JP2015226016A - Abrasive pad and determination method of abrasive pad - Google Patents

Abrasive pad and determination method of abrasive pad Download PDF

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JP2015226016A
JP2015226016A JP2014111430A JP2014111430A JP2015226016A JP 2015226016 A JP2015226016 A JP 2015226016A JP 2014111430 A JP2014111430 A JP 2014111430A JP 2014111430 A JP2014111430 A JP 2014111430A JP 2015226016 A JP2015226016 A JP 2015226016A
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polishing
state
polishing layer
tensile force
mpa
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美由紀 薄谷
Miyuki Usuya
美由紀 薄谷
謙次郎 尾形
Kenjiro Ogata
謙次郎 尾形
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Nitta DuPont Inc
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Nitta Haas Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Abstract

PROBLEM TO BE SOLVED: To provide an abrasive pad having high polishing rate, and to provide a determination method of the abrasive pad.SOLUTION: A plastic deformation region A calculated by the following mathematical formula A=(S1-S2)×(E1-E2)/2 is 665 or less, where the maximum stress S1(MPa) is the tensile stress of a polishing layer immediately before fracture when a tensile force acts, a strength point stress S2(MPa) is a tensile stress occurring in the polishing layer which has started plastic deformation, the maximum elongation E1(mm) is the elongation of the polishing layer after the tensile force begins to act until immediately before fracture, and the strength point elongation E2(mm) is the elongation of the polishing layer after the tensile force begins to act until plastic deformation starts.

Description

本発明は、半導体ウエハ等の被研磨物を研磨するための研磨パッド、及び該研磨パッドの判定方法に関する。   The present invention relates to a polishing pad for polishing an object to be polished such as a semiconductor wafer and a method for determining the polishing pad.

従来から、表面に高い平坦性が求められる被研磨物（例えば、半導体ウエハ）を研磨するための研磨パッドが提供されている。この種の研磨パッドは、例えば、型枠内に充填した発泡ポリウレタン樹脂を硬化させて発泡体を成形し、該発泡体をスライスすることによって製造されることがある（例えば、特許文献１）。   Conventionally, a polishing pad for polishing an object to be polished (for example, a semiconductor wafer) whose surface is required to have high flatness has been provided. This type of polishing pad may be manufactured, for example, by curing a foamed polyurethane resin filled in a mold, forming a foam, and slicing the foam (for example, Patent Document 1).

上述の研磨パッドの製造方法では、一つの発泡体から複数の研磨パッドを得ることができる。しかしながら、同じ発泡体から得られた複数の研磨パッドのそれぞれは、互いの研磨レートにばらつきが生じることがある。従って、同一の発泡体から得られた複数の研磨パッドには、研磨レートが低いものが含まれることがあるため、研磨レートが高い研磨パッドを正確に判定することで品質を安定させることが望まれている。   In the polishing pad manufacturing method described above, a plurality of polishing pads can be obtained from one foam. However, each of a plurality of polishing pads obtained from the same foam may vary in the polishing rate of each other. Therefore, since a plurality of polishing pads obtained from the same foam may include those having a low polishing rate, it is desired to stabilize the quality by accurately determining a polishing pad having a high polishing rate. It is rare.

特開２０１３−１９４１６３号公報JP 2013-194163 A

そこで、本発明は、かかる実情に鑑み、研磨レートが高い研磨パッド、及び該研磨パッドの判定方法を提供することを課題とする。   Accordingly, an object of the present invention is to provide a polishing pad having a high polishing rate and a method for determining the polishing pad in view of such a situation.

