JP2015198238A - Electronic component and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component suppressed in the occurrence of ion migration and excellent in mountability by solder.SOLUTION: An electronic component 1 includes an electronic component body 10, first and second external electrodes 13, 14, and a water-repellent film 20. The first and second external electrodes 13, 14 are provided on the electronic component body 10. The water-repellent film 20 is provided on the electronic component body 10 and on the first external electrode 13. The water-repellent film 20 is soluble into an organic solvent.

Description

  The present invention relates to an electronic component and a manufacturing method thereof.

  In recent years, electronic devices such as mobile phones and portable music players have been reduced in size and thickness. Accordingly, for example, downsizing of electronic components incorporated in electronic devices is required. In addition, the environment in which such an electronic device is used is diversified, and it is desired to improve the reliability of the electronic component with respect to the diversified environment.

  In recent years, as described in Patent Document 1, ion migration in electronic components may be a problem. Ion migration causes condensation on the surface of the electronic component due to the difference in temperature difference between the electronic component and the outside air, and water droplets generated by this condensation form a water film that connects the external electrodes on the surface of the electronic component. When a voltage is applied between the external electrodes of the electronic component in this state, the metal species ionized from the external electrode are dissolved / precipitated in the water film. This problem is more noticeable when it is installed in a car placed in a harsh environment. Patent Document 1 describes that a water repellent film is provided between external electrodes in order to suppress the occurrence of ion migration. Patent Document 1 describes that a water-repellent film is formed using a silane coupling agent containing fluorine.

International Publication No. 02/082480

  Incidentally, electronic components are generally used by being mounted on a mounting board using solder or the like. However, an electronic component provided with a water repellent film may have low mountability.

  A main object of the present invention is to provide an electronic component that is suppressed in the occurrence of ion migration and has excellent mountability by solder.

  A first electronic component according to the present invention includes an electronic component main body, first and second external electrodes, and a water repellent film. The first and second external electrodes are provided on the electronic component main body. The water repellent film is provided on the electronic component main body and on the first external electrode. The water repellent film is soluble in an organic solvent.

  In the first electronic component according to the present invention, it is preferable that the water repellent film is soluble in a solvent contained in the solder flux.

  A second electronic component according to the present invention includes an electronic component main body, first and second external electrodes, and a water repellent film. The first and second external electrodes are provided on the electronic component main body. The water repellent film is provided on the electronic component main body and on the first external electrode. The water repellent film is soluble in the solvent contained in the solder flux.

  In each of the first and second electronic components according to the present invention, the solvent is an ether organic solvent, an alcohol organic solvent, a hydrocarbon organic solvent, a ketone system, an ester system, and a glycol ether system. It may contain at least one selected from

  In each of the first and second electronic components according to the present invention, the solvent solubility parameter (SP value) may be 7.0 to 14.0.

  In each of the first and second electronic components according to the present invention, the electronic component main body includes first and second main surfaces extending along the length direction and the width direction, and the length direction and the thickness direction. And first and second end surfaces extending along the width direction and the thickness direction. On the 2nd main surface, the front-end | tip part of a 1st external electrode and the front-end | tip part of a 2nd external electrode may oppose in the length direction. It is preferable that the water repellent film is located on a portion of the second main surface located between the tip portion of the first external electrode and the tip portion of the second external electrode.

  In each of the first and second electronic components according to the present invention, the water repellent film is provided over the electronic component main body and the first external electrode. preferable.

  In each of the first and second electronic components according to the present invention, it is preferable that the water repellent film covers the exposed portion of the electronic component main body and the entire first and second external electrodes.

  In each of the first and second electronic components according to the present invention, the outermost layer of the external electrode may include at least one of Sn, Cu, and Ag.

  The electronic component mounting structure according to the present invention includes the electronic component according to the present invention, a mounting substrate, and solder. Electronic components are mounted on the mounting substrate. The solder joins the electronic component and the mounting board. In the electronic component mounting structure according to the present invention, a water repellent film is not provided at the joint between the electronic component and the mounting substrate.

