JP2015209574A - Method for manufacturing member having film on surface - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method that allows masks to be more stably moved, in a film forming technology for superposing a plurality of masks on a substrate.SOLUTION: A method for manufacturing a member having a film on a surface thereof includes the steps of: disposing a first mask having openings on a substrate and disposing a second mask having openings on the first mask; growing a film on the surface of the substrate exposed in the openings of the first and second masks; and moving the first and second masks from the substrate after the growth of the film. The second mask has through holes. In the moving step, the first and second masks are moved by adsorbing the first mask through the through holes.

Description

  The present invention relates to a method for manufacturing a member having a film on its surface.

  Patent Document 1 discloses a technique in which a plurality of masks are stacked on a substrate and a film is formed on the surface of the substrate exposed in the opening of each mask. According to such a technique, it is possible to prevent the mask from floating from the substrate during film formation.

Japanese Patent Laid-Open No. 63-69692

  After forming the film, it is necessary to move each mask from the substrate to another location. In a film forming technique in which a plurality of masks are stacked on a substrate as in Patent Document 1, when an outermost mask is moved, a lower mask than the outermost mask adheres to the outermost mask. The mask may be moved to the lower mask, and the process of moving the mask is not stable. Further, the lower mask attached to the outermost mask may fall off during the movement. Therefore, the present specification provides a method capable of moving a mask more stably in a film formation technique in which a plurality of masks are stacked on a substrate.

  This specification discloses the method of manufacturing the member which has a film | membrane on the surface. The method includes the steps of disposing a first mask having an opening on a substrate and disposing a second mask having an opening on the first mask, the opening of the first mask, and the opening of the second mask. And a step of growing a film on the surface of the substrate exposed inside, and a step of moving the first mask and the second mask from the substrate after the film is grown. The second mask has a through hole. In the moving step, the first mask and the second mask are moved by sucking the first mask through the through hole.

  The substrate may be any one of a conductor, an insulator, and a semiconductor. The film may be any of a conductor, an insulator, and a semiconductor. Further, in the step of arranging, the first mask and the second mask may be arranged on the substrate at the same time, or the first mask is arranged on the substrate, and then the second mask is arranged on the first mask. May be.

  A through hole is formed in the second mask used in this method. In the moving step, the first mask located below the second mask is sucked through the through hole. For this reason, the first mask and the second mask can be moved together. Since the lower first mask is sucked, it is possible to prevent any of the masks from dropping off during the movement. For this reason, the member which has a film | membrane on the surface can be manufactured stably.

The perspective view of the board | substrate 12, the 1st mask 14, and the 2nd mask 18. FIG. Schematic explanatory drawing of the film-forming apparatus. FIG. 2 is a schematic explanatory diagram of a moving device 32 according to the first embodiment. 5 is a flowchart showing a film forming process. The perspective view which shows arrangement | positioning of the moving apparatus 32 and the 2nd mask 18 when moving the 2nd mask 18 from the 2nd mask stage 40. FIG. The perspective view which shows arrangement | positioning of the moving apparatus 32 and the 2nd mask 18 when moving the 2nd mask 18 from the 2nd mask stage 40. FIG. Sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 after implementation of step S6. Sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 after implementation of step S8. The perspective view which shows arrangement | positioning of the moving apparatus 32 and the 2nd mask 18 when moving the 1st mask 14 and the 2nd mask 18 from the board | substrate 12. FIG. Sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 at the time of adsorb | sucking the 1st mask 14 with the adsorption | suction collet 36. FIG. Sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 at the time of adsorb | sucking the 1st mask 14 with the adsorption | suction collet 36 in Example 2. FIG. In Example 3, sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 at the time of adsorb | sucking the 1st mask 14 with the adsorption collet 36. FIG. In Example 3, sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 at the time of adsorb | sucking the 1st mask 14 with the adsorption collet 36. FIG. FIG. 6 is a schematic explanatory diagram of a moving device 32 according to a fourth embodiment. In Example 4, sectional drawing of the 2nd mask 18 at the time of adsorb | sucking the 2nd mask 18 with the auxiliary collet 38. FIG. In Example 4, sectional drawing of the board | substrate 12, the 1st mask 14, and the 2nd mask 18 at the time of adsorb | sucking the 1st mask 14 with the adsorption collet 36. FIG.