本発明に係る研磨パッドは、
少なくとも被研磨物を研磨する研磨面を有する研磨層を備え、
下記数式１で表される研磨層の塑性変形領域Ａが６６５以下であることを満たす。

Figure 2015226016
Ｓ１：引張力が作用している状態の研磨層の最大応力（ＭＰａ）であって、破断し始めた状態の研磨層の最大応力（ＭＰａ）
Ｓ２：引張力が作用している状態の研磨層の耐力点応力（ＭＰａ）であって、永久ひずみが生じ始めた状態の研磨層の耐力点応力（ＭＰａ）
Ｅ１：引張力が作用していない状態から、引張力が作用して破断し始める状態になるまでの研磨層の最大伸び量（ｍｍ）
Ｅ２：引張力が作用していない状態から、引張力が作用して永久ひずみが生じ始める状態になるまでの研磨層の耐力点伸び量（ｍｍ） The polishing pad according to the present invention is:
A polishing layer having at least a polishing surface for polishing an object to be polished;
It satisfies that the plastic deformation region A of the polishing layer represented by the following formula 1 is 665 or less.
Figure 2015226016
 S1: Maximum stress (MPa) of the polishing layer in a state in which a tensile force is applied, and maximum stress (MPa) of the polishing layer in a state of starting to break
S2: Yield point stress (MPa) of the polishing layer in a state where tensile force is acting, and Yield point stress (MPa) of the polishing layer in a state where permanent strain has started to occur
E1: Maximum elongation of the polishing layer (mm) from the state where no tensile force is applied to the state where the tensile force is applied to start breaking
E2: Elongation point of yield point of the polishing layer (mm) from the state where no tensile force is applied until the state where the tensile force is applied and permanent deformation starts to occur

上記数式１によって算出される塑性変形領域Ａが６６５以下である研磨パッドは、上記数式１によって算出される塑性変形領域Ａが６６５よりも大きい研磨パッドに対して研磨レートが高くなる。従って、上記数式１によって算出される塑性変形領域Ａが６６５以下であることを満たす研磨パッドは、高い研磨レートを有する。   A polishing pad having a plastic deformation area A calculated by Equation 1 of 665 or less has a higher polishing rate than a polishing pad having a plastic deformation area A calculated by Equation 1 larger than 665. Therefore, a polishing pad satisfying that the plastic deformation region A calculated by the above mathematical formula 1 is 665 or less has a high polishing rate.

本発明に係る研磨パッドの判定方法は、
少なくとも被研磨物を研磨する研磨面を有する研磨層を備える研磨パッドの判定方法であって、
下記数式１で表される研磨層の塑性変形領域Ａを算出し、該塑性変形領域Ａが６６５以下であることを確認する。

Figure 2015226016
Ｓ１：引張力が作用している状態の研磨層の最大応力（ＭＰａ）であって、破断し始めた状態の研磨層の最大応力（ＭＰａ）
Ｓ２：引張力が作用している状態の研磨層の耐力点応力（ＭＰａ）であって、永久ひずみが生じ始めた状態の研磨層の耐力点応力（ＭＰａ）
Ｅ１：引張力が作用していない状態から、引張力が作用して破断し始める状態になるまでの研磨層の最大伸び量（ｍｍ）
Ｅ２：引張力が作用していない状態から、引張力が作用して永久ひずみが生じ始める状態になるまでの研磨層の耐力点伸び量（ｍｍ） A method for determining a polishing pad according to the present invention includes:
A method for determining a polishing pad comprising at least a polishing layer having a polishing surface for polishing an object to be polished,
The plastic deformation region A of the polishing layer represented by the following formula 1 is calculated, and it is confirmed that the plastic deformation region A is 665 or less.
Figure 2015226016
 S1: Maximum stress (MPa) of the polishing layer in a state in which a tensile force is applied, and maximum stress (MPa) of the polishing layer in a state of starting to break
S2: Yield point stress (MPa) of the polishing layer in a state where tensile force is acting, and Yield point stress (MPa) of the polishing layer in a state where permanent strain has started to occur
E1: Maximum elongation of the polishing layer (mm) from the state where no tensile force is applied to the state where the tensile force is applied to start breaking
E2: Elongation point of yield point of the polishing layer (mm) from the state where no tensile force is applied until the state where the tensile force is applied and permanent deformation starts to occur

上記数式１によって算出される塑性変形領域Ａが６６５以下である研磨パッドは、上記数式１によって算出される塑性変形領域Ａが６６５よりも大きい研磨パッドに対して研磨レートが高くなる。従って、上記数式１によって算出される塑性変形領域Ａが６６５以下であることを確認することによって、高い研磨レートを有する研磨パッドを判定することができる。   A polishing pad having a plastic deformation area A calculated by Equation 1 of 665 or less has a higher polishing rate than a polishing pad having a plastic deformation area A calculated by Equation 1 larger than 665. Therefore, by confirming that the plastic deformation region A calculated by the above mathematical formula 1 is 665 or less, a polishing pad having a high polishing rate can be determined.

