JP2015198316A - Piezoelectric vibrator and piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator in which a glass for fixing a lead wire is prevented from being damaged, when the lead wire of the piezoelectric vibrator is bent, and variation can be prevented at the bending position of the lead wire, and to provide a piezoelectric oscillator mounting the piezoelectric vibrator.SOLUTION: A piezoelectric vibrator includes a piezoelectric vibration piece mounting board 120 mounting a piezoelectric element 140 on one principal surface side, and having through holes 160A, B, lead wires 130A, B passing through the through holes 160A, B, and projecting from the other principal surface of piezoelectric vibration piece mounting board 120, and a glass 170 embedded in the through holes 160A, B so as to fix the lead wires 130A, B and having an external exposure surface 171. When the region of the lead wires 130A, B projecting from the external exposure surface 171 consists of a lead wire first region 133, a lead wire second region 134, and a lead wire third region 135, the width of the lead wire second region 134 is smaller than the width of the lead wire first region 133 and the width of the lead wire third region 135, when viewing from a first direction.

Description

  The present invention relates to a piezoelectric vibrator and a piezoelectric oscillator. In particular, the present invention relates to a piezoelectric vibrator that can prevent the piezoelectric vibrator from being damaged, and a piezoelectric oscillator having the piezoelectric vibrator.

  In various electronic devices such as mobile phones and personal computers, piezoelectric devices having piezoelectric elements are widely used mainly for frequency selection and control. Piezoelectric devices can be classified into piezoelectric vibrators and piezoelectric oscillators according to their functions. A crystal resonator or a crystal oscillator using crystal as a piezoelectric element is widely known and commonly used.

  Here, as a crystal resonator, Patent Document 1 discloses the following. First, there is a substrate in which two through holes are formed. A lead wire passes through each of the through holes, and the lead wires are fixed to the substrate with glass in the through holes. A crystal vibrating piece is bonded to one end of the lead wire, and the crystal vibrating piece is mounted on one main surface side of the base. A part of the lead wire is coated with an insulating material. The said coating is made into the part extended up and down of the through-hole from the part of the through-hole of the base.

  Patent Document 2 discloses the following crystal resonator. First, there is a substrate in which two through holes are formed. The first lead wire passes through each through hole, and the first lead wire is fixed to the substrate with the glass in the through hole. The first lead wire extends from the two openings of each through hole. A crystal vibrating piece is joined to one end of the first lead wire via a holding member, and the crystal vibrating piece is mounted on one main surface side of the base. A second lead wire having a diameter smaller than that of the first lead wire is welded to the other end portion of the first lead wire.

JP-A-1-292909 Japanese Patent Laid-Open No. 3-128324

  However, in the crystal resonator in which the lead wire is bonded to the substrate with glass, there is a problem that when the lead wire is bent and mounted on the mounting substrate, the glass is stressed and the glass may be damaged. In addition, there is a variation in the portion where the lead wire bends, which makes it difficult to achieve uniform finish. Furthermore, in order to suppress the variation, there has been a problem that it is necessary to devise jigs and processing steps.

  In view of the circumstances as described above, when the lead wire of the piezoelectric vibrator is bent, the present invention provides a piezoelectric vibrator capable of preventing the bending of the lead wire while preventing breakage of the glass for fixing the lead wire, and An object is to provide a piezoelectric oscillator equipped with the piezoelectric vibrator.

The piezoelectric vibrator of the first aspect of the present invention is
A piezoelectric vibration element;
The piezoelectric vibration element mounted on one main surface side, and a piezoelectric vibration element mounting substrate having a through hole;
A plurality of lead wires projecting from the other main surface of the piezoelectric vibration element mounting substrate through the through hole;
A glass that is buried in the through-hole to fix the lead wire and has an externally exposed surface that is a surface opposite to the surface on the piezoelectric vibration element side,
When a region that is a part of the lead wire and protrudes from the external exposed surface is a lead wire first region, a lead wire second region, and a lead wire third region in order from the external exposed surface side, When viewed from the direction, the width of at least a part of the lead wire second region is smaller than the width of the lead wire first region and the width of the lead wire third region.

A piezoelectric vibrator according to a second aspect of the present invention is the piezoelectric vibrator according to the first aspect,
The lead wire second region is narrower than the lead wire first region and the lead wire third region.

A piezoelectric vibrator according to a third aspect of the present invention is the piezoelectric vibrator according to the first aspect,
The lead wire second region is flat.

A piezoelectric vibrator according to a fourth aspect of the present invention is the piezoelectric vibrator according to the first aspect,
The lead second region is provided with a notch.

A piezoelectric vibrator according to a fifth aspect of the present invention is the piezoelectric vibrator according to any one of the first to fourth aspects.
When the lead wire fourth region is a part of the lead wire and is opposite to the lead wire second region in the lead wire third region, the lead wire is viewed from a second direction. The width of at least a part of the fourth line region is smaller than the width of the third lead region.

A piezoelectric vibrator according to a sixth aspect of the present invention is the piezoelectric vibrator according to the fifth aspect.
The lead wire sixth region is narrower than the lead wire third region.

A piezoelectric vibrator according to a seventh aspect of the present invention is the piezoelectric vibrator according to the fifth aspect.
The lead wire fourth region is flat.

A piezoelectric vibrator according to an eighth aspect of the present invention is the piezoelectric vibrator according to the fifth aspect.
The lead wire fourth region is provided with a notch.