  In the first method for manufacturing an electronic component according to the present invention, the first external electrode and the second external electrode are formed on the electronic component main body. A water-repellent film that is soluble in an organic solvent is provided on the electronic component body and the first external electrode.

  In the second electronic component manufacturing method according to the present invention, the first external electrode and the second external electrode are formed on the electronic component main body. A water-repellent film that is soluble in a solvent contained in the solder flux is provided on the electronic component main body and the first external electrode.

  According to the present invention, the occurrence of ion migration is suppressed, and an electronic component excellent in mountability by solder can be provided.

It is a typical perspective view of the electronic component which concerns on one Embodiment of this invention. It is typical sectional drawing in line II-II of FIG. It is a typical sectional view of a mounting structure of electronic parts concerning one embodiment of the present invention.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  Moreover, in each drawing referred in embodiment etc., the member which has a substantially the same function shall be referred with the same code | symbol. The drawings referred to in the embodiments and the like are schematically described. A ratio of dimensions of an object drawn in a drawing may be different from a ratio of dimensions of an actual object. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

  FIG. 1 is a schematic perspective view of an electronic component according to this embodiment. As shown in FIG. 1, FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. In FIG. 1, drawing of the water repellent film 20 is omitted.

  The electronic component 1 includes a rectangular parallelepiped electronic component main body 10. The electronic component body 10 includes first and second main surfaces 10a and 10b, first and second side surfaces 10c and 10d, and first and second end surfaces 10e and 10f (see FIG. 2). . The first and second main surfaces 10a and 10b extend along the length direction L and the width direction W, respectively. The first and second side surfaces 10c and 10d extend along the thickness direction T and the length direction L, respectively. The first and second end faces 10e and 10f extend along the thickness direction T and the width direction W, respectively. The length direction L, the width direction W, and the thickness direction T are orthogonal to each other.

  In the present invention, the “rectangular shape” includes a rectangular parallelepiped with rounded corners and ridges. That is, the “cuboid” member means all members having first and second main surfaces, first and second side surfaces, and first and second end surfaces. Moreover, unevenness etc. may be formed in a part or all of a main surface, a side surface, and an end surface.

  The dimension of the electronic component main body 10 is not particularly limited. For example, the thickness dimension of the electronic component body 10 is preferably 0.1 mm to 3.0 mm, the length dimension is preferably 0.2 mm to 3.5 mm, and the width dimension is 0.1 mm to 3.0 mm. Preferably there is.

The electronic component body 10 is made of appropriate ceramics corresponding to the function of the electronic component 1. Specifically, when the electronic component 1 is a capacitor, the electronic component main body 10 can be formed of dielectric ceramics. Specific examples of the dielectric ceramic include BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO _{3 and the} like. Subcomponents such as Mn compounds, Mg compounds, Si compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, and rare earth compounds are appropriately added to the electronic component body 10 according to the characteristics required for the electronic component 1. May be.

  When the electronic component 1 is a piezoelectric component, the electronic component main body 10 can be formed of piezoelectric ceramics. Specific examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics.

  When the electronic component 1 is, for example, a thermistor, the electronic component main body 10 can be formed of semiconductor ceramics. Specific examples of semiconductor ceramics include spinel ceramics.

  When the electronic component 1 is an inductor, for example, the electronic component main body 10 can be formed of magnetic ceramics. Specific examples of magnetic ceramics include ferrite ceramics.

  As shown in FIG. 2, a plurality of first internal electrodes 11 and a plurality of second internal electrodes 12 are provided inside the electronic component main body 10.

  The first internal electrode 11 has a rectangular shape. The first internal electrode 11 is provided in parallel with the first and second main surfaces 10a and 10b. That is, the first internal electrode 11 is provided along the length direction L and the width direction W. The first inner electrode 11 is exposed at the first end face 10e, and is exposed at the first and second main faces 10a and 10b, the first and second side faces 10c and 10d, and the second end face 10f. Not done.

