JP2015220137A - Diffusion cover, lighting lamp, lighting device, and manufacturing method of diffusion cover - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a diffusion cover with improved heat radiation performance, and to provide a lighting lamp using the diffusion cover, a lighting device, and a manufacturing method of the diffusion cover.SOLUTION: A diffusion cover 2 includes: a light permeable cover body 3 in which a light emitting part 11 is accommodated; and a diffusion film 4 which is provided at the cover body 3, diffuses light emitted from the light emitting part 11, and includes a heat conductive material 5.

Description

  The present invention relates to a diffusion cover for diffusing light, an illumination lamp using the same, an illumination device, and a method for manufacturing the diffusion cover.

  In an illumination lamp using a solid light-emitting element such as an LED as a light source, various heat dissipation techniques have been proposed in the past in order to release heat generated from the light source, for example. Patent Document 1 discloses an LED lamp including a substrate having a plurality of LED elements on the surface, and a glass tube in which the substrate is housed and whose outer surface or inner surface is diffusion-treated. In Patent Document 1, light emitted from an LED element is diffused when passing through a diffusion-treated glass tube, and emitted to the outside of the LED lamp. Thereby, diffused light is irradiated to the room etc. in which the LED lamp was attached.

JP2011-138681A (pages 4 to 5)

  As described above, in the LED lamp disclosed in Patent Document 1, a light emitting unit having a light source is included in a cover made of a glass tube or the like in order to protect the light source and diffuse light emitted from the light source. . However, since a glass tube or the like has a low thermal conductivity K (W / m · K), heat generated from the light source of the LED lamp is hardly released. Further, not only glass tubes but also tubes made of resin have poor heat dissipation.

  The present invention has been made against the background described above, and provides a diffusion cover with improved heat dissipation, an illumination lamp using the same, an illumination device, and a method for manufacturing the diffusion cover.

  A diffusion cover according to the present invention includes a light-transmitting cover main body in which a light emitting unit is accommodated, a diffusion film provided in the cover main body, diffusing light emitted from the light emitting unit, and having a heat conductive material; It is characterized by having.

  According to the present invention, since the diffusion film includes the heat conductive material, the heat dissipation can be improved.

1 is a perspective view showing an illumination lamp 1 according to Embodiment 1. FIG. 1 is a front sectional view showing an illumination lamp 1 according to Embodiment 1. FIG. 1 is a side view showing an illumination lamp 1 according to Embodiment 1. FIG. 1 is a side sectional view showing an illumination lamp 1 according to Embodiment 1. FIG. It is front sectional drawing which shows the illumination lamp 100 which concerns on a 1st modification. It is side surface sectional drawing which shows the illumination lamp 200 which concerns on a 2nd modification. It is side surface sectional drawing which shows the illumination lamp 300 which concerns on a 3rd modification. 1 is a perspective view showing a lighting device 30 according to Embodiment 1. FIG. It is side surface sectional drawing which shows the illumination lamp 400 which concerns on Embodiment 2. FIG. FIG. 6 is a side sectional view showing an illumination lamp 500 according to Embodiment 3. It is a front view which shows the illumination lamp 600 which concerns on Embodiment 4. FIG. It is a front view which shows the illuminating device 630 which concerns on Embodiment 4. FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a diffusion cover, an illumination lamp, an illumination device, and a method for manufacturing a diffusion cover according to the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Moreover, in the following drawings including FIG. 1, the relationship of the size of each component may be different from the actual one.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an illumination lamp 1 according to Embodiment 1. FIG. The illumination lamp 1 will be described with reference to FIG. As shown in FIG. 1, the illumination lamp 1 includes a light source module 10, a power supply base 13, a ground base 14, and a diffusion cover 2.

(Light source module 10)
2 is a front cross-sectional view showing the illumination lamp 1 according to Embodiment 1, and is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 2, the light source module 10 includes a light emitting unit 11 and a heat sink 12 on which the light emitting unit 11 is installed. The light emitting unit 11 includes, for example, a plurality of LEDs 11 a and a wiring pattern (see FIG. And a substrate 11b on which the LED 11a is mounted.