The piezoelectric oscillator of the ninth aspect of the present invention is
The piezoelectric vibrator according to any one of the first to eighth aspects, wherein the lead wire is bent in the lead wire second region;
An electronic component mounting substrate having a through-hole, wherein an end of the lead wire is inserted into the through-hole and the piezoelectric vibrator is mounted;
An electronic component electrically connected to the piezoelectric vibrator.

  According to the piezoelectric vibrator and the piezoelectric oscillator having the piezoelectric vibrator of the present invention, when the lead wire of the piezoelectric vibrator is bent, variation in the bent portion of the lead wire is prevented while preventing breakage of the glass for fixing the lead wire. Can be prevented.

FIG. 3A is a front view of the piezoelectric vibrator 100. FIG. FIG. 4B is a side view of the piezoelectric vibrator 100. FIG. 2 is a cross-sectional view of a piezoelectric vibrator 100. FIG. 4 is a side view of a part of a metal column 900. FIG. 2 is a cross-sectional view of a piezoelectric oscillator 200. FIG. FIG. 4A is a front view of the piezoelectric vibrator 300. FIG. FIG. 4B is a side view of the piezoelectric vibrator 300. FIG. FIG. 4A is a front view of the piezoelectric vibrator 400. FIG. FIG. 4B is a side view of the piezoelectric vibrator 400. FIG. 4A is a front view of the piezoelectric vibrator 500. FIG. FIG. 4B is a side view of the piezoelectric vibrator 500. FIG. 4A is a front view of the piezoelectric vibrator 600. FIG. FIG. 4B is a side view of the piezoelectric vibrator 600. FIG.

<First Embodiment>
(Configuration of the piezoelectric vibrator 100)
A piezoelectric vibrator 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1A is a front view of the piezoelectric vibrator 100. FIG. 1B is a side view of the piezoelectric vibrator 100. FIG. 2 is a cross-sectional view of the piezoelectric vibrator 100.

  As shown in FIG. 1A, the piezoelectric vibrator 100 includes a piezoelectric vibration element mounting substrate 120, a cover 110 bonded to one main surface of the piezoelectric vibration element mounting substrate 120, and the piezoelectric vibration element mounting substrate 120. Lead wires 130 </ b> A and 130 </ b> B that are joined and extend from the piezoelectric vibration element mounting substrate 120 to the side opposite to the cover 110 are provided. The piezoelectric vibration element mounting substrate 120 has a flat plate shape and is a long and thin shape in plan view. The detailed shape of the piezoelectric vibration element mounting substrate 120 will be described next.

  Here, the thickness direction of the piezoelectric vibration element mounting substrate 120 is the Z direction. A direction from the piezoelectric vibration element mounting substrate 120 toward the cover 110 is defined as a + Z direction. Further, in a plan view of the piezoelectric vibration element mounting substrate 120, that is, when the piezoelectric vibration element mounting substrate 120 is viewed from the Z direction, the width direction of the piezoelectric vibration element mounting substrate 120 is defined as the X direction. A direction perpendicular to the X direction and the Z direction is defined as a Y direction. The positive direction and the negative direction in the X direction and the Z direction are as shown in the drawing.

  As described above, the piezoelectric vibration element mounting substrate 120 has a flat plate shape and a long and narrow shape in plan view. As shown in FIG. 2, the piezoelectric vibration element mounting substrate 120 is provided with two through holes 160 </ b> A and B that are arranged in the Y direction. Further, the outer peripheral region when the piezoelectric vibration element mounting substrate 120 is viewed from the Z direction is bent, and the edge portion 121 of the piezoelectric vibration element mounting substrate 120 is parallel to the central portion of the piezoelectric vibration element mounting substrate 120. And it arrange | positions from the said center part to -Z side. Accordingly, a step is formed in the outer peripheral region of the piezoelectric vibration element mounting substrate 120, and further, when the piezoelectric vibration piece mounting substrate 120 is viewed from the −Z side, a recess 122 is formed inside the edge portion 121. . For example, a metal such as iron (Fe), nickel (Ni), or Kovar is used for the piezoelectric vibration element mounting substrate 120.

  As shown in FIG. 2, metal lead wires 130A and 130B are inserted into the through holes 160A and B, respectively. The lead wires 130 </ b> A and B are fixed to the piezoelectric vibrating reed mounting substrate 120 with the glass 170 embedded in the through holes 160 </ b> A and B. Since the glass 170 is insulative, a short circuit between the through holes 160A and 160B and the piezoelectric vibrating reed mounting substrate 120 can be prevented. The glass 170 is embedded not only in the through holes 160 </ b> A and 160 </ b> B but also up to a part of the recess 122. Thereby, the bonding strength of the lead wires 130A, B to the piezoelectric vibrating reed mounting substrate 120 can be increased.

  The lead wires 130A and B extend to the + Z side and the −Z side of the through holes 160A and B. The end portions of the lead wires 130A and B on the −Z side extend to the −Z side from the externally exposed surface 171 that is the −Z side surface of the glass 170, and further extend to the −Z side from the edge portion 121. Yes. Metal supporters 151A and 151B extending in the + Z direction are joined to the + Z side ends of the lead wires 130A and 130B, respectively. The piezoelectric vibration element 140 is fixed to the + Z side end of the supporter 151A and the + Z side end of the supporter 151B by the conductive adhesive 150. In this way, the piezoelectric vibrating element 140 is mounted on the + Z side of the piezoelectric vibrating piece mounting substrate 120.