First, features of the embodiments described below are listed. The following features are all independently useful.
(Characteristic 1) The moving device that moves the first mask and the second mask in the moving step has a suction collet. The suction collet is inserted into the through hole and sucks the first mask in contact with the first mask.
(Characteristic 2) A moving device for moving the first mask and the second mask in the moving step has a suction collet. The suction collet sucks the first mask by reducing the pressure in the through-hole while in contact with the second mask. In this case, the thickness of the portion exposed in the through hole of the first mask may be thinner than the thickness of the portion located outside the through hole of the first mask.
(Feature 3) The method further includes a step of transporting the second mask. The second mask has at least three through holes. A moving device has at least three of the adsorption collets. The moving device is capable of rotating at least three suction collets about an axis existing within a range surrounded by at least three suction collets. In the transporting step, the second mask is sucked in a state where at least three suction collets are in contact with the surface of the second mask at a position displaced about the axis with respect to the through hole.
(Feature 4) The method further includes a step of transporting the second mask. The moving device further has an auxiliary collet. In the transporting step, the auxiliary collet adsorbs the second mask while being in contact with the surface of the second mask.
(Characteristic 5) It should be noted that the process of transporting the above characteristics 3 and 4 may be any process as long as it transports the second mask. For example, it may be a step of overlaying the second mask on the first mask before forming the film. Further, it may be a step of moving the second mask from the first mask after forming the film (that is, after moving the first mask and the second mask from the substrate). Moreover, the process of conveying another 2nd mask may be sufficient.

  FIG. 1 shows a substrate 12, a first mask 14, and a second mask 18 used in the method of the first embodiment. The substrate 12 shown in FIG. 1 is a silicon semiconductor substrate. In the method of this embodiment, an electrode film is formed on the substrate 12. The first mask 14 is a mask placed directly on the substrate 12. A plurality of openings 16 are formed in the first mask 14. The opening 16 penetrates from the front surface to the back surface of the first mask 14. The second mask 18 is a mask placed on the first mask 14. That is, the first mask 14 and the second mask 18 are stacked on the substrate 12. The second mask 18 has a plurality of openings 20. The opening 20 penetrates from the front surface to the back surface of the second mask 18. In the present embodiment, the openings 20 are formed in the same pattern as the openings 16. Further, four through holes 22 are formed in the outer peripheral portion of the second mask 18 (that is, the portion around the region where the plurality of openings 20 are formed). The through hole 22 penetrates from the front surface to the back surface of the second mask 18.

  FIG. 2 shows a film forming apparatus 30 used in the method of the first embodiment. As shown in FIG. 2, the film forming apparatus 30 includes a moving device 32, a second mask stage 40, a film forming stage 42, and a post-use mask stage 44. The second mask stage 40 is a stage for placing the second mask 18 before being used for the film forming process. Although not shown in FIG. 2, the film forming apparatus 30 includes a substrate stage and a first mask stage. The substrate stage is a stage for placing the substrate 12 before film formation. The first mask stage is a stage for placing the first mask 14 before being used for the film forming process. The film forming stage 42 is a stage for forming a film on the substrate 12. The film formation stage 42 is installed in a film formation chamber. The post-use mask stage 44 is a stage for placing the first mask 14 and the second mask 18 after being used for the film forming process. The moving device 32 is movable to the upper part of the second mask stage 40, the upper part of the film forming stage 42, and the upper part of the used mask stage 44. The moving device 32 may be further movable to the upper part of the substrate stage and the upper part of the first mask stage. Further, the moving device 32 can move forward and backward with respect to each stage. For this reason, the moving apparatus 32 can contact the mask etc. on each stage.

  FIG. 3 shows the moving device 32. The moving device 32 has a conveying suction plate 34 and four suction collets 36. In FIG. 3, the conveyance suction plate 34 is indicated by a dotted line for easy viewing. The conveyance suction plate 34 is a disk-shaped plate. The four suction collets 36 are fixed to the lower surface of the transport suction plate 34. The four suction collets 36 are fixed to the outer peripheral portion of the transport suction plate 34. The four suction collets 36 are installed at approximately the same distance from the central axis 34 a of the transport suction plate 34. The four suction collets 36 are arranged at substantially equal angular intervals (ie, 90 ° intervals) around the central axis 34 a of the conveyance suction plate 34. The moving device 32 can rotate around the central axis 34 a of the conveyance suction plate 34. An air flow path that opens to the tip of the suction collet 36 is formed inside the transport suction plate 34 and the suction collet 36. By sucking air from the air flow path by a pump (not shown), air can be sucked by each adsorption collet 36. For this reason, a mask etc. can be adsorbed by each adsorption collet 36.

