JP2016001311A - Electro-optic substrate, electro-optic device, manufacturing method, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a sealing process for a connection part between each flexible substrate and each mount terminal in an electro-optic substrate in which a plurality of data line control circuits are mounted by a COF system, and to avoid an increase in thickness of the entire electro-optic substrate.SOLUTION: A terminal part is provided along one side of an electro-optic substrate in a scanning line direction, and first and second mount terminals 12-1 and 12-2 for connecting first and second flexible substrates 30-1 and 30-2 mounted with data line control circuits respectively are arranged in a direction of drawing data lines. In a sealing step of applying resin 50-1 to 50-3 for sealing a bonding part between the first flexible substrate 30-1 and the first mount terminal 12-1 and a bonding part between the second flexible substrate 30-2 and the second mount terminal 12-2, the resin is applied so that parts of the former bonding part and the latter bonding part that face each other are sealed with a common resin member 50-2.

Description

  The present invention relates to an electro-optic board in which a plurality of wiring boards such as TCP (tape carrier package), FPC (flexible printed circuit), COF (Chip On Film), etc. are superimposed on a terminal portion of the electro-optic board, In particular, the present invention relates to a circuit suitable for an electro-optical substrate on which a driving circuit such as a data line control circuit or a scanning line control circuit is mounted by a COF method.

In the COF method, a data line control circuit or a scanning line control circuit is mounted on a flexible substrate formed in a film shape with polyimide or the like, and the flexible substrate is mounted on an electro-optical substrate through an anisotropic conductive film. This is a method of thermocompression bonding to a terminal (hereinafter, mounted terminal) provided in the terminal portion. In addition, when a data line control circuit or a scanning line control circuit is mounted on an electro-optic board by the COF method, the connection portion between the mounting terminal on the electro-optic board side and the terminal on the flexible board side is sealed (molded). ) Is also commonly done. This is to protect the connection portion between the mounting terminal on the electro-optic substrate side and the flexible substrate from moisture and dust, and to reinforce the connection portion.
In addition, the data line control circuit or the scanning line control circuit can be configured to be mounted by a TCP method (see, for example, Patent Document 1). Alternatively, the data line control circuit or the scanning line control circuit may be arranged on another substrate and connected to the electro-optical substrate by FPC.

JP 2000-242194 A

  For example, when the data line control circuit is implemented by the COF method, it is generally performed to divide the data line into a plurality of groups, for example, those belonging to the left half and those belonging to the right half, and to implement the data line control circuit for each group. It has been broken. This is because both the cost and the accuracy are superior to the mode in which the drive control of all the data lines is performed by one data line control circuit. In an embodiment in which a plurality of data line control circuits (or scanning line control circuits) are mounted, mounting terminals for connecting a flexible substrate on which each data line control circuit (or each scanning line control circuit) is mounted are electrically connected. In many cases, it is arranged in parallel with the terminal portion along one side of the optical substrate. Some large electro-optic substrates such as for liquid crystal television receivers are configured by mounting terminals arranged in a matrix at the terminal portions.

  However, in the aspect in which the data lines (or scanning lines) are grouped and the data line control circuit (or scanning line control circuit) is mounted for each group, the sealing process takes time and effort as the number of mounting terminals increases. Cost increases. Further, in the aspect in which the mounting terminals for connecting the flexible substrate on which the data line control circuit (or the scanning line control circuit) is mounted are arranged in a matrix of 2 × 2, the thickness of the entire electro-optical substrate is increased. There is also a problem. This is because the electro-optic substrates connected to the mounting terminals arranged in the direction of drawing out the flexible substrate overlap each other, so that the upper flexible substrate serves as a connection portion between the lower flexible substrate and the mounting terminals. This is because the thickness when these flexible substrates are laminated is increased by the rise of the resin member to be sealed.

  The present invention has been made in view of the above problems, and in an electro-optical substrate on which a driving circuit such as a data line control circuit or a scanning line control circuit is mounted via a COF method, a TCP method, or an FPC, It is an object of the present invention to provide a technique for simplifying a sealing process of a connection portion between a flexible substrate and a mounting terminal and avoiding an increase in thickness when the flexible substrate is laminated.