以上のように、本発明の研磨パッドは、高い研磨レートを有するという優れた効果を奏し得る。また、本発明の研磨パッドの判定方法によれば、高い研磨レートを有する研磨パッドを判定することができるという優れた効果を奏し得る。   As described above, the polishing pad of the present invention can have an excellent effect of having a high polishing rate. In addition, according to the method for determining a polishing pad of the present invention, it is possible to achieve an excellent effect that a polishing pad having a high polishing rate can be determined.

図１は、本発明の一実施形態に係る研磨パッドの側面図である。FIG. 1 is a side view of a polishing pad according to an embodiment of the present invention. 図２は、同実施形態に係る研磨パッドの研磨層に引張力を作用させたときの伸び量と引張応力との関係を示すグラフである。FIG. 2 is a graph showing the relationship between the amount of elongation and tensile stress when a tensile force is applied to the polishing layer of the polishing pad according to the embodiment. 図３は、本発明における実施例１〜５の研磨パッド、及び比較例１〜３の研磨パッドの作成方法の説明図である。FIG. 3 is an explanatory diagram of a method for producing the polishing pads of Examples 1 to 5 and the polishing pads of Comparative Examples 1 to 3 in the present invention. 図４は、本発明の実施例１〜５及び比較例１〜３に係る研磨パッドの塑性変形領域と研磨レートとの関係性を示すグラフである。FIG. 4 is a graph showing the relationship between the plastic deformation region and the polishing rate of the polishing pads according to Examples 1 to 5 and Comparative Examples 1 to 3 of the present invention.

以下、本発明の第一実施形態に係る研磨パッドについて、添付図面を参照しつつ説明を行う。本実施形態に係る研磨パッドは、半導体ウエハ等の被研磨物を研磨するためのものである。   Hereinafter, a polishing pad according to a first embodiment of the present invention will be described with reference to the accompanying drawings. The polishing pad according to this embodiment is for polishing an object to be polished such as a semiconductor wafer.

より具体的に説明する。図１に示すように、本実施形態に係る研磨パッド１は、少なくとも被研磨物を研磨する研磨面１００を有する研磨層１０を備える。なお、図１において図示していないが、研磨層１０には、複数の気泡が形成されている。なお、本実施形態に係る研磨パッド１は、単層であるが（研磨層１０のみを備えるものであるが）、研磨層１０とは別の層を備えるものであってもよい。   This will be described more specifically. As shown in FIG. 1, the polishing pad 1 according to the present embodiment includes a polishing layer 10 having a polishing surface 100 for polishing at least an object to be polished. Although not shown in FIG. 1, a plurality of bubbles are formed in the polishing layer 10. The polishing pad 1 according to this embodiment is a single layer (including only the polishing layer 10), but may include a layer different from the polishing layer 10.

また、研磨パッド１は、下記数式１で表される研磨層１０の塑性変形領域Ａが６６５以下であることを満たす（図２参照）。

Figure 2015226016
Ｓ１：引張力が作用している状態の研磨層１０の応力（以下、最大応力とする）（ＭＰａ）であって、破断し始めた状態の研磨層１０の最大応力（ＭＰａ）
Ｓ２：引張力が作用している状態の研磨層１０の応力（以下、耐力点応力とする）（ＭＰａ）であって、永久ひずみが生じ始めた状態の研磨層１０の耐力点応力（ＭＰａ）
Ｅ１：引張力が作用していない状態から、引張力が作用して破断し始める状態になるまでの研磨層１０の伸び量（以下、最大伸び量とする）（ｍｍ）
Ｅ２：引張力が作用していない状態から、引張力が作用して永久ひずみが生じ始める状態になるまでの研磨層１０の伸び量（以下、耐力点伸び量とする）（ｍｍ） Further, the polishing pad 1 satisfies that the plastic deformation region A of the polishing layer 10 represented by the following formula 1 is 665 or less (see FIG. 2).
Figure 2015226016
 S1: Stress (MPa) of the polishing layer 10 in a state where tensile force is acting (hereinafter referred to as maximum stress) (MPa), and maximum stress (MPa) of the polishing layer 10 in a state of starting to break
S2: Stress of the polishing layer 10 in a state where a tensile force is applied (hereinafter referred to as proof stress) (MPa), and the proof stress (MPa) of the polishing layer 10 in a state where permanent strain has started to occur.
E1: Elongation amount (hereinafter referred to as maximum elongation amount) of the polishing layer 10 from the state where the tensile force is not applied to the state where the tensile force acts and starts to break (mm)
E2: Elongation amount of the polishing layer 10 from the state where the tensile force is not applied to the state where the tensile force is applied and the permanent strain begins to occur (hereinafter referred to as the yield strength elongation) (mm)