  Next, the film forming method of Example 1 will be described with reference to the flowchart of FIG. At the start of the flowchart of FIG. 4, the substrate 12 is placed on the substrate stage, the first mask 14 is placed on the first mask stage, and the first mask 14 is placed on the second mask stage 40. Two masks 18 are placed. First, in step S2, the substrate 12 is moved from the substrate stage onto the film formation stage. Here, the substrate 12 may be moved using the moving device 32, or the substrate 12 may be moved using another moving device. Next, in step S4, the first mask 14 is moved from the first mask stage to the substrate 12 (that is, on the film forming stage 42). That is, the first mask 14 is stacked on the substrate 12 on the film formation stage 42. Here, the first mask 14 may be moved using the moving device 32, or the first mask 14 may be moved using another moving device.

  Next, in step S <b> 6, the second mask 18 is moved from the second mask stage 40 to the first mask 14 (that is, on the film forming stage 42). That is, the second mask 18 is stacked on the first mask 14 on the film forming stage 42. Here, the second mask 18 is moved by the moving device 32. Hereinafter, the operation of the moving device 32 will be described in detail.

  First, as shown in FIG. 5, the moving device 32 is moved directly above the second mask stage 40. Here, the moving device 32 is stopped at a position where the center axis of the second mask 18 placed on the second mask stage 40 and the center axis 34a of the transport suction plate 34 substantially coincide. Further, as described above, the moving device 32 can rotate around the central axis 34a. Here, as shown in FIG. 5, the central axis 34 a of the moving device 32 is set so that each suction collet 36 is located above the position of the outer peripheral portion of the second mask 18 where the through hole 22 is not formed. Adjust the surrounding angle. Next, as shown in FIG. 6, the moving device 32 is moved toward the second mask 18, and the tip of each suction collet 36 is brought into contact with the second mask 18. Then, the second mask 18 is sucked by each suction collet 36. When the second mask 18 is sucked, the second mask 18 is lifted from the second mask stage 40, and the second mask 18 is moved onto the film forming stage 42. Then, when the second mask 18 is moved to a position where the second mask 18 comes into contact with the first mask 14, the suction of each suction collet 36 is released. As a result, the second mask 18 is separated from the moving device 32, and the second mask 18 is placed on the first mask 14. As described above, step S6 is completed. By executing step S6, the first mask 14 and the second mask 18 are laminated on the substrate 12 on the film forming stage 42 as shown in FIG. As shown in FIG. 7, in step S6, the second mask 18 is placed so that the opening 16 of the first mask 14 and the opening 20 of the second mask 18 substantially coincide. In this state, no through hole or opening is formed in the first mask 14 at a position corresponding to the through hole 22. Accordingly, the through hole 22 is closed by the first mask 14 at the lower end thereof.

  Next, in step S8, a film forming process is performed on the film forming stage. In this embodiment, a metal film 13 (electrode film) is grown on the surface of the substrate 12 by sputtering or vapor deposition, as shown in FIG. When the film forming process is performed, the metal film 13 is formed on the surface of the substrate 12 exposed in the openings 16 and 20. The metal film 13 is also formed on the surfaces of the first mask 14 and the second mask 18. The metal film 13 is not formed on the surface of the substrate 12 in a range covered with the first mask 14 and the second mask 18. Therefore, the patterned metal film 13 can be formed on the surface of the substrate 12.

  Next, in step S <b> 10, the first mask 14 and the second mask 18 are moved from the substrate 12 onto the post-use mask stage 44. That is, the first mask 14 and the second mask 18 are moved from the substrate 12 to expose the substrate 12. Here, the first mask 14 and the second mask 18 are moved by the moving device 32. Hereinafter, the operation of the moving device 32 will be described in detail.

  First, as shown in FIG. 9, the moving device 32 is moved directly above the film forming stage 42. Here, the moving device 32 is stopped at a position where the central axis of the second mask 18 placed on the film forming stage 42 and the central axis 34a of the transporting suction plate 34 substantially coincide with each other. Further, as described above, the moving device 32 can rotate around the central axis 34a. Here, as shown in FIG. 9, the angle around the central axis 34 a of the moving device 32 is adjusted so that each suction collet 36 is positioned above the through hole 22 of the second mask 18. Next, the moving device 32 is moved toward the film forming stage 42. Here, the diameter of the tip of each suction collet 36 is smaller than the diameter of each through hole 22. Therefore, when the moving device 32 is moved toward the film forming stage 42, the tip of each suction collet 36 is inserted into the through hole 22. Here, as shown in FIG. 10, the moving device 32 is lowered until each suction collet 36 contacts the first mask 14 in the through hole 22. Then, the first mask 14 is sucked by each suction collet 36. When the first mask 14 is sucked, the first mask 14 is lifted from the substrate 12. At this time, the second mask 18 placed on the first mask 14 is lifted together with the first mask 14. Thereafter, the moving device 32 moves the first mask 14 and the second mask 18 onto the post-use mask stage 44. Then, by releasing the suction of each suction collet 36, the first mask 14 and the second mask 18 are separated from the moving device 32 and placed on the post-use mask stage 44. As described above, step S10 is completed.

