JP2010270820A - Pipe, cooling device, exposure device, and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pipe securing the vacuum within a chamber with high reliability while maintaining flexibility of the pipe, an exposure device, and a method for manufacturing a device. <P>SOLUTION: The pipe includes a first pipe 34 in which a refrigerant flows; a second pipe 35 covering the outside of the first pipe 34 with the inner circumferential surface thereof being separated from the outer circumferential surface of the first pipe 34 by a predetermined distance; and liquid mercury filled between the outer circumferential surface of the first pipe 34 and the inner circumferential surface of the second pipe 35. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to, for example, piping provided in a chamber of an exposure apparatus, a cooling apparatus including the piping, an exposure apparatus including the cooling apparatus, and a device manufacturing method using the exposure apparatus.

  Generally, in an exposure apparatus that transfers an image of a pattern onto a wafer using EUV (Extreme Ultraviolet) light, EB (Electron Beam), or the like, the interior of the chamber is set to a vacuum atmosphere in order to suppress attenuation of the exposure light. Yes. In such an exposure apparatus, when the exposure process is performed in a state where the wafer absorbs a part of the exposure light and is thermally deformed, there is a possibility that the pattern image transferred to the wafer is distorted. Therefore, in an exposure apparatus, piping for supplying a coolant to a wafer stage that supports a wafer is usually connected. The wafer is cooled by the refrigerant supplied through the pipe, so that the thermal deformation is suppressed. In recent years, various pipes that ensure flexibility have been proposed as pipes connected to the wafer stage so that they can respond to changes in movement when the wafer stage is driven during wafer positioning (for example, patents). Reference 1).

  That is, the pipe shown in Patent Document 1 includes an inner resin layer made of a highly flexible resin material, a thin metal layer that covers the outside of the resin layer, and an outer resin layer that covers the outside of the metal layer. It is configured. In general, metal has a property that the amount of liquid or gas that permeates is extremely small as compared with resin. Therefore, the metal layer plays a role of suppressing the refrigerant flowing in the inner resin layer in the pipe from passing through the inner resin layer and the outer resin layer and leaking out of the pipe. Moreover, since the metal layer is formed into a thin film with a sufficiently small thickness, the flexibility of the pipe can be maintained.

JP 2003-247676 A

  By the way, in the piping shown in Patent Document 1, the metal layer interposed between the inner resin layer and the outer resin layer is broken by metal fatigue when repeatedly deformed in conjunction with the change in the movement of the wafer stage (positioning device). It is possible to do. In this case, at the broken location, the outer peripheral surface of the inner resin layer and the inner peripheral surface of the outer resin layer are opposed to each other through a fractured gap of the metal layer. Therefore, when the refrigerant flowing inside the inner resin layer permeates the inner resin layer, after reaching the inner peripheral surface of the outer resin layer via the fractured gap of the metal layer, the outer periphery of the outer resin layer There is a possibility that the degree of vacuum in the chamber is lowered by permeating to the surface side and leaking into the chamber.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a pipe capable of suppressing the fluid flowing in the pipe from leaking out of the pipe while maintaining the flexibility of the pipe, and the pipe. A cooling apparatus including the above, an exposure apparatus including the cooling apparatus, and a device manufacturing method using the exposure apparatus.

In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 5 shown in the embodiment.
The pipe of the present invention includes a first pipe (34) through which a fluid flows, and the first pipe (34) in a state in which an inner peripheral surface is separated from the outer peripheral surface of the first pipe (34) by a predetermined distance. A second pipe (35) covering the outside of the first pipe (34), and a liquid filler filled between the outer peripheral surface of the first pipe (34) and the inner peripheral surface of the second pipe (35). This is the summary.

  According to the above configuration, the fluid flowing in the first pipe passes through the first pipe and the second pipe and leaks out of the pipe. The outer peripheral surface of the first pipe and the inner peripheral surface of the second pipe It is suppressed by the liquid filler filled in between. Further, since the liquid filler has fluidity, when the pipe is deformed, it flows between the outer peripheral surface of the first pipe and the inner peripheral surface of the second pipe according to the deformation of the pipe. By doing so, the flexibility of the piping can be maintained.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings shown in the embodiments, but it goes without saying that the present invention is not limited to the embodiments.

