JP2015228449A5 - - Google Patents

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Publication number
JP2015228449A5
JP2015228449A5 JP2014114124A JP2014114124A JP2015228449A5 JP 2015228449 A5 JP2015228449 A5 JP 2015228449A5 JP 2014114124 A JP2014114124 A JP 2014114124A JP 2014114124 A JP2014114124 A JP 2014114124A JP 2015228449 A5 JP2015228449 A5 JP 2015228449A5
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JP
Japan
Prior art keywords
substrates
pair
substrate bonding
bonding method
substrate
Prior art date
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Pending
Application number
JP2014114124A
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English (en)
Japanese (ja)
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JP2015228449A (ja
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Publication date
Application filed filed Critical
Priority to JP2014114124A priority Critical patent/JP2015228449A/ja
Priority claimed from JP2014114124A external-priority patent/JP2015228449A/ja
Publication of JP2015228449A publication Critical patent/JP2015228449A/ja
Publication of JP2015228449A5 publication Critical patent/JP2015228449A5/ja
Pending legal-status Critical Current

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JP2014114124A 2014-06-02 2014-06-02 基板接合方法および基板接合装置 Pending JP2015228449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014114124A JP2015228449A (ja) 2014-06-02 2014-06-02 基板接合方法および基板接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014114124A JP2015228449A (ja) 2014-06-02 2014-06-02 基板接合方法および基板接合装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018225811A Division JP6631684B2 (ja) 2018-11-30 2018-11-30 基板接合方法および基板接合装置

Publications (2)

Publication Number Publication Date
JP2015228449A JP2015228449A (ja) 2015-12-17
JP2015228449A5 true JP2015228449A5 (enExample) 2017-06-22

Family

ID=54885763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014114124A Pending JP2015228449A (ja) 2014-06-02 2014-06-02 基板接合方法および基板接合装置

Country Status (1)

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JP (1) JP2015228449A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6988801B2 (ja) * 2016-06-16 2022-01-05 株式会社ニコン 積層装置および積層方法
TW201826333A (zh) * 2016-11-16 2018-07-16 日商尼康股份有限公司 保持構件、接合裝置、及接合方法
WO2021039427A1 (ja) * 2019-08-30 2021-03-04 東京エレクトロン株式会社 押圧装置、基板処理システム、及び基板処理方法
JP7512761B2 (ja) * 2020-08-19 2024-07-09 住友金属鉱山株式会社 基板接合装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0256918A (ja) * 1988-05-24 1990-02-26 Nippon Denso Co Ltd 半導体ウェハの直接接合方法
JPH0691147B2 (ja) * 1988-10-14 1994-11-14 信越半導体株式会社 接合ウエーハ検査方法
JP3239884B2 (ja) * 1989-12-12 2001-12-17 ソニー株式会社 半導体基板の製造方法
JPH05217973A (ja) * 1992-02-06 1993-08-27 Nippon Steel Corp 半導体基板貼付装置
JP3927925B2 (ja) * 2003-06-04 2007-06-13 直江津電子工業株式会社 半導体接合ウエハ
JP2008166586A (ja) * 2006-12-28 2008-07-17 Fujifilm Corp 接合方法
JP2010034445A (ja) * 2008-07-31 2010-02-12 Sumco Corp ウェーハ自動貼合せ装置およびウェーハ自動貼合せ方法
JP2011082453A (ja) * 2009-10-09 2011-04-21 Sumco Corp 貼り合わせシリコンウェーハの製造方法及び製造装置

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