  Next, in step S12, the substrate 12 is moved from the film-forming stage 42 to the next process by the moving device 32 or a moving device (not shown). Thus, a series of processes for forming the metal film 13 on the surface of the substrate 12 is completed.

  In the method of the first embodiment described above, the suction collet 36 is inserted into the through hole 22, and the first mask 14 is sucked by the suction collet 36 while the suction collet 36 is in contact with the first mask 14. Thus, the first mask 14 and the second mask 18 are simultaneously moved from the substrate 12 onto the post-use mask stage 44. According to this method, the first mask 14 and the second mask 18 can be reliably moved from the substrate 12 together. In this method, it is possible to prevent any mask from dropping off during the movement. Therefore, according to this method, the substrate 12 on which the metal film 13 is stably formed can be manufactured.

  In the method of the first embodiment described above, in step S6, the suction collet 36 is brought into contact with a portion other than the through-hole 22 of the second mask 18 by adjusting the angle of the transport suction plate 34 around the central axis 34a. In step S10, the suction collet 36 is inserted into the through hole 22 of the second mask 18 and brought into contact with the first mask 14 by adjusting the angle of the transport suction plate 34 around the central axis 34a. That is, in this method, each suction collet 36 is inserted into the position where it can come into contact with the second mask 18 and into the through hole 22 of the second mask 18 by rotating the suction plate 34 for conveyance around the central axis 34a. It was possible to switch to a possible position. According to such a configuration, in step S6, the second mask 18 can be transported by the suction collet 36 arranged substantially evenly around the central axis of the second mask 18. Also in step S10, the first mask 14 and the second mask 18 can be transported by the suction collet 36 that is arranged substantially evenly around the central axes of the second mask 18 and the first mask 14. In this way, by adsorbing the outer peripheral portion of the mask 14 or 18 at three or more locations by the suction collet 36 evenly arranged around the central axis 34a, the mask 14 or 18 is prevented from being bent during conveyance. Is possible. Therefore, the second mask 18 can be placed with high positional accuracy when the second mask 18 is placed, and the first mask 14 is separated when the first mask 14 is separated from the substrate 12. It is possible to prevent the substrate 14 from being bent and damaging the substrate 12. The central axis 34a is a central axis of the four adsorption collets 36 (more specifically, an axis positioned at the center of a quadrangle obtained by connecting the four adsorption collets 36). If each suction collet 36 is rotated around the central axes of the four suction collets 36 as described above, the respective suction collets are moved without moving the relative positions of the central axes of the four suction collets 36 with respect to the second mask 18. 36 can be moved relative to the second mask 18. Therefore, in both step S6 and step S10, it is possible to easily align the central axis of the four suction collets 36 and the central axis of the mask, and it is possible to suppress the bending of the mask during conveyance. The rotation axis for rotating the adsorption collet 36 is preferably the central axis of each adsorption collet 36, but may be an axis located within a range surrounded by each adsorption collet 36. With such an axis, when the moving device 32 is rotated, the relative movement of the central axes of the four suction collets 36 with respect to the second mask 18 can be relatively reduced.

  Moreover, in the method of Example 1 mentioned above, although the four adsorption collets 36 were used, the number of the adsorption collets 36 may be any number. However, in order to transport the mask more stably, the number of suction collets 36 is preferably three or more.

