JP2015204330A - Liquid-like material supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid-like material supply device in which generation of foreign matter in a conduction tube is suppressed with a simple configuration.SOLUTION: A liquid-like material supply device 1 includes: a conduction tube 10 which is a conduit in which a liquid-like material R to be supplied is transported toward the downstream side from the upstream side; a transportation drive force generation part 20 which generates transportation drive force for transporting the liquid-like material R from the upstream side to the downstream side of the conduction tube 10; and a flow drive force generation part 30 which generates flow drive force for making the liquid-like material R flow so as to be reciprocated from the upstream side to the downstream side and the downstream side to the upstream side in at least a part of the conduction tube 10.

Description

  The present invention relates to a liquid material supply apparatus that supplies a liquid material.

  For example, during the manufacture of electronic devices typified by liquid crystal panels and solar cells, a step of applying a liquid photosensitive material (hereinafter simply referred to as “resist”) to the wafer may be performed. The resist applied on the wafer by this process is selectively removed through an exposure and development process and becomes a solid state, thereby forming a resist pattern having a desired shape. This resist pattern is used as a mask at the time of manufacturing an electronic device, or is used as one of components constituting the electronic device such as a color filter.

  In the step of applying the resist onto the wafer, a liquid material supply device is used to transport and supply the resist. The liquid material supply device includes a conduit that is a conduit through which the resist is transported, a pump that generates a driving force for transporting the resist, and the like.

  By the way, when the resist is applied using the liquid material supply device, the resist stays in the conduit. Such a staying resist may deteriorate when left for a long time, and may cause an object (hereinafter referred to as “foreign matter”) that causes a defect, for example, a resist pattern as designed cannot be formed. Become.

  Specifically, for example, a resist for a color filter containing a pigment or a resist having a high viscosity can become a gel-like foreign substance when left standing for a long time. Further, for example, a resist containing a highly volatile solvent can become a foreign substance containing bubbles when left standing for a long time. Further, for example, when the chemically amplified resist is left in a staying state for a long time, the acid generating material is decomposed to become a foreign substance having a lowered sensitivity.

  When the resist is transported in a state where the above foreign matter is present in the conduit, the foreign matter is mixed into the resist. When a resist mixed with foreign matter is supplied onto the wafer, a resist that is non-homogeneous within the surface of one wafer is formed, or a resist that is heterogeneous is formed between a plurality of wafers. A resist pattern defect may occur in units of wafers or lots.

  Therefore, before starting the use of the liquid material supply device, a foreign substance remaining in the conduit is obtained by performing a process of cleaning the interior of the conduit by discarding the resist through the conduit (hereinafter referred to as “dummy dispense”). It is conceivable to remove. However, when removing foreign matters by this dummy dispense, there is a problem that the resist consumption increases. In particular, the higher the probability that foreign matter will be generated in the conduit, the greater the need for cleaning the conduit, and the greater the amount of resist consumed by dummy dispensing.

  Patent Documents 1 and 2 propose a liquid material supply apparatus that suppresses foreign matters from being mixed into the resist supplied to the outside. These liquid material supply apparatuses will be described with reference to the drawings. 8 and 9 are flow charts schematically showing the configuration of a conventional liquid material supply apparatus. FIG. 8 shows the liquid material supply apparatus proposed in Patent Document 1, and FIG. 9 shows the liquid material supply apparatus proposed in Patent Document 2.

  The liquid material supply apparatus 100 shown in FIG. 8 includes a conduit 110 that is a conduit for taking out and transporting the resist R in the container J, a pump 120 that generates a driving force for transporting the resist R in the conduit 110, and a stage S. A nozzle 130 for supplying the resist R onto the held wafer W, a circulation pipe 140 that is a pipe for taking out the resist R in the container J separately from the conduit 110 and returning it to the container J, and a circulation pipe 140 includes a pump 150 that generates a driving force for transporting the resist R and a filter 160 that filters the resist R transported in the circulation pipe 140. In FIG. 8, the transport direction of the resist R in the conduit 110 and the circulation pipe 140 is indicated by white arrows.

  A liquid material supply apparatus 200 shown in FIG. 9 includes a conduit 210 that is a conduit for taking out and transporting the resist R in the container J, a pump 220 that generates a driving force for transporting the resist R in the conduit 210, and a stage S. A nozzle 230 that supplies the resist R onto the held wafer W, a return pipe 240 that branches from the conduit 210 and transports the resist R back to the container J, and gives or returns the resist R to the nozzle 230. The switching part 250 which switches whether to give to the pipe | tube 240, and the filter 260 which filters the resist R conveyed in the conduit | pipe 210 are provided. In FIG. 9, the transport direction of the resist R in the conduit 210 and the return pipe 240 is indicated by white arrows.

  The liquid material supply devices 100 and 200 shown in FIGS. 8 and 9 include a mechanism for circulating the resist R, and in the standby state in which the resist R is not supplied onto the wafer W, the resist R is always circulated and the filters 160 and 260 are provided. The resist R is used and filtered to suppress the stay of the resist R and remove foreign matters in the resist R.

