JP2015220342A - Optical semiconductor device manufacturing method and optical semiconductor device manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit spread of underfill to a surface of an optical semiconductor chip and successfully fill underfill between a wiring board and an optical semiconductor chip.SOLUTION: An optical semiconductor device manufacturing method comprises: a first process S1 of preparing a work W where an optical semiconductor chip 3 is connected to a wiring board 2; a second process S2 of making a state of a tip 23a of a discharge nozzle 23 be arranged on a first edge E1 side of the optical semiconductor chip 3; a third process S3 of making a state of the tip 23a of the discharge nozzle 23 be arranged closer to the wiring board 2 side than a surface 3a of the optical semiconductor chip 3; a fourth process S4 of making a state of a discharge direction A2 incline against a connection surface 2a of the wiring board 2; and a fifth process S5 of intermittently discharge underfill 6 from the discharge nozzle 23 to fill a gap between the optical semiconductor chip 3 and the wiring board 2 with the underfill 6.

Description

  The present invention relates to an optical semiconductor device manufacturing method and an optical semiconductor device manufacturing apparatus.

  A semiconductor device is known in which a wiring board and a semiconductor chip such as an LSI are electrically connected by a plurality of bumps and a gap between the wiring board and the semiconductor chip is filled with an underfill to ensure mechanical mounting strength. Yes. As a technology in such a field, there is an electronic device manufacturing apparatus described in Patent Document 1. This manufacturing apparatus manufactures an electronic device having an upper chip and a lower chip that are electrically and mechanically bonded via metal bumps. The manufacturing apparatus includes a dispenser that discharges underfill between the upper chip and the lower chip, a detection unit that detects a fillet formed around the upper chip, and a control unit that performs additional discharge of the underfill. doing. The control means performs additional discharge of underfill when the fillet width detected by the detection unit does not satisfy a preset reference fillet width.

JP 2007-194403 A

  In a semiconductor device in which a wiring board and a semiconductor chip are connected by a plurality of bumps, it is desired to reliably fill an underfill without generating bubbles between the wiring board and the semiconductor chip. Further, when the semiconductor chip is an optical semiconductor chip such as a light receiving element or a light emitting element, when the fillet is positively formed, a part of the underfill forming the fillet may wrap around the upper surface of the optical semiconductor chip. . This underfill wraparound may reduce the performance of the optical semiconductor chip.

  Accordingly, the present invention provides a method for manufacturing an optical semiconductor device and a method for manufacturing an optical semiconductor device in which the underfill wraparound to the upper surface of the optical semiconductor chip is suppressed and the underfill is reliably filled between the wiring board and the optical semiconductor chip. Providing equipment.

  One embodiment of the present invention includes a wiring board, an optical semiconductor chip electrically connected to the wiring board via a plurality of connection bumps, and an underfill filled between the wiring board and the optical semiconductor chip. A method for manufacturing an optical semiconductor device comprising: a first step of preparing a joined body in which an optical semiconductor chip is electrically connected to a wiring board via connection bumps; and an underfill after the first step. A second step in which the tip of the ejection nozzle to be ejected is arranged in the first state, which is arranged on the first edge side of the optical semiconductor chip; and the tip of the ejection nozzle is arranged on the wiring substrate side from the upper surface of the optical semiconductor chip The third step of setting the second state, and the fourth step of setting the third state where the direction in which the underfill is discharged from the discharge nozzle is inclined with respect to the connection surface to which the optical semiconductor chip of the wiring substrate is connected. Process, second process, third process After the extent and the fourth step comprises intermittently discharging underfill from the discharge nozzle, and a fifth step of filling an underfill into a gap between the optical semiconductor chip and the wiring substrate.

  According to the present invention, it is possible to prevent the underfill from entering the upper surface of the optical semiconductor chip and to reliably fill the underfill between the wiring board and the optical semiconductor chip.

