JP2015213975A - Workpiece machining method and machining device as well as joint unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a workpiece machining method in which an ingot for manufacturing a substrate of an electron device, etc., is used as a workpiece, and the workpiece can be machined by few manufacturing processes without grinding the end face thereof.SOLUTION: A first main spherical joint 1a is stuck while being positioned in a reference axis O in one end face of a workpiece W, and a second main spherical joint 1b is stuck while being positioned in the reference axis O in the other end face of the workpiece W. A first sub-spherical joint 11a swingably coming into contact with the main spherical joint 1a is provided in a first rotation shaft 21a, and a second sub-spherical joint 11b swingably coming into contact with the main spherical joint 1b is provided in a second rotation shaft 21b. While the workpiece W is rotated by the rotation shafts 21a, 21b, an outer circumferential surface of the workpiece W is subjected to the grinding work in parallel to the reference axis O by a grinding wheel.

Description

  The present invention relates to a workpiece processing technique in which an ingot made of a brittle material such as sapphire is used as a workpiece, and an outer peripheral surface of the workpiece is processed based on a crystal orientation axis without grinding an end surface of the workpiece.

  Single crystal sapphire is used as a substrate for LEDs of blue and white, a polarizer holding substrate for liquid crystal projectors, and a substrate for electronic devices. Single crystal silicon is used as a substrate for electronic devices such as semiconductor integrated circuits. The above-described substrate made of a brittle material such as sapphire is manufactured from an ingot manufactured in a cylindrical shape. For example, the manufacturing process of the sapphire substrate includes a process of manufacturing an ingot of sapphire and a crystal orientation axis of the ingot as described in Patent Document 1, and both end faces of the ingot are crystal orientation axes, that is, C-axis or Cutting and grinding the end face of the ingot so as to be perpendicular to the OFF axis. The ingot is further processed with an orientation flat, that is, OF, on the outer peripheral surface of the ingot so that the crystal orientation can be determined in a step of grinding the outer peripheral surface with the crystal orientation axis as a central axis, and a subsequent step.

  The ingot in which the outer peripheral surface is ground and the OF is processed is cut from the ingot by wire cutting, that is, slicing, into a plane perpendicular to the crystal orientation axis. A large number of sapphire substrates are manufactured using the cut wafer. Such a manufacturing process is the same when a silicon substrate is manufactured.

JP 2013-84688 A

  In order to grind the outer peripheral surface of the ingot with the crystal orientation axis as the central axis, the ingot is rotated by rotating shafts that are abutted against both end surfaces of the ingot. For this reason, conventionally, prior to grinding the outer peripheral surface of both end faces of the ingot, the end faces of the ingot are cut and ground so that the both end faces of the ingot are perpendicular to the crystal orientation axis. The ingot is rotated against the tip of the rotating shaft.

  The sapphire ingot has a crystal orientation axis or an OFF axis inclined with respect to the crystal orientation axis as a reference axis, and after cutting both end faces and grinding both end faces so as to be perpendicular to the reference axis The outer peripheral surface is ground. Further, when slicing, the ingot is positioned so that the ingot is in a predetermined position on the slicing machine with the reference axis as the central axis.

  Thus, conventionally, the step of cutting and grinding the end face of the ingot perpendicularly to the crystal orientation axis as a reference axis, and the end face of the ingot perpendicular to the axis inclined with respect to the crystal orientation axis as a reference axis Cutting and grinding. In other words, the crystal orientation axis is used as a reference axis, or an axis tilted with respect to this is used as a reference axis. In any case, an axis based on the crystal orientation axis is used as a reference axis. By using it as a shaft, centering processing such as grinding of the outer peripheral surface is performed.

  For this reason, in order to process an ingot of a brittle material such as sapphire as a workpiece, that is, a workpiece, it is inevitable to cut and further grind the end surface of the workpiece. The grinding process takes time, and the processing efficiency of the workpiece for manufacturing the substrate cannot be improved.

  An object of the present invention is to make an ingot for manufacturing a substrate such as an electronic device a workpiece, and the workpiece can be processed by a small number of manufacturing steps without grinding the end face.

  The workpiece machining method of the present invention is a workpiece machining method in which a workpiece is machined using a reference axis set by a crystal orientation axis of a cylindrical workpiece as a centering axis, and is positioned on the reference axis on one end surface of the workpiece. A first main spherical joint, and a joint affixing step of attaching the second main spherical joint to the other end surface of the workpiece and the second main spherical joint; and swingable to the first main spherical joint A first rotary shaft provided with a first sub-spherical joint to be in contact; a second sub-spherical joint provided in a swingable contact with the second main spherical joint; and the first rotary shaft; A workpiece supporting step of supporting the workpiece in a state in which the reference axis and the rotation center of each of the rotating shafts coincide with each other by a second rotating shaft arranged coaxially; Rotate by rotating shaft , Having a grinding step in parallel to grinding the outer peripheral surface of the workpiece to the reference axis by the grinding wheel.

  A workpiece machining apparatus according to the present invention is a workpiece machining device for machining a workpiece with a reference axis set by a crystal orientation axis of a cylindrical workpiece as a centering axis, and the workpiece is machined on one end surface of the workpiece with the crystal orientation axis. A first rotating shaft provided with a first sub-spherical joint that swingably contacts the first main spherical joint that is positioned and pasted, and the other end face of the workpiece that is positioned on the reference axis and pasted A second rotary shaft provided with a second sub-spherical joint that swingably contacts the attached second main spherical joint, the center of the reference axis of the workpiece and the first and second rotary shafts And a grinding wheel that grinds the outer peripheral surface of the workpiece in parallel to the reference axis in a state where the shaft is aligned and the workpiece is rotated by each of the rotating shafts.