  The piezoelectric vibrating element 140 includes a piezoelectric vibrating piece 141, an excitation electrode 142, and an extraction electrode 143, as shown in FIG. The piezoelectric vibrating piece 141 has a disk shape with a circular plan view, and is formed of quartz. A pair of excitation electrodes 142 facing each other is provided at the central portion of both the main surface of the piezoelectric vibrating piece 141 on the + X side surface and the −X side surface. The extraction electrode 143 extends from the −Y side end of the + X side excitation electrode 142 to the −Y side end of the piezoelectric vibrating piece 141. The lead electrode 143 extends from the + Y side end of the −X side excitation electrode 142 to the + Y side end of the piezoelectric vibrating piece 141.

  The extraction electrode 143 extending to the end portion on the + Y side of the piezoelectric vibrating piece 141 is electrically connected to the supporter 151 </ b> A by the conductive adhesive 150. Similarly, the lead electrode 143 extending to the end portion on the −Y side of the piezoelectric vibrating piece 141 is electrically connected to the supporter 151 </ b> B by the conductive adhesive 150. Therefore, the excitation electrode on the + X side is conducted to the lead wire 130B, and the excitation electrode on the −X side is conducted to the lead wire 130A.

  A cover 110 is bonded to the + Z side of the piezoelectric vibrating piece mounting substrate 120. The cover 110 has a flat ceiling portion 111 having a surface perpendicular to the Z direction as a main surface, a cylindrical trunk portion 112 extending in the −Z direction from the outer peripheral region of the ceiling portion 111, and a trunk portion viewed from the Z direction. 112 includes a flange portion 113 that spreads outward from an end portion on the −Z side of 112. The −Z side surface of the flange portion 113 is bonded to the + Z side surface of the edge portion 121 of the piezoelectric vibrating piece mounting substrate 120. This joining is performed by, for example, cold welding or resistance welding. The supporter 151 and the piezoelectric vibration element 140 are accommodated and sealed in a recess formed by the ceiling portion 111 and the body portion 112. This sealed space is, for example, a vacuum or a nitrogen atmosphere.

  Next, details of the shape of the lead wires 130A and 130B will be described. As shown in FIGS. 1A, 1B, and 2, the two lead wires 130A and 130B extend in parallel to each other in the Z direction and are in the same plane. The lead wires 130A and 130B have a substantially circular cross section at any part. Here, as shown in FIG. 2, lead wires 130A and B are arranged in order from the end on the + Z side, a lead wire end region 131, a lead wire bonding region 132, a lead wire first region 133, and a lead wire second region. 134, the lead wire third region 135, and the lead wire fourth region 136 will be described separately.

  The lead wire end region 131 is an end portion on the + Z side of the lead wires 130A and B, and is a region protruding from the end portion on the + Z side of the through holes 160A and B. The lead wire bonding region 132 is a region that is adjacent to the −Z side of the lead wire end region 131 and whose side surface is surrounded by the glass 170. The lead wires 130A and 130B are fixed to the piezoelectric vibrating reed mounting substrate 120 in this region (lead wire bonding region 132). The lead wire first region 133 is a region which is adjacent to the −Z side of the lead wire bonding region 132 and protrudes from the external exposed surface 171 in the −Z direction. The −Z side end of the lead wire bonding region 132 extends to the −Z side from the −Z side surface of the edge 121. The lead wire end region 131, the lead wire joining region 132, and the lead wire first region 133 have a substantially circular shape with the same radius in cross section.

  As described above, the lead wire second region 134, the lead wire third region 135, and the lead wire fourth region 136 exist in this order on the −Z side of the lead wire first region 133. When viewed from the Y direction, the lead wire first region 133 of the lead wire 130A is at the same position as the lead wire first region 133 of the lead wire 130B. The cross section of the lead wire third region 135 has a substantially circular shape having the same radius as that of the cross section of the lead wire first region 133. On the other hand, the cross section of the lead wire second region 134 has a substantially circular shape having a radius smaller than that of the lead wire first region 133 and a cross section of the lead wire third region 135. The cross section of the lead wire fourth region 136 is the same as the cross section of the lead wire second region 134 and has a substantially circular shape with a smaller radius than the cross section of the lead wire third region 135. Therefore, when the lead wires 130A and B are viewed from the direction perpendicular to the lead wires 130A and B, the lead wire second region 134 and the lead wire fourth region 136 are thinner than the other regions of the lead wires 130A and B. It has become.

  The lead wires 130A and 130B include a lead wire end region 131, a lead wire bonding region 132, a lead wire first region 133, a lead wire second region 134, a lead wire third region 135, and a lead wire fourth region 136. It is integrally formed.

  Here, consider a case where the piezoelectric vibrator 100 is mounted on a mounting board (not shown). Before mounting the piezoelectric vibrator 100, part of the lead wires 130A and 130B may be bent so that the cover 110 may be tilted forward when the piezoelectric vibrator 100 of FIG. 1 is viewed from the + X side. . Then, the end portions on the −Z side of the lead wires 130 </ b> A and B are inserted into through holes provided in the mounting substrate and fixed with solder. Thereby, the height reduction of the mounting substrate on which the piezoelectric vibrator 100 is mounted is realized.

  Meanwhile, in the piezoelectric vibrator 100, the lead wire second region 134 is narrower than the lead wire first region 133 and the lead wire third region 135. Therefore, when viewed from the Y direction, the width of the lead wire second region 134 is smaller than the width of the lead wire first region 133 and the lead wire third region 135. Therefore, the bending of the lead wires 130A and B can be limited to the region of the lead wire second region 134 that is easily bent. For this reason, for each of the manufactured piezoelectric vibrators 100, variations in the bent portions of the lead wires 130A and B are prevented.