1 is a side view of an optical semiconductor device manufactured by an optical semiconductor device manufacturing method and an optical semiconductor device manufacturing apparatus according to an embodiment of the present invention. It is a figure which shows the structure of the manufacturing apparatus of the optical semiconductor device which concerns on one form of this invention. It is a flowchart which shows the main processes of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention. It is a figure which shows 1 process of the manufacturing method of the optical semiconductor device which concerns on one form of this invention.

[Description of Embodiment of the Present Invention]
First, embodiments of the present invention will be listed and described.

  One embodiment of the present invention includes a wiring board, an optical semiconductor chip electrically connected to the wiring board via a plurality of connection bumps, and an underfill filled between the wiring board and the optical semiconductor chip. A method for manufacturing an optical semiconductor device comprising: a first step of preparing a joined body in which an optical semiconductor chip is electrically connected to a wiring board via connection bumps; and an underfill after the first step. A second step in which the tip of the ejection nozzle to be ejected is arranged in the first state, which is arranged on the first edge side of the optical semiconductor chip; and the tip of the ejection nozzle is arranged on the wiring substrate side from the upper surface of the optical semiconductor chip The third step of setting the second state, and the fourth step of setting the third state where the direction in which the underfill is discharged from the discharge nozzle is inclined with respect to the connection surface to which the optical semiconductor chip of the wiring substrate is connected. Process, second process, third process After the extent and the fourth step comprises intermittently discharging underfill from the discharge nozzle, and a fifth step of filling an underfill into a gap between the optical semiconductor chip and the wiring substrate.

  In this method of manufacturing an optical semiconductor device, since the discharge nozzle is inclined with respect to the connection surface of the wiring board with respect to the joined body, the discharge direction is inclined, so that it enters the gap between the wiring board and the optical semiconductor chip. Underfill can be discharged. When the underfill is discharged, the underfill is discharged intermittently, so the underfill is pushed into the gap between the wiring board and the optical semiconductor chip and between the connection bumps to ensure that the underfill is filled. Is possible. At this time, the tip of the discharge nozzle with respect to the joined body is arranged on the wiring board side with respect to the upper surface of the optical semiconductor chip. That is, the position where the underfill is discharged is located below the upper surface of the optical semiconductor chip. For this reason, even if it discharges so that an underfill may be pushed in with respect to a clearance gap, it can suppress that an underfill wraps around the upper surface of an optical semiconductor chip. Therefore, it is possible to suppress the underfill from entering the upper surface of the optical semiconductor chip and to reliably fill the underfill between the wiring board and the optical semiconductor chip.

  The manufacturing method of the optical semiconductor device includes, after the fifth step, a sixth step in which the tip of the discharge nozzle is in a fourth state arranged on the second edge side of the optical semiconductor chip, The method may further comprise a seventh step of intermittently discharging the underfill from the discharge nozzle after the step to fill the gap between the optical semiconductor chip and the wiring substrate with the underfill. Since the underfill is discharged after the discharge nozzle is arranged on the second edge side, the underfill that has been pushed in from the first edge side is filled with the underfill. Is possible. Therefore, the underfill can be more reliably filled between the wiring board and the optical semiconductor chip.

  Another embodiment of the present invention includes a wiring board, an optical semiconductor chip electrically connected to the wiring board via a plurality of connection bumps, an underfill filled between the wiring board and the optical semiconductor chip, An optical semiconductor device manufacturing apparatus comprising: a support base that supports a joined body in which an optical semiconductor chip is electrically connected to a wiring board via connection bumps; a discharge nozzle that ejects underfill; and a joined body A control unit that controls the position and orientation of the discharge nozzle relative to the discharge nozzle and underfill discharge from the discharge nozzle, and the control unit has the tip of the discharge nozzle disposed on the first edge side of the optical semiconductor chip. In the second state, the tip of the discharge nozzle is placed in the second state in which the tip of the discharge nozzle is disposed on the wiring substrate side with respect to the upper surface of the optical semiconductor chip, and the direction in which the underfill is discharged from the discharge nozzle In the third state inclined with respect to the connection surface to which the chip is connected, and in the state where the position and posture of the discharge nozzle with respect to the joined body satisfy the first state, the second state, and the third state, Underfill is discharged intermittently.