  The joint unit of the present invention has a first shaft pressed against one end surface of the workpiece and a center of the second shaft pressed against the other end surface with a reference axis set by the crystal orientation axis of the cylindrical workpiece as a centering axis. A joint unit for setting a shaft and the reference axis to coincide with each other, wherein the first main spherical joint is attached to one end surface of the work piece so as to be positioned on the reference shaft, and the reference surface is attached to the other end face of the work piece. A second main spherical joint to be affixed on the shaft, a first subspherical joint provided at a tip of the first shaft and in contact with the first main spherical joint, and the second shaft A second sub-spherical joint that is in contact with the second main spherical joint, and the central axis is in a state where both end faces of the workpiece are not perpendicular to the reference axis. And the reference axis To.

  The shaft that presses the end face of the work to process the work is provided with a secondary spherical joint that comes into contact with the main spherical joint that is affixed to the end face of the work. When the shaft is pressed through the joint unit consisting of the workpiece, the workpiece is centered so that the central axis of the shaft is coaxial with the reference axis set based on the crystal orientation axis. By performing various processes such as processing of the outer peripheral surface in the centered state, the other surface of the workpiece can be processed using a joint unit without processing at right angles to the reference axis. it can. Thereby, the process of processing the end surface of a workpiece | work becomes unnecessary, and board | substrates, such as an electronic device, can be efficiently manufactured by few manufacturing processes by using an ingot as a workpiece | work.

(A)-(E) are process drawings which show the processing method for grinding a workpiece outer peripheral surface. (A) is a top view of the workpiece | work which shows the processing method for cutting a workpiece | work into a thin piece with a fixed space | interval, (B) is a front view of (A), (C) is 2B- in (B). It is 2B line sectional drawing. (A)-(D) are process drawings which show the grinding method of the conventional workpiece outer peripheral surface shown as a comparative example. It is a perspective view which shows the processing apparatus of the workpiece | work for affixing a main spherical joint on the both end surfaces of a workpiece | work. FIG. 5 is a front view of FIG. 4. It is a partially cutaway left view of FIG. FIG. 7 is an enlarged cross-sectional view of the indexing table shown in FIGS. 4 to 6. It is a partially cutaway front view which shows one of the two sticking heads shown by FIG. It is an expanded sectional view of the A section shown in FIG. It is a block diagram which shows the control circuit of the processing apparatus shown by FIGS. It is a perspective view which shows the processing apparatus of the workpiece | work for grinding the outer peripheral surface of a workpiece | work. It is a front view of FIG. FIG. 13 is a plan view of FIG. 12. It is a perspective view which shows the workpiece | work processing apparatus for detecting the inclination angle of the workpiece | work support plate fixed to the workpiece | work and the reference | standard axis | shaft of a workpiece | work.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a processing method in which an ingot made of sapphire, which is a brittle material, is used as a work W and the outer peripheral surface of the work W is ground. The sapphire ingot as the workpiece W is formed into a cylindrical shape by an ingot manufacturing technique such as the EFG method. As shown in FIG. 1A, the workpiece W pulled up from the crucible has its both end faces E1, E2 not perpendicular to the C axis, that is, the crystal orientation axis C.

  If the end faces E1 and E2 of the workpiece W are not perpendicular to the crystal orientation axis C, the workpiece W cannot be rotated by pressing the grinding shaft directly against the end faces E1 and E2 as in the prior art. This is because when the outer peripheral surface of the workpiece W is ground or when the workpiece W is sliced to cut the sapphire wafer, the center axis of the shaft pressed against the end surface of the workpiece and the crystal orientation axis C coincide with each other. This is because it is necessary to center the workpiece. For this reason, the end surface of the workpiece W is cut and further ground so that the end surfaces E1 and E2 are perpendicular to the crystal orientation axis C. However, it takes time to grind the end face, and the machining efficiency of the workpiece cannot be improved.

  Therefore, without grinding the end face of the work W, that is, even if the end face of the work W is inclined with respect to the crystal orientation axis C as the reference axis O, the work W In order to perform the centering process, as shown in FIG. 1B, the first end surface E1 is formed on the one end face E1 without performing the grinding process while cutting both ends of the workpiece W which is lifted from the crucible. 1 main spherical joint 1a is attached, and the second main spherical joint 1b is attached to the other end face E2. In each of the main spherical joints 1a and 1b, the crystal orientation axis C is set as a reference axis, that is, the central axis O, and the centers of the main spherical joints 1a and 1b coincide with the central axis O in the joint attaching process shown in FIG. In this way, it is positioned on the central axis O and is attached to the end surface of the workpiece W.

  FIG. 1C shows a state in which the workpiece W is arranged in a processing apparatus for grinding the outer peripheral surface of the workpiece W. This figure shows the tip portions of the first and second rotary shafts 21a and 21b in the processing apparatus. Both rotary shafts 21a and 21b are arranged coaxially and are slidable in the axial direction. A first secondary spherical joint 11a is provided at the tip of the first rotating shaft 21a, and the secondary spherical joint 11a is in contact with the main spherical joint 1a so as to be swingable. Further, a second secondary spherical joint 11b is provided at the tip of the second rotating shaft 21b, and this secondary spherical joint 11b contacts the main spherical joint 1b in a swingable manner.