本実施形態では、研磨層１０に全長（引張力が作用していない状態の研磨層１０の全長）の０．２％の永久ひずみが生じた状態を、研磨層１０に永久ひずみが生じ始めた状態とする。すなわち、研磨層１０に永久ひずみが生じ始めた状態とは、弾性変形していた研磨層１０が塑性変形し始めた状態である。   In the present embodiment, permanent strain of the polishing layer 10 has started to occur in a state where a permanent strain of 0.2% of the entire length (the total length of the polishing layer 10 in a state where no tensile force is applied) has occurred in the polishing layer 10. State. That is, the state in which the permanent strain has started to occur in the polishing layer 10 is a state in which the polishing layer 10 that has been elastically deformed has started to be plastically deformed.

なお、本実施形態では、上述のように、研磨層１０に全長の０．２％の永久ひずみが生じた状態を研磨層１０に永久ひずみが生じ始めた状態とするが、例えば、研磨層１０に全長の０．１％の永久ひずみが生じた状態を研磨層１０に永久ひずみが生じ始めた状態としてもよい。   In the present embodiment, as described above, the state in which the permanent strain of 0.2% of the entire length is generated in the polishing layer 10 is the state in which the permanent strain starts to be generated in the polishing layer 10. Alternatively, a state in which permanent strain of 0.1% of the total length has occurred may be a state in which permanent strain has started to occur in the polishing layer 10.

研磨パッド１は、塑性変形領域Ａが６６５以下である場合、研磨層１０が塑性変形し難くなるため、高い研磨レートを有する。これに対し、研磨パッド１は、塑性変形領域Ａが６６５より大きい場合、研磨層１０が塑性変形しやすくなるため、研磨レートが低くなる。   When the plastic deformation region A is 665 or less, the polishing pad 1 has a high polishing rate because the polishing layer 10 is hardly plastically deformed. On the other hand, when the plastic deformation region A is larger than 665, the polishing pad 1 has a low polishing rate because the polishing layer 10 is easily plastically deformed.

本実施形態に係る研磨パッド１は、以上の通りである。続いて、研磨パッド１の判定方法について説明する。   The polishing pad 1 according to the present embodiment is as described above. Next, a method for determining the polishing pad 1 will be described.

本実施形態に係る研磨パッド１の判定方法では、まず、上記数式１で塑性変形領域Ａを算出する。   In the determination method of the polishing pad 1 according to the present embodiment, first, the plastic deformation region A is calculated by the above mathematical formula 1.

上述のように、塑性変形領域Ａが６６５以下である研磨パッド１は、高い研磨レートを有する。そのため、上記数式１によって算出した塑性変形領域Ａが上記数式１を満たすことを確認することによって、研磨パッド１が高い研磨レートを有するものであることを判定することができる。   As described above, the polishing pad 1 having the plastic deformation region A of 665 or less has a high polishing rate. Therefore, it is possible to determine that the polishing pad 1 has a high polishing rate by confirming that the plastic deformation region A calculated by the above formula 1 satisfies the above formula 1.