  In the method of the second embodiment, the adsorption collet 36 is different from that of the first embodiment. The diameter of the tip of the suction collet 36 of Example 2 shown in FIG. 11 is larger than the diameter of the through hole 22. Other configurations of the moving device 32 of the second embodiment are the same as those of the moving device 32 of the first embodiment. In the method of the second embodiment, steps S2 to S8 in FIG. 4 are performed in the same manner as in the first embodiment. In step S10, the suction collet 36 is moved toward the through hole 22 of the second mask 18, as shown in FIG. In Example 2, since the diameter of the tip of the suction collet 36 is larger than the diameter of the through hole 22, the suction collet 36 contacts the surface of the second mask 18 around the through hole 22. Here, the suction collet 36 is brought into contact with the second mask 18 so that the entire through-hole 22 is covered with the suction collet 36. When the suction collet 36 is brought into contact with the second mask 18, the air in the through hole 22 is sucked by the suction collet 36. Then, the inside of the through hole 22 is decompressed, and the first mask 14 and the second mask 18 are adsorbed by the adsorption collet 36. Thereafter, similarly to the method of the first embodiment, the first mask 14 and the second mask 18 are moved together to the post-use mask stage 44. As described above, the first mask 14 and the second mask 18 can be moved together from the substrate 12 also by the method of the second embodiment.

  In the third embodiment, as in the second embodiment, the suction collet 36 having a large tip diameter is used. As shown in FIG. 12, in Example 3, a thin plate portion 14 a is formed on the first mask 14. The thin plate portion 14 a is formed in a portion exposed to the inside of the through hole 22 when the second mask 18 is laminated on the first mask 14. The thin plate portion 14a is thinner than the first mask 14 outside the through hole 22 (a portion not exposed to the inside of the through hole 22). According to such a configuration, when the inside of the through hole 22 is depressurized by the suction collet 36 in step S10, the thin plate portion 14a warps toward the suction collet 36 as shown in FIG. As the thin plate portion 14a is warped in this way, the leakage of air through the interface 15 (contact portion) between the first mask 14 and the second mask 18 is suppressed. For this reason, according to this method, the adsorption power of the adsorption collet 36 can be improved.

  In the fourth embodiment, the moving device 32 has an auxiliary collet 38 in addition to the suction collet 36 as shown in FIG. The auxiliary collet 38 is installed on the lower surface of the conveyance suction plate 34 and next to each suction collet 36. The air flow path of the adsorption collet 36 and the air flow path of the auxiliary collet 38 are formed independently of each other. For this reason, the suction operation can be executed only by the suction collet 36, and the suction operation can be executed only by the auxiliary collet 38. The suction collet 36 protrudes below the auxiliary collet 38. In the fourth embodiment, the diameter of the tip of the adsorption collet 36 is smaller than the diameter of the through hole 22. In the fourth embodiment, the moving device 32 cannot rotate around the central axis 34a. In a state in which the moving device 32 is stopped on each stage, the suction collet 36 is disposed above the through hole 22 of the second mask 18 (that is, a position where the second collimator 22 can be inserted), and the auxiliary collet 38 is disposed. The second mask 18 is disposed at an upper part of the portion where the through hole 22 is not formed (that is, a position where the second mask 18 can contact the surface of the second mask 18).

  In the fourth embodiment, steps S2 and S4 are performed in the same manner as in the first embodiment. In step S <b> 6, the moving device 32 is moved toward the second mask 18. Then, as shown in FIG. 15, the suction collet 36 is inserted into the through hole 22, and the auxiliary collet 38 comes into contact with the surface of the second mask 18. Here, the suction operation is performed by the auxiliary collet 38 without performing the suction operation by the suction collet 36. As a result, the second mask 18 is sucked and moved onto the film forming stage 42.

  Step S8 of the fourth embodiment is performed in the same manner as the first embodiment. In step S <b> 10 of the fourth embodiment, first, the moving device 32 is moved toward the second mask 18. Then, as shown in FIG. 16, the suction collet 36 contacts the first mask 14 in the through hole 22, and the auxiliary collet 38 contacts the second mask 18. Here, the suction operation is performed by the suction collet 36, and the suction operation is not performed by the auxiliary collet 38. As a result, the first mask 14 is sucked, and the first mask 14 and the second mask 18 are moved together onto the film forming stage 42. The subsequent step S12 is executed in the same manner as in the first embodiment.

  As described above, in the method of the fourth embodiment, the second mask 18 is sucked by the auxiliary collet 38 in step S6, and the first mask 14 is sucked by the suction collet 36 in step S10. Even with such a configuration, the moving device 32 can be used in both step S6 and step S10.

  Further, by using the suction collet 36 and the auxiliary collet 38 as in the fourth embodiment, it is not necessary to rotate the moving device 32 around the central axis 34a as in the first embodiment. That is, in the configuration of the fourth embodiment, the rotational drive mechanism of the moving device 32 can be omitted. Conversely, if the rotational drive mechanism is employed as in the first embodiment, the auxiliary collet 38 and the air suction mechanism for the auxiliary collet 38 as in the fourth embodiment can be omitted.