  The second internal electrode 12 has a rectangular shape. The second internal electrode 12 is provided in parallel with the first and second main surfaces 10a, 10b. That is, the second internal electrode 12 is provided along the length direction L and the width direction W. The second internal electrode 12 is exposed at the second end face 10f. The second internal electrode 12 is not exposed on the first and second main surfaces 10a and 10b, the first and second side surfaces 10c and 10d, and the first end surface 10e.

  The first and second internal electrodes 11 and 12 are alternately provided along the thickness direction T. The first internal electrode 11 and the second internal electrode 12 which are adjacent in the thickness direction T are opposed to each other through the ceramic portion 10g. The thickness of the ceramic portion 10g can be about 1 μm to 100 μm, and preferably 2 μm to 10 μm.

  The first and second internal electrodes 11 and 12 can be made of an appropriate conductive material. The first and second internal electrodes 11 and 12 are, for example, a metal selected from the group consisting of Ni, Cu, Ag, Pd and Au, or a kind selected from the group consisting of Ni, Cu, Ag, Pd and Au. It can be comprised with the alloy (for example, Ag-Pd alloy etc.) containing the above metals.

  The thicknesses of the first and second internal electrodes 11 and 12 are preferably about 0.5 μm to 1.5 μm, for example.

  On the electronic component body 10, a first external electrode 13 and a second external electrode 14 are provided. Specifically, the first external electrode 13 is formed on the first end face 10e and on each of the first and second main faces 10a and 10b and the first and second side faces 10c and 10d. It is provided across. The first external electrode 13 is electrically connected to the first internal electrode 11 at the first end face 10e.

  The second external electrode 14 is provided across the second end face 10f and the first and second main faces 10a and 10b and the first and second side faces 10c and 10d. It has been. The second external electrode 14 is electrically connected to the second internal electrode 12 at the second end face 10f.

  In each of the first and second main faces 10a and 10b and the first and second side faces 10c and 10d, the tip in the length direction L of the first external electrode 13 and the length of the second external electrode 14 The tip in the direction L is opposed in the length direction L.

  The outermost layer of the first external electrode 13 includes at least one of Sn, Cu, and Ag. Specifically, the first external electrode 13 includes a first electrode layer 13a, a second electrode layer 13b, and a third electrode layer 13c.

  The first electrode layer 13 a is provided on the electronic component main body 10. The first electrode layer 13a is composed of a fired electrode layer. The fired electrode layer refers to an electrode layer obtained by firing a paste layer obtained by applying a paste containing conductive particles. The conductive particles contained in the fired electrode layer may be particles containing at least one of Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, and the like.

  The second electrode layer 13b is provided on the first electrode layer 13a. The second electrode layer 13b may be constituted by a plating layer. In the present embodiment, the second electrode layer 13b is composed of a Ni plating layer.

  The third electrode layer 13c is provided on the second electrode layer 13b. The third electrode layer 13c may be constituted by a plating layer. In the present embodiment, the third electrode layer 13c is composed of an Sn plating layer.

  The outermost layer of the second external electrode 14 includes at least one of Sn, Cu, and Ag. Specifically, the second external electrode 14 includes a first electrode layer 14a, a second electrode layer 14b, and a third electrode layer 14c.

  The first electrode layer 14 a is provided on the electronic component body 10. The first electrode layer 14a is composed of a fired electrode layer.

  The second electrode layer 14b is provided on the first electrode layer 14a. The second electrode layer 14b may be constituted by a plating layer. In the present embodiment, the second electrode layer 14b is composed of a Ni plating layer.

  The third electrode layer 14c is provided on the second electrode layer 14b. The third electrode layer 14c may be constituted by a plating layer. In the present embodiment, the third electrode layer 14c is composed of an Sn plating layer.

  The electronic component 1 includes a water repellent film 20. The water repellent film 20 can be made of, for example, a resin. The water repellent film 20 can be composed of, for example, a silicone resin, a fluorine resin, or the like. The resin constituting the water repellent film 20 is preferably a non-crosslinked resin. For example, the water repellent film 20 may be made of only a resin, or may be made of a resin composition containing a filler or the like.