  In order to solve the above-described problem, the present invention provides a terminal portion provided on at least one side of the electro-optic substrate, and first and second mounting terminals arranged on the terminal portion and arranged side by side in a direction intersecting the one side. A first flexible substrate connected to the first mounting terminal and a second flexible substrate connected to the second mounting terminal, wherein the first flexible substrate overlaps with the first flexible substrate. The second flexible substrate, the first resin member covering the first side surface of the first mounting terminal, the second side surface facing the first side surface of the first mounting terminal, and the second side surface A second resin member covering the third side surface of the second mounting terminal facing the second side, and a third resin member covering the fourth side surface of the second mounting terminal facing the third side surface, One resin member is continuous with the first flexible substrate and the first side surface of the electro-optic substrate. The second resin member includes a portion that is continuous with the second flexible substrate and the second side surface of the electro-optic substrate, the second flexible substrate, and the third portion of the electro-optic substrate. And an electro-optic substrate characterized in that the third resin member covers the second flexible substrate and a portion that continues to the fourth side surface of the electro-optic substrate. To do.

In such an electro-optical substrate, the first flexible substrate and a portion connected to the second side surface of the first mounting terminal of the electro-optical substrate, and the second flexible substrate and the second mounting terminal of the electro-optical substrate. Portions connected to the three side surfaces are sealed by a common resin member (second resin member), and moisture proofing, dust proofing and reinforcement are realized for these portions. In addition, the first flexible substrate and the portion connected to the second side surface of the first mounting terminal of the electro-optic substrate, and the second flexible substrate and the portion connected to the third side surface of the second mounting terminal of the electro-optic substrate are shared. Therefore, the sealing process is simplified as compared with an embodiment in which these portions are sealed with separate resin members. That is, according to the present invention, the process work time (tact) of the same process can be shortened according to the simplification of the sealing process, and the manufacturing cost can be reduced.

  In addition, a portion connected to the second side surface of the first mounting terminal of the first flexible substrate and the electro-optical substrate, and a portion connected to the third side surface of the second mounting terminal of the second flexible substrate and the electro-optical substrate, respectively. In the aspect of sealing with a separate resin member, the second flexible substrate is lifted by the rise of the resin member that seals the former part, and the thickness of the entire electro-optical substrate is increased. Accordingly, it is possible to avoid an increase in the thickness of the entire electro-optic substrate. Therefore, according to the present invention, in the electro-optic board on which the flexible board on which the drive control circuit for controlling the driving of the data line or the scanning line is mounted is mounted by the COF method, the connection portion between the flexible board and the mounting terminal The manufacturing process can be reduced by simplifying the sealing process, and an increase in the thickness of the electro-optic substrate can be avoided.

  In a more preferred aspect, the electro-optic board is arranged in the direction of the one side with the first mounting terminal and arranged in the terminal portion, and in the direction of the one side, the second mounting terminal is arranged in the direction of the one side. A fourth mounting terminal disposed in the terminal portion; a third flexible substrate connected to the third mounting terminal; and a fourth flexible substrate connected to the fourth mounting terminal. A fourth flexible substrate disposed so as to overlap with the three flexible substrates, the first resin member covering the first side surface of the third mounting terminal and the first resin member together with the first resin member Covering the third flexible substrate and the portion of the electro-optic substrate continuous with the first side surface, the second resin member is formed on the second side surface and the second side surface facing the first side surface of the third mounting terminal. Covering the third side surface of the fourth mounting terminal opposite to the fourth mounting terminal Covering the third flexible substrate and the portion of the electro-optic substrate continuous with the second side surface and the fourth flexible substrate and the portion of the electro-optic substrate continuous with the third side surface, The three resin member covers the fourth side surface of the second mounting terminal facing the third side surface of the third mounting terminal and is continuous with the fourth side surface of the second flexible substrate and the electro-optical substrate. It is characterized by covering the part. According to such an aspect, the connection part of the mounting terminal arranged in the direction of the one side and the flexible substrate connected to the mounting terminal is sealed with the common resin member, further simplifying the sealing process. Manufacturing costs can be reduced.

  In a further preferred aspect, the second resin member is formed of a resin having a lower viscosity than the first resin member and the third resin member. According to such an aspect, when the resin is applied to the first flexible substrate and the part of the electro-optical substrate that is continuous with the second side surface of the first mounting terminal, the resin is applied to the second flexible substrate and the electro-optical substrate. To the portion connected to the third side surface of the second mounting terminal, whereby the second resin member is formed. For this reason, the second resin member can be formed without greatly lifting the second flexible substrate. That is, according to such an aspect, in the step of forming the second resin member, it can be avoided that the second flexible substrate is peeled off from the second mounting terminal and the electro-optical substrate is damaged.

  In a further preferred aspect, the electro-optic substrate is characterized in that the first, second and third resin members are formed by continuously applying a resin. Here, applying the resin continuously is so-called one-stroke writing, and means applying the resin continuously without interruption. According to such an aspect, the application trajectory of the resin is simplified, and the cost can be reduced by further simplifying the sealing process.