  In this optical semiconductor device manufacturing apparatus, the control unit makes the discharge nozzle posture with respect to the joined body in a state in which the discharge direction is inclined with respect to the connection surface of the wiring substrate, so that it enters the gap between the wiring substrate and the optical semiconductor chip. Underfill can be discharged in the direction. When discharging the underfill, the control unit discharges the underfill intermittently, so that the underfill is surely filled in the gap between the wiring board and the optical semiconductor chip and the gap between the connection bumps. It becomes possible to push in the fill. Further, the control unit places the tip of the discharge nozzle with respect to the bonded body in a state of being arranged closer to the wiring board than the upper surface of the optical semiconductor chip. Then, the position where the underfill is discharged is located below the upper surface of the optical semiconductor chip. For this reason, even if it discharges so that an underfill may be pushed into the gap, it is possible to suppress the underfill from flowing into the upper surface of the optical semiconductor chip. Therefore, it is possible to suppress the underfill from entering the upper surface of the optical semiconductor chip and to reliably fill the underfill between the wiring board and the optical semiconductor chip.

  Further, in the optical semiconductor device manufacturing apparatus, the support base has a support surface for supporting the joined body and is rotatable around the normal direction of the support surface, and the control unit has the tip of the discharge nozzle at the optical semiconductor. In the fourth state arranged on the second edge side of the chip, in the state where the position and posture of the discharge nozzle with respect to the joined body satisfy the second state, the third state, and the fourth state, The underfill may be intermittently discharged from the discharge nozzle moved to the discharge position. Since the underfill is discharged from the discharge nozzle moved to the second edge side, the underfill pushed from the first edge side is filled with the underfill. Can do. Therefore, the underfill can be more reliably filled between the wiring board and the optical semiconductor chip.

[Details of the embodiment of the present invention]
Embodiments of an optical semiconductor device manufacturing method and an optical semiconductor device manufacturing apparatus according to the present invention will be described below with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In addition, this invention is not limited to these description, but is shown by the claim, and it is intended that all the changes within the meaning and range equivalent to the claim are included.

  First, an optical device manufacturing method and an optical semiconductor device manufactured by the optical semiconductor device according to an embodiment of the present invention will be described. As shown in FIG. 1, the optical semiconductor device 1 includes a wiring board 2, an optical semiconductor chip 3, and connection bumps 4. A plurality of connection bumps 4 are arranged between the wiring substrate 2 and the optical semiconductor chip 3, and electrical connection between the wiring substrate 2 and the optical semiconductor chip 3 is ensured by these connection bumps 4. Further, a gap having a height of about 4 to 9 μm is formed between the wiring board 2 and the optical semiconductor chip 3, and this gap is filled with an underfill 6.

  The optical semiconductor device 1 is a so-called infrared image sensor that converts received infrared light into an electrical signal and outputs the electrical signal. The optical semiconductor device 1 is, for example, a back-illuminated infrared image sensor. The wiring substrate 2 is formed by forming a plurality of electric elements on a Si (silicon) substrate and functions as a reading circuit for the optical semiconductor chip 3. The wiring board 2 has a connection surface 2 a on which connection pads for ensuring electrical connection with the optical semiconductor chip 3 are formed. The optical semiconductor chip 3 is a light receiving element having a light receiving unit 7. The light receiving unit 7 has, for example, an InGaAs / GaAsSb multiple quantum well structure formed on an indium phosphide (InP) substrate, and has a band extending to a long wavelength region of near infrared light. The optical semiconductor chip 3 has, for example, a flat plate shape with a length of 10 mm, a width of 10 mm, and a thickness of 0.3 mm. The light receiving unit 7 is formed on the surface 3 a of the optical semiconductor chip 3. The optical semiconductor chip 3 is mounted on the wiring board 2 so that the light receiving portion 7 faces the connection surface 2 a of the wiring board 2. The back surface 3b opposite to the front surface 3a is the top surface.

