JP2015208765A5 - - Google Patents
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- JP2015208765A5 JP2015208765A5 JP2014092241A JP2014092241A JP2015208765A5 JP 2015208765 A5 JP2015208765 A5 JP 2015208765A5 JP 2014092241 A JP2014092241 A JP 2014092241A JP 2014092241 A JP2014092241 A JP 2014092241A JP 2015208765 A5 JP2015208765 A5 JP 2015208765A5
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Description
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092241A JP2015208765A (ja) | 2014-04-28 | 2014-04-28 | 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092241A JP2015208765A (ja) | 2014-04-28 | 2014-04-28 | 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015208765A JP2015208765A (ja) | 2015-11-24 |
| JP2015208765A5 true JP2015208765A5 (ja) | 2017-03-09 |
Family
ID=54611433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014092241A Pending JP2015208765A (ja) | 2014-04-28 | 2014-04-28 | 無鉛はんだ材、電力用半導体装置、および電力用半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015208765A (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116316047B (zh) * | 2023-05-17 | 2023-08-15 | 苏州长光华芯光电技术股份有限公司 | 一种高可靠性半导体封装结构及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215294A (ja) * | 1983-05-24 | 1984-12-05 | Toshiba Corp | 半田接合材料とその材料を使用した接合方法 |
| JPS62179889A (ja) * | 1986-01-31 | 1987-08-07 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
| JPH0639583A (ja) * | 1992-07-27 | 1994-02-15 | Toshiba Lighting & Technol Corp | 半田ペースト及び回路基板 |
| TWI248384B (en) * | 2000-06-12 | 2006-02-01 | Hitachi Ltd | Electronic device |
| JP4081073B2 (ja) * | 2000-12-25 | 2008-04-23 | Ｔｄｋ株式会社 | はんだ付け方法 |
| JP5160201B2 (ja) * | 2007-11-20 | 2013-03-13 | 株式会社豊田中央研究所 | はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法 |
| WO2013017885A2 (en) * | 2011-08-02 | 2013-02-07 | Fry's Metals, Inc. | Solder compositions |
-
2014
- 2014-04-28 JP JP2014092241A patent/JP2015208765A/ja active Pending
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