JP-A-6-267837 Japanese Patent No. 4496833

  However, in the liquid material supply devices 100 and 200 shown in FIGS. 8 and 9, it is necessary to separately provide the circulation pipes 140 and 240 and the circulation pump 150, which increases the size and complexity of the device. There's a problem. Further, in the liquid material supply devices 100 and 200 shown in FIGS. 8 and 9, all the resist R in the container J can be made unusable because foreign matters generated during the circulation are mixed and contaminated in the container J. There is also a problem.

  Furthermore, in the liquid material supply apparatus 100 shown in FIG. 8, the resist R remaining in the conduit 110 cannot be circulated. For this reason, in this liquid material supply apparatus 100, it is difficult to reduce the consumption amount of the resist R due to the dummy dispense because the generation of foreign matters in the conduit 110 cannot be suppressed.

  On the other hand, in the liquid material supply apparatus 200 shown in FIG. 9, by bringing the switching unit 250 closer to the nozzle 230, it is possible to circulate the resist R remaining in the conduit 210 and suppress the generation of foreign matters. Therefore, in this liquid material supply apparatus 200, it is possible to reduce the consumption amount of the resist R by dummy dispensing.

  However, in this liquid material supply apparatus 200, the closer the switching unit 250 is to the nozzle 230, the longer the conduit through which the resist R is circulated. Therefore, the problems associated with the circulation of the resist R described above (upsizing and complication of the apparatus, The contamination of the resist R in the container J) becomes serious.

  Then, an object of this invention is to provide the liquid material supply apparatus which suppresses generation | occurrence | production of the foreign material in a conduit | pipe with a simple structure.

  In order to achieve the above object, the present invention provides a conduit that is a conduit through which a liquid material supplied to the outside is transported from the upstream side toward the downstream side, and the liquid material from the upstream side to the downstream side of the conduit. A transport driving force generating section that generates a transport driving force to be transported and a flow driving force that causes the liquid material to flow back and forth from at least a part of the conduit to reciprocate from upstream to downstream and from downstream to upstream. Provided is a liquid material supply device including a flow driving force generating unit.

  Furthermore, in the liquid material supply apparatus having the above characteristics, the flow driving force generator is disposed on at least a part of the conduit so that a part of the conduit is expanded and another part of the conduit is contracted. Preferably, the flow driving force is generated by applying force to deform the conduit.

  Furthermore, in the liquid material supply apparatus having the above characteristics, the flow driving force generation unit expands by pulling a part of the conduit from the outside, and contracts by compressing another part of the conduit from the outside. Thus, it is preferable to generate the flow driving force.

  Furthermore, in the liquid material supply apparatus having the above characteristics, the apparatus further includes a conduit protection portion having a layer filled with a liquid, and the conduit protection portion includes at least a portion to which a force is applied from the flow driving force generation portion of the conduit. It is preferable that it is provided so as to cover a part.

  Furthermore, in the liquid material supply apparatus having the above characteristics, it is preferable that the liquid included in the conduit protection unit is maintained at a predetermined temperature.

  Furthermore, in the liquid material supply apparatus having the above characteristics, when the transport driving force generation unit is in a standby state where the transport driving force is not generated, the fluid driving force generation unit intermittently generates the fluid driving force. It is preferable.

  Furthermore, in the liquid material supply apparatus having the above characteristics, it is preferable that the flow driving force generation unit is provided on the downstream side of the transport driving force generation unit of the conduit.

  Furthermore, in the liquid material supply apparatus having the above characteristics, the liquid material is provided between the transport driving force generation unit and the flow driving force generation unit in the conduit and is transported from the upstream side to the downstream side of the conduit. It is preferable to further include a filter that removes foreign matters contained in.

  According to the liquid material supply device having the above characteristics, it is possible to suppress the generation of foreign matter in the conduit with a simple configuration that includes a flow driving force generator that causes the liquid material to flow in at least a portion of the conduit. . Further, by suppressing the generation of foreign matter in the conduit, it is possible to reduce the amount of liquid material consumed by dummy dispensing.

1 is a flow chart schematically showing a basic configuration of a liquid material supply apparatus according to an embodiment of the present invention. The perspective view shown about an example of a structure of a flow drive force generation | occurrence | production part. Sectional drawing which shows the XX cross section of the flow drive force generation | occurrence | production part shown in FIG. Sectional drawing shown about 1st Example of a flow drive force generation | occurrence | production part. Sectional drawing shown about 2nd Example of a flow drive force generation | occurrence | production part. Sectional drawing shown about one modification of the liquid material supply apparatus which concerns on embodiment of this invention. The flow path figure shown typically about another modification of the liquid material supply apparatus which concerns on embodiment of this invention. The flow-path figure shown typically about the structure of the conventional liquid material supply apparatus. The flow-path figure shown typically about the structure of the conventional liquid material supply apparatus.

<< Basic configuration >>
First, a basic configuration of a liquid material supply apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following, for the sake of concrete explanation, a case where the liquid material supply apparatus according to the embodiment of the present invention is an apparatus for supplying a resist onto a wafer will be described.

  FIG. 1 is a flow chart schematically showing a basic configuration of a liquid material supply apparatus according to an embodiment of the present invention. As shown in FIG. 1, the liquid material supply apparatus 1 includes a conduit 10, a transport driving force generation unit 20, a flow driving force generation unit 30, an electromagnetic valve 40, and a nozzle 50. In FIG. 1, the transport direction and flow direction of the resist R in the conduit 10 are indicated by white arrows.