(LED11a)
In this Embodiment 1, the case where a light emitting element is LED11a is demonstrated. As described above, the LEDs 11a are mounted on the substrate 11b, and are arranged in a straight line, for example, on the surface of the substrate 11b. A light source circuit is formed by connecting the LED 11a and a wiring pattern provided on one surface of the substrate 11b. As the LED 11a, for example, a pseudo white LED packaged by providing a phosphor that converts blue light into yellow light on an LED chip that emits blue light having a wavelength of about 440 nm to 480 nm can be used.

  In addition, you may use COB (Chip On Board) etc. with which the LED chip was directly mounted in the board | substrate 11b. In addition, the number, arrangement, or type of the LEDs 11a can be appropriately changed according to the use of the illumination lamp 1 or the like. Furthermore, instead of the LED 11a, a light emitting element (device) such as an LD (laser diode) or an organic EL can be used. When an organic EL or the like is used as the light emitting element, instead of mounting a plurality of light emitting elements on the substrate 11b, a single plate-like light emitting element extending in the longitudinal direction may be mounted on the substrate 11b. .

(Substrate 11b)
The board | substrate 11b is a member extended in the longitudinal direction (arrow Y direction), for example. As described above, a plurality of LEDs 11a are mounted on the substrate 11b along the longitudinal direction (arrow Y direction). In addition, a lighting circuit element (not shown) made of a diode, a fuse, a resistor, or the like for lighting the LED 11a is mounted on the substrate 11b. And the board | substrate 11b is electrically connected with the electric power feeding terminal 13a of the electric power feeding base 13 in the end, and the lighting circuit element of the board | substrate 11b is electrically fed via the electric power feeding terminal 13a from an external power supply. Thereby, LED11a lights.

  As a material of the substrate 11b, a glass epoxy material, a paper phenol material, a composite material, or a metal material such as aluminum (Al) is selected and used in consideration of component arrangement, heat dissipation, and material cost. The thickness of the substrate 11b is, for example, about 1 mm, but may be thicker or thinner than 1 mm. In addition, in order to improve the utilization efficiency of the light emitted from the LED 11a, a reflective material may be formed on the surface of the substrate 11b by using a method such as coating, printing, or vapor deposition. In this case, the use efficiency of light can be further improved by forming a reflective material on the surface of the substrate 11b on which the LED 11a is mounted.

(Heat sink 12)
The heat sink 12 is a member extending in the longitudinal direction (arrow Y direction), for example, and is a heat conducting member having thermal conductivity. The heat sink 12 includes a flat portion 12 a and an arc portion 12 b, and the light emitting unit 11 is installed on the flat portion 12 a of the heat sink 12. Specifically, the longitudinal direction (arrow Y direction) of the substrate 11 b of the light emitting unit 11 is placed parallel to the longitudinal direction (arrow Y direction) of the flat portion 12 a of the heat sink 12.

  The heat sink 12 is bonded to the cylindrical diffusion cover 2 using, for example, an adhesive 12c, and the portion of the heat sink 12 bonded to the diffusion cover 2 is a circle along the inner wall of the diffusion cover 2. It is an arcuate arc portion 12b. In this way, the heat sink 12 connects the substrate 11b of the light emitting unit 11 and the diffusion cover 2, so that the heat sink 12 transmits operating heat generated from the LED 11a to the diffusion cover 2 for illumination. Heat is radiated outside the lamp 1.

  In addition, the heat sink 12 is provided with the rigidity required to support the longitudinal direction (arrow Y direction) of the illumination lamp 1, and it is preferable that a linear expansion coefficient is small. The heat sink 12 may be formed by extrusion molding of a metal material, but may be formed by a method other than extrusion molding. As this metal material, aluminum (Al), iron (Fe), or the like can be used. The heat sink 12 may be ceramic instead of a metal material, or may be a high thermal conductive resin to which a filler having thermal conductivity is added.

(Power feed cap 13)
The power supply base 13 is an example of a base part, and the power supply base 13 is attached to one end of the diffusion cover 2 as shown in FIG. 1. The power supply base 13 includes a pair of conductive power supply terminals 13a and a bottomed cylindrical power supply base case 13b (base member) in which these power supply terminals 13a are embedded. As described above, the power supply terminal 13a is electrically connected to one end of the substrate 11b, and is connected to the external power supply of the lighting fixture 20, whereby the lighting circuit element of the substrate 11b is supplied with power.