  Further, when viewed from the Y direction, the lead wire first region 133 of the lead wire 130A is at the same position as the lead wire first region 133 of the lead wire 130B. Therefore, the lead wires 130A and B are bent with a line parallel to the Y axis as an axis. Therefore, when the lead wires 130A and 130B are partially bent so that the cover 110 is tilted forward when the piezoelectric vibrator 100 of FIG. 1 is viewed from the + X side, the cover 110 is not twisted and tilted. For this reason, when the piezoelectric vibrator 100 is mounted on the mounting substrate, a space for the piezoelectric vibrator 100 necessary on the mounting substrate can be reduced.

  In addition, the width of the lead wire first region 133 is larger than the width of the lead wire second region 134. Therefore, the stress applied to the glass 170 from the lead wire first region 133 when the lead wires 130A and 130B are bent can be reduced. Therefore, breakage of the glass 170 can be prevented and the hermeticity of the piezoelectric vibrator 100 can be maintained.

  Further, as described above, with respect to the piezoelectric vibrator 100 that is used by bending the lead wires 130A and B, the end of the lead wires 130A and B on the −Z side in order to adjust the length of the lead wire before or after the bending. The part may be cut. Here, the lead wire fourth region 136 is narrower than the lead wire third region 135. Therefore, by cutting the lead wire fourth region 136, the stress at the time of cutting is relaxed by the lead wire third region 135, and the impact applied to the glass 170 can be reduced. Therefore, breakage of the glass 170 can be prevented and the hermeticity of the piezoelectric vibrator 100 can be maintained.

(Method of manufacturing piezoelectric vibrator 100)
Next, a method for manufacturing the piezoelectric vibrator 100 will be described. First, the piezoelectric vibrating reed mounting substrate 120 is formed. The piezoelectric vibrating reed mounting substrate 120 is formed by providing the edge portion 121 and the through holes 160A and 160B by machining on a plate-like metal. In addition to machining, a method such as casting may be used.

  Further, lead wires 130A and B are formed. The lead wires 130A and 130B are formed by processing a cylindrical elongated metal column 900. The formation of the lead wires 130A and B will be described with reference to FIG. FIG. 3 is a side view of a part of the metal column 900. The metal pillar 900 may be an elongated metal having a square or triangular cross section other than a cylindrical shape.

  As shown in FIG. 3, the metal pillar 900 includes a plurality of regions P1 to P5. The regions P1 to P4 become one of the lead wires 130A and 130B by being processed as described below. Accordingly, a plurality of lead wires 130A and 130B are formed from the metal pillar 900. The region P <b> 1 is a region that becomes the lead wire end region 131, the lead wire bonding region 132, and the lead wire first region 133. The regions P2, P3, and P4 are regions that become the lead wire second region 134, the lead wire third region 135, and the lead wire fourth region 136, respectively.

  First, the region P1 and the region P3 are pressed and fixed with a jig. Next, the region P1 and the region P3 are extended in opposite directions. As a result, the region P2 is stretched, and the region P2 becomes thinner than the regions P1 and P3. Similarly, the region P3 and the region P5 are pressed and fixed with a jig. Next, the region P3 and the region P5 are extended in opposite directions. As a result, the region P4 is stretched, and the region P4 becomes narrower than the regions P3 and P5. Next, the boundary between the region P1 and the region P5 and the boundary between the region P4 and the region P5 are cut. Thus, the regions P1 to P4 are processed into one of the lead wires 130A and B.

  The lead wires 130A and B may be formed as follows. That is, the region P1, the region P3, and the region P5 are fixed with a jig. Next, as viewed from the region P3, a force is applied to the region P3 and the region P5 so that the region P1 and the region P5 move in the opposite directions. Thereby, the region P2 and the region P4 are stretched, and the P2 and the region P4 are thinner than the regions P1, P3, and P5.

  Next, the supporters 151A and 151B formed in advance are joined to the ends of the lead wires 130A and B on the + Z side by welding or the like. Next, as shown in FIG. 2, lead wires 130A and B are inserted into the through holes 160A and B of the piezoelectric vibrating reed mounting substrate 120, and glass is poured into the through holes 160A and B and the recesses 122 to lead the lead wires 130A and B. Is fixed to the piezoelectric vibrating reed mounting substrate 120. Note that the lead wires 130A and 130B may be inserted into the through holes 160A and 160B after the glass is poured into the through holes 160A and 160B and the recesses 122.

  The piezoelectric vibration element 140 is formed as follows, for example. That is, first, for example, a crystal wafer 141 is cut and polished to form a disk-shaped piezoelectric vibrating piece 141. Next, excitation is performed on the surface on the + X side and the surface on the −X side of the piezoelectric vibrating piece 141 by sputtering or vacuum deposition using a mask in which through holes are formed in portions corresponding to the excitation electrode 142 and the extraction electrode 143. Electrode 142 and extraction electrode 143 are formed.

  Next, the piezoelectric vibration element 140 is sandwiched between the + Z side end of the supporter 151 </ b> A and the + Z side end of the supporter 151 </ b> B, and the supporters 151 </ b> A and 151 </ b> B are fixed with the conductive adhesive 150. At this time, as shown in FIG. 2, the piezoelectric vibration element 140 is arranged so that the extraction electrode 143 contacts the conductive adhesive 150.