  According to the present invention, it is possible to suppress the fluid flowing in the pipe from leaking out of the pipe while maintaining the flexibility of the pipe.

1 is a schematic block diagram that shows an exposure apparatus of the present embodiment. Sectional drawing which shows the 1st cooling water supply pipeline of this embodiment. FIG. 3 is a sectional view taken along line 3-3 in FIG. 2. The flowchart of the manufacture example of a device. The detailed flowchart regarding the board | substrate process in the case of a semiconductor device.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS.
As shown in FIG. 1, the exposure apparatus 11 of this embodiment uses extreme ultraviolet light, ie, EUV (Extreme Ultraviolet) light, which is a soft X-ray region having a wavelength of about 100 nm or less, emitted from a light source device 12 as exposure light. This is an EUV exposure apparatus used as an EL (radiation beam). Such an exposure apparatus 11 includes a chamber 13 (indicated by a two-dot chain line in FIG. 1) in which an illumination optical system 14, a reticle holding mechanism 15, a projection optical system 16, and a wafer holding mechanism 17 are installed. The inside of the chamber 13 is set to a vacuum atmosphere, and the degree of vacuum is high enough to perform exposure processing using EUV light in the chamber 13.

  Then, the exposure light EL that has entered the chamber 13 from the light source device 12 illuminates the reticle R held by the reticle holding mechanism 15 via the illumination optical system 14 disposed in the chamber 13. The reticle R is composed of a reflective reticle (reflective mask) on which a predetermined pattern is formed. Further, the exposure light EL reflected by the reticle R irradiates the wafer W held by the wafer holding mechanism 17 via the projection optical system 16 arranged in the chamber 13. A photosensitive material such as a resist is applied to the surface of the wafer W.

  The illumination optical system 14 includes a housing 18 in which the inside is set to a vacuum atmosphere, similarly to the inside of the chamber 13. In the casing 18, a plurality of reflection mirrors (not shown) that can reflect the exposure light EL incident from the light source device 12 into the casing 18 are provided. Then, the exposure light EL sequentially reflected by the respective reflection mirrors is incident on a reflection mirror 19 for folding installed in a lens barrel 23 described later, and the exposure light EL reflected by the reflection mirror 19 is reflected by the reticle holding mechanism 15. To the reticle R held on the surface.

  The reticle holding mechanism 15 is disposed on the object plane side of the projection optical system 16, and includes a first electrostatic chuck holding device 20 for electrostatic chucking of the reticle R, and the first electrostatic chuck holding device 20. A reticle stage 21 that supports the reticle R, and a reticle stage drive unit 22 that moves the reticle stage 21 in the Y-axis direction (left-right direction in FIG. 1) with a predetermined stroke. In this embodiment, the reticle stage 21 functions as a holding unit (first holding unit) that holds the reticle R while being displaced according to the driving of the reticle stage driving unit 22.

  The projection optical system 16 is an optical system that reduces an image of a pattern formed by illuminating the pattern surface Ra of the reticle R with exposure light EL to a predetermined reduction magnification (for example, 1/4 times). As with the interior of the lens, a lens barrel 23 whose interior is set to a vacuum atmosphere is provided. A plurality of reflection mirrors 24 (six as an example, only one is shown in FIG. 1) are accommodated in the lens barrel 23. Then, the exposure light EL guided from the reticle R side, which is the object surface side, is sequentially reflected by each mirror 24 and guided to the wafer W held by the wafer holding mechanism 17.

  The wafer holding mechanism 17 includes a second electrostatic chuck holding device 25 for electrostatic chucking of the wafer W, a wafer stage 26 for supporting the wafer W via the second electrostatic chuck holding device 25, and the wafer stage. And a wafer stage drive unit 27 that moves the motor 26 with a predetermined stroke in the Y-axis direction. In this embodiment, the wafer stage 26 functions as a holding unit (second holding unit) that holds the wafer W while being displaced in accordance with the driving of the wafer stage driving unit 27.