  The power supply terminal 13a is made of, for example, a conductive metal material, and the power supply base case 13b is made of, for example, an insulating resin material. The power supply terminal 13a and the power supply base casing 13b are integrally formed by insert molding or the like. The power supply base 13 may be a GX16 type base, for example, but other types of bases, such as a G13 type base, may be used.

(Earth cap 14)
The ground cap 14 is an example of a cap portion, and is attached to the other end portion of the diffusion cover 2 as shown in FIG. The ground base 14 includes a ground terminal 14a having conductivity and a bottomed cylindrical ground base casing 14b (base member) in which the ground terminal 14a is embedded. The ground lamp 14 is grounded by connecting the ground terminal 14 a to the ground portion of the lighting fixture 20.

  The ground terminal 14a is made of, for example, a conductive metal material, and the ground base casing 14b is made of, for example, an insulating resin material. The ground terminal 14a and the ground cap casing 14b are integrally formed by insert molding or the like. The ground base 14 can be a GX16 type base, for example, but other types of bases such as a G13 type base can also be used.

(Diffusion cover 2)
The diffusion cover 2 is, for example, a cylindrical member extending in the longitudinal direction (arrow Y direction). In this case, the diffusion cover 2 is also referred to as an outer tube valve, a tube tube, or a straight tube. The diffusion cover 2 accommodates the light emitting unit 11. FIG. 3 is a side view showing the illumination lamp 1 according to the first embodiment. As shown in FIG. 3, the diffusion cover 2 includes a cover body 3 and a diffusion film 4 provided on the cover body 3.

(Cover body 3)
The cover body 3 is light transmissive and can be made of glass, for example, but may be made of resin. A diffusion film 4 is formed on the outer wall surface 3 a and the inner wall surface 3 b of the cover body 3. As described above, the diffusion film 4 includes the outer surface diffusion film 4 a formed on the outer wall surface 3 a of the cover body 3 and the inner surface diffusion film 4 b formed on the inner wall surface 3 b of the cover body 3.

(Diffusion film 4)
4 is a side sectional view showing the illumination lamp 1 according to Embodiment 1, and is an enlarged view of a portion surrounded by a broken line in FIG. As shown in FIG. 4, of the outer surface diffusion film 4 a and the inner surface diffusion film 4 b, the outer surface diffusion film 4 a is composed of a substrate 6 to which a plurality of cavities 8 and a heat conductive material 5 are added. The substrate 6 can be, for example, a resin such as acrylic, polycarbonate, or epoxy, but may be low-melting glass. The cavity 8 diffuses the light emitted from the light emitting unit 11, and the diffusion medium that diffuses the light in the outer surface diffusion film 4 a is only the cavity 8.

  The heat conductive material 5 is a heat conductive particle 5a having heat conductivity, and is made of a metal powder such as titanium, aluminum, or magnesium. Further, the heat conductive particles 5a are not limited to metals, and may be powders of metal oxides such as titania, alumina, magnesia, and silica. In addition, a thermally conductive filler such as boron nitride, silicon carbide, or aluminum nitride can be used. The outer surface diffusion film 4a may be configured such that only the heat conductive material 5 is added to the substrate 6 and the cavity 8 is not added.

  On the other hand, the inner surface diffusion film 4b is composed of a base material 6 to which a plurality of diffusion materials 7 and cavities 8 are added. The substrate 6 can also be a resin such as acrylic, polycarbonate, or epoxy, but may be a low-melting glass. Each of the diffusion material 7 and the cavity 8 diffuses the light emitted from the light emitting unit 11. In the inner surface diffusion film 4 b, the diffusion medium that diffuses the light is the diffusion material 7 and the cavity 8. is there. In addition, as the diffusing material 7, for example, an inorganic material such as silica can be used, but an organic material may be used.

  Next, a method for manufacturing the illumination lamp 1 according to the first embodiment will be described. First, a method for forming the outer surface diffusion film 4a will be described. A heat conductive material 5, for example, a heat conductive particle 5 a is added to the substrate 6. Next, the base material 6 is liquefied with a solvent, and the liquefied base material 6 is applied to the outer wall surface 3 a of the cover body 3. Then, the base material 6 is dried and hardened by heating the base material 6.