  Further, in another aspect of the present invention, an aspect in which an electro-optical device having the electro-optical substrate and an electronic apparatus including the electro-optical device as a display unit are also conceivable. As described above, according to the electro-optical substrate of the present invention, the manufacturing cost can be reduced by simplifying the sealing process. Therefore, the electro-optical device including the electro-optical substrate, or the electro-optical device as a display unit. Similarly, the product cost can be reduced for the electronic devices provided.

1 is a left side view of an electro-optical substrate 1 according to an embodiment of the present invention. 2 is a perspective view of the same electro-optical substrate 1. FIG. 2 is a left side view of the electro-optical substrate 1 in a state where sealing with resin is performed. FIG. It is a figure for demonstrating the effect of this embodiment. It is a figure for demonstrating the application locus | trajectory of sealing resin. It is a figure for demonstrating the variation of the application locus. It is a figure for demonstrating the variation of the application locus. It is a figure for demonstrating the dispenser apparatus for forming resin member 50-j (j = 1-3), and the sealing process using this dispenser apparatus. It is a figure for demonstrating the variation of the dispenser apparatus. It is a figure for demonstrating the electro-optical board | substrate which concerns on the modification (1) of this invention. It is a figure for demonstrating the application | coating locus | trajectory of sealing resin in the sealing process of the electro-optical board | substrate which concerns on the modification (1). It is a figure for demonstrating the variation of the application locus. It is a perspective view which shows the structure of the personal computer to which the same electro-optical apparatus is applied. It is a perspective view which shows the structure of the mobile telephone to which the same electro-optical apparatus is applied. It is a perspective view which shows the structure of the portable information terminal to which the electro-optical device is applied. It is a perspective view which shows the structure of the projection type display apparatus to which the same electro-optical apparatus is applied.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(A. Embodiment)
(A-1: Configuration)
FIG. 1 is a side view of an electro-optical substrate 1 according to an embodiment of the present invention, and FIG. 2 is a perspective view of the electro-optical substrate 1. The electro-optical substrate 1 constitutes an active matrix type liquid crystal display device that forms a display unit of a small electronic device such as a projection type projector. For example, as shown in FIG. (Not shown in FIG. 2) is placed. A gap between the element substrate 10 and the counter substrate 20 is filled with an electro-optical material such as liquid crystal (not shown in FIGS. 1 and 2). A portion of the surface of the element substrate 10 that overlaps the counter substrate 20 has a pixel electrode (not shown) and a TFT (Thin Film Transistor) element (not shown) in which one of the three terminals is connected to the pixel electrode. Are arranged in a matrix. The remaining two terminals among the three terminals of the TFT element are connected to scanning lines (not shown) and data lines (not shown) arranged in a grid pattern surrounding the pixel electrode. Each scanning line extends along the X direction in FIG. 2, is pulled out in the X direction, and is connected to a scanning line control circuit (not shown). On the other hand, each data line extends along the Y direction in FIG. 2 and is drawn out in the Y direction. In the terminal portion 12 of the element substrate 10, the mounting terminals 12-1, 12-2, 12-3, and 12-4 are provided. It is connected to either.

  As shown in FIG. 2, the terminal portion 12 is provided along one side of the element substrate 10 (one side in the X direction in the example shown in FIG. 2). As shown in FIG. 1, the terminal portion 12 has a direction in which the mounting terminal 12-2 and the mounting terminal 12-1 cross the one side from the side close to the counter substrate 20 (that is, the Y direction in FIG. 2). Are arranged with a short interval (for example, 1 mm). As shown in FIG. 2, the mounting terminal 12-3 is arranged side by side with the mounting terminal 12-1 in the direction of the one side, and the mounting terminal 12-4 is arranged side by side with the mounting terminal 12-2 in the direction of the one side. Although not shown in detail in FIGS. 1 and 2, the mounting terminals 12-1 are connected to data lines connected to the lower left half of the TFT elements arranged in a matrix on the element substrate 10, respectively. The mounting terminals 12-2 are connected to data lines connected to the TFT elements arranged in the upper left half. The mounting terminal 12-3 is connected to data lines connected to the TFT elements arranged in the lower right half, and the mounting terminal 12-4 is connected to the TFT element arranged in the upper right half. A data line connected to each of these is connected.