  In the present invention, the “water-repellent film” refers to a layer having a water contact angle of 90 ° or more at 25 ° C. The contact angle of water can be measured using, for example, a micro contact angle meter (MCA-3) manufactured by Kyowa Interface Science in the following manner. First, electronic components are arranged on a horizontal base so that the second main surface faces the base. Next, a contact angle can be obtained by photographing a droplet formed by dropping a water droplet on the first main surface of the electronic component from the lateral direction. The contact angle here refers to a static contact angle measured immediately after dropping.

  The water repellent film 20 is provided on the electronic component main body 10 and on at least one of the first and second external electrodes 13 and 14. For this reason, it is suppressed that a water film is formed on the electronic component main body 10. Therefore, the occurrence of ion migration is suppressed.

  Ion migration involves ionization of the metal component of the external electrode and movement of the ionized metal component to the counter electrode. For this reason, from the viewpoint of suppressing the occurrence of ion migration, it is preferable to suppress the contact between the metal component of the external electrode and moisture. Therefore, from the viewpoint of more effectively suppressing the occurrence of ion migration, it is preferable to provide the water repellent film 20 so as to cover at least a part of the first and second external electrodes 13 and 14. More preferably, the water repellent film 20 is provided so as to cover the tip portions of the first and second external electrodes 13 and 14. More preferably, the water repellent film 20 is provided across at least one of the first and second external electrodes 13 and 14 and the electronic component main body 10.

  From the viewpoint of suppressing the ionized metal component of one of the first and second external electrodes 13 and 14 from reaching the counter electrode, the first and second main surfaces 10a and 10b and the first and second main surfaces 10 and 10 are used. It is preferable that the water repellent film 20 is provided on at least one of the side surfaces 10c and 10d so as to isolate the first external electrode 13 and the second external electrode 14 from each other.

  More preferably, the water repellent film 20 covers the exposed portion of the electronic component main body 10 and the entire first and second external electrodes 13 and 14. Here, the water repellent film 20 covers the exposed portion of the electronic component body 10 and the entire first and second external electrodes 13 and 14. It means that 90% or more of the entire surfaces of the first and second external electrodes 13 and 14 are covered. The portion covered by the water-repellent film 20 is analyzed by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS). This is the portion where ions are detected. That is, the water-repellent film 20 covers the exposed portion of the electronic component body 10 and the entire first and second external electrodes 13 and 14. That is, the exposed portion 10 of the electronic component 10 and the first and second external electrodes 13 and 14 are covered by TOF-SIMS. When the second external electrodes 13 and 14 are mapped with Si in a field of 50 μm □, ions containing Si are exposed on the exposed portion of the electronic component body 10 and on the entire surface of the first and second external electrodes 13 and 14. It means that 90% or more of them are detected.

  The water repellent film preferably contains a non-crosslinked resin. A non-crosslinked resin does not cause a crosslinking reaction. For this reason, in the non-crosslinked resin, it is easy to control the molecular weight of the resin, and the molecular weight can be prevented from undesirably increasing. For this reason, even if the non-crosslinked resin is a dried / cured water-repellent film, it is soluble in organic solvents and solvents contained in solder flux.

  FIG. 3 is a schematic cross-sectional view of the electronic component mounting structure according to the embodiment.

  As shown in FIG. 3, the electronic component mounting structure 2 includes an electronic component 1. The electronic component 1 is mounted on the mounting substrate 30. Lands 31 provided on the mounting surface 30 a of the mounting substrate 30 and the external electrodes 13, 14 are joined by solder 32. A solder member (for example, a solder ball) for constituting the solder 32 includes solder and solder flux. The solder flux contains a solvent. The solvent contained in the solder flux may be an aqueous solvent or an organic solvent. Examples of the organic solvent preferably used include ether-based organic solvents, alcohol-based organic solvents, hydrocarbon-based organic solvents, solvents containing at least one selected from the group consisting of ketone-based, ester-based and glycol ether-based solvents. The solubility parameter (SP value) of the solvent contained in the solder flux may be 7.0 to 14.0, for example.