  In addition, during the heating, the base material 6 is cured, and at the same time, a reaction occurs in which the cavities 8 are generated inside the base material 6. Thereby, the cavity 8 is produced | generated inside the base material 6. FIG. At this time, the size or number of the cavities 8 is controlled by appropriately changing the reaction time and the reaction temperature when the cavities 8 are generated. As a result, an outer surface diffusion film 4 a including the cavities 8 and the heat conductive particles 5 a is formed on the outer wall surface 3 a of the cover body 3.

  Next, a method for forming the inner surface diffusion film 4b will be described. First, the diffusing material 7 is added to the base material 6. Next, the base material 6 is liquefied with a solvent, and the liquefied base material 6 is applied to the inner wall surface 3 b of the cover body 3. Then, the base material 6 is dried and hardened by heating the base material 6.

  In addition, during the heating, the base material 6 is cured, and at the same time, a reaction occurs in which the cavities 8 are generated inside the base material 6. Thereby, the cavity 8 is produced | generated inside the base material 6. FIG. At this time, the size or number of the cavities 8 is controlled by appropriately changing the reaction time and the reaction temperature when the cavities 8 are generated. As a result, the inner surface diffusion film 4 b including the diffusion material 7 and the cavity 8 is formed on the inner wall surface 3 b of the cover body 3.

  The diffusion cover 2 is manufactured through the above steps. And the light emission part 11 is accommodated in this diffusion cover 2, and the illumination lamp 1 is manufactured.

  Next, the operation of the illumination lamp 1 according to the first embodiment will be described. In the first embodiment, the outer surface diffusion film 4a includes the heat conductive particles 5a. For this reason, the heat generated from the light emitting unit 11 is transmitted to the diffusion cover 2, efficiently transmitted through the outer surface diffusion film 4 a, and radiated to the air outside the illumination lamp 1. Thus, since the outer surface diffusion film 4a is provided with the heat conductive particle 5a, the illumination lamp 1 can improve heat dissipation. Moreover, since the outer surface diffusion film 4 a includes the cavity 8, the light diffusibility can be enhanced by the cavity 8. Thereby, while being able to improve heat dissipation, the diffusibility of light can be improved. In addition, even if the existing cover body 3 is used and the diffusion film 4 is formed on the cover body 3, the same effect can be obtained. Thus, the illumination lamp 1 according to Embodiment 1 is extremely versatile.

  Since the inner surface diffusion film 4 b includes the diffusing material 7 and the cavity 8, the inner surface diffusion film 4 b has higher light diffusibility than the outer surface diffusion film 4 a having only the cavity 8. Thereby, the light emitted from the light emitting portion 11 is diffused by the inner surface diffusion film 4b, further diffused by the outer surface diffusion film 4a, and emitted to the outside. Thus, the illumination lamp 1 according to the first embodiment has extremely high diffusibility.

  For the purpose of enhancing the heat dissipation of the diffusion cover 2 itself, it is conceivable to form a rubbed glass by forming irregularities on the cover body 3 such as glass. However, if this rubbed glass is constantly exposed to air, it will rub. The glass itself gets dirty. On the other hand, in the first embodiment, the cover body 3 is provided with the outer surface diffusion film 4a provided with the heat conductive particles 5a, and the outer surface diffusion film 4a is in contact with air. For this reason, the cover main body 3 itself does not touch air, and the cover main body 3 is not soiled. Furthermore, since the outer surface diffusion film 4a is formed on the outer wall surface 3a of the cover body 3, the cover body 3 is protected by the outer surface diffusion film 4a. For this reason, the illumination lamp 1 can maintain the strength of the cover body 3 and suppress the deformation of the diffusion cover 2. This also makes it difficult for the electronic components and the like housed in the diffusion cover 2 to be broken, and the reliability is improved.