  As shown in FIG. 1C, the main spherical joints 1a and 1b have a joint piece member 3. The joint piece member 3 is provided with a sticking surface 4 at one end face and an opening face 5 at the other end face. Is provided. A spherical concave surface 6 is formed in the joint piece member 3 so as to open to the opening surface 5. In the main spherical joints 1a and 1b, the affixing surface 4 is affixed to the end surfaces E1 and E2 of the workpiece W by an adhesive. On the other hand, the sub-spherical joints 11a and 11b have a sphere 7 and a part of the sphere 7 protrudes from the tip end portions of the rotary shafts 21a and 21b. When the spherical body 7 of the secondary spherical joints 11a and 11b is brought into contact with the concave surface 6 of the main spherical joints 1a and 1b, the main spherical joints 1a and 1b come into contact with the secondary spherical joints 11a and 11b in a swingable manner by spherical contact. To do.

  Therefore, as shown in FIG. 1C, when the rotary shafts 21a and 21b are moved toward the workpiece W in a state where the workpiece W is disposed between the rotary shafts 21a and 21b, As shown in FIG. 1D, the work is supported in a state where the rotation center axes of the rotation shafts 21a and 21b arranged coaxially and the center axis O of the work W coincide with each other. Even if the center axis O of the workpiece W is disposed in an inclined state with respect to the rotation center axes of the rotary shafts 21a and 21b, when the workpiece W is pressed in the axial direction by the rotary shafts 21a and 21b, FIG. In the work support process shown in FIG. 6, the center axis O of the work W automatically coincides with the rotation center axes of the rotary shafts 21a and 21b by the sliding contact between the spherical body 7 and the concave surface 6, that is, the sliding contact. In FIG. 1D, the state where the outer peripheral surface of the workpiece W is inclined with respect to the central axis O which is the crystal orientation axis is exaggerated.

  FIG. 1E shows a state in which the outer peripheral surface of the workpiece W is ground by a processing device for grinding. In this grinding step, when the outer peripheral surface is ground, the end surfaces E1 and E2 are not perpendicular to the central axis O, but the outer peripheral surface is parallel to the central axis O. Accordingly, when the main spherical joints 1a and 1b are attached to the end faces of the workpiece and the secondary spherical joints 11a and 11b attached to the tips of the rotating shafts 21a and 21b for grinding are pressed against the main spherical joints 1a and 1b, Without cutting the end faces E1 and E2 at right angles to the crystal orientation axis C, the work outer peripheral surface and the crystal orientation axis C as the reference axis can be made parallel.

  FIG. 2 shows a cutting method for cutting a sapphire wafer by cutting a workpiece W whose outer peripheral surface is ground into thin pieces at regular intervals. Prior to this cutting process, an orientation flat OF is ground on the outer peripheral surface of the workpiece W, and a workpiece support plate P is attached to the OF surface. A cutting device such as a multi-wire saw or a peripheral blade type cutting machine is used as a processing device for cutting. This processing apparatus has a first fixed shaft 22a for fixing the workpiece W and a second fixed shaft 22b arranged coaxially therewith, and a cutting tool such as an outer peripheral grindstone or a wire is cut. Provided in the apparatus.

  Secondary spherical joints 12a and 12b are provided at the ends of the fixed shafts 22a and 22b. Each of the secondary spherical joints 12a and 12b has a sphere 7 like the secondary spherical joints 11a and 11b shown in FIG. By moving at least one of the two fixed shafts 22a and 22b in the axial direction, the secondary spherical joints 12a and 12b come into contact with the main spherical joints 1a and 1b, respectively. Thus, the workpiece fixing step of pressing the fixed shafts 22a and 22b toward the workpiece W brings the workpiece W into a state where the reference axis of the workpiece W and the central axis of the fixed shafts 22a and 22b coincide with each other. , 22b. Therefore, when the workpiece W whose outer peripheral surface is ground is cut into a thin piece, that is, a wafer, the main spherical joints 1a and 1b attached to the end surfaces E1 and E2 for grinding the outer peripheral surface are used for cutting as they are. Can be used. The workpiece W is cut into thin pieces at regular intervals along the reference axis C, as indicated by a dashed line in FIG. By this cutting step, the workpiece W is cut so that the cut surface is in a direction perpendicular to the reference axis C. 2A and 2B, the cut surface is indicated by a two-dot chain line D.

  Prior to this cutting, when the orientation flat OF is ground on the outer peripheral surface of the workpiece W, the main spherical joints 1a and 1b attached to the end surfaces E1 and E2 are used as they are to grind the outer peripheral surface. Thus, it can be used for grinding the OF surface. Accordingly, a sub-spherical joint is attached to the tip of the shaft of the grinding apparatus for grinding the OF surface.

  Depending on the type of workpiece, after grinding the outer peripheral surface parallel to the crystal orientation axis C, the outer peripheral surface parallel to the so-called OFF angle inclined with respect to the crystal orientation axis C may be further ground. . In this case, the OFF angle with respect to the crystal orientation axis C is measured, the reference axis O is set based on the crystal orientation axis C, the outer peripheral surface is ground using the reference axis O as a centering axis, and the workpiece is cut. Etc. are performed. As described above, there are processing using the crystal orientation axis C as the reference axis O and processing using the axis inclined by the OFF angle with respect to the crystal orientation axis C as the reference axis O. In either case, the reference axis O is the crystal. The azimuth axis C is set based on this.