  Each of the mounting terminals 12-k (k = 1 to 4) has a flexible substrate 30-k (k = 1 to 4) through an anisotropic conductive film 40-k (k = 1 to 4). Thermocompression bonded. The flexible substrate 30-k is, for example, formed of polyimide in a film shape, and a data line control circuit (not shown) is mounted thereon. In FIG. 1, the flexible substrate 30-1 is connected to the mounting terminal 12-1 through the anisotropic conductive film 40-1 and the mounting terminal through the anisotropic conductive film 40-2. 12-2 shows a state in which the flexible substrate 30-2 is connected. As shown in FIG. 1, the flexible substrate 30-2 connected to the mounting terminal 12-2 is disposed so as to overlap the flexible substrate 30-1 connected to the mounting terminal 12-1. The Similarly, the flexible substrate 30-4 connected to the mounting terminal 12-4 is disposed so as to overlap the flexible substrate 30-3 connected to the mounting terminal 12-3.

  Although detailed illustration is omitted in FIGS. 1 and 2, the connection portion between the mounting terminal 12-k (k = 1 to 4) and the flexible substrate 30-k (k = 1 to 4) is moisture and dust proof. And it is sealed with a resin member for reinforcement. The electro-optical substrate 1 according to the present embodiment is characterized in that a resin is applied to form the resin member.

  FIG. 3 shows the electro-optical substrate 1 in a state in which the connecting portion of the mounting terminal 12-k (k = 1 to 4) and the flexible substrate 30-k (k = 1 to 4) is sealed with a resin member. It is a side view. As shown in FIG. 3, the electro-optical substrate 1 of the present embodiment has a side surface 121-1 that is a side surface farther from the counter substrate 20 among the two side surfaces extending in the X direction of the mounting terminal 12-1. The covering resin member 50-1, the side surface 122-1 which is the other (side surface facing the side surface 121-1) of the two side surfaces, and the two side surfaces extending in the same X direction of the mounting terminal 12-2. Resin member 50-2 covering the side surface (side surface 123-2) facing the side surface 122-1, and the resin member covering the side surface (side surface 124-2) facing the side surface 123-2 in the mounting terminal 12-2. 50-3. As shown in FIG. 3, the resin member 50-1 is formed so as to cover a portion that continues to the side surface 121-1 of each of the element substrate 10 and the flexible substrate 30-1. The resin member 50-2 is continuous with a portion continuous with each side surface 122-1 of the element substrate 10 and the flexible substrate 30-1, and with each side surface 123-2 of the element substrate 10 and the flexible substrate 30-2. It is formed so as to cover the part. And the resin member 50-3 is formed so that the part connected to each side surface 124-2 of the element substrate 10 and the flexible substrate 30-2 may be covered.

  Of course, all of the resin members 50-1, 50-2 and 50-3 may have the same physical properties, but the resin member 50-2 is more viscous than the resin members 50-1 and 50-3. It is preferably formed by applying a resin having a low (that is, high fluidity) resin. In the present embodiment, a resin is applied to the element substrate 10 and the side surface 122-1 of the flexible substrate 30-1 by a dispenser or the like, and the element substrate 10 and the side surface 123-2 of the flexible substrate 30-2 are applied. After the resin sufficiently flows to the continuous portion, the resin is cured by ultraviolet irradiation or the like to form the resin member 50-2. For this reason, it is preferable to use a resin having a lower viscosity than the resin members 50-1 and 50-3 for the resin member 50-2.

  As described above, the electro-optic substrate 1 of the present embodiment includes the mounting terminals 12-1 and 12-2 arranged in the Y direction (data line extending direction) in FIG. Of the connecting portions with each of 30-2, the portions facing each other are characterized in that they are sealed with a common resin member 50-2. Temporarily, as shown in FIG. 4, the part which continues to each side 122-1 of the element substrate 10 and the flexible substrate 30-1 is sealed with the resin member 52-1, and the element substrate 10 and the flexibility are provided. If the part which continues to each side 123-2 of the board | substrate 30-2 is sealed with the resin member 52-2, the frequency | count of application | coating of resin will increase compared with this embodiment. Moreover, in the aspect shown in FIG. 4, the thickness at the time of laminating | stacking flexible base | substrates 30-1 and 30-2 will increase by the part | minute of the thickness of the resin member 52-1. In other words, according to the present embodiment, the sealing process is simplified and flexible as compared with the case where the connection portion between each flexible substrate and the mounting terminal is sealed in the mode shown in FIG. It is possible to avoid an increase in thickness when the conductive substrates are stacked.