  The conduit 10 is a conduit that takes out the resist R in the container J and transports it to the nozzle 50. In the following, the positional relationship and the like regarding the conduit 10 will be described based on the transport direction of the resist R in the conduit 10 when the liquid material supply apparatus 1 supplies the resist R onto the wafer W. Specifically, in the following, when the liquid material supply apparatus 1 supplies the resist R onto the wafer W, the transport source side (that is, the container J side) of the resist R is “upstream”, and the transport destination side of the resist R (That is, the nozzle 50 side) is referred to as “downstream side”.

  The transport driving force generator 20 generates a transport driving force for transporting the resist R from the upstream side to the downstream side of the conduit 10, and is, for example, a pump. A suitable example of the transport driving force generator 20 is a bellows pump. Hereinafter, a state in which the transport driving force generating unit 20 generates the transport driving force is referred to as a “supply state”, and a state in which the transport driving force generating unit 20 does not generate the transport driving force is referred to as a “standby state”.

  The flow driving force generator 30 generates a flow driving force for causing the resist R to flow back and forth from at least a part of the conduit 10 from upstream to downstream and from downstream to upstream. The details of the flow driving force generation unit 30 will be described later with reference to specific examples. Hereinafter, as described above, flowing the resist R so as to reciprocate from the upstream side to the downstream side and from the downstream side to the upstream side in the conduit 10 is referred to as “reciprocating flow”.

  The electromagnetic valve 40 is a valve that is provided on the path of the conduit 10 and whose opening and closing is controlled by an electric signal given from the outside. In the supply state, the electromagnetic valve 40 is controlled to be in an open state, and allows the supply of the resist R onto the wafer W. On the other hand, in the standby state, the electromagnetic valve 40 is controlled to be in a closed state, and prohibits the supply of the resist R onto the wafer W.

  The nozzle 50 is provided at the downstream end of the conduit 10 and supplies the resist R transported in the conduit 10 onto the wafer W. The wafer W is fixed on the stage S (for example, attracted to a vacuum chuck provided on the stage S), and is supplied onto the wafer W by rotating the wafer W as the stage S rotates ( Dropped resist spreads outward. Thereby, a resist is applied to the entire surface of the wafer W. Note that the resist coating method for the wafer W is not limited to this example (a coating method for rotating the wafer W, so-called spin coating), but another coating method (for example, the nozzle 50 so that the nozzle 50 scans the wafer). Alternatively, a coating method in which at least one of the wafers W is moved, so-called scan coating, may be employed.

  In the liquid material supply apparatus 1, the transport driving force generation unit 20 generates the transport driving force in the supply state. Thereby, the resist R taken out from the container J is transported from the upstream side of the conduit 10 to the downstream side. At this time, the flow driving force generator 30 does not generate a flow driving force, and the electromagnetic valve 40 is opened, so that the resist R in the conduit 10 is transported to the nozzle 50. Then, the resist R is supplied from the nozzle 50 onto the wafer W.

  On the other hand, in the liquid material supply apparatus 1, in the standby state, the transport driving force generation unit 20 does not generate the transport driving force, and the electromagnetic valve 40 is closed. As a result, the resist R is not transported in the conduit 10, and the resist R remains in the conduit 10.

  However, in the standby state, the flow driving force generator 30 generates the flow driving force, thereby causing the resist R remaining in the conduit 10 to reciprocate in the conduit 10. As a result, the resist R remaining in the conduit 10 is prevented from staying, and the generation of foreign matter can be suppressed.

  As described above, the liquid material supply apparatus 1 according to the embodiment of the present invention has a simple configuration in which the flow driving force generation unit 30 that causes the resist R to flow in at least a part of the conduit 10 is provided. It is possible to suppress the generation of foreign matter. Then, by suppressing the generation of foreign matter in the conduit 10, it is possible to reduce the consumption amount of the resist R by dummy dispensing.

  The liquid material supply apparatus 1 illustrated in FIG. 1 has a configuration in which one flow driving force generation unit 30 is provided on the path of the conduit 10, but a plurality of flow driving force generation units 30 are provided on the path of the conduit 10. May be provided.

  The liquid material supply apparatus 1 illustrated in FIG. 1 has a configuration in which a flow driving force generation unit 30 is provided on the downstream side of the transport driving force generation unit 20 and the upstream side of the electromagnetic valve 40 in the conduit 10. The position where the force generation unit 30 is provided is not limited to this example, and may be any position on the path of the conduit 10.

  However, if the flow driving force generation unit 30 is provided on the downstream side of the transport driving force generation unit 20 in the conduit 10, the resist R remaining in the conduit 10 actively flows in the standby state after the transportation is completed. By making it possible, it becomes possible to effectively suppress the generation of foreign matters, which is preferable.

  Further, the flow driving force generator 30 does not need to keep the remaining resist R constantly flowing in the standby state, and can suppress the generation of foreign matters only by flowing it intermittently. Specifically, for example, when the resist R is not supplied for more than one hour, the fluid driving force generator 30 may generate a fluid driving force that causes the resist R to flow about five reciprocations every hour. Can be suppressed. In addition, the generation frequency of the flow driving force by the flow driving force generation unit 30 may be appropriately selected according to the properties of the resist R and the like.