  FIG. 3 is a process diagram showing a conventional grinding method for the outer peripheral surface of a workpiece shown as a comparative example. 3A, similarly to FIG. 1A, both end faces E1 and E2 of the workpiece W that is pulled up from the crucible and cut at both end faces are not perpendicular to the crystal orientation axis C. Indicates the state. Conventionally, as shown in FIG. 3B, both end portions F1 and F2 are cut, and end faces G1 and G2 which are perpendicular to the crystal orientation axis C are ground and finished. After grinding the end faces G1 and G2, as shown in FIG. 3C, the front end surfaces of the rotary shafts 10a and 10b of the grinding apparatus are abutted against the end faces G1 and G2 of the workpiece W, and the outer peripheral surface is ground. ing. FIG. 3D shows a state where the outer peripheral surface has been ground.

  As described above, when the outer peripheral surface is ground after the end surface is cut and further ground, it takes time to grind the end surface in order to obtain the perpendicularity of the end surfaces G1 and G2, thereby improving the work efficiency of the workpiece. There is a limit. On the other hand, when a machining method using a spherical joint is employed, the outer peripheral surface of the workpiece can be efficiently machined in a short time without grinding both end faces.

  4 to 9 show a workpiece processing apparatus for attaching the main spherical joints 1a and 1b described above to the end surfaces E1 and E2 of the workpiece W. FIG. The workpiece processing device 30 constitutes a joint member pasting device for pasting the main spherical joint to the end surface of the workpiece W as a pre-processing prior to grinding the outer peripheral surface of the workpiece.

  The workpiece processing apparatus 30 includes first and second sticking heads 31a and 31b, and the sticking heads 31a and 31b are guided by guide rails 32a and 32b so as to freely reciprocate in the horizontal direction. . The guide rails 32a and 32b extend in the longitudinal direction at both end portions of the sticking base 33 with a central portion in the longitudinal direction of the sticking base 33 as a processing machine bed. Both the pasting heads 31a and 31b are opposed to each other, and vertical movement blocks 34a and 34b are mounted on the opposing surfaces so as to be movable up and down. The vertical movement block 34a is provided with a first reciprocating shaft 23a for attaching the main spherical joint 1a to one end surface of the work W. The vertical movement block 34b has a main spherical surface on the other end face of the work W. A second reciprocating shaft 23b for attaching the joint 1b is provided.

  The sticking base 33 is provided with a guide rail 35 that is positioned between the guide rails 32a and 32b and extends in a direction perpendicular to the guide rails 32a and 32b. A slide table 36 is provided on the guide rail 35 so as to be movable in the horizontal direction. As shown in FIGS. 5 and 6, a turntable 37 is mounted on the slide table 36 so as to be rotatable about the vertical axis V. An index table, that is, an indexing table 38 is attached to the turntable 37. As shown in FIGS. 6 and 7, the indexing table 38 includes a horizontal plate 38 a and a vertical plate 38 b integrated with the horizontal plate 38 a, and the vertical plate 38 b has a turntable 39 that rotates around a horizontal axis H. Is pivotably mounted. The turntable 39 is provided with a work support base 41 that supports the work W. As shown in FIG. 6, the work support base 41 includes a horizontal plate 41 a and a vertical plate 41 b integrated with the horizontal plate 41 a, and the vertical plate 41 b is attached to the turntable 39.

  As shown in FIGS. 4 and 5, joint holders 42 a and 42 b are attached to both ends of the slide table 36, and each joint holder 42 a and 42 b is a main spherical surface that is attached to the end surface of the workpiece W. The joints 1a and 1b are held. FIG. 5 shows a state where the main spherical joints 1a and 1b are loaded in the respective joint holders 42a and 42b. The main spherical joints may be loaded into the joint holders 42a and 42b manually by the operator or automatically by the transport device.

  The slide table 36 is located between a workpiece mounting position where the main spherical joints 1a and 1b are loaded into the joint holders 42a and 42b, and a workpiece attaching position between the reciprocating shafts 23a and 23b. Move horizontally. In order to move the slide table 36 horizontally between the workpiece mounting position and the workpiece attaching position, as shown in FIG. 6, an electric motor 43 is attached to the attaching base 33. The feed screw 44 driven by the electric motor 43 is screwed to a nut incorporated in the drive block 45, and the drive block 45 is attached to the slide table 36.

  In order to rotate the turntable 37 around the vertical axis V, an electric motor 46 is attached to the slide table 36 as shown in FIG. 6 and FIG. The index table 38 is pivotally driven about the vertical axis V by the turntable 37. As shown in FIGS. 6 and 7, an electric motor 47 is attached to the vertical plate 38 b of the indexing table 38 in order to turn the work support base 41 around the horizontal axis H. Thus, the work support base 41 is driven to turn about the horizontal axis H.

  A V block 48 that supports the workpiece W is attached to the workpiece support base 41. The workpiece W is loaded into the V block 48 manually or by a transfer device. As shown in FIG. 6, a clamp member 49 is mounted on the vertical plate 38 b of the indexing table 38 so as to be movable toward and away from the V block 48, and the workpiece W is fixed by the V block 48 and the clamp member 49. Is done. In order to reciprocate the clamp member 49, an electric motor 51 is attached to the vertical plate 38 b, and a feed screw 52 driven by the electric motor 51 is screwed to a nut incorporated in the drive block 53, The drive block 53 is attached to the clamp member 49.