  In the above-described fourth embodiment, the diameter of the tip of the suction collet 36 is smaller than the diameter of the through-hole 22, but in the fourth embodiment, the suction collet whose tip diameter is larger than that of the through-hole 22 as in the second embodiment. 36 may be used.

  In the above-described fourth embodiment, the suction operation is performed only with the suction collet 36 in step S8. However, the suction operation may be performed with both the suction collet 36 and the auxiliary collet 38 in step S8.

  The examples 1 to 4 have been described above. In Examples 1 to 4 described above, the moving device 32 is used when moving the second mask 18 in Step S6. However, in step S6, the second mask 18 may be moved by another moving device. Further, in the step of moving the second mask 18 different from step S6, the moving device 32 may be used similarly to step S2. For example, when only the second mask 18 is transported from the post-use mask stage 44 to another position, the moving device 32 may be used in the same manner as in step S6.

  In the first to fourth embodiments, it is possible to separate the first mask 14 from the substrate 12 without fixing the substrate 12 to the film formation stage 42 in step S10. Depending on the weight, thickness, material, etc. of the substrate 12, the first mask 14 can be suitably separated from the substrate 12 without fixing the substrate 12 to the film forming stage 42 as in the first to fourth embodiments. it can. However, in some cases, when the first mask 14 is separated from the substrate 12, the substrate 12 may adhere to the first mask 14 and cannot be suitably separated. In such a case, in step S <b> 10, the substrate 12 may be fixed to the film formation stage 42 by air suction, electrostatic adsorption, or the like, and the first mask 14 may be separated from the substrate 12.

  In the first to fourth embodiments, the patterns of the openings 16 of the first mask 14 and the openings 20 of the second mask 18 are substantially the same. However, these patterns may be different. That is, if the film can be grown on the surface of the substrate 12 through the opening 16 of the first mask 14 and the opening 20 of the second mask 18, the pattern of these openings 16 and 20 is any pattern. Also good.

  Moreover, in Examples 1-4 mentioned above, although the board | substrate 12 was a semiconductor substrate, the board | substrate 12 may be any of a semiconductor, a conductor, and an insulator. In Examples 1 to 4 described above, the film to be grown is a metal film, but the film to be grown may be any of a semiconductor, a conductor, and an insulator.

  In Examples 1 to 4 described above, two masks are stacked on the substrate, but three or more masks may be stacked on the substrate. Even in this case, by providing a through-hole in the outermost mask, the outermost mask and the lower mask can be moved together.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

12: Substrate 13: Metal film 14: First mask 14a: Thin plate portion 15: Interface 16: Opening 18: Second mask 20: Opening 22: Through hole 30: Film forming device 32: Moving device 34: Transporting suction plate 34a : Central axis 36: suction collet 38: auxiliary collet 40: second mask stage 42: film formation stage 44: post-use mask stage

Claims (6)

A method for producing a member having a film on a surface,
Disposing a first mask having an opening on the substrate and disposing a second mask having an opening on the first mask;
Growing a film on the surface of the substrate exposed in the opening of the first mask and the opening of the second mask;
Moving the first mask and the second mask from the substrate after growing the film;
Have
The second mask has a through hole;
In the moving step, the first mask and the second mask are moved by sucking the first mask through the through hole.
Method. The moving device for moving the first mask and the second mask in the moving step has a suction collet,
The suction collet is inserted into the through hole and sucks the first mask in a state of being in contact with the first mask;
The method of claim 1. The moving device for moving the first mask and the second mask in the moving step has a suction collet,
The suction collet sucks the first mask by reducing the pressure in the through hole in a state where the suction collet is in contact with the second mask.
The method of claim 1 or 2.   The method according to claim 3, wherein a thickness of a portion of the first mask exposed in the through hole is smaller than a thickness of a portion of the first mask located outside the through hole. The method further comprises transporting the second mask;
The second mask has at least three of the through holes;
The moving device has at least three of the adsorption collets;
The moving device is capable of rotating the at least three adsorption collets about an axis existing within a range surrounded by the at least three adsorption collets;
In the transporting step, the at least three suction collets suck the second mask while being in contact with the surface of the second mask at a position displaced about the axis with respect to the through-hole.
The method according to any one of claims 2 to 4. The method further comprises transporting the second mask;
The moving device further comprises an auxiliary collet;
In the transporting step, the auxiliary collet adsorbs the second mask while being in contact with the surface of the second mask.
The method according to any one of claims 2 to 4.

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