以上のように、本実施形態に係る研磨パッド１は、高い研磨レートを有するという優れた効果を奏し得る。また、本実施形態に係る研磨パッド１の判定方法によれば、高い研磨レートを有する研磨パッド１を判定することができるという優れた効果を奏し得る。   As described above, the polishing pad 1 according to this embodiment can exhibit an excellent effect of having a high polishing rate. Moreover, according to the determination method of the polishing pad 1 which concerns on this embodiment, there can exist the outstanding effect that the polishing pad 1 which has a high polishing rate can be determined.

以下、上記第一実施形態に係る研磨パッドとして、塑性変形領域Ａが６６５以下となる研磨パッド（実施例１〜５）と、比較用の研磨パッドとして、塑性変形領域Ａが６６５よりも大きくなる研磨パッド（比較例１〜３）とによって、塑性変形領域Ａと研磨レートとの関係性を検討した結果について説明する。なお、本発明は、下記の各実施例によって限定されるものではない。   Hereinafter, as the polishing pad according to the first embodiment, the polishing pad (Examples 1 to 5) in which the plastic deformation region A is 665 or less, and the plastic deformation region A is larger than 665 as a polishing pad for comparison. The result of examining the relationship between the plastic deformation region A and the polishing rate with the polishing pad (Comparative Examples 1 to 3) will be described. The present invention is not limited to the following examples.

実施例１〜５に係る研磨パッドは、図３に示すように、フィラー（発泡剤）を添加した熱硬化型ウレタンを有底筒状の型枠２内に充填し、該熱硬化型ウレタンを硬化させた円柱状の発泡体３をスライスすることで作成している。また、実施例１〜５に係る研磨パッドの厚みは、約１．２７ｍｍに設定される。   As shown in FIG. 3, the polishing pads according to Examples 1 to 5 are filled with a thermosetting urethane to which a filler (foaming agent) is added in a bottomed tubular mold 2, and the thermosetting urethane is filled with the polishing pad. It is created by slicing the cured cylindrical foam 3. Moreover, the thickness of the polishing pad which concerns on Examples 1-5 is set to about 1.27 mm.

実施例１〜５に係る研磨パッドを発泡体３から切り出した位置、実施例１〜５に係る研磨パッドの密度（ｇ／ｃｍ３）及びポア径（μｍ）を下記表１に示す。 Table 1 below shows the positions at which the polishing pads according to Examples 1 to 5 were cut out from the foam 3, the density (g / cm 3 ) and the pore diameter (μm) of the polishing pads according to Examples 1 to 5.

比較例１〜３に係る研磨パッドも、実施例１〜５に係る研磨パッドと同様に、有底筒状の型枠２内に充填した熱硬化型ウレタンを硬化させて円柱状の発泡体３を成形し、該発泡体３をスライスすることで作成している。また、比較例１〜３に係る研磨パッドの厚みは、約１．２７ｍｍに設定される。   Similarly to the polishing pads according to Examples 1 to 5, the polishing pads according to Comparative Examples 1 to 3 are also cured by curing the thermosetting urethane filled in the bottomed tubular mold 2 and the cylindrical foam 3. Is formed by slicing the foam 3. Moreover, the thickness of the polishing pad which concerns on Comparative Examples 1-3 is set to about 1.27 mm.

比較例１〜５に係る研磨パッドを発泡体３から切り出した位置、比較例１〜３に係る研磨パッドの密度（ｇ／ｃｍ３）及びポア径（μｍ）を下記表１に示す。 Table 1 below shows the positions at which the polishing pads according to Comparative Examples 1 to 5 were cut out from the foam 3, the density (g / cm 3 ) and the pore diameter (μm) of the polishing pads according to Comparative Examples 1 to 3 .

なお、本実施例では、発泡体３のうちの型枠２の底部側に位置していた部分を下方部３０とし、発泡体３のうちの該下方部３０とは反対側の部分を上方部３１とし、発泡体３のうちの下方部３０と上方部３１との間の部分を中央部３２として説明を行うことがある。

Figure 2015226016
In the present embodiment, the portion of the foam 3 located on the bottom side of the mold 2 is defined as the lower portion 30, and the portion of the foam 3 opposite to the lower portion 30 is defined as the upper portion. The portion between the lower portion 30 and the upper portion 31 of the foam 3 may be described as the central portion 32.
Figure 2015226016

（塑性変形領域Ａの算出）
まず、実施例１の研磨パッドの塑性変形領域Ａを算出する方法について説明する。 (Calculation of plastic deformation area A)
First, a method for calculating the plastic deformation region A of the polishing pad of Example 1 will be described.