  Note that if the number of the heat conductive particles 5a in the outer surface diffusion film 4a is small, the heat dissipation effect is reduced, and if the number of the heat conductive particles 5a in the outer surface diffusion film 4a is large, the light emitted from the light emitting unit 11 is emitted. The transmittance of is reduced. Further, when the number of the heat conductive particles 5 a in the outer surface diffusion film 4 a is large, the diffusion film 4 is easily peeled from the cover body 3. Furthermore, if the size of the heat conductive particles 5a in the outer surface diffusion film 4a is small, the heat dissipation effect is lowered. If the size of the heat conductive particles 5a in the outer surface diffusion film 4a is large, the heat emitting particles 5a are emitted from the light emitting unit 11. The light transmittance is reduced. Furthermore, if the size of the heat conductive particles 5a in the outer surface diffusion film 4a is large, the diffusion film 4 is easily peeled from the cover body 3. For this reason, the number and size of the heat conductive particles 5a in the outer surface diffusion film 4a are determined in consideration of the balance between light transmission and heat dissipation, adhesion, and the like.

(First modification)
Next, the illumination lamp 100 which concerns on the 1st modification of this Embodiment 1 is demonstrated. FIG. 5 is a front sectional view showing an illumination lamp 100 according to a first modification. As shown in FIG. 5, in the circumferential cross section of the diffusion cover 102, two line segments connecting the center point O of the diffusion cover 102 and the intersections H <b> 1 and H <b> 2 of the flat portion 12 a and the arc portion 12 b in the heat sink 12. The points where the extended line intersects the outer wall of the cover body 3 of the diffusion cover 102 are denoted by A1 and A2, respectively. Out of the diffusion film 104, an outer surface diffusion film 104a is formed on the outer wall portion of the cover body 3 from A1 to A2. That is, the outer surface diffusion film 104a is formed in a portion where the cover body 3 and the heat sink 12 are in contact with each other. The inner surface diffusion film 104b is formed on the entire circumference of the cover body 3.

  Most of the heat generated from the light emitting unit 11 is transmitted to the heat sink 12 and further to the diffusion cover 102. In the first modification, the outer surface diffusion film 104a is formed in a portion where the cover main body 3 and the heat sink 12 are in contact with each other, so that the heat transmitted from the heat sink 12 to the diffusion cover 102 is outside the illumination lamp 100. Heat can be radiated efficiently. Furthermore, since the outer surface diffusion film 104a is not formed over the entire outer periphery of the cover body 3, the formation cost of the outer surface diffusion film 104a can be reduced. Thus, in the first modification, the heat dissipation effect can be maintained, and the cost reduction effect can be achieved. The outer surface diffusion film 104a may be formed of a heat conductive film that does not have light diffusibility.

(Second modification)
Next, an illumination lamp 200 according to a second modification of the first embodiment will be described. FIG. 6 is a side sectional view showing an illumination lamp 200 according to a second modification. As shown in FIG. 6, in the second modification, in the diffusion film 204 of the diffusion cover 202, the outer surface diffusion film 204 a further includes a plurality of diffusion materials 7 in addition to the plurality of cavities 8 and the heat conductive particles 5 a. ing. That is, two kinds of particles, that is, the heat conductive particles 5a and the diffusion material 7 are added. The inner surface diffusion film 204b is the same as the inner surface diffusion film 204b in the illumination lamp 1. In the second modification, the outer surface diffusion film 204a includes the plurality of diffusion materials 7, so that the heat conduction particles 5a can maintain high thermal conductivity and can further increase the light diffusibility. There is an effect.

(Third Modification)
Next, an illumination lamp 300 according to a third modification of the first embodiment will be described. FIG. 7 is a side sectional view showing an illumination lamp 300 according to a third modification. As shown in FIG. 7, in the third modification, in the diffusion film 304 of the diffusion cover 302, the outer surface diffusion film 304 a includes the diffusion material 7, the cavity 8, and the heat conductive particles 5 a, and the inner surface diffusion film 304 b also includes , A diffusing material 7, a cavity 8, and a heat conducting particle 5 a. In the third modified example, both the outer surface diffusion film 304a and the inner surface diffusion film 304b include the diffusing material 7, the cavity 8, and the heat conduction particles 5a, so that the heat conductivity is further increased by the heat conduction particles 5a. At the same time, the diffusion material 7 and the cavity 8 further improve the light diffusibility.