  When a pattern image is projected onto the wafer W using the exposure apparatus 11 of the present embodiment, the reticle stage is driven by the reticle stage drive unit 22 while the illumination area of the illumination optical system 14 is irradiated onto the reticle R. 21 and the reticle R are moved at predetermined strokes in the Y-axis direction (for example, from the + Y direction side to the -Y direction side (in FIG. 1, from the right side to the left side)). At the same time, the wafer stage driving unit 27 drives the wafer W together with the wafer stage 26 at a speed ratio corresponding to the reduction magnification of the projection optical system 16 with respect to the movement of the reticle R along the Y axis direction (for example, the Y axis direction (for example, , And move in synchronization with the + Y direction (from left to right in FIG. 1) from the −Y direction. When the pattern formation on one shot area is completed, the pattern formation on the other shot areas of the wafer W is continuously performed.

Next, a cooling device 28 for cooling the reticle stage 21 and the wafer stage 26 will be described.
As shown in FIG. 1, the cooling device 28 is provided with a first cooling water supply pipe 29 as a pipe for supplying cooling water into the reticle stage 21 and collecting cooling water from the reticle stage 21 side. ing. In the reticle stage 21, a first fluid flow path 30 is formed in which cooling water supplied from the cooling device 28 via the first cooling water supply pipe 29 flows. The cooling water flowing in the first fluid flow path 30 absorbs heat energy from the reticle R via the first electrostatic adsorption holding device 20 to cool the reticle R.

  Further, the cooling device 28 is provided with a second cooling water supply pipe 31 as a pipe for supplying cooling water into the wafer stage 26 and collecting the cooling water from the wafer stage 26 side. In addition, a second fluid flow path 32 in which cooling water supplied from the cooling device 28 via the second cooling water supply conduit 31 flows is formed in the wafer stage 26. The cooling water flowing in the second fluid flow path 32 cools the wafer W by absorbing thermal energy from the wafer W via the second electrostatic adsorption holding device 25.

  Next, the configuration of the pipe extending from the cooling device 28 will be described below with reference to FIGS. In the present embodiment, the cooling water supply pipes 29 and 31 that connect the cooling device 28 to the reticle stage 21 and the wafer stage 26 have the same configuration. Therefore, in the following description, the configuration of the first cooling water supply conduit 29 that connects the cooling device 28 and the reticle stage 21 will be described in detail.

  As shown in FIGS. 2 and 3, the first cooling water supply pipe 29 includes a cylindrical first pipe 34 in which a flow path 33 for flowing cooling water as a fluid is formed, and the first cooling water supply pipe 29. A cylindrical second pipe is arranged so as to cover the outside of the first pipe 34 in a state where the pipe diameter is larger than that of the first pipe 34 and the inner peripheral surface is separated from the outer peripheral surface of the first pipe 34 by a predetermined distance. It consists of a pipe 35. That is, the first cooling water supply pipe 29 has a relatively small first pipe 34 and a second pipe 35 in the relatively large diameter second pipe 35 of the first pipe 34 and the second pipe 35. It has a double piping structure inserted so as to be coaxially arranged. In addition, both the 1st piping 34 and the 2nd piping 35 consist of urethane resin which is a flexible material which has a softness | flexibility, and the 1st cooling water supply conduit 29 is meandering in the middle of the longitudinal direction. It can be deformed.

  Further, a space area 36 having a substantially annular cross section is formed between the outer peripheral surface of the first pipe 34 and the inner peripheral surface of the second pipe 35 in the first cooling water supply pipe 29. It is formed so as to extend along the extending direction. The first pipe 34 and the second pipe 35 have one end in the longitudinal direction (the end on the reticle stage 21 side in this embodiment) that seals the opening of the space region 36 having a substantially annular cross section. Are joined to each other by heat welding. On the other hand, the first pipe 34 and the second pipe 35 are each a sealing material in which the opening of the space region 36 at the other end in the longitudinal direction (the end on the cooling device 28 side in this embodiment) has a substantially annular cross section. 37 is sealed.

  In the first cooling water supply pipe 29 configured as described above, the other in the longitudinal direction is formed in the space region 36 formed between the outer peripheral surface of the first pipe 34 and the inner peripheral surface of the second pipe 35. In a state where mercury (Hg), which is a kind of liquid metal, is filled through the opening on the end side, the opening on the other end is sealed in a liquid-tight manner by the sealing material 37. In this respect, one end portions of the first pipe 34 and the second pipe 35 joined to each other so as to seal the opening of the space region 36 at one end portion in the longitudinal direction of the first cooling water supply pipe line 29, and The sealing material 37 sealed in the opening of the space region 36 at the other end in the longitudinal direction of the first cooling water supply pipe 29 is between the outer peripheral surface of the first pipe 34 and the inner peripheral surface of the second pipe 35. When the mercury is filled in the space area 36, it functions as a sealing portion that enables the mercury to be contained in the space area 36.