実施例１の研磨パッドを得た発泡体３と同一の発泡体３から別の研磨パッドを切り出し、該研磨パッドから試験片を成形する。また、試験片を成形する研磨パッドを発泡体から切り出した位置と、実施例１の研磨パッドを発泡体から切り出した位置とは、互いに近接している。   Another polishing pad is cut out from the same foam 3 as the foam 3 from which the polishing pad of Example 1 was obtained, and a test piece is molded from the polishing pad. Further, the position where the polishing pad for molding the test piece is cut out from the foam and the position where the polishing pad of Example 1 is cut out from the foam are close to each other.

そして、実施例１の研磨パッドを、ＪＩＳ Ｋ６２５１の１号形に準じた型（株式会社ダンベル製のＳＤＫ−１７３０−０２）で打ち抜き、ダンベル状の試験片を得る。   Then, the polishing pad of Example 1 is punched out with a die according to JIS K6251 No. 1 (SDK-1730-02 manufactured by Dumbbell Co., Ltd.) to obtain a dumbbell-shaped test piece.

そして、かかる試験片を試験機（島津製作所製オートグラフＡＧ−１ｋＮ）の一対の掴み具で掴み、試験片を掴んだ部分を互いに相反する方向に引っ張る。このとき、試験機の一対の掴み具同士の間隔の初期値を７０（ｍｍ）とし、一対の掴み具を互いに離間させる速度を５００（ｍｍ／ｍｉｎ）とする（ＪＩＳ Ｋ６２５１，ＪＩＳ Ｋ７１６１参照）。   Then, such a test piece is gripped by a pair of gripping tools of a testing machine (manufactured by Shimadzu Autograph AG-1kN), and the portions gripping the test piece are pulled in directions opposite to each other. At this time, the initial value of the distance between the pair of gripping tools of the testing machine is set to 70 (mm), and the speed at which the pair of gripping tools are separated from each other is set to 500 (mm / min) (see JIS K6251, JIS K7161).

そして、試験片が破断するまでの引張応力と、伸び量とを測定し、測定した最大応力Ｓ１、耐力点応力Ｓ２、最大伸び量Ｅ１、耐力点伸び量Ｅ２のそれぞれと上記数式１から塑性変形領域Ａを算出する。   Then, the tensile stress and the elongation amount until the test piece breaks are measured, and the measured maximum stress S1, the proof stress point S2, the maximum elongation amount E1, the proof stress point elongation amount E2 and the plastic deformation from the above formula 1. Region A is calculated.

実施例２〜５の研磨パッドの塑性変形領域Ａ、及び比較例１〜３の研磨パッドの塑性変形領域Ａも、実施例１の研磨パッドと同様の方法で算出する。このようにして算出した実施例１〜５の研磨パッド及び比較例１〜３の研磨パッドの最大応力Ｓ１、耐力点応力Ｓ２、最大伸び量Ｅ１、耐力点伸び量Ｅ２、塑性変形領域Ａを表２に示す。   The plastic deformation region A of the polishing pads of Examples 2 to 5 and the plastic deformation region A of the polishing pads of Comparative Examples 1 to 3 are also calculated by the same method as the polishing pad of Example 1. The maximum stress S1, the proof stress S2, the maximum elongation E1, the proof stress elongation E2, and the plastic deformation region A of the polishing pads of Examples 1 to 5 and Comparative Examples 1 to 3 calculated in this way are shown. It is shown in 2.

なお、実施例１〜５の研磨パッドのうち、実施例１〜３の研磨パッドは、同一の発泡体３から切り出したものである。また、比較例１〜３の研磨パッドのうち、比較例１，２の研磨パッドは、同一の発泡体３から切り出したものである。 Of the polishing pads of Examples 1 to 5, the polishing pads of Examples 1 to 3 are cut out from the same foam 3. Of the polishing pads of Comparative Examples 1 to 3, the polishing pads of Comparative Examples 1 and 2 are cut out from the same foam 3.