  And since the inner surface diffusion film 304b provided with the heat conductive particles 5a is formed on the cover body 3, the area in contact with the adhesive 12c that bonds the heat sink 12 and the diffusion cover 2 is increased, and the adhesion is improved. . Thereby, the heat transferability from the adhesive 12c to the cover body 3 is improved. For this reason, the heat generated from the light emitting unit 11 can be efficiently transmitted to the diffusion cover 2. Then, the heat transmitted to the diffusion cover 2 is transmitted to the outer surface diffusion film 304 a and is radiated to the outside of the illumination lamp 300. As described above, in the third modification example, both the outer surface diffusion film 304a and the inner surface diffusion film 304b are provided with the heat conductive particles 5a. Therefore, the heat dissipation effect of radiating the heat generated from the light emitting unit 11 to the outside is extremely high. high.

(Lighting device 30)
Next, the illuminating device 30 of this Embodiment 1 is demonstrated. FIG. 8 is a perspective view showing the illumination device 30 according to the first embodiment. As shown in FIG. 8, the illumination device 30 includes the illumination lamp 1 having a straight tube shape according to the first embodiment, and the luminaire 20 to which the illumination lamp 1 is attached. The lighting fixture 20 includes, for example, a main body 21 that is attached to the ceiling of a room and extends in the longitudinal direction (the direction of the arrow Y), and sockets 22 that are formed at both ends of the main body 21.

  The both ends of the lighting lamp 1 are inserted into the socket 22 and attached to the lighting fixture 20. At that time, the power supply terminal 13 a of the power supply base 13 is connected to the terminal of the socket 22, and the ground terminal 14 a of the ground base 14 is connected to the terminal of the socket 22. This illuminating device 30 includes an illuminating lamp 1 having a straight tube shape. The illuminating device 30 illuminates a room by being attached to the ceiling of the room, for example.

Embodiment 2. FIG.
Next, the illumination lamp 400 according to the second embodiment will be described. FIG. 9 is a side sectional view showing an illumination lamp 400 according to the second embodiment. The second embodiment is different from the first embodiment in that the heat conductive material 5 is a heat conductive diffusion material 5b. In the second embodiment, portions common to the first embodiment are denoted by the same reference numerals, description thereof is omitted, and differences from the first embodiment will be mainly described.

  As shown in FIG. 9, the diffusion film 404 in the diffusion cover 402 includes an outer surface diffusion film 404 a formed on the outer wall surface 3 a of the cover body 3 and an inner surface diffusion film 404 b formed on the inner wall surface 3 b of the cover body 3. I have. The outer surface diffusion film 404a is configured by a base material 6 to which a plurality of cavities 8 and a heat conductive material 5 are added. In the second embodiment, the heat conductive material 5 is a heat conductive diffusion material 5b. . The heat conducting diffusion material 5b is obtained by applying heat conduction processing to the surface of the diffusing material 7, thereby allowing light to diffuse and efficiently transferring heat. Examples of the heat conduction processing include metal deposition. Thus, in the outer surface diffusion film 404a, the diffusion media for diffusing light are the cavity 8 and the heat conduction diffusion material 5b. The configuration of the inner surface diffusion film 404b is the same as that in the first embodiment.

  As described above, in the second embodiment, the outer surface diffusion film 404a includes the heat conductive diffusion material 5b. For this reason, even if the heat generated from the light emitting unit 11 is transmitted to the diffusion cover 2, the heat is efficiently transmitted through the outer surface diffusion film 404a and radiated to the air. Further, since the heat conducting diffusion material 5b has light diffusibility, the light can be sufficiently diffused together with the cavity 8 in the outer surface diffusion film 404a. As described above, in the second embodiment, in the outer surface diffusion film 404a, it is possible to maintain high thermal conductivity by the heat conductive diffusion material 5b and to further improve the light diffusibility.

  Note that the illumination lamp 400 according to the second embodiment can be appropriately changed to a configuration such as the first modification, the second modification, and the third modification as the illumination lamp 1 according to the first embodiment. It is.

Embodiment 3 FIG.
Next, the illumination lamp 500 according to the third embodiment will be described. FIG. 10 is a side sectional view showing an illumination lamp 500 according to the third embodiment. The third embodiment is different from the first embodiment in that the outer surface diffusion film 504a in the diffusion film 504 has a two-layer structure instead of a one-layer structure. In the third embodiment, portions common to the first embodiment are denoted by the same reference numerals, description thereof is omitted, and differences from the first embodiment will be mainly described.