  Mercury is a urethane resin that constitutes the first pipe 34 and the second pipe 35 due to its characteristics as a metal and has a permeability to liquids and gases such as cooling water flowing in the flow path 33 in the first pipe 34. It has properties that are extremely lower than resin materials such as. Therefore, mercury does not allow cooling water flowing through the flow path 33 in the first pipe 34 to pass through the first pipe 34 and the second pipe 35 and leak out of the first cooling water supply pipe 29. It functions as a liquid filler that suppresses the liquid.

  Next, with regard to the operation of the exposure apparatus 11 configured as described above, in particular, the first cooling water supply conduit 29 is deformed in conjunction with the displacement of the reticle stage 21 and ensures the degree of vacuum in the chamber 13. The following description will be given focusing on the action at the time.

  When the exposure apparatus 11 performs exposure, the reticle stage 21 that supports the reticle R in the reticle holding mechanism 15 is displaced in the Y-axis direction (left-right direction in FIG. 1) by driving the reticle stage drive unit 22. Then, stress is applied to the first cooling water supply conduit 29 connected to the reticle stage 21 at one end in the longitudinal direction from the reticle stage 21 side to deform the first cooling water supply conduit 29. At this time, the first cooling water supply pipe 29 is configured such that both the first pipe 34 and the second pipe 35 are made of highly flexible urethane resin, and are enclosed in a space 36 between the pipes 34 and 35. Since mercury is a liquid metal having fluidity, it easily deforms following the displacement of the reticle stage 21. That is, the first cooling water supply conduit 29 does not restrict the movement of the reticle stage 21 when the reticle stage 21 is displaced, and hardly affects the positioning accuracy of the reticle R.

  In addition, the mercury contained in the space 36 between the first pipe 34 and the second pipe 35 in the first cooling water supply pipe 29 has fluidity. Therefore, in the first cooling water supply pipe 29, when a part of the space area 36 formed between these pipes 34 and 35 is deformed and deformed so as to be crushed in conjunction with the displacement of the reticle stage 21. Even in this case, mercury contained in the space region 36 is interrupted along the extending direction of the first cooling water supply pipe 29 due to its fluidity, unlike solid metal that can be broken by metal fatigue. Continue to maintain an unbroken aspect. As a result, the mercury sealed in the space region 36 covers the outer peripheral surface of the first pipe 34 in the entire extending direction of the first cooling water supply pipe 29. Therefore, in the first cooling water supply pipe 29, even when the cooling water flowing through the flow path 33 in the first pipe 34 permeates the first pipe 34, the permeated cooling water is the outer periphery of the first pipe 34. The mercury covering the entire surface is suppressed from reaching the second pipe 35 side. Therefore, the first cooling water supply pipe 29 is a flow path 33 in the first pipe 34 in a region inserted into the chamber 13 set in a vacuum atmosphere (that is, a region in the vicinity of the connection portion to the reticle stage 21). Since the cooling water that flows through the second pipe 35 is suppressed from leaking into the chamber 13, the degree of vacuum in the chamber 13 can be secured.

  Furthermore, according to the first cooling water supply pipe 29 of the present embodiment, the urethane resin constituting the first pipe 34 and the second pipe 35 has a property of hardly transmitting mercury. Therefore, the mercury confined in the space region 36 between the first pipe 34 and the second pipe 35 is prevented from passing through the first pipe 34 and the second pipe 35. Therefore, in the first cooling water supply pipe 29, the mercury contained in the space region 36 between these pipes 34 and 35 is suppressed from leaking into the flow path 33 through the first pipe 34. The Similarly, in the first cooling water supply pipe 29, in the region inserted into the chamber 13 set in a vacuum atmosphere (that is, the region near the connection portion to the reticle stage 21), these pipes 34 and 35 are connected. Since mercury contained in the space area 36 is restricted from leaking into the chamber 13 through the second pipe 35, the degree of vacuum in the chamber 13 can be ensured.