  As described above, when the flow driving force generation unit 30 intermittently generates the flow driving force, it is possible to suppress energy consumption in the standby state and to suppress generation of foreign matters due to excessive flow. It becomes possible.

<< Flow driving force generator >>
Next, specific examples of the flow driving force generation unit 30 will be described with reference to the drawings. FIG. 2 is a perspective view showing an example of the configuration of the flow driving force generator. FIG. 3 is a cross-sectional view showing the XX cross section of the flow driving force generator shown in FIG. 3A and 3B respectively show two states that the flow driving force generator 30 can take in the standby state.

  In the flow driving force generation unit 30 illustrated in FIG. 2, a part of the deformation area 11 is enlarged and a part of the deformation area 11 is reduced with respect to the deformation area 11 which is a partial area of the conduit 10. As described above, conduit deformation portions 31 and 32 that deform the deformation region 11 by applying a force to at least a part of the deformation region 11 are provided. The conduit deformation portion 31 is provided on the upstream side of the conduit 10, and the conduit deformation portion 32 is provided on the downstream side of the conduit 10. Moreover, the deformation | transformation area | region 11 reducing is that the cross-sectional area of a cross section perpendicular | vertical with respect to the transport direction (left direction in a figure) of the deformation | transformation area | region 11 becomes small, for example. Moreover, the deformation | transformation area | region 11 expanding is that the cross-sectional area of a cross section perpendicular | vertical with respect to the transport direction (left direction in a figure) of the deformation | transformation area | region 11 becomes large, for example.

  As shown in FIG. 3A, in the flow driving force generator 30 of this example, the conduit deformation portion 31 is contracted by compressing the upstream side of the deformation region 11 from the outside, and the conduit deformation portion 32 is deformed. It expands by pulling the downstream side of the region 11 from the outside. Thereby, in the deformation region 11, the resist R flows from the upstream side to the downstream side. In FIG. 3A, the flow direction of the resist R in the deformation region 11 is indicated by white arrows.

  Further, as shown in FIG. 3B, in the flow driving force generation unit 30 of this example, the conduit deformation portion 31 expands by pulling the upstream side of the deformation region 11 from the outside, and the conduit deformation portion 32 Reduction is performed by compressing the downstream side of the deformation region 11 from the outside. Thereby, in the deformation region 11, the resist R flows from the downstream side to the upstream side. In FIG. 3B, the flow direction of the resist R in the deformation region 11 is indicated by white arrows.

  As described above, the flow driving force generation unit 30 of this example can reciprocate the resist R remaining in the conduit 10 while remaining in the conduit 10. As a result, the resist R can be made to flow without being circulated, so that the generation of foreign matters is suppressed without causing problems associated with circulation (enlargement and complexity of the apparatus, contamination of the resist R in the container J). It becomes possible to do.

  2 and 3 exemplify a pair of conduit deformation portions 31 and 32 in which one compresses the deformation region 11 and the other pulls the deformation region 11, but a force is simultaneously applied from the conduit deformation portions 31 and 32. A configuration that is not applied (for example, a configuration in which the conduit deforming portions 31 and 32 alternately apply force) may be employed. However, in this case, from the viewpoint of sufficiently reciprocating the resist R remaining in the conduit 10, a part of the deformation region 11 is deformed (reduced or enlarged) by applying a force to one of the conduit deforming portions 31 and 32. ), Another part of the deformation region 11 (for example, the part where the other one of the conduit deformation parts 31 and 32 is installed) is configured to cause a deformation (enlargement or reduction) opposite to this (for example, It is preferable to absorb a pressure fluctuation of the resist R caused by a partial deformation of the deformation region 11 and to provide a portion having high elasticity so as to be able to be deformed in the opposite direction.

  Furthermore, as described above, when a part of the deformation region 11 is deformed (reduced or enlarged), if a deformation opposite to this occurs in another part, there is one conduit deformation part. Even if only, it is possible to reciprocate the resist R in the conduit 10. On the contrary, the flow driving force generation unit 30 may include three or more conduit deformation portions. As the number of conduit deformation portions increases, various portions in the deformation region 11 can be arbitrarily deformed, so that the resist R can be easily reciprocated.

  However, a pair of conduit deformation portions 31 in which one compresses the deformation region 11 and the other pulls the deformation region 11 at the same time as illustrated in FIGS. 2 and 3 in the conduit deformation portion included in the flow driving force generation unit 30. , 32 is included, it is possible to increase the pressure difference (that is, the flow driving force) of the resist R caused by the expansion and contraction of the deformation region 11, and a large amount of resist R is reciprocated over a wide range. This is preferable.

  Further, when a pair of conduit deforming portions 31 and 32 as illustrated in FIGS. 2 and 3 are provided as the flow driving force generating portion 30, the conduit deforming portions 31 and 32 may be mechanically interlocked. In this case, since one of the conduit deformation portions 31 and 32 is controlled to compress the deformation region 11 and the other automatically pulls the deformation region 11, the operation control of the conduit deformation portions 31 and 32 is performed. It can be made easy.