  As shown in FIG. 10, in the third embodiment, the outer surface diffusion film 504a in the diffusion cover 502 includes a layer in which the cavities 8 and the heat conductive particles 5a are added to the base material 6, and the cavities 8 and the heat conductive diffusion material 5b. Is composed of a layer added to the substrate 6. Thus, even if the outer surface diffusion film 504a has a two-layer structure, the same effect as that of the one-layer structure can be obtained. The outer surface diffusion film 504a can have a multilayer structure of three or more layers. In addition, this can similarly have a multilayer structure in the inner surface diffusion film 504b.

  In addition, the third embodiment includes both the heat conductive particles 5a and the heat conductive diffusion material 5b as the heat conductive material 5 in the outer surface diffusion film 504a. For this reason, it has the extremely high heat conductivity by the heat conductive granular material 5a and the heat conductive diffusion material 5b, and also has the effect that the diffusibility of light can be improved further. The heat conductive particles 5a and the heat conductive diffusion material 5b are not only provided separately in layers, but both the heat conductive particles 5a and the heat conductive diffusion material 5b are added to the substrate 6 in the same layer. May be.

  Note that the illumination lamp 400 according to the second embodiment can be appropriately changed to a configuration such as the first modification, the second modification, and the third modification as the illumination lamp 1 according to the first embodiment. It is.

Embodiment 4 FIG.
Next, the illumination lamp 600 according to the fourth embodiment will be described. FIG. 11 is a front view showing an illumination lamp 600 according to the fourth embodiment. The fourth embodiment is different from the first embodiment in that the diffusion cover 602 has a bulb globe shape and is a bulb-shaped illumination lamp 600. In the fourth embodiment, portions common to the first embodiment are denoted by the same reference numerals, description thereof is omitted, and differences from the first embodiment will be mainly described.

  As shown in FIG. 11, the illumination lamp 600 includes a diffusion cover 602, a housing 610, and a base 611. Among these, the housing | casing 610 is provided with the metal housing | casing part 610a and the resin housing | casing part 610b.

  The configuration of the diffusion cover 602 is the same as that of the diffusion cover 602 in the first embodiment except for the shape, and is different from the first embodiment in that the shape is a dome shape. The diffusion cover 602 is fitted to one end of a cylindrical metal casing 610a, and a plurality of heat radiating fins are formed on the metal casing 610a. One end of a cylindrical resin casing 610b is fitted to the other end of the metal casing 610a. The resin casing 610b includes a metal casing 610a, a base 611, Is to insulate. Further, one end of a cylindrical base 611 is fitted to the other end of the resin casing 610b, and a base terminal 611a is formed at the other end of the base 611. And the light emission part (not shown) accommodated in the inside of the illumination lamp 600 is supplied with power from the external power source through the cap terminal 611a.

  As described above, the diffusion cover 602 according to the fourth embodiment has the same configuration as that of the first embodiment except for the shape. For this reason, even in the light bulb-shaped illumination lamp 600 as in the fourth embodiment, the extremely high heat dissipation effect obtained in the first embodiment can be obtained.

(Lighting device 630)
Next, the illuminating device 630 of this Embodiment 4 is demonstrated. FIG. 12 is a front view showing illumination device 630 according to Embodiment 4. As shown in FIG. 12, the illumination device 630 includes a light bulb-shaped illumination lamp 600 including a diffusion cover 602 that has the shape of a light bulb according to Embodiment 4, and a lighting fixture 620 to which the illumination lamp 600 is attached. It has. The lighting fixture 620 is provided on the ceiling of a room, for example, and includes a fixture mounting portion 621, a fixture body 622, a socket 623, and a reflector 624.

  The ceiling fixture mounting portion 621 is provided with a hole of a size that can store the illumination lamp 600, and this is a fixture body 622. The appliance main body 622 is provided with a socket 623 to which the illumination lamp 600 is attached at the back. By attaching the base 611 of the illumination lamp 600 to the socket 623, the illumination lamp 600 is attached to the appliance main body 622. Installed. A dome-shaped reflector 624 for reflecting light emitted from the illumination lamp 600 is provided on the inner wall of the instrument body 622.