  As shown in FIG. 5, electric motors 54a and 54b are attached to the sticking base 33 to reciprocate the sticking heads 31a and 31b in the axial direction along the guide rails 32a and 32b. A feed screw (not shown) driven by the electric motor 54a is screwed to the pasting head 31a, and a feed screw (not shown) driven by the electric motor 54b is screwed to the pasting head 31b. Each of the electric motors 54a and 54b constitutes a shaft driving member for moving the reciprocating shafts 23a and 23b closer to each other. The electric motors 54a and 54b are not shown in FIG.

  In order to drive the vertical movement blocks 34a, 34b provided in the respective sticking heads 31a, 31b in the vertical direction, the sticking heads 31a, 31b are provided with electric motors 55a, 55b as shown in FIGS. Is attached. A feed screw (not shown) driven by the electric motor 55a is screwed to the vertical movement block 34a, and a feed screw (not shown) driven by the electric motor 55b is screwed to the vertical movement block 34b. The vertical positions of the reciprocating shafts 23a and 23b are set by the respective electric motors 55a and 55b.

  In order to position the work W arranged on the V block 48 and detect the position of the end face according to the length of the work W, position detection rods 56a and 56b are respectively attached to the sticking heads as shown in FIG. It is attached to 31a, 31b. Each position detection rod 56a, 56b can be moved toward and away from the workpiece W by an actuator such as an electric motor (not shown). When the position detection rods 56a and 56b are moved forward, the workpiece W is positioned at the center position in the longitudinal direction of the V block 48 of the workpiece support base 41, and based on the protruding length of the position detection rods 56a and 56b. The position of the end face of the workpiece W is detected.

  The work support table 41 can be swung or tilted in two axes by the swivel movement about the horizontal axis H of the work support base 41 and the swivel movement about the vertical axis V of the index table 38. . Further, the work support base 41 is horizontally movable in the radial direction of the reciprocating shafts 23 a and 23 b by the lateral movement of the slide table 36. Therefore, by turning the work support base 41 in the biaxial direction and moving the slide table 36 horizontally, the crystal orientation axis of the work W can be set to the same axis as the central axes of the reciprocating shafts 23a and 23b. .

  The outer diameter of the workpiece W and the direction of the crystal orientation axis are measured in advance, and the measurement data is stored in the memory of the control unit for driving each electric motor described above. Therefore, by driving each electric motor based on the measurement data, when the workpiece W positions its crystal orientation axis at the position of the center axis of both reciprocating shafts 23a and 23b, the crystal orientation axis is the center axis. And can be positioned at the same coaxial position.

  A first sub-spherical joint 13a that contacts the main spherical joint 1a is provided at the tip of the reciprocating shaft 23a, and a second sub-spherical surface that contacts the main spherical joint 1b is provided at the tip of the reciprocating shaft 23b. A joint 13b is provided. As shown in FIGS. 8 and 9, the secondary spherical joint 13b has a sphere 7, and the sphere 7 is held by an annular retainer 57 fixed to the distal end surface of the reciprocating shaft 23b by a screw member. Has been. An attachment hole 58 is formed in the sphere 7, and the sphere 7 is fixed to the reciprocating shaft 23 b by a screw member 59 that passes through the attachment hole 58. The spherical body 7 of the secondary spherical joint 13b contacts the concave surface 6 of the main spherical joint 1b.

  In order to attract the main spherical joint 1b to the secondary spherical joint 13b with the spherical body 7 in contact with the concave surface 6, the reciprocating shaft 23b has a vacuum channel as shown in FIGS. 61 is formed, and the vacuum channel 61 communicates with the inside of the concave surface 6 of the main spherical joint 1b through a communication hole 62 formed in the sphere 7. An annular seal member 63 is provided on the retainer 57 in order to seal between the opening surface 5 and the sub-spherical joint 13b. In order to supply vacuum, that is, negative pressure air, to the vacuum flow path 61 from the outside, as shown in FIG. 8, a joint member 64 is provided in the vertical movement block 34b, and the joint member 64 has a vacuum (not shown). A pipe connected to the source is connected. Thus, the vacuum flow path 61 and the like constitute a vacuum supply mechanism for adsorbing the main spherical joints 1a and 1b to the auxiliary spherical joints 13a and 13b. 8 and 9 show the reciprocating shaft 23b provided in the sticking head 31b, but the reciprocating shaft 23a provided in the other sticking head 31a has the same structure.

  As shown in FIG. 9, the main spherical joints 1a and 1b attached to the end face of the workpiece W, and the reciprocating shafts 23a and 23b, which are shafts for centering and supporting the workpiece W, are mounted on the secondary spherical surface. A joint unit U is formed by the joints 13a and 13b. As long as the joint unit U is in a oscillating contact with each other around the center point of the spherical surface, a joint member having a sphere 7 is used as a main spherical joint, such as the secondary spherical joints 13a and 13b, and the main spherical joint 1a. , 1b, the joint member having the joint piece member 3 in which the concave surface 6 is formed may be used as the sub-spherical joints 13a and 13b. However, as a member to be attached to the end face of the workpiece W, it is preferable that the member not provided with the sphere 7 is lighter, so that the member is attached to the workpiece W.