In addition, in the present embodiment, the joint portion of each mounting terminal and the flexible substrate arranged in the X direction in the terminal portion 12 is sealed with a common resin member, thereby further reducing the number of times of resin application and sealing. The stopping process is simplified. For example, the resin member 50-1 is formed so as to cover the side surface 121-3 of the mounting terminal 12-3, and the resin member 50-1 allows the side surface 121-3 of the element substrate 10 and the flexible substrate 30-1 to be covered. The part which continues to each side 121-3 is covered. The resin member 50-2 is formed so as to cover the side surface 122-3 of the mounting terminal 12-3 and the side surface 123-4 of the mounting terminal 12-4. A portion continuous with each side surface 122-3 of the flexible substrate 30-3 is covered, and a portion continuous with each side surface 123-4 of the element substrate 10 and the flexible substrate 30-4 is covered. The resin member 50-3 is formed so as to cover the side surface 124-4 of the mounting terminal 12-4, and the side surface 124 of each of the element substrate 10 and the flexible substrate 30-4 is formed by the resin member 50-3. -4 is covered.
The above is the configuration of the electro-optical substrate 1.

(A-2: Manufacturing method and manufacturing apparatus)
Next, a manufacturing method and a manufacturing apparatus for manufacturing the electro-optical substrate 1 will be described. In addition, the manufacturing method of the electro-optic substrate 1 includes the mounting terminals 12-k (k = 1 to 1) through the manufacturing process of the element substrate 10 and the anisotropic conductive films 40-k (k = 1 to 4). 4) includes a step of thermocompression bonding the flexible substrate 30-k (k = 1 to 4), etc., but since these steps are not related to the present invention, a detailed description thereof is omitted. Below, the sealing process which forms resin member 50-j (j = 1-3) and the manufacturing apparatus suitable for execution of this sealing process are demonstrated.

  As shown in FIGS. 1 and 2, the flexible substrate 30 is mounted on each of the mounting terminals 12-k (k = 1 to 4) through each of the anisotropic conductive films 40-k (k = 1 to 4). Application locus when applying the resin for forming the resin members 50-1, 50-2 and 50-3 to the electro-optic substrate 1 in a state where -k (k = 1 to 4) is thermocompression bonded. Various modes are conceivable. For example, with the aspect which apply | coats resin so that each of three application | coating locus | trajectories R11, R12, and R13 shown in FIG. 5 may be drawn, and to form each of resin member 50-1, 50-2, and 50-3 separately As shown in FIG. 6 or FIG. 7, it is conceivable that the resin members 50-1, 50-2 and 50-3 are formed by applying the resin continuously (so-called with a single stroke).

  For example, in the embodiment shown in FIG. 6, resin members 50-3 and 50-2 are applied by continuously applying the resin without interrupting the application trajectories R21, R22, R23, R24 and R25 in this order. And 50-1 are formed in this order. On the other hand, in the embodiment shown in FIG. 7, by continuously applying the resin without interrupting the resin so as to draw the application trajectories R31, R32, R33, R34, R35, R36, and R37 in this order, the resin member 50-3. , 50-2 and 50-1 are formed in this order. In FIG. 7, R34, R35, R36 and R37 are drawn in this order, and then resin is applied so as to draw R33, R32 and R31 in the opposite direction to the example shown in FIG. Each resin member can be formed in the order of 2, 50-1, and 50-3. In the embodiment shown in FIG. 6 and FIG. 7, resin and application are performed on some of the side surfaces extending in the Y direction of the connection portion as compared with the embodiment shown in FIG. 5. Thus, it is considered that the moisture-proof, dust-proof and reinforcing effects on the connecting portion are increased and the reliability is improved. However, it is not always essential to apply the resin to the side surface extending in the Y direction.

  Although various aspects can be considered about the formation order of the resin members 50-1, 50-2, and 50-3, the resin member 50-2 is formed first in relation to the resin members 50-2 and 50-3. It is preferable. The reason is as follows. As described above, in the electro-optical substrate 1 of the present embodiment, the flexible substrate 30-2 is superimposed on the flexible substrate 30-1, and the flexible substrate 30-4 is a flexible substrate. It is superimposed on 30-3. For this reason, when forming the resin member 50-2, it is necessary to lift the flexible substrate 30-2 and the flexible substrate 30-4 and apply the resin. If the resin member 50-3 is formed prior to the formation of the resin member 50-2, the resin member 50-3 is mounted when the flexible substrate 30-2 (or the flexible substrate 30-4) is lifted. There is a risk of peeling from the terminal 12-2 (or the mounting terminal 12-4). For this reason, it is preferable to form the resin member 50-2 prior to the formation of the resin member 50-3.