  As described above, the illumination lamp 600 according to Embodiment 4 can be installed on the ceiling and used as the illumination device 630 for the ceiling, but can also be used as another illumination device 630. For example, it can be used as a lighting device 630 that is installed on a desk and illuminates the desk.

  DESCRIPTION OF SYMBOLS 1 Illumination lamp, 2 Diffusion cover, 3 Cover main body, 3a Outer wall surface, 3b Inner wall surface, 4 Diffusion film, 4a Outer surface diffusion film, 4b Inner surface diffusion film, 5 Thermal conductive material, 5a Thermal conduction particle, 5b Thermal conduction diffusion Material, 6 base material, 7 diffusing material, 8 cavity, 10 light source module, 11 light emitting part, 11a LED, 11b substrate, 12 heat sink, 12a flat part, 12b arc part, 12c adhesive material, 13 feeding base, 13a feeding terminal, 13b Power supply base case, 14 ground base, 14a ground terminal, 14b ground base case, 20 lighting fixture, 21 body part, 22 socket, 30 lighting device, 100 lighting lamp, 102 diffusion cover, 104 diffusion film, 104a outer surface diffusion Membrane, 104b Internal diffusion film, 200 Illumination lamp, 202 Diffusion cover, 204 Diffusion film, 204a Outside Surface diffusion film, 204b inner surface diffusion film, 300 illumination lamp, 302 diffusion cover, 304 diffusion film, 304a outer surface diffusion film, 304b inner surface diffusion film, 400 illumination lamp, 402 diffusion cover, 404 diffusion film, 404a outer surface diffusion film, 404b inner surface Diffusion film, 500 illumination lamp, 502 diffusion cover, 504 diffusion film, 504a outer diffusion film, 504b inner diffusion film, 600 illumination lamp, 602 diffusion cover, 610 casing, 610a metal casing, 610b resin casing, 611 Base part, 611a Base terminal, 620 Lighting fixture, 621 Instrument mounting part, 622 Instrument body, 623 Socket, 624 reflector, 630 Lighting device.

Claims (15)

A light-transmitting cover body in which the light emitting unit is accommodated;
A diffusion cover provided on the cover main body and diffusing light emitted from the light emitting portion and including a heat conductive material. The diffusion cover according to claim 1, wherein the diffusion film is obtained by adding the thermally conductive substance to a base material. The diffusion cover according to claim 2, wherein the diffusion film is obtained by adding a diffusion material that diffuses light emitted from the light emitting portion to the base material. The base material in the diffusion film is:
The diffusion cover according to claim 2, further comprising a cavity for diffusing light emitted from the light emitting unit. The thermally conductive material is
The diffusion cover according to any one of claims 1 to 4, wherein the diffusion cover has thermal conductive particles having thermal conductivity. The thermally conductive material is
The diffusion cover according to any one of claims 1 to 5, further comprising a heat conductive diffusion material having a surface subjected to heat conductive processing. The light emitting unit
It is housed in the cover body in a state of being placed on the heat conducting member,
The diffusion film is
The diffusion cover according to any one of claims 1 to 6, wherein the diffusion cover is formed in a portion where the cover main body and the heat conducting member are in contact with each other. The diffusion film is
The diffusion cover according to claim 1, further comprising an outer surface diffusion film formed on an outer wall surface of the cover body. The diffusion film is
The diffusion cover according to claim 1, further comprising an inner surface diffusion film formed on an inner wall surface of the cover body. The light emitting unit;
An illuminating lamp comprising: the diffusion cover according to claim 1. The illumination lamp according to claim 10, wherein the diffusion cover has a shape of a straight pipe. The illumination lamp according to claim 10, wherein the diffusion cover has a shape of a bulb globe. The illumination lamp according to any one of claims 10 to 12,
A lighting apparatus to which the illumination lamp is attached. Adding a diffusion material and a thermally conductive material to the substrate;
Applying the base material liquefied with a solvent to a light-transmitting cover body;
And a step of drying and curing the base material to form a diffusion film including the diffusion material and the heat conductive material on the cover body. Adding a thermally conductive material to the substrate;
Applying the base material liquefied with a solvent to a light-transmitting cover body;
Drying and curing the base material to form a cavity for diffusing light in the base material, and forming a diffusion film including the thermally conductive material on the cover body. A method for manufacturing a diffusion cover.

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