  Finally, the cover 110 is placed on the piezoelectric vibrating piece mounting substrate 120. At this time, the −Z side surface of the flange portion 113 is disposed so as to contact the + Z side surface of the edge portion 121, and the piezoelectric vibration element 140 is placed in the concave portion of the cover 110 surrounded by the body portion 112 and the ceiling portion 111. And supporters 151A and 151B are placed so as to be accommodated. Then, for example, by joining the flange portion 113 and the edge portion 121 by cold welding or resistance welding, the cover 110 is fixed and joined to the piezoelectric vibrating piece mounting substrate 120. In this way, the piezoelectric vibrator 100 is manufactured.

Second Embodiment
(Configuration of the piezoelectric oscillator 200)
A piezoelectric oscillator 200 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a sectional view of the piezoelectric oscillator 200.

  The piezoelectric oscillator 200 has a substantially rectangular parallelepiped shape, and extends from the oscillator lead wire 250 substantially vertically from the bottom surface. The direction in which the oscillator lead 250 extends is the Z direction, and the direction from the bottom surface of the piezoelectric oscillator 200 toward the tip of the oscillator lead 250 is the −Z direction. One of the directions perpendicular to the Z direction is the X direction, and the direction perpendicular to the Z direction and the X direction is the Y direction.

  As shown in FIG. 4, the piezoelectric oscillator 200 has a flat plate-like electronic component mounting substrate 240 having a main surface perpendicular to the Z direction. The electronic component mounting substrate 240 is made of, for example, glass epoxy, and the piezoelectric vibrator 100 is mounted on the main surface on the + Z side of the electronic component mounting substrate 240. In addition, electronic components 230 such as an IC, a heating resistor, a transistor, and a thermistor are mounted on the main surface on the + Z side and the main surface on the −Z side of the electronic component mounting substrate 240 as necessary. At least a part of the electronic component 230 is electrically connected to the piezoelectric vibrator 100 to form an oscillation circuit. The piezoelectric vibrator 100 may be mounted on the main surface on the −Z side. The electronic component 230 may be mounted only on one of the + Z side main surface and the −Z side main surface of the electronic component mounting substrate 240.

  The electronic component mounting board 240 has, for example, oscillator lead wires 250 extending in the Z direction bonded to four corners when viewed from the Z direction. The oscillator lead wire 250 is fixed by solder in the through hole of the electronic component mounting board 240 and extends from the electronic component mounting board 240 in the −Z direction. The oscillator lead wire 250 is electrically connected to at least a part of the electronic component 230 or the piezoelectric vibrator 100, and functions as an external terminal that functions as a ground terminal, a power supply terminal, an input / output terminal, and the like. The number of oscillator lead wires 250 is not limited to four, but is determined according to the function of the piezoelectric oscillator 200 and the like.

  On the −Z side of the electronic component mounting substrate 240, the oscillator substrate 220 is disposed in parallel to the main surface of the electronic component mounting substrate 240. The oscillator substrate 220 is made of, for example, metal, and through holes are formed at four corners. An oscillator lead wire 250 passes through the through hole of the oscillator substrate 220, and the oscillator lead wire 250 is fixed to the oscillator substrate 220 with a nonconductive material such as glass filled in the through hole. This nonconductive material prevents a short circuit between the oscillator lead wires 250 via the oscillator substrate 220.

  An oscillator cover 210 is mounted on the surface on the + Z side of the oscillator substrate 220. As shown in FIG. 4, the open end of the oscillator cover 210 is bonded to the edge when the oscillator substrate 220 is viewed from the Z direction, and is mounted on the electronic component mounting substrate 240 and the electronic component mounting substrate 240. 100 and the electronic component 230 are accommodated in a space surrounded by the oscillator cover 210 and the oscillator substrate 220.

  Next, details of mounting the piezoelectric vibrator 100 on the electronic component mounting substrate 240 will be described. As shown in FIG. 4, the piezoelectric vibrator 100 is arranged such that the main surface of the cover 110 (the surface perpendicular to the X axis of the cover 110 in FIG. 1) faces the + Z side surface of the electronic component mounting substrate 240. The The main surface of the cover 110 and the electronic component mounting substrate 240 are bonded together by a bonding material 260. As the bonding material 260, solder or an adhesive containing silicon is used.

  From the piezoelectric vibrating reed mounting substrate 120, lead wire first regions 133 of the lead wires 130A and B extend in the −X direction. The lead wire second region 134 extending from the −X side end of the lead wire first region 133 is bent in the −Z direction, and the lead wire second region 134 is opposite to the lead wire first region 133. The end of is directed in the -Z direction. A lead wire third region 135 extends in the −Z direction from the end. The lead wire third region 135 passes through the through hole of the electronic component mounting board 240 and is joined to the electronic component mounting board 240 with solder filled in the through hole. Therefore, the piezoelectric vibrator 100 is fixed and mounted on the electronic component mounting board 240 with solder around the bonding material 260 and the lead wire third region 135.

  As described above, the lead wires 130 </ b> A and B are bent at the lead wire second region 134 that is narrower than the lead wire first region 133 and the lead wire third region 135. Therefore, this bending is limited to the region of the lead wire second region 134, and variations in the bent portions of the lead wires 130A and B are prevented for each of the manufactured piezoelectric vibrators 100. Therefore, it is not necessary to secure an area corresponding to the variation of the piezoelectric vibrator 100 in the electronic component mounting substrate 240, and the piezoelectric oscillator 200 can be downsized.