  Further, when the flow driving force generator 30 of this example is employed, it is preferable that at least the deformation region 11 of the conduit 10 is made of a material that can withstand deformation by the conduit deforming portion 32. For example, it is preferable that at least the deformation region 11 of the conduit 10 is made of a stretchable material. Furthermore, it is preferable that at least the deformation region 11 of the conduit 10 is made of a material having chemical resistance. Specifically, for example, it is preferable that at least the deformation region 11 of the conduit 10 is made of perfluoroelastomer represented by Kalrez (registered trademark), Teflon (registered trademark), polyethylene, or the like.

  In addition, when the flow driving force generating unit 30 is configured by a plurality of conduit deforming portions, it is preferable that each conduit deforming portion is configured by the same type of device because the control of the operation becomes simple. For example, one of the conduit deformation portions 31 and 32 may be configured in a first embodiment described later, and the other in a second embodiment described later.

  2 and 3 exemplify a case where the flow driving force generation unit 30 is configured by conduit deformation portions 31 and 32 that expand and contract the deformation region 11 by applying a force from outside the deformation region 11. However, you may comprise by the conduit | pipe deformation | transformation part which applies a force from the inside of the deformation | transformation area | region 11, and expands and contracts the deformation | transformation area | region 11. FIG. However, as illustrated in FIG. 2 and FIG. 3, if the flow driving force generating unit 30 is configured with conduit deforming portions 31 and 32 that expand and contract the deforming region 11 by applying a force from the outside of the deforming region 11, This is preferable because the structure of the driving force generation unit 30 can be simplified and the transport and flow of the resist R in the conduit 10 can be prevented.

<First embodiment>
Next, specific examples (first example and second example) of the flow driving force generator 30 shown in FIGS. 2 and 3 will be described with reference to the drawings. First, a first embodiment of the flow driving force generator 30 shown in FIGS. 2 and 3 will be described with reference to the drawings. FIG. 4 is a cross-sectional view showing the first embodiment of the flow driving force generator. 4A and 4B show a cross section (XX cross section, see FIG. 2) in the same state as FIGS. 3A and 3B, and the resist in the deformation region 11 is shown. The flow direction of R is indicated by white arrows.

  As shown in FIG. 4, the flow driving force generator 30A of the first embodiment includes an annular pressure regulator 31A as the conduit deforming portion 31 (see FIGS. 2 and 3), and the conduit deforming portion 32 (see FIG. 4). 2 and FIG. 3), an annular pressure regulator 32A is provided.

  The annular pressure boosters 31 </ b> A and 32 </ b> A are hollow annular rings provided along the outer peripheral surface of the deformation region 11, and the inner peripheral surfaces of the annular pressure boosters 31 </ b> A and 32 </ b> A are connected to the outer peripheral surface of the deformation region 11. At least a part of the annular pressure increasing / decreasing machines 31A and 32A (particularly, the inner peripheral surface connected to the deformation region 11) is made of a stretchable material such as rubber, and gas is sent into the interior by an air pump or the like. It expands and contracts when the internal gas is sucked by an air pump or the like.

  When gas is sent into the annular pressure increasing / decreasing devices 31A and 32A and expanded, the annular pressure increasing / decreasing devices 31A and 32A compress the deformation region 11 from the surroundings, and the deformation region 11 is reduced (the annular shape in FIG. 4A). The pressure booster 31A and the annular pressure booster 32A in FIG. On the other hand, when the gas inside the annular pressure increasing / decreasing devices 31A and 32A is sucked and contracted, the annular pressure increasing / decreasing devices 31A and 32A pull the deformation region 11 from the surroundings, and the deformation region 11 expands (FIG. 4A). No. 32A of the annular pressure-intensifier and the annular pressure-intensifier 31A in FIG. 4B).

  In addition, about a pair of annular pressure regulator 31A, 32A, it is good also as a structure (namely, the structure which interlock | cooperates mechanically mentioned above) in which the gas attracted | sucked from one side is sent to the other. In this case, it is possible to simplify the configuration by reducing the number of air pumps and the like that control the gas in the annular pressure increase / decrease units 31A and 32A.

  FIG. 4 illustrates the annular pressure increase / decrease units 31A and 32A whose expansion and contraction are controlled by taking in and out the gas inside, but the expansion and contraction are controlled by taking in and out a fluid (for example, liquid) other than gas. You may employ | adopt the cyclic | annular booster / reducer.

<Second embodiment>
Next, a second embodiment of the flow driving force generator 30 shown in FIGS. 2 and 3 will be described with reference to the drawings. FIG. 5 is a cross-sectional view showing a second embodiment of the flow driving force generator. 5A and 5B show a cross section (XX cross section, see FIG. 2) in the same state as FIGS. 3A and 3B, and the resist in the deformation region 11 is shown. The flow direction of R is indicated by white arrows.

  As shown in FIG. 5, the flow driving force generator 30B of the second embodiment includes arcuate pushers 31B1 and 31B2 as the conduit deforming portion 31 (see FIGS. 2 and 3), and the conduit As the deforming portion 32 (see FIGS. 2 and 3), arc-shaped pushers 32B1 and 32B2 are provided.