Figure 2015226016
Figure 2015226016

（研磨試験）
研磨試験では、研磨機として荏原製作所製のＦＲＥＸ３００を使用し、実施例１〜５の研磨パッド、及び比較例１〜３の研磨パッドで被研磨物（ＴＥＯＳ膜）を研磨したときの研磨レートを測定する。 (Polishing test)
In the polishing test, FREX300 manufactured by Ebara Manufacturing Co., Ltd. was used as a polishing machine, and the polishing rate when the object to be polished (TEOS film) was polished with the polishing pads of Examples 1 to 5 and the polishing pads of Comparative Examples 1 to 3 was used. taking measurement.

まず、実施例１の研磨パッドの研磨試験について説明する。被研磨物を研磨する前に、ドレッサー（Ｋｉｎｉｋ社製、ＥＰ１ＡＧ−１５０７３０−ＮＣ）で実施例１の研磨パッドの研磨面をドレッシングする（所謂、ＥＸ−ｓｉｔｕドレッシング）。   First, the polishing test of the polishing pad of Example 1 will be described. Before polishing an object to be polished, the polishing surface of the polishing pad of Example 1 is dressed with a dresser (Kinik, EP1AG-150730-NC) (so-called EX-situ dressing).

そして、研磨圧力を４（ｐｓｉ）、回転数を８０（ｒｐｍ）として、０．５（ｈ）間実施例１の研磨パッドのブレークインを行った後に、被研磨物を研磨する。このとき、スラリー(ニッタ・ハース社製のＩＬＤ３２２５を１：１希釈としたもの)を２００ｍｌ／ｍｉｎの流量で研磨面上に供給する。   Then, with the polishing pressure set to 4 (psi) and the rotation speed set to 80 (rpm), the polishing pad of Example 1 was broken in for 0.5 (h), and then the object to be polished was polished. At this time, slurry (those obtained by diluting ILD3225 manufactured by Nitta Haas) at a 1: 1 dilution is supplied onto the polishing surface at a flow rate of 200 ml / min.

このようにして、実施例１の研磨パッドで被研磨物を研磨し、該実施例１の研磨パッドの研磨レートを測定する。   In this way, the object to be polished is polished with the polishing pad of Example 1, and the polishing rate of the polishing pad of Example 1 is measured.

実施例２〜５の研磨パッドの研磨レート及び比較例１〜３の研磨パッドの研磨レートも、実施例１の研磨パッドと同様の方法で測定する。このようにして測定した実施例１〜５の研磨パッドの研磨レート及び比較例１〜３の研磨パッドの研磨レートを表３に示す。   The polishing rate of the polishing pads of Examples 2 to 5 and the polishing rate of the polishing pads of Comparative Examples 1 to 3 are also measured in the same manner as the polishing pad of Example 1. Table 3 shows the polishing rates of the polishing pads of Examples 1 to 5 and the polishing rates of the polishing pads of Comparative Examples 1 to 3 measured in this manner.

Figure 2015226016
Figure 2015226016

図４に示すように、塑性変形領域Ａが６６５以下の研磨パッド（実施例１〜５の研磨パッド）は、塑性変形領域Ａが６６５よりも大きい研磨パッド（比較例１〜３の研磨パッド）よりも研磨レートが高いことがわかる。   As shown in FIG. 4, the polishing pad having the plastic deformation region A of 665 or less (the polishing pad of Examples 1 to 5) is the polishing pad having the plastic deformation region A larger than 665 (the polishing pad of Comparative Examples 1 to 3). It can be seen that the polishing rate is higher than that.

また、塑性変形領域Ａが６６５以下の研磨パッド（実施例１〜５の研磨パッド）のうち、塑性変形領域Ａが最も小さい研磨パッド（実施例５の研磨パッド）が最も高い研磨レートを有することがわかる。すなわち、研磨パッドは、塑性変形領域Ａが小さいほど、高い研磨レートを有することがわかる。   Of the polishing pads having a plastic deformation region A of 665 or less (the polishing pads of Examples 1 to 5), the polishing pad having the smallest plastic deformation region A (the polishing pad of Example 5) has the highest polishing rate. I understand. That is, it can be seen that the polishing pad has a higher polishing rate as the plastic deformation region A is smaller.