  FIG. 10 is a block diagram showing a control circuit of the processing apparatus 30 shown in FIGS. Each electric motor is driven by a control signal from the control unit 65. The control unit 65 includes a microprocessor that calculates control signals, and a memory that stores control programs, arithmetic expressions, map data, and the like. An operation panel 66 is connected to the control unit 65, and data such as an angle and an outer diameter of the crystal orientation axis of the workpiece W measured in advance with respect to the outer peripheral surface are input to the memory by operating the operation panel 66. . A detection signal 67 is sent to the control unit 65 from an actuator that drives the position detection rods 56a and 56b.

  The procedure for attaching the main spherical joints 1a and 1b to the end faces E1 and E2 of the workpiece W by the machining apparatus 30 shown in FIGS. 4 to 10 is as follows.

  The workpiece W is conveyed to the V block 48 of the workpiece support base 41 and is fixed by the clamp member 49 and the V block 48. The main spherical joint 1a is loaded into the joint holder 42a, and the main spherical joint 1b is loaded into the joint holder 42b. An adhesive is applied in advance to the affixing surfaces 4 of the main spherical joints 1a and 1b. Under this state, the slide table 36 is driven from the workpiece mounting position to the workpiece pasting position. On the other hand, the vertical movement blocks 34a and 34b are driven so that the reciprocating shafts 23a and 23b face the main spherical joints 1a and 1b at the workpiece mounting position. With the reciprocating shafts 23a and 23b facing the main spherical joints 1a and 1b, the reciprocating shafts 23a and 23b are driven forward toward the main spherical joints 1a and 1b.

  FIG. 8 shows the negative pressure air supplied to the vacuum flow path 61 in a state where the secondary spherical joints 13a and 13b provided on the reciprocating shafts 23a and 23b are in contact with the main spherical joints 1a and 1b. Thus, the main spherical joints 1a and 1b are attracted to the sub spherical joints 13a and 13b. When the vertical motion blocks 34a and 34b are raised under this state, the main spherical joints 1a and 1b are held by suction at the tips of the reciprocating shafts 23a and 23b.

  On the other hand, based on the crystal orientation axis and outer diameter data of the workpiece W input from the operation panel 66, the workpiece support base 41 is driven to turn in two axial directions, and the slide table 36 is driven in the horizontal direction to move up and down. The moving blocks 34a and 34b are driven in the vertical direction. Thereby, the workpiece | work W is positioned in the position where the crystal orientation axis | shaft C corresponds with the center axis | shaft of both reciprocating shafts 23a and 23b. In this state, when both the reciprocating shafts 23 a and 23 b are moved forward toward the workpiece W, the main spherical joints 1 a and 1 b are attached to the end surface of the workpiece W. Even if the end face of the workpiece W is not perpendicular to the crystal orientation axis C, the main spherical joints 1a and 1b slide along the sphere 7 to the end face as shown by a two-dot chain line in FIG. Glued.

  The workpiece W to which the main spherical joints 1a and 1b are attached by the processing device 30 is conveyed to a processing device for grinding the outer peripheral surface.

  FIGS. 11-13 shows the processing apparatus 70 for grinding the outer peripheral surface of the workpiece | work shown in FIG.

  This processing apparatus 70 has first and second drive heads 71a and 71b, and each drive head 71a and 71b is guided by a guide rail 73 provided on a support base 72 as a processing machine bed. It is free to reciprocate. The guide rail 73 is covered with a plurality of slide-type covers 74 shown in FIG. 11, and FIG. 13 shows the support base 72 with the cover 74 removed. As shown in FIG. 12, an electric motor 75a is attached to the support base 72, and a feed screw 76a driven by the electric motor 75a is screwed to a nut incorporated in the drive block 77a. The drive block 77a is attached to the drive head 71a. An electric motor 75b is further attached to the support base 72. A feed screw 76b driven by the electric motor 75b is screwed to a nut incorporated in the drive block 77b, and the drive block 77a is connected to the drive head 71b. Is attached.

  The drive head 71a is provided with the first rotary shaft 21a shown in FIG. 1, and the drive head 71b is provided with the second rotary shaft 21b. The rotary shafts 21a and 21b are respectively connected to the drive head 71a. , 71b, and is rotated by an electric motor (not shown) incorporated in the motor. The rotary shafts 21a and 21b are provided with the sub-spherical joints 11a and 11b shown in FIG.

  As shown in FIG. 13, the left end of the support base 72, that is, one end in the longitudinal direction is a workpiece loading position, and the workpiece W is rotatably supported by the rotating shafts 21a and 21b at the workpiece loading position.

  As shown in FIG. 13, grinding bases 81a and 81b are arranged on both sides of the support base 72, and grinding heads 82a and 82b are provided on the respective grinding bases 81a and 81b. Guide rails 83 a and 83 b for guiding the grinding heads 82 a and 82 b are attached to the grinding bases 81 a and 81 b, and the respective guide rails 83 a and 83 b extend in a direction perpendicular to the guide rail 73. In order to reciprocate the respective grinding heads 82a and 82b in the horizontal direction, the grinding bases 81a and 81b are provided with electric motors 84a and 84b, and feeds (not shown) driven by the respective electric motors 84a and 84b. Screws are screwed to the grinding heads 82a and 82b.