  The arc-shaped push / pull machines 31B1 and 31B2 are provided so as to sandwich the deformation area 11 from a direction perpendicular to the transport direction (left direction in the figure) (up and down direction in the figure, hereinafter referred to as “vertical direction”). An arc-shaped member Pa (for example, a fan-shaped (semicircle) arc having a central angle of 180 degrees) that is arranged along the outer peripheral surface of 11 and connected to the outer peripheral surface is perpendicular to the arc-shaped member Pa. A columnar member Pc protruding in the direction is connected. The arcuate pushers 32B1 and 32B2 have the same shape as the arcuate pushers 31B1 and 31B2.

  The arcuate push / pull machines 31B1 and 31B2 are driven in the vertical direction by an actuator or the like connected to the columnar member Pc. Specifically, the arc-shaped push / pull machines 31B1 and 31B2 are driven to simultaneously push the deformation area 11 (that is, compress the deformation area 11) (see FIG. 5A), and the deformation area 11 is simultaneously moved. It is driven to pull (see FIG. 5B). Then, the arcuate push / pull machines 31B1 and 31B2 simultaneously push the deformation area 11 to reduce the deformation area 11 (see FIG. 5A), and simultaneously pull the deformation area 11 to enlarge the deformation area 11 ( (Refer FIG.5 (b)).

  The arc-shaped push / pull machines 32B1 and 32B2 are similarly driven in the vertical direction by an actuator or the like connected to the columnar member Pc. Specifically, the arc-shaped push / pull machines 32B1 and 32B2 are driven to simultaneously push the deformation area 11 (that is, compress the deformation area 11) (see FIG. 5B), and the deformation area 11 is simultaneously moved. It is driven to pull (see FIG. 5A). Then, the arcuate push / pull machines 32B1 and 32B2 simultaneously push the deformation area 11 to reduce the deformation area 11 (see FIG. 5B), and simultaneously pull the deformation area 11 to enlarge the deformation area 11 ( (See FIG. 5 (a)).

  From the viewpoint of avoiding interference of the apparatus when the deformation area 11 is pushed in, the shape of the member Pa in the arc-shaped push / pull machines 31B1 and 31B2 may be a fan-shaped arc whose central angle is smaller than 180 degrees. The drive directions of the arc-shaped push / pull machines 31B1 and 31B2 may be shifted (each drive direction is parallel to the vertical direction but not on the same straight line). The same applies to the arc-shaped push / pull machines 32B1 and 32B2.

  Also, one of the arcuate pushers 31B1 and 31B2 and the arcuate pushers 32B1 and 32B2 as a pair (the arcuate pushers 31B1 and 32B1) and the other (the arcuate pushers 31B2 and 32B2). ) Are connected by a crankshaft or the like, for example, when one pushes in the deformation region 11, the other pulls the deformation region 11, and when one pulls the deformation region 11, the other pushes the deformation region 11 (that is, The above-described mechanically interlocking configuration may be employed. In this case, it is possible to simplify the configuration by reducing the number of motors and the like for driving and controlling each of the arcuate pushers 31B1 and 31B2 and the arcuate pushers 32B1 and 32B2.

  Further, in FIG. 5, two arcuate pushers 31B1 and 31B2 and two arcuate pushers 32B1 and 32B2 arranged so as to sandwich the deformation region 11 from two directions are illustrated. A set of three or more arc-shaped stamps arranged so as to sandwich the deformation region 11 from three or more directions may be adopted.

<< Modification >>
Hereinafter, modified examples of the liquid material supply device according to the embodiment of the present invention will be described with reference to the drawings. Note that the modifications described below can be implemented in combination as long as there is no contradiction. In the following description, portions different from the above-described liquid material supply device 1 (that is, deformed portions) will be described, and description of portions similar to those of the above-described liquid material supply device 1 will be omitted.

[1] A modification of the liquid material supply apparatus according to the embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a cross-sectional view showing one modification of the liquid material supply apparatus according to the embodiment of the present invention. 6A and 6B show a cross section (XX cross section, see FIG. 2) in the same state as FIGS. 3A and 3B. The resist in the deformation region 11 is shown in FIGS. The flow direction of R is indicated by white arrows.

  As shown in FIG. 6, in the liquid material supply apparatus according to this modification, a conduit protection unit 12 having a layer filled with a liquid L (for example, water) is provided so as to cover the deformation region 11. In this case, the conduit deforming portions 31 and 32 apply a force (compress, pull) to the deformed region 11 via the conduit protecting portion 12 having the liquid L layer.

  Thus, when the conduit protection part 12 is provided so as to cover the deformation region 11, the force applied by the conduit deformation portions 31 and 32 is indirectly applied to the deformation region 11 through the liquid L layer. . Therefore, it becomes possible to suppress that the deformation | transformation area | region 11 is damaged by the force which the conduit | pipe deformation | transformation parts 31 and 32 apply.

  In the liquid material supply apparatus according to this modification, it is preferable to maintain the liquid L at a predetermined temperature (in particular, a temperature of 20 ° C. or more and 25 ° C. or less suitable for application of the resist R). In this case, for example, the liquid L adjusted to have a predetermined temperature using a temperature regulator equipped with a thermostat and a heater (or chiller) may be circulated through the conduit protection unit 12. Further, for example, the temperature regulator may be brought into contact with at least a part of the conduit protection unit 12 so that the liquid L inside the conduit protection unit 12 is held at a predetermined temperature.