  In addition, the width of the lead wire first region 133 is larger than the width of the lead wire second region 134. Therefore, the stress applied to the glass 170 from the lead wire first region 133 when the lead wires 130A and 130B are bent can be reduced. Therefore, breakage of the glass 170 can be prevented, the hermeticity of the piezoelectric vibrator 100 can be maintained, and the occurrence of defects in the piezoelectric oscillator 200 can be reduced.

  In addition, before or after the bending of the lead wires 130A and B, the end of the lead wires 130A and B on the −Z side may be cut in order to adjust the length of the lead wires. Here, the lead wire fourth region 136 is narrower than the lead wire third region 135. Therefore, by cutting the lead wire fourth region 136, the stress at the time of cutting is relaxed by the lead wire third region 135, and the impact applied to the glass 170 can be reduced. Therefore, breakage of the glass 170 can be prevented and the hermeticity of the piezoelectric vibrator 100 can be maintained. For this reason, generation | occurrence | production of the defect of the piezoelectric oscillator 200 can be reduced.

(Method for manufacturing piezoelectric oscillator 200)
Next, a method for manufacturing the piezoelectric oscillator 200 will be described. First, the piezoelectric vibrator 100 shown in FIG. 1 is prepared. Next, the lead wire first area 133 and the lead wire third area 135 of the lead wires 130A and 130B are bent while being held by a jig, and as shown in FIG. 135 is almost perpendicular. Next, a part of the lead wire fourth region 136 is cut to adjust the length of the lead wires 130A and 130B. The lengths of the lead wires 130A and B by cutting part of the fourth lead wire region 136 may be adjusted before the lead wires 130A and B are bent. In addition, when it is not necessary to adjust the lengths of the lead wires 130A and 130B, a part of the lead wire fourth region 136 may not be cut.

  Next, an electronic component mounting board 240 is prepared in which solder is applied to the through holes into which the lead wires 130A and 130B are inserted, and further, the bonding material 260 is applied. Next, as shown in FIG. 4, the main surface of the cover 110 faces the + Z side surface of the electronic component mounting substrate 240 with the bonding material 260 interposed therebetween, and the lead wire third region 135 passes through the through hole. Then, the piezoelectric vibrator 100 is placed on the electronic component mounting substrate 240. Next, the piezoelectric vibrator 100 is bonded to the electronic component mounting substrate 240 by heating or the like.

  Next, the electronic component 230 is mounted on the electronic component mounting board 240. Further, the oscillator lead wire 250 is bonded to the electronic component mounting substrate 240. Note that the order of mounting and joining the piezoelectric vibrator 100, the electronic component 230, and the oscillator lead wire 250 to the electronic component mounting substrate 240 may be different from the above-described order. Next, the electronic component mounting board 240 is mounted on the oscillator board 220. Next, the oscillator cover 210 is joined to the oscillator substrate 220, and the electronic component mounting substrate 240 is sealed in a space formed between the oscillator cover 210 and the oscillator substrate 220 to form the piezoelectric oscillator 200.

<Other embodiments>
(First Modification of Piezoelectric Vibrator 100)
Next, a piezoelectric vibrator 300 which is a first modification of the piezoelectric vibrator 100 will be described with reference to FIGS. FIG. 5A is a front view of the piezoelectric vibrator 300. FIG. 5B is a side view of the piezoelectric vibrator 300. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The difference between the piezoelectric vibrator 300 and the piezoelectric vibrator 100 is the lead wires 330A and B. Therefore, details of the lead wires 330A and B will be described. As in the piezoelectric vibrator 100 shown in FIG. 1A, the lead wires 330A and B have a lead wire first region 333, a lead wire second region 334, a lead wire third region 335, and a lead wire fourth region. There are 336. As shown in FIGS. 5A and 5B, the lead wire second region 334 and the lead wire fourth region 336 have a flat shape.

  That is, as shown in FIG. 5A, the widths of the lead wires 330A and B when viewed from the X direction are not uniform. When viewed from the X direction, the width of the lead wire second region 334 and the width of the lead wire fourth region 336 are larger than the width of the lead wire first region 333 and the width of the lead wire third region 335. Further, as shown in FIG. 5B, the widths of the lead wires 330A and B are not uniform even when viewed from the Y direction. When viewed from the Y direction, the width of the lead wire second region 334 and the width of the lead wire fourth region 336 are smaller than the width of the lead wire first region 333 and the width of the lead wire third region 335.

  Therefore, when bending the lead wires 330A and B in the same manner as the piezoelectric vibrator 100, this bending can be limited to the lead wire second region 334. For each of the manufactured piezoelectric vibrators 300, the lead wire 330A is bent. , Variation in the bent portion of B is prevented. Further, the stress applied to the glass 170 from the first lead wire region 333 when the lead wires 330A and B are bent can be reduced. Therefore, breakage of the glass 170 can be prevented and the hermeticity of the piezoelectric vibrator 300 can be maintained. The same applies to the following modifications.

  In addition, when the end of the lead wire 330A, B on the −Z side is cut in order to adjust the length of the lead wire 330A, B, the lead wire fourth region 336 is cut, so that the stress at the time of cutting is reduced. The impact applied to the glass 170 can be reduced by being relaxed in the third line region 335. Therefore, breakage of the glass 170 can be prevented and the hermeticity of the piezoelectric vibrator 100 can be maintained. This also applies to the following modification having the lead wire fourth region.