  The connection bump 4 is disposed between the surface 3 a on which the light receiving portion 7 of the optical semiconductor chip 3 is formed and the wiring substrate 2. The connection bump 4 is made of, for example, indium or the like, and is formed by vapor deposition or plating. A plurality of connection bumps 4 are two-dimensionally arranged, and the interval between them is about 30 μm. That is, the optical semiconductor device 1 has a smaller interval between the optical semiconductor chip 3 that is an infrared image sensor and the wiring board 2 and a smaller arrangement interval of the connection bumps 4 than an LSI chip or a general electronic component assembly. .

  The underfill 6 is filled in a gap formed between the wiring board 2 and the optical semiconductor chip 3 to ensure mechanical connection strength between the wiring board 2 and the optical semiconductor chip 3. For the underfill 6, for example, an epoxy-based thermosetting resin is used. The underfill 6 is thermally cured. In order to prevent the connection bump 4 from being remelted and causing unexpected assembly defects during thermosetting, an undercoat that can be applied and cured at a temperature lower than the melting point of the connection bump 4 (about 157 ° C. in the case of indium). Fill 6 is used. The underfill 6 may not be transparent to light in the light receiving wavelength band of the optical semiconductor chip 3.

  In the following description, the wiring substrate 2 and the optical semiconductor chip 3 are electrically connected and the underfill 6 is filled between the wiring substrate 2 and the optical semiconductor chip 3 is referred to as an optical semiconductor device 1. . The wiring board 2 and the optical semiconductor chip 3 are mechanically fixed only by the connection bumps 4, that is, the underfill 6 is not filled between the wiring board 2 and the optical semiconductor chip 3. It will be called a workpiece (joined body) W.

  Next, a manufacturing apparatus for manufacturing the optical semiconductor device 1 will be described. As shown in FIG. 2, the manufacturing apparatus 8 includes a support portion 9 that supports the workpiece W and an underfill discharge portion 11.

  The support portion 9 includes a support base 14 on which the rotation shaft 13 is attached on the center axis A <b> 1 of the support disc 12, and a jig plate 16 attached to the surface 12 a of the support disc 12.

  The support base 14 is rotatable around the central axis A1. In addition, the support base 14 is formed with a holding hole 17 that penetrates the rotating shaft 13 and the support disk 12. The holding hole 17 is connected to a vacuum device (not shown) and functions as a so-called vacuum chuck. A heating unit 18 is disposed inside the support disk 12. The heating unit 18 is connected to a power source (not shown), and controls the support base 14 to a desired temperature by passing a current. The jig plate 16 is for attaching the workpiece W to the support base 14. The disc-shaped jig plate 16 has a through hole 19 for a vacuum chuck that communicates with a holding hole 17 provided in the support base 14 and a positioning portion 21 for positioning the workpiece W.

  The underfill discharge unit 11 includes a storage unit 22 that holds the underfill 6 and a dispenser 24 that includes a discharge nozzle 23 that discharges the underfill 6. The container 22 holds an underfill 6 such as an epoxy-based thermosetting resin. The underfill 6 is discharged through an injection needle-like discharge nozzle 23 having an outer diameter of about 0.36 mm and an inner diameter of about 0.18 mm. The underfill discharge unit 11 includes an air pressure applying mechanism 27 for pushing out the underfill 6 held in the storage unit 22 from the tip of the discharge nozzle 23. The underfill 6 is discharged from the tip of the discharge nozzle 23 by being supplied with air pressure from an air pressure applying mechanism 27 connected to the accommodating portion 22. The discharge of the underfill 6 is controlled by the control unit 28.