  As described above, from the viewpoint of suppressing the occurrence of ion migration, it is preferable to provide a water repellent film also on at least one of the first and second external electrodes. However, as a result of intensive studies by the present inventors, when a water repellent film is provided on at least one of the first and second external electrodes, the mountability of the electronic component may be low. As a result of diligent research, the present inventors have found that the reason why the mountability is lowered is that the water-repellent film inhibits the bonding between the solder and the external electrode when the external electrode and the substrate are bonded via the solder. I came up with something. Therefore, in the electronic component 1, the water repellent film 20 is a film that is soluble in the solvent contained in the solder flux of the solder. For this reason, when the molten solder and the water-repellent film 20 come into contact with each other during mounting by solder, the water-repellent film 20 is dissolved in the solder flux. Therefore, the water repellent film 20 located on the portion to be joined by the solder of the external electrodes 13 and 14 is removed. That is, in the mounting structure 2, a water repellent film is not provided at the interface between the external electrodes 13 and 14 and the solder. Therefore, the solder melted and the external electrodes 13 and 14 are easily in direct contact, and the electronic component 1 has excellent mountability.

  The electronic component 1 can be manufactured, for example, in the following manner.

  First, the electronic component main body 10 having the first and second internal electrodes 11 and 12 is prepared. The electronic component body 10 can be manufactured by, for example, a known method. Specifically, the electronic component main body 10 can be manufactured, for example, in the following manner. First, a ceramic green sheet is prepared. Next, a conductive paste layer is formed on the ceramic green sheet by printing the conductive paste. Next, after laminating a plurality of ceramic green sheets on which the conductive paste layer is not printed, a ceramic green sheet on which the conductive paste is printed is laminated, and a ceramic green sheet on which the conductive paste layer is printed is further formed thereon. Laminate. Thereby, a mother laminated body is produced. The mother laminate may be pressed by an isostatic pressing method or the like. Next, a plurality of raw ceramic bodies are produced by dividing the mother laminate into a plurality. Next, the electronic component body 10 can be completed by firing the raw ceramic body.

  Next, the first and second external electrodes 13 and 14 are formed on the electronic component body 10. The first and second external electrodes 13 and 14 can be formed in the following manner, for example. The first electrode layers 13a and 14a are formed by applying a conductive paste on the electronic component body 10 and baking it. The second electrode layers 13b and 14b are formed on the first electrode layers 13a and 14a by performing Ni plating. The third electrode layers 13c and 14c are formed by performing Sn plating on the second electrode layers 13b and 14b. The first and second external electrodes 13 and 14 can be completed by the above process.

  Next, a water repellent film 20 is formed on the electronic component main body 10 and on the external electrodes 13 and 14. Specifically, first, a treatment agent is prepared by diluting a resin for forming the water repellent film 20 with a solvent such as methanol. The water-repellent film 20 can be produced by immersing the electronic component main body 10 on which the external electrodes 13 and 14 are formed in the treatment agent and drying it. Or you may apply | coat a processing agent to the electronic component main body 10 in which the external electrodes 13 and 14 were formed. The thickness of the water repellent film 20 can be controlled, for example, by appropriately adjusting the concentration of the water repellent resin in the treatment agent.

  In this embodiment, the water repellent film 20 is formed using a water repellent resin that is soluble in a solvent contained in the solder flux. Therefore, a treatment agent with high homogeneity can be prepared by using a solvent having a solubility parameter (SP value) close to that of the solvent contained in the solder flux. Therefore, the water repellent film 20 excellent in homogeneity can be manufactured.

  Hereinafter, the present invention will be described in more detail on the basis of specific examples. However, the present invention is not limited to the following examples, and may be appropriately modified and implemented without departing from the scope of the present invention. Is possible.

(Example 1)
An electronic component having a configuration substantially similar to that of the electronic component 1 according to the above embodiment was manufactured under the following conditions.