  Moreover, when forming the resin member 50-1, it is preferable to apply | coat resin from the back surface side of the electro-optical board | substrate 1. FIG. If the resin is applied from the surface side of the electro-optic substrate 1, it is necessary to lift all the flexible substrates 30-k (k = 1 to 4), and the flexible substrate 30-k is peeled off. It is because there is a possibility of doing. As described above, when forming the resin member 50-1, it is preferable to apply the resin from the back side of the electro-optic substrate 1. For example, the electro-optic substrate 1 is held horizontally and the resin is only in the vertically downward direction. When the resin is applied using a conventional manufacturing apparatus that discharges the resin, it is necessary to turn the electro-optical substrate 1 over to form the resin member 50-1. For this reason, when applying resin using the conventional manufacturing apparatus, it is preferable to form the resin member 50-1 first or last. The resin members 50-2 and 50-3 need to be formed by applying resin from the surface side of the electro-optical substrate 1, and if the resin member 50-1 is formed second, the electro-optical substrate 1 This is because the work to reverse the front and back occurs twice.

  As described above, in the aspect in which the resin member 50-j (j = 1 to 3) is formed using a conventional manufacturing apparatus, the electro-optical substrate 1 is attached at least once when the resin member 50-1 is formed. It is necessary to work upside down. For this reason, the resin member 50-j (j = 1 to 3) cannot be formed in such a manner that the resin is applied by one stroke as shown in FIG. 6 or FIG. Hereinafter, a specific example of a manufacturing apparatus capable of forming the resin member 50-j (j = 1 to 3) by applying the resin with one stroke shown in FIG. 6 or FIG. 7 will be described with reference to the drawings. .

  The manufacturing apparatus shown in FIG. 8 includes a panel suction stage 200 for fixing the electro-optic substrate 1 horizontally, a discharge nozzle 220 having an elongated tubular discharge port capable of adjusting the discharge angle of the resin, and a flexible substrate 30-2. And a support plate member 230 that gently lifts and holds 30-4. In the manufacturing apparatus shown in FIG. 8, for example, the resin member 50-j (j = 1 to 3) is formed with a single stroke by applying resin so as to draw the application locus shown in FIG. be able to. First, the flexible bases 30-2 and 30-4 are gently lifted and held by the support plate member 230. Since the discharge port of the discharge nozzle 220 is formed in an elongated tubular shape, the resin member 50-2 can be formed without lifting the flexible substrates 30-2 and 30-4 greatly. As described above, if the flexible substrates 30-2 and 30-4 are lifted greatly, the electro-optic substrate 1 may be damaged (the flexible substrates 30-2 and 30-4 may be peeled off from the mounting terminals). Street. In this embodiment, since the resin member 50-2 can be formed without greatly lifting the flexible substrates 30-2 and 30-4, the electro-optical substrate 1 is damaged in the process of forming the resin member 50-2. It is difficult to generate. In this embodiment, the flexible base plates 30-2 and 30-4 are lifted from below by the support plate member 230. However, the plate member and the support plate member 230, which form a pair with the support plate member 230, are supported. Alternatively, the flexible substrates 30-2 and 30-4 may be sandwiched and lifted.

  Next, the operating position of the discharge nozzle 220 is positioned so as to discharge the resin vertically downward toward the start point of the application locus R21 in FIG. 6, and the end point of the application locus R21 in FIG. (In the example shown in FIG. 8, the discharge nozzle 220 is moved from the near side to the far side in the X direction in the figure). Thereby, the resin member 50-3 is formed. Next, from the end point of the application trajectory R21 in FIG. 6 to the start point of the application trajectory R23 in FIG. 6, the discharge nozzle 220 is swung while discharging the resin so as to draw the application trajectory R22 in FIG. 6 (in the example shown in FIG. 8, 6, while discharging the resin from the discharge nozzle 220 so as to draw the application trajectory R23 in FIG. 6, so as to draw the application trajectory R23 in FIG. 6 (in the example shown in FIG. 8, In the drawing, the discharge nozzle 220 is moved from the rear side in the X direction to the front side. Thereby, the resin member 50-2 is formed. Then, as the application locus R24 of FIG. 6 is drawn, the discharge angle of the discharge nozzle 220 is further swung clockwise by the angle φ2 while discharging the resin (see FIG. 8), and the application locus R25 of FIG. The discharge nozzle 220 is moved from the front side in the X direction in FIG. 8 to the back side while discharging the resin. Thereby, the resin member 50-1 is formed.

  As described above, according to the manufacturing apparatus shown in FIG. 8, the process of forming the resin member 50-2 (or 50-3) and the process of forming the resin member 50-1 are performed without turning over the electro-optical substrate 1. The resin member 50-j (j = 1 to 3) can be formed by applying resin with a single stroke. If the discharge angle of the discharge nozzle 220 is adjusted by computer control, the sealing process of the electro-optical substrate 1 can be automated.

