JP2015507832A5 - - Google Patents

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Publication number
JP2015507832A5
JP2015507832A5 JP2014552740A JP2014552740A JP2015507832A5 JP 2015507832 A5 JP2015507832 A5 JP 2015507832A5 JP 2014552740 A JP2014552740 A JP 2014552740A JP 2014552740 A JP2014552740 A JP 2014552740A JP 2015507832 A5 JP2015507832 A5 JP 2015507832A5
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JP
Japan
Prior art keywords
heat transfer
transfer device
emitting diode
housing
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014552740A
Other languages
English (en)
Japanese (ja)
Other versions
JP6067749B2 (ja
JP2015507832A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2013/050516 external-priority patent/WO2013108236A1/en
Publication of JP2015507832A publication Critical patent/JP2015507832A/ja
Publication of JP2015507832A5 publication Critical patent/JP2015507832A5/ja
Application granted granted Critical
Publication of JP6067749B2 publication Critical patent/JP6067749B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014552740A 2012-01-20 2013-01-20 熱伝達装置 Expired - Fee Related JP6067749B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261588737P 2012-01-20 2012-01-20
US61/588,737 2012-01-20
US201261620479P 2012-04-05 2012-04-05
US61/620,479 2012-04-05
PCT/IB2013/050516 WO2013108236A1 (en) 2012-01-20 2013-01-20 Heat transferring arrangement

Publications (3)

Publication Number Publication Date
JP2015507832A JP2015507832A (ja) 2015-03-12
JP2015507832A5 true JP2015507832A5 (enExample) 2016-03-10
JP6067749B2 JP6067749B2 (ja) 2017-01-25

Family

ID=47891798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014552740A Expired - Fee Related JP6067749B2 (ja) 2012-01-20 2013-01-20 熱伝達装置

Country Status (6)

Country Link
US (2) US10088252B2 (enExample)
EP (1) EP2805105B1 (enExample)
JP (1) JP6067749B2 (enExample)
CN (1) CN104067047B (enExample)
RU (1) RU2617296C2 (enExample)
WO (1) WO2013108236A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9518723B2 (en) 2011-04-08 2016-12-13 Brite Shot, Inc. Lighting fixture extension
DE102014116963B4 (de) * 2014-11-19 2019-12-12 Dsh Handels- Und Verwertungsgesellschaft Mbh Kühlkörper mit einem Elektronikbauteil und Leuchte mit einem solchen Kühlkörper
JP2017044795A (ja) * 2015-08-25 2017-03-02 オリンパス株式会社 撮像装置
RU2636385C1 (ru) * 2016-08-24 2017-11-23 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Устройство охлаждения одиночного мощного светодиода с интенсифицированной конденсационной системой
DE102017113948A1 (de) * 2017-06-23 2018-12-27 Wolfgang Koerfer Kühlkörper für ein LED Leuchtmittel und Verfahren zum Herstellen des Kühlkörpers
US11493186B2 (en) * 2020-12-08 2022-11-08 Richard S. Belliveau Theatrical strobe apparatus and light sources with optimized focus thereof
US12429206B2 (en) 2021-03-23 2025-09-30 Signify Holding B.V. Thermal element for a pressing insertion manufacturing process

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US7625103B2 (en) * 2006-04-21 2009-12-01 Cree, Inc. Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods
US7824075B2 (en) * 2006-06-08 2010-11-02 Lighting Science Group Corporation Method and apparatus for cooling a lightbulb
US7637628B2 (en) * 2006-06-13 2009-12-29 Light-Pod, Inc. LED light pod with modular optics and heat dissipation structure
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US8033696B2 (en) * 2007-04-19 2011-10-11 Simon Jerome H Heat sinks and other thermal management for solid state devices and modular solid state systems
CN201059513Y (zh) 2007-04-27 2008-05-14 东莞横沥鑫旺电子厂 具有散热器的led灯照具
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