Dimension of electronic component: length dimension: 1.6 mm, width dimension: 0.8 mm, thickness dimension: 0.8 mm
Ceramic part: BaTiO ₃
Internal electrode: Ni
First electrode layer: Firing electrode layer containing Cu Second electrode layer: Ni plating layer Third electrode layer: Sn plating layer First external electrode and second electrode on each of the first and second main surfaces Distance along the length direction between the external electrodes: 0.8 mm
Treatment liquid: Liquid obtained by diluting silicone polymer dispersion SD-8002 DISPERSION (manufactured by Toray Dow Corning Co., Ltd.) containing non-crosslinked silicone resin so that the concentration becomes 1% by mass Method of forming water-repellent film: 5 minutes in treatment liquid After the immersion, the substrate was pulled up from the treatment liquid and dried at 150 ° C. for 30 minutes. As a result, a water repellent film having a thickness of several nm could be formed.

(Example 2)
An electronic component was produced in the same manner as in Example 1 except that the concentration of the silicone resin in the treatment liquid was 5% by mass.

(Example 3)
An electronic component was produced in the same manner as in Example 1 except that the concentration of the silicone resin in the treatment liquid was 60% by mass.

Example 4
An electronic component was produced in the same manner as in Example 1 except that a fluorine-based non-crosslinked resin coating liquid (WOP-019XPC manufactured by Noda Screen) was used. The formed water-repellent film had a thickness of several nm.

(Comparative Example 1)
An electronic component was produced in the same manner as in Example 1 except that the water repellent film was not formed.

(Comparative Example 2)
An electronic component was produced in the same manner as in Example 1 except that an alkoxysilane-based silane coupling agent KBM-3063 (manufactured by Shin-Etsu Chemical Co., Ltd.) was formed using a treatment agent diluted to 5% by volume with propanol.

(Comparative Example 3)
An electronic component was produced in the same manner as in Example 1 except that the silicone-based cross-linked polymer coating solution (KR-400) manufactured by Shin-Etsu Chemical Co., Ltd. was used. The thickness of the water repellent film was about 5 μm.

(Ion migration evaluation)
Examples 1 to 4 and Comparative Examples 1 to 3 were made using Sn-3Ag-0.5Cu solder (manufactured by Senju Metal Industry Co., Ltd., M705-GRN360-K2-V) containing a solder flux containing diethylene glycol monohexyl ether as a solvent. After the sample prepared in each of the above was solder-mounted on a substrate, a dew condensation cycle test was performed under the following conditions.

  The produced mounting structure was held for 1 hour in a low temperature environment of −30 ° C. Thereafter, it was kept for 1 hour in a high temperature and high humidity environment of 25 ° C. and 90% humidity. Finally, the humidity was reduced to 50% over 1.5 hours at a temperature of 25 ° C. and the sample was dried. This was defined as one cycle, and 48 cycles were performed.

  Thereafter, a part of the second main surface was magnified 100 times with a microscope and observed. As a result, when it was confirmed that a white or black product was present on the second main surface, it was determined that ion migration had occurred, and “x” was assigned. On the other hand, when a white or black product was not confirmed on the main surface of 2, it was evaluated as “◯” because no ion migration occurred. Table 1 shows the ratio of the number of samples determined as “×” to the total number of samples ((number of samples determined as “×”) / (total number of samples)).

  When the product was analyzed with a wavelength dispersive X-ray spectrometer (WDX), Sn, Ni, or Cu could be detected. Therefore, it was confirmed that the observed white or black product was a product due to ion migration.