  The manufacturing apparatus shown in FIG. 9 includes a discharge nozzle 310 that discharges resin vertically downward, a panel suction stage 320 that can be fixed at an arbitrary angle with respect to a horizontal plane, and flexible substrates 30-2 and 30. And a support plate 230 for lifting -4. According to such a manufacturing apparatus, as shown in FIGS. 9A and 9B, the resin discharge direction by the discharge nozzle 310 is provided for each step of forming the resin member 50-j (j = 1 to 3). By adjusting the angle α between the panel suction stage 320 to which the electro-optical substrate 1 is fixed and the horizontal plane H so that the portion of the electro-optical substrate 1 to which the resin is applied faces each other, the electro-optical substrate 1 is not turned over. Each step can be performed. For this reason, even with the manufacturing apparatus shown in FIG. 9, it is possible to apply the resin with a single stroke to form the resin member 50-j (j = 1 to 3). In the manufacturing apparatus shown in FIG. 9 as well, if the angle between the panel suction stage 310 and the horizontal plane H is adjusted by computer control, the sealing process of the electro-optical substrate 1 can be automated.

(B. Modification)
Although the embodiment of the present invention has been described above, it is needless to say that the following modifications may be added to this embodiment.
(B-1) In the above embodiment, the four mounting terminals to which the flexible substrate is bonded are arranged in a 2 × 2 matrix on the terminal portion 12 of the electro-optical substrate 1. As shown, the mounting terminals may be arranged in a matrix of 3 × 3 or the like, and M × N (M is the number of mounting terminals arranged in the direction in which the data lines extend, and N is the same in the direction in which the scanning lines extend). The mounting terminals may be arranged in a matrix of arrangement number: N is an arbitrary natural number and M is an arbitrary natural number of 2 or more. Moreover, in the aspect which arrange | positions a mounting terminal in matrix shape, such as 3x3 as shown in FIG. 10, the resin member which protects the connection part of a mounting terminal and a flexible board | substrate applies application | coating locus | trajectory R41-shown in FIG. The resin is applied so as to draw R43, and each may be formed separately or by applying the resin with a single stroke so as to draw the application trajectories R51 to R59 shown in this order.

(B-2) In the above-described embodiment, the application example of the present invention to the mounting of the flexible substrate on which the data line control circuit is mounted has been described. However, the present embodiment is not limited to the mounting on the flexible substrate on which the scanning line control circuit is mounted. Of course, the invention may be applied.

(B-3) In the above-described embodiment, the case where a three-terminal element typified by TFT is used as the switching element of the pixel circuit has been described. However, a two-terminal element such as a diode may be used. . However, when a two-terminal element is used as the switching element of the pixel circuit, the scanning line is formed on one substrate, the data line is formed on the other substrate, and the two-terminal element is connected to the scanning line 2 or the data line 3. It is necessary to form between any one of these and a pixel electrode. In this case, the pixel circuit includes a two-terminal element connected in series between the scanning line and the data line, and a liquid crystal.

(B-4) In the above-described embodiment, an active matrix type liquid crystal display device has been described as an example of an electro-optical device including the electro-optical substrate 1. However, the present invention is not limited thereto, and STN (Super Twisted Nematic). ) It can also be applied to a passive type using a liquid crystal or the like. Further, the above-described embodiment may be applied to an electro-optical device having an organic light-emitting diode element using an organic EL (Electro Luminescent) as a light-emitting row element as an electro-optical material. The present invention is also applied to an electro-optical panel using an electro-optical material other than the organic EL. An electro-optical material is a material whose optical characteristics such as transmittance and luminance change when an electric signal (current signal or voltage signal) is supplied. For example, a display panel using a liquid crystal or a light emitting polymer as an electro-optical material, an electrophoretic display panel using a microcapsule containing a colored liquid and white particles dispersed in the liquid as an electro-optical material, polarity Twisted ball display panels using twist balls that are painted in different colors for different areas as electro-optical materials, toner display panels using black toner as electro-optical materials, or high-pressure gas such as helium or neon The present invention can be applied to various electro-optical panels such as a plasma display panel used as an optical material as in the above-described embodiments.

(C. Application examples)
Next, an electronic apparatus to which the electro-optical device 1000 including the electro-optical substrate 1 according to the above-described embodiments and modifications is applied will be described. FIG. 13 shows a configuration of a mobile personal computer to which the electro-optical device 1000 is applied. The personal computer 2000 includes an electro-optical device 1000 as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002.