  In addition, the underfill discharge unit 11 sets the position of the discharge nozzle 23 to a predetermined position and positions the front end position of the discharge nozzle 23 at a predetermined position, and the front end position of the discharge nozzle 23. And a camera 29 for imaging. The control unit 28 controls the posture of the discharge nozzle 23, the tip position of the discharge nozzle 23, and the discharge of the underfill 6 from the tip of the discharge nozzle 23.

  The nozzle position adjusting mechanism 26 positions the discharge nozzle 23 with high accuracy in the three-dimensional space. The nozzle position adjusting mechanism 26 also sets the posture of the discharge nozzle 23 with high accuracy. Here, the posture of the discharge nozzle 23 refers to the inclination angle θ of the discharge nozzle 23 with respect to the wiring board 2 (see the part (b) in FIG. 5). Therefore, the positional relationship between the discharge nozzle 23 and the workpiece W is defined by the rotation angle of the support base 14, the position of the discharge nozzle 23 in the three-dimensional space, and the inclination angle θ of the discharge nozzle 23.

  In this optical semiconductor device manufacturing apparatus 8, the control unit 28 changes the posture of the discharge nozzle 23 relative to the workpiece W to the state where the discharge direction A 2 is inclined with respect to the connection surface 2 a of the wiring substrate 2. The underfill 6 can be discharged in a direction that enters the gap with the semiconductor chip 3. When the underfill 6 is discharged, the control unit 28 discharges the underfill 6 intermittently, so that the underfill 6 is surely provided in the gap between the wiring substrate 2 and the optical semiconductor chip 3 and the gap between the connection bumps 4. It becomes possible to push the underfill 6 so as to be filled. Further, the control unit 28 places the tip 23 a of the discharge nozzle 23 for the work W on the wiring board 2 side with respect to the back surface (upper surface) 3 b of the optical semiconductor chip 3. Then, the position where the underfill 6 is discharged is positioned below the back surface 3 b of the optical semiconductor chip 3. For this reason, even if it discharges so that the underfill 6 may be pushed into the gap, it is possible to suppress the underfill 6 from entering the back surface 3 b of the optical semiconductor chip 3. Therefore, the underfill 6 can be prevented from wrapping around the back surface 3 b of the optical semiconductor chip 3 and the underfill 6 can be reliably filled between the wiring substrate 2 and the optical semiconductor chip 3. Furthermore, if the underfill 6 is prevented from entering the back surface 3 b of the optical semiconductor chip 3, it is possible to use the underfill 6 that is opaque to the light receiving band of the optical semiconductor chip 3.

  Further, since the underfill 6 is discharged from the discharge nozzle 23 arranged on the second edge E2 side in the optical semiconductor device manufacturing apparatus 8, the underfill 6 pushed from the first edge E1 side is discharged. The underfill 6 can be filled in the gap that has not reached. Therefore, the underfill 6 can be more reliably filled between the wiring board 2 and the optical semiconductor chip 3.

  Next, a method for manufacturing the optical semiconductor device 1 using the manufacturing apparatus 8 described above will be described. FIG. 3 is a flowchart showing main steps S1 to S10 of the method for manufacturing the optical semiconductor device. As shown in FIG. 4A, a work W in which the wiring substrate 2 and the optical semiconductor chip 3 are electrically connected via the connection bumps 4 is prepared (first step S1). The work W has a certain mechanical connection strength due to the connection bumps 4. Subsequently, after the work W is arranged on the jig plate 16, the jig plate 16 is arranged on the support base 14. Then, a vacuum pump (not shown) is operated to vacuum chuck the workpiece W. At this time, the temperature of the support base 14 is controlled to a predetermined temperature (for example, 100 ° C.) by the heating unit 18.