  Each grinding head 82a, 82b is provided with grinding wheels 85a, 85b, and the grinding wheels 85a, 85b are rotationally driven by an electric motor (not shown) incorporated in the grinding heads 82a, 82b. The grinding head 82 a and the grinding head 82 b are arranged so as to be shifted in the longitudinal direction of the support base 72. Therefore, when the workpiece W is moved to the right in FIG. 13 from the workpiece loading position, as shown in FIG. 13, after rough grinding is performed by the grinding wheel 85a provided on the grinding head 82a on the workpiece loading position side. Then, finish grinding is performed by the grinding wheel 85b.

  In this grinding process, the crystal orientation axis C is set as shown in FIG. 1 using the main spherical joints 1a and 1b attached to the end faces E1 and E2 by the processing apparatus 30 shown in FIGS. The outer peripheral surface is ground as the reference axis O.

  As described above, after grinding the outer peripheral surface parallel to the crystal orientation axis C and further grinding the outer peripheral surface parallel to the OFF angle inclined with respect to the crystal orientation axis C, the crystal A reference axis O is set based on the azimuth axis, and the outer peripheral surface of the workpiece is ground using the reference axis O as a centering axis. At that time, the processing apparatus 70 shown in FIGS. 11 to 13 is used.

  As shown in FIG. 2, in order to cut the workpiece W whose outer peripheral surface is ground into thin pieces, the orientation flat OF is ground on the workpiece W, and the workpiece support plate P is bonded to the processed OF surface. Is done.

  FIG. 14 is a perspective view showing a processing apparatus 90 for measuring the inclination angle between the reference axis O of the workpiece W and the workpiece support plate P prior to the cutting processing for cutting the workpiece W into thin pieces.

  The processing apparatus 90 includes a measurement head 91a provided with a first support shaft 24a and a measurement head 91b provided with a second support shaft 24b. The measurement head 91a is attached to a measurement base 92 as a support bed, and the measurement head 91b is attached to a guide rail 93 provided on the measurement base 92 so as to be movable in the longitudinal direction, and can move toward and away from the measurement head 91a. It has become. Both of the measurement heads 91a and 91b may be movable in the longitudinal direction. By moving at least one of the measurement heads to the guide rail 93, the first support shaft 24a is relative to the second support shaft 24b. Arranged to move closer and away. One support shaft 24b is pressed against the other support shaft 24a via the workpiece W by an actuator 94 such as a pneumatic cylinder provided in the measurement head 91b.

  A sub-spherical joint 14a that contacts the main spherical joint 1a attached to one end surface of the work W is mounted on the support shaft 24a, and a main spherical joint attached to the other end face of the work W is attached to the support shaft 24b. A secondary spherical joint 14b that contacts 1b is mounted. Each of the secondary spherical joints 14a and 14b has the same structure as each of the above-described secondary spherical joints.

  The measurement base 92 is provided with a measurement base 95, and a measurement block 96 is loaded on the measurement base 95. A workpiece W having a workpiece support plate P attached to the OF surface is mounted on the measurement block 96. The measurement block 96 is loaded so that the center line in the longitudinal direction of the workpiece support plate P coincides with the center line of the measurement block 96.

  A measuring instrument 97 is provided on the measurement base 92, and the measuring instrument 97 includes an irradiating unit for irradiating laser light toward a measuring reflection plate 98 provided in the measuring block 96, and a reflecting plate 98. And a light receiving portion for receiving the reflected light. The inclination angle between the reference axis O of the workpiece W and the workpiece support plate P is measured according to the position of the reflected light reaching the light receiving unit. Data of the inclination angle of the workpiece support plate P with respect to the reference axis O of the workpiece W measured in this way was stored in a memory of a slicing device that is a processing device for cutting the workpiece W into a thin piece. Therefore, when the workpiece W is cut into thin pieces, the cut surface is changed according to the inclination angle in a state where the workpiece support plate P is positioned on the slicing device so that the workpiece support plate P is in a predetermined position. Is set. As a result, the workpiece W is cut by the cut surface perpendicular to the reference axis O.

  As described above, the joint unit U is formed by the main spherical joints 1a and 1b attached to the workpiece and the sub-spherical joints 11a to 14a that are slidably in contact with the rotary joints 21a and 21b, the fixed shaft. By attaching a sub-spherical joint to shafts such as 22a and 22b, reciprocating shafts 23a and 23b, and support shafts 24a and 24b, the end surface remains in an inclined state without being machined at a right angle to the reference axis O. The above-described work centering process can be performed.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. For example, the embodiment described above shows a case where a sapphire ingot is processed as a workpiece, but the processing technique of the present invention is a case where a brittle material such as a silicon ingot is processed as a workpiece. If it exists, it can be applied to machining of other workpieces.

1a, 1b Main spherical joint 3 Joint piece member 4 Attaching surface 5 Opening surface 6 Concave surface 7 Spherical bodies 11a-14a Secondary spherical joint 11b-14b Secondary spherical joint 21a, 21b Rotating shaft 22a, 22b Fixed shaft 23a, 23b Reciprocating shaft 24a, 24b Support shaft 30 Processing devices 31a, 31b First and second sticking heads 33 Sticking bases 34a, 34b Vertical movement block 35 Guide rail 36 Slide table 37 Rotating table 38 Indexing table 39 Rotating table 41 Work support table 61 Vacuum flow path 62 communication hole 63 seal member 70 processing device 71a, 71b drive head 72 support base 73 guide rail 75a, 75b electric motor 81a, 81b grinding base 82a, 82b grinding head 85a, 85b grinding wheel 90 processing device 91a, 91b measuring head 92 Measurement base 95 Measurement Table 96 Measuring block 97 Measuring instrument 98 Reflecting plate C Crystal orientation axis E1, E2 One end face O Central axis (reference axis)
P Work support plate U Joint unit W Work

