JP2015533668A5 - - Google Patents
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- Publication number
- JP2015533668A5 JP2015533668A5 JP2015541855A JP2015541855A JP2015533668A5 JP 2015533668 A5 JP2015533668 A5 JP 2015533668A5 JP 2015541855 A JP2015541855 A JP 2015541855A JP 2015541855 A JP2015541855 A JP 2015541855A JP 2015533668 A5 JP2015533668 A5 JP 2015533668A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- polishing pad
- polishing
- thermoplastic
- polyurethane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- -1 polycyclic aromatic Polymers 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261723226P | 2012-11-06 | 2012-11-06 | |
| US61/723,226 | 2012-11-06 | ||
| PCT/US2013/068523 WO2014074521A1 (en) | 2012-11-06 | 2013-11-05 | Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015533668A JP2015533668A (ja) | 2015-11-26 |
| JP2015533668A5 true JP2015533668A5 (OSRAM) | 2016-12-28 |
| JP6336997B2 JP6336997B2 (ja) | 2018-06-06 |
Family
ID=50685113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015541855A Active JP6336997B2 (ja) | 2012-11-06 | 2013-11-05 | オフセットした同心の溝のパターンを有する研磨パッドおよびそれを用いて基材を研磨するための方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9687956B2 (OSRAM) |
| JP (1) | JP6336997B2 (OSRAM) |
| KR (1) | KR102148050B1 (OSRAM) |
| CN (1) | CN104781913B (OSRAM) |
| SG (1) | SG11201503496YA (OSRAM) |
| TW (1) | TWI633970B (OSRAM) |
| WO (1) | WO2014074521A1 (OSRAM) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI449597B (zh) | 2008-07-09 | 2014-08-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
| KR101455919B1 (ko) * | 2013-01-18 | 2014-11-03 | 주식회사 엘지실트론 | 웨이퍼 양면 연마 장치의 정반 구조 |
| US20170232573A1 (en) * | 2016-02-12 | 2017-08-17 | Kabushiki Kaisha Toshiba | Polishing member and semiconductor manufacturing method |
| US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
| US10857648B2 (en) * | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Trapezoidal CMP groove pattern |
| US10777418B2 (en) * | 2017-06-14 | 2020-09-15 | Rohm And Haas Electronic Materials Cmp Holdings, I | Biased pulse CMP groove pattern |
| US10861702B2 (en) * | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Controlled residence CMP polishing method |
| US10857647B2 (en) * | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | High-rate CMP polishing method |
| WO2019038675A1 (en) * | 2017-08-25 | 2019-02-28 | 3M Innovative Properties Company | SURFACE SURFACE SURFACE POLISHING PAD |
| TWI642516B (zh) * | 2017-10-02 | 2018-12-01 | 智勝科技股份有限公司 | 研磨墊以及研磨方法 |
| CN108381331B (zh) * | 2018-03-22 | 2020-02-18 | 大连理工大学 | 一种平面零件全局修形加工装置和方法 |
| US11298794B2 (en) * | 2019-03-08 | 2022-04-12 | Applied Materials, Inc. | Chemical mechanical polishing using time share control |
| CN112548845B (zh) * | 2021-02-19 | 2021-09-14 | 清华大学 | 一种基板加工方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5842910A (en) * | 1997-03-10 | 1998-12-01 | International Business Machines Corporation | Off-center grooved polish pad for CMP |
| KR20010002471A (ko) * | 1999-06-15 | 2001-01-15 | 고석태 | 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴 |
| KR100314866B1 (ko) | 1999-10-05 | 2001-11-17 | 김진우 | 다양한 표면 그루브패턴을 갖는 연마패드 |
| US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
| US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7377840B2 (en) * | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
| US7252582B2 (en) * | 2004-08-25 | 2007-08-07 | Jh Rhodes Company, Inc. | Optimized grooving structure for a CMP polishing pad |
| JP2007007771A (ja) * | 2005-06-30 | 2007-01-18 | Mitsubishi Materials Techno Corp | 研磨パット及び研磨機 |
| US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| CN101244535B (zh) * | 2006-02-15 | 2012-06-13 | 应用材料公司 | 抛光仓 |
| US7234224B1 (en) * | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
| US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| TWI449597B (zh) * | 2008-07-09 | 2014-08-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
-
2013
- 2013-11-05 SG SG11201503496YA patent/SG11201503496YA/en unknown
- 2013-11-05 KR KR1020157014705A patent/KR102148050B1/ko active Active
- 2013-11-05 JP JP2015541855A patent/JP6336997B2/ja active Active
- 2013-11-05 CN CN201380058083.3A patent/CN104781913B/zh active Active
- 2013-11-05 WO PCT/US2013/068523 patent/WO2014074521A1/en not_active Ceased
- 2013-11-05 US US14/440,209 patent/US9687956B2/en active Active
- 2013-11-06 TW TW102140320A patent/TWI633970B/zh active
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