  Such lead wires 330A and B can be manufactured as follows. That is, first, a cylindrical elongated metal column is prepared. Then, the portions corresponding to the lead wire second region 334 and the lead wire fourth region 336 are crushed using pliers or the like. The crushed portion becomes the above-described lead wire second region 334 and lead wire fourth region 336. Therefore, the manufacture of the lead wires 330A and B can be easily formed without requiring a complicated process.

(Second Modification of Piezoelectric Vibrator 100)
Next, a piezoelectric vibrator 400 as a second modification of the piezoelectric vibrator 100 will be described with reference to FIGS. FIG. 6A is a front view of the piezoelectric vibrator 400. FIG. 6B is a side view of the piezoelectric vibrator 400. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The difference between the piezoelectric vibrator 400 and the piezoelectric vibrator 100 is the lead wires 430A and 430B. Accordingly, details of the lead wires 430A and 430B will be described. In the lead wires 430A and B, similarly to the piezoelectric vibrator 100 shown in FIG. 1A, the lead wire first region 433, the lead wire second region 434, the lead wire third region 435, and the lead wire fourth region. There are 436. In the lead wire second region 434 of the lead wires 430A and B, a notch 437 extending in the Y direction is formed on the + X side. A plurality of notches 437 are formed side by side in the Z direction, and as shown in FIG. 6B, the shape of the saw blade is seen from the Y direction. Similarly, a notch 437 extending in the Y direction is formed on the + X side in the lead wire fourth region 436 of the lead wires 430A and 430B. A plurality of notches 437 are formed side by side in the Z direction, and as shown in FIG. 6B, the shape of the saw blade is seen from the Y direction. Therefore, when the lead wires 430A and B are viewed from the Y direction, the width (length in the X direction) of the lead wire second region 434 and the notch 437 portion of the lead wire fourth region 436 is equal to the lead wire first region. It is smaller than the width (length in the X direction) of 433 and the lead wire third region 435.

  As described above, in the lead wire second region 434, a plurality of notches 437 extending in the Y direction are formed on the + X side. Therefore, when a part of the lead wire 430A is bent so that the cover 110 falls down when the piezoelectric vibrator 100 in FIG. 6A is viewed from the + X side, the bottom portion of the notch 437 (most -X side) The portion can be bent with the axis as an axis, and accurate bending with reduced variation from product to product is possible.

  The number of notches 437 formed in the lead wire second region 434 and the lead wire fourth region 436 is not limited. One or more notches 437 may be provided in accordance with the strength of the lead wires 430A and B, the angle at which the lead wires 430A and B are bent, or the like. Further, the number of the notches 437 may be changed between the lead wire 430A and the lead wire 430B.

(Third Modification of Piezoelectric Vibrator 100)
Next, a piezoelectric vibrator 500 which is a third modification of the piezoelectric vibrator 100 will be described with reference to FIGS. FIG. 7A is a front view of the piezoelectric vibrator 500. FIG. 7B is a side view of the piezoelectric vibrator 500. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The difference between the piezoelectric vibrator 500 and the piezoelectric vibrator 100 is the lead wires 530A and 530A. In the lead wires 530A and B, similarly to the piezoelectric vibrator 100 shown in FIG. 1A, the lead wire first region 533, the lead wire second region 534, the lead wire third region 535, and the lead wire fourth region. 536, which have the same shape as the lead wire first region 133, the lead wire second region 134, the lead wire third region 135, and the lead wire fourth region 136 shown in FIG.

  In the piezoelectric vibrator 500, the lead wire fifth region 537 is further provided on the −Z side of the lead wire fourth region 536. The cross-sectional shape of the fifth lead wire region 537 is the same as that of the first lead wire region 533 or the third lead wire region 535. Therefore, the lead wire fifth region 537 is thicker than the lead wire fourth region 536, and the width of the lead wire fifth region 537 is larger than the width of the lead wire fourth region 536 when viewed from the Y direction.

  Thus, the lead wire fifth region 537 is thicker than the lead wire fourth region 536, and the width of the lead wire fifth region 537 is larger than the width of the lead wire fourth region 536 when viewed from the Y direction. Therefore, for the convenience of the manufacturing process, after the piezoelectric vibrator 500 is manufactured, the end portions of the lead wires 530A and B on the −Z side are cut in order to make the lengths of the lead wires 530A and B a predetermined length. In this case, the cut portion can be limited to the lead wire fourth region 536 by using the above difference in width as a mark. Therefore, variations in the lengths of the lead wires 530A and B can be suppressed.

  Note that the piezoelectric vibrator 300, the piezoelectric vibrator 400, and the piezoelectric vibrator 500 also have a cross section at the end of the lead wires 330A, B, 430A, B, 530A, and B on the −Z side. A lead wire fifth region equal to the regions 335, 435, and 535 may be provided.

(Fourth Modification of Piezoelectric Vibrator 100)
Next, a piezoelectric vibrator 600, which is a fourth modification of the piezoelectric vibrator 100, will be described with reference to FIGS. FIG. 8A is a front view of the piezoelectric vibrator 600. FIG. 8B is a side view of the piezoelectric vibrator 600. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The difference between the piezoelectric vibrator 600 and the piezoelectric vibrator 100 is the lead wires 630A and 630B. The lead wires 630A and B have a lead wire first region 633, a lead wire second region 634, and a lead wire third region 635, similarly to the piezoelectric vibrator 100 shown in FIG. However, there is no region corresponding to the fourth lead wire region 136 of the piezoelectric vibrator 100.

