JP2015511667A5 - - Google Patents

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Publication number
JP2015511667A5
JP2015511667A5 JP2014561293A JP2014561293A JP2015511667A5 JP 2015511667 A5 JP2015511667 A5 JP 2015511667A5 JP 2014561293 A JP2014561293 A JP 2014561293A JP 2014561293 A JP2014561293 A JP 2014561293A JP 2015511667 A5 JP2015511667 A5 JP 2015511667A5
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JP
Japan
Prior art keywords
sputter device
rotatable
sputter
deposition apparatus
support
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Application number
JP2014561293A
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English (en)
Japanese (ja)
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JP6073383B2 (ja
JP2015511667A (ja
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Priority claimed from PCT/EP2012/054261 external-priority patent/WO2013135265A1/en
Publication of JP2015511667A publication Critical patent/JP2015511667A/ja
Publication of JP2015511667A5 publication Critical patent/JP2015511667A5/ja
Application granted granted Critical
Publication of JP6073383B2 publication Critical patent/JP6073383B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014561293A 2012-03-12 2012-03-12 スパッタ堆積用の小型の回転可能なスパッタデバイス Expired - Fee Related JP6073383B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/054261 WO2013135265A1 (en) 2012-03-12 2012-03-12 Mini rotatable sputter devices for sputter deposition

Publications (3)

Publication Number Publication Date
JP2015511667A JP2015511667A (ja) 2015-04-20
JP2015511667A5 true JP2015511667A5 (https=) 2015-05-28
JP6073383B2 JP6073383B2 (ja) 2017-02-01

Family

ID=45852532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014561293A Expired - Fee Related JP6073383B2 (ja) 2012-03-12 2012-03-12 スパッタ堆積用の小型の回転可能なスパッタデバイス

Country Status (7)

Country Link
US (1) US20160189939A1 (https=)
EP (1) EP2826057B1 (https=)
JP (1) JP6073383B2 (https=)
KR (1) KR101780466B1 (https=)
CN (1) CN104160471B (https=)
TW (1) TWI567216B (https=)
WO (1) WO2013135265A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636195A (zh) * 2015-06-05 2018-01-26 应用材料公司 溅射沉积源、溅射装置及其操作方法
EP3310941B1 (de) * 2015-06-16 2020-12-30 Schneider GmbH & Co. KG Vorrichtung und verfahren zur beschichtung von linsen
KR102407392B1 (ko) * 2015-07-03 2022-06-13 삼성디스플레이 주식회사 스퍼터링 장치 및 이를 이용한 스퍼터링 방법
US12057297B2 (en) * 2015-10-22 2024-08-06 Richard DeVito Deposition system with integrated cooling on a rotating drum
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
CN107354443B (zh) * 2017-07-26 2019-10-11 中国电子科技集团公司第五十五研究所 一种调节磁控溅射镀膜均匀性的装置
CN109487225A (zh) * 2019-01-07 2019-03-19 成都中电熊猫显示科技有限公司 磁控溅射成膜装置及方法
BE1027427B1 (nl) * 2019-07-14 2021-02-08 Soleras Advanced Coatings Bv Bewegingssystemen voor sputter coaten van niet-vlakke substraten
EP4270444A1 (en) * 2022-04-27 2023-11-01 Bühler Alzenau GmbH Magnetron sputtering system with tubular sputter cathode and method for controlling a layer thickness

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610253C2 (de) * 1996-03-15 1999-01-14 Fraunhofer Ges Forschung Zerstäubungseinrichtung
JP2002529600A (ja) * 1998-11-06 2002-09-10 シヴァク 高レート・コーティング用のスパッタリング装置および方法
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
WO2006076345A2 (en) * 2005-01-13 2006-07-20 Cardinal Cg Company Reduced maintenance sputtering chambers
JP2008038192A (ja) * 2006-08-04 2008-02-21 Optorun Co Ltd スパッタ源、スパッタ成膜装置およびスパッタ成膜方法
JP2009024230A (ja) * 2007-07-20 2009-02-05 Kobe Steel Ltd スパッタリング装置
CN102356450A (zh) * 2009-03-20 2012-02-15 应用材料公司 具有高温可旋转靶的沉积设备及该设备的操作方法
JP5240782B2 (ja) * 2009-05-18 2013-07-17 株式会社神戸製鋼所 連続成膜装置
EP2306489A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
JP6118258B2 (ja) * 2010-11-17 2017-04-19 ソレラス・アドバンスト・コーティングス・ベスローテン・フェンノートシャップ・メット・ベペルクテ・アーンスプラーケレイクヘイトSoleras Advanced Coatings Bvba ソフトスパッタリングマグネトロンシステム

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