  If comprised in this way, the temperature of the resist R conveyed by the conduit | pipe 11 can be made into the temperature suitable for application | coating of the resist R. FIG. The resist R varies in film thickness distribution of the resist pattern to be formed in accordance with the temperature at the time of application (more specifically, when dropping from the nozzle 50). Therefore, if the resist R is configured as described above and kept at an appropriate temperature, a uniform resist pattern can be created with good reproducibility.

  Further, from the viewpoint of obtaining the effect of suppressing the damage of the deformation region 11 described above, the conduit protection unit 12 is provided so as to cover at least a part of a portion to which a force is applied from the flow driving force generation unit 30 of the deformation region 11. It only has to be. Further, from the viewpoint of accurately maintaining the temperature of the resist R, the conduit protection unit 12 may be provided not only in the deformation region 11 but also in a region other than the deformation region 11 of the conduit 10.

[2] Another modification of the liquid material supply apparatus according to the embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a flow chart schematically showing another modified example of the liquid material supply apparatus according to the embodiment of the present invention. In FIG. 7, the transport direction and flow direction of the resist R in the conduit 10 are indicated by white arrows.

  As shown in FIG. 7, the liquid material supply apparatus 1 </ b> M of the present modification example is located downstream of the transport driving force generation unit 20 and upstream of the flow driving force generation unit 30, from the upstream side of the conduit 10 toward the downstream side. A filter 60 for removing foreign substances contained in the resist R to be transported is provided.

  The flow driving force generator 30 can suppress the formation of foreign matters in a partial region (deformation region 11) in the conduit 10. However, in regions other than the deformation region 11, particularly in a region downstream of the transport driving force generation unit 20 and upstream of the flow driving force generation unit 30, the resist R remains in the standby state after the transportation is completed. The flow driving force generated by the flow driving force generator 30 does not sufficiently act on the resist R, and foreign matter may be generated.

  However, in the liquid material supply apparatus 1M of the present modification, even if foreign matter is generated from the region upstream of the transport driving force generation unit 20 and downstream of the flow driving force generation unit 30, the foreign matter is removed by the filter 60. Since it can be removed, it is possible to suppress the foreign matter from being supplied to the outside.

  In the liquid material supply apparatus 1M according to the present modification, the filter 60 is installed in the immediate vicinity of the upstream side of the flow driving force generation unit 30, and the flow driving force generation unit 30 and the filter 60 are arranged as downstream as possible from the conduit 10. If it installs in, it can suppress effectively that a foreign material is supplied outside, and it is preferable.

[3] Although the liquid material supply apparatus that supplies the resist R onto the wafer W has been described as an example of the embodiment of the present invention, the present invention is another liquid material supply that supplies a liquid material other than the resist R. Even an apparatus is applicable. However, the present invention is preferably applied to a liquid supply apparatus that supplies a liquid material that can generate foreign matters by being left in the conduit for a long time.

  In addition, when the present invention is applied to a liquid material supply apparatus that supplies the resist R onto the wafer W, a liquid material supply apparatus that supplies a relatively expensive resist such as a color resist used for forming a color filter (ie, a color resist) The present invention is preferably applied to a liquid material supply apparatus) that has a large loss due to dummy dispensing.

<Summary>
The liquid material supply devices 1 and 1M according to the embodiment of the present invention can be grasped as follows, for example.

  The liquid material supply devices 1 and 1M according to the embodiment of the present invention include a conduit 10 that is a conduit through which a liquid material R supplied to the outside is transported from an upstream side toward a downstream side, and an upstream side of the conduit 10. A transport driving force generator 20 for generating a transport driving force for transporting the liquid material R from the downstream side to the downstream side, and at least a part of the conduit 10 so as to reciprocate from the upstream side to the downstream side and from the downstream side to the upstream side. Flow driving force generation units 30, 30 </ b> A, and 30 </ b> B that generate a flow driving force for flowing the liquid material R.

  In this liquid material supply device 1, 1 </ b> M, the flow driving force generators 30, 30 </ b> A, 30 </ b> B generate a flow driving force to reciprocate the liquid material R remaining in the conduit 10 within the conduit 10. . As a result, the retention of the liquid material R remaining in the conduit 10 is hindered, so that the generation of foreign matters can be suppressed.

  Therefore, in this liquid material supply device 1, 1 </ b> M, a simple structure of including the flow driving force generation units 30, 30 </ b> A, 30 </ b> B that cause the liquid material R to flow in at least a part of the conduit 10 can be used. Occurrence can be suppressed. Then, by suppressing the generation of foreign matter in the conduit 10, it is possible to reduce the consumption amount of the liquid material R due to the dummy dispense.

  Further, the liquid material supply devices 1, 1 </ b> M have the flow driving force generators 30, 30 </ b> A, 30 </ b> B so that a part of the conduit 10 is expanded and another part of the conduit 10 is contracted. However, the flow driving force is generated by deforming the conduit 10 by applying a force to at least a part of the conduit 10.

  In this liquid material supply device 1, 1 </ b> M, the resist R remaining in the conduit 10 can be reciprocated while remaining in the conduit 10. As a result, the resist R can be made to flow without being circulated, so that the generation of foreign matters is suppressed without causing problems associated with circulation (enlargement and complexity of the apparatus, contamination of the resist R in the container J). It becomes possible to do.