  Subsequently, the posture and position of the discharge nozzle 23 with respect to the workpiece W are set. First, as shown in FIG. 4B, the tip 23a of the discharge nozzle 23 is disposed on the first edge E1 side of the optical semiconductor chip 3 (step S2). Specifically, the control unit 28 controls the rotation angle of the support base 14 (see FIG. 2) and arranges the first edge E1 of the optical semiconductor chip 3 in the vicinity of the discharge nozzle 23 (second step). S2). At this time, the control unit 28 finely adjusts the rotation angle of the support base 14 so that the discharge direction A2 of the discharge nozzle 23 and the first edge E1 of the optical semiconductor chip 3 are substantially orthogonal.

  Subsequently, as shown in part (a) of FIG. 5, the control unit 28 controls the nozzle position adjusting mechanism 26 so that the tip 23 a of the discharge nozzle 23 is closer to the wiring substrate 2 than the back surface 3 b of the optical semiconductor chip 3. The discharge nozzles 23 are moved so as to be disposed in the third step S3. For example, the control unit 28 may move the tip 23a of the discharge nozzle 23 from the front surface 3a to the back surface 3b (reference numeral L1) of the optical semiconductor chip 3, or from the front surface 3a of the optical semiconductor chip 3 to the wiring substrate 2. You may move between the connection surfaces 2a (code | symbol L2).

  Subsequently, as shown in part (b) of FIG. 5, the control unit 28 controls the nozzle position adjusting mechanism 26, and the discharge direction A <b> 2 in which the underfill 6 is discharged from the discharge nozzle 23 is connected to the wiring board 2. The posture of the discharge nozzle 23 is set so as to be inclined with respect to the surface 2a (fourth step S4). The controller 28 sets the inclination angle θ formed by the ejection direction A2 and the connection surface 2a to 30 degrees to 60 degrees, for example, 45 degrees. Then, as shown in part (a) of FIG. 6, the tip position of the discharge nozzle 23 is visually observed with the camera 29 and is brought closer to the workpiece W. The tip 23a of the discharge nozzle 23 is brought close to a position slightly spaced apart from the first edge E1 of the optical semiconductor chip 3 (reference numeral L3, 0.1 mm to 0.3 mm) in the horizontal direction. Then, as shown in FIG. 6B, the control unit 28 controls the nozzle position adjusting mechanism 26 to move the tip of the discharge nozzle 23 to substantially the center of the first edge E1. Through the above steps, setting of the posture and position of the discharge nozzle 23 with respect to the workpiece W is completed.

  Subsequently, as shown in FIG. 7A, the underfill 6 starts to be discharged (fifth step S5). The underfill 6 is discharged intermittently. More specifically, the control unit 28 controls a discharge time (time for applying air pressure), a time interval of discharge timing, and air pressure per one time. For example, the control unit 28 executes the discharge of the underfill 6 only about 100 times at an interval of 0.2 seconds with a discharge time of 0.03 seconds and an air pressure of 20 k (kilo) Pa. . According to such discharge, the underfill 6 is filled between the wiring substrate 2 and the optical semiconductor chip 3 in a concentric manner with the tip of the discharge nozzle 23 as the center. Further, according to such discharge, the underfill 6 is filled in the vicinity of the center of the optical semiconductor chip 3 before the underfill 6 wraps around the peripheral portion of the optical semiconductor chip 3 due to the capillary phenomenon caused by the surface tension. The According to the form in which the underfill 6 is filled from the vicinity of the center of the optical semiconductor chip 3, it is possible to suppress the generation of bubbles in the gap between the optical semiconductor chip 3 and the optical semiconductor chip 3. Then, when half of the preset total discharge amount is discharged, the control unit 28 stops applying air pressure to the dispenser 24.

  Subsequently, as shown in FIG. 7B, the discharge nozzle 23 is moved vertically upward to retract the tip 23a of the discharge nozzle 23 from the optical semiconductor chip 3 (step S6). For example, the tip 23 a of the discharge nozzle 23 is moved above the back surface 3 b of the optical semiconductor chip 3. According to such a position, when the workpiece W is rotated in the next process, the contact between the workpiece W and the tip 23a of the discharge nozzle 23 can be prevented.