Therefore, in this embodiment, the following effects can be obtained.
(1) The cooling water flowing through the flow path 33 in the first pipe 34 passes through the first pipe 34 and the second pipe 35 and leaks out of the cooling water supply pipes 29 and 31. It is suppressed by the mercury filled in the space region 36 between the outer peripheral surface of the pipe 34 and the inner peripheral surface of the second pipe 35. Therefore, it is possible to reliably suppress cooling water from leaking from the cooling water supply pipes 29 and 31 into the chamber 13 and to ensure the vacuum in the chamber 13 with high reliability.

  (2) The first pipe 34 and the second pipe 35 are made of urethane resin that is impermeable to mercury. Therefore, mercury can be prevented from passing through the first pipe 34 and leaking into the flow path 33, and similarly, mercury can be prevented from passing through the second pipe 35 and leaking into the chamber 13.

  (3) Since the first piping 34 and the second piping 35 constituting the cooling water supply pipes 29 and 31 are made of a flexible flexible urethane resin, the displacement of the corresponding stages 21 and 26 is accompanied. When the cooling water supply pipes 29 and 31 are deformed, it is possible to suppress the movement of the stages 21 and 26 from being restricted by the rigidity of the cooling water supply pipes 29 and 31.

  (4) Since the mercury filled and contained in the space region 36 between the outer peripheral surface of the first pipe 34 and the inner peripheral surface of the second pipe 35 has fluidity, the corresponding stages 21 and 26 Even when the cooling water supply pipes 29 and 31 are deformed so as to crush a part of the space region 36 in accordance with the displacement, unlike the case of the solid metal, they are not broken. Therefore, by maintaining the state of covering the entire outer peripheral surface of the first pipe 34 according to the deformation of each cooling water supply pipe 29, 31, while maintaining the flexibility of the first cooling water supply pipe 29, Even when the cooling water flowing through the flow path 33 in the first pipe 34 permeates the first pipe 34, it is possible to suppress the permeated cooling water from reaching the second pipe 35.

  (5) During exposure of the exposure apparatus 11, cooling water can be supplied from the cooling device 28 to the reticle stage 21 and the wafer stage 26 via the cooling water supply pipes 29, 31, and is thus held by the stages 21, 26. It is possible to suppress thermal deformation of the reticle R and the wafer W that have been performed.

Note that this embodiment may be changed to another embodiment as described below.
In the above embodiment, a polymer liquid may be employed as the liquid that is filled and contained in the space region 36 between the first pipe 34 and the second pipe 35. In this case, the polymer liquid has a structure in which the three-dimensional structure gap obtained by the cross-linking is smaller than the molecule of the fluid (for example, water) flowing through the flow path 33 in the first pipe 34, Therefore, it is desirable that the material be non-permeable.

  In the above embodiment, oil may be used as the liquid that is filled and contained in the space region 36 between the first pipe 34 and the second pipe 35. Here, since oil generally has a molecular structure with a relatively small polarity as a whole, when the fluid flowing inside the first pipe 34 is a polar molecule such as water, the oil preferably has a leakage suppressing function. It can be demonstrated.

  -In the said embodiment, the material which comprises the 1st piping 34 and the 2nd piping 35 is not limited to urethane resin, Arbitrary materials can be employ | adopted if it is a flexible material. However, in order to maintain the degree of vacuum in the chamber 13, it is desirable that the material has a relatively low volatilization amount even in a vacuum atmosphere, such as a fluororesin.

In the above embodiment, the fluid flowing in the first cooling water supply pipe 29 is not limited to a coolant such as cooling water, and any medium can be adopted as long as it has fluidity.
In the above embodiment, the openings at both ends in the longitudinal direction of both the pipes 34 and 35 are sealed in a state where the space 36 between the first pipe 34 and the second pipe 35 is filled with liquid and sealed. It is good also as a structure sealed by the material 37 in a liquid-tight state.

  In the above embodiment, the piping structure having the above configuration may be connected to any member other than the reticle stage 21 and the wafer stage 26 as long as it is a member that is displaceable in the chamber 13 that is in a vacuum atmosphere. Good.

