer B having a film as a support, a prepreg (manufactured by Hitachi Chemical Co., Ltd., glass cloth substrate high Tg epoxy resin prepreg GEA-679FG (thickness 0.1 mm)) and a protective film (PET film) at 150 ° C. A prepreg with a primer layer was prepared by laminating at 1.0 MPa. At this time, the primer B was placed on the prepreg side, and the primer B, the prepreg, and the protective film with the film as a support were used.

  The film support and the protective film of the prepreg with the primer layer obtained above are peeled off, and the copper foil thickness is formed by previously forming a copper foil (F2WS-12, manufactured by Furukawa Electric Co., Ltd.) on the primer layer side and a circuit in advance on the opposite side. A copper-clad laminate MCL-E-679FG (manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 18 μm and a thickness of 0.4 mm is laminated (copper foil-primer layer / prepreg-circuit forming substrate) at 180 ° C. and 3.0 MPa. The substrate was manufactured by press molding for 1 hour.

(Example 2)
A substrate was produced in the same manner as in Example 1 except that the resin composition A was applied to a thickness of 8 μm in Example 1.

(Example 3)
A substrate was produced in the same manner as in Example 1 except that 5 parts by mass of fumed silica (manufactured by Nippon Aerosil Co., Ltd., trade name: R972) was blended in Example 1.

(Comparative Example 1)
In Example 1, except that the prepreg (Hitachi Chemical Co., Ltd., glass cloth base material high Tg epoxy resin prepreg GEA-679FG (thickness 0.1 mm)) which does not laminate the primer B having a film as a support was used. A substrate was produced in the same manner as in Example 1.

(Comparative Example 2)
In Example 1, a substrate was produced in the same manner as in Example 1 except that the resin composition A was applied to a thickness of 15 μm.

(Evaluation of fine wiring formation)
The substrates obtained in Examples 1 to 3 and Comparative Examples 1 and 2 are entirely etched, and the minimum circuit conductor width / circuit conductor interval (L / S) = 15/15 μm is obtained using the semi-additive method shown below. A circuit pattern was formed as described above.

  The substrate etched on the entire surface was roughened. In the roughening treatment, a permanganic acid roughening solution (MLB conditioner 211: trade name, manufactured by Rohm and Haas Electronic Materials Co., Ltd.) heated to 70 ° C. and heated to 80 ° C. for 5 minutes. Rohm and Haas Electronic Materials Co., Ltd., MLB Promoter 213: Trade Name) for 10 minutes, hydroxylamine sulfate neutralizing solution (Rohm and Haas Electronic Materials Co., Ltd., MLB Neutralizer 216-2: Trade Name) ) For 5 minutes.

  Next, the substrate subjected to the roughening treatment is immersed in a conditioner (Hitachi Chemical Co., Ltd., using CLC-601 (trade name)) at 60 ° C. for 5 minutes, washed with hot water at 60 ° C., washed with water (normal temperature ( 25 ° C.), the same applies hereinafter), immersion in a catalyst solution for electroless plating (made by Hitachi Chemical Co., Ltd., using HS-202B (trade name)) at room temperature for 10 minutes, washing with water at room temperature, palladium activity It was immersed in a chemical treatment solution (manufactured by Hitachi Chemical Co., Ltd., using ADP-401 (trade name)) at room temperature for 5 minutes and washed in this order.

  Next, it is immersed in an electroless copper plating solution (manufactured by Hitachi Chemical Co., Ltd., CUST201 (trade name)) at room temperature for 15 minutes, washed with water, dried at 80 ° C. for 10 minutes, and electroless plating thinned. It was.

  Next, RY-3325 (trade name, manufactured by Hitachi Chemical Co., Ltd.) which is a dry film photoresist is laminated on the surface of the electroless plating layer, and a photomask ((L / S ) = 15/15 μm), and developed with plating to form a plating resist.

Next, using a copper sulfate bath, electrolytic copper plating was performed for about 20 μm under conditions of a liquid temperature of 25 ° C. and a current density of 1.0 A / dm ² to form a circuit. Subsequently, the resist was removed, and the electroless copper plating on the lower surface of the resist was removed by soft etching.

  Next, it was evaluated using a microscope and an ohmmeter whether the circuit pattern was reliably formed.

(Measurement of plating peel)
Using part of the circuit pattern for fine wiring formation evaluation in Examples 1 to 3 and Comparative Examples 1 and 2, the conductor peeling strength of the evaluation sample was measured. For peeling, the vertical peeling strength was measured. Measurements were always made at 20 ° C. The measuring method was based on JIS-C-6482.

(Hygroscopic heat resistance test)
The moisture absorption heat test of the substrates of Examples 1 to 3 and Comparative Examples 1 and 2 was performed. In the board test, each sample was treated for 2 hours under the conditions of 121 ° C., humidity 100% RH, and 2 atmospheres, and then immersed in a solder bath at 288 ° C. for 20 seconds to confirm whether or not swelling or the like occurred on the substrate. went. A saturation type PCT apparatus PC-242 manufactured by Hirayama Seisakusho was used for the test.

(Test results)
The test results are shown in Table 1.

  It was found that the substrates produced in Examples 1, 2, and 3 were excellent in fine wiring formation, high in plating peel, and excellent in adhesion with plated copper. Moreover, the moisture absorption heat resistance of the substrate was also good. In Comparative Example 1, since there was no adhesive layer, adhesion with the plated copper was poor, line peeling occurred during circuit formation, and fine wiring formation was difficult. In addition, blistering occurred in the moisture absorption heat resistance test. In Comparative Example 2, since the layer of the adhesion auxiliary agent became thick, blistering occurred in the moisture absorption heat resistance test.

Claims (8)

  A prepreg with a primer layer bonded to one side of a prepreg, which is a primer layer on the film (A) epoxy resin, (B) polymer component, (C) epoxy resin curing agent, (D) curing accelerator A prepreg with a primer layer for a plating process, wherein a film with a primer layer formed of a thermosetting resin composition containing 10 μm or less is bonded to one side of the prepreg.   The prepreg with a primer layer for a plating process according to claim 1, wherein (A) the epoxy resin is a novolac type epoxy resin having a biphenyl structure.   (B) The polymer component is composed of at least one selected from acrylonitrile butadiene rubber particles, carboxylic acid-modified acrylonitrile butadiene rubber particles, carboxylic acid-modified acrylonitrile butadiene rubber particles, and core-shell particles of butadiene rubber-acrylic resin. The prepreg with a primer layer for a plating process according to claim 1 or 2.   The prepreg with a primer layer for a plating process according to any one of claims 1 to 3, wherein (C) the epoxy resin curing agent is a triazine ring-containing novolac type phenol resin.   The prepreg with a primer layer for a plating process according to any one of claims 1 to 4, wherein the thermosetting resin composition further contains an inorganic filler (E) having an average primary particle size of 100 nm or less.   A copper foil of a laminated board obtained by stacking a copper foil on the primer layer side of the prepreg with a primer layer for a plating process according to any one of claims 1 to 5, and laminating a laminated board obtained by circuit processing on the opposite side, and heating and pressing the laminated foil. A method for producing a multilayer printed wiring board, in which a circuit is formed by etching in an exposed primer layer by a semi-additive method.   The multilayer printed wiring board manufacturing method according to claim 6, wherein a copper foil is laminated on a primer layer side of a prepreg with a primer layer for a plating process, and a laminated board obtained by circuit processing is laminated on at least one prepreg on the opposite side. A method for manufacturing a wiring board.   A multilayer printed wiring board obtained by the method for producing a multilayer printed wiring board according to claim 6 or 7.