  The control unit 28 rotates the support base 14 by 180 degrees (sixth step S7) (see the part (a) in FIG. 8), and then moves the discharge nozzle 23 in the reverse direction (step). S8) (see part (b) of FIG. 8). By these steps, the position and posture of the discharge nozzle 23 are set with respect to the second edge E2 facing the first edge E1 of the optical semiconductor chip 3. In this state, the position and posture of the discharge nozzle 23 with respect to the second edge E2 are equivalent to the position and posture of the discharge nozzle 23 with respect to the first edge E1.

  Subsequently, the underfill 6 is discharged under the same conditions as the discharge of the underfill 6 to the first edge E1 (seventh step S9). According to such discharge, as shown in FIG. 9, the underfill 6 is filled between the wiring substrate 2 and the optical semiconductor chip 3 concentrically with the tip of the discharge nozzle 23 as the center.

  After the discharge of the underfill 6 is completed, the workpiece W is transferred to a separately provided baking furnace, and the temperature is raised to 120 ° C. and held for 3 hours to solidify the underfill 6. You may solidify the underfill 6 by raising the temperature of the support stand 14 to 120 degreeC using the heating part 18 of the support stand 14, and hold | maintaining for 3 hours, without moving the workpiece | work W (process S10). The optical semiconductor device 1 is completed through the above steps.

  In this method of manufacturing an optical semiconductor device, since the discharge nozzle 23 is positioned with respect to the workpiece W so that the discharge direction A2 is inclined with respect to the connection surface 2a of the wiring substrate 2, the wiring substrate 2, the optical semiconductor chip 3, and the like. It is possible to discharge the underfill 6 in the direction of entering the gap. When the underfill 6 is discharged, the underfill 6 is discharged intermittently, so that the underfill 6 is surely filled in the gap between the wiring board 2 and the optical semiconductor chip 3 and the gap between the connection bumps 4. It becomes possible to push the underfill 6 into. At this time, the tip 23 a of the discharge nozzle 23 with respect to the workpiece W is in a state of being arranged closer to the wiring substrate 2 than the back surface 3 b of the optical semiconductor chip 3. That is, the position where the underfill 6 is discharged is located below the back surface 3 b of the optical semiconductor chip 3. For this reason, even if it discharges so that the underfill 6 may be pushed into the gap, the underfill 6 can be prevented from going around the back surface 3 b of the optical semiconductor chip 3. Therefore, the underfill 6 can be prevented from wrapping around the back surface 3 b of the optical semiconductor chip 3, and the underfill 6 can be reliably filled between the wiring substrate 2 and the optical semiconductor chip 3.

  In this method of manufacturing an optical semiconductor device, since the underfill 6 is discharged after the discharge nozzle 23 is arranged on the second edge E2 side, the underfill 6 pushed in from the first edge E1 side reaches. It becomes possible to fill the underfill 6 with respect to the gaps that are not formed. Therefore, the underfill 6 can be more reliably filled between the wiring board 2 and the optical semiconductor chip 3.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

  For example, the optical semiconductor chip 3 may be a light receiving element whose wavelength band of received light is other than near infrared.

  For example, the positions and postures of the workpiece W and the discharge nozzle 23 are configured such that the support base 14 and the jig plate 16 that support the workpiece W can be moved in three axial directions, and the workpiece W is moved with respect to the discharge nozzle 23. May be.

  For example, steps S2 to S4 for setting positions and postures performed after the work W is mounted on the support base 14 and before the underfill 6 is filled are performed in a desired order in consideration of work efficiency and the like. May be.