(Other variations)
In the piezoelectric vibrator 100 and the modification of the piezoelectric vibrator 100, the respective lead wires are integrally formed. However, a part of each lead wire may be joined by welding or the like. That is, a lead wire that is not integrally formed may be used.

  In the piezoelectric vibrator 100 and the modification of the piezoelectric vibrator 100, the piezoelectric vibrator 100 in FIGS. 1A and 1B will be described as an example. When viewed from the Y direction, the lead wire first region of the lead wire 130A. 133 is in the same position as the lead wire first region 133 of the lead wire 130B. However, the lead wire first region 133 of the lead wire 130A may be shifted from the lead wire first region 133 of the lead wire 130B. At this time, when the lead wires 130A and B are partly bent so that the cover 110 falls to the near side when the piezoelectric vibrator 100 of FIG. 1A is viewed from the + X side, the cover 110 is twisted and falls. However, depending on the relationship with the arrangement of other electronic components on the mounting board, it may be necessary to twist and fall in this way.

  In the piezoelectric vibrator 100 and the modification of the piezoelectric vibrator 100, two lead wires are provided. However, there may be three or more lead wires. In this case, one end of the third or more lead wires is joined to the piezoelectric vibrating piece 141, and the other end penetrates the piezoelectric vibrating piece mounting substrate 120 and extends parallel to the other lead wires. The third or more lead wires are also provided with a lead wire first region to a lead wire third region and, if necessary, a lead wire fourth region and a lead wire fifth region. The piezoelectric vibrating piece 141 is stably fixed by the third or more lead wires. Note that the third or more lead wires joined to the piezoelectric vibrating piece 141 may not be electrically connected to the excitation electrode 142.

  In the piezoelectric vibrator 100 and the modification of the piezoelectric vibrator 100, the piezoelectric vibration element 140 is circular in plan view, but may be other shapes such as a tuning fork type, an ellipse, and a rectangle. The piezoelectric vibrating piece 141 is formed of quartz, but a piezoelectric material other than quartz, for example, lithium tantalate, lithium niobate, or piezoelectric ceramic may be used.

  The piezoelectric oscillator 200 has the piezoelectric vibrator 100 mounted thereon, but instead of the piezoelectric vibrator 100, a modification of the above-described piezoelectric vibrator 100 may be mounted.

100, 300, 400, 500, 600 ... Piezoelectric vibrator 110 ... Cover 111 ... Ceiling part 112 ... Body part 113 ... Flange part 120 ... Piezoelectric vibration piece mounting substrate 121 .. Edge 122 ... Recess 130A, B, 330A, B, 430A, B, 530A, B, 630A, B ... Lead wire 131 ... Lead wire end region 132 ... Lead wire bonding region 133 333, 433, 533, 633 ... Lead wire first region 134, 334, 434, 534, 634 ... Lead wire second region 135, 335, 435, 535, 635 ... Lead wire third region 136, 336, 436, 536, ... Lead wire fourth region 140 ... Piezoelectric vibration element 141 ... Piezoelectric vibration piece 142 ... Excitation electrode 143 ... Extraction electrode 150 ... Conductive adhesive 151A, B ... Supporter 160A, ... Through hole 170 ... Glass 171 ... Externally exposed surface 200 ... Piezoelectric oscillator 210 ... Oscillator cover 220 ... Oscillator substrate 230 ... Electronic component 240 ... Electronic component mounting substrate 250 ... Oscillator lead wire 260 ... Bonding material 437 ... Notch 537 ... Lead wire fifth area 900 ... Metal pillar P1 to P5 ... Area

Claims (9)

A piezoelectric vibration element;
The piezoelectric vibration element mounted on one main surface side, and a piezoelectric vibration element mounting substrate having a through hole;
A plurality of lead wires projecting from the other main surface of the piezoelectric vibration element mounting substrate through the through hole;
A glass that is buried in the through-hole to fix the lead wire and has an externally exposed surface that is a surface opposite to the surface on the piezoelectric vibration element side,
When a region that is a part of the lead wire and protrudes from the external exposed surface is a lead wire first region, a lead wire second region, and a lead wire third region in order from the external exposed surface side, When viewed from the direction, the piezoelectric vibrator is characterized in that the width of at least a part of the lead wire second region is smaller than the width of the lead wire first region and the width of the lead wire third region.   2. The piezoelectric vibrator according to claim 1, wherein the lead wire second region is narrower than the lead wire first region and the lead wire third region.   The piezoelectric vibrator according to claim 1, wherein the lead wire second region is flat.   The piezoelectric vibrator according to claim 1, wherein the lead wire second region is provided with a notch.   When the lead wire fourth region is a part of the lead wire and is opposite to the lead wire second region in the lead wire third region, the lead wire is viewed from a second direction. 5. The piezoelectric vibrator according to claim 1, wherein a width of at least a part of the line fourth region is smaller than a width of the lead wire third region. 6.   The piezoelectric vibrator according to claim 5, wherein the lead wire fourth region is thinner than the lead wire third region.   The piezoelectric vibrator according to claim 5, wherein the lead wire fourth region is flat.   The piezoelectric vibrator according to claim 5, wherein the lead wire fourth region is provided with a notch. The piezoelectric vibrator according to any one of claims 1 to 8, wherein the lead wire is bent in the lead wire second region;
An electronic component mounting substrate having a through-hole, wherein an end of the lead wire is inserted into the through-hole and the piezoelectric vibrator is mounted;
A piezoelectric oscillator comprising: an electronic component electrically connected to the piezoelectric vibrator.