  FIG. 14 shows a configuration of a mobile phone to which the electro-optical device 1000 is applied. A cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and an electro-optical device 1000 as a display unit. By operating the scroll button 3002, the screen displayed on the electro-optical device 1000 is scrolled.

  FIG. 15 shows a configuration of a portable information terminal (PDA: Personal Digital Assistants) to which the electro-optical device 1000 is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the electro-optical device 1000 as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the electro-optical device 1000.

  FIG. 16 is a schematic diagram of a projection display device (three-plate projector) 4000 to which the electro-optical device 1000 is applied. The projection display device 5000 includes three electro-optical devices 1000 (1000R, 1000G, and 1000B) corresponding to different display colors (red, green, and blue). The illumination optical system 4001 supplies the red component r of the light emitted from the illumination device (light source) 4002 to the electro-optical device 1000R, the green component g to the electro-optical device 1000G, and the blue component b to the electro-optical device 1000B. To supply. Each electro-optical device 1000 functions as a light modulator (light valve) that modulates each monochromatic light supplied from the illumination optical system 4001 in accordance with a display image. The projection optical system 4003 synthesizes the emitted light from each electro-optical device 100 and projects it on the projection surface 4004.

  Electronic devices to which the electro-optical device 1000 is applied include those shown in FIGS. 13 to 16, digital still cameras, liquid crystal televisions, viewfinder type, monitor direct-view type video tape recorders, car navigation devices, pagers, and electronic devices. Examples include notebooks, calculators, word processors, workstations, videophones, POS terminals, and devices equipped with touch panels. The electro-optical device described above can be applied as a display unit of these various electronic devices.

  DESCRIPTION OF SYMBOLS 1 ... Electro-optical board | substrate, 10 ... Element board | substrate, 20 ... Opposite board | substrate, 12 ... Terminal part, 12-k (k = 1-4) ... Mounting terminal, 30-k (k = 1-4) ... Flexible board | substrate , 40-k (k = 1 to 4) ... anisotropic conductive film, 50-j (j = 1 to 3) ... resin member, 1000 ... electro-optical device, 2000 ... personal computer, 3000 ... mobile phone, 4000 ... information Mobile terminal, 4000 ... Information mobile terminal.

Claims (6)

A terminal portion provided on at least one side of the electro-optic substrate;
First and second mounting terminals arranged in the terminal portion and arranged side by side in the direction intersecting the one side;
A first flexible substrate connected to the first mounting terminal;
A second flexible substrate connected to the second mounting terminal, wherein the second flexible substrate is disposed so as to overlap the first flexible substrate;
A first resin member covering a first side surface of the first mounting terminal;
A second resin member that covers the second side surface facing the first side surface of the first mounting terminal and covers the third side surface of the second mounting terminal facing the second side surface;
A third resin member covering a fourth side surface of the second mounting terminal facing the third side surface;
Have
The first resin member covers a portion connected to the first side surface of each of the first flexible substrate and the electro-optic substrate;
The second resin member includes a portion connected to the second side surface of each of the first flexible substrate and the electro-optical substrate, and the third side surface of each of the second flexible substrate and the electro-optical substrate. Covering the part connected to
The third resin member covers a portion connected to the fourth side surface of each of the second flexible substrate and the electro-optic substrate. A third mounting terminal arranged in the terminal portion side by side with the first mounting terminal in the direction of the one side;
A fourth mounting terminal arranged in the terminal portion side by side with the second mounting terminal in the direction of the one side;
A third flexible substrate connected to the third mounting terminal;
A fourth flexible substrate connected to the fourth mounting terminal, the fourth flexible substrate being disposed to overlap the third flexible substrate,
The first resin member covers a first side surface of the third mounting terminal, covers a portion connected to the first side surface of each of the third flexible substrate and the electro-optic substrate,
The second resin member covers a second side surface facing the first side surface of the third mounting terminal and a third side surface of the fourth mounting terminal facing the second side surface, and the third flexibility Covering a portion connected to the second side surface of each of the substrate and the electro-optical substrate and a portion connected to the third side surface of the fourth flexible substrate and the electro-optical substrate;
The third resin member covers a fourth side surface of the fourth mounting terminal facing the third side surface of the fourth mounting terminal, and the fourth flexible substrate and the fourth of the electro-optical substrate. The electro-optic substrate according to claim 1, wherein a portion connected to the side surface is covered.   3. The electro-optic substrate according to claim 1, wherein the second resin member is formed of a resin having a lower viscosity than the first resin member and the third resin member.   The electro-optic substrate according to claim 1, wherein the first, second, and third resin members are formed by continuously applying a resin.   An electro-optical device including the electro-optical substrate according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 5.

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