DESCRIPTION OF SYMBOLS 1 ... Optical semiconductor device, 2 ... Wiring board, 2a ... Connection surface, 3 ... Optical semiconductor chip, 3a ... Front surface, 3b ... Back surface (upper surface), 4 ... Connection bump, 6 ... Underfill, 7 ... Light-receiving part, 8 ... Manufacturing apparatus, 9 ... support part, 11 ... underfill discharge part, 12 ... support disk, 13 ... rotating shaft, 14 ... support base, 16 ... jig plate, 17 ... holding hole, 18 ... heating part, 19 ... penetration Hole, 21 ... Positioning part, 22 ... Storage part, 23 ... Discharge nozzle, 23a ... Tip, 24 ... Dispenser, 26 ... Nozzle position adjustment mechanism, 27 ... Air pressure application mechanism, 28 ... Control part, 29 ... Camera, A1 ... Center Axis, A2 ... discharge direction, E1 ... first edge, E2 ... second edge, S1 ... first step, S2 ... second step, S3 ... third step, S4 ... fourth step , S5: Fifth step, S7: Sixth step, S9: Seventh step, W: W Click (Assembly).

Claims (4)

An optical semiconductor device comprising: a wiring board; an optical semiconductor chip electrically connected to the wiring board via a plurality of connection bumps; and an underfill filled between the wiring board and the optical semiconductor chip A manufacturing method of
A first step of preparing a bonded body in which the optical semiconductor chip is electrically connected to the wiring board via the connection bump;
After the first step, a second step of bringing the tip of the discharge nozzle for discharging the underfill into a first state arranged on the first edge side of the optical semiconductor chip;
A third step of bringing the discharge nozzle tip into a second state in which the tip of the discharge nozzle is disposed closer to the wiring substrate than the upper surface of the optical semiconductor chip;
A fourth step in which a direction in which the underfill is discharged from the discharge nozzle is set to a third state in which the direction of the wiring substrate is inclined with respect to the connection surface to which the optical semiconductor chip is connected;
After the second step, the third step, and the fourth step, the underfill is intermittently discharged from the discharge nozzle, and the underfill is provided in a gap between the optical semiconductor chip and the wiring board. And a fifth step of filling an optical semiconductor device. After the fifth step, a sixth step of setting the tip end of the discharge nozzle to a fourth state arranged on the second edge side of the optical semiconductor chip;
After the sixth step, the method further includes a seventh step of intermittently discharging the underfill from the discharge nozzle to fill the gap between the optical semiconductor chip and the wiring substrate with the underfill. A method for manufacturing an optical semiconductor device according to claim 1. An optical semiconductor device comprising: a wiring board; an optical semiconductor chip electrically connected to the wiring board via a plurality of connection bumps; and an underfill filled between the wiring board and the optical semiconductor chip Manufacturing equipment,
A support base for supporting a joined body in which the optical semiconductor chip is electrically connected to the wiring board via the connection bumps;
A discharge nozzle for discharging the underfill;
A control unit that controls the position and orientation of the discharge nozzle with respect to the joined body and the discharge of the underfill from the discharge nozzle;
The controller is
In a first state where the tip of the discharge nozzle is disposed on the first edge side of the optical semiconductor chip,
In a second state where the tip of the discharge nozzle is disposed on the wiring board side with respect to the upper surface of the optical semiconductor chip,
A third state in which the direction in which the underfill is discharged from the discharge nozzle is inclined with respect to the connection surface of the wiring substrate to which the optical semiconductor chip is connected;
An optical semiconductor that intermittently discharges the underfill from the discharge nozzle in a state where the position and posture of the discharge nozzle with respect to the joined body satisfy the first state, the second state, and the third state. Equipment manufacturing equipment. The support base has a support surface for supporting the joined body and is rotatable around a normal direction of the support surface;
The controller is
In the fourth state where the tip of the discharge nozzle is disposed on the second edge side of the optical semiconductor chip,
In a state where the position and posture of the discharge nozzle with respect to the joined body satisfy the second state, the third state, and the fourth state, the under nozzle is moved from the discharge nozzle moved to the second discharge position. The optical semiconductor device manufacturing apparatus according to claim 3, wherein the fill is intermittently discharged.

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