Claims (7)

A workpiece machining method for machining a workpiece using a reference axis set by a crystal orientation axis of a cylindrical workpiece as a centering axis,
A joint affixing step of attaching a first main spherical joint to the one end face of the work and attaching the first main spherical joint to the other end face of the work and attaching a second main spherical joint to the other end face of the work;
A first rotary shaft provided with a first sub-spherical joint that swingably contacts the first main spherical joint; and a second sub-spherical face that swingably contacts the second main spherical joint. A workpiece support that is provided with a joint and that supports the workpiece in a state in which the reference axis and the rotation center of each of the rotating shafts coincide with each other by a second rotating shaft that is arranged coaxially with the first rotating shaft. Process,
A grinding step of grinding the outer peripheral surface of the workpiece in parallel with the reference axis by a grinding wheel while rotating the workpiece by the first and second rotating shafts;
A method for machining a workpiece having A workpiece processing apparatus that processes a workpiece using a reference axis set by a crystal orientation axis of a cylindrical workpiece as a centering axis,
A first rotary shaft provided with a first sub-spherical joint that swingably contacts a first main spherical joint that is attached to one end face of the workpiece so as to be positioned on the crystal orientation axis;
A second rotary shaft provided with a second sub-spherical joint that swingably contacts a second main spherical joint that is attached to the other end surface of the work piece so as to be positioned on the reference axis;
The outer peripheral surface of the workpiece is ground in parallel with the reference axis in a state where the reference axis of the workpiece is aligned with the central axes of the first and second rotating shafts and the workpiece is rotated by the respective rotating shafts. A grinding wheel,
A processing apparatus for workpieces. Prior to grinding of the outer peripheral surface of the workpiece, the first main spherical joint is attached to one end surface of the workpiece with the reference axis set by the crystal orientation axis of the cylindrical workpiece as a centering axis. , A workpiece processing apparatus for attaching the second main spherical joint to the other end surface while being positioned on the reference axis,
A first reciprocating shaft provided at a tip of a first sub-spherical joint provided on a sticking base so as to freely reciprocate in an axial direction and contacting the first main spherical joint;
A second sub-spherical joint that is arranged coaxially with respect to the first reciprocating shaft and is provided on the sticking base so as to be capable of reciprocating in the axial direction is provided at the tip. A second reciprocating shaft formed;
Provided on the pasting base so as to be horizontally movable between a workpiece pasting position between the first and second reciprocating shafts and a workpiece mounting position shifted from the pasting position in the radial direction of the reciprocating shaft. Slide table,
An indexing table that is provided on the slide table and supports a work support that supports the work so as to be rotatable about a vertical axis and a horizontal axis;
A vacuum supply mechanism provided on the first and second reciprocating shafts, wherein the main spherical joint is attracted to the subspherical joint in a state where each of the subspherical joints is in contact with the main spherical joint; ,
A shaft drive member that moves the reciprocating shafts close to each other in a state in which the reference axis of the work and the central axes of the first and second reciprocating shafts coincide with each other by the work support;
Have
A workpiece processing apparatus for affixing the main spherical joint adsorbed on each reciprocating shaft to both end surfaces of the workpiece.   The workpiece processing apparatus according to claim 3, wherein a joint holder for holding each of the main spherical joints is provided on the slide table, and the main spherical joint loaded in the joint holder is adsorbed by the sub-spherical joint. Workpiece processing equipment that is transported to the workpiece end face. A workpiece that measures the inclination angle between the workpiece whose outer peripheral surface is processed parallel to the reference axis set by the crystal orientation axis of the workpiece and the workpiece support plate fixed to the workpiece prior to the cutting process in which the workpiece is cut into thin pieces. The processing device of
A first support shaft provided with a first sub-spherical joint that slidably contacts a first main spherical joint affixed to one end surface of the workpiece;
A second sub-spherical joint that swingably contacts the second main spherical joint attached to the other end surface of the workpiece is provided, is coaxial with the first support shaft, and is connected to the first support shaft. A second support shaft that is relatively movable toward and away from the second support shaft;
A measuring instrument for measuring an inclination of the reference axis with respect to the work support plate under a state in which the work is fixed by the first and second support shafts;
A processing apparatus for workpieces. The center axis of the first shaft pressed against one end surface of the workpiece and the center axis of the second shaft pressed against the other end surface, with the reference axis set by the crystal orientation axis of the cylindrical workpiece as the centering axis, and the reference axis A joint unit that is set in a matched state,
A first main spherical joint which is attached to one end surface of the work so as to be positioned on the reference axis;
A second main spherical joint that is attached to the other end surface of the workpiece and is positioned on the reference axis;
A first sub-spherical joint provided at a tip of the first shaft and in contact with the first main spherical joint;
A second sub-spherical joint provided at a tip of the second shaft and in contact with the second main spherical joint;
Have
A joint unit in which the central axis and the reference axis are coaxial even when both end faces of the workpiece are not perpendicular to the reference axis.   7. The joint unit according to claim 6, wherein the main spherical joint has a joint piece member in which a pasting surface to be affixed to an end surface of a workpiece is provided at one end portion and an opening surface for opening a concave surface is provided at the other end surface. The sub-spherical joint has a spherical body that contacts the concave surface and swingably contacts the concave surface.

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