１…研磨パッド、２…型枠、３…発泡体、１０…研磨層、３０…発泡体の下方部、３１…発泡体の上方部、３２…発泡体の中央部、１００…研磨面 DESCRIPTION OF SYMBOLS 1 ... Polishing pad, 2 ... Formwork, 3 ... Foam, 10 ... Polishing layer, 30 ... Lower part of foam, 31 ... Upper part of foam, 32 ... Center part of foam, 100 ... Polishing surface

Claims (2)

少なくとも被研磨物を研磨する研磨面を有する研磨層を備え、
下記数式１で表される研磨層の塑性変形領域Ａが６６５以下であることを満たす研磨パッド。
Figure 2015226016
 Ｓ１：引張力が作用している状態の研磨層の最大応力（ＭＰａ）であって、破断し始めた状態の研磨層の最大応力（ＭＰａ）
Ｓ２：引張力が作用している状態の研磨層の耐力点応力（ＭＰａ）であって、永久ひずみが生じ始めた状態の研磨層の耐力点応力（ＭＰａ）
Ｅ１：引張力が作用していない状態から、引張力が作用して破断し始める状態になるまでの研磨層の最大伸び量（ｍｍ）
Ｅ２：引張力が作用していない状態から、引張力が作用して永久ひずみが生じ始める状態になるまでの研磨層の耐力点伸び量（ｍｍ） A polishing layer having at least a polishing surface for polishing an object to be polished;
A polishing pad satisfying that the plastic deformation region A of the polishing layer represented by the following formula 1 is 665 or less.
Figure 2015226016
 S1: Maximum stress (MPa) of the polishing layer in a state in which a tensile force is applied, and maximum stress (MPa) of the polishing layer in a state of starting to break
S2: Yield point stress (MPa) of the polishing layer in a state where tensile force is acting, and Yield point stress (MPa) of the polishing layer in a state where permanent strain has started to occur
E1: Maximum elongation of the polishing layer (mm) from the state where no tensile force is applied to the state where the tensile force is applied to start breaking
E2: Elongation point of yield point of the polishing layer (mm) from the state where no tensile force is applied until the state where the tensile force is applied and permanent deformation starts to occur 少なくとも被研磨物を研磨する研磨面を有する研磨層を備える研磨パッドの判定方法であって、
下記数式１で表される研磨層の塑性変形領域Ａを算出し、該塑性変形領域Ａが６６５以下であることを確認する研磨パッドの判定方法。
Figure 2015226016
 Ｓ１：引張力が作用している状態の研磨層の最大応力（ＭＰａ）であって、破断し始めた状態の研磨層の最大応力（ＭＰａ）
Ｓ２：引張力が作用している状態の研磨層の耐力点応力（ＭＰａ）であって、永久ひずみが生じ始めた状態の研磨層の耐力点応力（ＭＰａ）
Ｅ１：引張力が作用していない状態から、引張力が作用して破断し始める状態になるまでの研磨層の最大伸び量（ｍｍ）
Ｅ２：引張力が作用していない状態から、引張力が作用して永久ひずみが生じ始める状態になるまでの研磨層の耐力点伸び量（ｍｍ） A method for determining a polishing pad comprising at least a polishing layer having a polishing surface for polishing an object to be polished,
A polishing pad determination method for calculating a plastic deformation region A of a polishing layer represented by the following formula 1 and confirming that the plastic deformation region A is 665 or less.
Figure 2015226016
 S1: Maximum stress (MPa) of the polishing layer in a state in which a tensile force is applied, and maximum stress (MPa) of the polishing layer in a state of starting to break
S2: Yield point stress (MPa) of the polishing layer in a state where tensile force is acting, and Yield point stress (MPa) of the polishing layer in a state where permanent strain has started to occur
E1: Maximum elongation of the polishing layer (mm) from the state where no tensile force is applied to the state where the tensile force is applied to start breaking
E2: Elongation point of yield point of the polishing layer (mm) from the state where no tensile force is applied until the state where the tensile force is applied and permanent deformation starts to occur
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