  Next, an embodiment of a microdevice manufacturing method using the device manufacturing method by the exposure apparatus 11 of the embodiment of the present invention in the lithography process will be described. FIG. 4 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micro machine, etc.).

  First, in step S101 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S102 (mask manufacturing step), a mask (reticle R or the like) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S103 (substrate manufacturing step), a substrate (a wafer W when a silicon material is used) is manufactured using a material such as silicon, glass, or ceramics.

  Next, in step S104 (substrate processing step), as will be described later, an actual circuit or the like is formed on the substrate using the mask and substrate prepared in steps S101 to S104, as will be described later. Next, in step S105 (device assembly step), device assembly is performed using the substrate processed in step S104. Step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S106 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S105 are performed. After these steps, the microdevice is completed and shipped.

FIG. 5 is a diagram illustrating an example of a detailed process of step S104 in the case of a semiconductor device.
In step S111 (oxidation step), the surface of the substrate is oxidized. In step S112 (CVD step), an insulating film is formed on the substrate surface. In step S113 (electrode formation step), an electrode is formed on the substrate by vapor deposition. In step S114 (ion implantation step), ions are implanted into the substrate. Each of the above steps S111 to S114 constitutes a pretreatment process at each stage of the substrate processing, and is selected and executed according to a necessary process at each stage.

  When the above-mentioned pretreatment process is completed in each stage of the substrate process, the posttreatment process is executed as follows. In this post-processing process, first, in step S115 (resist formation step), a photosensitive material is applied to the substrate. Subsequently, in step S116 (exposure step), the circuit pattern of the mask is transferred to the substrate by the lithography system (exposure apparatus 11) described above. Next, in step S117 (development step), the substrate exposed in step S116 is developed to form a mask layer made of a circuit pattern on the surface of the substrate. Subsequently, in step S118 (etching step), the exposed member other than the portion where the resist remains is removed by etching. In step S119 (resist removal step), the photosensitive material that has become unnecessary after the etching is removed. That is, in step S118 and step S119, the surface of the substrate is processed through the mask layer. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the substrate.

  DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 12 ... Light source device, 13 ... Chamber, 21 ... Reticle stage as holding part and 1st holding part, 26 ... Wafer stage as holding part and 2nd holding part, 28 ... Cooling device, 29 ... Piping First cooling water supply pipe, 31 ... second cooling water supply pipe as pipe, 34 ... first pipe, 35 ... second pipe, EL ... exposure light as radiation beam, R ... held member, and A reticle as a mask, W ... a member to be held and a wafer as a substrate.

Claims (10)

A first pipe through which the fluid flows;
A second pipe that covers the outside of the first pipe in a state in which the inner peripheral face is spaced apart from the outer peripheral face of the first pipe by a predetermined distance;
A pipe comprising a liquid filler filled between an outer peripheral surface of the first pipe and an inner peripheral surface of the second pipe. The piping according to claim 1,
The first pipe and the second pipe are made of a flexible material. In the piping according to claim 1 or 2,
The piping, wherein the liquid filler is a liquid metal. In the piping according to claim 1 or 2,
The piping, wherein the liquid filler is a polymer liquid. In the piping according to claim 1 or 2,
The piping, wherein the liquid filler is oil. In piping as described in any one of Claims 1-5,
A pipe having a sealing portion for containing the liquid filler between an outer peripheral surface of the first pipe and an inner peripheral surface of the second pipe. A cooling device that is disposed in a chamber whose interior is set to a predetermined atmosphere and cools a holding unit that holds a held member,
A cooling device, wherein a refrigerant is supplied to the holding portion via the pipe according to any one of claims 1 to 6. An exposure apparatus that illuminates a mask on which a predetermined pattern is formed with a radiation beam emitted from a light source device and irradiates the substrate with the radiation beam via the mask,
A first holding unit for holding the mask;
A second holding unit for holding the substrate;
With
An exposure apparatus, wherein at least one of the first holding unit and the second holding unit includes the cooling device according to claim 7. The exposure apparatus according to claim 7, wherein
Of the holding units, the holding unit having the cooling device is displaceable. In a device manufacturing method including a lithography process,
10. The device manufacturing method using the exposure apparatus according to claim 8 or 9, wherein the lithography step.

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