  In addition, the liquid material supply devices 1 and 1M are expanded by the flow driving force generators 30, 30 </ b> A, and 30 </ b> B pulling a part of the conduit 10 from the outside, and another one of the conduits 10. The flow driving force is generated by reducing the size by compressing the portion from the outside.

  In this liquid material supply apparatus 1, 1 M, it becomes possible to increase the pressure difference (that is, flow driving force) of the resist R caused by expansion and contraction of the conduit 10, and a large amount of resist R is reciprocated over a wide range. Is possible.

  The liquid material supply devices 1 and 1M further include a conduit protection unit 12 having a layer filled with a liquid, and the conduit protection unit 12 includes the flow driving force generation units 30 and 30A of the conduit 10. , 30B is provided so as to cover at least part of the portion to which the force is applied.

  In this liquid material supply device 1, 1 </ b> M, the force applied by the flow driving force generators 30, 30 </ b> A, 30 </ b> B is indirectly applied to the conduit 10 through the liquid L layer. Therefore, it becomes possible to suppress that the conduit | pipe 10 is damaged with the force which the flow drive force generation | occurrence | production parts 30, 30A, and 30B apply.

  In the liquid material supply devices 1 and 1M, the liquid L included in the conduit protection unit 12 is maintained at a predetermined temperature.

  In the liquid material supply devices 1 and 1M, liquid materials having different characteristics depending on the temperature at the time of supply can be supplied with good reproducibility. For example, the distribution of the film thickness of the resist pattern formed on the resist R varies depending on the temperature at the time of application (more specifically, when dropping from the nozzle 50). Therefore, if the resist R is configured as described above and kept at an appropriate temperature, it becomes possible to create a uniform resist pattern with good reproducibility.

  In addition, the liquid material supply devices 1 and 1M are configured so that the flow driving force generation units 30, 30A, and 30B are in the standby state in which the transport driving force generation unit 20 does not generate the transport driving force. The driving force generators 30, 30A, 30B intermittently generate the flow driving force.

  In the liquid material supply devices 1 and 1M, it is possible to suppress energy consumption in a standby state in which the transport driving force generation unit 20 does not generate transport driving force, and to suppress generation of foreign matters due to excessive flow. It becomes possible.

  In the liquid material supply devices 1 and 1M, the flow driving force generation units 30, 30A and 30B are provided on the downstream side of the transport driving force generation unit 20 of the conduit.

  In this liquid material supply device 1, 1 </ b> M, it is possible to effectively suppress the generation of foreign matters by actively flowing the resist R remaining in the conduit 10 in the standby state after the transportation is completed. Become.

  The liquid material supply apparatus 1M is provided between the transport driving force generation unit 20 and the flow driving force generation units 30, 30A, and 30B in the conduit 10, and from the upstream side to the downstream side of the conduit 10. A filter 60 is further provided for removing foreign substances contained in the liquid material R that is transported toward the vehicle.

  In this liquid material supply apparatus 1M, even if foreign matter is generated from the region upstream of the transport driving force generation unit 20 and downstream of the flow driving force generation unit 30, the foreign matter can be removed by the filter 60. Therefore, it is possible to suppress the foreign matter from being supplied to the outside.

  The present invention can be applied to a liquid material supply apparatus that supplies a liquid material such as a resist.

DESCRIPTION OF SYMBOLS 1,1M: Liquid material supply apparatus 10: Conduit 11: Deformation area | region 12: Conduit protection part 20: Transport drive force generation part 30, 30A, 30B: Flow drive force generation part 31, 32: Conduit deformation part 31A, 32A: Annular Pressurizer 31B1, 31B2, 32B1, 32B2: Arc-shaped pusher 40: Solenoid valve 50: Nozzle 60: Filter R: Resist (liquid material)
L: Liquid

Claims (6)

A conduit that is a conduit through which the liquid material supplied to the outside is transported from the upstream side toward the downstream side;
A transport driving force generating section for generating a transport driving force for transporting the liquid material from the upstream side to the downstream side of the conduit;
A flow driving force generator for generating a flow driving force for flowing the liquid material so as to reciprocate from upstream to downstream and from downstream to upstream in at least a portion of the conduit;
A liquid material supply device comprising:   The flow driving force generator applies a force to at least a portion of the conduit to deform the conduit so that a portion of the conduit expands and another portion of the conduit contracts. The liquid material supply device according to claim 1, wherein the fluid driving force is generated.   The flow driving force generator generates the flow driving force by expanding a part of the conduit by pulling it from the outside and reducing another part of the conduit by compressing it from the outside. The liquid material supply apparatus according to claim 2. A conduit protector having a layer filled with liquid,
4. The liquid material supply device according to claim 2, wherein the conduit protection unit is provided so as to cover at least a part of a portion to which a force is applied from the flow driving force generation unit of the conduit. 5. .   The liquid material supply apparatus according to claim 4, wherein the liquid included in the conduit protection unit is maintained at a predetermined temperature.   The flow driving force generation unit intermittently generates the flow driving force when the transport driving force generation unit is in a standby state in which the transportation driving force is not generated. The liquid material supply apparatus of any one of Claims.

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