(Mountability evaluation)
The samples produced in each of Examples 1 to 4 and Comparative Examples 1 to 3 were subjected to JIS C 60068-2-69 “Environmental Test Method—Electric / Electronic” using a Resca solder wettability tester “SAT-5100”. —Part 2-69: Test—Test Te: Solderability test method (equilibrium method) for surface mount components (SMD) ”was evaluated for mounting properties. Resca solder pellets were used. As the flux, a solution of 25% solid rosin (pine resin) and 75% IPA (weight ratio) was used. The test temperature was 245 ° C. From the obtained test results, the zero cross time (the time when wetting started) was measured, and the case where the zero cross time was within 5 seconds was evaluated as “◯”, and the case where the zero cross time exceeded 5 seconds was evaluated as “x”. Table 1 shows the ratio of the number of samples determined as “×” to the total number of samples ((number of samples determined as “×”) / (total number of samples)). Here, the number of tests was n = 10.

(Evaluation of solubility in solder flux)
It was evaluated whether the water repellent film of the electronic component produced in each of Examples 1-4 and Comparative Examples 1-3 was soluble in solder flux. Use Flux F (25% rosin, 75% propanol, manufactured by Sasaki Chemical Co., Ltd.) as the solder flux, immerse the created electronic component, and mark “○” when the water repellent film is dissolved and removed. The case where no change was observed in the film was evaluated as “x”. Table 1 shows the results.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Mounting structure 10 Electronic component main body 10a 1st main surface 10b 2nd main surface 10c 1st side surface 10d 2nd side surface 10e 1st end surface 10f 2nd end surface 10g Ceramic part 11 1st Internal electrode 12 Second internal electrode 13 First external electrode 14 Second external electrodes 13a, 14a First electrode layers 13b, 14b Second electrode layers 13c, 14c Third electrode layer 20 Water repellent film 30 Mounting Board 30a Mounting surface 31 Land 32 Solder

Claims (13)

An electronic component body;
First and second external electrodes provided on the electronic component body;
A water repellent film provided on the electronic component body and on the first external electrode;
With
An electronic component in which the water repellent film is soluble in an organic solvent.   The electronic component according to claim 1, wherein the water repellent film is soluble in a solvent contained in the solder flux. An electronic component body;
First and second external electrodes provided on the surface of the electronic component;
A water repellent film provided on the surface of the electronic component and on the first external electrode;
With
An electronic component in which the water repellent film is soluble in a solvent contained in a solder flux.   The said solvent contains at least 1 type chosen from the group which consists of an ether type organic solvent, an alcohol type organic solvent, a hydrocarbon type organic solvent, a ketone type organic solvent, an ester type organic solvent, and a glycol ether type organic solvent. Electronic component as described in any one of -3.   The electronic component as described in any one of Claims 1-4 whose solubility parameter (SP value) of the said solvent is 7.0-14.0.   The electronic component according to claim 1, wherein the water repellent film is made of a non-crosslinked resin. The electronic component main body includes first and second main surfaces extending along the length direction and the width direction, first and second side surfaces extending along the length direction and the thickness direction, and the width direction and the thickness direction. And first and second end faces extending along
On the second main surface, the distal end portion of the first external electrode and the distal end portion of the second external electrode are opposed in the length direction,
The water repellent film is located on a portion of the second main surface located between a tip portion of the first external electrode and a tip portion of the second external electrode. The electronic component according to any one of 6.   The electronic component according to claim 1, wherein the water-repellent film is provided over the electronic component main body and the first external electrode.   The electronic component according to claim 1, wherein the water-repellent film covers an exposed portion of the electronic component main body and the first and second external electrodes.   The electronic component according to claim 1, wherein the outermost layer of the external electrode includes at least one of Sn, Cu, and Ag. The electronic component according to any one of claims 1 to 10,
A mounting substrate on which the electronic component is mounted;
Solder for joining the electronic component and the mounting board;
With
A mounting structure for an electronic component, wherein the water repellent film is not provided at a joint between the electronic component and the mounting substrate. Forming a first external electrode and a second external electrode on the electronic component body;
Providing a water-repellent film soluble in an organic solvent on the electronic component body and on the first external electrode;
An electronic component manufacturing method comprising: Forming a first external electrode and a second external electrode on the electronic component body;
Providing a water-repellent film soluble in a solvent contained in solder flux on the electronic component body and on the first external electrode;
An electronic component manufacturing method comprising: